WO2008058869A3 - Messvorrichtung und messverfahren zum inspizieren einer oberfläche eines substrates - Google Patents
Messvorrichtung und messverfahren zum inspizieren einer oberfläche eines substrates Download PDFInfo
- Publication number
- WO2008058869A3 WO2008058869A3 PCT/EP2007/061936 EP2007061936W WO2008058869A3 WO 2008058869 A3 WO2008058869 A3 WO 2008058869A3 EP 2007061936 W EP2007061936 W EP 2007061936W WO 2008058869 A3 WO2008058869 A3 WO 2008058869A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- air
- measuring device
- substrate
- inspecting
- measuring
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/304—Contactless testing of printed or hybrid circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/07—Non contact-making probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Of Optical Devices Or Fibers (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07822253A EP2092350A2 (de) | 2006-11-16 | 2007-11-06 | Messvorrichtung und messverfahren zum inspizieren einer oberfläche eines substrates |
JP2009508395A JP4922396B2 (ja) | 2006-11-16 | 2007-11-06 | 基板の表面の検査用の測定装置および測定方法 |
CN2007800156183A CN101432628B (zh) | 2006-11-16 | 2007-11-06 | 用于检查基板的表面的测量装置和测量方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006054088A DE102006054088A1 (de) | 2006-11-16 | 2006-11-16 | Messvorrichtung und Messverfahren zum Inspizieren einer Oberfläche eines Substrates |
DE102006054088.3 | 2006-11-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2008058869A2 WO2008058869A2 (de) | 2008-05-22 |
WO2008058869A3 true WO2008058869A3 (de) | 2008-07-24 |
Family
ID=39311198
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2007/061936 WO2008058869A2 (de) | 2006-11-16 | 2007-11-06 | Messvorrichtung und messverfahren zum inspizieren einer oberfläche eines substrates |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP2092350A2 (de) |
JP (1) | JP4922396B2 (de) |
KR (1) | KR101014121B1 (de) |
CN (1) | CN101432628B (de) |
DE (1) | DE102006054088A1 (de) |
WO (1) | WO2008058869A2 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010020011A1 (de) | 2010-05-10 | 2011-11-10 | Siemens Aktiengesellschaft | Konstant-Spannungs-Sensor |
CN102221354B (zh) * | 2011-04-02 | 2013-01-09 | 中南大学 | 一种多测点浮动定位表面不平顺测量方法 |
CN105960589B (zh) * | 2013-07-22 | 2019-04-26 | Zs-处理有限责任公司 | 用于检查工件表面和带材料的装置 |
CN108398114B (zh) * | 2018-02-12 | 2020-09-18 | 武汉华星光电半导体显示技术有限公司 | 曲面盖板边缘曲率测量装置、测量系统及测量方法 |
CN108375608A (zh) * | 2018-03-12 | 2018-08-07 | 昆山国显光电有限公司 | 基板检测装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0207338A2 (de) * | 1985-07-05 | 1987-01-07 | Thyssen Industrie Ag | Oberflächenprüfeinrichtung |
EP0426182A2 (de) * | 1989-10-31 | 1991-05-08 | Kla Instruments Corp. | Automatische mit hoher Geschwindigkeit arbeitende optische Prüfungsvorrichtung und Verfahren |
US6046596A (en) * | 1996-11-13 | 2000-04-04 | Seagate Technology, Inc. | Capacitance probe for magnetic recording head transducer to disc surface spacing measurement |
US20050168234A1 (en) * | 2004-01-30 | 2005-08-04 | Kwark Young H. | Contactless circuit testing for adaptive wafer processing |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4824248A (en) * | 1987-12-21 | 1989-04-25 | Environmental Research Institute Of Michigan | Stabilized sensor device |
JPH08233560A (ja) * | 1995-02-23 | 1996-09-13 | Hitachi Maxell Ltd | 磁気記録媒体の表面検査方法とその装置 |
JP2001296278A (ja) * | 2000-04-13 | 2001-10-26 | Nkk Corp | 金属体検査装置 |
SG142160A1 (en) * | 2001-03-19 | 2008-05-28 | Semiconductor Energy Lab | Method of manufacturing a semiconductor device |
TWI222423B (en) * | 2001-12-27 | 2004-10-21 | Orbotech Ltd | System and methods for conveying and transporting levitated articles |
JP3892801B2 (ja) * | 2002-12-12 | 2007-03-14 | 新日本製鐵株式会社 | 鋼板の内部欠陥検出装置 |
JP2006510772A (ja) * | 2002-12-19 | 2006-03-30 | チバ スペシャルティ ケミカルズ ホールディング インコーポレーテッド | フタルイミジルアゾ染料、その製造方法、およびその使用 |
JP2005043172A (ja) * | 2003-07-28 | 2005-02-17 | Jfe Steel Kk | 探傷装置及びセンサ退避方法 |
JP2006242860A (ja) * | 2005-03-04 | 2006-09-14 | Oht Inc | 検査装置および検査方法 |
DE102005046154B4 (de) * | 2005-09-27 | 2008-07-03 | Siemens Ag | Messvorrichtung und Messsystem zum Inspizieren einer Oberfläche eines Substrates |
-
2006
- 2006-11-16 DE DE102006054088A patent/DE102006054088A1/de not_active Withdrawn
-
2007
- 2007-11-06 JP JP2009508395A patent/JP4922396B2/ja not_active Expired - Fee Related
- 2007-11-06 KR KR1020087026796A patent/KR101014121B1/ko not_active IP Right Cessation
- 2007-11-06 WO PCT/EP2007/061936 patent/WO2008058869A2/de active Application Filing
- 2007-11-06 EP EP07822253A patent/EP2092350A2/de not_active Ceased
- 2007-11-06 CN CN2007800156183A patent/CN101432628B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0207338A2 (de) * | 1985-07-05 | 1987-01-07 | Thyssen Industrie Ag | Oberflächenprüfeinrichtung |
EP0426182A2 (de) * | 1989-10-31 | 1991-05-08 | Kla Instruments Corp. | Automatische mit hoher Geschwindigkeit arbeitende optische Prüfungsvorrichtung und Verfahren |
US6046596A (en) * | 1996-11-13 | 2000-04-04 | Seagate Technology, Inc. | Capacitance probe for magnetic recording head transducer to disc surface spacing measurement |
US20050168234A1 (en) * | 2004-01-30 | 2005-08-04 | Kwark Young H. | Contactless circuit testing for adaptive wafer processing |
Non-Patent Citations (1)
Title |
---|
See also references of EP2092350A2 * |
Also Published As
Publication number | Publication date |
---|---|
CN101432628A (zh) | 2009-05-13 |
DE102006054088A1 (de) | 2008-05-21 |
KR101014121B1 (ko) | 2011-02-14 |
KR20090016449A (ko) | 2009-02-13 |
JP2009535632A (ja) | 2009-10-01 |
WO2008058869A2 (de) | 2008-05-22 |
JP4922396B2 (ja) | 2012-04-25 |
CN101432628B (zh) | 2012-10-03 |
EP2092350A2 (de) | 2009-08-26 |
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