WO2008058869A3 - Messvorrichtung und messverfahren zum inspizieren einer oberfläche eines substrates - Google Patents

Messvorrichtung und messverfahren zum inspizieren einer oberfläche eines substrates Download PDF

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Publication number
WO2008058869A3
WO2008058869A3 PCT/EP2007/061936 EP2007061936W WO2008058869A3 WO 2008058869 A3 WO2008058869 A3 WO 2008058869A3 EP 2007061936 W EP2007061936 W EP 2007061936W WO 2008058869 A3 WO2008058869 A3 WO 2008058869A3
Authority
WO
WIPO (PCT)
Prior art keywords
air
measuring device
substrate
inspecting
measuring
Prior art date
Application number
PCT/EP2007/061936
Other languages
English (en)
French (fr)
Other versions
WO2008058869A2 (de
Inventor
Hagen Klausmann
Karl Kragler
Martin Neusser
Original Assignee
Siemens Ag
Hagen Klausmann
Karl Kragler
Martin Neusser
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag, Hagen Klausmann, Karl Kragler, Martin Neusser filed Critical Siemens Ag
Priority to EP07822253A priority Critical patent/EP2092350A2/de
Priority to JP2009508395A priority patent/JP4922396B2/ja
Priority to CN2007800156183A priority patent/CN101432628B/zh
Publication of WO2008058869A2 publication Critical patent/WO2008058869A2/de
Publication of WO2008058869A3 publication Critical patent/WO2008058869A3/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/304—Contactless testing of printed or hybrid circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/07—Non contact-making probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Of Optical Devices Or Fibers (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

Es wird eine Messvorrichtung (100) zum Inspizieren einer Oberfläche (141) eines Substrates (140) beschrieben. Die Messvorrichtung (100) weist auf ein Halteelement (110) und ein luftgelagertes Element (120, 220), welches an dem Halteelement (110) angebracht ist, welches derart ausgebildet ist, dass zusammen mit der zu inspizierenden Oberfläche (141) des Substrates (140) ein Luftlager bildbar ist, und welches eine Elastizität aufweist, so dass das luftgelagerte Element (120, 220) an Unebenheiten der Oberfläche (141) anpassbar ist. Die Messvorrichtung (100) weist ferner auf zumindest einen Sensor (130, 230), welcher an dem luftgelagerten Element (120, 220) angebracht ist und welcher zum Erfassen der Oberfläche (141) des Substrates (140) eingerichtet ist. Infolge der Flexibilität des luftgelagerten Elements (120, 220) kann der zumindest eine Sensor (130, 230) auch bei einer Welligkeit der zu inspizierenden Oberfläche (141) stets in einem konstanten Messabstand relativ zu der Oberfläche (141) bewegt werden. Es wird ferner ein Messverfahren zur Oberflächeninspektion beschrieben, bei dem die beschriebene Messvorrichtung (100) relativ zu der Oberfläche (141) bewegt wird.
PCT/EP2007/061936 2006-11-16 2007-11-06 Messvorrichtung und messverfahren zum inspizieren einer oberfläche eines substrates WO2008058869A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP07822253A EP2092350A2 (de) 2006-11-16 2007-11-06 Messvorrichtung und messverfahren zum inspizieren einer oberfläche eines substrates
JP2009508395A JP4922396B2 (ja) 2006-11-16 2007-11-06 基板の表面の検査用の測定装置および測定方法
CN2007800156183A CN101432628B (zh) 2006-11-16 2007-11-06 用于检查基板的表面的测量装置和测量方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006054088A DE102006054088A1 (de) 2006-11-16 2006-11-16 Messvorrichtung und Messverfahren zum Inspizieren einer Oberfläche eines Substrates
DE102006054088.3 2006-11-16

Publications (2)

Publication Number Publication Date
WO2008058869A2 WO2008058869A2 (de) 2008-05-22
WO2008058869A3 true WO2008058869A3 (de) 2008-07-24

Family

ID=39311198

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2007/061936 WO2008058869A2 (de) 2006-11-16 2007-11-06 Messvorrichtung und messverfahren zum inspizieren einer oberfläche eines substrates

Country Status (6)

Country Link
EP (1) EP2092350A2 (de)
JP (1) JP4922396B2 (de)
KR (1) KR101014121B1 (de)
CN (1) CN101432628B (de)
DE (1) DE102006054088A1 (de)
WO (1) WO2008058869A2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010020011A1 (de) 2010-05-10 2011-11-10 Siemens Aktiengesellschaft Konstant-Spannungs-Sensor
CN102221354B (zh) * 2011-04-02 2013-01-09 中南大学 一种多测点浮动定位表面不平顺测量方法
CN105960589B (zh) * 2013-07-22 2019-04-26 Zs-处理有限责任公司 用于检查工件表面和带材料的装置
CN108398114B (zh) * 2018-02-12 2020-09-18 武汉华星光电半导体显示技术有限公司 曲面盖板边缘曲率测量装置、测量系统及测量方法
CN108375608A (zh) * 2018-03-12 2018-08-07 昆山国显光电有限公司 基板检测装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0207338A2 (de) * 1985-07-05 1987-01-07 Thyssen Industrie Ag Oberflächenprüfeinrichtung
EP0426182A2 (de) * 1989-10-31 1991-05-08 Kla Instruments Corp. Automatische mit hoher Geschwindigkeit arbeitende optische Prüfungsvorrichtung und Verfahren
US6046596A (en) * 1996-11-13 2000-04-04 Seagate Technology, Inc. Capacitance probe for magnetic recording head transducer to disc surface spacing measurement
US20050168234A1 (en) * 2004-01-30 2005-08-04 Kwark Young H. Contactless circuit testing for adaptive wafer processing

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4824248A (en) * 1987-12-21 1989-04-25 Environmental Research Institute Of Michigan Stabilized sensor device
JPH08233560A (ja) * 1995-02-23 1996-09-13 Hitachi Maxell Ltd 磁気記録媒体の表面検査方法とその装置
JP2001296278A (ja) * 2000-04-13 2001-10-26 Nkk Corp 金属体検査装置
SG142160A1 (en) * 2001-03-19 2008-05-28 Semiconductor Energy Lab Method of manufacturing a semiconductor device
TWI222423B (en) * 2001-12-27 2004-10-21 Orbotech Ltd System and methods for conveying and transporting levitated articles
JP3892801B2 (ja) * 2002-12-12 2007-03-14 新日本製鐵株式会社 鋼板の内部欠陥検出装置
JP2006510772A (ja) * 2002-12-19 2006-03-30 チバ　スペシャルティ　ケミカルズ　ホールディング　インコーポレーテッド フタルイミジルアゾ染料、その製造方法、およびその使用
JP2005043172A (ja) * 2003-07-28 2005-02-17 Jfe Steel Kk 探傷装置及びセンサ退避方法
JP2006242860A (ja) * 2005-03-04 2006-09-14 Oht Inc 検査装置および検査方法
DE102005046154B4 (de) * 2005-09-27 2008-07-03 Siemens Ag Messvorrichtung und Messsystem zum Inspizieren einer Oberfläche eines Substrates

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0207338A2 (de) * 1985-07-05 1987-01-07 Thyssen Industrie Ag Oberflächenprüfeinrichtung
EP0426182A2 (de) * 1989-10-31 1991-05-08 Kla Instruments Corp. Automatische mit hoher Geschwindigkeit arbeitende optische Prüfungsvorrichtung und Verfahren
US6046596A (en) * 1996-11-13 2000-04-04 Seagate Technology, Inc. Capacitance probe for magnetic recording head transducer to disc surface spacing measurement
US20050168234A1 (en) * 2004-01-30 2005-08-04 Kwark Young H. Contactless circuit testing for adaptive wafer processing

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2092350A2 *

Also Published As

Publication number Publication date
CN101432628A (zh) 2009-05-13
DE102006054088A1 (de) 2008-05-21
KR101014121B1 (ko) 2011-02-14
KR20090016449A (ko) 2009-02-13
JP2009535632A (ja) 2009-10-01
WO2008058869A2 (de) 2008-05-22
JP4922396B2 (ja) 2012-04-25
CN101432628B (zh) 2012-10-03
EP2092350A2 (de) 2009-08-26

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