WO2008058619A1 - Leuchtstoffplättchen für leds aus strukturierten folien - Google Patents
Leuchtstoffplättchen für leds aus strukturierten folien Download PDFInfo
- Publication number
- WO2008058619A1 WO2008058619A1 PCT/EP2007/009278 EP2007009278W WO2008058619A1 WO 2008058619 A1 WO2008058619 A1 WO 2008058619A1 EP 2007009278 W EP2007009278 W EP 2007009278W WO 2008058619 A1 WO2008058619 A1 WO 2008058619A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- phosphor
- phosphor body
- precursor
- substrate film
- sio
- Prior art date
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims abstract description 226
- 239000000758 substrate Substances 0.000 claims abstract description 64
- 239000011521 glass Substances 0.000 claims abstract description 24
- 239000010445 mica Substances 0.000 claims abstract description 21
- 229910052618 mica group Inorganic materials 0.000 claims abstract description 21
- 238000006243 chemical reaction Methods 0.000 claims abstract description 20
- 229910052593 corundum Inorganic materials 0.000 claims abstract description 4
- 239000010431 corundum Substances 0.000 claims abstract description 4
- 239000002243 precursor Substances 0.000 claims description 58
- 238000000034 method Methods 0.000 claims description 53
- 239000000725 suspension Substances 0.000 claims description 41
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 33
- 230000005855 radiation Effects 0.000 claims description 30
- 239000000203 mixture Substances 0.000 claims description 28
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 24
- 230000008569 process Effects 0.000 claims description 24
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 23
- 239000002245 particle Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 20
- 239000000126 substance Substances 0.000 claims description 19
- 229910004283 SiO 4 Inorganic materials 0.000 claims description 16
- -1 alcoholates Chemical class 0.000 claims description 16
- 239000007900 aqueous suspension Substances 0.000 claims description 16
- 239000002019 doping agent Substances 0.000 claims description 13
- 238000002156 mixing Methods 0.000 claims description 13
- 238000002360 preparation method Methods 0.000 claims description 13
- 238000001035 drying Methods 0.000 claims description 12
- 238000000926 separation method Methods 0.000 claims description 11
- 238000007711 solidification Methods 0.000 claims description 11
- 230000008023 solidification Effects 0.000 claims description 11
- 238000001556 precipitation Methods 0.000 claims description 10
- 229910003668 SrAl Inorganic materials 0.000 claims description 8
- 229910052605 nesosilicate Inorganic materials 0.000 claims description 8
- 229910052684 Cerium Inorganic materials 0.000 claims description 7
- 229910052688 Gadolinium Inorganic materials 0.000 claims description 7
- 229910052788 barium Inorganic materials 0.000 claims description 7
- 229910052791 calcium Inorganic materials 0.000 claims description 7
- 239000002105 nanoparticle Substances 0.000 claims description 7
- 150000004762 orthosilicates Chemical class 0.000 claims description 7
- 229910052712 strontium Inorganic materials 0.000 claims description 7
- 229910052725 zinc Inorganic materials 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 6
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 239000012190 activator Substances 0.000 claims description 4
- 238000005286 illumination Methods 0.000 claims description 4
- 229910002601 GaN Inorganic materials 0.000 claims description 3
- 229910052771 Terbium Inorganic materials 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 229910052733 gallium Inorganic materials 0.000 claims description 3
- 150000002500 ions Chemical class 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 claims description 3
- 229910052723 transition metal Inorganic materials 0.000 claims description 3
- 150000003624 transition metals Chemical class 0.000 claims description 3
- 229910052727 yttrium Inorganic materials 0.000 claims description 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical class OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 claims description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 2
- 229910052765 Lutetium Inorganic materials 0.000 claims description 2
- 229910019142 PO4 Inorganic materials 0.000 claims description 2
- 229910052772 Samarium Inorganic materials 0.000 claims description 2
- 150000001242 acetic acid derivatives Chemical class 0.000 claims description 2
- AUCDRFABNLOFRE-UHFFFAOYSA-N alumane;indium Chemical compound [AlH3].[In] AUCDRFABNLOFRE-UHFFFAOYSA-N 0.000 claims description 2
- 150000004649 carbonic acid derivatives Chemical class 0.000 claims description 2
- 150000007942 carboxylates Chemical class 0.000 claims description 2
- 229910010293 ceramic material Inorganic materials 0.000 claims description 2
- 239000003153 chemical reaction reagent Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 150000004820 halides Chemical class 0.000 claims description 2
- 150000004679 hydroxides Chemical class 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims description 2
- MEFBJEMVZONFCJ-UHFFFAOYSA-N molybdate Chemical compound [O-][Mo]([O-])(=O)=O MEFBJEMVZONFCJ-UHFFFAOYSA-N 0.000 claims description 2
- 150000002823 nitrates Chemical class 0.000 claims description 2
- 150000004767 nitrides Chemical class 0.000 claims description 2
- 150000002902 organometallic compounds Chemical class 0.000 claims description 2
- 150000003891 oxalate salts Chemical class 0.000 claims description 2
- 235000021317 phosphate Nutrition 0.000 claims description 2
- 150000003013 phosphoric acid derivatives Chemical class 0.000 claims description 2
- 229910052706 scandium Inorganic materials 0.000 claims description 2
- 238000003980 solgel method Methods 0.000 claims description 2
- 150000003467 sulfuric acid derivatives Chemical class 0.000 claims description 2
- LSGOVYNHVSXFFJ-UHFFFAOYSA-N vanadate(3-) Chemical class [O-][V]([O-])([O-])=O LSGOVYNHVSXFFJ-UHFFFAOYSA-N 0.000 claims description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000010970 precious metal Substances 0.000 claims 1
- 229910052761 rare earth metal Inorganic materials 0.000 claims 1
- 239000000376 reactant Substances 0.000 claims 1
- 239000011701 zinc Substances 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 33
- 239000000377 silicon dioxide Substances 0.000 abstract description 16
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 abstract 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 abstract 2
- 239000000243 solution Substances 0.000 description 17
- 238000000576 coating method Methods 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 12
- 239000011734 sodium Substances 0.000 description 10
- 238000003756 stirring Methods 0.000 description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 229910017639 MgSi Inorganic materials 0.000 description 8
- 238000000137 annealing Methods 0.000 description 8
- 229910004261 CaF 2 Inorganic materials 0.000 description 6
- 229910004762 CaSiO Inorganic materials 0.000 description 6
- 101100476480 Mus musculus S100a8 gene Proteins 0.000 description 6
- 230000008901 benefit Effects 0.000 description 6
- 238000009826 distribution Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 239000000654 additive Substances 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 239000002244 precipitate Substances 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 4
- 229920002799 BoPET Polymers 0.000 description 3
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 3
- 229910002651 NO3 Inorganic materials 0.000 description 3
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 3
- 229910008484 TiSi Inorganic materials 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical class OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000007858 starting material Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 229910015999 BaAl Inorganic materials 0.000 description 2
- 229910016066 BaSi Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- 229910052693 Europium Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229910002420 LaOCl Inorganic materials 0.000 description 2
- 229910010199 LiAl Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000004115 Sodium Silicate Substances 0.000 description 2
- 229910002367 SrTiO Inorganic materials 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 150000001805 chlorine compounds Chemical group 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 210000001072 colon Anatomy 0.000 description 2
- 230000001143 conditioned effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- 229910052911 sodium silicate Inorganic materials 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910016036 BaF 2 Inorganic materials 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 101150027751 Casr gene Proteins 0.000 description 1
- 229910004631 Ce(NO3)3.6H2O Inorganic materials 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910017414 LaAl Inorganic materials 0.000 description 1
- 229910012506 LiSi Inorganic materials 0.000 description 1
- 229910020068 MgAl Inorganic materials 0.000 description 1
- 229910017857 MgGa Inorganic materials 0.000 description 1
- 229910017625 MgSiO Inorganic materials 0.000 description 1
- 229910003251 Na K Inorganic materials 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- 229910007709 ZnTe Inorganic materials 0.000 description 1
- 150000001447 alkali salts Chemical class 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
- 229910052729 chemical element Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010616 electrical installation Methods 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- UIWYJDYFSGRHKR-UHFFFAOYSA-N gadolinium atom Chemical compound [Gd] UIWYJDYFSGRHKR-UHFFFAOYSA-N 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000004038 photonic crystal Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 229910052950 sphalerite Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/0883—Arsenides; Nitrides; Phosphides
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/628—Coating the powders or the macroscopic reinforcing agents
- C04B35/62802—Powder coating materials
- C04B35/62805—Oxide ceramics
- C04B35/62813—Alumina or aluminates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7774—Aluminates
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/20—Particle morphology extending in two dimensions, e.g. plate-like
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3418—Silicon oxide, silicic acids or oxide forming salts thereof, e.g. silica sol, fused silica, silica fume, cristobalite, quartz or flint
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
- Y10T428/2993—Silicic or refractory material containing [e.g., tungsten oxide, glass, cement, etc.]
- Y10T428/2996—Glass particles or spheres
Definitions
- the invention relates to a phosphor body based on natural and / or synthetic, highly stable, platelet-shaped substrates such as mica (aluminosilicate), corundum (Al 2 O 3 ), silica (SiO 2 ), glass, ZrO 2 or TiO 2 and at least one phosphor its production via structured films and its use as an LED conversion phosphor for white LEDs or so-called color-on-demand applications.
- mica aluminosilicate
- corundum Al 2 O 3
- silica SiO 2
- glass glass
- ZrO 2 or TiO 2 glass
- at least one phosphor its production via structured films and its use as an LED conversion phosphor for white LEDs or so-called color-on-demand applications.
- White LEDs represent the future technology for artificially generating light. So-called phosphor converted pcLEDs or luminescence-converted lukoLEDs will, in the general opinion of light and energy experts, replace the incandescent and halogen bulbs perceptibly from 2010 onwards. From 2015, the substitution of
- the lumen efficiency of a commercially available white 1 W power pcLED is approximately 45 Im / W (lumens / watt), while the lumen efficiency of a light bulb is less than 20 Im / W.
- the loss factors of the pcLED lie mainly with the phosphor (engl., Phosphor), that with white ones pcLEDs for emitting the white light and in color-on-demand LED applications to produce a specific color point is needed, as well as the semiconductor chip of the LED itself and the structural structure of the LED (packaging).
- the color-on-demand concept is the realization of light of a particular color point with a pcLED using one or more phosphors. This concept is e.g. used to create certain corporate designs, e.g. for illuminated company logos, brands, etc.
- phosphors currently used for the white pcLED, which contains a blue-emitting chip as a primary radiator, mainly YAGiCe 3+ or modifications thereof, or ortho-silicates: Eu 2+ .
- the phosphors are produced by solid-state diffusion processes ("mixing and firing") by mixing oxidic educts as powders, grinding them and then annealing them in an oven at temperatures up to 1700 ° C. for up to several days in an optionally reducing atmosphere.
- the phosphor particles are dispersed in a binder, usually silicones or epoxides, and one or more drops of this dispersion are applied to the chip.
- a binder usually silicones or epoxides
- the morphology and size of the phosphor particles result in inconsistent sedimentation behavior, resulting in inhomogeneous coating within an LED and from LED to LED.
- Luminous flux and the lumen efficiency (Im / W) to be sorted.
- This sorting leads to a reduction in the time yield of LED units per machine day, because in most cases »30% of the LEDs are produced as rejects.
- This situation leads to the high unit cost, especially of power LEDs (i.e., LEDs with a power requirement of over 0.5 W), even in the
- the object of the present invention is therefore to provide phosphors, preferably conversion phosphors for white LEDs or for color on demand applications, which do not have one or more of the abovementioned disadvantages.
- the phosphor body should be platelet-shaped and have a diameter of about 20 microns.
- the present object can be achieved in that the phosphor body by means of a structured substrate (For example, a polyethylene terephthalate film) wet-chemically in the form of thin platelets can be produced.
- a structured substrate for example, a polyethylene terephthalate film
- the inventive method for producing these phosphors and the use of these phosphors in LEDs leads to a reduction in the production of white LEDs and / or LEDs for
- the present invention thus relates to a phosphor body consisting of a phosphor-coated substrate containing mica, glass ZrO 2 , TiO 2 , SiO 2 or Al 2 O 3 platelets or mixtures thereof.
- a phosphor body obtainable by
- Fluorescent body obtainable by • preparing a phosphor precursor suspension
- phosphor body only of one or more phosphor materials, ie it does not contain a substrate of mica, glass, ZrO 2 -, TiO 2 -, SiO 2 - or Al 2 O 3 platelets or mixtures thereof.
- the phosphor body or the phosphor platelets with diameters of more than 20 microns can be prepared by a natural or synthetically produced highly stable support or a substrate of mica, SiO 2 -, Al 2 O 3 -, ZrO 2 -, glass or TiO 2 platelets, which has a very high aspect ratio, has an atomically smooth surface and an adjustable thickness, can be coated by precipitation reaction in aqueous suspension or dispersion with a phosphor layer.
- the platelets can also be constructed from the phosphor material itself. If the plate itself only serves as a carrier for the phosphor coating, it must consist of a material which is transparent to the primary radiation of the LED, or the Absorbs primary radiation and transfers this energy to the phosphor layer.
- the LED light cone becomes more homogeneous (color point and brightness) and the
- this phosphor layer is more favorable than of irregular phosphor powders because of the
- LED chip emitted light is scattered back less from the surface of the flake, as from the surface of resin-dispersed non-uniform powders. Thus, more light can be absorbed and converted by the phosphor. As a result, the light efficiency of the white LEDs is increased.
- the phosphor bodies according to the invention can also be applied directly over a finished, blue or UV LED or at a distance from the chip (so-called "remote phosphor concept”) .
- This makes it possible, by simply exchanging the phosphor wafer, for the light temperature and the hue This can be done in the simplest way by replacing the chemically identical phosphor substance in the form of differently thick platelets.
- the following compounds can be selected as the material for the phosphor bodies according to the invention, wherein in the following notation the host lattice is shown to the left of the colon and one or more doping elements to the right of the colon. When chemical elements are separated and bracketed by commas, they can optionally be used. Depending on the desired luminescence property of the phosphor body, a or several of the selected compounds are used:
- BaAl 2 O 4 Eu 2+ , BaAl 2 S 4 ) Eu 2+ , BaB 8 Oi -3 : Eu 2+ , BaF 2 , BaFBrEu 2+ , BaFCkEu 2+ , BaFChEu 2+ , Pb 2+ , BaGa 2 S 4 ) Ce 3+ , BaGa 2 S 4 ) Eu 2+ , Ba 2 Li 2 Si 2 O 7 ) Eu 2+ , Ba 2 Li 2 Si 2 O 7 ) Sn 2+ , Ba 2 Li 2 Si 2 O 7 ) Sn 2+ , Mn 2+ , BaMgAl 10 Oi 7 ) Ce 3+ ,
- BaTiP 2 O 7 (Ba 1 Ti) 2 P 2 O 7 ) Ti, Ba 3 WO 6 ) U, BaY 2 F 8 Er 3+ , Yb + , Be 2 SiO 4 ) Mn 2+ , Bi 4 Ge 3 O 12 , CaAl 2 O 4 ) Ce 3+ , CaLa 4 O 7 ) Ce 3+ , CaAl 2 O 4 ) Eu 2+ , CaAl 2 O 4 ) Mn 2+ , CaAl 4 O 7 : Pb 2+ , Mn 2+ , CaAl 2 O 4 ) Tb 3+ , Ca 3 Al 2 Si 3 O 12 ) Ce 3+ , Ca 3 Al 2 Si 3 Oi 2 ) Ce 3+ , Ca 3 Al 2 Si 3 O 12 ) Eu 2+ , Ca 2 B 5 O 9 BrEu 2+ , Ca 2 B 5 O 9 Cl) Eu 2+ , Ca 2 B 5 O 9 Cl) Pb 2+ , CaB 2 O 4 ) Mn 2+ ,
- CaGa 2 S 4 Mn 2+ , CaGa 2 S 4 ) Pb 2+ , CaGeO 3 ) Mn 2+ , CaI 2 ) Eu 2+ in SiO 2 , Cal 2 : Eu 2+ , Mn 2+ in SiO 2 , CaLaBO 4 ) Eu 3+ , CaLaB 3 O 7 : Ce 3+ , Mn 2+ , Ca 2 La 2 BO 6 .
- Ca 3 WO 6 U, CaYAIO 4 : Eu 3+ , CaYBO 4 : Bi 3+ , CaYBO 4 : Eu 3+ , CaYB 0 . 8 O 3 . 7 : Eu 3+ , CaY 2 ZrO 6 IEu 3+ , (Ca, Zn, Mg) 3 (PO 4 ) 2 : Sn, CeF 3 , (Ce, Mg) BaAlnO 18 : Ce, (Ce 1 Mg) SrAl 11 Oi 8 ) Ce, CeMgAl 11 O 19 ICeTb, Cd 2 B 6 O 11 ) Mn 2+ , CdS: Ag + , Cr, CdS: In, CdS: In, CdS: In, Te, CdSTe, CdWO 4 , CsF, CsI, CsI: Na + , CsITI 1 (ErCI) 0 25 (BaCl 2 ) 0 .75, GaN: Z
- GdNbO 4 Bi 3+ , Gd 2 O 2 SiEu 3+ , Gd 2 O 2 Pr 3 *, Gd 2 O 2 SPr 1 Ce 1 F, Gd 2 O 2 STb 3+ , Gd 2 SiO 5 ICe 3+ , KAI 11 O 17 TI + , KGa 11 O 17 ) Mn 2+ , K 2 La 2 Ti 3 O 10 ) Eu, KMgF 3 ) Eu 2+ , KMgF 3 ) Mn 2+ , K 2 SiF 6 ) Mn 4+ , LaAl 3 B 4 O 12 ) Eu 3+ , LaAIB 2 O 6 ) Eu 3+ , LaAIO 3 ) Eu 3+ , LaAIO 3 ) Sm 3+ , LaAsO 4 ) Eu 3+ , LaBr 3 ) Ce 3+ , LaBO 3 ) Eu 3+ , (La 1 Ce 1 Tb) PO 4 ) Ce) Tb 1 LaCl 3 ) Ce 3+ ,
- Ce Na 3 (PO 4) 2 Tb 3+, NaI) Tl, Na K L23 (M2 M2 EUC TiSi 4 O 11) Eu 3+, Na 1 23 K 42 0 0 12 Eu TiSi 5 O 13 XH 2 O) Eu 3+ , Na 1 29 K 0 46 Er 0 08 TiSi 4 Oi 1 ) Eu 3+ , Na 2 Mg 3 Al 2 Si 2 O 10 ) Tb, Na (Mg 2-x Mn x ) LiSi 4 O 10 F 2 : Mn, NaYF 4 ) He 3+ , Yb 3+ , NaYO 2 ) Eu 3+ , P46 (70%) + P47 (30%), SrAl 12 O 19 ) Ce 3+ , Mn 2+ , SrAl 2 O 4 ) Eu 2+ , SrAl 4 O 7 ) Eu 3+ , SrAl 12 O 19 ) Eu 2+ , SrAl 2 S 4 ) Eu 2+ , Sr 2
- Sr 3 (PO 4) 2 Sn 2+, ß-Sr 3 (PO 4 ) 2 : Sn 2+ , Mn 2+ (Al), SrS: Ce 3+ , SrS: Eu 2+ , SrS: Mn 2+ ,
- SrS Cu + , Na, SrSO 4 : Bi, SrSO 4 : Ce 3+ , SrSO 4 : Eu 2+ , SrSO 4 : Eu 2+ , Mn 2+ , Sr 5 Si 4 O 10 Cl 6 ) Eu 2+ , Sr 2 SiO 4 : Eu 2+ , SrTiO 3 Pr 3+ , SrTiO 3 Pr 3+ , Al 3+ , Sr 3 WO 6 : U, SrY 2 O 3 ) Eu 3+ , ThO 2 : Eu 3+ , ThO 2 Pr 3+ , ThO 2 Tb 3+ , YAl 3 B 4 O 12 ) Bi 3+ , YAl 3 B 4 O 12 ) Ce 3+ , YAl 3 B 4 O 12 : Ce 3+ , Mn, YAl 3 B 4 O.
- ZnS-CdS Ag 1 Br 1 Ni 1 ZnS-CdS: Ag + , Cl, ZnS-CdS) Cu 1 Br 1 ZnS-CdS) Cu 1 I 1 ZnS) Cl " , ZnS ) Eu 2+ , ZnS) Cu, ZnS: Cu + , Al 3+ , ZnS: Cu + , Cr, ZnS) Cu 1 Sn, ZnS) Eu 2+ , ZnS) Mn 2+ , ZnS) Mn 1 Cu 1 ZnS ) Mn 2+ je 2+ , ZnS) P 1 ZnS: P 3 " , Cr, ZnS) Pb 2+ , ZnS: Pb 2+ , CI ⁇ ZnS) Pb 1 Cu, Zn 3 (PO 4 ) 2 : Mn 2 + , Zn 2 SiO 4 ) Mn 2+ , Zn 2 SiO 4 : Mn 2+
- ZnTe Mn 2+
- ZnSe Cu +
- CI ZnWO 4
- the phosphor body consists of at least one of the following phosphor materials:
- Zinc-alkaline earth orthosilicates copper-alkaline earth orthosilicates, iron-alkaline earth orthosilicates, molybdate, tungstates, vanadates, group III nitrides, oxides, individually or mixtures thereof with one or more activator ions such as Ce, Eu, Mn, Cr and / or Bi.
- the phosphor body can be produced on a large scale as platelets in thicknesses of 10 .mu.m up to 5 mm, preferably between 20 .mu.m and 100 .mu.m.
- the platelets expansion in the two other dimensions (length x width) is when mounted directly on the chip of 100 .mu.m.times.100 .mu.m up to 8 mm.times.8 mm, preferably 120 .mu.m.times.120 .mu.m up to 3 mm.times.3 mm.
- the phosphor chips are mounted over a finished LED and / or at a distance from the LED chip, which may cause the remote phoshor arrangement to fall, then the emerging light cone is to be completely covered by the platelets.
- the platelet-shaped phosphor body usually has an aspect ratio (ratio of the diameter to the particle thickness) of 2: 1 to 400: 1, and in particular 1, 5: 1 to 100: 1.
- the substrate used in the phosphor body consists of SiO 2 and / or Al 2 O 3 .
- the side surfaces of the phosphor body according to the invention can be mirrored with a light or noble metal, preferably aluminum or silver.
- the silvering effect causes no light to emerge laterally from the phosphor body by waveguiding in the phosphor body according to the invention. Lateral exiting light can reduce the luminous flux to be coupled out of the LED.
- the mirroring of the phosphor body can take place in a process step after the production of the phosphor body.
- the side surfaces are for this purpose e.g. wetted with a solution of silver nitrate and glucose and then exposed at elevated temperature to an ammonia atmosphere.
- a silver coating on the side surfaces e.g. a silver coating on the side surfaces.
- electroless metallization processes are also suitable, see, for example, Hollemann-Wiberg, Lehrbuch der Anorganischen Chemie, Walter de Gruyter Verlag or Ulimann's Encyclopedia of Chemical Technology.
- the surface of the phosphor body according to the invention facing the LED chip can be provided with a coating which acts in an anti-reflection manner with respect to the primary radiation emitted by the LED chip.
- a coating which acts in an anti-reflection manner with respect to the primary radiation emitted by the LED chip.
- This also leads to a reduction in the backscattering of the primary radiation, as a result of which it can be better coupled into the phosphor body according to the invention.
- Coating may also consist of photonic crystals, wherein this also includes a structuring of the surface of the flaky phosphor body to achieve certain functionalities.
- the platelet-shaped phosphor body has a patterned (e.g., pyramidal) surface on the side opposite an LED chip (see Figure 5).
- a patterned (e.g., pyramidal) surface on the side opposite an LED chip (see Figure 5).
- the structured surface on the phosphor body is by subsequent coating with a suitable material, which is already structured, or in a subsequent step by (photo) lithographic methods, etching or writing method with
- the phosphor body according to the invention has a rough surface (see FIG. 5) on the side opposite to an LED chip, the nanoparticles of SiO 2 , T ⁇ O 2 , Al 2 O 3 , ZnO 2 , ZrO 2 and / or Y 2 O 3 or Combinations of these materials or particles carries with the phosphor composition.
- a rough surface has a roughness of up to several 100 nm.
- the coated surface has the
- the phosphor body according to the invention has on the side facing away from the chip
- Fluorescent body on the side facing a LED chip a polished surface according to DIN EN ISO 4287 (Rugotest, polished surface have the roughness class N3-N1). This has the advantage that the surface is reduced, whereby less light is scattered back.
- this polished surface can also be provided with a coating that is transparent to the primary radiation, but reflects the secondary radiation. Then the secondary radiation can only be emitted upwards. It is also preferable if the side of the phosphor body facing an LED chip has a surface equipped for the radiation emitted by the LED with antireflective properties.
- the starting materials for the preparation of the phosphor body consist of the base material (for example, salt solutions of yttrium, aluminum, gadolinium, etc.) and at least one dopant (for example cerium).
- Suitable starting materials are inorganic and / or organic substances such as nitrates, halides, carbonates, bicarbonates, phosphates, carboxylates, alcoholates, acetates, oxalates, sulfates, organometallic compounds, hydroxides and / or oxides of metals, semimetals, transition metals and / or
- Rare earths in question which are dissolved and / or suspended in inorganic and / or organic liquids.
- Mixed nitrate solutions, chloride or hydroxide solutions are used, which contain the corresponding elements in the required stoichiometric ratio.
- Method for producing a phosphor body with the following method steps: a) producing a phosphor precursor suspension by mixing at least two educts and at least one dopant by wet chemical methods, b) preparing an aqueous suspension of mica, glass, ZrO 2 , TiO 2 , SiO 2 or Al 2 O 3 platelets or mixtures thereof, c) application of the aqueous suspension prepared in step b to a structured support medium to form a substrate film, d) solidification of the substrate film by drying and separation of the dried substrate film from the support medium, e ) Addition of the phosphor precursor suspension prepared under step a and subsequent addition of a
- the structured carrier medium preferably from organic materials (eg polyethylene terephthalate films) or ceramic materials (eg corundum), platelet-shaped phosphor bodies with a diameter of between 20 ⁇ m and up to 5 mm can be produced.
- the structured carrier medium consists of wells (preferably square) into which the substances from which the platelets are made are filled. The size of the plates is determined by the dimensions of the cups (length x width x depth) (see Fig.1 to 3). After filling the wells, the contents of the wells are elevated
- the heating can take place up to a temperature (preferably from 180 to 800 ° C.) at which the structured carrier medium or the cups, if they consist of polymers, are fired away, as a result of which the platelets can be isolated or removed.
- the wells may also be removed by passing the flexible carrier medium in the form of an endless belt over a reversing roller, with the solidified platelets separating from the carrier medium.
- the platelets preferably consist of an inorganic substrate or binder material such as mica, glass, ZrO 2 -, TiO 2 -, SiO 2 - or
- the preparation of the synthetic platelets is done by conventional methods via a strip process from the corresponding alkali salts (eg for silica from a potassium or sodium water glass solution). The preparation process is described in detail in EP 763573, EP 608388 and DE 19618564.
- the platelets are then defined as an aqueous suspension with a
- Solid content of mica, glass, ZrO 2 -, TiO 2 -, SiO 2 - or Al 2 O 3 presented and then coated by known to those skilled method via a previously described structured support medium with phosphor precursors.
- salts of the desired components of the phosphor precursor eg YAG: Ce
- the phosphor-coated substrate is annealed for several hours at temperatures between 700 and 1800 0 C, preferably between 900 and 1700 0 C.
- the phosphor precursor or the phosphor precursor (preferably in the form of a phosphor hydroxide) is converted into the actual platelet-shaped phosphor body (preferably in oxide form). It is preferred to carry out the annealing at least partially under reducing conditions (for example with carbon monoxide, forming gas, pure hydrogen or at least a vacuum or an oxygen-deficient atmosphere).
- this thermal aftertreatment consists of a two-stage process, wherein the first process may be a Scherrerhitzen, which is performed at the temperature Ti and the second process is an annealing process at the temperature T 2 .
- Shock heating can be triggered, for example, by placing the sample to be heated in the oven already heated on Ti.
- Ti is 700 to 1800 ° C., preferably 900 to 1600 ° C.
- T 2 values between 1000 and 1800 ° C., preferably 1200 to 1700 ° C., apply.
- the first process proceeds over a period of 1 to 2 h. Thereafter, the material can be cooled to room temperature and finely and gently ground with low energy input.
- the annealing process at T 2 takes place over a period of, for example, 2 to 8 hours.
- the annealing process can be carried out in a reducing atmosphere.
- This two-stage thermal aftertreatment has the advantage that the partially crystalline or amorphous finely divided, surface-reactive phosphor powder, in the first step at the temperature Ti of a partial
- the present invention further provides a process for producing a phosphor body with the following process steps: a) producing a phosphor precursor suspension
- the inorganic substrate of mica, glass, ZrO 2 , TiO 2 , SiO 2 or Al 2 O 3 - platelets or mixtures thereof is mixed with the Leuchtstoffprecursor- suspension and from a substrate film on a structured
- a further process variant relates to a process for the production of phosphor bodies with the following process variants:
- Dopant by wet-chemical methods b) application of the phosphor precursor suspension to a structured carrier medium and formation of a substrate film, c) solidification of the substrate film by drying and separation of the dried substrate film from the carrier medium to form a phosphor precursor, d) thermal post-treatment of the phosphor precursor to the obtained phosphor body.
- no inorganic substrate of mica, glass, ZrO 2 , TiO 2 , SiO 2 or AbO ß platelets or mixtures thereof, for the preparation of the phosphor body according to the invention is used.
- the phosphor bodies produced in this way are particularly preferred when it comes to ensuring that the highest possible
- Phosphorus concentration is required as conversion material.
- the wet-chemical preparation generally has the advantage that the resulting materials according to the invention have a higher uniformity with regard to the stoichiometric composition, the particle size and the morphology of the particles from which the phosphor body according to the invention is produced.
- the wet-chemical preparation of the phosphor body is preferably carried out by the precipitation and / or sol-gel process.
- the advantage of the phosphor body according to the invention is that they are storable and without resin dispersion directly on the LED chip can be applied, if it is designed in flip-chip design.
- Conventional LED chips with connecting wires on the surface can not be equipped directly with the phosphor chips according to the invention.
- the optical coupling of the phosphor body to the chip for example, with a transparent
- Another object of the present invention is a lighting unit with at least one primary light source whose emission maximum is in the range 240 to 510 nm, wherein the primary
- Radiation is partially or completely converted into longer-wave radiation by the phosphor body according to the invention.
- this lighting unit emits white or emits light with a certain color point (color-on-demand principle).
- the person skilled in possible forms of such light sources are known. These may be light-emitting LED chips of different construction.
- the light source is a luminescent arrangement based on ZnO, TCO (transparent conducting oxide), ZnSe or SiC or else an arrangement based on an organic light-emitting layer.
- the platelet-shaped phosphor body can either be directly on the
- Primary light source can be arranged or from this, depending on The remote array technology may also be used remotely (the latter arrangement also includes “remote phosphor technology.")
- the advantages of "remote phosphor technology” are well known to those skilled in the art and can be found in the following publication: Japanese Journ. of Appl. Phys. VoI 44, no. 21 (2005). L649-L651.
- the optical coupling of the illumination unit between the phosphor body and the primary light source is realized by a light-conducting arrangement.
- the primary light source is installed at a central location and this is optically coupled to the phosphor by means of light-conducting devices, such as light-transmitting fibers.
- the lighting requirements adapted lights can only be realized consisting of one or different phosphor bodies, which can be arranged to form a luminescent screen, and a light guide which is coupled to the primary light source.
- Fluorescent bodies which are coupled to the optical fibers to install.
- the lighting unit consists of one or more phosphor bodies, which are constructed the same or different.
- Another object of the present invention is the use of the phosphor body according to the invention for the conversion of the blue or in the near UV emission in visible white radiation. Furthermore, the use of the phosphor body according to the invention for the conversion of the primary radiation into a specific color point according to the "color-on-demand" concept is preferred.
- the phosphor body can be used as a conversion phosphor for visible primary radiation for generating white light. In this case, it is particularly advantageous for a high light output when the phosphor body absorbs a certain portion of the visible primary radiation (in the case of non-visible primary radiation, this is to be absorbed in its entirety) and the remaining portion of the primary radiation is transmitted in the direction of the surface, which Primary light source is opposite.
- the phosphor body is as transparent as possible for the radiation emitted by it with respect to the coupling-out via the surface opposite the material emitting the primary radiation.
- the phosphor body can be used as conversion phosphor for UV primary radiation for generating
- White light can be used.
- the phosphor body absorbs the entire primary radiation and if the phosphor body is as transparent as possible for the radiation emitted by it.
- Example 1 Preparation of Silica Flakes with dimensions of 2 mm ⁇ 2 mm ⁇ 100 ⁇ m
- a commercially available sodium silicate solution is initially with
- Example 2 Coating of the flakes from Example 1 with YAG: Ce phosphor, starting from nitrate precursors
- Silica flakes from Example 1 are presented as an aqueous suspension having a solids content of less than 50 g / l in a coating vessel. The suspension is then heated to 75 ° C and gently stirred with a few 100 rpm.
- an aqueous solution containing the precursor of the actual phosphor is prepared as follows: 157.10 g of Al (NO 3 ) 3 .9H 2 O is added to the magnetic stir plate with stirring
- the phosphor precursor (phosphorus hydroxide) is converted into the actual phosphor in the oxide form.
- a second annealing under reducing conditions (CO or forming gas) is carried out at temperatures up to 1200 0 C.
- the suspension is then heated to 75 ° C and intensively with 1000
- the preformed YAG: Ce phosphor in the suspension now precipitates and the resulting phosphor nano-particles deposit on the silica substrate, i. the platelets are coated with the phosphor particles.
- the coating process is completed.
- the suspension is then stirred for a further 2 hours and the material is filtered off with suction as described, washed and calcined at 1000 ° C. for about 6 hours.
- the phosphor precursor phosphorus hydroxide
- the annealing takes place under reducing conditions (eg CO atmosphere).
- Example 4 Incorporation of YAG: Ce phosphor particles in silica flakes
- the preformed YAG: Ce phosphor now precipitates in the suspension. Thereafter, the suspension is dried and solidified. The solidified platelets are separated from the structured support medium and thermally post-treated. The thermal aftertreatment is carried out in a two-stage process: At 1000 0 C, the material is annealed in the air for 4 h, then the material at 1700 0 C in a reducing atmosphere
- Forming gas annealed over a period of 6 h.
- FIG. 1 Side view of the structured film consisting of wells with a certain depth.
- the cups represent the template for the mica, glass, ZrO 2 , TiO 2 , SiO 2 or Al 2 O 3 platelets.
- (1 PET film, predetermined breaking point for the mica, glass, ZrO 2 , TiO 2 , SiO 2 or Al 2 O 3 platelets)
- Fig. 2 Top view of the film structure, which consists of juxtaposed rectangular wells.
- Fig. 3 The wells are filled with the liquid or dissolved precursor substances for the platelets - gray (e.g., soda waterglass), the precursors are dried and heated - gray.
- heating may be to a temperature at which the patterned support medium (e.g., PET film) is baked away, thereby isolating the (gray) platelets.
- the dimensions of the plates correspond to those of the wells.
- FIG. 5 pyramidal structures 2 can be produced on one surface of the platelet by treatment according to the invention of the platelet-shaped phosphor body (top). Likewise, according to the invention, on a surface (rough side 3) of the platelet-shaped phosphor body nanoparticles of SiO 2 , TiO 2 , ZnO 2 , ZrO 2 , Al 2 ⁇ 3 , Y 2 O 3 etc. or mixtures thereof or particles of the phosphor composition consisting.
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Abstract
Description
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CA002669838A CA2669838A1 (en) | 2006-11-17 | 2007-10-25 | Phosphor flakes for leds made from structured films |
US12/514,937 US20100244067A1 (en) | 2006-11-17 | 2007-10-25 | Phosphor plates for leds from structured films |
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DE102006054330A DE102006054330A1 (de) | 2006-11-17 | 2006-11-17 | Leuchtstoffplättchen für LEDs aus strukturierten Folien |
DE102006054330.0 | 2006-11-17 |
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CA (1) | CA2669838A1 (de) |
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DE102014117440B3 (de) * | 2014-11-27 | 2016-04-07 | Seaborough IP IV BV | Lichtemittierende Remote-Phosphor-Vorrichtung |
CN107532082A (zh) * | 2015-04-27 | 2018-01-02 | 默克专利有限公司 | 无机发光材料和无机发光材料转化led |
DE102017108190A1 (de) * | 2017-04-18 | 2018-10-31 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes optoelektronisches Bauelement |
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DE102008051029A1 (de) | 2008-10-13 | 2010-04-15 | Merck Patent Gmbh | Dotierte Granat-Leuchtstoffe mit Rotverschiebung für pcLEDs |
DE102008058621A1 (de) | 2008-11-22 | 2010-05-27 | Merck Patent Gmbh | Co-dotierte 1-1-2-Nitride |
DE102009010705A1 (de) | 2009-02-27 | 2010-09-02 | Merck Patent Gmbh | Co-dotierte 2-5-8 Nitride |
WO2010097157A1 (de) | 2009-02-27 | 2010-09-02 | Merck Patent Gmbh | Mit zirkonium und hafnium co-dotierte nitridosilikate |
DE102009032711A1 (de) | 2009-07-11 | 2011-01-20 | Merck Patent Gmbh | Co-dotierte Silicooxynitride |
DE102009042479A1 (de) | 2009-09-24 | 2011-03-31 | Msg Lithoglas Ag | Verfahren zum Herstellen einer Anordnung mit einem Bauelement auf einem Trägersubstrat und Anordnung sowie Verfahren zum Herstellen eines Halbzeuges und Halbzeug |
WO2011035783A1 (de) | 2009-09-24 | 2011-03-31 | Msg Lithoglas Ag | Herstellungsverfahren eines gehäuses mit einem bauelement in einem hohlraum und entsprechendes gehäuse sowie verfahren zum herstellen eines halbzeuges und halbzeug |
DE202010018593U1 (de) | 2009-09-24 | 2018-03-19 | Msg Lithoglas Gmbh | Anordnung mit einem Bauelement auf einem Trägersubstrat und Halbzeug sowie ein Halbzeug |
EP3297036A1 (de) | 2009-09-24 | 2018-03-21 | MSG Lithoglas GmbH | Verfahren zum herstellen einer anordnung mit einem bauelement auf einem trägersubstrat und anordnung sowie verfahren zum herstellen eines halbzeuges |
DE102009050542A1 (de) | 2009-10-23 | 2011-04-28 | Merck Patent Gmbh | Sm-aktivierte Aluminat- und Borat-Leuchtstoffe |
WO2011047757A1 (de) | 2009-10-23 | 2011-04-28 | Merck Patent Gmbh | Sm-aktivierte aluminat- und borat-leuchtstoffe |
Also Published As
Publication number | Publication date |
---|---|
TW200835774A (en) | 2008-09-01 |
US20100244067A1 (en) | 2010-09-30 |
DE102006054330A1 (de) | 2008-05-21 |
CA2669838A1 (en) | 2008-05-22 |
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