WO2008017208A1 - Dispositif de purge automatique destiné à purger le pipeline d'un revêtement de résine photorésistante et appareil de développement - Google Patents

Dispositif de purge automatique destiné à purger le pipeline d'un revêtement de résine photorésistante et appareil de développement Download PDF

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Publication number
WO2008017208A1
WO2008017208A1 PCT/CN2006/001951 CN2006001951W WO2008017208A1 WO 2008017208 A1 WO2008017208 A1 WO 2008017208A1 CN 2006001951 W CN2006001951 W CN 2006001951W WO 2008017208 A1 WO2008017208 A1 WO 2008017208A1
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Prior art keywords
valve
pneumatic
air
photoresist coating
line
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PCT/CN2006/001951
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English (en)
French (fr)
Inventor
Wei Huang
Wei Xue
Yao Chen
Ke Hu
Original Assignee
He Jian Technology (Suzhou) Co., Ltd.
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Application filed by He Jian Technology (Suzhou) Co., Ltd. filed Critical He Jian Technology (Suzhou) Co., Ltd.
Priority to CN2006800551807A priority Critical patent/CN101479054B/zh
Priority to PCT/CN2006/001951 priority patent/WO2008017208A1/zh
Publication of WO2008017208A1 publication Critical patent/WO2008017208A1/zh

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4408Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber by purging residual gases from the reaction chamber or gas lines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • B08B9/02Cleaning pipes or tubes or systems of pipes or tubes
    • B08B9/027Cleaning the internal surfaces; Removal of blockages
    • B08B9/032Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing
    • B08B9/0321Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing using pressurised, pulsating or purging fluid
    • B08B9/0323Arrangements specially designed for simultaneous and parallel cleaning of a plurality of conduits
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • B08B9/02Cleaning pipes or tubes or systems of pipes or tubes
    • B08B9/027Cleaning the internal surfaces; Removal of blockages
    • B08B9/032Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing
    • B08B9/0321Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing using pressurised, pulsating or purging fluid
    • B08B9/0325Control mechanisms therefor

Definitions

  • the present invention relates to a pipe cleaning technique, and more particularly to an automatic pipe cleaning device in a photoresist coating and developing device. Background technology
  • Photoresist coating and developing devices are one of the important devices in semiconductor manufacturing processes. Because it does not have the function of automatic purge, the device's tubing cannot be automatically cleaned. After a period of use, Hexamethyldisilazane (hereinafter referred to as HMDS) and other harmful particles are formed on the tube wall, causing the above-mentioned device defects to be produced.
  • HMDS Hexamethyldisilazane
  • HMDS-air distribution pipeline The front pipe is disassembled and connected to the detergent propionic ethanol (IPA) or nitrogen (N 2 ) source. Then, disassemble the pipeline in front of the pneumatic switch valve 21 of the HMDS-air distribution pipeline, connect the waste liquid or the exhaust gas recovery bottle, use an external pressure source, and press the detergent into the pipeline to achieve the purpose of cleaning the pipeline. Therefore, it is easy to cause the hexamethylenediamine (HMDA) to leak if the pipe is not connected, or the vacuum is not properly installed or the wafer is scratched.
  • IPA detergent propionic ethanol
  • N 2 nitrogen
  • the detergent propylene glycol is required. If the detergent propylene glycol is not cleaned at all, the detergent propylene glycol and HMDS will form harmful particles to increase the probability of defects in the above device. Therefore, in order to improve efficiency and ensure safe production, semiconductor manufacturers need a photoresist coating and developing device that can overcome the defects of the above-mentioned conventional devices and perform automatic cleaning of the pipeline. SUMMARY OF THE INVENTION The present invention has been developed in order to overcome the drawbacks of the current photoresist coating and developing device in PM, and the object thereof is to provide an automatic pipe line without disassembling the cover and the pipe joint when doing PM. Cleaning device.
  • the invention provides an automatic pipeline cleaning device in a photoresist coating and developing device, which comprises a bubble tank, a bubble tank output line, a pressure gauge, a flow meter, an HMDS-air supply Pneumatic on-off valve for discharge and pneumatic shut-off valve for HMDS-air distribution line;
  • the automatic pipeline cleaning device of the present invention comprises a two-position three-way pneumatic reversing valve, which is connected with the above-mentioned HMDS-air supply and discharge pneumatic on-off valve a nitrogen line disposed between the pressure gauge and the flow meter, and a nitrogen line disposed at the outlet of the bubble tank, and connected to the bubbling tank output line through the two-position three-way pneumatic reversing valve to realize two types Working state, ie nitrogen or HMDS.
  • One or more pneumatic switches of the HMDS-air distribution line can be connected in parallel with the pneumatic switch valve of the above HMDS-air distribution line, and the pipeline can still be closed when the pneumatic on-off valve of the above-mentioned MDS-air distribution line is closed
  • the conduction is such that nitrogen in the above conduit can reach the reaction chamber.
  • the pneumatic on-off valve of the above HMDS-air distribution pipeline and the two-position three-way pneumatic reversing valve may be respectively connected with the HMDS-air discharge line pneumatic switch solenoid valve, and one or more HMDS-air distribution pipelines after the parallel connection
  • the pneumatic on-off valve can be connected to the HMDS - air-on switch solenoid.
  • One or more pneumatic switching valves of the HMDS-air distribution line can also be connected in parallel at the pneumatic switching valve of the other HMDS-air distribution line.
  • Photoresist coating and developing apparatus described above is preferably produced by Tokyo Electron CLEAN machine for the production of semiconductor photoresist coating and developing TRACK, an optical model for a cell MK8 ADH 0 preclude the use of the present invention provides Automatic cleaning device for pipelines in the coating and developing device. Since two nitrogen pipes are added to the pipeline, nitrogen can be directly connected to the nitrogen source as a cleaning agent. In addition, due to the HMDS-air distribution pipeline.
  • the pneumatic switch valve is connected in parallel with the same valve, so that when the pneumatic switch valve is closed, the pipeline can still be turned on, so that the nitrogen in the pipeline can reach the reaction chamber, so it is no longer needed when timing PM is performed.
  • Disassemble the cover of the above device and The pipe joint eliminates the need to connect to the waste liquid or waste gas recovery bottle, and uses an external pressure source to press the cleaning agent into the cleaning line. At the same time, it can prevent the leakage of hexamethylenediamine (HMDA) due to the lack of connection of the pipe, or The cover is not properly installed and the vacuum is abnormal or the wafer is scratched.
  • HMDA hexamethylenediamine
  • Another remarkable feature of the present invention is the use of nitrogen instead of propanol because nitrogen is an inert gas and can be supplied by a machine (CLEAN TRACK), and after cleaning the pipe with propylene glycol, it must be removed, and if it is left, it will increase.
  • the probability of failure of the above device, while the use of nitrogen does not cause the above device defects due to the residue.
  • FIGS. la and lb are schematic views of a pipeline apparatus of an existing photoresist coating and developing apparatus.
  • 2a and 2b are schematic views of the piping apparatus of the photoresist coating and developing apparatus in accordance with a preferred embodiment of the present invention.
  • Figure 3 is a schematic view showing the connection of a bubble can and a solenoid valve in a photoresist coating and developing device in accordance with a preferred embodiment of the present invention.
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to Figures 2a and 2b, Figures 2a and 2b are schematic views of an automatic line cleaning apparatus in a photoresist coating and developing apparatus in accordance with a preferred embodiment of the present invention.
  • the photoresist coating and developing device is a machine manufactured by Tokyo Electronics (TEL) Co., Ltd.
  • FIGS. 2a and 2b show the photoresist coating and developing apparatus, and the lines 191, 192, 193, 194, 195 shown in the drawing respectively show the piping connecting the devices shown in the two figures.
  • an automatic pipe cleaning device in a photoresist coating and developing device adds two nitrogens to an existing pipeline.
  • FIG. 3 is a schematic view showing the connection of the bubble can 15 and the electromagnetic valve in the automatic pipeline cleaning device in the photoresist coating and developing device according to a preferred embodiment of the present invention.
  • the automatic pipe cleaning device is further connected in parallel with a pneumatic valve 51 of the HMDS-air distribution pipe in the pipeline device of the conventional photoresist coating and developing device.
  • the purpose is that when the pneumatic on-off valve 21 of the HMDS-air distribution line is closed, the line can still be turned on so that nitrogen in the line can reach the reaction chamber.
  • the connections of the devices in Figure 3 are as follows: At the outlet of the bubble can 15 is connected to the nitrogen tube through a two-position three-way pneumatic reversing valve 52, and the two-position three-way pneumatic reversing valve 52 is connected to the HMDS - air supply, discharge pneumatic switch The valve 14 is then connected to a pneumatic switching valve 21 of the HMDS-air distribution line, which valve 21 is connected in parallel with a similar pneumatic switching valve 51. The outlets of the pneumatic on-off valve 21 and the pneumatic on-off valve 51 are passed to the reaction chamber.
  • the pneumatic shut-off valve 51 and the two-position three-way pneumatic reversing valve 52 are simultaneously connected with the HMDS-air discharge line pneumatic switch solenoid valve 23, and the pneumatic switch valve 21 is simultaneously connected with the HMDS-air-opening switch solenoid valve 22 of FIG. 2b. connection.
  • a pneumatic on-off valve 26 of the HMDS-air distribution line is connected in parallel with the pneumatic on-off valve 25 of the HMDS-air distribution line.

Description

一种光阻涂布和显影装置中的管路自动清洗装置 技术领域 本发明涉及管路清洗技术,特别是一种光阻涂布和显影装置中的管路 自动清洗装置。 说 背景技术
光阻涂布和显影装置是半导体制造工艺中的重要装置之一。由于其不 具备自动清洗(purge) 的功能,该装置的管路不能进行自动清洗。在使用 一段时间之后,就会在管壁上形成六甲基二硅氮垸(Hexamethyldisilazane, 以下简称 HMDS) 和其他的有害微粒, 造成上述装置缺陷 (defect) 的产 生。
为对管路进行清洁,需要定时进行预防保养 (Preventive Maintenance, 以下简称 PM)。如图 la和 lb所示的已有的光阻涂布和显影装置,在每次 PM 时均需拆开上述装置的盖子 (cover)和管子接头,例如,需要将鼓泡罐 15
(Bubble tank) 前的管路拆开, 接入清洁剂丙乙醇 (IPA) 或者氮 (N2) 源。然后拆开 HMDS—空气分配管路的气动开关阀 21前的管路, 接入废液 或废气回收瓶,运用外接压力源, 管路压入清洁剂,来达到清洁管路的 目的。 因此很容易造成管路没有接好而产生己二胺 (HMDA)泄漏, 或者 盖子没有安装正确造成的真空异常或者晶片 (wafer) 的刮伤。
另外, 在进行 PM的时候, 需要使用清洁剂丙乙醇, 如最后没有将清 洁剂丙乙醇全部清洁干净,清洁剂丙乙醇和 HMDS混合后会生成有害微粒 而增加上述装置缺陷产生的机率。 因此, 为了提高效率, 保障安全生产, 半导体生产厂家需要有一种能 克服上述现有装置的缺陷, 进行管路自动清洗的光阻涂布和显影装置。 发明内容 本发明是为了克服目前的光阻涂布和显影装置在 PM方面的缺陷而 开发完成的, 其目的在于提供一种在做 PM时不需要拆开盖子与管子接 头便能进行管路自动清洗的装置。
本发明提供一种光阻涂布和显影装置中的管路自动清洗装置,该光阻 涂布和显影装置包括鼓泡罐、 鼓泡罐输出管路、 压力表、 流量计、 HMDS -空气供应、 排放的气动开关阀和 HMDS―空气分配管路的气动幵关阀; 本发明的管路自动清洗装置包括两位三通气动换向阀, 同上述 HMDS -空 气供应、 排放的气动开关阀连接, 设置在压力表与流量计之间的氮管路, 设置在鼓泡罐的出口处的氮管路,通过上述两位三通气动换向阀与鼓泡罐 输出管路连接, 实现两种工作状态, 即通氮或者 HMDS。
在上述 HMDS—空气分配管路的气动开关阀处可以并联一个或多个 HMDS一空气分配管路的气动开关闽,则在上述 MDS -空气分配管路的气 动开关阀关闭时,管路仍然能够导通,使得上述管路中的氮可以到达反应 室。
上述 HMDS—空气分配管路的气动开关阀和上述两位三通气动换向 阀可以分别同 HMDS—空气排出管路气动开关电磁阀连接, 上述并联后的 一个或多个 HMDS -空气分配管路的气动开关阀可以同 HMDS -空气开启 开关电磁闽连接。
在另一个 HMDS—空气分配管路的气动开关阀处还可以并联一个或 多个 HMDS -空气分配管路的气动开关阀。 上述光阻涂布和显影装置最好是东京电子公司生产的用于半导体生 产中的光阻涂布和显影的机器 CLEAN TRACK, 型号为 MK8 ADH的一个 单元 0 釆用本发明提供的一种光阻涂布和显影装置中的管路自动清洗装置, 由于在管路中增加了两条氮管路, 可以直接从氮源接入作为清洁剂的氮, 另外, 由于在 HMDS—空气分配管路的气动开关阀处并联一个与该阀同样 的阅, 这样, 在气动开关阀关闭时, 管路仍然能够导通, 使得管路中的氮 可以到达反应室, 因此在进行定时 PM时不再需要拆开上述装置的盖子和 管子接头, 免去了接入废液或废气回收瓶, 运用外接压力源, Χ管路压入 清洁剂的麻烦, 同时可以防止因管路没有接好而产生己二胺(HMDA)泄 漏, 或者盖子没有安装正确造成的真空异常或者晶片刮伤。釆用本发明的 管路自动清洗装置,可以在不改变软件设定的状态下,实现管路的自动清 洗。
本发明的另一显著特点是使用氮气代替丙乙醇,原因是氮气是惰性气 体,可以由机台 (CLEAN TRACK)提供,而且使用丙乙醇清洁管路后,必 须要排除干净,如有残留会增加上述装置故障的机率,而使用氮气则不会 对由于残留而产生上述装置缺陷。
为让本发明之上述和其他目的、特征和优点能更明显易懂,下文特举 较佳实施例, 并配合附图, 作详细说明如下。 附图说明 图 la与图 lb是已有的光阻涂布和显影装置的管路设备示意图。 图 2a与图 2b是本发明的一较佳实施例的光阻涂布和显影装置的管路 设备示意图。
图 3是本发明的一较佳实施例的光阻涂布和显影装置中鼓泡罐与电磁 阀连接的示意图。 具体实施方式 请参照图 2a与 2b, 图 2a与图 2b是本发明的一较佳实施例的一种光阻涂 布和显影装置中的管路自动清洗装置的示意图。上述光阻涂布和显影装置 最好是东京电子 (TEL) 公司所生产的用于半导体生产中的光阻涂布和显 影的机器 CLEAN TRACK, 型号为 MK8 ADH的一个单元, 其主要用途是 晶片的表面涂布一层表面附着剂以增加晶片的表面张力。图 2a和图 2b是表 示光阻涂布和显影装置, 图中所示的管路 191, 192, 193 , 194, 195分别 表示连接两图所示装置的管路。如图所示,本发明的一较佳实施例的一种 光阻涂布和显影装置中的管路自动清洗装置在已有的管路中增加两条氮 (N2)管路, 即分别在已有的管路的压力表 13与流量计 11、 12之间增加一 条氮管路 16, 同时在鼓泡罐 15的出口增加一条氮管路 17,并通过一个两位 三通气动换向阁 52与鼓泡罐 15的输出管路连接起来,通过两位三通气动换 向阀 52实现同一条管路的两种工作状态, 即通氮或者 HMDS。 下面请参照图 3,图 3是本发明的一较佳实施例的一种光阻涂布和显影 装置中的管路自动清洗装置中鼓泡罐 15与电磁阀连接的示意图。 本发明的一较佳实施例管路自动清洗装置在已有的光阻涂布和显影 装置的管路装置中的 HMDS -空气分配管路的气动开关阀 21处再并联一 个同样的电磁阀 51,其目的是在 HMDS—空气分配管路的气动开关阀 21关 闭时, 管路仍然能够导通, 使得管路中的氮可以到达反应室。
图 3中各装置的连接如下: 在鼓泡罐 15的出口通过两位三通气动换向 阀 52接入氮管, 两位三通气动换向阀 52连接 HMDS—空气供应、 排放的气 动开关阀 14, 之后连接于 HMDS -空气分配管路的气动开关阀 21, 该阀 21 与一个同样的气动开关阀 51并联。气动开关阀 21和气动开关阀 51的出口到 达反应室。上述气动幵关阀 51和上述两位三通气动换向阀 52同时与 HMDS 一空气排出管路气动开关电磁阀 23连接,上述气动开关阀 21同时与图 2b中 HMDS一空气开启开关电磁阀 22连接。
在 HMDS -空气分配管路的气动开关阀 25处并联一个 HMDS -空气分 配管路的气动开关阀 26。 当然,本发明还可有其他实施例,在不背离本发明思想及其实质的情 况下,所属技术领域的技术人员当可根据本发明作出各种相应的变更和改 形, 但这些相应的变更和改形都应属于本发明的权利要求的保护范围。

Claims

1.一种光阻涂布和显影装置中的管路自动清洗装置,该光阻涂布和显 影装置包含鼓泡罐 (15), 鼓泡罐输出管路, 压力表 (13) 、 流量计 (11)
( 12) 、 六甲基二硅氮垸—空气供应、 排放的气动开关阀 (14) 和六甲基 二硅氮烷-空气分配管路的气动开关阀 (21) , 其特征是包括
两位三通气动换向阀 (权52) , 同上述六甲基二硅氮烷—空气供应、 排 放的气动开关阀 ( ) 连接,
设置在压力表 (13) 与流量计 (11) 、 流量计 (12) 之间的氮管路, 设置在鼓泡罐 (15) 的出口处的氮管路,通过上述两位三通气动换向 书
阀 (52) 与鼓泡罐输出管路连接。
2.根据权利要求 1所述的装置, 其特征是在六甲基二硅氮垸—空气分 配管路的气动开关阀 (21)处并联一个六甲基二硅氮烷一空气分配管路的 气动开关阀 (51) 。
3.根据权利要求 2所述的装置, 其特征是上述六甲基二硅氮烷-空气 分配管路的气动开关阀 (51 ) 和上述两位三通气动换向阀 (52) 分别同六 甲基二硅氮垸一空气排出管路气动开关电磁阀 (23)连接, 上述六甲基二 硅氮烷一空气分配管路的气动开关阀(21) 同六甲基二硅氮烷—空气开启 开关电磁阀 (22) 连接。
4.根据权利要求 3所述的装置, 其特征是在六甲基二硅氮烷一空气分 配管路的气动开关阀(25)处并联一个六甲基二硅氮垸―空气分配管路的 气动开关阀 (26) 。
5.根据权利要求 1所述的装置, 其特征是上述光阻涂布和显影装置是 东京电子公司生产的用于半导体生产中的光阻涂布和显影的机器 CLEAN TRACK, 型号为 MK8 ADH的一个单元。
PCT/CN2006/001951 2006-08-03 2006-08-03 Dispositif de purge automatique destiné à purger le pipeline d'un revêtement de résine photorésistante et appareil de développement WO2008017208A1 (fr)

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Application Number Priority Date Filing Date Title
CN2006800551807A CN101479054B (zh) 2006-08-03 2006-08-03 一种光阻涂布和显影装置中的管路自动清洗装置
PCT/CN2006/001951 WO2008017208A1 (fr) 2006-08-03 2006-08-03 Dispositif de purge automatique destiné à purger le pipeline d'un revêtement de résine photorésistante et appareil de développement

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PCT/CN2006/001951 WO2008017208A1 (fr) 2006-08-03 2006-08-03 Dispositif de purge automatique destiné à purger le pipeline d'un revêtement de résine photorésistante et appareil de développement

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CN112802773B (zh) * 2019-11-13 2022-03-04 长鑫存储技术有限公司 半导体系统及半导体工艺方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02294017A (ja) * 1989-05-08 1990-12-05 Fuji Electric Co Ltd リソグラフィ法
JPH05171447A (ja) * 1991-12-14 1993-07-09 Tokyo Electron Ltd 処理ガス供給装置
US5505781A (en) * 1993-01-29 1996-04-09 Tokyo Electron Limited Hydrophobic processing apparatus including a liquid delivery system
US6019849A (en) * 1996-10-04 2000-02-01 Taiwan Semiconductor Manufacturing Company Method and apparatus for automatic purge of HMDS vapor piping
US6109278A (en) * 1996-08-12 2000-08-29 Tokyo Electron Limited Liquid treatment method and apparatus
US6202653B1 (en) * 1998-03-18 2001-03-20 Tokyo Electron Ltd. Processing solution supplying apparatus, processing apparatus and processing method
CN1635609A (zh) * 2003-12-26 2005-07-06 南美特科技股份有限公司 半导体制程设备的清洁方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02294017A (ja) * 1989-05-08 1990-12-05 Fuji Electric Co Ltd リソグラフィ法
JPH05171447A (ja) * 1991-12-14 1993-07-09 Tokyo Electron Ltd 処理ガス供給装置
US5505781A (en) * 1993-01-29 1996-04-09 Tokyo Electron Limited Hydrophobic processing apparatus including a liquid delivery system
US6109278A (en) * 1996-08-12 2000-08-29 Tokyo Electron Limited Liquid treatment method and apparatus
US6019849A (en) * 1996-10-04 2000-02-01 Taiwan Semiconductor Manufacturing Company Method and apparatus for automatic purge of HMDS vapor piping
US6202653B1 (en) * 1998-03-18 2001-03-20 Tokyo Electron Ltd. Processing solution supplying apparatus, processing apparatus and processing method
CN1635609A (zh) * 2003-12-26 2005-07-06 南美特科技股份有限公司 半导体制程设备的清洁方法

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