WO2008011003A3 - Système de caméra et méthodes associées - Google Patents

Système de caméra et méthodes associées Download PDF

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Publication number
WO2008011003A3
WO2008011003A3 PCT/US2007/016156 US2007016156W WO2008011003A3 WO 2008011003 A3 WO2008011003 A3 WO 2008011003A3 US 2007016156 W US2007016156 W US 2007016156W WO 2008011003 A3 WO2008011003 A3 WO 2008011003A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrates
optics stack
imaging system
camera system
associated methods
Prior art date
Application number
PCT/US2007/016156
Other languages
English (en)
Other versions
WO2008011003A2 (fr
Inventor
Michael R Feldman
James E Morris
Robert D Tekolste
Original Assignee
Tessera North America
Michael R Feldman
James E Morris
Robert D Tekolste
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/487,580 external-priority patent/US8049806B2/en
Application filed by Tessera North America, Michael R Feldman, James E Morris, Robert D Tekolste filed Critical Tessera North America
Priority to KR1020097003164A priority Critical patent/KR101185881B1/ko
Priority to JP2009520799A priority patent/JP5292291B2/ja
Priority to EP07796897A priority patent/EP2044629A4/fr
Priority to CN2007800336275A priority patent/CN101512768B/zh
Publication of WO2008011003A2 publication Critical patent/WO2008011003A2/fr
Publication of WO2008011003A3 publication Critical patent/WO2008011003A3/fr
Priority to US12/805,617 priority patent/US8953087B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
    • G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
    • G02B13/003—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having two lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
    • G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
    • G02B13/0035—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having three lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0055—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element
    • G02B13/006—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element at least one element being a compound optical element, e.g. cemented elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

L'invention concerne un système de caméra pouvant comporter un empilement de dispositifs optiques comprenant deux substrats. L'empilement de dispositifs optiques constitue un système d'imagerie, chaque substrat présente deux surfaces parallèles et perpendiculaires à un axe optique du système d'imagerie. L'empilement de dispositifs optiques comprend une zone de fixation sur des surfaces opposées des deux substrats. Les deux substrats sont fixés ensemble sur un niveau de paquet au niveau de leurs zones de fixation respectives. Au moins une des surfaces des deux substrats comprend une surface de réfraction du système d'imagerie. Un substrat de détecteur présente une zone active et une structure de recouvrement protégeant la zone active du substrat de détecteur. L'empilement de dispositifs optiques est fixé contre une surface supérieure de la structure de recouvrement.
PCT/US2007/016156 2004-04-08 2007-07-17 Système de caméra et méthodes associées WO2008011003A2 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020097003164A KR101185881B1 (ko) 2006-07-17 2007-07-17 카메라 시스템 및 관련 방법들
JP2009520799A JP5292291B2 (ja) 2006-07-17 2007-07-17 カメラシステムの作製方法
EP07796897A EP2044629A4 (fr) 2006-07-17 2007-07-17 Systeme de camera et methodes associees
CN2007800336275A CN101512768B (zh) 2006-07-17 2007-07-17 相机系统及相关方法
US12/805,617 US8953087B2 (en) 2004-04-08 2010-08-10 Camera system and associated methods

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US11/487,580 US8049806B2 (en) 2004-09-27 2006-07-17 Thin camera and associated methods
US11/487,580 2006-07-17
US85536506P 2006-10-31 2006-10-31
US60/855,365 2006-10-31

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US11/487,580 Continuation-In-Part US8049806B2 (en) 2004-04-08 2006-07-17 Thin camera and associated methods

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/805,617 Continuation US8953087B2 (en) 2004-04-08 2010-08-10 Camera system and associated methods

Publications (2)

Publication Number Publication Date
WO2008011003A2 WO2008011003A2 (fr) 2008-01-24
WO2008011003A3 true WO2008011003A3 (fr) 2008-06-26

Family

ID=38957311

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/016156 WO2008011003A2 (fr) 2004-04-08 2007-07-17 Système de caméra et méthodes associées

Country Status (5)

Country Link
EP (1) EP2044629A4 (fr)
JP (2) JP5292291B2 (fr)
KR (1) KR101185881B1 (fr)
CN (1) CN101512768B (fr)
WO (1) WO2008011003A2 (fr)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080118241A1 (en) * 2006-11-16 2008-05-22 Tekolste Robert Control of stray light in camera systems employing an optics stack and associated methods
US7841785B2 (en) 2007-02-19 2010-11-30 Konica Minolta Opto, Inc. Imaging lens, imaging device, portable terminal, and method for manufacturing imaging lens
WO2008102648A1 (fr) * 2007-02-19 2008-08-28 Konica Minolta Opto, Inc. Lentille et dispositif d'imagerie, et terminal mobile
JP5212354B2 (ja) * 2007-02-19 2013-06-19 コニカミノルタアドバンストレイヤー株式会社 撮像レンズ、撮像装置、携帯端末、および撮像レンズの製造方法
US8456564B2 (en) 2007-07-04 2013-06-04 Konica Minolta Opto, Inc. Imaging lens, imaging device, and mobile terminal
US20110031510A1 (en) * 2007-11-27 2011-02-10 Heptagon Oy Encapsulated lens stack
TW200937642A (en) * 2007-12-19 2009-09-01 Heptagon Oy Wafer stack, integrated optical device and method for fabricating the same
CN101952761B (zh) 2008-02-20 2012-12-19 柯尼卡美能达精密光学株式会社 摄像透镜、摄像装置、便携终端及摄像透镜的制造方法
US9118825B2 (en) 2008-02-22 2015-08-25 Nan Chang O-Film Optoelectronics Technology Ltd. Attachment of wafer level optics
WO2009133756A1 (fr) * 2008-04-28 2009-11-05 コニカミノルタオプト株式会社 Procédé pour produire un ensemble lentille mince et procédé de fabrication de lentille mince
WO2009137022A1 (fr) * 2008-05-06 2009-11-12 Tessera North America, Inc. Système de caméra comprenant un blindage contre les rayonnements et procédé de blindage contre les rayonnements
FR2931587B1 (fr) * 2008-05-21 2011-05-13 Commissariat Energie Atomique Procede de realisation d'un dispositif optique a composants optoelectroniques integres
US20090321861A1 (en) * 2008-06-26 2009-12-31 Micron Technology, Inc. Microelectronic imagers with stacked lens assemblies and processes for wafer-level packaging of microelectronic imagers
JP5094802B2 (ja) * 2008-09-26 2012-12-12 シャープ株式会社 光学素子ウエハの製造方法
KR101634353B1 (ko) 2008-12-04 2016-06-28 삼성전자주식회사 마이크로 렌즈, 상기 마이크로 렌즈 제조방법, 상기 마이크로 렌즈 제조 장치, 및 상기 마이크로 렌즈를 구비한카메라 모듈
NL1036360C2 (nl) * 2008-12-23 2010-06-24 Anteryon B V Optische eenheid.
TWM364865U (en) 2009-05-07 2009-09-11 E Pin Optical Industry Co Ltd Miniature stacked glass lens module
KR20100130423A (ko) * 2009-06-03 2010-12-13 삼성전자주식회사 웨이퍼-레벨 렌즈 모듈 및 이를 구비하는 촬상 모듈
KR101648540B1 (ko) 2009-08-13 2016-08-16 삼성전자주식회사 웨이퍼-레벨 렌즈 모듈 및 이를 구비하는 촬상 장치
US9419032B2 (en) 2009-08-14 2016-08-16 Nanchang O-Film Optoelectronics Technology Ltd Wafer level camera module with molded housing and method of manufacturing
TW201109165A (en) 2009-09-11 2011-03-16 E Pin Optical Industry Co Ltd Stacked disk-shaped optical lens array, stacked disk-shaped lens module array and the method of manufacturing thereof
US8305699B2 (en) 2009-09-23 2012-11-06 Samsung Electronics Co., Ltd. Wafer-level lens module with extended depth of field and imaging device including the wafer-level lens module
JP2011085625A (ja) * 2009-10-13 2011-04-28 Toppan Printing Co Ltd カメラモジュール及びその製造方法
JP5556140B2 (ja) * 2009-11-20 2014-07-23 凸版印刷株式会社 カメラモジュール及びその製造方法
SG186214A1 (en) * 2010-06-14 2013-01-30 Heptagon Micro Optics Pte Ltd Method of manufacturing a plurality of optical devices
NL2005164C2 (nl) 2010-07-28 2012-01-31 Anteryon Internat B V Optische eenheid.
FR2966936B1 (fr) * 2010-11-02 2012-12-07 Commissariat Energie Atomique Systeme optique de formation d'image sur une surface spherique concave
CN102478695B (zh) * 2010-11-25 2016-05-11 鸿富锦精密工业（深圳）有限公司 镜头模组阵列、制造方法及镜头
US9910239B2 (en) * 2010-11-30 2018-03-06 Flir Systems Trading Belgium Bvba Wafer level optical elements and applications thereof
KR101262470B1 (ko) * 2011-01-31 2013-05-08 엘지이노텍 주식회사 렌즈 어셈블리 및 카메라 모듈
NL2006373C2 (nl) 2011-03-11 2012-09-17 Anteryon Internat B V Optische eenheid.
US8345360B2 (en) * 2011-06-03 2013-01-01 Visera Technologies Company Limited Camera unit and macro lens thereof
CN103620468A (zh) * 2011-06-17 2014-03-05 柯尼卡美能达株式会社 晶片透镜的制造方法及晶片透镜、透镜单元的制造方法及透镜单元
JP2013007969A (ja) * 2011-06-27 2013-01-10 Sharp Corp 撮像レンズ、レンズアレイ、撮像レンズの製造方法、および撮像モジュール
US20130122247A1 (en) * 2011-11-10 2013-05-16 Omnivision Technologies, Inc. Spacer Wafer For Wafer-Level Camera And Method For Manufacturing Same
JP5469235B2 (ja) * 2012-12-20 2014-04-16 オリンパス株式会社 レンズモジュールの製造方法
SG11201606706WA (en) * 2014-02-18 2016-09-29 Heptagon Micro Optics Pte Ltd Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules
JP6254680B2 (ja) * 2014-04-04 2018-01-10 シャープ株式会社 レンズ素子および撮像装置
US20160307881A1 (en) * 2015-04-20 2016-10-20 Advanced Semiconductor Engineering, Inc. Optical sensor module and method for manufacturing the same
US9829698B2 (en) 2015-08-31 2017-11-28 Panasonic Corporation Endoscope
JP6744119B2 (ja) * 2016-04-05 2020-08-19 パナソニックｉ−ＰＲＯセンシングソリューションズ株式会社 内視鏡
US9778443B2 (en) * 2015-10-05 2017-10-03 Omnivision Technologies, Inc. Three-surface wide field-of-view lens system
KR101701060B1 (ko) * 2015-11-03 2017-01-31 삼성전기주식회사 카메라 모듈
US10677964B2 (en) 2017-10-23 2020-06-09 Omnivision Technologies, Inc. Lens wafer assembly and associated method for manufacturing a stepped spacer wafer
US11311187B2 (en) 2018-04-06 2022-04-26 Amo Development, Llc Methods and systems for corneal topography with in-focus scleral imaging
KR102555577B1 (ko) * 2019-01-28 2023-07-18 삼성전자주식회사 카메라 모듈을 포함하는 전자 장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6541284B2 (en) * 2000-05-23 2003-04-01 Atmel Corporation Integrated IC chip package for electronic image sensor die
US20060044450A1 (en) * 2002-09-17 2006-03-02 Koninklijke Philips Electronics, N.C. Camera device, method of manufacturing a camera device, wafer scale package

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6859229B1 (en) 1999-06-30 2005-02-22 Canon Kabushiki Kaisha Image pickup apparatus
US6806988B2 (en) 2000-03-03 2004-10-19 Canon Kabushiki Kaisha Optical apparatus
US7262799B2 (en) 2000-10-25 2007-08-28 Canon Kabushiki Kaisha Image sensing apparatus and its control method, control program, and storage medium
US20040012698A1 (en) 2001-03-05 2004-01-22 Yasuo Suda Image pickup model and image pickup device
US6635941B2 (en) 2001-03-21 2003-10-21 Canon Kabushiki Kaisha Structure of semiconductor device with improved reliability
JP4506083B2 (ja) * 2002-03-25 2010-07-21 コニカミノルタホールディングス株式会社 撮像レンズ，これを備える撮像装置、撮像ユニット及び撮像ユニットを備える携帯端末
JP4030048B2 (ja) * 2002-03-28 2008-01-09 シチズン電子株式会社 小型撮像モジュール
JP2004088713A (ja) * 2002-06-27 2004-03-18 Olympus Corp 撮像レンズユニットおよび撮像装置
JP2005198103A (ja) * 2004-01-08 2005-07-21 Inter Action Corp カメラモジュールの組立装置および組立方法
WO2005076069A1 (fr) * 2004-02-06 2005-08-18 Koninklijke Philips Electronics N.V. Dispositif camera, telephone mobile comprenant un dispositif camera, procede de fabrication d'un dispositif camera
KR100652375B1 (ko) 2004-06-29 2006-12-01 삼성전자주식회사 와이어 본딩 패키지를 포함하는 이미지 센서 모듈 구조물및 그 제조방법
US7511262B2 (en) * 2004-08-30 2009-03-31 Micron Technology, Inc. Optical device and assembly for use with imaging dies, and wafer-label imager assembly
JP2006080597A (ja) * 2004-09-07 2006-03-23 Canon Inc 撮像モジュール及び撮像モジュールの製造方法
JP2006081043A (ja) * 2004-09-13 2006-03-23 Seiko Precision Inc 固体撮像装置およびこれを備えた電子機器
JP2008035047A (ja) * 2006-07-27 2008-02-14 Matsushita Electric Ind Co Ltd カメラ部品およびカメラと、カメラ部品の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6541284B2 (en) * 2000-05-23 2003-04-01 Atmel Corporation Integrated IC chip package for electronic image sensor die
US20060044450A1 (en) * 2002-09-17 2006-03-02 Koninklijke Philips Electronics, N.C. Camera device, method of manufacturing a camera device, wafer scale package

Also Published As

Publication number Publication date
CN101512768A (zh) 2009-08-19
JP2013153537A (ja) 2013-08-08
KR101185881B1 (ko) 2012-09-25
JP2009544226A (ja) 2009-12-10
KR20090034981A (ko) 2009-04-08
WO2008011003A2 (fr) 2008-01-24
EP2044629A2 (fr) 2009-04-08
JP5372280B2 (ja) 2013-12-18
CN101512768B (zh) 2012-11-21
EP2044629A4 (fr) 2012-08-01
JP5292291B2 (ja) 2013-09-18

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