WO2008008270B1 - Wafer cassette - Google Patents

Wafer cassette

Info

Publication number
WO2008008270B1
WO2008008270B1 PCT/US2007/015523 US2007015523W WO2008008270B1 WO 2008008270 B1 WO2008008270 B1 WO 2008008270B1 US 2007015523 W US2007015523 W US 2007015523W WO 2008008270 B1 WO2008008270 B1 WO 2008008270B1
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
container
ramps
shelves
pair
Prior art date
Application number
PCT/US2007/015523
Other languages
French (fr)
Other versions
WO2008008270A3 (en
WO2008008270A2 (en
WO2008008270A9 (en
Inventor
Matthew A Fuller
John Burns
Original Assignee
Entegris Inc
Matthew A Fuller
John Burns
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc, Matthew A Fuller, John Burns filed Critical Entegris Inc
Priority to JP2009519465A priority Critical patent/JP2009543374A/en
Priority to US12/307,896 priority patent/US20090194456A1/en
Publication of WO2008008270A2 publication Critical patent/WO2008008270A2/en
Publication of WO2008008270A3 publication Critical patent/WO2008008270A3/en
Publication of WO2008008270B1 publication Critical patent/WO2008008270B1/en
Publication of WO2008008270A9 publication Critical patent/WO2008008270A9/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A front opening wafer container including an enclosure portion and a door. A wafer support system is provided including a pair of spaced apart cantilever wafer shelves, each wafer shelf including a pair of opposing inclined ramp portions. The ramp portions are cooperatively positioned and configured so that when the wafer is received on the shelves, the wafer is supported on the ramps at a lower peripheral corner of the wafer, all other portions of the wafer being free from contact with the wafer support system. Each wafer shelf may have a generally concave upper surface and the incline of the ramps is continuous with the concave upper surfaces of the wafer shelves.

Claims

AMENDED CLAIMS received by the International Bureau on 12 March 2008 (12.03.2008)
1. A wafer container comprising: at least one wafer; an enclosure portion including a top, a bottom, opposing sides, a back and an open front defined by a door frame; a door selectively receivable in the door frame to sealingly close the open front; and a wafer support system in the enclosure for receiving and supporting the wafer, the wafer support system including a pair of spaced apart cantilever wafer shelves, each wafer shelf including a pair of opposing inclined ramp portions, the ramp portions cooperatively positioned and configured so that when the wafer is received on the shelves, the wafer is supported on the ramps at a lower peripheral corner of the wafer, all other portions of the wafer being free from contact with the wafer support system.
2. The wafer container of claim 1, wherein the ramps are inclined at between one degree and nine degrees with respect to the horizontal.
3. The wafer container of claim 1, wherein the ramps are inclined at between three degree and seven degrees with respect to the horizontal.
4. The wafer container of claim 1, wherein the ramps are inclined at about five degrees with respect to the horizontal.
5. The wafer container of claim 1, wherein each wafer shelf has a generally concave upper surface.
6. The wafer container of claim 5, wherein the incline of the ramps is continuous with the concave upper surfaces of the wafer shelves.
7. The wafer container of claim 1, wherein the wafer support system comprises a pair of wafer support structures, and wherein each wafer support structure includes a column with one of the pair of wafer shelves extending therefrom.
8. The wafer container of claim 7, wherein each of the wafer support structures is secured in the enclosure portion with a plurality of fasteners.
9. The wafer container of claim 7, wherein the wafer support structures are integrally molded with the enclosure portion using an overmolding process.
10. The wafer container of claim 7, wherein the column and wafer shelves are integrally formed in one piece.
11. A wafer comprising: a plurality of wafers; an enclosure portion including a top, a bottom, opposing sides, a back and an open front defined by a door frame; a door selectively receivable in the door frame to sealingly close the open front; and a wafer support system in the enclosure for receiving and supporting the plurality of wafers in a horizontally oriented, spaced apart, axially aligned arrangement, the wafer support system including a pair of spaced apart opposing wafer support structures, each wafer support structure including a column with a plurality of spaced apart cantilever wafer shelves extending therefrom, each of the wafer shelves of a first one of the wafer support structures horizontally registered with one of the wafer shelves of the other wafer support structure to define a plurality of horizontally oriented slots, each for receiving one
15 of the plurality of wafers, each wafer shelf including a pair of opposing inclined ramp portions for contacting the wafer, the ramp portions cooperatively positioned and configured so that when the wafer is received in the slot, the wafer is supported on the ramps at a lower peripheral corner of the wafer, all other portions of the wafer being free from contact with the wafer support system.
12. The wafer container of claim 11, wherein the ramps are inclined at between one degree and nine degrees with respect to the horizontal.
13. The wafer container of claim 11, wherein the ramps are inclined at between three degree and seven degrees with respect to the horizontal.
14. The wafer container of claim 11, wherein the ramps are inclined at about five degrees with respect to the horizontal.
15. The wafer container of claim 11, wherein each wafer shelf has a generally concave upper surface.
16. The wafer container of claim 15, wherein the incline of the ramps is continuous with the concave upper surfaces of the wafer shelves.
16
17. A wafer container comprising: at least one wafer; an enclosure portion including a top, a bottom, opposing sides, a back and an open front defined by a door frame; a door selectively receivable in the door frame to sealingly close the open front; and means for supporting the wafer in the enclosure, said means supporting the wafer at a plurality of spaced apart locations along lower peripheral corner of the wafer, all other portions of the wafer being free from contact with the container.
18. The wafer container of claim 17, wherein said means for supporting the wafer in the enclosure includes a plurality of wafer support structures.
19. The wafer container of claim 18, wherein each wafer support structure includes a column with a plurality of spaced apart cantilever wafer shelves extending therefrom, each wafer shelf including a pair of opposing inclined ramp portions for contacting the wafer.
20. The wafer container of claim 19, wherein the ramps are inclined at about five degrees with respect to the horizontal.
17
PCT/US2007/015523 2006-07-07 2007-07-06 Wafer cassette WO2008008270A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009519465A JP2009543374A (en) 2006-07-07 2007-07-06 Wafer cassette
US12/307,896 US20090194456A1 (en) 2006-07-07 2007-07-06 Wafer cassette

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US81920806P 2006-07-07 2006-07-07
US60/819,208 2006-07-07

Publications (4)

Publication Number Publication Date
WO2008008270A2 WO2008008270A2 (en) 2008-01-17
WO2008008270A3 WO2008008270A3 (en) 2008-05-08
WO2008008270B1 true WO2008008270B1 (en) 2008-06-26
WO2008008270A9 WO2008008270A9 (en) 2008-08-14

Family

ID=38923798

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/015523 WO2008008270A2 (en) 2006-07-07 2007-07-06 Wafer cassette

Country Status (5)

Country Link
US (1) US20090194456A1 (en)
JP (1) JP2009543374A (en)
KR (1) KR20090056963A (en)
TW (1) TW200822268A (en)
WO (1) WO2008008270A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150023941A (en) 2008-01-13 2015-03-05 엔테그리스, 아이엔씨. Methods and apparatuses for large diameter wafer handling
JP2009259951A (en) * 2008-04-15 2009-11-05 Shin Etsu Polymer Co Ltd Substrate storing container
CN103765569A (en) 2011-05-03 2014-04-30 恩特格里公司 Wafer container with particle shield
JP5180403B1 (en) * 2012-10-02 2013-04-10 中外炉工業株式会社 Panel mounting rack
WO2015107674A1 (en) * 2014-01-17 2015-07-23 ミライアル株式会社 Substrate accommodating container
KR102162366B1 (en) * 2014-01-21 2020-10-06 우범제 Apparatus for removing fume
US9881820B2 (en) * 2015-10-22 2018-01-30 Lam Research Corporation Front opening ring pod
CN110797286A (en) * 2018-08-02 2020-02-14 奇景光电股份有限公司 Wafer rack
WO2020089986A1 (en) * 2018-10-29 2020-05-07 ミライアル株式会社 Method for molding substrate storage container, mold, and substrate storage container
TWI715896B (en) * 2018-12-12 2021-01-11 日月光半導體製造股份有限公司 Pod for transporting a carrier
NL2022185B1 (en) * 2018-12-12 2020-07-02 Suss Microtec Lithography Gmbh Substrate cassette

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04106953A (en) * 1990-08-27 1992-04-08 Dainippon Screen Mfg Co Ltd Wafer cassette
US5749469A (en) * 1992-05-15 1998-05-12 Fluoroware, Inc. Wafer carrier
JPH06204318A (en) * 1992-10-05 1994-07-22 Tokyo Electron Tohoku Ltd Wafer housing container and wafer array apparatus
DE69526126T2 (en) * 1995-10-13 2002-11-07 Empak Inc 300 MM CONTAINER WITH MICRO ENVIRONMENT AND SIDE DOOR AND GROUNDING LINE
US6776289B1 (en) * 1996-07-12 2004-08-17 Entegris, Inc. Wafer container with minimal contact
US5788082A (en) * 1996-07-12 1998-08-04 Fluoroware, Inc. Wafer carrier
JPH10144758A (en) * 1996-11-11 1998-05-29 Kokusai Electric Co Ltd Substrate transfer plate
US5791486A (en) * 1997-01-07 1998-08-11 Fluoroware, Inc. Integrated circuit tray with self aligning pocket
US6010008A (en) * 1997-07-11 2000-01-04 Fluoroware, Inc. Transport module
JP3938233B2 (en) * 1997-11-28 2007-06-27 信越ポリマー株式会社 Sealed container
JPH11233587A (en) * 1998-02-09 1999-08-27 Toshiba Ceramics Co Ltd Ic transferring fork
US6428729B1 (en) * 1998-05-28 2002-08-06 Entegris, Inc. Composite substrate carrier
US6216874B1 (en) * 1998-07-10 2001-04-17 Fluoroware, Inc. Wafer carrier having a low tolerance build-up
US6092981A (en) * 1999-03-11 2000-07-25 Applied Materials, Inc. Modular substrate cassette
JP2003077999A (en) * 2001-09-05 2003-03-14 Nitto Denko Corp Semiconductor wafer cassette
JP4159946B2 (en) * 2003-08-19 2008-10-01 信越ポリマー株式会社 Substrate storage container
US7100772B2 (en) * 2003-11-16 2006-09-05 Entegris, Inc. Wafer container with door actuated wafer restraint
JP4204047B2 (en) * 2003-11-27 2009-01-07 信越ポリマー株式会社 Storage container and manufacturing method thereof
WO2007008555A2 (en) * 2005-07-08 2007-01-18 Asyst Technologies, Inc. Workpiece support structures and apparatus for accessing same

Also Published As

Publication number Publication date
KR20090056963A (en) 2009-06-03
JP2009543374A (en) 2009-12-03
WO2008008270A3 (en) 2008-05-08
TW200822268A (en) 2008-05-16
US20090194456A1 (en) 2009-08-06
WO2008008270A2 (en) 2008-01-17
WO2008008270A9 (en) 2008-08-14

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