JPH06204318A - Wafer housing container and wafer array apparatus - Google Patents

Abstract

PURPOSE:To house a plurality of wafers in a perfectly horizontal state by a method wherein the retaining surface, where wafers are placed horizontally, is focused toward the center of a subaperture, the position of each wafer is regulated by the abutting surface which abuts on the edge of each wafer, and the wafers are placed on the same height of each retaining surface. CONSTITUTION:A container 10 is provided with a main aperture 12 where a wafer is inserted, and a sub-aperture 13, which is smaller than the main aperture 12, which are provided opposing with each other. A plurality of wafer holding slots 21 are formed in parallel on the inner surface of the container 10. Each filling material 23 is provided in a pair of grooves 21a of the holding slots 21. When the container 10 is placed on a horizontal surface with the container edge wall 14, which becomes the first reference surface, as the bottom, the wafer is positioned in a horizontal state perfectly. To be more precise, when the wafer is housed in a retaining slot 21 and the wafer edge WE is made to abut on the inner surface of the filling material, the wafer is placed on the part in the same height as the retaining surface 22. Accordingly, even when the attitude of the container is changed, the wafer can be housed completely.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a container for accommodating a plurality of wafers made of semiconductor, quartz, glass or the like at intervals, and an apparatus for aligning a plurality of wafers contained in the container.

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process,
Various heat treatments such as an oxidation treatment, a diffusion treatment, a CVD treatment, an annealing treatment, and an etching treatment of a semiconductor wafer are performed. In these processes, a storage container 2 as shown in FIG. 1 for storing a plurality of wafers at intervals is used in order to transfer the wafers to the vicinity of the processing apparatus.

The wafer storage container 2 has a main opening 3 for inserting the wafer W and a sub-opening 4 smaller than the main opening 3, and an orientation flat (hereinafter referred to as "orientation flat") of the wafer W through the sub-opening 4. A tool for aligning the OFs and counting the number of wafers W accesses the wafer W. After being aligned, the orientation flat OF of the wafer W may be left as it is on the side of the sub-opening 4 or may be moved to the side of the main opening 3.

As shown in FIG. 2, a large number of holding slots 5 for holding the wafer W are formed in parallel on the inner surface of the container 2. Each slot 5 comprises a pair of opposed grooves formed on the inner surface of both sides of the container 2. The shape of the groove is V-shaped in cross section, which gradually opens toward the inside of the container 2 in consideration of the ease of storing the wafer. Therefore, the container 2 is placed so that the wafer W is substantially horizontal.
, The wafer W is supported on the tapered holding surface 6 corresponding to one side of the V-shaped slot 5. Further, when the container 2 is placed so that the wafer W is in a substantially vertical state, the wafer W is abutted on both sides of the sub-opening 4 at its side portions or edges at the back of the V-shaped slot. Will be supported.

However, in the V-shaped slot container,
Even if the container is placed so that the wafer W is in a substantially horizontal state, the wafer W is not in a completely horizontal state and is tilted to some extent at various angles. More specifically, when the wafer W is inserted into the slot 5 as shown in FIG. 3, the wafer W is placed at a position corresponding to the line IVA-IVA in FIG. 3 whose cross section is shown in FIG.
Edge WE does not reach the inside of the groove. This is because at this position, a clearance C of about 1 to 2 mm is provided in order to smoothly insert and remove the wafer W. On the other hand, the edge WE of the wafer W reaches the back of the groove at the position corresponding to the line IVB-IVB in FIG. 3 whose cross section is shown in FIG. Therefore, the upper surface of the wafer W is at the level of L1 at the position corresponding to the line IVB-IVB, but is below the level of L1 at the position corresponding to the line IVA-IVA. That is, the wafer W is tilted slightly downward toward the main opening 3 side as shown in FIG. Here, in FIG. 5A, the aspect ratio is about 1
It is shown in an exaggerated state with a magnification of 0.

In FIG. 5A, the wall portion 5a (shown by parallel hatching) of the slot 5 of the container 2 is shown in a state of overlapping with the wafer W, but the width of the wafer W (in the figure). The width (in the direction perpendicular to the plane of the drawing) gradually becomes smaller toward the main opening 3 of the container 2, so in reality,
The wafer W and the wall portion 5a of the slot 5 do not interfere with each other.

[0007]

Therefore, when the wafer is held in such a tilted state, the arm 8 for carrying the wafer W (FIGS. 6A and 6B) is used. (See) is inserted between two wafers, the tip of the arm 8 may come into contact with the wafer and cause damage. Further, as shown in FIG. 5B, when the slot 5 is tilted to bring the wafer W closer to a completely horizontal state, the wafer comes into contact with the top surface of the slot 5 and is easily rubbed.

The front edge of each wafer W housed in the container 2 is aligned as shown in FIGS. 6 (A) and 6 (B) due to the dimensional accuracy in manufacturing the container 2. Rather than one, it fluctuates somewhat. This phenomenon occurs particularly when the container 2 is rotated so that the wafer W is changed from the substantially vertical state to the horizontal state. Such positional deviation of the wafer W causes a wafer placement error when the wafer W is transferred to a wafer boat or the like. The above phenomenon is caused by the 6 inch wafer.
With the increase in size to 8 inches, it has become a serious problem in wafer handling.

It is an object of the present invention to provide a wafer storage container capable of storing a plurality of wafers in a completely horizontal state. Another object of the present invention is to provide a wafer aligning device that aligns wafers in cooperation with a storage container so that front edges of a plurality of wafers are aligned.

[0010]

SUMMARY OF THE INVENTION A wafer storage container of the present invention is a wafer storage container for storing a plurality of substantially circular wafers, and has reference surfaces formed so as to face each other. First end wall and second end wall, first side wall and second side wall that are arranged to face each other and connect the first end wall and second end wall, and the first end wall and second end A first opening defined by a wall, a first side wall and a second side wall, which functions as an opening for inserting / removing a wafer into / from the container, the first end wall, the second end wall, and the first side wall And the second
A second opening that is defined by a side wall and that is arranged opposite to the first opening and that is dimensionally smaller than the first opening;
A plurality of slots for supporting the wafers one by one in the container at intervals, wherein the slots are
A cross section V formed on the inner surfaces of the first side wall and the second side wall and opening so as to gradually expand toward the inside of the container.
It comprises a pair of V-shaped grooves, and one surface defining each groove is
In a state where the container is arranged such that the reference plane is located on a horizontal plane, each wafer functions as a holding surface on which the wafer is placed in a substantially horizontal state, and the holding surface is the center of the second opening. And a contact surface for contacting the edge of each wafer housed in each slot is disposed on each convergence portion of each holding surface, and the contact surface determines the position of each wafer. It is characterized in that each wafer is regulated and placed on the same height portion of each holding surface.

Alternatively, in the wafer storage container of the present invention, instead of the above-mentioned abutting surface, the wafer storage container located on the first opening side and the second opening side with the center of gravity of each wafer stored in each slot being sandwiched therebetween. A lifting body having one portion and a second portion, which is in contact with the lower surface of each wafer housed in each slot and has an upper surface parallel to the reference surface, is provided on each holding surface. Is characterized by.

Alternatively, the wafer container of the present invention is
Instead of the contact surface, the angle formed by the holding surface with respect to a surface parallel to the reference surface is set to about 1 to 3 °, and the other surface of the groove facing the holding surface is It is characterized in that the angle formed is set to about 9 to 15 °.

The wafer aligning apparatus of the present invention is an apparatus for simultaneously aligning a plurality of substantially circular wafers housed in a container, wherein the containers are arranged to face each other.
A first end wall and a second end wall on which a reference surface is formed, and a first end wall arranged to face each other and connecting the first end wall and the second end wall.
First and second side walls defined by the first and second end walls and the first and second side walls, the first and second side walls functioning as openings for inserting and removing the wafer into and from the container.
An opening, and a second opening defined by the first end wall and the second end wall and the first side wall and the second side wall, the second opening being arranged to face the first opening and being dimensionally smaller than the first opening. And a frame body having a second reference surface formed on an end face, which is disposed with the second opening interposed therebetween, and a plurality of slots for supporting the wafers one by one in the container at intervals. The slot comprises a pair of grooves having a V-shaped cross section, which are formed on the inner surfaces of the first side wall and the second side wall and open to gradually expand toward the inside of the container. One surface that defines the above-mentioned surface functions as a holding surface on which each wafer is placed in a substantially horizontal state in a state where the container is arranged such that the first reference surface is located on a horizontal plane, and The holding surface has a converging portion that converges toward the center of the second opening. Then, the device is arranged at a right angle to the first plate, which is in contact with the second reference surface and places the container so that the second reference surface is located on a horizontal plane. The second plate facing the first reference surface and the first plate and the second plate are integrally rotated by 90 ° in a state where the container is placed on the first plate, and the container is opened. A posture changing means for changing the state of being placed on the first plate to a state of being placed on the second plate and having the first reference surface located on a horizontal plane; and inside the container from the second opening. And a side wall of the plurality of wafers contacting and abutting in a horizontal plane to simultaneously move the plurality of wafers to the first opening side.

[0014]

According to the wafer storage container of the present invention, since the contact surface for contacting the edge of each wafer accommodated in each slot is arranged on each converging portion of each holding surface, the contact surface concerned. Thus, the position of each wafer is regulated, and each wafer is placed on the same height portion of each holding surface.

According to another embodiment of the wafer storage container of the present invention, each wafer stored in each slot is supported by the raised body, and similarly each wafer is held parallel to the reference plane. It

According to another embodiment of the wafer storage container of the present invention, the angle formed by the holding surface of the slot with respect to the plane parallel to the reference surface is set to about 1 to 3 °, and Since the angle formed by the other surface of the facing groove is set to about 9 to 15 °, the wafer can be handled without any trouble.

According to the wafer aligning apparatus of the present invention, the edges of the wafers stored in the storage container can be aligned with a simple structure, and a suitable storage state can be obtained even when the attitude of the container is changed. Can be surely obtained.

[0018]

EXAMPLES Examples of the present invention will be described below. [Embodiment 1] FIG. 7 is a perspective view showing a container for storing a semiconductor wafer according to the present invention. The entire storage container 10 is integrally formed of, for example, a resin molded product such as PFE (tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer), PP (polypropylene), or SiC (silicon carbide). The container 10 includes a main opening 12 for inserting a wafer and a sub-opening 13 smaller than the main opening 12 so as to face each other.
Through which the wafer orientation flats are aligned and a tool for counting the number of wafers accesses the wafer. After being aligned, the orientation flat of the wafer W may be left as it is on the side of the sub-opening 13 or may be moved to the side of the main opening 12.

On the inner surface of the container 10, a large number of holding slots 21 for holding the wafer W are formed in parallel. An ordinary container is configured to store 25 wafers.
The side walls of the container 10 are defined by a number of fins 18,
Each slot 21 is formed between the fins 18. Fin 1
8, that is, both side walls of the container 10 are curved so as to converge from the main opening 12 toward the sub-opening 13. The fins 18 are connected to the body frame of the container 10 at several points including both ends. Each slot 21 has a pair of grooves 21a formed on both inner surfaces of the container 10 so as to extend from the main opening 12 to the sub opening 13.
It is equipped with. The pair of grooves 21 a has a symmetrical shape and faces the inner surface of the container 10.

Each groove 21a has a V-shaped cross-section that opens so as to gradually expand toward the inside of the container, as shown in FIG. 8, in consideration of ease of storing wafers. The angle of this V-shape is set to about 12-16 °. The groove 21a is shown in FIG.
As shown in (A), the fin 18 is formed over substantially the entire length so as to communicate with the groove 21b outside the container via the slit. The slot 21 can also be configured as shown in FIG. 9B in which the groove does not penetrate to the outside.

A projecting pattern 15 is formed on at least one end wall 14 of the container 10. Protruding pattern 15
Are used when handling the container 10. Further, the ridgeline of the projecting pattern 15 exists in one plane and constitutes a first reference plane. That is, the end wall 14 having the protruding pattern 15
When the container 10 is placed on the horizontal plane with the bottom as the bottom, the dividing line DL (see FIGS. 9A and 9B) of the groove 21a of the slot 21 is located on the horizontal plane.
Here, the two-part dividing line DL is about 12 to about V of the groove 21a.
It is a line that divides the 16 ° angle in half.

Legs 16 are arranged on both sides of the sub-opening 13. The legs 16 are also utilized in handling the container 10. The lower end surface or the ridgeline of the leg 16 exists in one plane and constitutes the second reference plane. That is, with the legs 16 down,
When the container 10 is placed on a horizontal surface, the groove 2 of the slot 21
The dividing line DL of 1a is located in the vertical plane.

FIG. 10 shows a container 1 according to the first embodiment of the present invention.
FIG. 7 is a cross-sectional plan view of one slot 21 of 0. Wafer W
When the container 10 is placed in a substantially horizontal state, the wafer W is supported on the holding surface 22 corresponding to one side of the V-shaped slot 21. At this time, in the plane, the holding surface 22 extends linearly on the main opening 12 side, extends on the sub opening 13 side in an arc shape, and has a downward tapered shape in a vertical cross section.

Adjacent to both sides of the sub-opening 13 of the container 10,
A filling body 23 is provided in each of the pair of grooves 21 a forming the slot 21. Filler 23 facing groove 21a
The inner surface of is positioned such that the wafer W is completely horizontal when the container 10 is placed on a horizontal plane with the container end wall 14 serving as the first reference surface as the bottom. More specifically, as shown in FIGS. 10 and 11, when the wafer W is accommodated in the holding slot 21 and its side or edge WE abuts the inner surface of the filling body 23, the wafer W is held on the holding surface. 22
It is designed to be placed on the same height part of. For example, the wafer W has the same height of the holding surface 22 at the positions corresponding to the XII A-XII A line and the XII B-XII B line of FIG. 11 whose cross sections are shown in FIGS. 12A and 12B, respectively. The upper surface of the wafer W is placed at a level of L2.

This effect of the container 10 of the present invention is illustrated in FIG.
This becomes clear when compared with the operation of the conventional container shown in FIGS. 4 (A) and 4 (B). That is, in the conventional container, since the edge WE of the wafer W reaches the back of the groove, the edge WE of the wafer W reaches the back of the groove at the position corresponding to the line IVB-IVB in FIG. Therefore, the upper surface of the wafer W is at the level of L1 at the position corresponding to the line IVB-IVB, which is the wafer W.
Cause the inclination of. On the other hand, in the present invention, the wafer W can be placed on the same high portion of the holding surface 22 by the simple configuration of providing the filling body 23 that functions as a wafer contact portion. That is, when the container 10 is placed on a horizontal surface with the container end wall 14 serving as the first reference surface as the bottom, the wafer W is also completely horizontal.

The position of the filling body 23 is not limited to the position adjacent to the sub-opening 13, and the filling body 23 is in the range of the portion where the holding surface 22 gradually opens toward the center of the sub-opening 13. It is sufficient if there is an inner surface of. In addition, in this embodiment, the side portion or the edge WE of the wafer is filled with the filler 2.
When contacting the inner surface of the wafer 3, the contour of the wafer W and the contour of the holding surface 22 are concentric on the side of the sub-opening 13. However, as shown in FIG. 13, the wafer W can be placed on the same height portion of the holding surface 22 without having to be concentric with each other.

In the second embodiment shown in FIG. 13, the side wall of the container 10 on the side of the sub-opening 13 is formed as a converging wall 24 which converges linearly, and the inner wall surface 24a of the converging wall 24 facing the groove 21a is Instead of the inner surface of the filling body 23, the side surface or the edge WE of the wafer W is abutted. The position of the inner wall surface 24a is selected so that the wafer W is completely horizontal when the container 10 is placed on a horizontal plane with the container end wall 14 serving as the first reference surface as the bottom. More specifically, the wafer W is housed in the holding slot 21 and its side or edge WE
When the wafer W contacts the inner wall surface 24 a, the wafer W is placed on the holding surface 22 at the same height.

For example, XIV A-XIV A line and XIV of FIG. 13 whose cross sections are shown in FIGS. 14A and 14B, respectively.
The wafer W is placed on the same height portion of the holding surface 22 at positions corresponding to the line B-XIV B, and the upper surface of the wafer W is at the level L2. Thus, even when the contour of the wafer W and the contour of the holding surface 22 are not concentric, the wafer W can be placed on the holding surface 22 at the same height.

FIG. 15 is a cross-sectional plan view showing one slot 21 according to the third embodiment of the present invention. In this embodiment, instead of the filling body 23 that comes into contact with the side portion of the wafer W or the edge WE, a raising body 26 is provided on the holding surface 22 of each groove 21a. The raised body 26 has a sub-opening 1
3 from the position adjacent to the wafer W, the center of gravity GC1 and GC2 of the wafer W in a state where the wafer W is in contact with the inner portion 25 of the side wall of the container 10.
Extends continuously toward the main opening 12 side. Where GC
1 is the center of gravity when the orientation flat is located on the main opening 12 side, and GC2 is the center of gravity when the orientation flat is located on the sub opening 13 side. Then, as shown in FIG. 17, the side surface 26e of the raised body 26 on the side of the main opening 12 is formed in a tapered shape so that the wafer W can be easily inserted.

The raised body 26 has a flat upper surface and is formed parallel to the first reference surface of the container end wall 14. Therefore, when the container 10 is placed on a horizontal surface with the container end wall 14 as the bottom, the wafer W on the raising body 26 is completely horizontal. More specifically, when the wafer W is housed in the holding slot 21 and placed on the raising body 26, for example, XVI of FIG. 15 whose cross section is shown in FIGS. 16A and 16B, respectively. A-XVI A line and XVI B-XV
The upper surface of the wafer W placed on the raised body 26 is at the level of L1 at the positions corresponding to the IB lines.

As shown in FIG. 17B, the raised body can be composed of two portions 26a and 26b arranged so as to sandwich at least the center of gravity GC2 of the wafer W therebetween. Side surfaces 26a of the portions 26a and 26b on the side of the main opening 12
Both e and 26be are formed in a tapered shape so that the wafer W can be easily inserted. As shown in FIG. 17 (A), in the structure in which the raising body 26 is integrally formed, the wafer is easily affected by the unevenness of the upper surface of the raising body 26, and thus the upper surface is smoothed with high accuracy. It is required to be a face. However, in the structure shown in FIG. 17B, since the adverse effect due to the unevenness of the upper surfaces of the raised body portions 26a and 26b is small, the smoothness is low and the manufacturing is easy.

FIG. 18 is a cross-sectional plan view showing the groove 27 of the slot according to the fourth embodiment of the present invention. In this embodiment, the entire structure is the same as that shown in FIG. 7, except that the direction of the V-shaped groove 27 is slightly different. Therefore, only the differences will be described below.

In the fourth embodiment, the wafer W is placed on the horizontal plane HP or the first reference plane when the container 10 is placed on the horizontal plane with the container end wall 14 serving as the first reference plane as the bottom. The angle θ1 formed by the holding surface 28a is set to about 1 to 3 °, and the angle θ2 formed on the top surface 28b is set to about 9 to 15 °. As a whole, the V-shaped angle of the groove 27 is set to about 12 to 16 ° as in the first to third embodiments.

According to the fourth embodiment, when the container 10 is placed on a horizontal plane with the container end wall 14 serving as the first reference plane as the bottom, the container 10 is placed on the horizontal plane as shown in FIGS. 3, 4A and 4B. ), As in the conventional structure shown in FIG.
Is not placed on the same height portion of the holding surface of the slot and is in a tilted state. However, since the angle θ1 formed by the holding surface 28a is set small, the inclination of the wafer W from the horizontal becomes extremely small, and the wafer W can be handled with almost no trouble. When the size of the angle θ1 is about 1 ° or less, it becomes difficult to insert the wafer W due to the friction between the wafer W and the holding surface. The size of angle θ1 is about 3 °
In the above, the handling of the wafer W causes the problems described in the related art.

FIG. 19 is a schematic view of a semiconductor wafer heat treatment system incorporating a wafer alignment apparatus according to the present invention. The alignment device of the present invention can handle either the storage container 10 according to the present invention described with reference to FIGS. 7 to 18 or the conventional storage container 2 shown in FIG.

An inlet / outlet port 31 for loading and unloading the containers 2 and 10 is formed on one side of the casing 30 of the heat treatment system. The doorway 31 is automatically opened and closed by an automatic door 61. A reaction tube 32 is arranged in the upper back part of the casing 30. The reaction tube 32 is a cover 62 having a built-in heater.
Covered by. An elevator 64 is disposed below the reaction tube 32, and the boat 64 for loading the wafers W is loaded and unloaded on the reaction tube 32 by the elevator 64.

An attitude changing section 40 is arranged in the casing 30 adjacent to the entrance 31. As shown in FIG.
The attitude conversion unit 40 includes containers 2, 10 (hereinafter, container 2
Will be described as an example. ) Is mounted on the table 72. A side wall 74 is arranged on the side of the table 72 at a right angle to the table 72, and a pair of convex guides 76 is arranged on the table 72. The container 2 is positioned by the side wall 74 and the guide 76. Table 72
An aligning device 80 according to the present invention, which will be described later, is disposed underneath.

The container 2 is carried in through the doorway 31, and first,
It is placed on the table 72 of the posture changing unit 40. At this time, the plurality of wafers W stored in the container 2 are substantially in a vertical state. Next, as shown in FIG.
Is rotated 90 ° downward about the shaft 73, and the container 2 is placed on the side wall 74. That is, the container 2 includes the posture conversion unit 4
When 0, the posture is changed by almost 90 °, and the wafer W becomes substantially horizontal.

Next, in this state, the container 2 is transferred to the elevator 43 by the transferer 41. The container 2 is further transferred to the upper stage 44 by the elevator 43. A filter unit 51 is arranged adjacent to the upper stage 44. On the upper stage 44, the wafer W is arranged parallel to the flux of the cleaning air passing through the filter unit 51, and the cleaning air removes particles on the surface of the wafer W.

After that, the storage container 2 is moved by the elevator 43.
Are lowered and transferred to the lower stage 42. Container 2
Is placed on the lower stage 42, the wafer W in the container 2 is transferred to the wafer boat 63 by the arm 48 of the transferer 45. As shown in FIG. 20, the transferer 45 includes a base portion 47 mounted on a support rod 46 so as to be vertically movable and rotatable, and a slider 49 movably arranged on the base portion 47. The arm 48 is supported by a slider 49 so as to be vertically movable.

As shown in FIG. 20, when the wafer W is transferred, the arm 48 is inserted into the gap between the two wafers W. Next, the arm 48 is slightly raised to support the wafer W by lifting it. Next, in this state, the arm 4
8 is withdrawn and the base 47 is rotated. Then, the arm 48 advances with the arm 48 facing the boat 63, and the wafer W is transferred to the boat 63. On this occasion,
In order to smoothly insert the arm 48 between the wafers W, it is desirable that the wafer W is not in the uneven state as shown in FIGS. 6 (A) and 6 (B).

As shown in FIG. 21 and FIG. 22, the aligner 80 arranges all the wafers W accommodated in the container 2 into the sub-openings 4.
A pair of pushers 82 extending in parallel are provided for simultaneously pushing through. The tip end surface 83 of the pusher 82 is formed in a tapered shape, and is set so as to contact the side portion of the wafer W on one horizontal surface when the table 72 is horizontal. The pusher 82 is reciprocally driven by a driving unit 84 incorporated in the aligning device 80, and is driven toward and away from the wafer W. A central opening 86 is formed in the alignment device 80, and the wafer counter 90 accesses the wafer W. That is, the pusher 82 and its drive unit 84 are arranged so as not to interfere with the operation of the wafer counter 90.

The wafer counter 90 is provided with a pair of rollers 92 for rotating the wafer W and aligning these orientation flats OF. When the orientation flat OF of the wafer W is aligned and then left as it is on the sub-opening 4 side,
It may be moved to the main opening 3 side. Wafer counter 9
The number 0 also includes between the rollers 92 a number of optical sensors 94 corresponding to the maximum number of wafers W that can be stored in the container 2, and the number of wafers W is optically detected. As shown in FIG. 19, the wafer counter 90 is driven toward and away from the table 72 of the posture changing unit 40 by the elevator 96.

The container 2 is loaded from the entrance / exit 31 and the container 2 is placed on the table 7 so that the wafer W is substantially vertical.
When placed on top of the container 2, first, the wafer counter 90 is driven by the elevator 96 and passes through the central opening 86 of the aligner 80, as shown in FIG.
Enter inside. Then, the roller 92 is used for the orientation flat OF.
Are aligned, and the number of wafers W is detected by the optical sensor 94. After detecting the number of wafers, the wafer counter 90
Escapes from the central opening 86 of the aligning device 80 and retracts downward. Next, the pushers 82 of the aligning device 80 extend and push the wafer W upward by their tip surfaces 83. In this state, that is, in the state where the front end surface 83 of the pusher 82 is in contact with the wafer W, the table 72 is moved to 90 ° as described above.
Rotated downward, the container 2 is placed on the side wall 74.

In the state where the container 2 is placed on the table 72 so that the plurality of wafers W are substantially vertical, the wafer W is brought into contact with and supported by the side wall portion adjacent to the sub-opening 4. To be done. At this time, the contact position between the wafer W and the container 2 is vertically displaced from one horizontal plane due to the dimensional accuracy when the container 2 is formed. For this reason, the side portions or edges of the wafer W on the side of the main opening 3 are in an irregular state.

If the container 2 is rotated 90 ° in this state to bring the wafer W into a substantially horizontal state, the side portion or the edge of the wafer W on the main opening 3 side is shown in FIGS. 6A and 6A.
The state shown in FIG. However, in the present invention, the pusher 82 separates the wafer W from the inner surface of the side wall of the container 2,
With the front edges of them aligned, the container 2 is rotated 90 °.
Since the wafer W is rotated, the side portion or the edge of the wafer W, which is in a substantially horizontal state, on the side of the main opening 3 is in a neat state.

The pusher 82 can also be replaced by a fixed protrusion that is not reciprocatingly driven. Because,
The purpose of the pusher 82 is to separate the wafer W from the inner surface of the side wall of the container 2 and align their front edges. The point is to push out and align the substantially vertical wafer W in the container 2 by the pusher or the convex portion on the table 72, and then rotate the container 2 by 90 ° so that the wafer W is substantially horizontal. It is in.

The pusher 82 or the fixed convex portion used instead thereof can be made of, for example, silicon carbide (SiC), quartz glass (SiO ₂ ), Teflon, polypropylene or the like. The push-out amount of the wafer W by the pusher 82 or the fixed convex portion is, for example, in the case of the container 2 for accommodating an 8-inch wafer, considering the variation in the dimensional accuracy of the holding surface 6 of the slot 5, the minimum is about 2 mm. The maximum is about 5 mm.

23 and 24 show a modification of the wafer alignment device. Alignment device 10 shown in FIG.
2 is a container 2 so that the wafer W is substantially horizontal.
Is used after 90 ° posture conversion. The aligning device 102 is provided so as to be movable back and forth by a driving unit 104.
A pair of pushers 106 is provided. The tip surface 107 of the pusher 106 is formed similarly to the tip surface 83 of the pusher 82. All the wafers W are extruded and separated from the side wall of the container 2 on the side of the sub-opening 4 by a range of 2 to 5 mm by the pusher 106. Therefore, as shown in FIG.
The side portion or the edge portion on the main opening 3 side is aligned.

The alignment device 112 shown in FIG.
The container 2 is set at 90 so that the wafer W becomes substantially horizontal.
° Used after posture conversion. Aligning device 11
2 includes a pair of pushers 116 rotatably provided by a driving unit 114. 2-5 mm from the side wall of the container 2 on the side of the sub-opening 4 by the pusher 116
Extruded and separated in a certain range. Therefore, as shown in FIG. 23B, the side portion or the edge portion of the wafer W on the main opening 3 side is aligned.

The wafer container of the present invention is not limited to semiconductor wafers, but can be applied to quartz or glass wafers for LCDs. Further, the wafer alignment apparatus of the present invention includes a wafer manufacturing system, an inspection system, an oxidation treatment,
It can be applied to various heat treatment systems such as diffusion treatment, CVD treatment, annealing treatment, and etching treatment.

[0052]

As described above, according to the wafer storage container of the present invention, the position of each wafer is regulated by the abutment surface or the raising member arranged in the slot so that each wafer has the same height. Since the angle between the holding surface of the slot or the other surface of the groove facing the slot is set within a specific range, the wafer can be handled without any trouble.

According to the wafer aligning apparatus of the present invention, the edges of the wafers stored in the storage container can be aligned with a simple structure, and a suitable storage state can be obtained even when the attitude of the container is changed. Can be surely obtained.

[Brief description of drawings]

FIG. 1 is a perspective view showing a conventional wafer storage container.

FIG. 2 is a partial perspective view showing an inner surface of a side wall of the container shown in FIG.

FIG. 3 is a plan view showing a state in which a wafer is stored in the container shown in FIG.

4 (A) and (B) are respectively IVA-IVA of FIG.
FIG. 4 is a cross-sectional view taken along line IVB-IVB.

5A and 5B are vertical cross-sectional side views showing a state in which a wafer is stored in the container shown in FIG.

6 (A) and 6 (B) are diagrams showing a mode of loading / unloading a wafer into / from the container shown in FIG.

FIG. 7 is a perspective view showing a wafer storage container according to the present invention.

8 is a partial perspective view showing an inner surface of a side wall of the container shown in FIG.

9A is a sectional view showing details of a side wall of the container shown in FIG. 7, and FIG. 9B is a sectional view showing details of a modified example of the side wall of the container shown in FIG. 7.

FIG. 10 is a cross-sectional plan view showing the slot of the container according to the first embodiment of the present invention.

FIG. 11 is a plan view showing a state where wafers are stored in the container according to the first embodiment.

12 (A) and (B) are XII A of FIG. 11, respectively.
It is sectional drawing which follows the -XII A line and the XII B-XII B line.

FIG. 13 is a plan view showing a state in which wafers are stored in the container according to the second embodiment of the present invention.

14 (A) and (B) are XIV A of FIG. 13, respectively.
It is sectional drawing which follows the -XIV A line and the XIV B-XIV B line.

FIG. 15 is a plan view showing a state in which wafers are stored in a container according to the third embodiment of the present invention.

16 (A) and (B) are XVI A of FIG. 15, respectively.
It is sectional drawing which follows the -XVI A line and the XVI B-XVI B line.

17 (A) is a cross-sectional view showing a raised body arranged in the groove of the container shown in FIG. 15, and FIG. 17 (B) is a cross-sectional view showing a modified example of the raised body.

FIG. 18 is a partially enlarged cross-sectional view showing the groove of the container according to the fourth embodiment of the present invention.

FIG. 19 is a schematic diagram showing the configuration of a heat treatment system incorporating a wafer alignment device according to the present invention.

FIG. 20 is a diagram showing a transfer mode of wafers by the transfer arm of the system of FIG. 19;

FIG. 21 is a perspective view showing a posture conversion unit of the system of FIG.

22 is a cross-sectional view showing a wafer alignment device and a counter of the system of FIG.

23 (A) and (B) are views showing modified examples of the wafer alignment device of the present invention.

FIG. 24 is a diagram showing another modification of the wafer alignment device of the present invention.

[Explanation of symbols]

2 Storage Container W Wafer 3 Main Opening 4 Sub Opening OF Orientation Flat 5 Slot 6 Holding Surface WE Edge C Clearance 8 Arm 10 Container 12 Main Opening 13 Sub Opening 14 End Wall 15 Projection Pattern 16 Leg 18 Fin 21 Slot 21a Groove 21b Groove 22 Holding Surface 23 Filling Body 24 Converging Wall 24a Wall Inner Surface 25 Back Part 26 Raised Body 26a, 26b Portion of Raised Body GC1, GC2
Center of gravity 26e Side surface of raised body 27 Groove HP Horizontal surface 28a Holding surface 28b Top surface 30 Casing 31 Entrance / exit 32 Reaction tube 40 Posture changer 41 Transfer 42 Lower stage 43 Elevator 44 Upper stage 45 Transfer 46 Support rod 47 Base 48 Arm 49 Slider 51 Filter unit 61 Auto door 62 Cover 63 Boat 64 Elevator 72 Table 74 Side wall 76 Convex guide 80 Alignment device 82 Pusher 83 Tip surface 84 Drive part 86 Central opening 90 Wafer counter 92 Roller 94 Optical sensor 96 Elevator 102 Alignment device 104 Drive part 106 Pusher 107 Tip surface 112 Alignment device 114 Drive unit 116 Pusher

Claims (4)

[Claims] 1. A wafer storage container for storing a plurality of substantially circular wafers, the first end wall and the second end wall having a reference surface and facing each other. A first side wall and a second side wall that are arranged to face each other and connect the first end wall and the second end wall, and are defined by the first end wall and the second end wall and the first side wall and the second side wall. A first opening that functions as an opening for inserting and removing the wafer into and from the container; and the first opening defined by the first end wall, the second end wall, and the first side wall and the second side wall. A second opening that is arranged to face each other and is smaller in dimension than the first opening, and a plurality of slots that support the wafers one by one in the container at intervals, The slot is formed on the inner surfaces of the first side wall and the second side wall and is inside the container. A pair of grooves having a V-shaped cross-section that open so as to gradually expand toward each other. One surface defining each groove is in a state in which the container is arranged such that the reference surface is located on a horizontal plane. , Each wafer accommodated in each slot functions as a holding surface on which each wafer is placed in a substantially horizontal state, and the holding surface has a converging portion that converges toward the center of the second opening. Abutting surfaces that come into contact with the edges of the holding surfaces are arranged on the respective converging portions of the respective holding surfaces, the abutting surfaces regulate the position of the respective wafers, and the respective wafers are placed on the same height portion of the respective holding surfaces. A wafer storage container characterized in that. 2. A wafer container for accommodating a plurality of substantially circular wafers, the first end wall and the second end wall having a reference surface formed opposite to each other. A first side wall and a second side wall that are arranged to face each other and connect the first end wall and the second end wall, and are defined by the first end wall and the second end wall and the first side wall and the second side wall. A first opening that functions as an opening for inserting and removing the wafer into and from the container; and the first opening defined by the first end wall, the second end wall, and the first side wall and the second side wall. A second opening that is arranged to face each other and is smaller in dimension than the first opening, and a plurality of slots that support the wafers one by one in the container at intervals, The slot is formed on the inner surfaces of the first side wall and the second side wall and is inside the container. A pair of grooves having a V-shaped cross-section that open so as to gradually expand toward each other. One surface defining each groove is in a state in which the container is arranged such that the reference surface is located on a horizontal plane. , Each wafer accommodated in each slot functions as a holding surface on which each wafer is placed in a substantially horizontal state, and the holding surface has a converging portion that converges toward the center of the second opening. With a first portion and a second portion located on the first opening side and the second opening side with respect to the center of gravity of the wafer, contacting the lower surface of each wafer housed in each slot, and parallel to the reference plane. A container for storing wafers, wherein a raised body having a transparent upper surface is provided on each holding surface. 3. A wafer storage container for storing a plurality of substantially circular wafers, the first end wall and the second end wall having a reference surface formed opposite to each other. A first side wall and a second side wall that are arranged to face each other and connect the first end wall and the second end wall, and are defined by the first end wall and the second end wall and the first side wall and the second side wall. A first opening that functions as an opening for inserting and removing the wafer into and from the container; and the first opening defined by the first end wall, the second end wall, and the first side wall and the second side wall. A second opening that is arranged to face each other and is smaller in dimension than the first opening, and a plurality of slots that support the wafers one by one in the container at intervals, The slot is formed on the inner surfaces of the first side wall and the second side wall and is inside the container. A pair of grooves having a V-shaped cross-section that open so as to gradually expand toward each other. One surface defining each groove is in a state in which the container is arranged such that the reference surface is located on a horizontal plane. , Each wafer functions as a holding surface on which the wafer is placed in a substantially horizontal state, and the holding surface has a converging portion that converges toward the center of the second opening, and is formed in a plane parallel to the reference plane. On the other hand, the angle formed by the holding surface is set to about 1 to 3 °, and the angle formed by the other surface of the groove facing the holding surface is set to about 9 to 15 °. Wafer storage container. 4. An apparatus for simultaneously aligning a plurality of substantially circular wafers housed in a container, wherein the container has first end walls arranged opposite to each other and having a first reference surface formed therein. And a second end wall, a first side wall and a second side wall that are arranged to face each other and connect the first end wall and the second end wall, the first end wall and the second end wall, and the first side wall, A first opening defined by the second side wall, which functions as an opening for inserting and removing the wafer into and from the container, and a first side wall and a second side wall, and a first side wall and a second side wall. A second opening that is arranged to face the first opening and is smaller in dimension than the first opening; and a second reference surface is formed on the end surface that is arranged so as to sandwich the second opening. Frame and a plurality of slots for supporting the wafers one by one in the container at intervals. And the slot includes a pair of grooves having a V-shaped cross section, which are formed on inner surfaces of the first side wall and the second side wall and open so as to gradually expand toward the inside of the container, One surface defining each groove functions as a holding surface on which each wafer is placed in a substantially horizontal state when the container is arranged such that the first reference surface is located on a horizontal plane. And the holding surface includes a converging portion that converges toward the center of the second opening, and the device contacts the second reference surface, and the second reference surface is positioned on a horizontal plane. A first plate on which the container is placed, and a second plate which is arranged at a right angle to the first plate and faces the first reference surface in a state where the container is placed on the first plate , The first plate and the second plate are integrally rotated by 90 °, and the container is Posture changing means for changing the state of being placed on the plate to the state of being placed on the second plate and having the first reference surface on a horizontal plane; and entering the container through the second opening. A wafer aligning device that contacts and abuts a side portion of the plurality of wafers in a horizontal plane, and simultaneously moves the plurality of wafers to the first opening side.