WO2008008270A9 - Wafer cassette - Google Patents
Wafer cassetteInfo
- Publication number
- WO2008008270A9 WO2008008270A9 PCT/US2007/015523 US2007015523W WO2008008270A9 WO 2008008270 A9 WO2008008270 A9 WO 2008008270A9 US 2007015523 W US2007015523 W US 2007015523W WO 2008008270 A9 WO2008008270 A9 WO 2008008270A9
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wafer
- container
- ramps
- shelves
- wafer support
- Prior art date
Links
- 230000002093 peripheral effect Effects 0.000 claims abstract description 11
- 235000012431 wafers Nutrition 0.000 claims description 226
- 238000000034 method Methods 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
Definitions
- This invention relates to wafer containers and, in particular, to systems for supporting wafers in wafer containers.
- wafers Semiconductor and magnetic components used in electronic devices are typically manufactured from "wafers," meaning silicon wafers, magnetic substrates or the like. In the processing of these wafers into finished devices, numerous steps must be performed and the wafers must often be transported facility to facility and internally within a facility. The wafers are generally very sensitive to physical and electrical shock. Additionally, the wafers may be quite valuable, particularly after processing steps have been completed.
- FOUPs front opening unified pod
- FOSBs front opening shipping boxes
- These containers have a container portion with interior wafer supports for holding a stack of wafers in a horizontal axially spaced arrangement in the interior of the container.
- the container has a front door that allows insertion and removal of the wafers and a door sealingly engages onto the wafer container and may be latched in place.
- Such boxes are, for example, disclosed in U.S. Patent Nos. 6,216,874; 6,206,196; 6,010,008; 5,944,194, all of which are owned by the owner of this application and are hereby fully incorporated herein by reference.
- FIG. 1 A generic prior art front opening carrier is depicted in Figure 1.
- the wafer container is shown seated on automatic processing equipment 25, and generally includes enclosure portion 20 and door 22.
- Enclosure portion 20 has open front 24, top 23, a pair of sides 28, 29, back side 32, and bottom 34.
- Door frame 36 defines open front 24 and is configured for receiving door 22.
- Enclosure portion 20 may have robotic handling flange 42.
- Wafer supports 46 in the interior of enclosure portion 20 support wafers (not shown) that are aligned in a horizontal orientation in a stacked space array.
- Door 22 has outwardly facing side 50, inwardly facing side 52 and periphery 54.
- Periphery 54 has latch slots 58 on the outwardly facing side.
- Exterior panel 62 which may be the principal structural panel of the door, covers latch mechanisms (not shown) associated with keyholes 68 and that have latch members (not shown), which extend out of the latch slots 58.
- wafers may shift in response to physical shocks to the container.
- the shifting of the wafers upon the wafer supports may cause particles to be abraded from the wafer or the supports upon which the wafer rests. Such particles, even if they are very tiny, may cause defects to occur in photolithography and other processing steps.
- the present invention substantially meets the aforementioned need of the industry by providing containers, wafer support systems, and methods that further limit particulate contamination within wafer containers and reduce gravitational sag of larger diameter wafers.
- Embodiments of the invention further provide wafer support surfaces having sloped wafer support regions providing supporting zones of contact only at the lower peripheral corner of the wafer, reducing contact between the supported wafer and wafer support and thereby minimizing damage and contamination to the wafer.
- the wafer supports may be formed separately or integrally with the wafer container. If formed separately, the wafer supports may be snapped into pre-formed structure in the wafer container and/or may be secured therein by connectors. If formed separately from the container, the wafer supports of this invention may be formed integrally by such processes as injection molding or components thereof may be formed separately. If formed separately, the components are assembled and may be secured in assembled form by connectors. If formed integrally with the container, the wafer supports may be formed by such known processes as overmolding.
- a wafer container includes an enclosure portion with a top, a bottom, opposing sides, a back and an open front defined by a door frame.
- a door is selectively receivable in the door frame to sealingly close the open front.
- a wafer support system is provided in the enclosure for receiving and supporting at least one wafer, the wafer support system including a pair of spaced apart cantilever wafer shelves, each wafer shelf including a pair of opposing inclined ramp portions.
- the ramp portions are cooperatively positioned and configured so that when the wafer is received on the shelves, the wafer is supported on the ramps at a lower peripheral corner of the wafer, all other portions of the wafer being free from contact with the wafer support system.
- the ramps may inclined at between one degree and nine degrees, between three degree and seven degrees, or about five degrees with respect to the horizontal.
- Each wafer shelf may have a generally concave upper surface, and in some embodiments, the incline of the ramps is continuous with the concave upper surfaces of the wafer shelves.
- the wafer support system includes a pair of wafer support structures, wherein each wafer support structure includes a column with one of the pair of wafer shelves extending therefrom.
- the wafer support structures may be secured in the enclosure portion with a plurality of fasteners, or may be integrally molded with the enclosure portion using an overmolding process.
- the column and wafer shelves may be integrally formed in one piece or may be molded as separate pieces and later assembled.
- a wafer container for supporting a plurality of wafers in a horizontally oriented, spaced apart, axially aligned arrangement includes an enclosure portion having a top, a bottom, opposing sides, a back and an open front defined by a door frame.
- a door is selectively receivable in the door frame to sealingly close the open front.
- a wafer support system is provided in the enclosure for receiving and supporting the wafers, the wafer support system including a pair of spaced apart opposing wafer support structures, each wafer support structure including a column with a plurality of spaced apart cantilever wafer shelves extending therefrom.
- Each of the wafer shelves of a first one of the wafer support structures is horizontally registered with one of the wafer shelves of the other wafer support structure to define a plurality of horizontally oriented slots, each for receiving one of the plurality of wafers.
- Each wafer shelf includes a pair of opposing inclined ramp portions for contacting the wafer, the ramp portions cooperatively positioned and configured so that when the wafer is received in the slot, the wafer is supported on the ramps at a lower peripheral comer of the wafer, all other portions of the wafer being free from contact with the wafer support system.
- a wafer container includes an enclosure portion having a top, a bottom, opposing sides, a back and an open front defined by a door frame.
- a door is selectively receivable in the door frame to sealingly close the open front.
- the container further includes means for supporting at least one wafer in the enclosure, wherein the means supports the wafer at a plurality of spaced apart locations along lower peripheral corner of the wafer, all other portions of the wafer being free from contact with the container.
- Figure 1 is a perspective view of a prior art wafer container positioned on processing equipment
- Figure 2 is a perspective view of a wafer container according to an embodiment of the present invention.
- Figure 3 is a front elevation view of a wafer container according to an embodiment of the present invention.
- Figure 3a is a sectional side view of the wafer container and wafer support system of Figure 3 taken at section 3A-3A of Figure 3;
- Figure 4 is a perspective view of a wafer support member according to an embodiment of the invention.
- Figure 5 is a perspective view of another embodiment of the wafer container of the invention formed by overmolding
- Figure 6 is a perspective view of another embodiment of the wafer container of the invention wherein the wafer support members are assembled from separately formed parts;
- Figure 7 is a perspective view of the wafer supports of the embodiment of Figure 6;
- Figure 8 is a fragmentary perspective view of a portion of the wafer supports of Figure 7;
- Figure 9 is a fragmentary perspective view of a wafer support ramp according to an embodiment of the present invention.
- Figure 10 is a cross-sectional view of the wafer support ramp of Figure 9 taken at section 10-10 of Figure 9; and Figure 11 is a fragmentary cross-sectional view of a wafer support ramp according to an embodiment of the invention, wherein the ramp is continuous with a concave upper surface of the wafer support member.
- Wafer container 70 according to embodiments of the present invention is depicted in Figures 2-10.
- Wafer container 70 generally includes enclosure 72 and door 74.
- Enclosure 72 generally includes unitary shell 76 having top wall 78, opposing bottom wall
- door frame 90 80, side walls 82, 84, back wall 86 and open front 88, which is defined by door frame 90.
- Kinematic coupling 92 may be received on bottom wall 80 for positioning container 70 on processing equipment (not shown), while robotic handling flange 94 may be received on top wall 78 to enable automated handling of container 70.
- Door 74 is receivable in door frame 90 to sealingly close container 70, and generally includes outer wall 96 and inner wall 98 defining an enclosed space for latch mechanisms (not shown) for latching door 74 in place.
- the latch mechanisms are operable through keyholes 100 defined in outer wall 96.
- Wafer support system 102 is provided in enclosure 72 for receiving a plurality of wafers 104 in a horizontal, spaced apart, axial Iy aligned arrangement.
- Wafer support system 102 generally includes a pair of wafer supports 106 positioned proximate, but spaced apart from, each of side walls 82, 84.
- wafer support 106 generally includes rear column 108 having integral attachment beams 110, 112, with cantilever shelves 1 14 spaced apart therebetween.
- Each cantilever shelf 114 and lower attachment beam 112 defines a pair of opposing wafer support ramps 1 16, 1 18.
- upper surface 120 of cantilever shelves 114 and lower attachment beam 1 12 is slightly concave, sloping upwardly in each direction from low point 122 toward ramps 116, 118.
- the cantilever shelves 114 of the pair of wafer supports 106 are horizontally registered so as to define a plurality of horizontal slots 123, each for receiving a wafer 104. It will be appreciated that enclosure 72 and wafer supports 106 may be configured to provide any desired number of slots 123, from one up to thirty or more.
- ramps 116, 118 are inclined at about five degrees from horizontal. Other angles of incline for ramps 116, 118, however, may be suitable for other embodiments and are within the scope of the present invention. For instance, in some embodiments, ramps 116, 118, may be inclined at between about three degrees and seven degrees from the horizontal, and in others between about one degree and nine degrees from the horizontal.
- Attachment beams 110, 112 may include bosses 126, 128, 130, for securing wafer support 106 in enclosure 72.
- each boss 126, 128, 130 defines a bore
- the fasteners may be electrically conductive and may extend into or through kinematic coupling 92 from bosses
- kinematic coupling 92 may be partially or wholly made from electrically conductive or static dissipative material so as to provide an electrical path to ground.
- each wafer 104 rests on ramps 1 16, 118, as depicted in Figures 9 and 10, such that each wafer 104 is supported only at four minimal zones 138 of contact, essentially a line defined by lower peripheral corner 124 of wafer 104.
- This mode of support minimizes contact between wafers 104 being stored in container 70 and the wafer support system 102. Minimizing contact eliminates or greatly minimizes wafer damage and particulate contamination that would otherwise occur due to more extensive contact.
- the wafer support 106 may be formed by several methods known to persons of skill in the art.
- wafer support may be formed from polymer material by injection molding, overmolding, or the like. Suitable materials are any materials with suitable abrasion resistance and chemical properties.
- PEEK or PEI polymers may be used, and may be combined with other materials such as carbon fiber to enable electrically conductive or static dissipative properties in wafer support 106.
- wafer support members 106 may be integrally formed with enclosure 72 by overmolding as depicted in Figure 5.
- electrical conductivity for grounding of wafer supports 106 through kinematic coupling 92 may be accomplished by a portion of wafer support 106 extending through bottom wall 80 of enclosure 72 or through conductive fasteners as disclosed above.
- wafer support 106 may be formed in separate parts as depicted in Figures 6-8.
- wafer support 106 generally includes column 140 defining spaced apart notches 142 and separate cantilever shelves 144.
- Each cantilever shelf 144 defines a tab structure 146 that is received in one of notches 142 to attach the cantilever shelf 144 to the column 140.
- Each column 140 in turn defines bores 148 at the top and bottom thereof to receive fasteners 150 to secure wafer support 106 in enclosure 72.
- columns 140 may be secured in enclosure 72 by any other suitable means such as by overmolding, adhesives, or the like.
- cantilever shelves 144 may have a slightly concave upper surface 152, and may define ramps 116, 118, to enable line contact with wafer 104.
- shelves 144 may be molded with recesses 153 or cores 153a as depicted in Figure 8.
- wafer supports 106 are positioned inwardly from sides 82, 84, such that a portion 154 of wafer 104 extends outward beyond outer margin 156 of wafer support 106. This enables a greater distance between zones of contact 138, thereby reducing the amount of gravitational sag in wafer 104. Moreover, the space between outer margins 156 and sides 82, 84, enables a robotic pickup tool to be inserted in this space to insert and remove wafer 104 from enclosure 72 by lifting portion 154.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/307,896 US20090194456A1 (en) | 2006-07-07 | 2007-07-06 | Wafer cassette |
JP2009519465A JP2009543374A (en) | 2006-07-07 | 2007-07-06 | Wafer cassette |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US81920806P | 2006-07-07 | 2006-07-07 | |
US60/819,208 | 2006-07-07 |
Publications (4)
Publication Number | Publication Date |
---|---|
WO2008008270A2 WO2008008270A2 (en) | 2008-01-17 |
WO2008008270A3 WO2008008270A3 (en) | 2008-05-08 |
WO2008008270B1 WO2008008270B1 (en) | 2008-06-26 |
WO2008008270A9 true WO2008008270A9 (en) | 2008-08-14 |
Family
ID=38923798
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2007/015523 WO2008008270A2 (en) | 2006-07-07 | 2007-07-06 | Wafer cassette |
Country Status (5)
Country | Link |
---|---|
US (1) | US20090194456A1 (en) |
JP (1) | JP2009543374A (en) |
KR (1) | KR20090056963A (en) |
TW (1) | TW200822268A (en) |
WO (1) | WO2008008270A2 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI469901B (en) | 2008-01-13 | 2015-01-21 | Entegris Inc | Wafer container and method of manufacture |
JP2009259951A (en) * | 2008-04-15 | 2009-11-05 | Shin Etsu Polymer Co Ltd | Substrate storing container |
JP2014513442A (en) * | 2011-05-03 | 2014-05-29 | インテグリス・インコーポレーテッド | Wafer container with particle shield |
JP5180403B1 (en) * | 2012-10-02 | 2013-04-10 | 中外炉工業株式会社 | Panel mounting rack |
WO2015107674A1 (en) * | 2014-01-17 | 2015-07-23 | ミライアル株式会社 | Substrate accommodating container |
KR102162366B1 (en) * | 2014-01-21 | 2020-10-06 | 우범제 | Apparatus for removing fume |
US9881820B2 (en) * | 2015-10-22 | 2018-01-30 | Lam Research Corporation | Front opening ring pod |
CN110797286A (en) * | 2018-08-02 | 2020-02-14 | 奇景光电股份有限公司 | Wafer rack |
KR102585052B1 (en) | 2018-10-29 | 2023-10-06 | 미라이얼 가부시키가이샤 | Forming method of substrate storage container, mold and substrate storage container |
TWI715896B (en) * | 2018-12-12 | 2021-01-11 | 日月光半導體製造股份有限公司 | Pod for transporting a carrier |
NL2022185B1 (en) * | 2018-12-12 | 2020-07-02 | Suss Microtec Lithography Gmbh | Substrate cassette |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04106953A (en) * | 1990-08-27 | 1992-04-08 | Dainippon Screen Mfg Co Ltd | Wafer cassette |
US5749469A (en) * | 1992-05-15 | 1998-05-12 | Fluoroware, Inc. | Wafer carrier |
JPH06204318A (en) * | 1992-10-05 | 1994-07-22 | Tokyo Electron Tohoku Ltd | Wafer housing container and wafer array apparatus |
WO1997013710A1 (en) * | 1995-10-13 | 1997-04-17 | Empak, Inc. | 300mm MICROENVIRONMENT POD WITH DOOR ON SIDE |
US6776289B1 (en) * | 1996-07-12 | 2004-08-17 | Entegris, Inc. | Wafer container with minimal contact |
US5788082A (en) * | 1996-07-12 | 1998-08-04 | Fluoroware, Inc. | Wafer carrier |
JPH10144758A (en) * | 1996-11-11 | 1998-05-29 | Kokusai Electric Co Ltd | Substrate transfer plate |
US5791486A (en) * | 1997-01-07 | 1998-08-11 | Fluoroware, Inc. | Integrated circuit tray with self aligning pocket |
US6010008A (en) * | 1997-07-11 | 2000-01-04 | Fluoroware, Inc. | Transport module |
JP3938233B2 (en) * | 1997-11-28 | 2007-06-27 | 信越ポリマー株式会社 | Sealed container |
JPH11233587A (en) * | 1998-02-09 | 1999-08-27 | Toshiba Ceramics Co Ltd | Ic transferring fork |
US6428729B1 (en) * | 1998-05-28 | 2002-08-06 | Entegris, Inc. | Composite substrate carrier |
US6216874B1 (en) * | 1998-07-10 | 2001-04-17 | Fluoroware, Inc. | Wafer carrier having a low tolerance build-up |
US6092981A (en) * | 1999-03-11 | 2000-07-25 | Applied Materials, Inc. | Modular substrate cassette |
JP2003077999A (en) * | 2001-09-05 | 2003-03-14 | Nitto Denko Corp | Semiconductor wafer cassette |
JP4159946B2 (en) * | 2003-08-19 | 2008-10-01 | 信越ポリマー株式会社 | Substrate storage container |
US7100772B2 (en) * | 2003-11-16 | 2006-09-05 | Entegris, Inc. | Wafer container with door actuated wafer restraint |
JP4204047B2 (en) * | 2003-11-27 | 2009-01-07 | 信越ポリマー株式会社 | Storage container and manufacturing method thereof |
EP1902465A2 (en) * | 2005-07-08 | 2008-03-26 | Asyst Technologies, Inc. | Workpiece support structures and apparatus for accessing same |
-
2007
- 2007-07-06 US US12/307,896 patent/US20090194456A1/en not_active Abandoned
- 2007-07-06 WO PCT/US2007/015523 patent/WO2008008270A2/en active Application Filing
- 2007-07-06 JP JP2009519465A patent/JP2009543374A/en active Pending
- 2007-07-06 KR KR1020097001048A patent/KR20090056963A/en not_active Application Discontinuation
- 2007-07-09 TW TW096124895A patent/TW200822268A/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW200822268A (en) | 2008-05-16 |
WO2008008270A3 (en) | 2008-05-08 |
WO2008008270A2 (en) | 2008-01-17 |
KR20090056963A (en) | 2009-06-03 |
WO2008008270B1 (en) | 2008-06-26 |
US20090194456A1 (en) | 2009-08-06 |
JP2009543374A (en) | 2009-12-03 |
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