WO2008006700A1 - Système de brasage à la vague pour le brasage de composants électroniques sur une carte de circuits imprimés - Google Patents

Système de brasage à la vague pour le brasage de composants électroniques sur une carte de circuits imprimés Download PDF

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Publication number
WO2008006700A1
WO2008006700A1 PCT/EP2007/056440 EP2007056440W WO2008006700A1 WO 2008006700 A1 WO2008006700 A1 WO 2008006700A1 EP 2007056440 W EP2007056440 W EP 2007056440W WO 2008006700 A1 WO2008006700 A1 WO 2008006700A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder
covering
wave soldering
crucible
soldering
Prior art date
Application number
PCT/EP2007/056440
Other languages
German (de)
English (en)
Inventor
Dietmar Birgel
Franz Glatz
Original Assignee
Endress+Hauser Gmbh+Co.Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Endress+Hauser Gmbh+Co.Kg filed Critical Endress+Hauser Gmbh+Co.Kg
Publication of WO2008006700A1 publication Critical patent/WO2008006700A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Definitions

  • the invention relates to a wave soldering for soldering electronic components on a printed circuit board.
  • solder electronic assemblies or printed circuit boards with wave soldering semi or fully automatic.
  • a solder side of the circuit board is first wetted with a flux.
  • the circuit board and the components are preheated to evaporate a proportion of solvent in the flux and to avoid a temperature delay of the assembly by a too steep temperature rise during subsequent soldering.
  • the actual soldering is achieved in such Wellenlötanlagen by a solder wave, over which the circuit board is driven.
  • the solder wave is generated by pumping liquid solder, which is in a heatable crucible, through a gap.
  • the soldering temperature is for lead-containing solders to about 240 - 250 0 C, for lead-free solders usually more than 260 0 C.
  • solder wave The shape of the solder wave is application-dependent and determines the quality of the desired solder joint. In many cases, two waves are used directly behind one another to cope with even more complex soldering situations. So surface-mounted electronic components (so-called SMD components) on a solder side of the circuit board together with connection pins of wired components (so-called THT components) located on the other side of the circuit board, in the same work step can be securely soldered to the circuit board.
  • SMD components surface-mounted electronic components
  • THT components connection pins of wired components
  • wave soldering is the so-called selective wave soldering.
  • the whole circuit board or assembly but only a small part thereof is soldered by means of only a few millimeters wide solder wave.
  • a cover of the solder is provided today during wave soldering in order to avoid the disadvantages associated with oxidation of the solder, or at least to significantly reduce.
  • a simple oil has hitherto been used in typical tin-lead solders with melting points up to 180 ° C.
  • a nitrogen blanket is also provided today.
  • the invention is therefore based on the object for wave soldering with lead-free
  • crucible for receiving a solder, wherein a surface of the solder is covered in the crucible during the soldering process of a perfluorinated polyether as a covering medium and thus minimized oxidation of the solder, wherein the covering medium at ambient pressure has a boiling point above 260 0 C.
  • a further cover with nitrogen is provided on the covering.
  • the covering medium is stored in a tank.
  • Yet another embodiment of the wave soldering system according to the invention comprises a condensate trap for vaporized covering medium.
  • the wave soldering invention the
  • the collected condensate of the vaporized Abdeckmediums is cleaned before being returned to the crucible.
  • Yet another embodiment of the wave soldering system according to the invention comprises a sensor for controlling a layer thickness of the covering medium on the
  • the advantage of the invention is the fact that it is easy to implement and that they have at least the same advantages as the conventional covers of the
  • Lotes offers: improved solder joints due to higher wetting speeds, significantly reduced solder consumption by reducing the oxides (scabies), reduced flux consumption, mild activated flux. Cleanliness of printed circuit boards, reduced maintenance; and environmentally friendly soldering with lead-free solders.
  • Fig. 1 is a schematic sectional view of a conventional wave soldering machine
  • Fig. 2 is a schematic sectional view of a particular embodiment of the invention.
  • a wave soldering system 10 is shown schematically, as used heretofore.
  • a heater 14 is provided, which holds for soldering a Lot 16 located in the crucible 12, today usually a tin-lead solder, at a temperature just above the melting point of the solder 16.
  • the molten solder is pressed through a slot nozzle 18 shown schematically here in the crucible 12 and directed upwards, mostly pumped.
  • a solder wave 20 is generated, as shown in FIG. 1 illustrates.
  • populated printed circuit boards 26 are brought to the wave soldering machine 10.
  • SMD components 30 have usually already been soldered to the respective upper sides 28 of the printed circuit boards 26.
  • THT components 32 equipped, as illustrated in Fig. 1, the connecting pins 34 have been inserted in corresponding connection holes through the circuit boards 26 therethrough ,
  • SMD components 38 are also equipped for the wave soldering process considered here, which are soldered to the solder wave 20 as well as from the respective tops 28 of the printed circuit boards 26 pushed through and on the Lötiety 36 of the printed circuit boards 26 projecting terminal pins 34 of the THT components 32.
  • the transport device 24 is set so that they can be run over by the circuit boards 26 so that the soldering sides 36 of the circuit boards 26 are wetted by the solder wave 20 in the desired manner, but the solder wave 20 passes on the tops 28 of the printed circuit boards 26.
  • the simplest cover used to date in the crucible 12 molten solder 16 is an oil cover 40, as illustrated in Fig. 1.
  • Such an oil cover can be realized in the simplest way with a relatively simple oil, such as peanut oil, which can be used with a boiling point of about 210 0 C for leaded solders.
  • a relatively simple oil such as peanut oil
  • With increasing melting temperatures of the solder unlike lead-free solders, higher-grade oils with a higher boiling point are required, which then also rise above average in price.
  • FIG. 2 is a schematic representation of an embodiment of a wave soldering system 50 according to the invention.
  • a heater 54 is also provided here in a lower region of a crucible 52, the solder for brazing a solder located in the crucible 52 56, preferably a lead-free solder, at a temperature just above the melting point of the solder 56 holds.
  • the molten solder 56 is pressed by a schematically shown here and obliquely upward slot nozzle 58 in the crucible 52, mostly pumped.
  • a solder wave 60 is generated as illustrated in FIG.
  • A as shown in Fig. 1, on rollers running transport device, are brought with the assembled printed circuit boards to the solder wave 60, can be used in the embodiment of the wave soldering machine 50 of FIG. 2. It is not shown for clarity in Fig. 2.
  • a special covering medium 62 is provided here to cover the solder 56.
  • this covering medium 62 according to the invention is a perfluorinated polyether having a boiling point above 260 0 C at ambient pressure. Perfluorinated polyethers which are suitable for the invention are used, for example, in so-called vapor-phase soldering as a heat transfer medium.
  • a nitrogen cover 64 is provided, which is located between the covering medium 62 of polyether and a lid 52 disposed above the crucible 52.
  • This nitrogen blanket 64 is not essential to the invention because the polyether capping medium 62 is already very efficient. However, it is advisable, especially when upgrading existing wave soldering with nitrogen cover on lead-free solder to maintain the nitrogen blanket and to use together with the inventive cover medium 62 made of polyether.
  • a condensate trap 68 is provided in the embodiment shown in Fig. 2, the Wellenlötstrom 50 of the invention the crucible 52 as completely as possible covered, as illustrated in Fig. 2.
  • Evaporated cover medium 62 of perfluorinated polyether condenses on the condensate trap 68 and drains off to the sides of the condensate trap 68 because of a roof-like construction.
  • a catcher 70 is recommended in the lower portion of the condensate trap 68 surrounding the condensed cover medium 62 of polyether to collect and return by means of a suction device 72 in the crucible 52.
  • the covering medium 62 made of perfluorinated polyether is usefully stored outside the crucible in a storage container 74.
  • a storage container 74 For semi-or fully automatic refilling of the reservoir 74 is connected via a line 76 to a pump 78, with which the covering medium 62 is pumped from polyether from the reservoir 74 via a further line 80 into an inlet 82 and then into the crucible 52.
  • the suction device 72 for the collected in the collecting device 70 condensed covering medium 62 made of polyether is connected to a line 84 to the conduit 80 just before it opens into the inlet 82. It is of course also possible to connect the suction device 72 directly to the reservoir 74 in order to bring the condensed polyether back into it.
  • a great advantage of the perfluorinated polyether used in the invention as covering medium 62 in the Wellenlötstrom 50 shown in Fig. 2 is that the covering 62 also gets there and covers the solder 56, where the nitrogen cover is not sufficient: ie in a neck of Slot nozzle 58. Especially with a very narrow slot of the slot 58 may come through oxidation products for partial clogging and thus to an uneven solder wave 60. Should it unexpectedly come to fine oxidation products on the solder 56 in the crucible 52, it has been found in that the perfluorinated polyether as covering medium 62 can bind these fine oxidation products. This also achieves a more even solder wave.

Abstract

Dans les systèmes de brasage à la vague connus jusqu'à ce jour, on utilise un recouvrement de la brasure liquide afin d'éviter ou, au moins de réduire, les inconvénients liés à l'oxydation de la brasure. Comme recouvrement, on utilise fréquemment, pour des brasures types étain-plomb, une huile simple ou, en variante et, en particulier pour des points de fusion plus élevés, un recouvrement à l'azote. Les recouvrements à l'huile ne donnent toutefois pas satisfaction pour des brasures exemptes de plomb, en raison des points de fusion plus élevés, et les recouvrements à l'azote posent des problèmes aux températures supérieures à 260°C, du fait qu'ils nécessitent un débit d'azote élevé et un degré de pureté particulier. Dans le but de produire de manière simple un milieu de recouvrement économique et efficace (62) de la brasure (56) dans un creuset (52), l'invention est caractérisée en ce que ledit milieu de recouvrement est un polyéther perfluoré, d'un point d'ébullition supérieur à 260°C à pression ambiante. Un tel recouvrement (62) peut également être combiné avec un recouvrement à l'azote (64). Un piège à condensat (68) peut également être employé pour collecter le milieu de recouvrement évaporé.
PCT/EP2007/056440 2006-07-10 2007-06-27 Système de brasage à la vague pour le brasage de composants électroniques sur une carte de circuits imprimés WO2008006700A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006032051.4 2006-07-10
DE102006032051.4A DE102006032051B4 (de) 2006-07-10 2006-07-10 Wellenlötanlage zum Löten elektronischer Bauteile auf einer Leiterplatte

Publications (1)

Publication Number Publication Date
WO2008006700A1 true WO2008006700A1 (fr) 2008-01-17

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Country Link
DE (1) DE102006032051B4 (fr)
WO (1) WO2008006700A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009060068A1 (fr) * 2007-11-09 2009-05-14 Endress+Hauser Gmbh+Co.Kg Procédé permettant de faire fonctionner un système de brasage à la vague, avec utilisation de polyéther perfluoré pour la réaction avec des impuretés contenant du plomb

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4032648A1 (fr) * 2021-01-25 2022-07-27 Infineon Technologies AG Agencement pour la formation d'une connexion

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3755886A (en) * 1971-10-22 1973-09-04 Magnavox Co Method for soldering electrical conductors
US3866307A (en) * 1973-09-07 1975-02-18 Western Electric Co Method for soldering, fusing or brazing
FR2341393A1 (fr) * 1976-02-20 1977-09-16 Schleuniger K & Co Dispositif de soudage, a ecoulement de soudure
EP0194152A1 (fr) * 1985-03-06 1986-09-10 Montedison S.p.A. Soudage d'éléments électroniques sur un support

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4360144A (en) 1981-01-21 1982-11-23 Basf Wyandotte Corporation Printed circuit board soldering
US4871109A (en) 1988-01-29 1989-10-03 Monsanto Company Vapor phase soldering using certain perfluorinated polyethers
DE3813931C2 (de) 1988-04-25 1995-05-04 Resma Gmbh Fuegetechnik Indust Schutzgaslötverfahren und Vorrichtung zur Ausführung dieses Verfahrens
DE4216693A1 (de) 1991-05-22 1992-11-26 Frank Bassen Verfahren und vorrichtung zum loeten von baugruppen
DE19716709A1 (de) 1997-04-21 1998-10-22 Helmut W Leicht Wellenlötanlage und Verfahren mit Schutz des Lotes vor Oxidation bzw. Korrosion
DE19911887C1 (de) 1999-03-17 2000-12-21 Asscon Systech Elektronik Gmbh Verfahren zum Reflow-Löten in einer Dampfphasenvakuumlötanlage

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3755886A (en) * 1971-10-22 1973-09-04 Magnavox Co Method for soldering electrical conductors
US3866307A (en) * 1973-09-07 1975-02-18 Western Electric Co Method for soldering, fusing or brazing
FR2341393A1 (fr) * 1976-02-20 1977-09-16 Schleuniger K & Co Dispositif de soudage, a ecoulement de soudure
EP0194152A1 (fr) * 1985-03-06 1986-09-10 Montedison S.p.A. Soudage d'éléments électroniques sur un support

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009060068A1 (fr) * 2007-11-09 2009-05-14 Endress+Hauser Gmbh+Co.Kg Procédé permettant de faire fonctionner un système de brasage à la vague, avec utilisation de polyéther perfluoré pour la réaction avec des impuretés contenant du plomb

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DE102006032051B4 (de) 2022-11-24
DE102006032051A1 (de) 2008-01-17

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