WO2007138183A3 - Carte et procede de fabrication par surmoulage par injection - Google Patents

Carte et procede de fabrication par surmoulage par injection Download PDF

Info

Publication number
WO2007138183A3
WO2007138183A3 PCT/FR2007/000883 FR2007000883W WO2007138183A3 WO 2007138183 A3 WO2007138183 A3 WO 2007138183A3 FR 2007000883 W FR2007000883 W FR 2007000883W WO 2007138183 A3 WO2007138183 A3 WO 2007138183A3
Authority
WO
WIPO (PCT)
Prior art keywords
card
tag
making same
injection overmolding
layers
Prior art date
Application number
PCT/FR2007/000883
Other languages
English (en)
Other versions
WO2007138183A2 (fr
Inventor
Floreal Jonveaux
Bernard Panek
Original Assignee
Plastifrance S A S
Floreal Jonveaux
Bernard Panek
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plastifrance S A S, Floreal Jonveaux, Bernard Panek filed Critical Plastifrance S A S
Priority to EP07765959A priority Critical patent/EP2021986A2/fr
Publication of WO2007138183A2 publication Critical patent/WO2007138183A2/fr
Publication of WO2007138183A3 publication Critical patent/WO2007138183A3/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1615—The materials being injected at different moulding stations
    • B29C45/1628—The materials being injected at different moulding stations using a mould carrier rotatable about an axis perpendicular to the opening and closing axis of the moulding stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1635—Making multilayered or multicoloured articles using displaceable mould parts, e.g. retractable partition between adjacent mould cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus
    • B29C45/04—Injection moulding apparatus using movable moulds or mould halves
    • B29C45/0441—Injection moulding apparatus using movable moulds or mould halves involving a rotational movement
    • B29C45/045—Injection moulding apparatus using movable moulds or mould halves involving a rotational movement mounted on the circumference of a rotating support having a rotating axis perpendicular to the mould opening, closing or clamping direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

La présente invention concerne une carte (1 ) comprenant une étiquette (2) constituée un film ou une feuille, ladite étiquette étant recouverte sur chacune de ses deux faces planes (2a, 2b) par respectivement une première couche (3) et une deuxième couche (4) de matière plastique, caractérisée en ce que ladite étiquette est en outre entièrement recouverte sur sa tranche périphérique (2c) par l'une des dites deux couches de matière plas tique. La présente invention concerne également un procédé de fabrication d'une carte selon l'une des revendications 1 à 14, caractérisé en ce qu'on applique lesdites première et deuxième couches (3,4) de matière plastique par surmoulage par inj ection sur ladite étiquette (2) sur toutes ses faces (2a, 2b, 2c) y compris sur sa tranche (2c), l'une au moins des deux couches étant d'épaisseur inférieure à 0,5 mm.
PCT/FR2007/000883 2006-05-29 2007-05-25 Carte et procede de fabrication par surmoulage par injection WO2007138183A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP07765959A EP2021986A2 (fr) 2006-05-29 2007-05-25 Carte et procede de fabrication par surmoulage par injection

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0604759A FR2901620B1 (fr) 2006-05-29 2006-05-29 Carte et procede de fabrication par surmoulage par injection
FR0604759 2006-05-29

Publications (2)

Publication Number Publication Date
WO2007138183A2 WO2007138183A2 (fr) 2007-12-06
WO2007138183A3 true WO2007138183A3 (fr) 2008-01-17

Family

ID=37898414

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2007/000883 WO2007138183A2 (fr) 2006-05-29 2007-05-25 Carte et procede de fabrication par surmoulage par injection

Country Status (3)

Country Link
EP (1) EP2021986A2 (fr)
FR (1) FR2901620B1 (fr)
WO (1) WO2007138183A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7431956B2 (ja) 2019-11-01 2024-02-15 ダウ グローバル テクノロジーズ エルエルシー オーバーモールド透明構造体

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL9400368A (nl) * 1994-03-09 1995-10-02 Vgf Axxicon B V Werkwijze en inrichting voor het door spuitgieten vervaardigen van verhoudingsgewijs dunne voorwerpen.
JPH09183284A (ja) * 1995-12-28 1997-07-15 Nhk Spring Co Ltd 非接触型ｉｃカード及びその製造方法
JPH09240179A (ja) * 1996-03-06 1997-09-16 Shinsei Kagaku Kogyo Kk Ｉｃカード及びｉｃカードの製造方法並びに ｉｃカード基板の製造方法
EP0914921A1 (fr) * 1997-11-07 1999-05-12 HERBST, Richard Procédé et dispositif pour mouler par injection des cartes codées

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL9400368A (nl) * 1994-03-09 1995-10-02 Vgf Axxicon B V Werkwijze en inrichting voor het door spuitgieten vervaardigen van verhoudingsgewijs dunne voorwerpen.
JPH09183284A (ja) * 1995-12-28 1997-07-15 Nhk Spring Co Ltd 非接触型ｉｃカード及びその製造方法
JPH09240179A (ja) * 1996-03-06 1997-09-16 Shinsei Kagaku Kogyo Kk Ｉｃカード及びｉｃカードの製造方法並びに ｉｃカード基板の製造方法
EP0914921A1 (fr) * 1997-11-07 1999-05-12 HERBST, Richard Procédé et dispositif pour mouler par injection des cartes codées

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7431956B2 (ja) 2019-11-01 2024-02-15 ダウ グローバル テクノロジーズ エルエルシー オーバーモールド透明構造体

Also Published As

Publication number Publication date
EP2021986A2 (fr) 2009-02-11
FR2901620B1 (fr) 2009-01-23
FR2901620A1 (fr) 2007-11-30
WO2007138183A2 (fr) 2007-12-06

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