WO2007114464A1 - Composition de résine permettant de former une couche isolante - Google Patents

Composition de résine permettant de former une couche isolante Download PDF

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Publication number
WO2007114464A1
WO2007114464A1 PCT/JP2007/057521 JP2007057521W WO2007114464A1 WO 2007114464 A1 WO2007114464 A1 WO 2007114464A1 JP 2007057521 W JP2007057521 W JP 2007057521W WO 2007114464 A1 WO2007114464 A1 WO 2007114464A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
resin
mass
bis
epoxy resin
Prior art date
Application number
PCT/JP2007/057521
Other languages
English (en)
Japanese (ja)
Inventor
Hirohisa Narahashi
Eiichi Hayashi
Original Assignee
Ajinomoto Co., Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co., Inc. filed Critical Ajinomoto Co., Inc.
Publication of WO2007114464A1 publication Critical patent/WO2007114464A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/20—Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L31/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid or of a haloformic acid; Compositions of derivatives of such polymers
    • C08L31/02—Homopolymers or copolymers of esters of monocarboxylic acids
    • C08L31/04—Homopolymers or copolymers of vinyl acetate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important

Definitions

  • the present invention relates to a resin composition suitable for forming an insulating layer such as a multilayer printed wiring board.
  • Japanese Patent Application Laid-Open No. 2 0 0 5-1 5 4 7 2 7 discloses a resin composition containing a large amount of silica.
  • the resin composition with high silica filling has a problem that the drilling process of via holes and the like deteriorates.
  • due to the progress of laser technology, etc. even when using a resin composition with high silica filling, it is accompanied by drilling.
  • Multi-layer printed wiring boards can be produced.
  • the drilling additivity is undeniably reduced compared to systems that do not contain silica or that contain a small amount.
  • the present invention includes the following contents.
  • a resin composition comprising: one or more resins selected from a settal resin.
  • the polymer of the component (A) bismaleimide compound and diamine compound in the present invention is obtained by Michael addition reaction of an aromatic or aliphatic primary diamine compound or secondary diamine compound to the bismaleimide compound. Can do.
  • Examples of commercially available polymers of bismaleimide compounds and diamine compounds include “Techmite E 2 0 2 0” (N, N ′ — (4,4′-diphenylmethane) bis manufactured by Printec Co., Ltd. Polymers of maleimide and 1,3-bis ( ⁇ , 1-dimethyl-1,4-aminobenzyl) benzene, mass average molecular weights 15 500 to 2000, softening point 103 to L1, etc.
  • the “epoxy resin having two or more epoxy groups in one molecule” of the component ( ⁇ ) in the present invention is an aromatic epoxy having an aromatic ring skeleton in the molecule from the viewpoint of thermal expansion coefficient and heat resistance.
  • Resins are preferred.
  • Preferred epoxy resins include, for example, cresol nopolac type epoxy resin, phenol nopolac type epoxy resin, tert-butyl-catechol type epoxy resin, biphenyl type epoxy resin, naphthalene type epoxy resin, bisphenol A type epoxy resin, Examples include bisphenol F type epoxy resin, bisphenol S type epoxy resin, fluorene type epoxy resin, xanthene type epoxy resin, dicyclopentene type epoxy resin, and anthracene type epoxy resin.
  • the epoxy resins may be used alone or in combination of two or more.
  • the content of the epoxy resin is preferably 15 to 45% by mass, more preferably 20 to 20%, when the nonvolatile content of the resin composition in the present invention is 100% by mass.
  • an amine curing agent, a guanidine curing agent, an imidazole curing agent, a phenol curing agent, an acid anhydride curing agent, a hydrazide curing agent, a carboxylic acid examples thereof include a system-based curing agent, a thiol-based curing agent, or those epoxy-encapsulated microcapsules.
  • a phenolic curing agent is particularly preferable.
  • the Ra value is a kind of numerical value representing the surface roughness, and is called arithmetic average roughness. Specifically, the absolute value of the height that changes in the measurement region is expressed as an average line. Measured from a certain surface and arithmetically averaged. For example, using WY KO NT 3 3 0 0 manufactured by Beecoin Sturmen Co., Ltd., the VSI contact mode and 50 ⁇ lens can be used to obtain the measurement range as 1 2 1 um X 9 2 m. wear.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

L'invention concerne une composition de résine caractérisée en ce qu'elle contient (A) un produit polymérisé constitué d'un composé de bismaléimide et d'un composé de diamine, (B) une résine époxy présentant au moins deux groupes époxy dans une molécule, (C) un agent de durcissement et (D) au moins une résine sélectionnée parmi des résines phénoxy et des résines d'acétal de polyvinyle. Cette composition de résine est conçue pour former une couche isolante de tableau de connexion imprimé multicouche ou analogue. Cette composition de résine présente une excellente résistance à la chaleur, une excellente résistance mécanique, une excellente capacité à former des films, et présente un faible coefficient de dilatation thermique.
PCT/JP2007/057521 2006-03-30 2007-03-28 Composition de résine permettant de former une couche isolante WO2007114464A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006095579A JP2009155355A (ja) 2006-03-30 2006-03-30 絶縁層形成用樹脂組成物
JP2006-095579 2006-03-30

Publications (1)

Publication Number Publication Date
WO2007114464A1 true WO2007114464A1 (fr) 2007-10-11

Family

ID=38563725

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/057521 WO2007114464A1 (fr) 2006-03-30 2007-03-28 Composition de résine permettant de former une couche isolante

Country Status (3)

Country Link
JP (1) JP2009155355A (fr)
TW (1) TW200745211A (fr)
WO (1) WO2007114464A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010100802A (ja) * 2008-09-24 2010-05-06 Sekisui Chem Co Ltd エポキシ系樹脂組成物、シート状成形体、プリプレグ、硬化体、積層板及び多層積層板
JP2014152309A (ja) * 2013-02-13 2014-08-25 Ajinomoto Co Inc 薄型フィルム用樹脂組成物、薄型フィルム、積層シート及び多層プリント配線板
JP2015180751A (ja) * 2015-07-09 2015-10-15 味の素株式会社 樹脂組成物

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5407678B2 (ja) * 2009-09-04 2014-02-05 日立化成株式会社 熱硬化性絶縁樹脂組成物、並びにこれを用いた支持体付絶縁フィルム、プリプレグ、積層板及び多層プリント配線板
JP5540611B2 (ja) * 2009-09-04 2014-07-02 日立化成株式会社 熱硬化性絶縁樹脂組成物、並びにこれを用いた支持体付絶縁フィルム、プリプレグ、積層板及びプリント配線板
JP5407679B2 (ja) * 2009-09-04 2014-02-05 日立化成株式会社 熱硬化性絶縁樹脂組成物、並びにこれを用いた支持体付絶縁フィルム、プリプレグ、積層板及び多層プリント配線板
JP5740940B2 (ja) * 2010-11-30 2015-07-01 味の素株式会社 金属張積層板の製造方法
WO2016007718A1 (fr) * 2014-07-10 2016-01-14 Isola Usa Corp. Films minces de résine et leur utilisation dans des empilements

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002179772A (ja) * 2000-12-08 2002-06-26 Mitsui Mining & Smelting Co Ltd プリント配線板の層間絶縁層構成用の樹脂化合物、その樹脂化合物を用いた絶縁層形成用樹脂シート及び樹脂付銅箔、並びにそれらを用いた銅張積層板
JP2003105205A (ja) * 2001-09-28 2003-04-09 Toppan Printing Co Ltd 高誘電率複合材料、高誘電率フィルム、金属箔付き積層板およびプリント配線板
JP2005039247A (ja) * 2003-06-27 2005-02-10 Ajinomoto Co Inc 多層プリント配線板用樹脂組成物および接着フィルム
JP2005154727A (ja) * 2003-05-27 2005-06-16 Ajinomoto Co Inc 多層プリント配線板の層間絶縁用樹脂組成物、接着フィルム及びプリプレグ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002179772A (ja) * 2000-12-08 2002-06-26 Mitsui Mining & Smelting Co Ltd プリント配線板の層間絶縁層構成用の樹脂化合物、その樹脂化合物を用いた絶縁層形成用樹脂シート及び樹脂付銅箔、並びにそれらを用いた銅張積層板
JP2003105205A (ja) * 2001-09-28 2003-04-09 Toppan Printing Co Ltd 高誘電率複合材料、高誘電率フィルム、金属箔付き積層板およびプリント配線板
JP2005154727A (ja) * 2003-05-27 2005-06-16 Ajinomoto Co Inc 多層プリント配線板の層間絶縁用樹脂組成物、接着フィルム及びプリプレグ
JP2005039247A (ja) * 2003-06-27 2005-02-10 Ajinomoto Co Inc 多層プリント配線板用樹脂組成物および接着フィルム

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010100802A (ja) * 2008-09-24 2010-05-06 Sekisui Chem Co Ltd エポキシ系樹脂組成物、シート状成形体、プリプレグ、硬化体、積層板及び多層積層板
JP2014152309A (ja) * 2013-02-13 2014-08-25 Ajinomoto Co Inc 薄型フィルム用樹脂組成物、薄型フィルム、積層シート及び多層プリント配線板
JP2015180751A (ja) * 2015-07-09 2015-10-15 味の素株式会社 樹脂組成物

Also Published As

Publication number Publication date
JP2009155355A (ja) 2009-07-16
TW200745211A (en) 2007-12-16

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