WO2007101366A1 - Récepteur infrarouge du type à fente - Google Patents

Récepteur infrarouge du type à fente Download PDF

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Publication number
WO2007101366A1
WO2007101366A1 PCT/CN2006/000347 CN2006000347W WO2007101366A1 WO 2007101366 A1 WO2007101366 A1 WO 2007101366A1 CN 2006000347 W CN2006000347 W CN 2006000347W WO 2007101366 A1 WO2007101366 A1 WO 2007101366A1
Authority
WO
WIPO (PCT)
Prior art keywords
lead frame
infrared receiver
chip
epoxy
epoxy resin
Prior art date
Application number
PCT/CN2006/000347
Other languages
English (en)
French (fr)
Inventor
Jiaxiang Yang
Original Assignee
Jiaxiang Yang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiaxiang Yang filed Critical Jiaxiang Yang
Priority to PCT/CN2006/000347 priority Critical patent/WO2007101366A1/zh
Publication of WO2007101366A1 publication Critical patent/WO2007101366A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge

Definitions

  • the present invention relates to a receiver, and more particularly to a component coupling structure of an infrared receiver. Background technique
  • infrared receivers are used in many home appliances such as color televisions, air conditioners, and DVDs to realize wireless remote control of home appliances.
  • many home appliances such as color televisions, air conditioners, and DVDs to realize wireless remote control of home appliances.
  • ultra-thin products such as portable DVDs
  • higher requirements have been placed on the miniaturization of infrared receivers, and thus infrared receivers of SMD packages have appeared.
  • the infrared receiver of the SMD package satisfies the requirements of the ultra-thin machine for the volume of the infrared receiver to a certain extent, it greatly reduces the acceptance sensitivity and the receiving angle of the infrared receiver. Obviously, this is not desirable. of.
  • a camera with good performance must have a large lens and a long lens.
  • the object of the present invention is to overcome the above contradiction existing in the infrared receiver, and to provide a card slot type infrared receiver with a simple structure and a reasonable design, which can meet the ultra-thin requirements of the whole machine and completely retain the requirements.
  • the high sensitivity and wide receiving angle of the conventional infrared receiver achieve uniformity of miniaturization, high sensitivity, and wide receiving angle.
  • the present invention provides a card slot type infrared receiver, comprising a lead frame and an epoxy resin encapsulation, wherein: the epoxy resin encapsulation body 1 is provided with a lead frame 4 and a lead frame 4 The upper part and the lower part are respectively provided with a photodiode chip 2 and an IC chip 3 , and the front surface of the epoxy resin encapsulant 1 is in the shape of a spherical crown 9 which is on the same horizontal line as the geometric center of the photodiode chip; The left and right sides of the oxygen resin encapsulation body 1 are provided with a groove 5 which can be embedded in the "U" shaped groove 8 of the PCB board 7; the lead wire 6 of the lead frame 4 is inverted and trapezoidal after being bent by processing.
  • the invention retains the basic processing process of the conventional infrared receiver, so the manufacturing technology and process are more mature and do not require more capital investment; and the unique components of the invention
  • the coupling structure also provides the advantage of effectively reducing the height actually occupied by the infrared receiver, making the optical center position of the infrared receiver more precise, and facilitating automated soldering.
  • Figure 1 is a schematic view showing the structure of the components constituting the present invention.
  • Figure 2 is a schematic view of the molding of the present invention
  • Figure 3 is a schematic view of the assembly of the present invention.
  • Figure 4 is a front elevational view of the assembly of the present invention.
  • Figure 5 is a schematic side view of the assembly of the present invention. Description of the symbols
  • FIG. 1 shows the specific structure of the epoxy resin encapsulant 1 and the lead frame 4.
  • the front portion of the epoxy resin encapsulant 1 shown in Fig. 1 has a spherical crown-like projection 9 and is encapsulated in an epoxy resin.
  • a groove 5 is formed in the left and right sides of the lower portion of 1.
  • a photodiode chip 2 and an IC chip 3, as electronic devices of an infrared receiver.
  • the optical focusing center in the spherical crown 9 should be placed on the same horizontal line as the geometric center of the photodiode chip.
  • Figure 2 is a schematic view of the molding of the present invention.
  • Figure 2 shows the case where the lead frame 4 and the epoxy encapsulant 1 are assembled together.
  • the leads 6 of the lead frame 4 after assembly of the lead frame 4 and the epoxy encapsulant 1 are It is inverted trapezoidal after processing and bending.
  • Figure 3 is a schematic view of the assembly of the present invention. That is, the card slot type fully integrated infrared receiver of the present invention is constructed by combining the epoxy resin encapsulant 1, the lead frame 4, and the PCB board 7. As can be seen from Fig. 3, a "U” shaped slot 8 is formed in the PCB board 7, and the "U” shaped slot is shaped and sized such that the recess 5 can be embedded in the "U" shaped slot 8 of the PCB board 7.
  • Figure 4 is a front elevational view of the assembly of the present invention. It can be clearly seen from Fig. 4 that the recess 5 is embedded in the slot 8 of the PCB board 7, and it should be particularly pointed out that the recess 5 of the epoxy encapsulant 1 of the present invention is embedded in the PCB board 7" In the U" slot 8, the height occupied by the infrared receiver can be effectively reduced, and the upper and lower spaces of the PCB board can be more fully utilized.
  • the optical center position of the infrared receiver is more accurate, and the receiving effect of the whole machine is applied (receiving angle) And the receiving sensitivity) is better.
  • the infrared receiver must be equipped with a plastic bracket or a metal bracket for the infrared receiver. Obviously, this will increase the material cost and manufacturing cost.
  • Figure 5 is a schematic side view of the assembly of the present invention.
  • the coupling of the epoxy resin encapsulant 1, the lead frame 4 and the PCB board 7 can be clearly seen from FIG. 5, in particular, the inverted trapezoidal shape after the processed bending shown in FIG. 2 can be clearly seen.
  • the end of the lead 6 is tangent to the back side of the PCB board 7, since the end of the infrared receiver lead 6 is flat on the PCB board 7, making it easier to automate the soldering during the manufacturing process.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Light Receiving Elements (AREA)
  • Optical Communication System (AREA)

Description

卡槽式红外接收器 技术领域
本发明涉及接收器， 特别是涉及一种红外接收器的部件耦接结构。 背景技术
目前彩色电视机、 空调、 DVD等许多家用电器上都使用红外接收器来实 现对家用电器的无线遥控。 随着家用电器产品的日趋小型化， 特别是便携式 DVD等超薄型产品的出现，对红外接收器的小型化提出了更高的要求， 于是， 便出现了 SMD封装的红外接收器。 SMD封装的红外接收器虽然一定程度上满 足了超薄型整机对红外接收器体积方面的要求， 但是， 却大大降低了红外接 收器的接受灵敏度和接收角度， 显然， 这是人们所不希望的。 众所周知， 一 个性能好的照相机， 其镜头一定比较大、 比较长， 否则， 就无法照出好的照 片。 红外接收器的情况与照相机的情况类同， 其外形尺寸的大小与接收灵敏 度、 接收角度之间存在矛盾， 即， 要想红外接收器的接受灵敏度高、 接收角 度宽， 其外形尺寸就必须要足够的大， 而这是超薄型整机所不希望的。 上述 矛盾多年来一直困扰着红外接收器产业的工程师， 从而， 受到广泛的关注。 发明内容
本发明的目的在于克服红外接收器所存在的上述矛盾，提供一种结构筒 单、 设计合理的卡槽型红外接收器， 该红外接收器既可以满足整机的超薄型 要求， 又完全保留了传统红外接收器的高灵敏度和宽的接收角度， 实现了小 型化和高灵敏度、 宽接收角度的统一。
为了达到上述目的， 本发明提供一种卡槽式红外接收器， 包括引线框架 及环氧树脂包封体， 其特征在于: 环氧树脂包封体 1内设置有引线框架 4 , 引线框架 4的上部、 下部分别设置有光电二极管芯片 2和 IC芯片 3,环氧树 脂包封体 1的正面呈球冠状 9 , 该球冠状的光学聚焦中心与光电二极管芯片 的几何中心在同一条水平线上；环氧树脂包封体 1的左右两侧设置有凹槽 5 , 此凹槽 5可以镶嵌于 PCB板 7的 "U" 形槽 8中； 引线框架 4的引线 6经加 工折弯后呈倒梯形， 其末端与 PCB板 7的背面相切。 与 SMD红外接收器的加工过程相比，本发明保留了传统红外接收器的基 本加工过程， 所以， 制造技术、 工艺都更成熟， 也不需要更大的资金投入； 另外本发明的独特的部件间的耦合结构还提供了可以有效地减小红外接收 器所实际占用的高度、红外接收器的光学中心位置更加精确以及便于自动化焊 接的优点。 附图说明
图 1是构成本发明的部件的结构示意图;
图 2是本发明成型示意图；
图 3是本发明的装配示意图；
图 4是本发明的装配正面示意图； 和
图 5是本发明的装配侧面示意图。 附图符号说明
1 环氧树脂包封体
2 光电二极管芯片
3 IC芯片
4 引线框架 4
5
6 引线
7 PCB板（线路板 )
8 "U" 形槽
9 球冠状表面 具体实施方式
下面结合附图对本发明的实施例的详细描述， 将使本发明的结构特征及 其优点更加清楚。
图 1是构成本发明的部件的结构示意图。本发明的卡槽式全集成红外接 收器是由环氧树脂包封体 1、 引线框架 4以及图 3所示的 PCB板 7耦接而构 成。 图 1示出了环氧树脂包封体 1、 引线框架 4的具体结构。 图 1所示的环 氧树脂包封体 1的正面部分有一呈球冠状的突起 9 , 并且在环氧树脂包封体 1的下部的左右两侧开有凹槽 5。 图 1所示的引线框架 4的上部和下部分别 安置有二个芯片， 即光电二极管芯片 2和 IC芯片 3,作为红外接收器的电子 装置。 在将引线框架 4安装在环氧树脂包封体 1中时， 应将呈球冠状 9的光 学聚焦中心与光电二极管芯片的几何中心安置在同一条水平线上。
图 2是本发明成型示意图。 图 2示出了引线框架 4和环氧树脂包封体 1 装配在一起时的情况， 由图中可以看出， 引线框架 4和环氧树脂包封体 1装 配后引线框架 4的引线 6经加工折弯后呈倒梯形。
图 3是本发明的装配示意图。 即本发明的卡槽式全集成红外接收器是由 环氧树脂包封体 1、 引线框架 4以及 PCB板 7组织合而构成。 由图 3可看出， 在 PCB板 7上开有 "U"形槽 8 , "U"形槽的形状和大小应当使得凹槽 5能够 镶嵌于 PCB板 7的 "U" 形槽 8中。
图 4是本发明的装配正面示意图。 由图 4可以清楚的看出凹槽 5镶嵌于 PCB板 7的 形槽 8中的情况， 应当特别指出的是本发明的环氧树脂包封 体 1的凹槽 5镶嵌于 PCB板 7的 "U" 形槽 8内， 可以有效地减小红外接收 器所实际占用的高度， 使 PCB板的上下空间得到了更充分的利用。 另外， 环 氧树脂包封体 1左右两侧的凹槽 5镶嵌于 PCB板的 "ϋ" 形槽 8内后， 红外 接收器的光学中心位置更加精确， 整机应用时的接收效果（接收角度和接收 灵敏度）就更好， 而以往的红外接收器要想达到同样的接收效果， 就必须给 红外接收器另外安装一个塑料支架或者金属支架， 显然， 这会增加材料成本 和制造成本。
图 5是本发明的装配侧面示意图。 由图 5可以清楚的看出环氧树脂包封 体 1、 引线框架 4以及 PCB板 7的耦接情况， 特别是可以清楚的看到图 2中 所示的经加工折弯后呈倒梯形的引线 6的末端与 PCB板 7的背面相切， 由于 红外接收器引线 6的末端是平贴在 PCB板 7上的， 因此使得在制造过程中自 动化焊接更加方便。
虽然上面利用一具体实施例对本发明作了说明，但其并非是对本发明的 限制 ,在不违反本发明的精神的前提下对本发明所作的各种修改和变化均在 本发明的权利要求的保护范围内。

Claims

权利要求
1、 一种卡槽式红外接收器， 包括引线框架及环氧树脂包封体， 其特征 在于： 环氧树脂包封体（1) 内设置有引线框架（4); 引线框架（4)的上部 和下部分别装配有光电二极管芯片 （ 2 )和 IC芯片（ 3 ); 环氧树脂包封体（ 1 ) 的正面呈球冠状（9), 该球冠状（9) 的光学聚焦中心与光电二极管芯片 (2)的几何中心在同一条水平线上； 环氧树脂包封体（1)的左右两侧开有 凹槽（5), 凹槽（5)镶嵌于 PCB板（7)的 " U" 形槽（8) 中； 引线框架（4 ) 的引线（6)经加工折弯后呈倒梯形， 其末端与 PCB (7)板的背面相切。
PCT/CN2006/000347 2006-03-08 2006-03-08 Récepteur infrarouge du type à fente WO2007101366A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2006/000347 WO2007101366A1 (fr) 2006-03-08 2006-03-08 Récepteur infrarouge du type à fente

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2006/000347 WO2007101366A1 (fr) 2006-03-08 2006-03-08 Récepteur infrarouge du type à fente

Publications (1)

Publication Number Publication Date
WO2007101366A1 true WO2007101366A1 (fr) 2007-09-13

Family

ID=38474584

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2006/000347 WO2007101366A1 (fr) 2006-03-08 2006-03-08 Récepteur infrarouge du type à fente

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WO (1) WO2007101366A1 (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US638440A (en) * 1899-01-11 1899-12-05 Eugene Brillie Combined distributer and regulator for explosive-engines.
JP2002027576A (ja) * 2000-07-05 2002-01-25 Toshiba Corp リモートコントローラ及び携帯電話及び電子機器及びその制御方法
CN2757245Y (zh) * 2004-11-26 2006-02-08 杨家象 微型全集成红外接收器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US638440A (en) * 1899-01-11 1899-12-05 Eugene Brillie Combined distributer and regulator for explosive-engines.
JP2002027576A (ja) * 2000-07-05 2002-01-25 Toshiba Corp リモートコントローラ及び携帯電話及び電子機器及びその制御方法
CN2757245Y (zh) * 2004-11-26 2006-02-08 杨家象 微型全集成红外接收器

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