WO2007080926A1

WO2007080926A1 - Inter-substrate bonding chip part, its manufacturing method, and wiring substrate connection method using the same

Info

Publication number: WO2007080926A1
Application number: PCT/JP2007/050247
Authority: WO
Inventors: Humikazu Harazono; Motohiko Aono; Yoshiharu Takade; Yoshiyuki Hotta; Masahiko Mikami
Original assignee: Matsushita Electric Industrial Co., Ltd.
Priority date: 2006-01-13
Filing date: 2007-01-11
Publication date: 2007-07-19
Also published as: JP2007189098A

Abstract

It is possible to easily mount a circuit module on a printed board without requiring a special facility. Moreover, it is possible to significantly simplify the positioning between substrates. An inter-substrate connection chip part is used for connection between wiring substrates having a wiring pattern. A first and a second surface opposing to each other constitute a flat plane. A plurality of conductive regions are arranged via an insulating region on the first and the second surface. The conductive regions are separately formed so as to constitute a plurality of conductive paths for connection from the first surface to the second surface.

Description

Specification

Chip component for board-to-board connection, its manufacturing method, and wiring board wiring using the same) Method C

Technical field

The present invention relates to a chip component for inter-plate connection, a method for manufacturing the same, and a method for connecting a wiring board using the same, and particularly relates to a chip component for connection used for collective connection between wiring boards.

Background art

[0002] Mounted circuit modules are widely used in which semiconductor elements, resistors, capacitors, and the like are mounted on a wiring board made of resin or ceramic. The structure is generally composed of a wiring layer formed on the substrate and an insulating layer that insulates it, and the wiring layer on the substrate is a hole-like conductor contact layer called a via hole provided in the substrate. They are connected to each other by (conduction vias).

In recent years, a high-density circuit board such as a surface wiring printed circuit (SLC) board has come to be used as this circuit board. The SLC is composed of a substrate and its surface wiring layer. The surface layer wiring layer is a laminate of a wiring layer and an insulating layer, and the wiring layers are connected to each other through conductive vias. In addition, the connection between the wirings on both sides of the board is made by conductive vias (through holes) in the board. Build-up of mounting circuit module using such SLC board The lower part of the board is electrically connected to the mounting board (mother board, etc.) via the solder balls (ball-dally-array) for carrier connection . On the other hand, a semiconductor chip is electrically connected to the upper part of the buildup substrate via chip connection bumps (solder bumps).

[0004] When connecting, as shown in FIG. 12, the printed circuit board 10 on which the electronic component 20 is mounted is individually connected to the flexible wiring board 40, that is, the connection terminal 43 on the flexible board 42 via the solder ball 130. The method of doing is taken.

In the above structure, as shown in the connection process in FIGS. 13A to 13D, the solder ball 130 is placed at a desired position on the printed circuit board 10 (FIG. 13A) on which the electronic component 20 is mounted. Position and install (Fig. 13 (b)), and attach this to the connection terminal 43 (Fig. 13 (c)) on the flexible board 40. It is formed by wearing and reflowing (Fig. 13 (d)). In this method, it is necessary to individually mount solder balls 130 for connection between connection plates at connection points.

Patent Document 1: JP 2001-102749 A

Disclosure of the invention

Problems to be solved by the invention

As described above, in the above structure, as shown in the connection process in FIG. 13, it is necessary to individually mount the solder balls 130 for connecting the plates to the connection points, which increases the number of parts. It was. Positioning is also an important issue. It takes a lot of time for mounting, and misalignment easily occurs.

In addition, in order to connect efficiently, a dedicated facility for mounting solder balls is required, leading to a problem of increased costs.

[0007] The present invention has been made in view of the above circumstances, and an object thereof is to enable easy mounting of a circuit module on a printed circuit board without requiring special equipment.

In addition, another object is to efficiently facilitate alignment between substrates. Means for solving the problem

[0008] The present invention is an inter-plate connecting chip component used for connecting substrates to a wiring substrate on which a wiring pattern is formed, wherein the first and second surfaces facing each other form a flat surface. A plurality of conductive regions and an insulating region are arranged on the first and second surfaces, and the conductive region is connected to the second surface from the first surface. The insulating regions are formed so as to form a path.

According to this configuration, the connection between the substrates can be easily realized with chip parts with good workability, and the presence of the insulating region can surely prevent a short circuit between the conductive paths.

[0009] Further, the present invention provides the above-described chip component for board connection, wherein the conductive region is the first part.

One of the first and second surfaces includes one-dimensionally arranged ones.

According to this configuration, it can be cut into a predetermined length and can be attached to any location, so that it is highly versatile.

[0010] Further, the present invention includes the above-described chip component for board connection, wherein the conductive region is a columnar region arranged toward the second surface with the first surface force. According to this configuration, the conductive path is reliably ensured by the columnar region.

[0011] Further, the present invention provides the above-described chip component for inter-plate connection, wherein the conductive region is the first part.

From the first surface to the second surface, a conductive pattern disposed on the side surface in contact with the end portions of the first and second surfaces is included.

According to this configuration, the configuration is simple and the manufacture is easy.

[0012] The present invention also includes the above-described chip component for connecting plates, including an insulating coating layer disposed between the conductive regions on at least one of the first and second surfaces.

According to this configuration, due to the presence of the insulating coating layer, the flow of solder can be suppressed and a short circuit can be prevented.

[0013] In addition, the present invention includes the above-described chip component for inter-plate connection, wherein the conductive region forms a recess in the vicinity of at least one of the first and second surfaces.

According to this configuration, the recess serves as a liquid reservoir that prevents the solder from flowing out, and the solder flow can be more reliably suppressed.

[0014] In addition, the present invention includes the above-described chip component for inter-plate connection, wherein the columnar region includes concave grooves penetrating from the first surface to the second surface on both side surfaces.

According to this configuration, the concave groove serves to increase the contact area between the connection terminal on the wiring board surface and the solder layer, and serves as a liquid reservoir that prevents the solder layer from flowing out. The insulative area becomes a dam. This suppresses the solder from spreading indefinitely and increases the area of the solder joint, thereby ensuring reliable and strong electrical and physical connection.

[0015] Further, the present invention is configured by a laminate in which an insulating region made of an insulating substrate and a conductive region made of a conductive substrate are stacked in a direction perpendicular to the first and second surfaces. Including things.

[0016] Further, the present invention includes the above-described chip component for board connection, wherein the insulating substrate is a ceramic substrate. According to this configuration, it is possible to configure a firm and reliable chip component for inter-plate connection.

[0017] Further, the present invention includes the above-described chip component for inter-plate connection, wherein the insulating substrate is a resin substrate.

According to this configuration, it is possible to configure a firm and reliable chip component for inter-plate connection.

[0018] Further, the present invention includes the above-described chip component for inter-plate connection, wherein the conductive substrate is a metal substrate.

[0019] The present invention is also a method of manufacturing a chip component for inter-plate connection used for connecting substrates with a wiring substrate on which a wiring pattern is formed, wherein the first and second surfaces facing each other are provided. A plurality of conductive regions are arranged on the first and second surfaces through insulating regions, and the conductive regions are arranged from the first surface to the second surface. The conductive region and the insulating region are arranged so as to form a plurality of conductive paths connected to the.

[0020] Further, according to the present invention, in the method for manufacturing a chip component for inter-plate connection, a step of alternately laminating an insulating substrate and a conductive substrate to form a laminate, and the cut surface is a first surface. And a step of cutting the stacked body perpendicularly to the stacking direction so as to constitute the second surface.

According to this configuration, since the laminated body is cut perpendicularly to the stacking direction so that the cut surfaces constitute the first and second surfaces, the flat surface can be easily formed and more reliable connection can be achieved. Is possible.

[0021] Further, the present invention provides the above-described method for manufacturing a chip component for inter-plate connection, wherein, after the step of forming the laminate, prior to the step of cutting, a through hole is formed in the conductive substrate along the cut surface. The step of cutting includes a step of cutting at a position where the through hole is cut.

According to this configuration, by forming the through hole and cutting it so as to divide it, the recesses on the side surfaces are simultaneously formed, and the productivity is improved.

[0022] Further, the present invention provides the above-described method for manufacturing a chip component for inter-plate connection, the step of forming a stripe-shaped first conductive pattern on the front surface and the back surface of the insulating substrate; Cutting the insulating substrate into a predetermined width in a direction perpendicular to the conductive pattern to form a plate-like body having a predetermined width; and forming the plate-like body into the first conductive pattern. A rearrangement step of rearranging the cut surfaces so as to make contact with each other and aligning the cut surfaces; and a second conductive strip in the rearrangement so as to match the first conductive pattern on the rearranged cut surfaces. Forming a sex pattern.

According to this configuration, the same effect can be achieved at low cost by forming the conductive pattern in the form of stripes on the surface of the insulating substrate.

[0023] Further, according to the present invention, in the method for manufacturing a chip component for inter-plate connection, the step of forming the first and second conductive patterns includes a screen printing step.

According to this configuration, since the process of forming the first and second conductive patterns is a screen printing process, it is possible to efficiently perform highly accurate pattern formation.

[0024] Further, according to the present invention, in the method for manufacturing a chip component for inter-plate connection, the step of forming the second conductive pattern includes a coating step by an ink jet method.

According to this configuration, it is possible to form a highly accurate pattern with high efficiency even on an uneven surface.

[0025] Further, according to the present invention, the first and second surfaces facing each other form a flat surface, and a plurality of conductive regions are arranged on the first and second surfaces via insulating regions. Preparing a chip component for inter-plate connection formed separately in an insulating region so that the conductive region constitutes a plurality of conductive paths connecting from the first surface to the second surface. In the first connection terminal region of the first wiring board, the inter-plate connection chip component is disposed so that the first surface is in contact with the connection terminal region, and solder-bonded. And a second step in which the second surface of the interchip connecting chip component is disposed so as to abut on the second connecting terminal region of the second wiring board and soldered.

According to this structure, it becomes easy to connect between boards efficiently and collectively.

[0026] Further, in the wiring board connection method according to the present invention, the first and second steps are in contact with the first and second surfaces of the first and second connection terminal regions. A solder layer is also formed on the outer side of the surface, and a joining region is formed from the first and second surfaces to the side surface connected to the first and second surfaces. According to this configuration, electrical connection and physical connection are made even on the side surfaces of the first and second connection terminal regions that are not just the contact surfaces with the first and second surfaces, so that the connection is more reliable. Connection is possible.

[0027] Further, according to the present invention, in the method for connecting wiring boards, a groove is formed on a side surface of the conductive region, and in the first and second steps, the solder flows into the groove. This includes a process for forming a bonding region.

According to this configuration, since the joining region is formed so that the solder flows into the recessed groove, it is possible to increase the connection area, the joining property is improved, and the wall surface of the recessed groove serves as a liquid reservoir. As a result, the bonding becomes stronger and more reliable.

[0028] Further, the present invention includes the above wiring board connection method, wherein at least one of the first and second wiring boards is a hard board (rigid board).

According to this configuration, since the hard substrate can maintain flatness, peeling between the two wiring substrates can be prevented.

[0029] Further, the present invention includes the above wiring board connection method, wherein at least one of the first and second wiring boards is a flexible board.

According to the said structure, since a flexible wiring board has flexibility and it is easy to use space, it is often used for the connection between wiring boards or a glass substrate. By applying the present invention, the directly connected flexible substrate is less likely to be peeled off, which leads to a reduction in yield and reliability of electronic products.

The invention's effect

[0030] According to the present invention, a plurality of inter-plate connection points can be connected together, and the number of parts can be reduced. In addition, dedicated mounting equipment for mounting components is not required, and efficient mounting can be realized with a standard equipment configuration.

Brief Description of Drawings

[0031] FIG. 1 is a diagram showing a circuit module mounted using the inter-plate connecting chip component according to the first embodiment of the present invention.

FIG. 2 is a diagram showing a chip component for inter-plate connection according to Embodiment 1 of the present invention.

FIG. 3 is a top view of the circuit module according to the first embodiment of the present invention. FIG. 4 is a view showing an inter-plate connection process using the inter-plate connection chip component according to the first embodiment of the present invention.

FIG. 5 is a manufacturing process diagram of a chip component for inter-plate connection according to Embodiment 1 of the present invention.

FIG. 6 is a manufacturing process diagram of a chip component for inter-board connection according to Embodiment 1 of the present invention.

FIG. 7 is a manufacturing process diagram of a chip component for inter-board connection according to Embodiment 1 of the present invention.

FIG. 8 is a diagram showing a chip part for connecting between plates according to the second embodiment of the present invention.

FIG. 9 is a view showing a chip part for connecting between plates according to a third embodiment of the present invention.

FIG. 10 is a diagram showing a manufacturing process of the interchip connecting chip part according to the third embodiment of the present invention.

FIG. 11 is a diagram showing a manufacturing process of the inter-plate connecting chip part according to the third embodiment of the present invention.

[FIG. 12] A diagram showing a circuit module mounted using a conventional chip component for inter-plate connection.

FIG. 13 is a diagram showing a manufacturing process of a conventional circuit module.

Explanation of symbols

[0032] 10 multilayer wiring board

20 chip parts

30 Chip components for board-to-board connection

31 Conductive area

BEST MODE FOR CARRYING OUT THE INVENTION

Next, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)

FIG. 1 is a cross-sectional view showing a circuit module 100 mounted using the inter-plate connecting chip component according to the embodiment of the present invention. FIG. 2 is a chip part for inter-plate connection of the present embodiment, and FIG. 3 is a top view of the circuit module 100 of FIG. FIG. 4 is a diagram illustrating a circuit module mounting process using the inter-plate connection method using the inter-plate connecting chip component, and FIGS. 5 to 7 are diagrams illustrating a manufacturing process of the inter-chip connecting chip component.

In the present embodiment, as shown in FIG. 1, an inter-plate connection chip is formed on a flexible wiring board 40 having wiring patterns 43 and 41 formed on the front and back surfaces of a polyimide resin film material 42. The multilayer wiring board 10 is connected via the component 30 to achieve board-to-board connection. [0036] Here, the inter-plate connecting chip component 30 is an inter-plate connecting chip component used to connect the substrates with the wiring substrate on which the wiring pattern is formed, as shown in FIG. The first and second surfaces 30a, 30b are flat surfaces, and a plurality of conductive regions 31 having the same width and insulating regions 32 are arranged on the first and second surfaces. The conductive region 31 is formed separately from the first surface by the insulating region 32 so as to constitute a plurality of conductive paths connected to the second surface. Reference numeral 34 denotes an insulating coating layer.

[0037] Further, this conductive region constitutes a columnar conductive path, and has concave grooves 33 penetrating from the first surface 30a to the second surface 30b on both side surfaces.

[0038] As shown in the cross-sectional view of FIG. 1 and the top view of FIG. 3, the circuit module 100 has six inter-plate connecting chip components 30 arranged on the periphery of the multilayer wiring board 10 of the circuit module. Yes. Further, chip components such as the solid-state imaging device chip 21, the capacitor 22, and the resistor 23 are connected to the surface side of the multilayer wiring board of the circuit module by the solder layer 24. As shown in FIG. 1, this multilayer wiring board 20 is composed of a multilayer ceramic substrate. From the chip component side, wiring patterns 1 2a to 1st board 11, 2nd board 15 and 3rd board 18 are respectively provided. , 14, 17, 12b Snoley Honore connecting these 13, 16, 19 forces are formed!

Next, the inter-plate connection method using the inter-plate connection chip component 30 will be described.

As shown in FIG. 4 (a), the interchip connecting chip component 30 shown in FIG. 2 is prepared. Then, as shown in FIG. 4 (b), the solder layer 24 is applied to the connection terminal region of the multilayer wiring board 10 using a dispenser, and the chip component 30 for board-to-board connection 30 is placed and heated, so that the multilayer wiring board is heated. 10 and the chip part 30 for connecting between plates are joined.

Subsequently, as shown in FIG. 4 (c), positioning is performed so that the second surface 30b of the inter-plate connecting chip part 30 contacts the wiring pattern 43 of the flexible wiring board 40.

Then, as shown in FIG. 4 (d), the solder is heated while supplying the dispenser side force, and the interchip connecting chip component and the flexible wiring board 40 are connected.

In this way, the inter-plate connection can be realized very easily.

As shown in FIG. 3, in the present embodiment, six inter-plate connecting chip components are used, so six inter-plate connecting chip components 30 are temporarily fixed at predetermined positions of the multilayer wiring board 10. If bonding is performed by batch heating, bonding can be performed with better workability. [0040] According to this configuration, the inter-plate connecting chip parts 30 can be connected together and the terminals are arranged in a one-dimensional manner, so that it can be used for general purposes. In other words, if the connection terminal area is long, a plurality of chip components for inter-plate connection can be used.

[0041] Further, the concave groove 33 provided on the side surface of the conductive region 31 of the inter-plate connecting chip component 30 helps to increase the contact area between the connection terminal region on the wiring board surface and the solder layer. . In addition, it acts as a reservoir that prevents the solder layer from flowing out, and as a result, the isolated region that is a protruding region acts as a dam. This suppresses the solder from spreading indefinitely and increases the area of the solder joint, thereby ensuring reliable and strong electrical and physical connection.

[0042] Next, a method for manufacturing the chip component for inter-plate connection will be described.

In this method, the insulating substrate constituting the insulating region 32 and the conductive substrate constituting the conductive region 31 are alternately laminated to form a laminate, and the cut surface is the first surface 30a. And a step of cutting the stacked body perpendicularly to the stacking direction so as to constitute the second surface 30b.

First, as shown in FIG. 5 (a), the insulating substrate constituting the insulating region 32 and the conductive substrate constituting the conductive region 31 are alternately laminated to form a laminate.

Next, as shown in FIG. 5 (b), the stacked body is cut along the dicing line DL perpendicularly to the stacking direction so that the cut surfaces form the first surface 30a and the second surface 30b.

[0044] As shown in Fig. 6 (a), the base to be the chip component 30 for connecting the plates obtained in this way is formed.

Then, as shown in FIG. 6 (b), an insulating coating layer 34 is formed on the insulating regions of the first and second surfaces by a coating method. Thereafter, as shown in FIG. 7 (a), resists Rl and R2 are applied to the first surface 30a and the second surface 30b, and the conductive region 31 is etched to thereby form the conductive region 31. A concave groove 33 is formed on the side surface (FIG. 7 (b)).

In this way, the interchip connecting chip component shown in FIG. 2 is formed.

[0046] In this way, a chip component for inter-plate connection can be formed very easily with high controllability and high dimensional accuracy.

In the above-described embodiment, the force described in the chip component for connecting between plates in which the conductive regions 31 are formed at an equal pitch is not necessarily the same pitch, and the first surface and the second surface are electrically connected. It may be formed so that the pitch of the sex region 31 is different! /.

[0047] (Embodiment 2)

FIG. 8 is a diagram showing a chip component for connecting between plates according to an embodiment of the present invention. In the first embodiment, the concave portion 33 is formed on the side surface of the conductive region 31 of the inter-plate connecting chip component 30. However, as shown in FIG. 8, it may have a rectangular parallelepiped shape without forming the concave portion. Is formed by executing the steps of FIGS. 5 to 6 in the first embodiment.

According to this configuration, it is easier to manufacture than the inter-plate connecting chip part of the first embodiment, and it is possible to reduce the number of manufacturing steps.

[0048] (Embodiment 3)

FIG. 9 is a diagram showing a chip component for connecting between plates according to the embodiment of the present invention. In the present embodiment, conductive regions 31P made of a conductor pattern formed by screen printing are formed on the surface of the base substrate 36 having a ceramic substrate force at predetermined intervals, and the base substrate 36 is located between the conductive regions 31P. To constitute an insulating region. Also here, an insulating coating layer 34 is formed on the surface of the insulating region. A method for manufacturing the inter-plate connecting chip component 30 will be described.

As shown in FIG. 10 (a), a ceramic substrate 36 is prepared, and stripe-shaped conductive patterns 31P are formed at predetermined intervals on the front and back surfaces by screen printing.

Then, as shown in FIG. 10 (b), the ceramic substrate on which this conductive pattern 31P is formed Is cut along the dicing line DL to form a rectangular parallelepiped shape.

After that, as shown in FIG. 11 (a), rearrangement is made so that the cut surface is on top, and again on the front and back surfaces as shown in FIG. 11 (b) so as to continue to the conductive pattern 31P. A second conductive pattern 31 S is formed.

In this way, a flat surface with excellent workability can be formed, and the interchip connecting chip component shown in FIG. 9 is formed.

Industrial applicability

According to the present invention, it is possible to provide a chip component for connecting between plates that is small in size and high in mounting strength, so that the connection between the plates is realized with a thin shape and high reliability.

Claims

The scope of the claims

[1] A chip component for inter-board connection used for connection between boards with a wiring board on which a wiring pattern is formed,

The first and second surfaces facing each other form a flat surface, and a plurality of conductive regions and insulating regions are arranged on the first and second surfaces,

The chip component for board-to-plate connection formed by the insulating region so that the conductive region constitutes a plurality of conductive paths connecting from the first surface to the second surface.

[2] The chip part for connecting between boards according to claim 1,

The conductive region is a chip component for inter-plate connection that is one-dimensionally arranged on at least one of the first and second surfaces.

[3] A chip component for inter-plate connection according to claim 1 or 2,

The interchip connecting chip component, wherein the conductive region is a columnar region arranged from the first surface toward the second surface.

[4] A chip component for inter-board connection according to claim 1 or 2,

The conductive region includes an inter-plate connection chip including a conductive pattern disposed on a side surface in contact with an end of the first and second surfaces from the first surface to the second surface. Parts

[5] The chip component for inter-plate connection according to any one of claims 1 to 4,

An inter-plate connecting chip component including an insulating coating layer disposed between the conductive regions on at least one of the first and second surfaces.

[6] The chip component for inter-plate connection according to any one of claims 1 to 5,

The inter-plate connecting chip component, wherein the conductive region forms a recess in the vicinity of at least one of the first and second surfaces.

[7] The chip component for inter-plate connection according to claim 3,

The columnar region is a chip component for inter-plate connection having a concave groove penetrating to both sides of the first surface force and the second surface.

[8] The chip component for inter-plate connection according to any one of claims 1 to 7,

An insulating region made up of an insulating substrate and a conductive region made of a conductive substrate are first and The chip component for board-to-board connection comprised of the laminated body laminated | stacked on the direction orthogonal to a 2nd surface.

[9] The chip component for inter-plate connection according to claim 8,

The chip part for board-to-board connection, wherein the insulating substrate is a ceramic substrate.

[10] The chip component for inter-plate connection according to claim 8,

The insulating board is a resin board chip component for board connection.

[11] A chip component for inter-plate connection according to any one of claims 8 to 10,

The inter-plate connecting chip component, wherein the conductive substrate is a metal substrate.

[12] A method of manufacturing a chip component for inter-board connection used for connection between substrates with a wiring substrate on which a wiring pattern is formed,

The first and second surfaces facing each other form a flat surface, and a plurality of conductive regions are arranged on the first and second surfaces through insulating regions,

The inter-plate connection in which the conductive region and the insulating region are arranged so that the conductive region constitutes a plurality of conductive paths connecting from the first surface to the second surface. Method for manufacturing chip components.

[13] A method of manufacturing a chip component for inter-plate connection according to claim 12,

Insulating substrates and conductive substrates are alternately stacked to form a stacked body, and the stacked body is perpendicular to the stacking direction so that the cut surfaces form the first and second surfaces. The manufacturing method of the chip | tip component for board connection including the process cut | disconnected into.

[14] A method for manufacturing a chip component for inter-plate connection according to claim 13,

After the step of forming the laminate, prior to the cutting step, including a step of forming a through hole in the conductive substrate along the cut surface,

The method of manufacturing a chip component for inter-plate connection, wherein the cutting step is a step of cutting at a position where the through hole is divided.

[15] A method for manufacturing a chip component for inter-plate connection according to claim 12,

Forming a stripe-shaped first conductive pattern on the front and back surfaces of the insulating substrate; and

Cutting the insulating substrate into a predetermined width in a direction orthogonal to the first conductive pattern to form a plate-like body having a predetermined width; A rearrangement step of rearranging the plate-like bodies so that the surfaces on which the first conductive patterns are formed are in contact with each other, and aligning the cut surfaces;

Forming a strip-shaped second conductive pattern on the rearranged cut surfaces so as to coincide with the first conductive pattern.

[16] A method of manufacturing a chip component for inter-plate connection according to claim 15,

The step of forming the first and second conductive patterns includes a board printing chip part manufacturing method including a screen printing step.

[17] A method of manufacturing a chip component for inter-plate connection according to claim 15,

The step of forming the second conductive pattern includes a chip part for board-to-board connection including a coating step by an ink jet method.

[18] The first and second surfaces facing each other form a flat surface, and a plurality of conductive regions are arranged on the first and second surfaces through insulating regions,

A step of preparing chip-parts for board-to-board connection separately formed so that the conductive region forms a plurality of conductive paths connected from the first surface to the second surface;

In the first connection terminal area of the first wiring board,

A first step in which the inter-plate connecting chip component is disposed such that the first surface is in contact with the connecting terminal region and soldered;

A wiring board connecting method comprising: a second step of arranging and soldering the second surface of the interchip connecting chip component so as to contact the second connecting terminal region of the second wiring board.

[19] The wiring board connection method according to claim 18,

In the first and second steps, a solder layer is formed outside the contact surface of the first and second connection terminal regions with the first and second surfaces, respectively. A method of connecting a wiring board, wherein a bonding region is formed on the side surfaces connected to the first and second surface surfaces.

[20] The wiring board connection method according to claim 19,

A concave groove is formed on a side surface of the conductive region,

In the first and second steps, a joining region is formed so that solder flows into the concave groove. A method of connecting a wiring board, which is a process to perform.

[21] The method for connecting wiring boards according to any one of claims 18 to 20,

At least one of the first and second wiring boards is a hard board (rigid board). A wiring board connection method, wherein:

[22] The method for connecting wiring boards according to any one of claims 18 to 20, comprising:

A wiring board connection method, wherein at least one of the first and second wiring boards is a flexible board.