WO2007057752A1 - Panneau de copeaux comprenant un evidement decoratif et proceded de fabrication - Google Patents

Panneau de copeaux comprenant un evidement decoratif et proceded de fabrication Download PDF

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Publication number
WO2007057752A1
WO2007057752A1 PCT/IB2006/003232 IB2006003232W WO2007057752A1 WO 2007057752 A1 WO2007057752 A1 WO 2007057752A1 IB 2006003232 W IB2006003232 W IB 2006003232W WO 2007057752 A1 WO2007057752 A1 WO 2007057752A1
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WO
WIPO (PCT)
Prior art keywords
board
wood chips
pressure pad
wood
compression
Prior art date
Application number
PCT/IB2006/003232
Other languages
English (en)
Inventor
Bo Nilsson
Original Assignee
Inter Ikea Systems B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inter Ikea Systems B.V. filed Critical Inter Ikea Systems B.V.
Publication of WO2007057752A1 publication Critical patent/WO2007057752A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/08—Moulding or pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/08—Moulding or pressing
    • B27N3/18—Auxiliary operations, e.g. preheating, humidifying, cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/08—Moulding or pressing
    • B27N3/20—Moulding or pressing characterised by using platen-presses
    • B27N3/203—Moulding or pressing characterised by using platen-presses with heating or cooling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N5/00—Manufacture of non-flat articles

Definitions

  • Chipboard comprising decorative recess and manufacturing method
  • the present invention relates to a board with decorative recess according to the precharacterizing clause of Patent Claim 1 and also relates to a method for manufacturing the board according to the precharacterizing clause of Patent Claim 8.
  • Boards are often required with an appearance imitating a panel door or cupboard door with a framework of solid wood and panels or with other aesthetic designs.
  • the present invention can be attributed to the manufacturing industry for chipboards, which are a type of wood-based board. Wood-based boards are in turn used in furniture manufacture and within the building industry, for example.
  • MDF Medium Density Fibreboard
  • These boards are manufactured by a fine fraction of wood fibres being baked together with a large quantity of adhesive. Then, when the board has hardened, the decorative recess is milled out of the surface of the board.
  • MDF consists of a relatively fine fraction of wood fibres and a relatively large quantity of adhesive, with which a fine surface can be achieved at the same time as good strength is obtained.
  • the problem with such known boards is that they are also heavy to handle and that a large quantity of wood material and adhesive is required, which is expensive.
  • the boards have to be manufactured in a number of manufacturing steps (smoothing, sawing, milling of surfaces and edges and sealing of milled surfaces and edges), which is likewise expensive.
  • High vapour pressure in the board exists in the case of compression-moulding of a board with a large content of plastic, which, in combination with sealed edges, contributes to the drying and pressing time being unnecessarily long.
  • Compression-moulding of chipboards is carried out today according to various methods in order to produce reliefs or patterns in a surface layer.
  • no board consists of a conventional single chipboard with a relatively deep distinct decorative recess over a relatively large area of the board, for imitating a panel of a panel door, for example.
  • milling out of decorative recesses in a chipboard is carried out.
  • the surface produced by means of machining has to be covered with a surface layer because the surface has a rough appearance owing to the coarser wood chips in comparison with the finer wood fibres in a board of the MDF type.
  • Document US 4812188 discloses a method for producing doors with panels (decorative recess). The method is based on manufacturing thin boards made of wood chips, which can be faced with veneer for example, which boards are produced with a desired profile in their cross section.
  • Document US 3793125 discloses a method in which a central chip layer made of coarser glued chips (L ⁇ 10 mm) is surrounded by finer chip layers (diam. ⁇ 0.1 mm) made of glued chips. The chip layers are applied to one another and then prepressed. The prepressed chip mass is surrounded by embossed decorative paper which has been impregnated with adhesive for hardening, a relief being produced in the surface layer imitating the distribution of natural wood grain.
  • DE 2615661 discloses a chipboard with embossed veneer on both sides.
  • a board suitable for being used as a finished product as a cupboard door, kitchen hatch, wardrobe door, sliding hatch, table top, front panel etc., has thus been produced, which board has a decorative recess imitating a panel, for example.
  • the recess or hollow in one surface plane (surface layer) (or both surface planes) of the board is made so deep that an artificial framework, a fluting or other decorative depression is clearly marked.
  • a number of pressure pads of different appearance with regard to external dimensions and projecting means for producing different types of recess in the boards can likewise be used in one and the same pressing arrangement according to a module system and also in one manufacturing operation according to a chip-separation method.
  • the chip mat is essentially even before compression, which is cost-effective as regards manufacture.
  • the wood chips are preferably of a finer chip size in the at least one surface layer of the board than in an intermediate layer of the board.
  • the wood chips are suitably of both finer and coarser chip size in an intermediate chip layer of the board.
  • the intermediate layer (intermediate chip layer) of the board is thus made stronger, and the board within the area of the decorative recess can be made even stronger on account of the greater density of wood chips.
  • the board is mechanically separable from at least one other board.
  • a "cake" consisting of a number of continuous boards can be manufactured in one compression operation.
  • the boards can either be separated from one another already in the compression operation or be sawn apart (cut apart, broken along recessed indications between the boards produced in the compression operation).
  • a pressure pad with projecting elements for producing a recessed indication, automatically marking exactly the outer edges of the finished board, the position of the saw cut can be determined accurately for sawing the boards apart from one another. This means minimum material waste.
  • adhesive vapours adheresive with which the wood chips have previously been coated
  • the edges can be removed from the edges, which results in cost-effective manufacture of the board from a time perspective (shorter drying time). After the glued wood chips have been compressed under heat action (for example 140°C-250°C), it is thus possible for the vapour pressure which has built up to be removed and water vapour to leave the adhesive in an effective way.
  • the decorative recess suitably has a depth greater than the thickness of a surface layer (chip layer) assigned to the board.
  • a marked recess has thus been produced in the board, which contributes to making the board more like, for example, a solid wood door with panels and a framework.
  • the upper chip layer (the surface layer) consists of wood chips of finer chip size
  • the applicant for the present patent has observed in experiments that this surface layer effectively covers the coarser wood chips constituting the intermediate chip layer within the area of the transition from the decorative recess to the non-recessed area.
  • the depth of the decorative recess is suitably around 4-8 mm when the upper chip layer (chip size 0.1-2.0 mm) has a thickness of around 6-10 mm (before compression) and around 3-7 mm (after compression has been completed).
  • the surface layer of the board preferably comprises a decorative film.
  • the board can thus imitate any wood type as far as its appearance is concerned.
  • the decorative film such as a relief paper or thin veneer sheet for example, is suitably applied to the chip mat before compression of the board (the chip mat).
  • Coloured powder lacquer can also be used for decoration, which lacquer is distributed on top of and/or below the chip mat before compression.
  • Melamine-impregnated film or laminate can likewise advantageously be used.
  • the board has rounded edges, and the wood material has greater density within the area of the rounded edge.
  • edge of the board can already undergo shaping in the compression step.
  • the edge likewise automatically obtains greater strength by virtue of the greater density of wood chips in the compacted edge. This is desirable as well because edges have a tendency to be exposed to impacts to a greater extent than other parts of the board.
  • the first pressure pad suitably comprises a projecting means corresponding to the shape of a decorative recess.
  • Both sides of a board can thus be produced with decorative recesses in a single manufacturing step.
  • the wood chips are preferably heated with the aid of a heat-generating means of the pressing arrangement.
  • Temperatures higher than room temperature can thus be used for producing a glued-together board made of wood chips.
  • the heat for compression can be adjusted according to desired adhesive melting points and compression times.
  • glued wood chips can be compressed under heat action at around 140°C-250°C, depending on the adhesive type and depending on the compression time which in turn depends on the thickness of the board. In general, about 6-18 seconds can be reckoned with per mm thickness, for example.
  • the compression step also comprises, when the pressure pads are in the position of essentially completed compression of the wood chips, mechanical separation of at least two boards from one another.
  • a "cake" consisting of a number of continuous boards can be manufactured in one compression operation.
  • the boards are already separated from one another in the compression operation, which is cost-effective.
  • the wood chips are suitably applied to the first pressure pad in such a way that wood chips of finer chip size form at least one surface layer (lower chip layer) and wood chips of coarser chip size form an intermediate chip layer.
  • the board can thus be made lighter and with a smaller quantity of wood chips, which is cost-effective.
  • the intermediate layer can suitably consist of non- separated wood chips (that is to say a chip fraction with coarser and finer chips). It is also easier to separate boards from the abovementioned "cake” with indicated edges.
  • the surface layers suitably consist of separated wood chips, which provides a homogeneous surface layer after compression. This allows the surface of the decorative recess to be made even and fine.
  • the pressing arrangement preferably comprises a fixing pad comprising fastening means for mounting a number of pressure pads.
  • the pressing arrangement suitably comprises a fixing pad (fixing plate) which can be fastened to the pressing arrangement by means of clamps.
  • the pressure pads (forming plates) are fastened detachably to the fixing pad by means of screws, for example.
  • a number of boards can thus be manufactured in one and the same pressing operation according to a module system.
  • Figure 1 shows diagrammatically a chip mat for compression
  • Figure 2 shows diagrammatically, according to a first embodiment, removal of the pressure pad in Fig. 1 from a finished board with finer chip size in the surface layer;
  • Figure 2a shows diagrammatically the edge area of the board in Fig. 2;
  • Figure 3 shows diagrammatically a second embodiment for a module system and an indication for separation of boards from one another;
  • Figure 4 shows diagrammatically a cake with two boards with an indication brought about by the module system in Figure 3 ;
  • Figure 5 shows diagrammatically a board with a distinct recess imitating a panel door with a framework
  • Figure 6 shows diagrammatically a second pressure pad for manufacturing the board in Figure 5;
  • Figure 7 shows diagrammatically a fixing pad with pressure pads mounted;
  • Figure 8 shows diagrammatically an intermittent press for manufacturing boards according to a third embodiment
  • Figures 9a-9d show diagrammatically a spreading machine for distributing chips of different chip size forming a chip mat before compression to form a board according to a fourth embodiment.
  • FIG 1 shows a chip mat 1 comprising a lower chip layer 3 consisting of glued wood chips 4 (shown in Figure 4) of essentially the chip size 1 mm - 2 mm, that is to say a finer chip size, spread evenly on a spreading strip (a first pressure pad 6).
  • An intermediate chip layer 5, with a coarser chip size, is spread on the lower chip layer 3.
  • An upper chip layer 7 consisting of wood chips corresponding to the chip size of the lower chip layer is spread on the intermediate chip layer 5 with a thickness tl.
  • the three chip layers 3, 5 and 7 therefore consist of wood material 10 made up of glued wood chips 4 which has been applied to the first pressure pad 6, the wood chips 4 forming a desired board 8 after hot-pressing.
  • a pressure plate (a second pressure pad 11) made of metal is fastened detachably to a fixing plate (fixing pad 9) of a pressing arrangement 13.
  • a drive means 15 brings about movement of the second pressure pad 11 towards the first pressure pad 6 until the pressure pads 6 and 11 are in the position of completed compression moulding.
  • the compression moulding can alternatively take place by the first pressure pad 6 being moved towards the second pressure pad 11.
  • the second pressure pad 11 comprises projecting means 17 corresponding in inverted form to the decorative recess 2 in the board 8. Compression for producing the decorative recess 2 is completed when the projecting means 17 of the pressure pad 11 has compressed the chip layers 3, 5, 7 to such an extent that the upper side 19 of the upper chip layer 7 has arrived below the lower side 21 of the upper chip layer 7 in the direction of compression.
  • Figure 2 shows diagrammatically how, after the first and second pressure pads 6 and 11 are in the position of completed compression of the wood chips 4, the drive means 15 of the pressing arrangement 13 moves the second pressure pad 11 in the direction away from the first pressure pad 6 in order to expose the board 8.
  • the decorative recess 2 therefore has a depth d which is greater than the thickness T of the compressed upper chip layer 7.
  • the upper chip layer 7 (the surface layer) consists of wood chips of finer chip size.
  • this surface layer effectively covers the coarser wood chips in the intermediate chip layer within the area of the transition from the decorative recess to the non-recessed area.
  • the depth of the decorative recess is around
  • the second pressure pad 11 comprises projecting elements 25 for mechanical separation of the board 8 from wood material 10 surrounding the board 8 or from an adjacent finished pressed board.
  • Such a pressure pad 11 is used for manufacturing boards 8 which are separated from one another at the end of the compression step. That is to say, when the pressure pads 11 are in the position of essentially completed compression of the wood chips 4, mechanical separation of at least two boards 8 from one another also takes place.
  • FIG 2a shows diagrammatically an edge area 27 of a board 8 with a homogeneous, non-separated chip layer of wood chips 4 of different chip size g', g" according to a second embodiment.
  • the chip mat 1 has been covered with a decorative film 29, such as a plastic film, before the compression step.
  • the wood chips 4 of the edge area 27 and the decorative film 29 located on top form a rounded edge 28 during the compression step, the board 8 automatically being provided with greater density within the edge area 27 and the rounded edge 28 because the wood chips 4 are more tightly packed here (see reference P). This contributes to greater strength in the edge area 27, which is desirable because the edges of the board 8 are extra sensitive to impacts.
  • FIG 3 shows diagrammatically a pressing arrangement 13 for compression moulding of a number of boards 8 located side by side in line with one another.
  • the pressing arrangement 13 comprises a fixing pad 31 comprising fastening means 33, such as clamps 35.
  • fastening means 33 such as clamps 35.
  • two upper second pressure pads 11 made of metal are screwed firmly to the fixing pad 31 with the aid of screws 37.
  • the pressure pads 11 are manufactured on the basis of the wishes of one or more customers for the type of finished board 8. A number of designs of finished pressed boards 8 can thus be manufactured in one compression step according to the module system brought about.
  • Heat- generating means 39 are provided on the pressing arrangement 13 for heating the glued wood chips 4 during compression to a temperature of 140°C-250°C, preferably 160°C-220°C, so that the hardening properties of the adhesive complete the firm (hard) structure of the board 8.
  • Projecting elements 25 of the second pressure pads 11 are adapted so as in the compression step to produce an indication 41 which marks the external dimensions (the edges of the board 8) of the boards 8, which indication 41 also further simplifies mechanical separation of the boards 8 from one another. The mechanical separation can take place by means of breaking, sawing etc. of wood material 10 forming waste material 42.
  • Figure 3 shows diagrammatically the finished pressed boards 8 and how the fixing pad 31 is moved in the direction away from the first pressure pad 6 after the compression step has been completed.
  • the depth the projecting elements 25 produced in the board can be half the thickness of the board.
  • FIG 4 shows diagrammatically how a cake 43 has been produced comprising the two boards 8 in accordance with the compression step shown in Figure 3.
  • the boards are constructed from an intermediate chip layer 5 and a lower 3 and an upper chip layer 7. This makes it clear that the density of the wood material 10 within the area 45 of (below) the decorative recess 2 is greater than in other areas 46 of the boards 8 because the thickness s is greater than the thickness s' (of the compressed intermediate layer 5) and the total thickness S of the remaining area 46 is greater than the thickness S' of said area 45.
  • Figure 5 illustrates diagrammatically a board 8 with a distinct decorative recess 2 imitating a panel door with a framework 47.
  • a cross section I-I of the profile of the board 8 the corresponding profile of a second pressure pad 11 provided for the purpose is shown in Figure 6.
  • the projecting means 17 for producing the imaginary panel (decorative recess 2) of the board 8 is adapted to compress at least a third of the surface area of the chip mat with greater compression than the remaining area 46.
  • the projecting means 17 is adjoined by four (two of which are shown) projecting means 17' and 17" of the pressure pad 11 for producing grooves 49 (see Figure 5) in the board 8 to mark the joining together of the imaginary wood frame 47.
  • FIG. 7 shows diagrammatically a fixing pad 9 detachably fastened to a pressing arrangement 13.
  • Six pressure pads 11 are mounted on the fixing pad 9 according to the module system for producing three different board types.
  • pressure pads for new boards can be produced during the time for production of boards already ordered and mounted on a second fixing pad (not shown).
  • a module system has been brought about which has the advantage of on the one hand producing a number of boards 8 in a single compression step and on the other hand saving time in the production line because fixing pads 9 for new types of board 8 can be prepared without any interruption of production being necessary.
  • Figure 8 illustrates diagrammatically an intermittent press 50 for manufacturing boards 8 according to a third embodiment.
  • These boards comprise decorative recesses 2 on both sides of the board 8.
  • the first pressure pad 6 thus also comprises the projecting means 17.
  • Fixing pads 31 with screwed-on pressure pads (pressing strips) 6 are positioned one on another in stacks for compression of four chip mats (not shown). In this way, a large number of boards 8 can be produced in a single compression step, which is cost-effective.
  • the method for manufacturing a board 8 in the pressing arrangement 13 shown in Figure 8, by compression of essentially wood material 10, in which the board 8 comprises at least one decorative recess 2, is carried out by the wood material 10, consisting of glued wood chips 4, first being applied to at least the first pressure pad 6.
  • the second pressure pad 11 is then moved towards the first pressure pad 6 by the drive means 15.
  • Both the first 6 and the second pressure pad 11 comprise projecting means 17 with the shape corresponding in an inverted manner to the desired decorative recess 2.
  • the movement takes place (the compression step) until the pressure pads 6 and 11 are in the position of completed compression of the wood chips 4 and the projecting means 17 have formed the decorative recesses 2.
  • the pressure pads 6 and 11 are then separated from one another by the drive means 15 to free the board 8 (the boards 8), which is (are) then removed from the pressing arrangement 13 and cooled.
  • the board can then be used as a finished product in a piece of furniture.
  • This finished product is lighter and has a lower manufacturing cost than boards of the MDF type.
  • a method for producing a chip mat 1 constructed from glued wood chips 4 of finer chip size in the lower chip layer 3 and upper chip layer 7 of the board 8 and of wood chips 4 of both coarser and finer chip sizes in the intermediate layer of the board will now be described in conjunction with Figures 9a-9d.
  • This is brought about by the lower 3 and upper chip layer 7 being applied in two layers A and B after mechanical separation of the wood chips 4 with supplementary air separation. Separation can likewise take place only mechanically.
  • a first pressure pad 6 is moved by drive means (not shown) in the direction of the arrow p'. Separation rollers 52 of different circumference and at different relative spacing are rotated anti-clockwise.
  • Glued wood chips 4 are fed from a chip feed unit (not shown) over the separation rollers 52, which separate the wood chips 4 so that wood chips 4 of finer chip size are distributed first on the pressure pad 6, forming the layer A. As the pressure pad 6 is moved in the direction of the arrow p', separated wood chips 4 of coarser chip size are also applied, forming the layer B. An air flow 54 can supplement the separation.
  • the finished chip mat 1 consisting of the layers A, B, C, D, B' and A' then undergoes compression by means of a second (upper) pressure pad 11 comprising a projecting means 17 (not shown).
  • the wood chips are heated during compression so that the hardening properties of the adhesive complete the firm (hard) structure of the board 8.
  • the board 8 is provided with greater strength owing to the greater central density.
  • the present invention is not to be regarded as being limited to the embodiments described above, but combinations of these and other embodiments also exist within the scope of the features indicated in the accompanying patent claims.
  • the surface layer of the board can be provided with a decorative film with a relief such as a plastic film, a melamine-impregnated film, various types of bottoming film etc.
  • Application of face veneer and direct lacquering can likewise be incorporated in the surface layer in order to produce an aesthetically attractive surface layer.
  • the present invention produces cost-effectively ready-made boards for cupboard doors, front panels, panel doors and other finished boards with a distinct decorative recess.

Abstract

La présente invention concerne un panneau construit de matériau essentiellement en bois (10), le panneau (8) comprenant au moins un évidement décoratif (2). Le matériau en bois (10) est constitué de copeaux de bois (4) comprimés les uns avec les autres et possède une densité plus importante au sein de la zone de l’évidement décoratif (2). Le panneau est produit en appliquant le matériau en bois (10) sur un premier tampon de pression (6), en déplaçant le premier tampon de pression (6) et un second tampon de pression (11) l’un vers l’autre grâce à des moyens d’entraînement (15), le second tampon de pression (11) comprenant un moyen en saillie (17) qui correspond à la forme de l’évidement décoratif (2), jusqu’à ce que les tampons de pression (6, 11) soient dans la position de compression complétée, en séparant les tampons de pression (6, 11) l’un de l’autre et en retirant le panneau (8), en tant que produit fini, à partir de l’agencement de pression (13).
PCT/IB2006/003232 2005-11-16 2006-11-16 Panneau de copeaux comprenant un evidement decoratif et proceded de fabrication WO2007057752A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE0502516-8 2005-11-16
SE0502516A SE528910C2 (sv) 2005-11-16 2005-11-16 Spånskiva innefattande dekorativ försänkning och tillverkningsmetod

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WO2007057752A1 true WO2007057752A1 (fr) 2007-05-24

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WO (1) WO2007057752A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1987930A1 (fr) * 2007-05-04 2008-11-05 Imal S.R.L. Procédé et appareil pour former des articles composés de matériaux mous pour préparer des portes, cadres ou autres

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3793125A (en) * 1970-06-24 1974-02-19 Uniboard Ag Method of making wood-chip boards
DE2615661A1 (de) * 1976-04-09 1977-10-20 Heidapal Spanplattenwerk Gmbh Holzplatte und verfahren zu deren herstellung
US4175106A (en) * 1977-09-14 1979-11-20 Masonite Corporation Post press molding of man-made boards to produce contoured furniture parts
EP0246208A1 (fr) * 1986-04-24 1987-11-19 Swedoor Ab Produit pressé en forme à chaud et méthode pour presser en forme à chaud
US4812188A (en) * 1985-10-10 1989-03-14 Hansen Hardy V Method for producing covering plate members for door or panel elements

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3793125A (en) * 1970-06-24 1974-02-19 Uniboard Ag Method of making wood-chip boards
DE2615661A1 (de) * 1976-04-09 1977-10-20 Heidapal Spanplattenwerk Gmbh Holzplatte und verfahren zu deren herstellung
US4175106A (en) * 1977-09-14 1979-11-20 Masonite Corporation Post press molding of man-made boards to produce contoured furniture parts
US4812188A (en) * 1985-10-10 1989-03-14 Hansen Hardy V Method for producing covering plate members for door or panel elements
EP0246208A1 (fr) * 1986-04-24 1987-11-19 Swedoor Ab Produit pressé en forme à chaud et méthode pour presser en forme à chaud

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1987930A1 (fr) * 2007-05-04 2008-11-05 Imal S.R.L. Procédé et appareil pour former des articles composés de matériaux mous pour préparer des portes, cadres ou autres

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SE0502516L (sv) 2007-03-13
SE528910C2 (sv) 2007-03-13

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