WO2007043263A1

WO2007043263A1 - Truing member for abrasive pad and truing method of abrasive pad

Info

Publication number: WO2007043263A1
Application number: PCT/JP2006/317896
Authority: WO
Inventors: Takashi Kubo; Hiroshi Kimura
Original assignee: Asahi Glass Company, Limited
Priority date: 2005-10-14
Filing date: 2006-09-08
Publication date: 2007-04-19
Also published as: JPWO2007043263A1; TW200726578A; JP5013202B2

Abstract

A truing member capable of truing an abrasive pad composed by sticking a plurality of sheets of small abrasive pad efficiently and effectively, and a truing method of an abrasive pad. The truing member has a rectangular base place, and an abrasive grain securing portion formed by electrodepositing diamond abrasive grains is formed on the diagonal of the base plate such that it becomes thinner toward the center of the base plate. When the truing member is presses against the abrasive pad while they are rotated relatively and revolved, contact time of the abrasive pad with the abrasive grain securing portion becomes equal over the entire surface of the abrasive pad and thereby the entire surface of the abrasive pad can be ground uniformly.

Description

Specification

Polishing pad crane member and polishing pad crane method

TECHNICAL FIELD [0001] The present invention relates to a polishing pad crane member for correcting (optimizing) the shape of a polishing pad (polishing member) of a polishing apparatus for polishing a plate glass, particularly a glass substrate for a display. The present invention relates to a clawing member and a clawing method for a polishing pad. Background art

[0002] As a method for producing a thin glass substrate for a flat panel display such as a liquid crystal display, a production method using a molding method called a float method is known. In this production method, the molten glass is formed into a plate shape by the float method, and then the fine irregularities and undulations on the surface of the glass plate are polished and removed by a polishing apparatus to obtain a thickness of 0.5. This is a method of forming a thin plate of ~ 1.1 mm.

[0003] As a thin glass substrate for a recent flat panel display, a large-sized glass substrate having a side exceeding 2000 mm is manufactured as the display is enlarged.

By the way, the applicant of the present application has proposed a polishing apparatus that targets a large thin glass substrate for a flat panel display as disclosed in Patent Document 1. This polishing apparatus supplies pressurized fluid between a film body to which an adsorption sheet for adsorbing and holding a substrate is attached and a carrier to which the film body is attached, and pressurizes the substrate that is adsorbed and held on the adsorption sheet. It is pressed against the polishing pad (polishing member) of the polishing surface plate by the pressure of the fluid for polishing.

[0005] Generally, in such a polishing apparatus, a grindstone (such as a micro waviness or the like existing on the surface of a polishing pad after polishing a polishing pad before use and a predetermined number of glass substrates) is removed. A truing process (shape correction process) using a truing member is performed.

In addition, a polishing pad for polishing a large glass substrate having a side exceeding 2000 mm cannot be composed of a single piece (one pad). For this reason, a large area of polishing pad is created by attaching a plurality of small polishing pads to a polishing surface plate. However, the stepped portion at the boundary between each polishing pad generated by bonding a plurality of polishing nodes is a glass substrate. In order to adversely affect the quality of the polishing pad, the stepped portion of the polishing pad must also be removed by grinding with a vine member! /.

[0006] The above-mentioned vine member is constituted by fixing (electrodepositing) diamond abrasive grains on the entire surface of a rectangular base plate (metal sheet) corresponding to the shape of the glass substrate. The tooling member is attached to a carrier of a polishing apparatus, and the carrier is rotated and revolved, and the polishing pad is tooled by pressing it against a circular polishing pad while rotating or swinging the polishing surface plate.

Patent Document 1: JP-A-2004-122351

Disclosure of the invention

Problems to be solved by the invention

[0007] However, in the above-described conventional vine member in which diamond barrels are electrodeposited on the entire surface of the base plate, the total grinding amount of the polishing node is required when all the steps of the polishing pad are removed by grinding. There were many more problems. Thus, when the total amount of grinding of the polishing pad is large, it takes a long time for the vineling process and the service life of the expensive polishing pad made of polyurethane foam is shortened.

The amount of grinding of the polishing pad by the temple member is proportional to the contact time between the polishing pad and the temple member. For example, in the case of a conventional truing member in which diamond abrasive grains are electrodeposited on the entire surface, the central portion thereof is always in contact with the polishing pad. Therefore, the central part of the polishing pad is always ground by relative rotation (rotation) and revolving motion. On the other hand, the peripheral portion of the polishing pad is not always ground because the contact with the vine member becomes intermittent during relative revolving motion. As a result, the polishing pad is ground more in the central part than in the peripheral part by the truing process.

Next, in the case of a large-area polishing pad configured by laminating a small-sized polishing pad, even if the stepped portion existing in the center of the polishing pad has already been ground and removed, the stepped portion on the periphery of the polishing pad Is difficult to remove as described above, so the vinening process is continued.

. As a result, the center portion of the polishing pad is excessively ground in order to grind the step portion of the peripheral portion of the polishing pad. Therefore, there is a problem that the total amount of grinding of the polishing pad is increased when all the steps of the polishing pad are removed by grinding, and the life of the polishing pad is shortened. It was.

Further, the conventional vine member is very expensive because diamond particles are electrodeposited on the entire surface of the base plate.

[0008] The present invention has been made in view of such a problem, and a polishing pad (polishing member) formed by laminating a plurality of small-sized polishing pads is efficiently and effectively used as a crane. It is an object of the present invention to provide a clawing member that can be worn and a method for clawing a polishing pad using the truing member.

Means for solving the problem

[0009] In order to achieve the above object, the present invention provides a polishing pad crane member having a barrel fixing portion formed by fixing a barrel on a base plate, The fixed part is located on a straight line passing through the center of the base plate and has a wedge shape that narrows toward the center of the base plate, and a part of the contour line of the barrel fixing part is the center of the base plate. Provided is a polishing pad crane member characterized by being provided in a plurality so as to be positioned on a point.

[0010] Further, the crane lining member is a wedge shape in which the base plate is rectangular, the gunball fixing portion is located on a diagonal line of the base plate and becomes narrower toward the center of the base plate, It is preferable that the base plate is disposed at least in a pair with a center point therebetween.

[0011] According to the crane member configured as described above, the difference between the contact time of the polishing pad and the gunball is reduced over the entire surface of the polishing pad by pressing the pulling member against the polishing pad while rotating and revolving. Become. Therefore, the entire surface of the polishing pad can be ground uniformly, and excessive grinding of the central portion of the polishing pad can be prevented. Therefore, the present invention can efficiently and effectively even a polishing pad configured by laminating a plurality of small polishing pads, that is, a polishing pad having a plurality of layers bonded to each other and having a step in the bonded portion. It can be craned.

[0012] Further, in the crane member of the present invention, it is preferable that the base plate is formed by joining a plurality of small flat plates! /.

[0013] Further, according to the present invention, when the clawing member is rotated about a predetermined rotation axis, There is provided a polishing pad truing method in which both are pressed against a polishing pad while revolving around a predetermined revolution axis, and the shape of the polishing pad is corrected. The crane member of the present invention can also dress a polishing pad.

The invention's effect

[0014] According to the polishing pad crane member and polishing pad crane method of the present invention, a polishing pad crane having an abrasive grain fixing portion formed by fixing abrasive grains on a base plate. In the first inching member, the barrel fixing part is in a wedge shape that is positioned on a straight line passing through the center of the base plate and narrows toward the center of the base plate, and is one on the contour line of the barrel fixing part. Since a plurality of force parts are provided so as to be positioned on the center point of the base plate, it is possible to efficiently and effectively tool a polishing pad formed by laminating a plurality of small polishing pads. .

Brief Description of Drawings

FIG. 1 is a plan view showing an overall structure of a polishing apparatus according to a first embodiment.

FIG. 2 is a side view showing an embodiment of a polishing head and a polishing stage.

FIG. 3 is an assembled perspective view of a polishing head.

FIG. 4 is an explanatory view showing a three-layer structure of a film body of a film frame.

FIG. 5 is an enlarged cross-sectional view of the main part showing the structure for attaching and detaching the membrane frame to the sliding ring.

FIG. 6 is a plan view of the crane member of the present embodiment.

FIG. 7 is an explanatory view showing a movement locus of the crane member shown in FIG.

FIG. 8 is an explanatory view showing a plan view of the crane member of patterns 1 to 4.

FIG. 9 is a graph showing the evaluation of crane members of patterns 1 to 4.

Explanation of symbols

[0016] G ... Glass substrate, 10 ... Polishing device, 12 ... Conveyor, 14 ... Film frame, 16 ... Stage, 18 ... First polishing stage, 20 ... Second polishing stage, 22 ... "Stage, 24 ... Glass substrate unloading conveyor, ₂₆ ... Membrane frame washing stage, ₂₈ ... Membrane frame drying stage, 30 ... Membrane frame return conveyor, 32 ... Robot, 33 ... Arm, 34 ... Adsorption node, 36 ... Conveyor, 38 ... Film body, 40 ... Upper frame, 42 ... Lower frame, 44 ... Airtight holding layer, 46 ... Strength holding layer, 48 ... Smooth layer, 50 ... Polishing head, 51 ... Main body casing, 52 ... Carrier, 53 ... Lower outer ring, 54 ... Air chamber, 56 ... Spindle, 58 ... Polishing pad, 60 ... Polishing pad, 62 ... Polishing surface plate, 64 ... Rotary axis, 66 ... Polishing surface plate, 68 ... Rotary axis, 70 ... Linear motion Guide, 72 ... Guide rail, 74 ... Maintenance stage, 76 ... Maintenance stage, 78 ... Lifting ring, 80 ... Through hole, 82 ... Sliding ring, 84 ··· Sliding ring suspension, 86 · · · Belleville spring for lifting, · · · Lifting spring, 90 · · · Through hole, 92 · · · Screw jack, 94 · · · Stopper pin, ··· Line Shaft, 98 ··· Injection port, 100 ··· Air chamber, 102 ··· Air supply passage, 104 ··· Noleb, 106 · “Air pump, 108 ··· pin, 110 ·” , 112 ··· Hook, 114 ··· Pin, 116 ··· Hole, 118 ··· Stocko plate, 120 · · · Air flow path, 1 22 ··· Holding member, 124 ··· Clipping plate, 126 Pole, 128 ... Through hole, 130 ... Through hole, 138 ... Bear, 140 ··· Robot, 142 ··· Arm, 144 ··· Suction head, 146 ··· Conveyor, 150, 152, 154 ··· Transport device, 160 ··· Guide rail, 170 ··· Guide Rail, 200 ··· Adhesive sheet, 210 ··· Intermediate sheet, 220 ··· Diamond barrel, 222 ··· Stainless steel sheet (base plate), 224 ································ Fixed part

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, preferred embodiments of the crane member and the crane method of the present invention will be described in detail according to the drawings.

A polishing apparatus 10 shown in FIG. 1 is a polishing apparatus that polishes one side of a large liquid crystal display glass substrate G (hereinafter simply referred to as a glass substrate G) to a desired flatness. As the glass substrate G, for example, one side exceeds 2000 mm and the thickness is 0.5 mn! ~ 1. lmm can be applied.

The polishing apparatus 10 includes a conveyor 12 that conveys an unpolished glass substrate G, a stage 16 that adheres the glass substrate G to a film frame 14, a first polishing stage 18, a second polishing stage 20, and a polishing The main parts are the stage 22 for removing the polished glass substrate G from the membrane frame 14, the glass substrate carry-out conveyor 24, the membrane frame cleaning stage 26, the membrane frame drying stage 28, and the membrane frame return conveyor 30! The

In addition, the polishing apparatus 10 has a transfer apparatus 150 for transferring the film frame 14 from the stage 16 to the first polishing stage 18, and the film frame 14 from the first polishing stage 18 to the second polishing stage 20. A transfer device 152 for transferring and a transfer device 154 for transferring the film frame 14 from the second polishing stage 20 to the stage 22 are provided. The unpolished glass substrate G transported by the conveyor 12 is sucked and held by the suction pad 34 provided on the arm 33 of the robot 32. Then, it is transferred from the conveyor 12 to the conveyor 36 by the rotating operation of the arm 33, and is conveyed toward the stage 16 by the conveyor 36.

In stage 16, first, glass substrate G is held on film frame 14. This holding method will be described. The film frame 14 is held on the stage 16 by an elevating device (not shown) which is a glass substrate sticking means, and the glass substrate G is positioned below the film frame 14. The film frame 14 is lowered by the lifting device, and the film body 38 of FIG. 2 stretched on the film frame 14 is pressed against the glass substrate G.

[0023] On the lower surface of the film body 38, a porous foamed polyurethane adsorption sheet 200 that self-adsorbs the glass substrate G is adhered, and between the adsorption sheet 200 and the film body 38, a poly force-carbonate is adhered. An intermediate sheet 210 made of metal is interposed and adhered to both the adsorbing sheet 200 and the film body 38.

[0024] The glass substrate G is relatively pressed against the suction sheet 200 by the pressing force by the lifting device described above, and is sucked and held by the suction sheet 200. Thereafter, the film frame 14 is held by the transfer device 150 of FIG. 1 and transferred to the first polishing stage 18 of FIG. 3, where it is attached to the carrier 52.

[0025] As shown in FIG. 2, the membrane frame 14 has a membrane body 38 stretched between the upper frame 40 and the lower frame 42, and then the upper frame 40 and the lower frame 42 are bolted (not shown). It is comprised by fastening with. The film frame 14 and the film body 38 are not limited to a circular shape, but may be a rectangular shape.

As shown in FIG. 4, the film body 38 has a two-layer structure including an airtight holding layer 44 and a strength holding layer 46. As shown in FIGS. 2 and 5, the airtight holding layer 44 is a sheet material whose outer peripheral portion is closely attached to the lower outer peripheral ring portion 53 of the carrier 52 and maintains airtightness with the air chamber 54 of the carrier 52. is there. Examples of the material of the sheet material include rubber materials, silicone materials, fluorine resin, salt materials (polyvinyl chloride), polyamide materials, urethane materials, and the like. Also, the strength holding layer 46 in FIG. 4 is a sheet material having a predetermined tensile strength that can withstand the tension that holds the airtight holding layer 44 and stretches the entire film body 38. Further, an intermediate sheet 210 is bonded to the lower surface thereof. [0027] Examples of the material for the strength retaining layer 46 include aramid fiber, stainless steel wire mesh, steel wire mesh, carbon fiber, glass fiber, nylon fiber, metal sheet, and resin sheet. In particular, aramid fibers are preferred because of their very low elongation to tensile force.

Next, the force for explaining the polishing head 50 shown in FIG. 3. Since the polishing head 50 of the first polishing stage 18 and the polishing head 50 of the second polishing stage 20 have the same structure, they are given the same reference numerals. I will explain.

The polishing head 50 is configured such that a motor is built in a main body casing 51, and an output shaft of the motor is connected to a spindle 56 that is suspended in a vertical direction. A carrier 52 is connected to the spindle 56. Therefore, the carrier 52 rotates. The main body casing 51 is connected to the slider 158 via the lifting mechanism 156. The main body casing 51 is moved up and down with respect to the slider 158 by the lifting mechanism 156, so that the carrier 52 moves forward and backward with respect to the polishing pad 58 of the first polishing stage 18 and the polishing pad 60 of the second polishing stage 20. In addition, the glass substrate G adhered to the film frame 14 can be pressed against the polishing pads 58 and 60 with a predetermined polishing pressure.

[0030] Since the polishing pad 58 is made of urethane foam and cannot be formed as a single piece (one pad), a plurality of (for example, eight) small-sized polishing pads are attached to the upper surface of the polishing surface plate 62. A large area polishing pad is attached to the surface.

A rotating shaft 64 that is rotated by a motor (not shown) is connected to the lower portion of the polishing surface plate 62. The polishing pad 60 is affixed to the upper surface of the polishing surface plate 66, and a rotating shaft 68 that is rotated by a motor (not shown) is connected to the lower portion of the polishing surface plate 66.

[0032] Further, the main casing 51 is connected to a revolution drive mechanism (not shown) and has a function of revolving around a revolution radius around a predetermined revolution axis. Accordingly, the carrier 52 revolves around the revolution axis. This revolution drive mechanism can also be configured by incorporating a planetary gear mechanism in the main body casing 51 and connecting the output shaft of the planetary gear mechanism to the spindle 56. The above is the configuration of each polishing stage 18, 20, and the glass substrate G is polished by these polishing stages 18, 20, and minute irregularities and undulations on the surface of the glass substrate G are removed. Further, the stepped portion at the boundary between the polishing pads is intensively ground and removed by a crane lining member described later. On the other hand, linear guides 70 and 70 are attached to the slider 158 of the first polishing stage 18. The linear guides 70 and 70 are fitted to guide rails 72 and 72. As shown in FIG. 1, the guide rails 72 and 72 are arranged toward the maintenance stage 74 that maintains the spindle 56 and the carrier 52 of the first polishing stage 18! /

Also, as shown in FIG. 2, linear motion guides 70 and 70 are similarly attached to the slider 158 of the second polishing stage 20, and the linear motion guides 70 and 70 are fitted to the guide rails 160 and 160. Yes. As shown in FIG. 1, the guide rails 160 and 160 are arranged toward the maintenance stage 76 for maintaining the spindle 56 and the carrier 52 of the second polishing stage 20.

In the carrier 52, a lifting ring 78 is fixed to the upper outer peripheral portion of the carrier 52 with bolts (not shown) as shown in FIG. A plurality of through holes 80, 80 ... are formed at equal intervals on a concentric circle in the flange portion where the outer peripheral force of the carrier 52 of the lifting ring 78 also protrudes, and these through holes 80, 80,. As shown in FIG. 5, a sliding ring hanger 84 projecting from the upper surface of the sliding ring 82 is penetrated from below. Further, the sliding ring suspension 84 is penetrated by a lifting spring 88 disposed between the lifting ring 78 and the lifting disc spring 86 and penetrates through the through hole 90 of the lifting disc spring 86. And connected to a screw jack 92.

Therefore, when the screw jack 92 is operated and the sliding ring suspension 84 is pulled upward against the urging force of the lifting spring 88, the sliding ring 82 is pulled up with respect to the carrier 52. Thereby, the membrane frame 14 detachably attached to the sliding ring 82 is pulled up, and a predetermined tension is applied to the membrane body 38.

In automating the application of tension, a plurality of film frames 14 and film bodies 38 are prepared and operated. However, there may be individual differences in the initial tension of the film body 38 with respect to the film frame 14, and the difference in the initial tension between the multiple film bodies 38, 38 ... Therefore, it is difficult to give the same working tension to the film body 38 having any individual difference in tension. Further, if excessive tension is applied to the film body 38, the film body 38 and peripheral devices may be damaged. In order to solve this, the amount of contraction of the lifting spring 88 (the distance between the lifting ring 78 and the lifting disc spring 86) is monitored. That is, the tension actually applied to the film body 38 is measured by monitoring the amount of contraction of the lifting spring 88 in addition to the amount of lifting of the screw jack 92 alone. By having this lifting spring 88, a certain tension is applied to the membrane 38. And the prevention of excessive tension applied to the film body 38 can be solved at the same time.

Note that the force required to measure the amount of contraction of the suspension spring 88 in order to maintain a constant tension. As one means, the current of a motor (not shown) connected to the screw jack 92 via the line shaft 96 is used. By calculating the torque from the value, indirectly acquiring the lifting force of the screw jack 92, and managing this, the tension applied to the film body 38 can be monitored. The line shaft 96 is a shaft that transmits the driving force of the motor to the screw jack 92. Reference numeral 94 is a stopper pin for receiving the reaction force of the lifting spring 88 generated between the lifting ring 78 and the lifting disc spring 86.

In the carrier 52, a plurality of injection ports 98, 98... For discharging compressed air that is a pressurized fluid is formed in the air chamber 54 of FIG. These injection ports 98, 98... Communicate with an air supply path 102 indicated by a broken line in FIG. 3 via an air chamber 100 formed on the upper surface of the carrier 52. The air supply path 102 extends outside the polishing head 50 via a rotary joint (not shown) attached to the polishing head 50, and is connected to the air pump 106 via a valve 104. Therefore, when the valve 104 is opened, compressed air from the air pump 106 is supplied to the air chamber 54 via the air supply path 102, the air chamber 100, and the injection port 98. Thereby, the pressure of the compressed air is transmitted to the glass substrate G through the film body 38, and the entire surface of the glass substrate G is pressed against the polishing pads 58 and 60 with a uniform pressure by this pressure and polished.

On the other hand, as shown in FIG. 2, the upper frame 40 of the membrane frame 14 is provided with a plurality of pins 108, 108... Protruding at equal intervals on a concentric circle and formed at the upper ends of these pins 108. The membrane frame 14 is attached to the sliding ring 82 by engaging the large-diameter head portion 110 shown in FIG. The engagement force between the head part 110 and the hook 112 is strengthened by the reaction force of the film body 38 when the film body 38 is lifted by the screw jack 92, and the polishing resistance received from the film body 38 during polishing causes the head from the hook 112 to Part 110 is not off.

When the polishing of the glass substrate G is completed at the second polishing stage 20 shown in FIG. 1, the film frame 14 is removed from the carrier 52 and transferred to the stage 22 by the transfer device 154. In order to remove the membrane frame 14 from the carrier 52, first, the screw jack 92 shown in FIG. Next, the film frame 14 is rotated by a predetermined angle with respect to the carrier 52 to remove the head portion 110 from the hook 112. This allows the carrier The membrane frame 14 is removed from 52.

In the stage 22 shown in FIG. 1, the glass substrate G that has been polished is removed from the film frame 14 that has been transported by the transport device 154. The removed glass substrate G is conveyed by the conveyor 138, and is adsorbed by the adsorption head 144 attached to the arm 142 of the robot 140, and transferred to the glass substrate carry-out conveyor 24 by the operation of the robot 140. It is carried out of the polishing apparatus 10.

[0042] The film frame 14 from which the glass substrate G has been removed is conveyed to the film frame cleaning stage 26 by the conveyor 146, where it is cleaned with water. The membrane frame 14 that has been cleaned is conveyed to the membrane frame drying stage 28 by the conveyor 148, where it is heated and dried. Then, the dried film frame 14 is transported to the stage 16 by the film frame return conveyor 30 and reused for adhering the glass substrate G. The above is the overall configuration of the polishing apparatus 10.

[0043] On the other hand, the polishing pads 58 and 60 are subjected to tooling (shape correction) before use in order to grind and remove the above-described stepped portions and to remove micro-waviness on the surface layer after processing a predetermined number of sheets. Applied. Note that the tooling is designed to reinforce the surface of the polishing pad before use and after polishing a predetermined number of undulations, irregularities, and steps! This refers to the process to be removed. For this reason, a grinding member is incorporated in the polishing apparatus 10. Since the crane member serves as a reference for the polishing surface of the polishing pad, high precision is required.

[0044] FIG. 6 shows a crane member of the present embodiment. In the present embodiment, the tooling is carried out by attaching a rectangular tooling member 224 having a barrel fixing part in which diamond barrels 220 are electrodeposited to a stainless steel sheet 222 as a base plate. That is, similarly to the polishing of the glass substrate G, the rounding member 224 attached to the adsorption sheet 200 of the film frame 14 is uniformly pressurized with compressed air, which is a pressurized fluid, to form a circular polishing node. While pressing against the belts 58 and 60, the crane pad 224 is rotated (revolved) and revolved, and the polishing pads 58 and 60 are rotated to rotate the polishing pads 58 and 60. It is preferable that the vine member has substantially the same shape as the glass substrate G!

[0045] As described above, the grinding amount of the polishing pad by the crane member is proportional to the contact time between the polishing pad and the gunshot particles. Therefore, diamond particles are electrodeposited on the entire surface of the base plate. In the case of the conventional vine member, the peripheral portion of the polishing pad is not always ground because the contact with the barrel is intermittent due to the relative revolving motion. However, since the central portion of the polishing pad is always in contact with the crane member, the central portion of the polishing pad is always ground by relative rotation and revolution. As a result, the polishing pad is shaved more in the center than in the periphery.

[0046] On the other hand, in the case of the large-area polishing pads 58 and 60 of the embodiment configured by bonding the small-sized polishing pads, as described above, the difference existing in the center part of the polishing pads 58 and 60 is provided. Even though the part has already been removed by grinding, the stepped part on the periphery of the polishing pads 58 and 60 must be removed, so that the tooling process must be continued. As a result, in order to grind the stepped portion around the periphery of the polishing pads 58, 60, there was a problem that the central portions of the polishing pads 58, 60 had to be further cut. Therefore, all the stepped parts of the polishing pads 58 and 60 are sharpened. ”・ The total grinding amount of the polishing pads 58 and 60 when removed is increased, and the service life of the polishing pads 58 and 60 is meaninglessly shortened. It was summer.

[0047] On the other hand, as shown in FIG. 6, the vine member 224 of the present embodiment is formed by forming a stainless steel sheet 222 as a base plate into a rectangular shape and electrodepositing diamond barrels 220. The pair of barrel fixing parts 226, 226 force formed on the diagonal line of the stainless steel sheet 222 are formed in a wedge shape that narrows toward the center O of the stainless steel sheet 222. In addition, since the stainless steel sheet 222 cannot be configured as a single piece (single part) due to size restrictions, nine stainless sheets (base plates) A to I of small size are joined in this embodiment. The diamond abrasive grains 220 are fixed (electrodeposited) to the stainless steel sheets A, E, and I to provide the barrel fixing part. In this embodiment, the temple fixing member 224 has a pair of forces formed on one diagonal along the center O of the stainless steel sheet 222 with the barrel fixing parts 226, 226 further along the other diagonal. You may arrange.

[0048] According to the temple member 224 configured as above, the temple member 22 4 while rotating and revolving the crane member 224 and the polishing pads 58, 60 relatively as shown in FIG. Is pressed against the polishing pads 58 and 60, so that the entire surface of the polishing nodes 58 and 60 (inside the circle indicated by reference numeral 228) with which the temple member 224 comes into contact is disposed between the polishing pads 58 and 60 and the barrel fixing part 226. Contact time is equal. Therefore, the entire surface of the polishing pad 58, 60 should be uniform. It is possible to grind and prevent the center portion of the polishing pads 58 and 60 from being excessively shaved.

Therefore, by using the temple member 224 of the present embodiment, it is possible to efficiently and effectively tool the polishing pads 58 and 60 formed by bonding a plurality of small polishing pads. it can.

[0050] Next, the results of comparison between the grinding amount by the temple member 224 of the present embodiment and the grinding amount by another temple member will be described with reference to Figs.

First, the crane members having the patterns 1 to 4 shown in FIG. 8 will be described.

Pattern 1 is a conventional templed member in which diamond particles are electrodeposited on the entire surface of a rectangular base plate (metal sheet). Pattern 2 is a tooling member in which diamond barrels are electrodeposited on a diagonal line of a rectangular base plate (metal sheet) so that the barrel fixing portions are strip-shaped. Pattern 3 is a force that has a shape narrowing toward the center of the base plate on a diagonal line of a rectangular base plate (metal sheet), and the diamond cannon is fixed to have a predetermined width at the center of the base plate. A vine member with electrodeposited grains. The crane member of pattern 3 does not correspond to the crane member of the present invention because a part of the contour line of the barrel fixing part is not located on the center point of the base plate (metal sheet). Pattern 4 is an electrode of this embodiment in which diamond abrasive grains are electrodeposited on a diagonal line of a rectangular base plate (metal sheet) so as to have a wedge shape (sharp shape) that narrows toward the center of the base plate (metal sheet). A truing member 224.

It should be noted that the crane member of the present invention should have a substantial effective area of the barrel fixing portion that is the same as the pattern 4 shown in the example! By providing a cutout in the barrel fixing part and changing the shape and distribution density of the cutout, it is possible to make the barrel fixing part obtained by removing this notch the same as pattern 4. it can. Such a crane member also includes the present invention.

[0052] Fig. 9 is a graph showing the polishing amount ratio when the polishing pad is ground by the truing members of patterns 1 to 4, and the horizontal axis indicates the position (mm) of the polishing pad central force. The grinding ratio is shown on the vertical axis.

[0053] The graph of FIG. (1) The pressure applied to the entire temple member shall be uniform, and the grinding amount shall be proportional to the relative speed between the polishing node and the temple member; and

(2) Relative swinging motion shall be ignored.

Was created as a prerequisite.

[0054] The outline of the procedure of the calculation method is as follows.

(A) Take the X–Y axis from the center of the clawing member as the origin, and similarly take the X and Y ′ axes from the center of the polishing pad as the origin.

(B) Any point (χ ', y') force on the polishing pad at time t when the crane member revolves at the angular velocity ω and the crane member rotates at the angular velocity W at the same time. Calculate the force that matches the throat position.

(C) It is determined whether or not an abrasive grain fixing portion exists at the position of the crane member. If there is no abrasive grain fixing portion, the grinding amount of the polishing pad is set to zero.

(D) If there is a barrel fixing part at the position of the temple member, the relative speed between the polishing pad and the temple member at the time t is calculated.

(E) Accumulate the relative speed when the turret is on any point (χ ', y') on the polishing pad during the crushing time T, and obtain the grinding amount ratio at that position.

That's it.

FIG. 9 shows the grinding amount ratio calculated under the above conditions (A) to (E).

[0055] According to FIG. 9, in the pattern 1 crane member, the polishing amount in the central portion of the polishing pad is overwhelmingly larger than the polishing amount in the peripheral portion, so all steps are ground and removed. In order to do so, it was found that the total grinding amount increased. In addition, although the total grinding amount of the non-turn 2 and 3 crane members is smaller than that of the pattern 1 crane member, the grinding amount in the center of the polishing pad is different from the grinding amount in other parts. The life of the polishing pad cannot be extended because it clearly increases in comparison.

[0056] On the other hand, the tooling member 224 of the pattern 4 can grind almost uniformly on the entire surface of the polishing pad, so that the step of the polishing pad can be ground and removed with a minimum amount of grinding. found.

[0057] As described above, according to the crane member 224 of the present embodiment, a plurality of small polishing pads are used. The polishing pads 58 and 60 formed by adhering the pads can be efficiently and effectively tooled.

Industrial applicability

The temple member for polishing pad of the present invention is suitable for correcting (optimizing) the shape of a polishing pad (polishing member) of a polishing apparatus for polishing plate glass, particularly a display glass substrate. It should be noted that the entire contents of the specification, claims, drawings and abstract of Japanese Patent Application No. 2005-300287 filed on October 14, 2005 are cited here as disclosure of the specification of the present invention. Incorporate.

Claims

The scope of the claims

[1] On a polishing pad crane member having a barrel fixed portion formed by fixing barrels on a base plate,

The barrel fixing part is located on a straight line passing through the center of the base plate, and has a wedge shape that narrows toward the center of the base plate,

A polishing pad crane member, wherein a plurality of partial forces on the contour line of the barrel fixing portion are provided so as to be positioned on a center point of the base plate.

[2] The base plate is rectangular,

The barrel fixing parts are in a wedge shape that is located on a diagonal line of the base plate and narrows toward the center of the base plate, and at least one pair is arranged across the center point of the base plate. The vine member for a polishing pad according to claim 1.

[3] The polishing pad crane member according to claim 1 or 2, wherein the base plate is configured by joining a plurality of flat plates.

[4] The polishing pad crane member according to any one of claims 1 to 3, wherein the polishing pad is pressed against the polishing pad while rotating and revolving, thereby correcting the shape of the polishing pad. A method for clawing a polishing pad, comprising:

5. The polishing pad tooling method according to claim 4, wherein the crane member is sucked and held on a glass substrate suction sheet and pressed against the polishing pad.