WO2007029981A1 - Appareil de chauffage en ceramique - Google Patents
Appareil de chauffage en ceramique Download PDFInfo
- Publication number
- WO2007029981A1 WO2007029981A1 PCT/KR2006/003570 KR2006003570W WO2007029981A1 WO 2007029981 A1 WO2007029981 A1 WO 2007029981A1 KR 2006003570 W KR2006003570 W KR 2006003570W WO 2007029981 A1 WO2007029981 A1 WO 2007029981A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- board
- ceramic heater
- temperature sensor
- circuit
- heating circuit
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 42
- 238000010438 heat treatment Methods 0.000 claims abstract description 57
- 238000000034 method Methods 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims description 14
- 229910045601 alloy Inorganic materials 0.000 claims description 12
- 239000000956 alloy Substances 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 229910017060 Fe Cr Inorganic materials 0.000 claims description 6
- 229910002544 Fe-Cr Inorganic materials 0.000 claims description 6
- 229910020968 MoSi2 Inorganic materials 0.000 claims description 6
- 229910018487 Ni—Cr Inorganic materials 0.000 claims description 6
- UPHIPHFJVNKLMR-UHFFFAOYSA-N chromium iron Chemical compound [Cr].[Fe] UPHIPHFJVNKLMR-UHFFFAOYSA-N 0.000 claims description 6
- 229910003465 moissanite Inorganic materials 0.000 claims description 6
- 229910052750 molybdenum Inorganic materials 0.000 claims description 6
- 238000000206 photolithography Methods 0.000 claims description 6
- 229910052697 platinum Inorganic materials 0.000 claims description 6
- 238000007650 screen-printing Methods 0.000 claims description 6
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 6
- 229910052715 tantalum Inorganic materials 0.000 claims description 6
- 229910052721 tungsten Inorganic materials 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 4
- 229910052684 Cerium Inorganic materials 0.000 claims description 3
- 229910002091 carbon monoxide Inorganic materials 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052746 lanthanum Inorganic materials 0.000 claims description 3
- 229910052748 manganese Inorganic materials 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 229910052727 yttrium Inorganic materials 0.000 claims description 3
- 238000005137 deposition process Methods 0.000 claims 2
- 239000002356 single layer Substances 0.000 claims 1
- 238000013021 overheating Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 2
- 239000011195 cermet Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
Definitions
- the present invention relates to a ceramic heater, and more particularly, to a ceramic heater incorporating a heating circuit and a separate temperature sensor circuit therein, which is manufactured by a cofiring process based on a precision circuit forming technique, such as screen printing or photolithography, and a layering technique.
- a precision circuit forming technique such as screen printing or photolithography
- a conventional ceramic heater is composed simply of a heating circuit, and its temperature is controlled by an analogue or digital method.
- each temperature control method using the conventional heater has the following problems.
- the analogue method reads a change in the resistance with respect to the temperature of the heating circuit itself, to thereby detect the temperature.
- a problem of this method is that it cannot raise the temperature quickly enough because resistance reading and voltage application should be switched by turns.
- the digital method uses an external, removable temperature sensor.
- Such an external removable temperature sensor shows large differences (2O 0 C) in temperature sensing, depending upon its locations and attachment methods. Therefore, it is very difficult to precisely control the temperature, which makes temperature control through the digital method uneasy. Disclosure of Invention
- the present invention has been made in view of the above drawbacks, and it is, therefore, an object of the present invention to provide a ceramic heater incorporating a heating circuit and a separate temperature sensor circuit therein, which is manufactured by a cofiring process based on a precision circuit forming technique, such as a screen printing or photolithography, and a layering technique.
- the temperature sensor circuit may be screen-printed or pho- tolithographically formed onto a board of ceramic or metallic material or onto a board of composite material of ceramics -metal system (i.e., cermet materials).
- a ceramic heater including: a first board; a heating circuit formed in predetermined patterns on an upper portion of the first board; a temperature sensor circuit positioned between the patterns of the heating circuit; and a second board layered on the first board.
- a ceramic heater including: a first board; a heating circuit formed in predetermined patterns on an upper portion of the first board; and a temperature sensor circuit provided on a separate surface other than the surface of the heating circuit.
- the present invention in case where the present invention is used in a digital temperature control method, it can measure the temperature data very precisely (within 3 0 C) when it is built in the same position all the time.
- the temperature control can be made digitally, so that heaters requiring high precision temperature control can remarkably improve their performances.
- the present invention can be advantageously employed in ceramic heaters in various shapes such as a plate shape (circular and rectangular), cylindrical, cubic structure and the like.
- FIG. 1 illustrates a ceramic heater according to one preferred embodiment of the present invention
- FIG. 2 illustrates a ceramic heater according to another preferred embodiment of the present invention. Best Mode for Carrying Out the Invention
- the ceramic heater of a first embodiment of the present invention includes a first board 10, a heating circuit 14 formed in a predetermined pattern on an upper portion of the first board 10, a temperature sensor circuit 12 located between the predefined patterns of the heating circuit 14, and a second board 16 layered on the first board 10.
- the temperature sensor circuit 12 and the heating circuit 14 are formed in predetermined patterns on the upper portion of the first board 10.
- the temperature sensor circuit 12 and the heating circuit 14 can be formed directly on the upper portion of the first board 10 through a screen-printing technique, or one of the patterns of either the temperature sensor circuit 12 or the heating circuit 14 can be formed on the upper portion of the first board 10 by a semiconductor process such as photolithography, and then materials of the heating circuit or the temperature sensor circuit are subjected to a process such as deposition. Thereafter, the pattern of the remaining temperature sensor circuit or heating circuit is formed on the upper portion of the second board 16 by a photolithographic technique in the same manner followed by being deposited.
- FIG. 1 illustrates the first board 10 and the second board 16 in a rectangular plate shape, they may be in diverse plate shapes or cubic structures like cylinder shapes, which can be applied to all shapes of ceramic heaters.
- a non-described reference numeral 20 denotes a wire.
- the ceramic heater of the structure as described above has the temperature sensor circuit 12 arranged between the patterns of the heating circuit 14, to help the temperature sensor circuit 12 accurately sense the heating temperature so that a user can precisely control the heating temperature of the ceramic heater.
- the heating circuit 14 and the temperature sensor circuit 12 receive electric power through the wire 20 that is separately connected for heating, and then output the sensed heating temperature to a controller (not shown).
- the heating circuit 12 used in the present invention is made of Pt, W, Mo, Ni, Ta, SiC, MoSi2 Ni-Cr alloy, Fe-Cr alloy or a mixture of these.
- the temperature sensor circuit is made of heating materials such as Pt, W, Mo, Ni, Ta, SiC, MoSi2 Ni-Cr alloy, Fe-Cr alloy and a compound thereof, NTC thermistor materials, PTC thermistor materials, Pt, or a mixture thereof.
- the NTC thermistor materials include Mn, CO, Ni, Fe and the like.
- Examples of the PTC thermistor materials include BaTiC ⁇ , Y, Ce, La, Sn and the like.
- the ceramic heater according to a second embodiment of the present invention includes a first board 10, a heating circuit 14 formed in a predetermined pattern on an upper portion of the first board 10, an intermediate board 18 layered on the first board 10, a temperature sensor circuit 12 formed in a predetermined pattern on an upper portion of the intermediate board 18, and a second board 16 layered on the intermediate board 18.
- the heating circuit 14 and the temperature sensor circuit 12 are formed in predetermined patterns on the upper portion of the first board 10 and the intermediate board 18, respectively. As in the first embodiment, the temperature sensor circuit 12 and the heating circuit 14 are formed by screen-printing or photolithography and deposition.
- the first board 10, the intermediate board 18 and the second board 16 are in a rectangular plate shape as depicted in FIG. 2, but they can be in diverse plate shapes or cubic structures like cylinder shapes, which can be applied to all shapes of ceramic heaters.
- the temperature sensor circuit 12 and the heating circuit 14 are formed on their respective boards 10 and 18. However, the heating circuit 14 receives electric power through a wire 20 which is separately connected for heating, and the temperature sensor circuit 12 outputs a sensed heating temperature to a controller (not shown) through the wire 20.
- the temperature sensor circuit 12 is closely adhered to the heating circuit 14 having the board 18 being in the middle, so it is not directly affected by heat generated by the heating circuit 14, thereby preventing any damage from the heat.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Resistance Heating (AREA)
- Control Of Resistance Heating (AREA)
Abstract
L'invention concerne un appareil de chauffage en céramique comprenant un circuit de chauffage intégré et un circuit de capteurs thermiques intégré. L'appareil est fabriqué par un procédé de cofrittage basé sur une technique de création d'un circuit de précision et une technique de placement en couches. L'appareil de chauffage en céramique comprend: un premier panneau; un circuit de chauffage formé selon des dessins préétablis sur une partie supérieure du premier panneau; un circuit de capteurs thermiques placé entre les dessins du circuit de chauffage; et un second panneau disposé sur le premier panneau.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050083532A KR100782063B1 (ko) | 2005-05-24 | 2005-09-08 | 세라믹 히터 |
KR10-2005-0083532 | 2005-09-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007029981A1 true WO2007029981A1 (fr) | 2007-03-15 |
Family
ID=37836057
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2006/003570 WO2007029981A1 (fr) | 2005-09-08 | 2006-09-08 | Appareil de chauffage en ceramique |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2007029981A1 (fr) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013120786A1 (fr) * | 2012-02-16 | 2013-08-22 | Webasto SE | Procédé de fabrication d'un chauffage de véhicule et chauffage de véhicule |
WO2013120767A1 (fr) * | 2012-02-16 | 2013-08-22 | Webasto SE | Chauffage de véhicule et procédé de fabrication d'un chauffage de véhicule |
CN103874245A (zh) * | 2014-03-27 | 2014-06-18 | 福建闽航电子有限公司 | 一种带温控的陶瓷发热片的焊盘结构 |
CN105554923A (zh) * | 2015-12-14 | 2016-05-04 | 福建闽航电子有限公司 | 一种mch电热基板的制作方法 |
JP2017117525A (ja) * | 2015-12-21 | 2017-06-29 | 京セラ株式会社 | ヒータ |
US20200163428A1 (en) * | 2017-05-03 | 2020-05-28 | Jemella Limited | Barrel for hair styling appliance |
RU2768239C2 (ru) * | 2017-10-30 | 2022-03-23 | Кейтиэндджи Корпорейшн | Устройство для генерирования аэрозоля с нагревателем |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0521135A (ja) * | 1991-07-12 | 1993-01-29 | Toshiba Lighting & Technol Corp | セラミクスヒータ |
JPH09106882A (ja) * | 1995-10-12 | 1997-04-22 | Canon Inc | セラミックヒータの温度制御機構 |
JP2003215955A (ja) * | 2002-12-04 | 2003-07-30 | Harison Toshiba Lighting Corp | 定着ヒータ、定着装置および画像形成装置 |
US20040022210A1 (en) * | 2002-08-01 | 2004-02-05 | Frank Edward H. | Cooperative transceiving between wireless interface devices of a host device |
-
2006
- 2006-09-08 WO PCT/KR2006/003570 patent/WO2007029981A1/fr active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0521135A (ja) * | 1991-07-12 | 1993-01-29 | Toshiba Lighting & Technol Corp | セラミクスヒータ |
JPH09106882A (ja) * | 1995-10-12 | 1997-04-22 | Canon Inc | セラミックヒータの温度制御機構 |
US20040022210A1 (en) * | 2002-08-01 | 2004-02-05 | Frank Edward H. | Cooperative transceiving between wireless interface devices of a host device |
JP2003215955A (ja) * | 2002-12-04 | 2003-07-30 | Harison Toshiba Lighting Corp | 定着ヒータ、定着装置および画像形成装置 |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013120786A1 (fr) * | 2012-02-16 | 2013-08-22 | Webasto SE | Procédé de fabrication d'un chauffage de véhicule et chauffage de véhicule |
WO2013120767A1 (fr) * | 2012-02-16 | 2013-08-22 | Webasto SE | Chauffage de véhicule et procédé de fabrication d'un chauffage de véhicule |
CN104115552A (zh) * | 2012-02-16 | 2014-10-22 | 韦巴斯托股份公司 | 车辆加热器的制造方法以及车辆加热器 |
CN104137647A (zh) * | 2012-02-16 | 2014-11-05 | 韦巴斯托股份公司 | 车辆加热器和车辆加热器的制造方法 |
US20150014295A1 (en) * | 2012-02-16 | 2015-01-15 | Dietmar Bytzek | Vehicle heater and method for producing a vehicle heater |
US10112457B2 (en) | 2012-02-16 | 2018-10-30 | Webasto SE | Method for producing a vehicle heater and vehicle heater |
US10555378B2 (en) | 2012-02-16 | 2020-02-04 | Webasto SE | Vehicle heater and method for producing a vehicle heater |
CN103874245A (zh) * | 2014-03-27 | 2014-06-18 | 福建闽航电子有限公司 | 一种带温控的陶瓷发热片的焊盘结构 |
CN105554923A (zh) * | 2015-12-14 | 2016-05-04 | 福建闽航电子有限公司 | 一种mch电热基板的制作方法 |
JP2017117525A (ja) * | 2015-12-21 | 2017-06-29 | 京セラ株式会社 | ヒータ |
US20200163428A1 (en) * | 2017-05-03 | 2020-05-28 | Jemella Limited | Barrel for hair styling appliance |
RU2768239C2 (ru) * | 2017-10-30 | 2022-03-23 | Кейтиэндджи Корпорейшн | Устройство для генерирования аэрозоля с нагревателем |
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