WO2007029981A1 - Appareil de chauffage en ceramique - Google Patents

Appareil de chauffage en ceramique Download PDF

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Publication number
WO2007029981A1
WO2007029981A1 PCT/KR2006/003570 KR2006003570W WO2007029981A1 WO 2007029981 A1 WO2007029981 A1 WO 2007029981A1 KR 2006003570 W KR2006003570 W KR 2006003570W WO 2007029981 A1 WO2007029981 A1 WO 2007029981A1
Authority
WO
WIPO (PCT)
Prior art keywords
board
ceramic heater
temperature sensor
circuit
heating circuit
Prior art date
Application number
PCT/KR2006/003570
Other languages
English (en)
Inventor
Youn-Seob Lee
Hyeung-Gyu Lee
Seung-An You
Original Assignee
Smattech. Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020050083532A external-priority patent/KR100782063B1/ko
Application filed by Smattech. Inc. filed Critical Smattech. Inc.
Publication of WO2007029981A1 publication Critical patent/WO2007029981A1/fr

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/10Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/20Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/28Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/283Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic

Definitions

  • the present invention relates to a ceramic heater, and more particularly, to a ceramic heater incorporating a heating circuit and a separate temperature sensor circuit therein, which is manufactured by a cofiring process based on a precision circuit forming technique, such as screen printing or photolithography, and a layering technique.
  • a precision circuit forming technique such as screen printing or photolithography
  • a conventional ceramic heater is composed simply of a heating circuit, and its temperature is controlled by an analogue or digital method.
  • each temperature control method using the conventional heater has the following problems.
  • the analogue method reads a change in the resistance with respect to the temperature of the heating circuit itself, to thereby detect the temperature.
  • a problem of this method is that it cannot raise the temperature quickly enough because resistance reading and voltage application should be switched by turns.
  • the digital method uses an external, removable temperature sensor.
  • Such an external removable temperature sensor shows large differences (2O 0 C) in temperature sensing, depending upon its locations and attachment methods. Therefore, it is very difficult to precisely control the temperature, which makes temperature control through the digital method uneasy. Disclosure of Invention
  • the present invention has been made in view of the above drawbacks, and it is, therefore, an object of the present invention to provide a ceramic heater incorporating a heating circuit and a separate temperature sensor circuit therein, which is manufactured by a cofiring process based on a precision circuit forming technique, such as a screen printing or photolithography, and a layering technique.
  • the temperature sensor circuit may be screen-printed or pho- tolithographically formed onto a board of ceramic or metallic material or onto a board of composite material of ceramics -metal system (i.e., cermet materials).
  • a ceramic heater including: a first board; a heating circuit formed in predetermined patterns on an upper portion of the first board; a temperature sensor circuit positioned between the patterns of the heating circuit; and a second board layered on the first board.
  • a ceramic heater including: a first board; a heating circuit formed in predetermined patterns on an upper portion of the first board; and a temperature sensor circuit provided on a separate surface other than the surface of the heating circuit.
  • the present invention in case where the present invention is used in a digital temperature control method, it can measure the temperature data very precisely (within 3 0 C) when it is built in the same position all the time.
  • the temperature control can be made digitally, so that heaters requiring high precision temperature control can remarkably improve their performances.
  • the present invention can be advantageously employed in ceramic heaters in various shapes such as a plate shape (circular and rectangular), cylindrical, cubic structure and the like.
  • FIG. 1 illustrates a ceramic heater according to one preferred embodiment of the present invention
  • FIG. 2 illustrates a ceramic heater according to another preferred embodiment of the present invention. Best Mode for Carrying Out the Invention
  • the ceramic heater of a first embodiment of the present invention includes a first board 10, a heating circuit 14 formed in a predetermined pattern on an upper portion of the first board 10, a temperature sensor circuit 12 located between the predefined patterns of the heating circuit 14, and a second board 16 layered on the first board 10.
  • the temperature sensor circuit 12 and the heating circuit 14 are formed in predetermined patterns on the upper portion of the first board 10.
  • the temperature sensor circuit 12 and the heating circuit 14 can be formed directly on the upper portion of the first board 10 through a screen-printing technique, or one of the patterns of either the temperature sensor circuit 12 or the heating circuit 14 can be formed on the upper portion of the first board 10 by a semiconductor process such as photolithography, and then materials of the heating circuit or the temperature sensor circuit are subjected to a process such as deposition. Thereafter, the pattern of the remaining temperature sensor circuit or heating circuit is formed on the upper portion of the second board 16 by a photolithographic technique in the same manner followed by being deposited.
  • FIG. 1 illustrates the first board 10 and the second board 16 in a rectangular plate shape, they may be in diverse plate shapes or cubic structures like cylinder shapes, which can be applied to all shapes of ceramic heaters.
  • a non-described reference numeral 20 denotes a wire.
  • the ceramic heater of the structure as described above has the temperature sensor circuit 12 arranged between the patterns of the heating circuit 14, to help the temperature sensor circuit 12 accurately sense the heating temperature so that a user can precisely control the heating temperature of the ceramic heater.
  • the heating circuit 14 and the temperature sensor circuit 12 receive electric power through the wire 20 that is separately connected for heating, and then output the sensed heating temperature to a controller (not shown).
  • the heating circuit 12 used in the present invention is made of Pt, W, Mo, Ni, Ta, SiC, MoSi2 Ni-Cr alloy, Fe-Cr alloy or a mixture of these.
  • the temperature sensor circuit is made of heating materials such as Pt, W, Mo, Ni, Ta, SiC, MoSi2 Ni-Cr alloy, Fe-Cr alloy and a compound thereof, NTC thermistor materials, PTC thermistor materials, Pt, or a mixture thereof.
  • the NTC thermistor materials include Mn, CO, Ni, Fe and the like.
  • Examples of the PTC thermistor materials include BaTiC ⁇ , Y, Ce, La, Sn and the like.
  • the ceramic heater according to a second embodiment of the present invention includes a first board 10, a heating circuit 14 formed in a predetermined pattern on an upper portion of the first board 10, an intermediate board 18 layered on the first board 10, a temperature sensor circuit 12 formed in a predetermined pattern on an upper portion of the intermediate board 18, and a second board 16 layered on the intermediate board 18.
  • the heating circuit 14 and the temperature sensor circuit 12 are formed in predetermined patterns on the upper portion of the first board 10 and the intermediate board 18, respectively. As in the first embodiment, the temperature sensor circuit 12 and the heating circuit 14 are formed by screen-printing or photolithography and deposition.
  • the first board 10, the intermediate board 18 and the second board 16 are in a rectangular plate shape as depicted in FIG. 2, but they can be in diverse plate shapes or cubic structures like cylinder shapes, which can be applied to all shapes of ceramic heaters.
  • the temperature sensor circuit 12 and the heating circuit 14 are formed on their respective boards 10 and 18. However, the heating circuit 14 receives electric power through a wire 20 which is separately connected for heating, and the temperature sensor circuit 12 outputs a sensed heating temperature to a controller (not shown) through the wire 20.
  • the temperature sensor circuit 12 is closely adhered to the heating circuit 14 having the board 18 being in the middle, so it is not directly affected by heat generated by the heating circuit 14, thereby preventing any damage from the heat.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Resistance Heating (AREA)
  • Control Of Resistance Heating (AREA)

Abstract

L'invention concerne un appareil de chauffage en céramique comprenant un circuit de chauffage intégré et un circuit de capteurs thermiques intégré. L'appareil est fabriqué par un procédé de cofrittage basé sur une technique de création d'un circuit de précision et une technique de placement en couches. L'appareil de chauffage en céramique comprend: un premier panneau; un circuit de chauffage formé selon des dessins préétablis sur une partie supérieure du premier panneau; un circuit de capteurs thermiques placé entre les dessins du circuit de chauffage; et un second panneau disposé sur le premier panneau.
PCT/KR2006/003570 2005-09-08 2006-09-08 Appareil de chauffage en ceramique WO2007029981A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020050083532A KR100782063B1 (ko) 2005-05-24 2005-09-08 세라믹 히터
KR10-2005-0083532 2005-09-08

Publications (1)

Publication Number Publication Date
WO2007029981A1 true WO2007029981A1 (fr) 2007-03-15

Family

ID=37836057

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2006/003570 WO2007029981A1 (fr) 2005-09-08 2006-09-08 Appareil de chauffage en ceramique

Country Status (1)

Country Link
WO (1) WO2007029981A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013120786A1 (fr) * 2012-02-16 2013-08-22 Webasto SE Procédé de fabrication d'un chauffage de véhicule et chauffage de véhicule
WO2013120767A1 (fr) * 2012-02-16 2013-08-22 Webasto SE Chauffage de véhicule et procédé de fabrication d'un chauffage de véhicule
CN103874245A (zh) * 2014-03-27 2014-06-18 福建闽航电子有限公司 一种带温控的陶瓷发热片的焊盘结构
CN105554923A (zh) * 2015-12-14 2016-05-04 福建闽航电子有限公司 一种mch电热基板的制作方法
JP2017117525A (ja) * 2015-12-21 2017-06-29 京セラ株式会社 ヒータ
US20200163428A1 (en) * 2017-05-03 2020-05-28 Jemella Limited Barrel for hair styling appliance
RU2768239C2 (ru) * 2017-10-30 2022-03-23 Кейтиэндджи Корпорейшн Устройство для генерирования аэрозоля с нагревателем

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0521135A (ja) * 1991-07-12 1993-01-29 Toshiba Lighting & Technol Corp セラミクスヒータ
JPH09106882A (ja) * 1995-10-12 1997-04-22 Canon Inc セラミックヒータの温度制御機構
JP2003215955A (ja) * 2002-12-04 2003-07-30 Harison Toshiba Lighting Corp 定着ヒータ、定着装置および画像形成装置
US20040022210A1 (en) * 2002-08-01 2004-02-05 Frank Edward H. Cooperative transceiving between wireless interface devices of a host device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0521135A (ja) * 1991-07-12 1993-01-29 Toshiba Lighting & Technol Corp セラミクスヒータ
JPH09106882A (ja) * 1995-10-12 1997-04-22 Canon Inc セラミックヒータの温度制御機構
US20040022210A1 (en) * 2002-08-01 2004-02-05 Frank Edward H. Cooperative transceiving between wireless interface devices of a host device
JP2003215955A (ja) * 2002-12-04 2003-07-30 Harison Toshiba Lighting Corp 定着ヒータ、定着装置および画像形成装置

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013120786A1 (fr) * 2012-02-16 2013-08-22 Webasto SE Procédé de fabrication d'un chauffage de véhicule et chauffage de véhicule
WO2013120767A1 (fr) * 2012-02-16 2013-08-22 Webasto SE Chauffage de véhicule et procédé de fabrication d'un chauffage de véhicule
CN104115552A (zh) * 2012-02-16 2014-10-22 韦巴斯托股份公司 车辆加热器的制造方法以及车辆加热器
CN104137647A (zh) * 2012-02-16 2014-11-05 韦巴斯托股份公司 车辆加热器和车辆加热器的制造方法
US20150014295A1 (en) * 2012-02-16 2015-01-15 Dietmar Bytzek Vehicle heater and method for producing a vehicle heater
US10112457B2 (en) 2012-02-16 2018-10-30 Webasto SE Method for producing a vehicle heater and vehicle heater
US10555378B2 (en) 2012-02-16 2020-02-04 Webasto SE Vehicle heater and method for producing a vehicle heater
CN103874245A (zh) * 2014-03-27 2014-06-18 福建闽航电子有限公司 一种带温控的陶瓷发热片的焊盘结构
CN105554923A (zh) * 2015-12-14 2016-05-04 福建闽航电子有限公司 一种mch电热基板的制作方法
JP2017117525A (ja) * 2015-12-21 2017-06-29 京セラ株式会社 ヒータ
US20200163428A1 (en) * 2017-05-03 2020-05-28 Jemella Limited Barrel for hair styling appliance
RU2768239C2 (ru) * 2017-10-30 2022-03-23 Кейтиэндджи Корпорейшн Устройство для генерирования аэрозоля с нагревателем

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