WO2007023863A1

WO2007023863A1 - Production method and transport method for very thin copper foil laminated film

Info

Publication number: WO2007023863A1
Application number: PCT/JP2006/316517
Authority: WO
Inventors: Hiroto Shimokawa
Original assignee: Ube Industries, Ltd.
Priority date: 2005-08-23
Filing date: 2006-08-23
Publication date: 2007-03-01

Abstract

Disclosed is a method for producing a very thin copper foil laminated film comprising (1) a first step wherein a carrier foil is removed from a very thin copper foil laminated film with a carrier foil which is obtained by arranging a very thin copper foil with a carrier foil and a film in layers, and (2) a second step wherein the copper surface is subjected to an anti-rust treatment within a short period of time after removal of the carrier foil in the first step before the copper surface is oxidized. The thus-produced very thin copper foil laminated film can be stored for a long time, and it can be easily transported since it is light weighted.

Description

Specification

Manufacturing method and transfer method of ultra-thin copper foil laminated film

Technical field

[0001] The present invention relates to a method for producing an ultra-thin copper foil laminated film that can be stored for a long period of time, is light and easy to transport, and a method for transferring these.

Background art

[0002] Copper foil laminated films with carrier foil are manufactured for the purpose of mounting electronic components such as ICs or LSIs.

[0003] A copper foil laminated film with carrier foil is manufactured by laminating a copper foil with carrier foil and a heat resistant film by a manufacturer of the heat resistant film, and is transported by the manufacturer of the heat resistant film to the wiring processing manufacturer. The carrier foil tape is manufactured by peeling the carrier foil and wiring the copper foil at a wiring manufacturer.

[0004] As the flexible laminate from which the carrier foil has been peeled off, Patent Document 1 discloses a method for producing a flexible laminate in which a metal foil is bonded to at least one surface of a heat-resistant adhesive film, the heat-resistant adhesive film And laminating a laminate having a metal foil and a release layer between at least a pair of metal rolls and a protective film so that the metal foil and the heat-resistant adhesive film are in contact with each other. There is disclosed a method for producing a flexible laminated board, comprising at least a step of separating the protective film and a step of separating the release layer from a metal foil cover.

Patent Document 1: Japanese Patent Laid-Open No. 2005-205731

Disclosure of the invention

Problems to be solved by the invention

[0005] In copper foil laminated film with carrier foil, thin copper foil with carrier foil is manufactured by a copper foil manufacturer, and the manufacturer of heat resistant film is a thin copper foil with carrier foil and heat resistant film. Manufactured and stored together, transported and stored at a wiring processing manufacturer, and then covered by a wiring manufacturer.

[0006] When the carrier foil is peeled off, the copper foil laminated film with the carrier foil has a shadow such as discoloration on the copper foil surface. The copper foil laminated film with carrier foil is transported, stored and used by the heat-resistant film manufacturer to the wiring processing manufacturer without peeling the carrier foil. For this reason, the carrier foil that is not necessary for wiring processing increases the transportation cost, and handling of heavy objects makes it difficult to carry and can cause danger to workers.

[0007] An object of the present invention is to provide a method for producing an ultrathin copper foil laminated film which is a copper foil laminated film with a carrier foil, can be stored for a long period of time, is light and easy to carry, and a method for transferring these. To do.

Means for solving the problem

[0008] The first of the present invention is a method for producing an ultrathin copper foil laminate film, which is produced by the following step (A) or step (B), Is the way

• Process (A)

(1) Ultra-thin copper-clad laminate film with carrier foil obtained by laminating an ultra-thin copper foil with a carrier foil and a film First step to remove the carrier foil,

(2) After removing the carrier foil in the first step, a second step (A) is performed in which the copper surface is subjected to a fouling treatment after a short time during which the copper surface is not oxidized.

• Process (B)

(2) After removing the carrier foil in the first step, if the copper surface is oxidized, the second step (B) to remove the acid part of the copper surface,

(3) After removing the acid oxide portion in the second step (B), a third step (B) is performed in which the copper surface is further subjected to antifouling treatment within a short time during which the copper surface is not oxidized.

[0009] In the second aspect of the present invention, when the ultra-thin copper foil laminated film is shipped, the ultra-thin copper foil laminated film is enclosed in the packaging bag after performing the following step (A) or step (B). And transporting the ultrathin copper foil laminated film.

• Process (A) (1) Ultra-thin copper-clad laminate film with carrier foil obtained by laminating ultra-thin copper foil with carrier foil and film First step to remove carrier foil,

• Process (B)

(1) Ultra-thin copper-clad laminate film with carrier foil obtained by laminating ultra-thin copper foil with carrier foil and film First step to remove carrier foil,

The invention's effect

[0010] Since the present invention removes the carrier foil in advance and performs the antifouling treatment on the copper foil surface,

1) Lightweight and easy to transport, reducing the possibility of danger to workers,

2) When processed to the same winding width, longer ultrathin copper foil laminated film can be handled,

3) Long-term storage is possible,

An ultra-thin copper foil laminated film in which a long ultra-thin copper foil is laminated with a heat-resistant film can be produced.

BEST MODE FOR CARRYING OUT THE INVENTION

[0011] An example of a method for producing an ultrathin copper foil laminated film is shown as step (A) or step (B).

• Process (A) is shown below.

(1) Ultra-thin copper-clad laminated film with carrier foil The first step of removing the carrier foil and then pickling, washing with water and drying if necessary,

(2) After removing the carrier foil in the first step, after the copper surface is not oxidized for a short period of time, the copper surface is subjected to an anti-fouling treatment, further washed with water if necessary, and then dried. A),

• Process (B) (1) Ultra-thin copper-clad laminated film with carrier foil The first step of removing the carrier foil and then pickling, washing with water and drying if necessary.

(2) After removing the carrier foil in the first step, when the copper surface is oxidized, the oxidized portion of the copper surface is removed, further washed with water if necessary, and dried (B),

(3) After removing the acid part in the second step (B), the copper surface is further subjected to antifouling treatment within a short time that the copper surface is not oxidized, and further washed with water if necessary and dried. And performing the third step (B).

[0012] In the method for producing an ultra-thin copper foil laminated film, because the step (A) is a simpler method with fewer steps than the step (B), it is preferable to use a laminated copper foil acid oxide, etc. The removal process does not affect the copper foil. However, if the copper surface is oxidized as a result of removing the carrier foil in the first step, it is preferable to adopt the step (B). Examples of possible oxidation of copper on the surface of the copper include the case where the fouling treatment cannot be performed quickly after the removal of the carrier foil, or the case where the oxidation is unavoidable in the process employed when removing the carrier foil. In some cases, it is not possible to avoid oxidation on the copper surface due to the treatment of the copper foil laminated film. In some cases, the received ultrathin copper foil with carrier foil is first oxidized. U, prefer to adopt (B).

[0013] A method for producing an ultrathin copper foil laminated film will be described.

[0014] After the first step of the step (A) and the step (B), as a method for removing the carrier foil, a known method can be used as the method for removing the carrier foil. Ultra-thin copper-clad laminated film force with a foil The method of peeling off a carrier foil, the ultra-thin copper-clad laminated film force with a carrier foil, and the method of removing a carrier foil by etching, etc.

[0015] As an etching method for removing the carrier foil in the first step of the step (A) and the step (B) by etching, a known etching method can be used, and the surface strength of the carrier foil can be reduced to the thickness of the carrier foil. The carrier foil can be removed by etching with an aqueous iron chloride solution or an ammonium persulfate aqueous solution.

[0016] In the second step (A) and the third step (B), a known method can be used as a method for carrying out an antifungal treatment on the copper surface, for example, benzotriazole, benzothiazole, tolyltriazole, alkyl Organic fenders using imidazole, benzylimidazole, etc., An inorganic fender using zinc, chromate, zinc alloy, or the like can be used.

In the second step (B), when the copper surface is oxidized by removing the carrier foil in the first step, it is necessary to remove the oxidized portion on the copper surface. As a method for removing the oxidized portion on the copper surface, a known method can be used. For example, pickling with a solution such as a hydrochloric acid solution, a sulfuric acid solution, a sulfuric acid hydrogen peroxide solution, an acidic chelate aqueous solution, or the like. The method of washing with can be used.

[0018] As a method of washing with water in each of the above steps, or washing with water and drying, a known method can be used.

[0019] An example of a method for continuously producing an ultrathin copper foil laminated film from a copper foil with a carrier and a heat resistant film will be described.

[0020] Using a copper foil with a carrier foil and a heat-resistant film using a pressure member, such as a metal roll, preferably a double belt press,

(1) Laminate a copper foil with a long carrier foil, a long polyimide film with a thermocompression-bonding polyimide layer on one or both sides, and a reinforcing material as necessary (thermocompression-bonding on both sides) (When using polyimide with a polyimide layer, use copper foil with carrier on both sides), preferably at about 150 to 250 ° C, especially higher than 150 ° C and lower than 250 ° C in-line immediately before introduction. Preheat using a preheater such as a hot air supply device or an infrared heater so that it can be preheated for about 2 to 120 seconds, and then use a pair of crimping rolls or a double belt press to heat and press a pair of crimping rolls or a double belt press. The temperature of the zone is at least 20 ° C higher than the glass transition temperature of the thermocompression bonding polyimide, in the temperature range of 400 ° C, especially in the temperature range of 30 ° C higher than the glass transition temperature to 400 ° C, Thermocompression bonding under pressure However, particularly in the case of a double belt press, it is subsequently cooled under pressure in a cooling zone, preferably at least 20 ° C lower than the glass transition temperature of the thermocompression bonding polyimide, particularly at least 30 ° C lower. A process for producing a copper-clad laminated polyimide film with a carrier foil on one or both sides of a roll by cooling to temperature, laminating and winding up into a roll,

(2) The process of removing the carrier foil from the copper-clad laminated polyimide film with carrier foil, and further pickling, washing with water and drying if necessary,

(3) By removing the carrier foil in the first step, the copper surface is not oxidized for a short time. At the same time, the copper surface is subjected to an antifouling treatment, followed by washing with water and drying as necessary.

[0021] The carrier foil is not particularly limited in material, but any material that can be bonded to the ultrathin copper foil and has a role of reinforcing and protecting the ultrathin copper foil, for example, an aluminum foil, Copper foil, grease foil with a metal coating on the surface, and the like can be used.

[0022] The thickness of the carrier foil is not particularly limited, but is generally preferably 1 to 200 / zm thick, and is generally preferred to be thicker than ultrathin copper foil, especially 5 to: LOO / zm preferable.

[0023] The carrier foil only needs to be used in such a form that it is planarly bonded to an ultrathin copper foil. In the case of an electrolytic copper foil with a carrier foil, since the copper component that becomes the electrolytic copper foil is electrodeposited on the surface of the carrier foil, the carrier foil needs to have at least conductivity.

[0024] The electrolytic copper foil with carrier foil flows through a continuous manufacturing process, and maintains the state of being joined to the electrolytic copper foil layer at least until the end of the production of the copper clad laminate, thereby facilitating handling. The carrier foil has a role of reinforcing and protecting the electrolytic copper foil in every sense, and therefore the carrier foil needs to have a predetermined strength. If these conditions are satisfied, it can be used as a “carrier foil”, and generally a metal foil is assumed, but it means a concept including a conductive film and the like.

[0025] Copper foils with carrier foils can generally be broadly classified into bearable types and etchable types. In short, the bearable type is a type in which the carrier foil is peeled off and removed after press molding. The etchable type is a type in which the carrier foil is removed by etching after press molding. Is.

[0026] As the ultrathin copper foil, a thin copper foil that can be used by being laminated with a carrier foil is used, and this copper foil can be prepared by a known method using the power of electrolysis as described above.

[0027] The thickness of the ultrathin copper foil may be any thickness as long as it is a copper foil with a carrier foil! /, But is preferably in the range of 0.1 μm to 8 μm! / ,.

[0028] An ultra-thin copper-clad laminate film with a carrier foil is

1) A heat-resistant film having thermocompression bonding or adhesiveness and a copper foil with a carrier foil bonded together in a pressurized state or a pressurized heating state, 2) Copper with a known carrier foil, such as a copper foil with a carrier foil that has thermocompression bonding or adhesion on the surface of the copper foil and a heat-resistant film bonded together in a pressurized or heated state. What laminated | stacked foil and a heat resistant film can be used.

[0029] Examples of the heat resistant film include polyimide, aramid, polyphenylene oxide, wholly aromatic polyester, epoxy resin, cyanate ester resin, phenol resole resin, wholly aromatic polyester resin, PPE -Renether) resin, bismaleimide triazine resin, fluorine resin, and the like, and a non-woven fabric of fibers such as glass fiber, polyimide fiber, and aramid fiber can be used.

[0030] The thickness of the film may be designed according to the purpose of use.

[0031] The ultra-thin copper foil laminated film produced in the present invention is prepared by enclosing the ultra-thin copper foil laminated film in a packaging bag when shipping the ultra-thin copper foil laminated film. The inert gas can be filled and sealed, and the ultra-thin copper foil laminated film can be packed, transported and shipped. The packing can be made of a resinous resin bag or a resinous film that can wrap a sheet or roll of an ultrathin copper foil laminated film. As the resin for packaging, known ones can be used. For example, the ultrathin copper foil laminated film should not be damaged, and the acidity of the ultrathin copper foil laminated film is poor as a substrate. It is preferable to have such characteristics.

[0032] The ultrathin copper foil laminated film produced in this way is suitably used for the production of electric circuit boards and the like. That is, in the method of manufacturing an electric circuit board, after receiving the ultra-thin copper foil laminated film manufactured by the process as described above and possibly shipped and transferred, preferably from the copper foil surface of the ultra-thin copper foil laminated film. Then, the antifouling film covering the copper surface is removed by the above-described antifouling treatment.

[0033] The removal of the antifouling film can be carried out by a known method depending on the method of the antifouling treatment, but in the case of organic antifouling, washing with an acidic solution (for example, sulfuric acid, hydrochloric acid, etc.) In this case, mechanical surface preparation, electrolytic degreasing, cleaning by microetching, etc. are used.

[0034] The ultra-thin copper foil laminated film from which the protective film has been removed is then processed in the same manner as when the ultra-thin copper-clad laminated film is received with the carrier foil attached to the printed circuit board, COF (Ch ip on Film) substrate, TAB (Tape Automated Bonding) substrate, etc. Can be manufactured.

Example

[0035] In the method for producing an ultra-thin copper foil laminated film, YSNAP-3B or YSNAP-5B manufactured by Nihon Electrolytic Co., Ltd. was used as a copper foil with a carrier, using a core with an outer diameter of 176 mm and a weight of 3.2 kg. Using a heat-resistant polyimide film with a pressure-bonding polyimide layer, Ube Industries Co., Ltd. In the case of manufacturing a laminated film, the weight reduction rate and the diameter reduction rate when the carrier foil is removed are calculated, and the results are shown in Table 1.

[0036] From Table 1, by removing the carrier foil from the copper foil laminated film with the carrier foil, a reduction effect of about 50 to 80% by weight and about 8 to 25% by diameter is recognized.

[0037] [Table 1]

[0038] (Performance experiment example)

Using ultra-thin copper foil laminate film, YSNAP-3B made by Nippon Electrolytic Co., Ltd. as a copper foil with carrier, and using Ube Industries Upilex 50VT, a heat-resistant polyimide film with a thermocompression-bonding polyimide layer on both sides Temperature: 330 ° C, Crimping pressure: 40kgZcm ² , Crimping time: Using a double-belt press copper foil layered heat-resistant film manufactured with a double belt press, the carrier foil is removed, and the presence or absence of antifouling treatment The discoloration of the copper foil due to long-term storage was investigated.

[0039] Immediately after peeling off the carrier foil from the copper foil laminated heat-resistant film with carrier (copper foil surface Chromate treatment was performed on the copper surface within a short period of time during which no oxidation occurred, and an anti-thin copper foil laminated film (A) was obtained.

[0040] Immediately after the carrier foil is peeled off from the copper foil laminated heat-resistant film with a carrier (within a short time when the copper foil surface is not oxidized), the copper surface is treated with benzotriazole for anti-corrosion treatment. A copper foil laminated film (B) was obtained.

[0041] The carrier foil was peeled off from the copper foil laminated heat-resistant film with a carrier to obtain an ultrathin copper foil laminated film (C) that was not subjected to a fouling treatment on the copper surface.

[0042] Ultrathin copper foil laminated film (A), ultrathin copper foil laminated film (B), and ultrathin copper foil laminated film

(C) is left in an atmosphere at a temperature of 25 ° C and a humidity of 60% for one month, and the discoloration of the copper foil surface is visually observed.

¾πί.

[0043] The ultrathin copper foil laminated film (Α) and the ultrathin copper foil laminated film (Β) do not show any discoloration of the copper foil, but the ultrathin copper foil laminated film (C) has a discolored copper foil. It was.

[0044] Using the ultra-thin copper foil laminated film (Α) and the ultra-thin copper foil laminated film (Β) after storage, the anti-mold agent is removed from these ultra-thin copper foil laminated films, washed with water and dried to obtain a copper thickness. A copper-plated copper foil laminated film was produced in which copper plating was performed so that the thickness of the film was 18 μm. The antifungal agent was removed by cleaning by microetching for the ultrathin copper foil laminated film (A) and by washing with sulfuric acid for the ultrathin copper foil laminated film (B).

[0045] When the peel strength between the copper foil and the film of the obtained copper-plated copper foil laminated film (stretching speed 50 mm, 90 ° pinole (in accordance with JIS .C6471)) was determined, the pinole strength 1.3 to 1. Te with 4N Z mm.

[0046] A copper-plated copper foil laminated film (D) was prepared by peeling the carrier foil from the copper foil-laminated heat-resistant film with a carrier and immediately copper-plating so that the copper thickness became 18 μm. The peel strength between the rums (tensioning speed 50mm, 90 ° peel (conforming to JIS C6471) was measured, and the peel strength was 1.3 to 1.4NZmm.

Claims

Claims [1] Step (A), that is, (1) Ultrathin copper-clad laminate film with carrier foil obtained by laminating an ultrathin copper foil with carrier foil and a film, a first step of removing carrier foil, And (2) a step (A) or a step having a second step (A) of performing anti-fouling treatment on the copper surface within a short time after the copper foil is not oxidized after removing the carrier foil in the first step. (B), that is, (1) Ultrathin copper-clad laminated film force with carrier foil obtained by laminating an ultrathin copper foil with carrier foil and a film, a first step of removing the carrier foil, (2) the first step above If the copper surface is oxidized after removing the carrier foil by the second step (B) of removing the acid part on the copper surface, and (3) the acid part by the second step (B). After the removal of copper, the third work is carried out on the copper surface within a short time when the copper surface is not oxidized. Method for manufacturing ultra-thin copper foil laminated film having a step (B) with (B). [2] The method according to [1], wherein the produced ultrathin copper foil laminated film is a roll-like long ultrathin copper foil laminated film. [3] A method for shipping and transporting an ultra-thin copper foil laminated film comprising the steps (A), that is,

(1) Ultra-thin copper-clad laminated film force with carrier foil obtained by laminating an ultra-thin copper foil with carrier foil and a film, a first step of removing the carrier foil, and

(2) Second step of performing antifouling treatment on the copper surface within a short time after the copper foil is not oxidized after removing the carrier foil in the first step (A)

(A) having the steps

Or

Step (B), ie (1) Ultra thin copper foil with carrier foil obtained by laminating an ultra thin copper foil with a carrier foil and a film The first step of removing the carrier foil,

(2) After removing the carrier foil in the first step, if the copper surface is oxidized, the second step (B) for removing the oxidic part of the copper surface, and

(3) The third step (B) in which the copper surface is further subjected to the anti-fouling treatment within a short time after the acid oxide portion is removed in the second step (B) and the copper surface is not oxidized.

Step (B) having

After that, the method for transporting an ultra-thin copper foil laminated film is characterized in that the ultra-thin copper foil laminated film is enclosed in a packaging bag, packed, and transported.

[4] The method according to [3], wherein the ultrathin copper foil laminated film to be transferred is a roll-like long ultrathin copper foil laminated film.

[5] A step of accepting the ultrathin copper foil laminated film produced according to claim 1 or 2, and a step of removing the antifouling film from the copper foil surface of the ultrathin copper foil laminated film;

A method of manufacturing an electric circuit board having

[6] receiving the ultra-thin copper foil laminated film transferred in the state of being packed according to claim 3 or 4, and

Removing the antifouling film from the copper foil surface of the ultrathin copper foil laminated film;

The manufacturing method of the electric circuit board which has this.