WO2016143484A1

WO2016143484A1 - Metal foil with carrier, and manufacturing method for wiring board

Info

Publication number: WO2016143484A1
Application number: PCT/JP2016/054851
Authority: WO
Inventors: 哲聡 ▲高▼梨; 浩人飯田; 吉川　和広
Original assignee: 三井金属鉱業株式会社
Priority date: 2015-03-12
Filing date: 2016-02-19
Publication date: 2016-09-15
Also published as: KR20170127414A; WO2016143117A1; CN107249876A; TW201644330A; JPWO2016143484A1

Abstract

A metal foil (10) with a carrier has a carrier (11), an ultrathin metal foil layer (12), and a release layer (13) located therebetween. The release layer (13) has a thickness of 1 nm to 1 μm. The carrier (11) has extension parts (111a, 111b) that extend from at least a portion of the outer edge of the ultrathin metal foil layer (12). A surface protection layer is preferably provided to a surface located on the ultrathin metal foil layer side among the extension parts (111a, 111b). The surface protection layer is preferably formed from an extending section of the release layer (13). The surface protection layer is preferably formed from a layer containing an anti-rust agent. The difference ΔGs in glossiness between the surface of the ultrathin metal foil layer (12) and the surface of the extension parts (111a, 111b) at an incident angle of 60°, as measured in accordance with JIS Z8741-1997, is preferably at least 30.

Description

Metal foil with carrier and method for manufacturing wiring board

The present invention relates to a metal foil with a carrier. Moreover, this invention relates to the manufacturing method of the wiring board using the copper foil with a carrier.

Various techniques for manufacturing a thin build-up wiring board having no core layer (hereinafter also referred to as “coreless build-up board”) using a metal foil with a carrier are known. For example, Patent Document 1 proposes a circuit-forming support substrate (hereinafter referred to as a support) in which an insulating resin layer, such as a prepreg, is bonded to a carrier foil surface of an ultrathin copper foil with a carrier foil. . In this document, pattern electrolytic copper plating is performed on an ultrathin copper foil in the support to form a first wiring conductor; a second insulating resin is disposed so as to be in contact with the first wiring conductor. A non-through hole reaching the first wiring conductor is formed in the second insulating resin, and the inner wall of the non-through hole is subsequently connected by electrolytic copper plating or electroless copper plating. A coreless build-up wiring board is manufactured by forming a conductor; and then peeling off the carrier foil and the ultrathin copper foil.

In the method for manufacturing a wiring board described in Patent Document 2, a multilayer metal foil in which a first carrier metal foil, a second carrier metal foil, and a base metal foil are laminated in this order is prepared, and the base metal foil side of the multilayer metal foil is prepared. And a prepreg as a base material are laminated to form a support. Next, the first carrier metal foil is physically peeled between the first carrier metal foil and the second carrier metal foil of the multilayer metal foil. Then, first pattern plating is performed on the second carrier metal foil remaining on the core substrate. Furthermore, an insulating layer and a conductor layer are sequentially laminated on the second carrier metal foil including the first pattern plating to form a laminate having a build-up layer. Next, between the second carrier metal foil and the base metal foil of the multilayer metal foil, the laminate is physically separated from the support together with the second carrier metal foil and separated. Finally, an etching resist is formed on the second carrier metal foil of the peeled laminate, and etching is performed to form a three-dimensional circuit on the first pattern plating or the insulating layer.

JP 2005-101137 A JP 2012-094840 A

In the techniques described in these documents, after forming a support using a metal foil with a carrier and a prepreg, the support is formed in the process of manufacturing a coreless buildup substrate on which a buildup layer is formed. A process of carrying is required. In this conveyance process, the operation | movement which hold | grips the copper foil with a carrier exposed to the support body surface is performed. For example, in the pressing process for forming the support or the process for forming the wiring layer on the support, the gripping work is performed by manual gripping, gripping by the fork or suction pad of the substrate transfer robot, or by a conveyor roll. There are various types such as gripping and gripping by slit conveyance. At this time, there is a possibility that damage such as tearing may occur in the metal foil which is a thin layer due to the contact operation by the gripping. As a result, the metal foil and the carrier are affected by chemicals entering the interface between the metal foil and the carrier during the build-up layer manufacturing process, and damage caused by the mechanical impact of the support end surface during the transport process. Inconveniences such as interfacial peeling may occur. It has been found that such inconvenience leads to an increase in defective pieces of the target wiring board and causes a reduction in the production efficiency of the wiring board.

Accordingly, an object of the present invention is to improve a metal foil with a carrier and to improve a method for producing a wiring board using the same. More specifically, when forming a support, the metal foil with a carrier has good handling properties such as conveyance. And it is providing the manufacturing method of a wiring board using the same.

The present invention is a metal foil with a carrier having a carrier, an ultrathin metal foil layer, and a release layer located between them,
The release layer has a thickness of 1 nm to 1 μm,
The carrier solves the above-mentioned problems by providing a metal foil with a carrier having an extended portion extending from at least a part of the outer edge of the ultrathin metal foil layer.

Further, the present invention is a method for manufacturing a wiring board using the metal foil with a carrier,
The above-described problems are solved by providing a method of manufacturing a wiring board having a step of gripping the extended portion of the metal foil with a carrier.

Fig.1 (a) is a top view which shows one Embodiment of metal foil with a carrier of this invention, FIG.1 (b) is a top view which shows another embodiment of metal foil with a carrier of this invention. . 2A is a cross-sectional view taken along line bb in FIGS. 1A and 1B, and FIG. 2B is a cross-sectional view taken along line bb in FIGS. 1A and 1B. It is another form of line sectional drawing. 3 (a) to 3 (c) are schematic views showing a production process of a support using the metal foil with a carrier shown in FIG. 4 (a) to 4 (d) are schematic views showing a process for manufacturing a wiring board with a carrier using the metal foil with a carrier shown in FIG. 1 and a metal foil with a carrier as shown in FIG. 3 (c). It is. 5 (a) to 5 (c) are schematic diagrams showing a manufacturing process of a wiring board by a support using the metal foil with a carrier shown in FIG. 1 as a continuation of FIG. 4 (d). 6 (a) to 6 (e) are schematic views showing a manufacturing process of a wiring board using the metal foil with a carrier shown in FIG. 1 and a support using the metal foil with a carrier as shown in FIG. 5 (c). FIG.

Hereinafter, the present invention will be described based on an example of a preferred embodiment with reference to the drawings. FIG. 1A shows a plan view of an embodiment of the metal foil with a carrier of the present invention. FIG.1 (b) is a top view of another embodiment of the metal foil with a carrier of this invention. 2A is a cross-sectional view taken along the line cc in FIGS. 1A and 1B. As shown in FIGS. 1A and 1B and FIG. 2A, the metal foil 10 with a carrier of this embodiment includes a carrier 11 and an ultrathin metal foil layer 12. The carrier 11 is provided to be peelable from the ultrathin metal foil layer 12. For this purpose, the metal foil 10 with a carrier has a release layer 13 located between the carrier 11 and the ultrathin metal foil layer 12.

<Metal foil with carrier>
The ultrathin metal foil layer 12 in the metal foil with carrier 10 has a pair of sides facing each other in plan view. The peeling layer 13 positioned between the ultrathin metal foil layer 12 and the carrier 10 can be formed so that they are completely overlapped with each other when viewed from the ultrathin metal foil layer 12. In that case, the release layer 13 has the same shape and dimensions as the ultrathin metal foil layer 12. However, the shape of the release layer 13 is not limited to this, and may be extended from at least a part of the outer edge of the ultrathin metal foil layer 12 in plan view of the metal foil 10 with a carrier, as will be described later.

The ultrathin metal foil layer 12 having a quadrilateral shape in plan view has a pair of first

outer edges

12a, 12a facing each other and a pair of second

outer edges

12b, 12b facing each other. The pair of first

outer edges

12a and 12a may be parallel to each other or may not be parallel to each other. The same applies to the pair of second

outer edges

12b, 12b. The pair of first

outer edges

12a, 12a may have the same length or may be different. The same applies to the pair of second

outer edges

12b, 12b.

In the metal foil 10 with a carrier of the embodiment shown in FIG. 1 (a), when viewed in plan, the carrier 11 has a first outer edge 12a and a second outer edge 12b which are outer edges of the ultrathin metal foil layer 12. It extends from the whole area. The carrier 11 has a quadrilateral shape in plan view, and has a pair of first

outer edges

11a and 11a facing each other and a pair of second

outer edges

11b and 11b facing each other. The first outer edge 11 a of the carrier 11 is substantially parallel to the first outer edge 12 a of the ultrathin metal foil layer 12. Similarly, the second outer edge 11 b of the carrier 11 is substantially parallel to the second outer edge 12 b of the ultrathin metal foil layer 12. That is, the carrier 11 has a quadrilateral shape having four sides substantially parallel to the four sides of the ultrathin metal foil layer 12 in plan view. Thereby, the carrier 11 has a pair of first extending portions 111a extending from the outer edge of the ultrathin metal foil layer 12 and facing each other, and a pair of second extending portions 111b facing each other in plan view. . Each extending

part

111a, 111b has a long quadrilateral shape in one direction. Each extending

part

111a, 111b improves the handleability of the end part of the metal foil 10 with a carrier, for example, the handling property in the transport process when the support is formed, and further, in the process of the later build-up layer It is formed for the purpose of forming a sealed region in which the interface between the carrier 11 and the ultrathin metal foil layer 12 can be sealed with an insulating resin over four sides. For this purpose, the ultrathin metal foil layer 12 preferably has a quadrilateral shape such as a rectangle.

In the metal foil 10 with a carrier according to the embodiment shown in FIG. 1A, when the extending

portions

111a and 111b and the ultrathin metal foil layer 12 are viewed in cross section along their thickness directions, the extending portions are provided. The end portions of 111a, 111b and the ultrathin metal foil layer 12 may be stepped shapes having different planes as shown in FIG. Alternatively, although not shown, the

extended portions

111a and 111b may be sloped, and the end of the ultrathin metal foil layer 12 may be formed on a plane continuous with the slope.

On the other hand, in the embodiment shown in FIG. 1B, the ultrathin metal foil layer 13 has a quadrilateral shape in plan view, and the carrier 11 extends at least from a pair of opposing sides in the ultrathin metal foil layer. It has a pair of

extended portions

111a and 111a.

<Career>
The carrier 11 is used as a member that supports the ultrathin metal foil layer 12 in order to improve the handleability of the ultrathin metal foil layer 12 that is a thin member. The material constituting the carrier 11 is not particularly limited. For example, a copper foil, a copper alloy foil, an aluminum foil, a composite metal foil in which a metal plating layer such as copper or zinc is provided on the surface of the aluminum foil, a stainless steel foil, etc. Metal foil can be used. In addition, a resin film such as a PET film, a PEN film, an aramid film, a polyimide film, a nylon film, and a liquid crystal polymer, a metal-coated resin film having a metal coating layer on the resin film, a glass plate, a ceramic plate, and the like. Among them, a metal foil is preferable from the viewpoint of preventing foreign matter from being entrained by static electricity that may occur during handling, and a copper foil is preferable from the viewpoint of uniformity of thickness and corrosion resistance of the foil. The thickness of the carrier 11 is typically 250 μm or less, preferably 12 μm or more and 200 μm or less, provided that it is larger than the thickness of the ultrathin metal foil layer 12.

<Peeling layer>
The peeling layer 13 weakens the peeling strength of the carrier 11, ensures the stability of the strength, and further may occur between the carrier 11 and the ultrathin metal foil layer 12 during press molding at a high temperature. It is a layer having a function of suppressing diffusion. In the embodiment shown in FIG. 1, the release layer 13 is formed only on one surface of the carrier 11, but may be formed on both surfaces of the carrier 11 as necessary. The release layer 13 may be either an organic release layer or an inorganic release layer. Examples of organic components used in the organic release layer include nitrogen-containing organic compounds, sulfur-containing organic compounds, carboxylic acids and the like. Examples of nitrogen-containing organic compounds include triazole compounds, imidazole compounds, and the like. Among these, triazole compounds are preferable in terms of easy release properties. Examples of triazole compounds include 1,2,3-benzotriazole, carboxybenzotriazole, N ′, N′-bis (benzotriazolylmethyl) urea, 1H-1,2,4-triazole and 3-amino-1H. -1,2,4-triazole and the like. Examples of the sulfur-containing organic compound include mercaptobenzothiazole, thiocyanuric acid, 2-benzimidazolethiol and the like. Examples of the carboxylic acid include monocarboxylic acid and dicarboxylic acid. On the other hand, examples of inorganic components used in the inorganic release layer include at least one of Ni, Mo, Co, Cr, Fe, Ti, W, P, Zn, and carbon, or an alloy thereof, and / or an oxide. Can be mentioned. By using these materials as the release layer, an extremely thin release layer can be formed. Due to this, for example, the surface area of the release layer exposed at the end of the extension site is reduced compared to the case where the release layer is formed by applying a pressure-sensitive adhesive. It becomes possible to strongly prevent chemicals from entering the interface between the metal foil and the carrier at the stage and the occurrence of a peeling start point due to mechanical impact.

When the release layer 13 is an organic release layer, the release layer 13 is formed by bringing the release layer component-containing solution into contact with at least one surface of the carrier 11 and fixing the release layer component to the surface of the carrier 11. Just do it. When the carrier 11 is brought into contact with the release layer component-containing solution, this contact may be performed by immersion in the release layer component-containing solution, spraying of the release layer component-containing solution, or flowing down of the release layer component-containing solution. On the other hand, examples of the method for forming the release layer 13 when the release layer 13 is an inorganic release layer include wet processes such as an electrodeposition method and an electroless plating method. In addition, for the formation of the release layer 13, a method of forming a release layer component by a vapor phase method such as vapor deposition (PVD), sputtering, or CVD can be employed regardless of organic or inorganic.

The thickness of the release layer 13 is typically 1 nm or more and 1 μm or less, preferably 2 nm or more and 500 nm or less, more preferably 2 nm or more and 100 nm or less. The thickness can be measured by employing a cross-sectional observation method, an area weight conversion method, or the like. The area weight conversion method is obtained by identifying the compound adhered as the release layer 13 and then measuring the adhesion weight per unit area by spectroscopic analysis or chromatography and dividing by the specific gravity of the compound. By setting the release layer 13 within this thickness range, the insulating layer is overlapped with a part of or all of the region where the ultrathin metal foil is formed and the carrier extension part in the build-up layer manufacturing stage described later. When laminated, it is possible to strongly prevent chemicals from entering the interface between the metal foil and the carrier at the stage of manufacturing the build-up layer and the occurrence of a separation starting point at the interface due to mechanical impact. Moreover, since the thickness of the release layer 13 is very thin and the step between the carrier extension portion and the surface of the ultrathin metal foil can be lowered, the surface of the end portion of the insulating layer in the buildup layer stacking stage It becomes possible to maintain the flatness significantly. The thickness of the release layer 13 can be controlled, for example, by adjusting the immersion time when the carrier 11 is immersed in the release layer component-containing solution, or by adjusting the spray amount when spraying the release layer component-containing solution onto the carrier 11. it can.

The peel strength between the release layer 13 and the carrier 11 is preferably 2 gf / cm or more and 50 gf / cm or less, more preferably 5 gf / cm or more and 30 gf / cm or less, and still more preferably 10 gf / cm or more and 20 gf / cm. cm or less.

If desired, another functional layer may be provided between the release layer 13 and the carrier 11 and / or the ultrathin metal foil layer 12. An example of such another functional layer is an auxiliary metal layer. The auxiliary metal layer is preferably made of nickel and / or cobalt. By forming such an auxiliary metal layer on the surface side of the carrier 11 and / or the surface side of the ultrathin metal foil layer 12, the carrier 11 and the ultrathin metal foil layer 12 can be formed during hot press molding for a long time or at a long time. Interdiffusion that may occur between the two is suppressed, and the stability of the peeling strength of the carrier 11 can be ensured. The thickness of the auxiliary metal layer is preferably 0.001 μm or more and 1 μm or less.

<Ultrathin metal foil layer>
The thickness of the ultrathin metal foil layer 12 in the carrier-attached metal foil 10 is, from the viewpoint of electroplating conductivity for a wiring pattern at the time of manufacturing a wiring board, which will be described later, and a fine line forming property when flash etching is performed after peeling the support. The thickness is preferably 0.1 μm or more and 10 μm or less, more preferably 0.2 μm or more and 8 μm, and still more preferably 1 μm or more and 5 μm or less. The ultrathin metal foil layer 12 is preferably made of a material having conductivity and etching processability by a chemical solution, and can be formed of a metal material such as copper, copper alloy, aluminum, zinc, nickel, tin, or stainless steel, for example. In particular, a copper foil or a copper alloy foil, particularly a copper foil can be suitably used from the viewpoint of low electrical resistance, excellent workability during circuit formation by etching or the like, and ease of subsequent wiring layer formation. . Examples of the method for producing the metal foil layer 12 include a sputtering method, a vapor deposition method, and an electrolytic method. From the viewpoint of batch productivity of the carrier 11 and the release layer 13, it is preferable to employ an electrolytic method.

The surface of the ultrathin metal foil layer 12 is preferably a rough surface. A rough surface is formed, and the glossiness between the surface of the ultrathin metal foil layer 12 and the surfaces of the

extended portions

111a and 111b of the carrier 10 is reduced by reducing the glossiness of the surface of the ultrathin metal foil layer 12. And the visibility of the

extended portions

111a and 111b of the carrier 10 is improved. The rough surface can be formed by an electrodeposition method, an etching method, a blast method, or a metal oxidation and reduction method. Among these, if the electrodeposition method is used, a uniform particulate metal can be deposited, and by adjusting the particle shape and particle size, it is possible to increase the range of glossiness. The surface roughness of the ultrathin metal foil layer 12 is represented by surface roughness Rz (JIS B0601-2013), preferably 0.1 μm or more and 5.0 μm or less, and 0.2 μm or more and 4.0 μm or less. More preferably it is.

Furthermore, in order to maintain the chemical stability of the surface and the adhesion to the resist for pattern formation described later, the surface of the ultrathin metal foil layer 12 (including the case of a rough surface) is used. In addition, a rust prevention layer or a coupling layer may be formed. Examples of the material for the rust prevention layer include metals or alloys made of at least one of Ni, Mo, Co, Cr, Fe, Ti, W, P, Zn, and the like, and / or oxides thereof. On the other hand, as a coupling layer, the film of a silane coupling agent is mentioned, for example. Examples of silane coupling agents include vinyl methoxy silane, vinyl phenyl trimethoxy silane, methacryloxy propyl trimethoxy silane, glycidoxy propyl trimethoxy silane, glycidyl butyl trimethoxy silane, imidazole silane, triazine silane, mercapto propyl trimethoxy. Examples include silane, aminopropyltriethoxysilane, aminopropyltrimethoxysilane, and the like.

<Surface protective layer>
In the first extension part 111a and / or the second extension part 111b described above, the surface located on the ultrathin metal foil layer 12 side among those faces, as shown in FIG. It is more preferable to provide the surface protective layer 14. The surface protective layer 14 is used to oxidize the surface located on the ultrathin metal foil layer 12 side in the first extension part 111a and / or the second extension part 111b of the carrier and hold the extension part by long-term storage. It is used for the purpose of protecting from oxidation caused by scratches and prevention of oxidation contamination from water droplets and oil droplets transferred from a holding jig or gloves. The surface protective layer 14 may be an inorganic protective layer or an organic protective layer, but an organic protective layer is preferable in order to prevent oxidative contamination more firmly.

As one form in which the surface protective layer 14 is an organic protective layer, a form in which the surface protective layer 14 is an extension portion of the release layer 13 described above can be given. Since the surface protective layer 14 can be formed simultaneously with the peeling layer 13 when the surface protective layer 14 is composed of an extended portion of the peeling layer 13, the manufacturing process of the metal foil 10 with a carrier is not complicated. Is advantageous. When the surface protective layer 14 is composed of the extended portion of the release layer 13, both are integrated, and thus the surface protective layer 14 and the release layer 13 are made of the same material.

On the other hand, as another form in the case where the surface protective layer 14 is an organic protective layer, a resin layer may be mentioned. Examples of the resin constituting the surface protective layer 14 include resin components such as acrylic resin, acetal resin, ethylene resin, epoxy resin, silicone resin, fluorine resin, imide resin, amide resin, amideimide resin, and styrene-butadiene copolymer. It is preferable that it is comprised. In particular, when the surface protective layer 14 is formed of a resin component, the oxidation resistance can be maintained predominately, and by selecting the coating method, for example, the corner of the extension portion is chamfered, and the extension site It is possible to freely design the shape of this. Note that these resins may appropriately contain a color pigment and an inorganic filler.

When the surface protective layer 14 is an inorganic protective layer, the surface protective layer 14 can be composed of a layer containing the above-described rust inhibitor, for example. The layer containing a rust preventive agent may be composed of, for example, a metal or alloy made of at least one of Ni, Mo, Co, Cr, Fe, Ti, W, P, Zn, and / or an oxide thereof. preferable. Among these, when the layer containing the rust preventive agent is composed of at least one metal or alloy selected from the group consisting of Ni, Cr and Zn, and / or an oxide thereof, the extended portion and the ultrathin metal This is particularly preferable because visibility with the foil surface is improved.

Even if the surface protective layer 14 is in any of the forms described above, the thickness thereof is 1 nm or more in terms of preventing breakage due to the gripping of the extended portion and preventing spread of the spread width in the coating process or the like. It is preferably 10 μm or less, more preferably 2 nm or more and 5 μm or less, still more preferably 2 nm or more and 1 μm or less, particularly preferably 2 nm or more and 500 nm or less, and 2 nm or more and 50 nm or less. Most preferred.

<Visibility of the extended part>
From the viewpoint of enhancing the visibility of the first extending portion 111a and / or the second extending portion 111b when the metal foil with carrier 10 is viewed from the ultrathin metal foil layer 12 side, the ultrathin metal foil layer 12 is used. The difference ΔGs in glossiness at an incident angle of 60 ° between the surface of the first extending portion 111a and / or the surface of the second extending portion 111b located on the ultrathin metal foil layer 12 side is: It is preferable that it is 30 or more. The visibility mentioned here includes not only visibility with the naked eye but also visibility with an optical device. When ΔGs is within this range, when the support is formed using the metal foil with carrier 10 and the prepreg and the wiring board is manufactured, the first extending portion 111a of the metal foil with carrier 10 and / or The position of the second extension part 111b is not only clearer with the naked eye, but is also clearer when various optical devices are used, and the gripping operation of these

extension parts

111a and 111b is surely performed. Can do. From the viewpoint of making this advantageous effect more remarkable, ΔGs is more preferably 35 or more, and further preferably 40 or more. There is no particular limitation on the upper limit value of ΔGs, and the higher the value, the better. However, when the value is as high as 90, the above-described effects are sufficiently achieved.

The glossiness is measured using a commercially available gloss meter according to “Specular Glossiness—Measurement Method” of JIS Z8741-1997. The incident angle is 60 °. As the gloss meter, for example, PG-1M manufactured by Nippon Denshoku Industries Co., Ltd. can be used. The surface glossiness measured according to JIS Z8741-1997 means that the greater the value, the higher the degree of gloss. In the present invention, if the difference ΔGs in glossiness is equal to or greater than the above value, the visibility of the

extended portions

111a and 111b is sufficiently enhanced. At this time, the magnitude relationship between the glossiness of the ultrathin metal foil layer 12 and the surface glossiness of the first extension portion 111a and / or the second extension portion 111b is not particularly limited. As a method for adjusting the surface glossiness of the first extension part 111a and / or the second extension part 111b, for example, a method for changing the surface roughness of the carrier by etching, electrolytic method, blasting, polishing, etc. The method of adjusting also with the material of the protective layer 14, thickness, etc. is mentioned. In particular, in order to set ΔGs to be equal to or greater than the above value, the above-described surface protective layer 14 may be formed in the first extending portion 111a and / or the second extending portion 111b with a thickness in the above-described range. It is advantageous. Further, the surface glossiness of the ultrathin metal foil layer 12 can be adjusted by a surface treatment similar to the treatment applied to the carrier.

The surface glossiness (Gs-e) of the first extension part 111a and / or the second extension part 111b is preferably 30 or more and 600 or less, in view of the purpose of recognizing that it is a gripping part, and 50 or more. More preferably, it is 500 or less. On the other hand, the surface glossiness (Gs−t) of the ultrathin metal foil layer 12 is such that the glossiness difference ΔGs with respect to the extension portion is not less than a desired value, while maintaining a certain level of visibility, It is preferably 4 or more and 500 or less, more preferably 5 or more and 400 or less, from the viewpoint of preventing powder falling due to the rough surface.

According to the metal foil with carrier 10 having the above configuration, in the process of manufacturing a wiring board using the metal foil with carrier 10, a support is formed by laminating the metal foil with carrier and a prepreg, etc. When the metal foil 10 with a carrier is conveyed by holding the first extending portion 111a and / or the second extending portion 111b in the attached metal foil 10, the holding can be reliably performed. Since the ultrathin metal foil layer 12 does not exist in the first extension part 111a and / or the second extension part 111b, the first extension part 111a and / or the second extension part 111b is gripped. Thus, it is possible to effectively prevent contaminants from adhering to the ultrathin metal foil layer 12 and damage such as tearing to the ultrathin metal foil layer 12. In addition, by forming the first extension portion 111a and the second extension portion 111b as a resist-covered area of a so-called “embedded wiring layer”, the ultrathin metal foil layer 12 and the carrier 11 are formed at the time of forming the embedded wiring layer. It is possible to effectively prevent peeling due to the infiltration of the chemical solution between them.

Next, a support using the metal foil with a carrier of the present invention and a method for manufacturing a wiring board will be described taking the case of using the metal foil with a carrier 10 shown in FIGS. 1 and 2B as an example. First, as shown to Fig.3 (a), the metal foil 10 with a carrier is prepared. In the figure, the metal foil 10 with a carrier having the extending portion 111 of the carrier 11 only at a part of the outer edge of the ultrathin metal foil layer 12 is shown, but this is for convenience of explanation. As shown in FIG. 1, the extended portion may extend from the entire outer edge of the ultrathin metal foil layer 12.

<Support>
FIGS. 3B and 3C show a support formed by laminating the metal foil 10 with a carrier and the resin layer 15.
In the support, the resin layer 15 is laminated on the carrier 11 side of the metal foil with carrier 10, that is, on the non-formed surface of the ultrathin metal foil layer 12.
The metal foil formed on the support surface serves as a seed layer for forming the first wiring layer of the wiring board.
The support has a role of preventing warping, assisting in handling, and facilitating conveyance when forming a build-up layer that is a thin layer of the wiring board. In addition, after the buildup layer including the first wiring layer is formed, the support with the buildup layer includes the carrier 11 in close contact with the resin layer and the ultrathin metal foil layer 12 in close contact with the wiring substrate. Are separated and separated. That is, it is separated at the ultrathin metal thin layer 12 constituting the support and the release layer 13 between the carriers 11.
The resin layer 15 is laminated in a region overlapping with the ultrathin metal foil layer 12 and a region overlapping part or all of the extended portion 111 in a plan view of the metal foil with carrier 10. FIG. 3B shows a state in which the resin layer 15 is laminated in a region that overlaps with the entire extension portion 111.

The lamination of the metal foil with carrier 10 and the resin layer 15 may be performed in accordance with known conditions and techniques employed for the lamination of copper foil and prepreg in a normal printed wiring board manufacturing process. The resin layer 15 typically includes a resin, preferably an insulating resin. The resin layer 15 is preferably a prepreg and / or a resin sheet, more preferably a prepreg. The prepreg is a general term for composite materials in which a synthetic resin plate, a glass plate, a glass woven fabric, a glass nonwoven fabric, paper or the like is impregnated with a synthetic resin. Preferable examples of the insulating resin impregnated in the prepreg include an epoxy resin, a cyanate resin, a bismaleimide triazine resin (BT resin), a polyphenylene ether resin, and a phenol resin. Moreover, as an example of insulating resin which comprises a resin sheet, insulating resins, such as an epoxy resin, a polyimide resin, and a polyester resin, are mentioned. In addition, the resin layer 15 may contain filler particles made of various inorganic particles such as silica and alumina from the viewpoint of improving insulation. The thickness of the resin layer 15 is not particularly limited, but is preferably 3 μm or more and 1000 μm or less, more preferably 5 μm or more and 400 μm or less, and still more preferably 10 μm or more and 200 μm or less.

The support may be cut at a predetermined position as shown in FIG. 3 (c) as necessary before forming the first wiring layer. For example, as shown in FIG. 3 (c), the laminated body serving as the support body leaves the extending portion 111 located at the peripheral edge part, and extends the extending portion 111 and the resin layer 15 together in the thickness direction. Disconnected. By this cutting, an extension residual portion 111 ″ is formed in the laminated body. For example, when the size of the metal foil with carrier 10 is larger than the resin layer 15, the extension residual is obtained by performing the above-described cutting. The formation of the portion 111 ″ has an advantage that the ultrathin metal foil layer 12 is remarkably prevented from being turned over when the laminated body after cutting is held or transported.

<Manufacturing method of wiring board>
In this manufacturing method, not only the extension part 111 before cutting but also the extension residual part 111 "on the substrate side generated by the cutting may be used as a gripping part. From this viewpoint, the extension part 111 before cutting is used. The width W is preferably set to a value such that a sufficiently long extension residual portion 111 ″ is generated after cutting. From this point of view, the carrier 11 has a pair of first extending portions 111a and a pair of second extending portions 111b extending from the entire outer edge of the ultrathin metal foil layer 12 having a quadrilateral shape. As shown in FIG. 1A, the width W2 of the second extension part 111b is made larger than the width W1 of the first extension part 111a, and a part of the second extension part 111b is cut together with the resin layer. It is preferable to do. In addition to such a purpose, by setting the width W2 of the second extending portion 111b larger than the width W1 of the first extending portion 111a, for example, when the outer dimension of the metal foil 10 with a carrier is square, It becomes easy to identify the first extension part 111a and the second extension part 111b artificially or mechanically.

<Formation of wiring pattern>
Next, as shown to Fig.4 (a), the resist layer 16 is formed in the surface by the side of the ultra-thin metal foil layer 12 in a laminated body. The resist layer 16 is formed so that at least the exposed surface of the ultrathin metal foil layer 12 is covered, and preferably the surface on the ultrathin metal foil layer 12 side in the extended residual portion 111 ″ is also covered. By forming the resist layer 16 in this way, it is possible to reliably seal the end portion of the stacked body, and thus there is an advantage that a first wiring layer to be described later can be reliably formed.

When the resist layer 16 is formed, the resist layer 16 is subjected to pattern exposure as shown in FIG. 4B, and subsequently developed as shown in FIG. 4C. Thereby, a resist pattern 16 'is formed. The material for forming the pattern 16 ′ may be a negative resist or a positive resist. The resist may be either a film type or a liquid type. Examples of the light source for exposure include ultraviolet rays and electron beams. As the developer, sodium carbonate, sodium hydroxide, an amine-based aqueous solution, or the like can be used.

When the resist pattern 16 'is formed, copper plating 18 is applied to the surface of the resist pattern 16' as shown in FIG. The copper plating 18 can generally be formed by electroplating. The formation of the copper plating 18 is not particularly limited as long as it is performed using, for example, a copper sulfate plating solution, a copper pyrophosphate plating solution, or the like according to various pattern plating methods and conditions generally used for manufacturing a wiring board. As described above, since the end of the laminated body is sealed by the resist layer 16 (resist pattern 16 ′), the ultrathin metal foil layer 12 is less likely to be peeled off when the copper plating 18 is formed. .

After the copper plating 18 is formed, the resist pattern 16 ′ is peeled off to form a wiring pattern 20 as shown in FIG. The resist pattern 16 ′ is peeled off by using a sodium hydroxide aqueous solution, an amine-based solution or an aqueous solution thereof, and may be performed in accordance with various peeling methods and conditions generally used in the production of printed wiring boards. In this way, a wiring pattern in which wiring portions (lines) made of the first wiring layer 22 are arranged with a gap (space) therebetween is directly formed on the surface of the ultrathin metal foil layer 12. For example, for circuit miniaturization, highly refined wiring with a line / space (L / S) of 30 μm or less / 30 μm or less (for example, 30 μm / 30 μm, 20 μm / 20 μm, 5 μm / 5 μm) It is preferable to form a pattern.
In this way, the first wiring layer 22 is formed. The first wiring layer 22 may be subjected to a roughening process (not shown) according to a conventional method if necessary.

<Formation of build-up wiring layer>
In this manufacturing method, it is preferable to continue to form a buildup wiring layer to produce a laminate with a buildup wiring layer. The method for forming the build-up wiring layer is not particularly limited, and a subtractive method, an MSAP (Modified Semi-Additive Process) method, an SAP (Semi-Additive) method, a full additive method, or the like can be used. As an example, a forming method using the modified semi-additive method is shown below. Specifically, as shown in FIG. 5B, the insulating layer 24 is formed on the surface on the first wiring layer 22 side.

As shown in FIG. 5B, the insulating layer 24 overlaps with a region overlapping with the ultrathin metal foil layer 12 and a part or all of the extended portion 111 in the peripheral portion in plan view of the metal foil with carrier 10. It is preferable to be stacked in the region. By laminating the insulating layer 24 in this way, it becomes possible to reliably prevent the intrusion of the chemical solution in the build-up layer forming process.

Further, if necessary, a metal foil 30 with a carrier is laminated on the laminated insulating layer 24 as shown in FIG. The metal foil 30 with a carrier has a laminated structure of a carrier 31 and an ultrathin metal foil layer 32, and a release layer 33 is interposed between the two, and these members are the carrier described above. It can comprise from the material similar to the metal foil 10 with attachment. When laminating the metal foil 30 with a carrier on the insulating layer 24, the ultrathin metal foil layer 32 in the metal foil 30 with a carrier is laminated so as to face the insulating layer 24.

Next, after the carrier 31 is peeled from the metal foil 30 with the carrier, as shown in FIG. 6A, the ultrathin metal foil layer 32 and the insulating layer 24 positioned immediately below are subjected to perforation processing, and the first wiring layer 22 is formed. To expose. The perforation process can be performed by laser processing using, for example, a carbon dioxide laser, a UV-YAG laser, an excimer laser, or the like. Subsequently, patterning is performed by photoresist processing, electroless copper plating, electrolytic copper plating, photoresist stripping, flash etching, or the like to form the second wiring layer 34 as shown in FIG. 6B. This patterning can be repeated a plurality of times as necessary, whereby the nth wiring layer (n is an integer of 2 or more) can be formed.

As another method for forming the build-up layer after the second wiring layer 34, for example, when a metal foil typified by a resin layer and a copper foil is bonded together by press working at the same time, interlayer conduction such as via hole formation and panel plating is performed. In combination with the formation of the means, the panel plating layer and the metal foil can be etched to form a wiring pattern. When only the resin layer is bonded to the surface of the ultrathin metal foil layer 12 by pressing or laminating, a wiring pattern can be formed on the surface by a semi-additive method.

<Peeling of support and flash etching>
When the second wiring layer 34 and / or the build-up layer (not shown) after the second wiring layer 34 is formed in this way, the laminate is cut along the thickness direction as shown in FIG. A cutting step is performed. The cutting position of the laminate is preferably closer to the center side of the substrate than the carrier extension residual portion 111 ″ described above. When cutting is performed at such a position, the carrier shown in FIG. There is an advantage that peeling becomes easy in the peeling step of the support including 11. In the peeling step shown in Fig. 6 (d), the resin layer 15 is peeled together with the carrier 11. Subsequently, Fig. 6 (e) As shown in FIG. 2, the ultrathin metal foil layers 12 and 32 exposed between the wiring patterns of the first wiring layer 22 and between the wiring patterns of the second wiring layer 34 are removed by flash etching, thereby obtaining a target wiring board. .

As mentioned above, although this invention was demonstrated based on the preferable embodiment, this invention is not restrict | limited to the said embodiment. For example, in the embodiment, the shape of the carrier 11 and the ultrathin metal foil layer 12 in the metal foil with carrier 10 in a plan view is a quadrilateral, but the shape of these members is not limited to a quadrilateral.

Hereinafter, the present invention will be described in more detail with reference to examples. However, the scope of the present invention is not limited to such examples.

[Example 1]
In this example, a rectangular metal foil 10 with a carrier shown in FIGS. 1A and 2B was manufactured by the following procedures (1) to (6).
(1) Production of electrolytic copper foil for carrier A sulfuric acid copper sulfate solution is used as a copper electrolyte, a titanium electrode having a surface roughness Ra of 0.20 μm is used as a cathode, and a DSA (dimensional stability anode) is used as an anode. Was used for electrolysis at a solution temperature of 45 ° C. and a current density of 55 A / dm ² to obtain an electrolytic copper foil for carriers having a thickness of 12 μm. In the following description, the surface of the electrolytic copper foil for carrier that is processed in the steps described later is referred to as the “electrode surface side” that is in contact with the cathode during electrolysis, and is in contact with the electrolytic solution. The side is referred to as the “electrolyte surface side”.

(2) Formation of Organic Peeling Layer The electrode surface side of the pickled electrolytic copper foil for carrier was subjected to an aqueous solution containing 1000 mass ppm of CBTA (carboxybenzotriazole), 150 g / L of sulfuric acid and 10 g / L of copper. It was dipped at 30 ° C. for 30 seconds and pulled up. Thus, the CBTA component was adsorbed on the electrode surface side of the electrolytic copper foil for carrier, and the CBTA layer was formed as an organic release layer. The thickness of the release layer measured by the area weight conversion method was 3 nm.

(3) Formation of ultrathin copper foil layer Electroplating is carried out at an electric current density of 8 A / dm ^{2 in} an acidic copper sulfate solution on the electrode surface side of the electrolytic copper foil for carriers on which an organic release layer is formed. A 3 μm ultrathin copper foil layer was formed on the organic release layer.

(4) Roughening treatment Roughening treatment was performed on the ultrathin copper foil layer formed on the electrode surface side of the electrolytic copper foil for carrier by the following two-stage process. The first stage of the roughening treatment is electrolysis (current density 27 A / dm ² ) in a copper electrolytic solution for roughening treatment (copper concentration: 11 g / L, free sulfuric acid concentration: 220 g / L, solution temperature: 35 ° C.). This was done by washing with water. The second stage of the roughening treatment is electrolysis (current density: 21 A / dm ² ) in a copper electrolytic solution for roughening treatment (copper concentration: 69 g / L, free sulfuric acid concentration: 130 g / L, solution temperature: 52 ° C.). And then by washing with water.

(5) Rust prevention layer The rust prevention process which consists of an inorganic rust prevention process and a chromate process was performed on both surfaces of the copper foil after a roughening process. First, as an inorganic rust prevention treatment, a pyrophosphoric acid bath is used, potassium pyrophosphate concentration 80 g / L, zinc concentration 0.29 g / L, nickel concentration 2.9 g / L, liquid temperature 40 ° C., current density 0.5 A / dm. ^In Step ² , a rust-proofing treatment of zinc-nickel alloy was performed. Next, chromate treatment was performed, and a chromate layer was further formed on the zinc-nickel alloy rust prevention treatment. This chromate treatment was performed at a chromic acid concentration of 1 g / L, pH 11, a solution temperature of 25 ° C., and a current density of 1 A / dm ² .

(6) Carrier extension site | part formation process After cutting the said copper foil into a rectangle, it set | placed on the flat plate stage by making an ultra-thin copper layer into an upper surface, and the whole surface was vacuum-sucked. Then, in the state which exposed only the area | region of 20 mm from the edge part of one side of copper foil, it coat | covered with the stainless steel plate, and the polyimide tape with a silicone type adhesive was bonded only to the exposed part. After bonding, the polyimide tape with the ultrathin copper foil adhered is peeled off from the copper foil by pulling up the polyimide tape at a speed of 5 m / min, and a 20 mm wide extension with a release layer exposed at one end. The exit site was obtained. The same process was performed for the remaining three sides, and a metal foil 10 with a carrier provided with an extended portion in which the end portions of the four sides were covered with a release layer was obtained.

Thus, a metal foil 10 with a carrier shown in FIGS. 1 (a) and 2 (b) was obtained. In this metal foil 10 with a carrier, the organic peeling layer was also formed in the whole area of the surface on the ultrathin copper foil side in the extended portion. The gloss of the ultrathin copper foil (incident angle 60 °) in this metal foil with carrier 10 was 5, and the glossiness of the ultrathin copper foil side (incident angle 60 °) at the extended portion was 50. The difference in glossiness ΔGs between the two was 45. Due to the difference in glossiness between the two, the support laminated with the prepreg of the same size using the metal foil with carrier 10 had very good visibility of the extended portion. Moreover, the width W1 of the 1st extension site | part 111a was 20 mm, the width W2 of the 2nd extension site | part 111b was 20 mm, and the grip property by a suction pad was also favorable.

Further, after laminating the metal foil with carrier 10 and a prepreg of the same size as the metal foil with carrier 10 to form a support, the wiring layer shown in FIG. 5 is formed, and the build-up layer shown in FIG. After forming, the laminate was cut and the support including the carrier was peeled off. As a result, it was confirmed that the chemical solution did not enter from the end face at the interface between the carrier and the metal foil, and that the four sides were securely sealed.

[Example 2]
In this example, a metal foil 10 with a carrier whose extension part was covered with a protective layer made of an epoxy resin was prepared by the following procedure.
(1) Production of electrolytic copper foil for carrier The electrolytic copper foil for carrier was prepared in the same manner as in Example 1.
(2) Step of forming epoxy resin protective layer and extension site After shielding the inner region from the position 20 mm away from the outer edge of the electrolytic copper foil for carrier with a mask film, the transparent epoxy resin is dried to a thickness of 3 μm. Spray coated. Then, it was cured at 150 ° C. for 10 minutes in a drying furnace to obtain a copper foil provided with a surface protective layer formed by applying an epoxy resin to the region of the extended portion 20 mm from the outer edge.
(3) Organic release layer to antirust treatment For the copper foil, an organic release layer, an ultrathin copper foil layer, a roughening treatment layer, and an antirust layer were formed in the same manner as in Example 1 except for the step of forming the organic release layer. Formed. The organic release layer in this example was formed in the same manner as in Example 1 except that the immersion time was 90 seconds and the thickness of the release layer was 6 nm. A new film was not formed in the region covered with the protective layer made of epoxy resin, and a metal foil 10 with a carrier having an extended portion covered with the protective layer was obtained.

The glossiness (incident angle 60 °) of the ultrathin copper foil in this metal foil 10 with a carrier was 5, and the glossiness (incident angle 60 °) on the ultrathin copper foil side at the extended portion was 37. The difference in glossiness ΔGs between them was 32. Due to the difference in glossiness between them, in the support using the metal foil with carrier 10, the visibility of the extended portion was good. Moreover, the width W1 of the 1st extension site | part 111a was 20 mm, the width W2 of the 2nd extension site | part 111b was 20 mm, and the grip property by a suction pad was also favorable.

Example 3
In this example, the metal foil 10 with a carrier whose extension part was covered with a protective layer composed of two layers of an inorganic zinc-nickel alloy layer and a chromate layer was prepared by the following procedure.
(1) Formation of electrolytic copper foil for carrier The electrolytic copper foil for carrier was prepared in the same manner as in Example 1 except that the immersion time in the step of forming the organic release layer was 180 seconds and the thickness of the release layer was 10 nm. .
(2) Formation of ultrathin copper foil layer, roughening treatment layer, and rust prevention layer A shielding plate was installed on the copper foil to form an ultrathin copper foil layer and a roughening treatment layer. Here, the shielding board was installed in the position of 5 mm as a distance from the deposition surface of copper foil only in the process of an ultra-thin copper foil layer and a roughening process layer. The shielding area was an area within 20 mm from the outer edge of the copper foil, and an ultrathin copper foil layer and a roughening treatment layer were not formed in that area. Each treatment solution and electrodeposition conditions were the same as in Example 1. Next, the rust preventive layer was formed in the same manner as in Example 1, that is, without installing a shielding plate. As a result, a copper foil with a carrier in which a zinc-nickel alloy layer and a chromate layer having the same components as the rust preventive layer were coated on the extended portion was obtained.

The glossiness (incident angle 60 °) of the ultrathin copper foil in this metal foil 10 with a carrier was 5, and the glossiness (incident angle 60 °) on the ultrathin copper foil side at the extended portion was 70. The difference in glossiness ΔGs between the two was 65. The visibility of the extension site was very good. The width W1 of the 1st extension part 111a was 20 mm, the width W2 of the 2nd extension part 111b was 20 mm, and the grip property by a suction pad was favorable.

Example 4
The present example is an example in which the organic peeling layer as the surface protective layer was not formed on the extending

portions

111a and 111b in the first example.
(1) Formation of electrolytic copper foil for carrier and organic release layer The electrolytic copper foil for carrier and the organic release layer were prepared in the same manner as in Example 1.
(2) Formation of an ultrathin copper foil layer, a roughening treatment layer, and a rust prevention layer The ultrathin copper foil layer, a roughening treatment layer, and an anti-proofing were installed with respect to the copper foil by installing the shielding plate used in Example 3. A rust-treated layer was formed. Each treatment solution and electrodeposition conditions were the same as in Example 1. As a result, it was confirmed that the release layer formed on the carrier extension site in the rust prevention treatment step was dissolved and removed in the rust prevention treatment step.
Thus, the metal foil 10 with a carrier shown to Fig.1 (a) and (b) was obtained. The glossiness (incident angle 60 °) of the ultrathin copper foil in this metal foil 10 with a carrier was 5, and the glossiness (incident angle 60 °) on the ultrathin copper foil side at the extended portion was 30. The difference in glossiness ΔGs between the two was 25. Due to the difference in glossiness between the two, in the support using the metal foil 10 with a carrier, the visibility of the extended portion immediately after production was barely possible. In addition, when a part of the region gripped by the rubber gloves was observed after one week, a part was oxidized and discolored.

Example 5
This example is an example in which an organic layer and an inorganic layer as surface protective layers were formed on the

extended portions

111a and 111b in Example 1. After forming the organic release layer of the electrolytic copper foil for the carrier, 50 mg / m ^{2 of} Ni plating was formed, and the copper foil with carrier and the carrier extension were the same as in Example 1 except that the rust preventive layer forming step was not performed. A site was created.

In this metal foil 10 with a carrier, the organic peeling layer and the Ni layer were also formed on the entire surface of the extending portion on the ultrathin copper foil side. The amount of Ni deposited at the extension site was 3 nm in terms of thickness. The glossiness (incident angle 60 °) of the ultrathin copper foil in this metal foil 10 with carrier was 5, and the glossiness (incident angle 60 °) on the ultrathin copper foil side at the extended portion was 85. The difference in glossiness ΔGs between them was 80. Due to the difference in glossiness between the two, the support laminated with the prepreg of the same size using the metal foil with carrier 10 had very good visibility of the extended portion. Moreover, the width W1 of the 1st extension site | part 111a was 20 mm, the width W2 of the 2nd extension site | part 111b was 20 mm, and the grip property by a suction pad was also favorable.

[Comparative Example 1]
In this example, a pressure-sensitive adhesive layer having a thickness of 1.5 μm was used as the release layer in Example 1, and the extended portion was an exposed electrolytic copper foil for carrier. First, the outer periphery of the electrolytic copper foil for carrier obtained in Example 1 was masked with a polyimide tape having a width of 20 mm. Then, the peeling layer was formed by apply | coating and drying the adhesive agent which is a mixture of acrylic ester resin and an elastomer with the dry thickness of 1.5 micrometers on the masked surface. Thereafter, an ultrathin copper layer having a thickness of 2 μm was formed by a magnetron type sputtering apparatus. Then, after performing a roughening process and a rust prevention process like Example 1, the carrier extension site | part was produced by peeling a polyimide tape.

After laminating this metal foil with carrier 10 and a prepreg of the same size as the metal foil with carrier 10 to form a support, the wiring layer shown in FIG. 5 is formed, and the build-up layer shown in FIG. 6 is further formed. After that, the laminate was cut and the support including the carrier was peeled off. As a result, at the interface between the carrier and the metal foil, penetration of the chemical used when forming the buildup layer was observed in the adhesive layer and in the gap, and a pinhole having a size of 5 mmφ was generated in the ultrathin copper layer.

According to the copper foil with a carrier of the present invention, when a printed wiring board support is formed using the copper foil, the handling property such as transportation is good and the visibility of the gripping portion is excellent. In addition, according to the present invention, when a coreless build-up board is manufactured, it is excellent in sealing from the end face of the support and can prevent the intrusion of chemicals in the build-up layer forming process, so that the productivity of the wiring board is high. It can be.

Claims

In a metal foil with a carrier having a carrier, an ultrathin metal foil layer, and a release layer located between them,
The release layer has a thickness of 1 nm to 1 μm,
The carrier is a metal foil with a carrier having an extended portion extending from at least a part of an outer edge of the ultrathin metal foil layer.
The metal foil with a carrier according to claim 1, wherein a surface protective layer is provided on a surface of the extending portion on the ultrathin metal foil layer side.
The metal foil with a carrier according to claim 2, wherein the surface protective layer comprises an extended portion of the release layer.
The metal foil with a carrier according to claim 2, wherein the surface protective layer comprises a layer containing a rust inhibitor.
5. The difference ΔGs in glossiness between the surface of the ultrathin metal foil layer and the surface of the extended part at an incident angle of 60 °, measured according to JIS Z8741-1997, is 30 or more. The metal foil with a carrier according to one item.
The ultrathin metal foil layer has at least a pair of sides facing each other in plan view;
The metal foil with a carrier according to any one of claims 1 to 5, wherein the carrier has the extended portion extending from at least a pair of opposing sides in the ultrathin metal foil layer.
The ultrathin metal foil layer has a quadrilateral shape in plan view,
The carrier extends from the entire outer edge of the ultrathin metal foil layer and has a quadrilateral shape having four sides substantially parallel to the four sides of the ultrathin metal foil layer in plan view. A pair of opposing first extending portions and a pair of opposing second extending portions;
The metal foil with a carrier according to any one of claims 1 to 6, wherein a width W2 of the second extension part is larger than a width W1 of the first extension part.
A resin layer is laminated on a non-formed surface of the ultrathin metal foil layer in the metal foil with a carrier according to any one of claims 1 to 7,
The support for manufacturing a wiring board, wherein the resin layer is laminated in a region overlapping with the ultrathin metal foil layer and a region overlapping a part or all of the extended portion.
A method for manufacturing a wiring board using the metal foil with a carrier according to any one of claims 1 to 7,
The manufacturing method of a wiring board which has the process of hold | gripping the said extension part in the said metal foil with a carrier.
A method for manufacturing a wiring board using the wiring board manufacturing support according to claim 8,
Forming a wiring pattern on the ultrathin metal foil of the support,
It has a process of forming a build-up wiring layer in this order,
In the build-up wiring layer forming step, an insulating layer is laminated,
A method for manufacturing a wiring board, wherein the insulating layer is laminated in a region overlapping with the ultrathin metal foil layer and a region overlapping with a part or all of the extended portion at a peripheral portion of the support.
A method for manufacturing a wiring board using the wiring board manufacturing support according to claim 8,
A method for manufacturing a wiring board, comprising a step of cutting the extended portion and the resin layer together, leaving a part of the extended portion at a peripheral portion of the support.