WO2007017175A3 - Vakuumbeschichtung mit kondensatentfernung - Google Patents

Vakuumbeschichtung mit kondensatentfernung Download PDF

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Publication number
WO2007017175A3
WO2007017175A3 PCT/EP2006/007680 EP2006007680W WO2007017175A3 WO 2007017175 A3 WO2007017175 A3 WO 2007017175A3 EP 2006007680 W EP2006007680 W EP 2006007680W WO 2007017175 A3 WO2007017175 A3 WO 2007017175A3
Authority
WO
WIPO (PCT)
Prior art keywords
deposition
chambers
vacuum
vacuum depositing
substrates
Prior art date
Application number
PCT/EP2006/007680
Other languages
English (en)
French (fr)
Other versions
WO2007017175B1 (de
WO2007017175A2 (de
Inventor
Dieter Hofmann
Juergen Mangold
Original Assignee
Systec System Und Anlagentechn
Dieter Hofmann
Juergen Mangold
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Systec System Und Anlagentechn, Dieter Hofmann, Juergen Mangold filed Critical Systec System Und Anlagentechn
Publication of WO2007017175A2 publication Critical patent/WO2007017175A2/de
Publication of WO2007017175A3 publication Critical patent/WO2007017175A3/de
Publication of WO2007017175B1 publication Critical patent/WO2007017175B1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

Verfahren und Anlage zur Vakuumbeschichtung von Substraten mittels PVD-, PCVD- oder anderer Verfahren, bei dem überschüssiges gasförmiges Beschichtungsmaterial in der Beschichtungskammer aufgefangen und aus dieser entfernt wird, ohne das Vakuum zu unterbrechen. Eine Anlage zur Vakuumbeschichtung von Substraten 1 beinhaltet Beschichtungskammern 3, die mit Reinigungskammern 4 verbunden sind, wobei die Reinigungskammern 4 mit Kondensatauffangvorrichtungen 5 ausgerüstet sind und die Kondensatauffangvorrichtungen 5 zwischen den Reinigungskammern 4 und den Beschichtungskammern 3 verfahrbar sind.
PCT/EP2006/007680 2005-08-08 2006-08-03 Vakuumbeschichtung mit kondensatentfernung WO2007017175A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200510037822 DE102005037822A1 (de) 2005-08-08 2005-08-08 Vakuumbeschichtung mit Kondensatentfernung
DE102005037822.6 2005-08-08

Publications (3)

Publication Number Publication Date
WO2007017175A2 WO2007017175A2 (de) 2007-02-15
WO2007017175A3 true WO2007017175A3 (de) 2007-05-03
WO2007017175B1 WO2007017175B1 (de) 2007-07-05

Family

ID=37681033

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2006/007680 WO2007017175A2 (de) 2005-08-08 2006-08-03 Vakuumbeschichtung mit kondensatentfernung

Country Status (2)

Country Link
DE (1) DE102005037822A1 (de)
WO (1) WO2007017175A2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090050057A1 (en) 2007-08-23 2009-02-26 Von Ardenne Anlagentechnik Gmbh Apparatus for continuous coating
DE102009030814B4 (de) * 2009-06-26 2014-02-06 Von Ardenne Anlagentechnik Gmbh Anordnung zur Beschichtung von Substraten
DE102010049017A1 (de) * 2010-10-21 2012-04-26 Leybold Optics Gmbh Vorrichtung zum Beschichten eines Substrats
DE102017101202B4 (de) 2017-01-23 2021-11-18 VON ARDENNE Asset GmbH & Co. KG Verfahren und Vakuumanordnung

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1521588A1 (de) * 1966-12-05 1969-09-18 Lokomotivbau Elektrotech Einrichtung zum Schutz gegen Bedampfung in Vakuumschmelz- und-verdampfungsanlagen
US3690635A (en) * 1969-05-16 1972-09-12 Air Reduction Condensate collection means
US5065698A (en) * 1988-04-11 1991-11-19 Canon Kabushiki Kaisha Film forming apparatus capable of preventing adhesion of film deposits
US5837057A (en) * 1992-12-21 1998-11-17 Canon Kabushiki Kaisha Film forming apparatus with particle prevention plate
US6015594A (en) * 1991-03-20 2000-01-18 Canon Kabushiki Kaisha Method and apparatus for forming a film by sputtering process
US6103069A (en) * 1997-03-31 2000-08-15 Applied Materials, Inc. Chamber design with isolation valve to preserve vacuum during maintenance
US20020189636A1 (en) * 2001-05-24 2002-12-19 Applied Materials, Inc. Photo-assisted chemical cleaning and laser ablation cleaning of process chamber
JP2005019739A (ja) * 2003-06-26 2005-01-20 Tokyo Electron Ltd 被処理体の搬送方法
WO2005026405A1 (en) * 2003-09-03 2005-03-24 Otb Group B.V. System and method for treating substrates

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1521588A1 (de) * 1966-12-05 1969-09-18 Lokomotivbau Elektrotech Einrichtung zum Schutz gegen Bedampfung in Vakuumschmelz- und-verdampfungsanlagen
US3690635A (en) * 1969-05-16 1972-09-12 Air Reduction Condensate collection means
US5065698A (en) * 1988-04-11 1991-11-19 Canon Kabushiki Kaisha Film forming apparatus capable of preventing adhesion of film deposits
US6015594A (en) * 1991-03-20 2000-01-18 Canon Kabushiki Kaisha Method and apparatus for forming a film by sputtering process
US5837057A (en) * 1992-12-21 1998-11-17 Canon Kabushiki Kaisha Film forming apparatus with particle prevention plate
US6103069A (en) * 1997-03-31 2000-08-15 Applied Materials, Inc. Chamber design with isolation valve to preserve vacuum during maintenance
US20020189636A1 (en) * 2001-05-24 2002-12-19 Applied Materials, Inc. Photo-assisted chemical cleaning and laser ablation cleaning of process chamber
JP2005019739A (ja) * 2003-06-26 2005-01-20 Tokyo Electron Ltd 被処理体の搬送方法
WO2005026405A1 (en) * 2003-09-03 2005-03-24 Otb Group B.V. System and method for treating substrates

Also Published As

Publication number Publication date
DE102005037822A1 (de) 2007-02-15
WO2007017175B1 (de) 2007-07-05
WO2007017175A2 (de) 2007-02-15

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