WO2007014488A1

WO2007014488A1 - Heat conductor used for a semi conductor refrigerating equipment

Info

Publication number: WO2007014488A1
Application number: PCT/CN2005/001179
Authority: WO
Inventors: Chen Guo
Original assignee: Chen Guo
Priority date: 2005-08-03
Filing date: 2005-08-03
Publication date: 2007-02-08

Abstract

A kind of heat conductor used for a semiconductor refrigerating equipment is disclosed in the present invention. The power of heat source of the heat conductor is 20-120w and the cooling medium is a liquid with natural circulation in the semiconductor refrigerating unit. The conductor comprises a cabinet, which has a cavum for containing liquid. The cabinet has a metal heat conducting plate and a sealed cover. The outside of the heat conducting plate is provided with an input end for heat source. A water inlet and a water outlet provided in the upper end and the lower end of the cabinet separately can connect with the water pipe of a radiator. The surface area of the heat conducting plate is 0.002-0.075m2. The heat conductor according to the present invention can improve the thermal efficiency and simplify the constitution. The heat conductor can be applied in the refrigerator, icebox and other refrigerating equipments.

Description

Thermal spreader for semiconductor refrigeration device

The present invention relates to a heat spreader for a semiconductor refrigeration device, and more particularly to

20 - 120W heat source, liquid as cooling medium, heat spreader for mounting between heat source and heat sink. Background technique

Semiconductor refrigeration, also known as thermoelectric refrigeration or thermopile refrigeration, is based on the Peltier effect, using the potential energy changes and the absorption and exothermic phenomena generated by the electrons and holes in the two conductors in the energized circuit. The cold and hot ends, in turn, achieve the cold function, as described in Chinese Patent Application No. CN1307211A. In order to improve the cooling performance, in addition to selecting the appropriate working current and electric power, it is more important to improve the heat conduction and heat dissipation performance of the thermoelectric cooling device (component), reduce the heat exchange formed by the temperature accumulation at the hot and cold end, and minimize the heat and cold. The temperature difference between the ends is such that more cooling capacity can be obtained.

In the existing thermoelectric refrigeration device, the heat source power is generally 20-120 W, and the hot-end heat dissipation mode is usually forced water cooling, forced air cooling or heat pipe cooling. The forced water cooling method requires the use of a circulating pump. The forced air cooling method requires the use of a fan. Their common drawback is that they generate large noise and consume energy. In the heat pipe cooling method, the manufacturing and installation process of the heat pipe is complicated.

"Semiconductor Refrigeration and Application Technology" ( ISBN 7-313-01069-9/TN. 048, Shanghai Jiaotong University Press, December 1992, first edition). Page 92 discloses a schematic diagram of a thermopile cooling or cooling system. As shown in Figure 1, it is a natural circulation using water. The electric cooling structure for dissipating heat includes an electric refrigerating element 2 and a radiator 6, and between the electric refrigerating element and the radiator is a hollow heat spreader 4, the heat spreader has a cavity for accommodating the liquid, and a metal heat conducting plate and electricity The hot end of the refrigerating element (electrothermal stack) is fitted, and the upper and lower ends of the cavity have a water inlet and a water outlet that can be connected to the radiator water pipe. The water natural circulation refrigeration structure has large heat conductivity, no noise, environmental protection, energy saving, and convenient use. However, this structure cannot smoothly conduct heat conducted to the heat conducting plate due to the natural circulating water in the heat exchanger, so that It has not been put into practical use in areas such as ordinary life. The present invention has been made in view of the above-mentioned deficiencies of the prior art. SUMMARY OF THE INVENTION The object of the present invention is to overcome the above-mentioned deficiencies of the prior art, and to provide a heat spreader for a thermoelectric refrigeration device that utilizes a natural circulation of a liquid to improve the thermal efficiency of the loop between the naturally circulating water in the heat spreader and the heat conducting plate of the heat spreader.

In order to achieve the above object, the basic idea of the technical solution provided by the present invention is as follows: A heat spreader for a semiconductor refrigeration device, for a 20-120 W heat source, a natural circulating liquid as a cooling medium, comprising a casing having a casing a cavity for accommodating a liquid, the casing comprises a metal heat conducting plate and a sealing cover, the outer side of the heat conducting plate has a heat source input end, and the upper and lower ends of the casing have a water inlet and a water outlet connected to the radiator water pipe, and the heat conduction The surface area of the plate is 0. 002-0. 075m ² .

The heat conducting plate is provided with fins.

The heat conducting plate is made of copper or aluminum.

The heat source input end of the heat conducting plate has a size of 4 Omm X 4 Omm-5 Omni χ 50 mm. The liquid is water, alcohol, a mixture of water and alcohol, acetone, engine oil or kerosene. The heat spreader is used for a heat source of 20 W, and the outer dimensions of the casing are high.

002-0. 06 m ^2。 The surface area of the heat-conducting plate in the inner cavity is 0. 002-0. 06 m ² . Alternatively, the heat spreader is used for a heat source of 20 W, and the outer shape of the casing is 120-160 hidden, 80-95 wide, 42-50 thick, and the heat conducting plate (11) is in the inner cavity (15) the surface area of 0. 06-0. 075ra ² _o

Or the surface area of the heat conducting plate in the inner cavity is 0.06 m ² , and the outer shape of the casing is 120 mm high, 80 mm wide, and 42 mm thick.

Or the surface area of the heat-conducting plate is 0. 075 m ² . The surface area of the heat-conducting plate is 0. 075 m ² .

The beneficial effects of the present invention are: 釆 The above technical solution can make the cooling capacity of the 20-120W heat source (thermoelectric stack) reach more than 50% of its maximum cooling capacity. The utility model has the advantages of high heat conduction efficiency, simple structure, large heat conduction, no noise, environmental protection, energy saving and convenient use, and can be widely applied to refrigerators, cold drinks machines, refrigerators and the like, and has broad application prospects. DRAWINGS

Figure 1 is a schematic diagram of the principle of a temperature difference refrigeration device;

2 is a schematic structural view of a simulation test device of the present invention;

Figure 3 is a cross-sectional view taken along line A-A of Figure 2;

4 is a schematic view showing the external structure of the heat spreader of the present invention;

Figure 5 is a cross-sectional view of the heat exchanger C-C direction of Figure 4;

Figure 6 is a comparison diagram of the thermal conductivity of various heat spreaders measured by the apparatus shown in Figure 2;

7-9 are thermal conductivity curves of three types of heat spreaders of the present invention;

Wherein, the refrigerating object 1, the hot end of the heat source or the hot end of the electric refrigerating sheet 2, the heat source input end 3 of the heat conducting plate, the heat spreader 4, the liquid conduit 5, the radiator 6, the heat exchanger water outlet 7, the heat exchanger water inlet 8, The heat conducting plate 11, the fins 12, the sealing cover 13, the heat exchanger inner cavity 15, the height A of the heat spreader in the direction of the upper and lower inlet and outlet, the width B of the heat spreader, and the thickness C of the heat spreader in the direction of the heat source. The specific embodiments of the present invention are described in detail below with reference to the accompanying drawings:

In the riser water natural circulation cooling system, the heat spreader is the first in the whole heat dissipation process. The quality of the roadway, its performance will directly affect the heat dissipation efficiency of the overall cooling system, and the structural design of the heat spreader is reasonable, which directly leads to the thermal conductivity of the heat spreader. Therefore, the design of the heat spreader structure plays a vital role.

Theoretically, the thermal conductivity of the heat spreader is different from the material used by the heat spreader, the heat exchange heat area with the self-circulating liquid (the surface area of the heat transfer plate in the inner cavity), the thickness of the heat transfer plate, and the volume of the inner cavity. related.

The invention is based on the test of the thermal conductivity of different heat exchangers of different structures, and it can be practically applied to compare the structure of the heat spreader, and then confirm the scope of the design of the heat spreader, and the solution of the present invention is obtained.

Test equipment and conditions:

a) a heat source device with constant input power: one;

b) riser water circulation radiator: several sets;

c) different configurations of the heat spreader;

d) digital display temperature measuring instrument;

e) sensor PT1 00;

f) Constant temperature laboratory.

The theoretical basis of the test principle:

According to the "energy conservation law", at a constant room temperature, when the input power and output power are balanced, the temperature value of the heat conducting plate in the heat spreader is constant, and the heat conductivity of the heat spreader is under the condition that the input power and the output power are constant. When the performance changes, the temperature value of the heat conducting plate in the heat spreader will change with the temperature value, which reflects the change of heat around the heat spreader. According to the different temperature values of the heat spreader, the correct matching relationship between the heat spreader in the heat dissipation system is finally determined.

experiment procedure:

Given a constant input power: 2 0W-120W; Constant temperature environment: 25. C ± 1. C ;

The assembled heat spreader is connected to the heat sink and closely adhered to the hot end surface of the heating device to ensure that the bonding area is 95% or more;

The test time is 90 minutes, and the temperature value T1 of the hot end face of the heater (heat source) hot end 2 (Fig. 2) and the liquid temperature T2 at the water outlet 7 are recorded every five minutes;

Replace the heat spreader and heat sink of different structures separately, and repeat the above steps, and the details Record each temperature value.

Test results and data:

The performance parameters of the heat spreader are summarized in the attached table 1, where:

No.1 to No.1-12 The dimensions of the heat spreader are A132mm, B88mm, H40mm; The size of the heat exchanger of No.2 to No.2-1 is A14 ² , B108匪, MO let; The size of the heat exchanger of No.3 is Al l ² wake up, B112mm, H35;

No. 3 to No. 3-3 The dimensions of the heat spreader are A142 leg, B82瞧, H35 leg. Schedule 1 : Summary of performance parameters of the heat spreader (input power 60W)

Replacement page (Article 26) The comparison of the results of the comprehensive performance test of different heat spreaders is shown in Figure 6. The figure is actually an illustration of the attached Table 1, making it more visual and intuitive;

The thermal conductivity curve of a typical heat spreader is shown in Figure 7-9, where:

The dimensions of the heat spreader are AUO, B88, H42, the heat exchange area of the heat transfer plate and the liquid is 0. 06m ² , the heat transfer plate weight is 1130g, the heat transfer plate is made of copper, and the input power of the heat source is 60W. The performance curve tested is shown in Figure 7;

The shape of the heat spreader is A40 awake, B30 瞧, H15 awake, the heat exchange area of the heat transfer plate and the liquid is 0. 002m ² , the heat transfer plate weight is 160g, the heat conduction plate is made of aluminum, and the input power of the heat source is 20W. The performance curve tested is shown in Figure 8;

The shape of the heat spreader is A160 hidden, B95 wakes, H50 leg, the heat exchange area of the heat transfer plate and the liquid is 0. 075m ² , the heat transfer plate weight is 1350g, the heat conduction plate is made of copper, and the input power of the heat source is 120W. The performance curve tested is shown in Figure 9;

The design range of the heat spreader depends on the amount of heat released by the thermoelectric cooler. Where: (1) the upper limit of the heat exchange area of the heat transfer plate with the liquid in the inner cavity and the upper limit of the heat spreader

(2) The lower limit of the heat exchange area of the heat transfer plate with the liquid in the inner cavity and the lower limit geometry and size of the heat spreader are 20W of heat release;

Thermal Conductor Comprehensive Performance Test Data Analysis:

Through trial and error, we found that the thermal conductivity of the heat spreader mainly depends on the heat exchange area of the heat transfer plate and the liquid. The heat transfer capacity or speed of the metal heat transfer plate is much larger than the heat exchange rate with the liquid, and the thickness and metal are different. The main influencing factors, at the same time, have shown that the volume of the lumen of the heat spreader is not the main factor.

According to the above methods and steps, the heat spreaders of other metal heat conducting plates were tested, and as a result, they exhibited the same thermal conductivity as the copper and aluminum heat conducting plate heat spreaders.

The criteria of the inventive scheme are selected based on the above test data:

During the test, the ambient temperature was chosen to be 25 ° C because it is the temperature of the test electrical cooling fins in the national standard, and the temperature also represents an average of the indoor temperatures. In the process of optimizing the technical solution, the hot end temperature of the heat source is also referred to, because the test shows that when the hot end temperature of the electric cooling fin is below 50 °C, the cooling capacity can reach its maximum cooling capacity (at 25 ° C). More than 50% of this, the amount of cold produced can completely make the invention The liquid natural circulation heat exchanger reaches the level of practical application, such as in refrigerators, cold drinks machines, and small refrigerators.

According to the above conditions and analysis, the technical solution of the present invention is obtained as follows:

A heat exchanger for a semiconductor refrigeration device, for a 20-120W heat source, a natural circulating liquid as a cooling medium, comprising a casing having a cavity 15 for containing a liquid therein, the casing comprising a metal heat conducting plate 11 and a The sealing cover 13 has a heat source input end 3 on the outer side of the heat conducting plate 11. The upper and lower ends of the housing have a water inlet 8 and a water outlet 7 connectable to the radiator water pipe. The surface area of the heat conducting plate 11 in the inner cavity 15 is 0. 002-0. 075m ² .

The sealing cover may be metal or other materials (such as plastic) because the thermal conductivity of the heat spreader mainly depends on the disturbance between the metal heat conducting plate and the liquid /, ,, o

On the basis of the above, the present invention also has the following modifications:

1. The heat conducting plate U is made of copper or aluminum. Copper and aluminum are easily formed and have high thermal conductivity and can be used as a preferred material for the manufacture of the heat spreader of the present invention.

2. The liquid is water, alcohol, a mixture of water and alcohol, acetone or kerosene.

3. The heat spreader is used for a 20W heat source. The outer dimensions of the housing are 0-16 Omm, % 30-95mm, and thickness 15- 50mm. Of course, the heat spreader can also have other forms and sizes, as long as the heat exchange area of the heat transfer plate is required.

002-0. 06 m The surface area of the heat-conducting plate 11 in the inner cavity 15 is 0. 002-0. 06 m

5-0. 075m ² . The surface area of the heat-conducting plate 11 in the inner cavity 15 is 0. 06-0. 075m ² .

6. On the basis of the modification 5, the outer dimensions of the casing are 120-160 high, 80-95 wide, and 42-50 mm thick.

The surface area of the heat conducting plate 11 in the inner cavity 15 is 0.06 m ² , and the outer shape of the carcass is 120 awake, 80 ft wide, and 42 ft thick.

075米之间。 The heat transfer plate 11 in the inner cavity 15 has a surface area of 0. 075m ² .

9. On the basis of the modification 8, the outer dimensions of the casing are 160 inches high, 95 inches wide, and 50 meters thick. 10. The heat spreader further includes a plurality of fins 12 integral with the heat conducting plate 11 in the inner cavity 15. The purpose of the fins is to increase the heat exchange area between the heat conducting plate and the self-circulating liquid in the inner cavity, and to improve the heat conduction efficiency.

The thermal conduction plate 1 source input terminal 11 of the size of 3 to ⁴⁰ make implicit ^--50 Implicit X 50 awake.

The heat spreader of the invention can be widely applied to refrigeration devices such as refrigerators, cold drink machines and refrigerators, and has the advantages of large heat conduction, no noise, environmental protection and convenient use.

The above description of the invention with reference to the accompanying drawings and specific embodiments is intended to be illustrative and not limiting. Obviously, many variations can be made on the basis of the present invention, such as the change of the shape and size of the heat spreader, the change of the material (especially the material of the heat conducting plate), the selection of the heat input area of the heat source input end of the heat conducting plate, etc. Its essence.

Claims

A heat spreader for a semiconductor refrigeration device for a 20-120 W heat source and a natural circulating liquid as a cooling medium, comprising a casing having a cavity for containing a liquid therein

(15) The housing comprises a metal heat conducting plate (11) and a sealing cover (13). The outer side of the heat conducting plate (11) has a heat source input end (3), and the upper and lower ends of the housing have a water pipe for the radiator The water inlet (8) and the water outlet (7) are connected, characterized in that the surface area of the heat conducting plate (11) in the inner cavity (15) is 0.002-0·075 m ² .

2. A heat spreader according to claim 1, characterized in that the heat conducting plate (11) is provided with fins (12).

3. A heat spreader according to claim 2, characterized in that the heat conducting plate (11) is made of copper or aluminum.

4. The heat spreader according to claim 1, wherein the heat source input end (3) of the heat conducting plate (Π) has a size of 40 awake 40 with -5011111^50 legs.

5. The heat spreader according to any one of claims 1 to 4, wherein the liquid is water, alcohol, a mixture of water and alcohol, acetone, motor oil or kerosene.

6. The heat spreader according to claim 5, wherein the heat spreader is used for a heat source of 20 W, and the outer dimensions of the casing are 40-160 legs high, 30-95 legs wide, and 15-5 thick. Omm, the surface area of the heat conducting plate (11) in the inner cavity (15) is 0.002-0.06 m ² .

7. The heat spreader according to claim 5, wherein the heat spreader is used for a heat source of 20 W, and the outer shape of the casing is 120-160 mm in height, 80-95 mm in width, and 42-50 mm in thickness. The surface area of the heat conducting plate (11) in the inner cavity (15) is 0.06-0.075 m ² .

8. The heat spreader according to claim 6 or 7, wherein the heat conductive plate (11) has a surface area of 0.06 m ² in the inner cavity (15), and the outer shape of the casing is high.

120mm, width 80mm, thickness 42imn.

The heat spreader according to claim 5, wherein the heat spreader is used for a heat source of 120 W, and the outer shape of the casing is 160 mm high, 95 mm wide, and 50 mm thick, and the heat conducting plate (11) The surface area in the inner chamber (15) is 0.075 m ² .

9

Replacement page (Article 26)