WO2007013499A1

WO2007013499A1 - Visible light transmitting type planar coil element

Info

Publication number: WO2007013499A1
Application number: PCT/JP2006/314750
Authority: WO
Inventors: Yasutaka Tsuda; Katsuto Tanaka; Kenji Fujii; Hiroshi Honjo; Hiromi Hase
Original assignee: Central Glass Co., Ltd.
Priority date: 2005-07-27
Filing date: 2006-07-26
Publication date: 2007-02-01
Also published as: JP2007034644A

Abstract

There is provided a planar coil element having an excellent visible light transmittance which can be used for a sensor board having a high visible light transmittance. The visible light transmitting type planar coil element includes a substrate, a first layer pattern film having rectilinear conductive lines arranged in parallel on the substrate, a second layer insulation film made of a dielectric body formed with an opening at an arbitrary point on the conductive lines, and a third layer pattern film having rectilinear conductive lines arranged in parallel on the insulation film. The conductive lines of the first layer is connected to the conductive lines of the third layer at two points through the opening or the conductive lines of the third layer are connected to the conductive lines of the first layer at two points through the opening, so that the conductive lines of the first layer and the conductive lines of the third layer constitute a coil and the conductive lines arranged in parallel in the first layer orthogonally intersect the conductive lines arranged in parallel in the third layer when viewed from front.

Description

Specification

Visible light transmission type planar coil element

Technical field

The present invention relates to a planar coil element that can be suitably used for a position detection device using electromagnetic coupling such as a tablet sensor boat.

Background art

[0002] For magnetic elements used in cellular phones, notebook computers, etc., planar coils suitable for thinning have been used. By integrating a loop coil, which is one of planar coils, on a substrate, a sensor board that constitutes a position detection device using electromagnetic coupling used in an input / output integrated display device such as a tablet PC, etc. (For example, patent documents 1 and 2).

[0003] In an input / output integrated display device, a sensor board is placed behind the display, and electromagnetic waves are exchanged between the electronic input pen and the sensor board through the display to detect coordinates (Non-patent Document 1). However, an input / output integrated display device using this method requires a liquid crystal display on the premise that a sensor board is incorporated.Therefore, the display type is selected and the sensor board is placed on the display surface side of the display. An input / output integrated display device called an overlay structure to be arranged is desired. However, in order to realize an input / output integrated display device with this overlay structure, it is necessary to develop a sensor board with high visible light transmittance.

[0004] Patent Document 1: Japanese Patent Laid-Open No. 63-70326

Patent Document 2: JP-A-2-53805

Non-Patent Document 1: “Basics and Applications of Touch Panel”, Techno Times, pp. 39-48 Disclosure of Invention

Problems to be solved by the invention

[0005] In order to incorporate a coil element into a sensor board, it is necessary to integrate planar coils, and therefore a layer provided with conductive wires is provided on an insulating substrate such as a printed circuit board (Non-patent Document 1). . And considering the rational conductive wire pattern, the layer where the conductive layer is arranged By providing a plurality of openings in the substrate on both sides and the substrate, it is necessary to be able to connect the conductive wires between the layers.

[0006] On the other hand, in order to provide a sensor board having a high visible light transmittance, when the insulating substrate is achieved with a transparent member, a conductive wire forming a coil is thinned and the substrate is viewed from the front. It is necessary to form a loop coil with a transparent conductor such as power to improve the aperture ratio of the circuit.

In view of the above technical problems, an object of the present invention is to provide a planar coil element excellent in visible light transmission that can be used for a sensor board having a high visible light transmittance.

Means for solving the problem

That is, the first visible light transmissive planar coil element of the present invention is a first layer in which a substrate having visible light transparency and linear conductive lines are arranged in parallel on the substrate. A pattern film, a second-layer insulating film made of a dielectric formed so as to have an opening at an arbitrary point on the conductive line, and a linear conductive line arranged in parallel on the insulating film A third-layer pattern film, and the first-layer conductive wire is joined to the third-layer conductive wire at two points through the opening portion, or the third-layer conductive film A coil is formed by the first layer conductive wire and the third layer conductive wire depending on whether the conductive wire is structured to be joined to the first layer conductive wire at two points through the opening portion, and Conductive wires arranged in parallel on the first layer and conductive wires arranged in parallel on the third layer are arranged orthogonally in a front view of the substrate. The conductive wire is mainly composed of silver, copper or gold, the width of the conductive wire is 1 m to 50 / im, and the distance between the conductive wires in the same layer is 0.1 mm to : Characteristic of 10mm.

[0008] Further, the second visible light transmissive planar coil element of the present invention is a first layer pattern in which a substrate having visible light permeability and linear conductive wires are arranged in parallel on the substrate. A film, a second insulating film made of a dielectric formed so as to have an opening at an arbitrary point on the conductive wire, and a third conductive film in which linear conductive wires are arranged in parallel on the insulating film. A layer pattern film, and the first layer conductive line is connected to the third layer conductive line at two points through the opening, or the third layer conductive line A line extending through the opening By adopting a structure in which the first layer conductive wire is joined at two points, a coil is formed by the first layer conductive wire and the third layer conductive wire, and the first layer conductive wire is arranged in parallel on the first layer. The conductive wires and the conductive wires arranged in parallel in the third layer are arranged orthogonally in a front view of the substrate, so that the coils can be integrated, and the main components of the conductive wires are made of ITO. The width of the conductive wire is 0.1 mm to: 10 mm, and the distance between the conductive wires in the same layer is 1 μm to 50 μm.

In the visible light transmissive planar coil element of the present invention, a multilayer film is provided on a substrate having visible light permeability such as glass or a plastic sheet, and the first layer on the substrate side of the multilayer film is conductive. The pattern film on which the wires are arranged, the second layer is an insulating film made of a dielectric, and the third layer is a pattern film on which conductive wires are arranged. The insulating film of the second layer is provided with a plurality of opening portions, and the ends of the conductive wires of the first layer and the third layer are coupled to each other at the opening portions. If two junction points are provided between the first layer conductive line and the third layer conductive line to be joined through the opening, the first layer conductive line and the third layer conductive line are orthogonal. In addition, since the joining is made at the end of the conductive wire, a coil such as a loop coil can be formed on the substrate.

In the coil according to the present invention, the conductive wires arranged in parallel are in the same layer, and the conductive wires connected to the conductive wires arranged in parallel are in different layers. Can be arranged without overlapping, and the coil is successfully integrated on the substrate.

In the visible light transmissive planar coil element of the present invention, since the multilayer film is formed on a substrate having visible light permeability, the main component of the conductive wire is visible light of silver, copper or gold. In the case of a non-transparent conductive material, the width of the conductive line is set to 1 μm to 50 μm, and the distance between the conductive lines in the same layer is set to 0.1 mm to 10 mm. When the conductive material is transparent to visible light of IT ○, the width of the conductive line shall be 0.1 mm to 10 mm, and the distance between the conductive lines in the same layer shall be 1 μm to 50 μm.

[0011] Regarding the conductive material, it is preferable to use silver, copper, or gold as a main component when giving priority to the characteristics of conductivity. When priority is given to visible light transmission, ITO is used as the main component. It is preferable to use anything. When the conductive material contains silver, copper, or gold as the main component, if the width of the conductive wire is less than 1 μm, it will be difficult to fabricate and the resistance will be high. When the thickness exceeds 50 zm, the conductive lines are easily visualized, and the visible light transmittance of the element of the present invention is deteriorated. Considering the above, the width of the conductive wire should be between 10 111 and 30 111.

In addition, if the distance between the conductive lines in the same layer is less than 0.1 mm, the visible light transmission tends to deteriorate, and the manufacturing cost also increases, and if it exceeds 10 mm, the integration of the coils on the substrate is sufficient. Not. Considering these, the distance between the conductive lines in the same layer is preferably 0.5 mm to 5 mm.

[0012] When the main component of the conductive material is mainly composed of ITO, the width of the conductive line is increased and the distance between the conductive lines is decreased. When ITO is the main component, ITO is transparent to visible light, but since a multilayer film is formed on the substrate, there is a difference in optical interference between the presence and absence of ITO, and visible light. This affects the transparency or reflectivity of the film, making it easier to visualize the ITO-free part, and the same phenomenon as the above structure occurs when the conductive material is mainly composed of silver, copper, or gold.

[0013] Even when using a conductive material whose main component is ITO, it is necessary to consider the phenomenon of pattern visualization. Therefore, the distance between conductive lines in the same layer needs to be 50 / m or less, and is preferably 30 μΐη or less in consideration of the visualization phenomenon. On the other hand, if the distance between the conductive lines is set to l x m, it is not preferable because the production becomes difficult. In order to ensure conductivity with a material mainly composed of ITO, the width of the conductive wire is preferably 0.1 mm to 10 mm, preferably 0.3 mm or more.

The visible light transmitting substrate described above is a visible light transmitting material obtained in accordance with JIS R 3106 "Testing method for transmittance, reflectance, emissivity of solar glass" (1998). The rate is 70% or more, preferably 85% or more. The shape of the substrate is preferably rectangular in consideration of the field of application of the element of the present invention.

[0014] In the visible light transmission type planar coil of the present invention, it is preferable that the thickness of the second insulating film is smaller than the thickness of the first pattern film. By making the thickness of the second layer smaller than the thickness of the first layer pattern film, that is, the conductive line, the end of the conductive line in the first layer provided in the insulating film becomes the insulating film. Except for the direction of the conductive wire covered with, the conductive wire part can be the highest part. As a result, when forming the third layer pattern film, the third layer conductive wire And the first-layer conductive wire can be easily joined.

In consideration of the bonding of the conductive wires, it is preferable that the thickness of the second layer insulating film is 0.8 times or more less than the thickness of the first layer pattern film. If the ratio is less than 8 times, the height of the protruding portion of the conductive wire at the opening portion becomes high, and it becomes easy to form a gap in the wall surface portion of the protruding portion, and the conductive wire is likely to be partially cut. . Considering this, the thickness of the second-layer insulating film is preferably 0.9 times or more, more preferably 0.95 times or more that of the first-layer pattern film.

It is preferable to form a fourth-layer insulating film made of a dielectric on the third-layer pattern film because the third-layer conductive line can be protected. The fourth-layer insulating film has an opening for bonding the first-layer and / or second-layer conductive lines and the external circuit.

[0016] The insulating film is a colorless dielectric mainly composed of an oxide or nitride of any one of Si, Al, Ti, Zn, Nb, Ta, In, and Sn, or a silicone resin, a urethane resin, a polycarbonate. It is preferably made of a dielectric material mainly composed of any organic polymer selected from the group consisting of neat, polyethersulfone, polyacrylate, and polyacrylamide, particularly a colorless dielectric material. In consideration of the film formation and reflectivity, a dielectric thin film mainly composed of an oxide of Si is preferable. In consideration of the manufacturing cost of the insulating film having an opening portion, a manufacturing method having a screen process is adopted. In this case, a dielectric material composed mainly of an organic polymer that is soluble in a solvent and a coating solution or a thin film, or a silicon oxide that is easily soluble in a solvent, such as an alkoxide, is available. It is preferable to use a dielectric material as the main component.

[0017] When an insulating film is formed of a dielectric material composed mainly of an organic polymer and the substrate is a glass substrate, a primer component is applied to the surface of the glass substrate in order to improve the adhesion between the organic polymer and the glass. Or UV ozone treatment is preferred. In addition, a method of improving adhesion to a glass substrate by adding a silicon alkoxide or colloidal silica to a coating solution in which a dielectric material mainly composed of an organic polymer is dissolved can be employed.

In addition, when ITO is used for the conductive wire, it can be bent with ITO to reduce the interference effect of the film. A dielectric thin film whose main component is an oxide of Ti, Zn, Nb, Ta, In, or Sn with an approximate curvature may be used.

[0018] Further, it is preferable that the substrate on which the element of the present invention is used has a rectangular shape, and the included angle between the side of the substrate and the conductive wire is 20 degrees to 45 degrees. When used in a sensor board, the visible light transmission type planar coil element of the present invention is disposed on a display such as a liquid crystal display, a CRT display, an organic EL display, or a PDP display, thereby preventing the occurrence of moire. In order to achieve this, it is preferable to set the angle to 20 degrees to 45 degrees.

And, it is preferable that the distance between all the conductive lines and the width of all the conductive lines in the first layer and the third layer pattern film are constant because the visibility of an image viewed through the element of the present invention is improved. . Depending on the design in which the distance between the conductive wires and the conductive wire width are constant, the force S that generates a conductive wire that is not used as a coil may be used as a dummy.

Further, from the viewpoint of integrating the coil circuit on the substrate, the visible light transmission type planar coil element has a structure in which the first-layer conductive wire and the third-layer conductive wire are joined at the ends of the conductive wires, respectively. It is preferable to do.

[0019] From the viewpoint of improving the visibility of an image viewed through the element of the present invention, when the main component of the conductive wire is silver, copper, or gold, it is visible from the substrate side. In this case, it is preferable that a black pigment or a dye is mixed in the conductive line or the conductive line is formed on the black pattern so that the conductive line portion is blackened. This is preferable because the effect of improving the contrast of an image viewed through the element of the present invention is obtained.

The invention's effect

[0020] Since the planar coil element of the present invention can achieve transmission of visible light, it can be used in a wide range of applications of planar coil elements that are conventionally opaque and limited in use. For example, since the sensor boat used in a tablet PC can be made transparent, an input / output integrated display device called an overlay structure in which the sensor board is arranged on the display surface side of the display can be created regardless of the display type.

BEST MODE FOR CARRYING OUT THE INVENTION

The visible light transmissive planar coil element of the present invention will be described with reference to the drawings. FIG. 1 is a front view of the main part of the visible light transmission type planar coil element of the present invention, and FIGS. 2 and 3 are sectional views of the main part. Show. As shown in FIG. 1, the first-layer conductive wire 3 and the third-layer conductive wire 5 formed on the substrate 2 are arranged so as to be orthogonal when viewed from the front.

As shown in FIGS. 2 and 3, the conductive line 3 is joined to the third-layer conductive line 5 through the opening 7 provided in the second-layer insulating film 4. Then, the conductive line 5 is joined to the first-layer conductive line 3 arranged in parallel with the previous conductive line 3, so that the first-layer conductive line 3 and the third-layer conductive line 5 are connected. And are joined at two points, and can be a coil such as a loop coil.

[0022] The third-layer conductive wire 5 exists in a different layer from the first-layer conductive wire 3 via the second-layer insulating film 4, but is joined at the opening portion 7. As shown in FIG. 1, it is possible to provide an integrated coil circuit group integrated in the same direction and a coil circuit group integrated in the orthogonal direction.

FIG. 4 is a view showing a portion that becomes a joint portion of the coil with an external circuit when the visible light transmission type planar coil element main part of the present invention is viewed from the front. FIG. 5 shows a cross-section of the main part serving as the joining site. In order to form the connection part between the coil and the external circuit, the insulating film 4 or 6 may not be formed on the peripheral edge of the glass. However, as shown in the cross section of FIG. It is preferable to provide the opening part 8 without a film because the degree of freedom in the design of the coil circuit occurs. A coil circuit such as a loop coil is connected to an external circuit (not shown) through the opening 8.

FIG. 6 is a diagram showing an overall image when the visible light transmissive planar coil element of the present invention is viewed from the front. A masking layer 9 such as a black frame is preferably provided on the peripheral edge of the coil element 1 so as to cover and conceal the connection part with the external circuit as described above and the external circuit. The conductive wire 3 of the first layer pattern film and the conductive wire 5 of the third layer are visually recognized in a mesh pattern, and the line width and the arrangement width of the conductive wires are defined in the present invention, thereby making visible light visible. As a result, a visible light transmission type planar coil element is obtained.

The masking layer 9 is preferably provided with a masking layer having an absorbance of 3, more preferably 4 or more. This masking layer can be formed by applying a preparation containing a thermosetting synthetic resin, a pigment, and a dye, followed by drying and heating. Examples of the thermosetting synthetic resin include epoxy resins, acrylic silicon resins, alkyd resins, and polyamides. Resin, fluororesin, or the like can be used.

Examples of the pigment include one or more materials selected from iron oxide, copper oxide, chromium oxide, cobalt oxide, mangan oxide, aluminum oxide, zinc oxide, lead chromate, lead sulfate, lead molybdate, and the like. Can be used.

[0025] As the dye, for example, dioxazine-based, phthalocyanine-based, anthraquinone-based organic substances, and the like can be used. As a medium for making this mixture into a paste for coating, for example, a solvent such as diethylene glycol monobutyl ether acetate or ethylene glycol monobutyl ether can be used. Further, for example, a modified aliphatic polyamine resin or N-butanol may be mixed as a curing reaction accelerator.

The masking layer 9 may be provided on either the coil circuit forming side or the side opposite to the circuit forming side. The thickness is preferably 35 μm or less, particularly 30 μm or less.

[0026] When the masking layer is formed on the side opposite to the side on which the circuit is formed, if the thickness of the masking layer is larger than 35 μΐη, there is a step at the boundary between the masking layer surface and the glass substrate surface. Since the film becomes large, bubbles are likely to remain in the stepped portion when an antiglare film or a low reflection film is applied. Even when the masking layer is formed on the circuit forming side, if the level difference as described above becomes large, problems such as difficult circuit formation are likely to occur.

FIGS. 1 to 6 show schematic views when the main component of the conductive wire is silver, copper or gold. When the main component of the conductive wire is ΙΤΟ, the conductive wires 3 and 5 are As specified, it becomes a thick pattern, and when viewed in the whole image as shown in Fig. 6, it is visible with a partial force S mesh-like pattern without conductive wires.

[0027] The substrate 2 is, for example, a plate-like glass substrate such as soda lime silicate glass, borosilicate glass, aluminosilicate glass, norium borosilicate glass, or quartz glass, and is particularly manufactured by a float process. A glass substrate is preferred. When glass produced by the float process is used, the coil element of the present invention is preferably formed on the surface not in contact with the tin bath at the time of glass production, that is, on the top surface side. Other than glass substrates, for example, polycarbonate resin, polyethylene terephthalate resin, acrylic resin, triacetyl cellulose resin, polypropylene A resin-like resin substrate having a visible light transmittance such as a plate or a resin can be used. In consideration of the coil manufacturing process, the application of the overlay structure to the input / output integrated display device, etc., the substrate 2 is preferably a glass substrate.

[0028] The conductive lines 3 and 5 in the first layer pattern film and the third layer pattern film are a paste process using a silver paste or the like, a copper process or a plating process using a silver pattern, IT O It is possible to use a known wiring pattern such as a pattern Jung film fabrication process.

When the conductive lines 3 and 5 are formed by a paste process, for example, a commercially available silver paste is used and a known technique such as a screen printing method is used. A parallel pattern is formed on the substrate 2. Then, by heating the silver paste at temperatures required for firing, the thickness. 3 to: 10 / im, preferably, at 4 to 8 mu m, specific resistance ^{3. 0 X 10- 6 Ω 'cm~} :! · 0 X 10— ⁵ Ω 'cm conductive wire is obtained.

[0029] For example, using a metal organic compound (silver) paste XE109-8 (manufactured by NAMICS Co., Ltd.), on a soda-lime silicate glass substrate 2 by an 8-inch rectangular float method, a screen printing method is used. Thus, a pattern of conductive lines can be formed by forming linearly parallel patterns so that the line width is 30 xm and the line interval is 1 mm, and baking is performed at 250 ° C. after drying. This thickness is 6 xm, may be specific resistance obtained conductive lines ^{3. 8 X 10- 6 Ω 'cm} .

[0030] In addition to the above, an inorganic type paste in which silver fine particles, a low-melting glass frit, and a resin such as ethyl cellulose are mixed with a vehicle such as a viscous material that has been dissolved in a solvent such as terbinol is used as the silver paste. You can also. In the inorganic type silver paste, the low melting point glass functions as an adhesive layer with the base glass. When inorganic type silver paste is used, firing at 400 ° C or higher is required to oxidize and volatilize the resin component by firing and to soften the low melting point glass frit to form an adhesive layer with the glass substrate. Therefore, the substrate 2 must be made of glass. 2. The inorganic type silver paste ^{5 X 10- 6 Ω 'cm~3.} 0 X 1 0 "6 Ω' cm of the conductive wire is obtained.

[0031] Further, it is preferable to mix a black pigment or dye in the silver paste so that the specific resistance of the conductive wire does not decrease so that the conductive wires 3 and 5 are blackened. Examples of black pigments include oxidation A mixture of one or more materials selected from iron, copper oxide, chromium oxide, cobalt oxide, manganese oxide, aluminum oxide, zinc oxide, lead chromate, lead sulfate, lead molybdate, etc. can be used. As the dye, for example, dioxazine-based, phthalocyanine-based, anthraquinone-based organic substances, and the like can be used.

When the conductive lines 3 and 5 are formed by a plating process, a conductive film formed in a pattern can be efficiently formed by using a semi-additive method. For example, a substrate 2 / chrome oxide / chromium Z-copper layer film is formed on the substrate 2 by a known vapor deposition method such as a sputtering method, and a known patterning technique such as photolithography is used. A resist pattern formed in a straight line in parallel within the range specified in the present invention is formed on the laminated film. Then, by electrolytic plated thickness. 3 to: 10 mu m, preferably, at 4 to 8 mu m, the ratio resistance is ^{1. 7 X 10- 6 Ω 'cm~} :! · 0 X 10- 5 Ω' cm conductive wires are obtained. This process has the advantages that the specific resistance of the conductive wire can be made relatively small, a conductive line pattern with a narrow line width can be obtained quickly, and the blackening process using the optical interference effect between chromium oxide and chromium is easy. There is.

[0032] Next, an example of manufacturing a conductive film formed in a pattern using a plating process will be described.

A thin film of chromium oxide, chromium, and copper was sequentially laminated on a soda lime silicate glass substrate 2 by an 8-inch rectangular float method by a sputtering method to form a laminated film. A resist pattern formed in a straight line and in parallel is formed by photolithography on the conductive laminated film thus formed. At this time, the opening width was 20 μm and the line width was 1 mm. Subsequently, a conductive film formed in a pattern of copper having a thickness of 5 μm is formed by electrolytic copper plating on the opening of the resist of 20 μm. The resist is peeled off by immersing this in acetone and ultrasonic cleaning.

[0033] Subsequently, chemical etching is performed by sequentially immersing the copper layer, the chromium layer, and the chromium oxide layer between the lines in an optimum etchant solution for each layer, and the line width is 20 xm and the distance between the lines is lmm. pattern film resistivity of 2 X 10- ⁶ Ω 'cm conductive wire is obtained. The pattern film thus obtained has a narrow line width and is subjected to a blackening process utilizing the optical interference effect between chromium oxide and chromium. Therefore, the element 1 of the present invention is disposed on the front surface of the display. Even in the case of a problem, the visibility is not impaired.

In the above description, the production of the conductive film using the electrolytic plating method has been described. In addition to copper, silver or gold can be used as the main component of the conductor.

When forming the conductive lines 3 and 5 in the IT ○ pattern Jung film fabrication process, the conductive film formed in a pattern can be efficiently formed by using the sub-traactive method. A thin film is formed on the substrate 2 by a known vapor deposition method such as a sputtering method. At this time, in order to obtain a low resistance film, it is preferable to heat the glass substrate to 150 to 250 ° C. during vapor deposition. Then, using a known patterning technique such as photolithography, a resist pattern formed in a straight line and in parallel within a range defined by the present invention is formed on the ITO film.

[0035] Subsequently, a portion having no resist chemical etching, resist Te cowpea in removing, thickness 50 to 400 nm, preferably ί or 100 to 300 nm];匕抵drag S 1. 8 X 10- ⁴ Ω · cm~ 1. 0 X 10- 3 Ω 'cm of the conductive wire is obtained. Since the conductive wire by ITO is excellent in visible light transmission, it is preferable to use this process when priority is given to the visible light transmission of the element 1 over the specific resistance of the conductive wire.

A specific example of manufacturing a conductive film formed in a pattern using ITO will be described below.

An ITO thin film having a thickness of 200 nm was formed on a soda-lime silicate glass substrate 2 by an 8-inch rectangular float method by a sputtering method. At this time, in order to obtain a low-resistance ITO thin film, heating was performed so that the glass substrate at the time of film formation became 200 ° C. A resist pattern arranged in a straight line and in parallel is formed by photolithography on the IT ○ film thus formed.

Subsequently, this was immersed in an etchant solution to perform chemical etching on the resist opening portion. The article was then immersed in acetone and ultrasonically cleaned to remove the resist. In this way the specific resistance is ^{2. 0 X 10- 4 Ω 'cm} , a line width lmm, the conductivity of the pattern film of the distance between lines 50 mu m is obtained.

The insulating films 4 and 6 can be formed by forming the openings 7 and 8 at the same time as forming the film, or by forming a uniform film first, and then using a known patterning technique such as photolithography, laser ablation, etching, etc. Etc., and can be obtained by a method of forming the opening portions 7 and 8. In the present invention, the former is referred to as a simultaneous formation method and the latter post formation method for convenience. A specific example of forming an insulating film having an opening portion by the simultaneous formation method will be described below.

Prepare a screen plate that has a circular opening with a diameter of 300 μm at the site where the first-layer conductive wire and third-layer conductive wire are connected. The printing paste has transparency that does not impair the visibility when the printed film is placed on the front of the display, and the first and third conductive lines are electrically connected. As long as it has an insulating property so as not to be short-circuited.

As such a material, for example, an organic polymer such as silicone resin, urethane resin, polyether sulfone, polyamide or the like can be used. By mixing a silica precursor such as a silicon alkoxide into a solution containing these organic polymers, an insulator which is a dielectric in which an organic polymer and a silicon oxide are combined can be obtained. The composite dielectric not only improves the adhesion to the glass, but also increases the strength of the film. Furthermore, due to the influence of the silicon oxide, it is easy to stack the third conductive wire. Has the effect of. Among organic polymers, it is preferable to use polyethersulfone in view of heat resistance.

[0038] In addition to tetraethoxysilane, the silica precursor may be trimethoxysilane, triethoxysilane, tripropoxysilane, tetramethoxysilane, tetrapropoxysilane, methyltrimethoxysilane, etyltrimethoxysilane, propyltrimethoxysilane. Methoxysilane, methyltriethoxysilane, ethinoretriethoxysilane, propinoretriethoxysilane, dimethinoresimethoxymethoxypropyltriethoxysilane, γ-mercaptopropyl trimethoxysilane, γ-mercaptopropyltriethoxysilane, γ-aminopropyltrimethoxy Silane, γ-aminopropyl triethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, phenyltripropoxysilane, diphenyldimethoxysilane, diphenyl The Jetokishishiran the like can be used.

[0039] Preferably, a known thickening agent such as cellulose or polyethylene glycol is added to the above coating solution to form a paste-like coating solution, which is printed by a screen printing method, so that a volatile component of the solvent, a thickening agent, and the like. The insulating films 4 and 6 having opening portions 7 and 8 having a thickness of 2 to 8 zm are formed by volatilization and heat treatment at 80 to 400 ° C. A specific example of forming an insulating film having an opening by the post formation method will be described below. This post forming method is a well-known patterning technique such as photolithography at the part where the opening parts 7 and 8 are formed. For example, the thickness is 1 to 20 zm, preferably 5 to 15 zm, and the diameter 50 to 500. μm, preferably 100-400 μm cylindrical heat-resistant resist is formed, and then Si, Al, Ti, Zn, etc. are formed on the substrate by vacuum deposition such as coating, sputtering, ion plating, etc. A colorless dielectric film composed mainly of an oxide or nitride of Nb, Ta, In, or Sn is formed.

[0040] Then, the insulating films 4 and 6 having the opening portions 7 and 8 having a thickness of 0 · 05 to 4 xm are formed by immersing the article in acetone, ultrasonic cleaning, and peeling the resist. The

In addition, a method of forming a dielectric film first and then forming the opening portions 7 and 8 by laser ablation or etching can be used as a post formation method.

For example, the main component is an oxide or nitride of Si, Al, Ti, Zn, Nb, Ta, In, or Sn on the substrate by a vacuum deposition method such as coating or sputtering or ion plating. A colorless dielectric film is formed.

[0041] After that, a part that connects the first-layer conductive wire and the third-layer conductive wire is laser ablation, or a method of masking other than the perforated portion with a resist and performing chemical etching with a hydrofluoric acid solution, And reactive ion etching using a reactive gas such as oxygen, hydrogen, nitrogen, fluorine, argon, carbon fluoride, and carbon chloride. In this way, insulating films 4 and 6 having opening portions 7 and 8 having a thickness of 0.05 to 4 zm are formed.

Brief Description of Drawings

FIG. 1 is a diagram showing a main part of a visible light transmission type planar coil element according to the present invention when viewed from the front.

FIG. 2 is a view showing a cross section taken along the line aa ′ in FIG.

FIG. 3 is a view showing a cross section along line bb ′ of FIG.

FIG. 4 is a diagram showing a portion that becomes a joint portion with an external circuit of a coil when the visible light transmission type planar coil element of the present invention is viewed from the front.

FIG. 5 is a view showing a cross section of cc ′ of FIG.

FIG. 6 is a diagram showing an overall image when the visible light transmission type planar coil element of the present invention is viewed from the front. is there.

Explanation of symbols

1 Visible light transmission type planar coil element

2 Board

3 Conductive wire of the first layer pattern film

4 Second layer insulation film

5 Conductive wire of the third layer pattern film

6 4th layer insulating film

7 Opening part provided in the second-layer insulating film to connect the conductive wire of the first-layer pattern film and the conductive wire of the third-layer pattern film

8 Opening part for joining the conductive wire of the first layer pattern film or the conductive wire of the third layer pattern film to the external circuit

9 Masking layer

Claims

The scope of the claims

[1] A substrate having visible light transparency, a first layer pattern film in which linear conductive lines are arranged in parallel on the substrate, and an opening at an arbitrary point on the conductive lines. A second-layer insulating film made of a dielectric, and a third-layer pattern film in which linear conductive lines are arranged in parallel on the insulating film. The third-layer conductive line is joined at two points through the opening part, or the third-layer conductive line is connected at two points with the first-layer conductive line through the opening part. By adopting a bonded structure, a coil is formed by the first layer conductive wire and the third layer conductive wire, and the conductive wire arranged in parallel in the first layer and the third layer in parallel. The arranged conductive wires are arranged orthogonally in a front view of the substrate, so that the coil can be integrated, and the main component of the conductive wires is silver, copper or gold. And the width of the conductive wire is 1 111-50 111, visible light transmissive flat coil element, wherein a conductive wire distance in the same layer was 0. lmm~10mm.

[2] A substrate having visible light transparency, a first layer pattern film in which linear conductive lines are arranged in parallel on the substrate, and an opening portion at an arbitrary point on the conductive lines. A second-layer insulating film made of a dielectric, and a third-layer pattern film in which linear conductive lines are arranged in parallel on the insulating film. The third-layer conductive line is joined at two points through the opening part, or the third-layer conductive line is connected at two points with the first-layer conductive line through the opening part. By adopting a bonded structure, a coil is formed by the first layer conductive wire and the third layer conductive wire, and the conductive wire arranged in parallel in the first layer and the third layer in parallel. The arranged conductive wires are arranged orthogonally in front view of the substrate, so that the coil can be integrated. The main component of the conductive wires is ITO, and the conductive wires are conductive. A visible light transmissive planar coil element characterized in that the line width is 0.1 mm to 10 mm, and the distance between conductive wires in the same layer is 1 μm to 50 μm.

[3] The visible light transmissive planar coil element according to claim 1 or 2, wherein the thickness of the second layer insulating film is smaller than the thickness of the first layer pattern film.

[4] The visible light transmission type planar coil element according to any one of claims 1 to 3, wherein a fourth layer insulating film made of a dielectric is further formed on the third layer pattern film.

[5] The fourth-layer insulating film joins the first and / or second-layer conductive wires to the external circuit. 5. The visible light transmission type planar coil element according to claim 4, wherein the visible light transmission type planar coil element has an opening portion.

[6] The visible light transmissive type according to any one of claims 1 to 5, wherein the substrate has a rectangular shape, and a depression angle formed between the side of the substrate and the conductive wire is 20 degrees to 45 degrees. Planar coil element.

[7] The visible light transmission type according to any one of [1] to [6], wherein the distance between all conductive lines and the width of all conductive lines in the first layer and the third layer pattern film are constant. Planar coil element.

[8] The visible light transmission according to any one of [1] to [7], wherein the first-layer conductive wire and the third-layer conductive wire are joined at the ends of the conductive wires, respectively. Mold plane coil element.