JP2007034644A - Visible light transmission type planar coil element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a planar coil element excellent in visible light transmission, which can be provided to a sensor board which is high in the transmissivity of visible rays of light. <P>SOLUTION: This visible light transmission type planar coil element is configured of a substrate, a first layer pattern film where linear conductive wires are arranged in parallel on the substrate, a second layer insulating film constituted of a dielectric formed so that an opening site can be arranged at an arbitrary point on the conductive wire, and a third pattern film where linear conductive wires are arranged in parallel on the insulating film, wherein the conductive wires in the first layer are joined through the opening region to the conductive wires in the third layer at two points, or the conductive wires in the third layer are joined through the opening site to the conductive wires in the first layer at two points. Consequently, a coil is formed of the conductive wires in the first layer and the conductive wires in the third layer, and the conductive wires arranged in parallel in the first layer and the conductive wires arranged in parallel in the third layer are arranged to be orthogonal to each other when the substrate is viewed from the front. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a planar coil element that can be suitably used for a position detection device using electromagnetic coupling such as a sensor boat of a tablet.

  For magnetic elements used in cellular phones, notebook computers, etc., planar coils suitable for thinning are being used. Then, by integrating a loop coil, which is one of the planar coils, on a substrate, a sensor board that constitutes a position detection device using electromagnetic coupling used in an input / output integrated display device such as a tablet PC, and the like (For example, Patent Documents 1 and 2).

In the input / output integrated display device, a sensor board is disposed behind the display, and electromagnetic waves are exchanged between the electronic input pen and the sensor board through the display to detect coordinates (Non-patent Document 1). However, since the input / output integrated display device in this method requires a liquid crystal display on the premise that the sensor board is incorporated, the sensor board is arranged on the display surface side of the display regardless of the display type. An input / output integrated display device called an overlay structure is desired. However, in order to realize an input / output integrated display device having this overlay structure, it is necessary to develop a sensor board having a high visible light transmittance.
JP-A-63-70326 JP-A-2-53805 “Basics and Applications of Touch Panels”, Techno Times, 39-48

  In order to allow the coil element to be used on the sensor board, it is necessary to integrate planar coils, and therefore a layer provided with conductive wires is provided on an insulating substrate such as a printed circuit board (Non-Patent Document 1). . And considering the rational wiring pattern of the conductive lines, it is possible to connect the conductive lines between the layers by providing a layer on which the conductive layer is arranged on both sides of the substrate and providing a plurality of openings in the substrate. Things are needed.

  In order to provide a sensor board with high visible light transmittance, not only the above technical elements can be achieved with a transparent member, but also the aperture ratio of the circuit when the conductive wire forming the coil is thinned and the substrate is viewed from the front. It is necessary to form a loop coil with a transparent conductor such as ITO.

  In view of the above, an object of the present invention is to provide a planar coil element excellent in visible light transmission that can be used for a sensor board having high visible light transmittance.

  That is, the first visible light transmissive planar coil element of the present invention includes a substrate having visible light transmittance, a first layer pattern film in which linear conductive wires are arranged in parallel on the substrate, A second-layer insulating film made of a dielectric formed so as to have an opening at an arbitrary point on the conductive line, and a third-layer pattern film in which linear conductive lines are arranged in parallel on the insulating film And the first-layer conductive line is joined to the third-layer conductive line at two points through the opening part, or the third-layer conductive line is the opening part. The first layer conductive line and the third layer conductive line form a coil by being joined to the first layer conductive line through two points through the first layer conductive line, and are arranged in parallel in the first layer Coil integration by arranging conductive wires and conductive wires arranged in parallel in the third layer in an orthogonal manner in a front view of the substrate And enabling, the main component of the conductive wires silver, or copper, or gold, the width of the conductive wire 1 m to 50 m, and characterized in that a 0.1mm~10mm the conductive wire distance in the same layer.

  And the 2nd visible light transmission type planar coil element of this invention is a 1st layer pattern film | membrane with which the conductive wire was distribute | arranged to the board | substrate which has visible light transmittance | permeability, and the linear conductive wire in parallel on this board | substrate. A second layer insulating film made of a dielectric formed so as to have an opening at an arbitrary point on the conductive line, and a third layer in which linear conductive lines are arranged in parallel on the insulating film And the first layer conductive line is joined to the third layer conductive line at two points through the opening portion, or the third layer conductive line is A coil is formed by the first layer conductive wire and the third layer conductive wire by being joined to the first layer conductive wire at two points through the opening portion, and in parallel with the first layer. The conductive wires arranged and the conductive wires arranged in parallel in the third layer are arranged orthogonally in a front view of the substrate, so that the coil To allow the integration, the main component of the conductive wires ITO, the width of the conductive wire 0.1 mm to 10 mm, characterized in that the conductive wire distance in the same layer was 1 m to 50 m.

  A multilayer film is provided on a substrate having visible light permeability such as glass or plastic sheet, the first layer on the substrate side of the multilayer film is a pattern film in which conductive lines are arranged, and the second layer is made of a dielectric. The insulating film and the third layer are a pattern film provided with conductive lines. A plurality of opening portions are provided in the second-layer insulating film, and the ends of the first and third conductive lines are coupled to each other at the opening portions. If two junction points between the first layer conductive line and the third layer conductive line bonded through the opening are provided, the first layer conductive line and the third layer conductive line are arranged orthogonally. In addition, since the joining is made at the end of the conductive wire, a coil such as a loop coil can be formed on the substrate.

  In the coil according to the present invention, the conductive wires arranged in parallel are in the same layer as described above, and the conductive wires connecting the parallel conductive wires are in another layer, so a plurality of coils are arranged without overlapping. It is possible and succeeds in the integration of the coil on the substrate.

  Then, since the multilayer film is formed on a substrate having visible light permeability, when the main component of the conductive wire is a conductive material opaque to visible light of silver, copper, or gold, the width of the conductive wire 1 μm to 50 μm, the distance between the conductive lines in the same layer is 0.1 mm to 10 mm, and the main component of the conductive line is a conductive material transparent to visible light of ITO, the width of the conductive line is 0.1 mm. The visible light transmission type planar coil element can be formed by setting the distance between the conductive wires in the same layer to 10 to 10 mm and the distance between the conductive lines to 1 to 50 μm.

  As for the conductive material, it is preferable to use silver, copper, or gold as a main component when giving priority to the characteristics of conductivity. When priority is given to transmission of visible light, the material having ITO as the main component is used. It is preferable to use it. When the conductive material contains silver, copper, or gold as a main component, if the width of the conductive wire is less than 1 μm, its production tends to be difficult, and if it exceeds 50 μm The conductive lines are easily visualized, and the visible light transmittance of the element of the present invention is deteriorated. Considering the above, the width of the conductive wire is preferably 10 μm to 30 μm.

  Also, if the distance between the conductive wires in the same layer is less than 0.1 mm, the visible light transmission tends to deteriorate, and the manufacturing cost also increases, which is not preferable. If it exceeds 10 mm, the coil on the substrate is not integrated. Not enough. Considering these, the distance between the conductive lines in the same layer is preferably 0.5 mm to 5 mm.

  When the main component of the conductive material is ITO, the width of the conductive lines is increased and the distance between the conductive lines is decreased. When ITO is the main component, this material has a visible light transmission property, but since a multilayer film is formed on the substrate, a difference in optical interference occurs in the presence or absence of ITO, and visible light The portion without ITO is easily visualized, and a phenomenon similar to the above structure occurs when the conductive material is mainly composed of silver, copper, or gold.

  Thus, even when a conductive material mainly composed of ITO is used, it is necessary to consider the pattern visualization phenomenon. Therefore, the distance between the conductive lines in the same layer needs to be 50 μm or less, and is preferably 30 μm or less in consideration of the visualization phenomenon. On the other hand, if the distance between the conductive lines is set to 1 μm, it is difficult to manufacture the conductive line. And in order to ensure electroconductivity with the material which has ITO as a main component, it is preferable that the width | variety of a conductive wire shall be 0.1 mm-10 mm, Preferably, it is 0.3 mm or more.

  The visible light transmitting substrate is a visible light transmitting material obtained in accordance with JIS R 3106 “Testing method of transmittance, reflectance, emissivity, and solar heat gain of plate glass” (1998). The rate is 70% or more, preferably 85% or more. The shape of the substrate is preferably rectangular in consideration of the field of application of the element of the present invention.

  In the visible light transmissive planar coil of the present invention, it is preferable that the thickness of the second layer insulating film is smaller than the thickness of the first layer pattern film. By making the thickness of the second layer smaller than the thickness of the first layer pattern film, that is, the conductive line, the conductive line end portion in the first layer provided in the insulating film is covered with the insulating film. Except for the direction of the broken conductive wire, the conductive wire portion can be the highest portion. As a result, when the third-layer pattern film is formed, the third-layer conductive line and the first-layer conductive line can be easily joined.

  Considering the bonding of the conductive wires, it is preferable that the thickness of the second layer insulating film is less than the thickness of the first layer pattern film and 0.8 times or more. If it is less than 0.8 times, the height of the protruding portion of the conductive wire at the opening portion becomes high, and it becomes easy to form a gap in the wall surface portion of the protruding portion, and the conductive wire is likely to be partially cut. Considering this, the thickness of the second-layer insulating film is preferably 0.9 times or more, more preferably 0.95 times or more that of the first-layer pattern film.

  It is preferable to form a fourth-layer insulating film made of a dielectric on the third-layer pattern film because the third-layer conductive line can be protected. The fourth-layer insulating film preferably has an opening portion for joining the first-layer and / or second-layer conductive lines to an external circuit.

  The insulating film is a colorless dielectric composed mainly of an oxide or nitride of Si, Al, Ti, Zn, Nb, Ta, In, Sn, or a silicone resin, urethane resin, polycarbonate, polyether It is preferably made of a dielectric material mainly composed of any organic polymer of sulfone, polyacrylate, or polyacrylamide, particularly a colorless dielectric material. In consideration of the ease of forming the film and the reflectance, a dielectric thin film mainly composed of an oxide of Si is preferable.

  Further, in consideration of the manufacturing cost of the insulating film having an opening portion, it is preferable to use a manufacturing method having a screen process, in which case a dielectric material mainly composed of an organic polymer that is soluble in a solvent and easily forms a coating solution, Or it is preferable to make it the dielectric material which has Si oxide which can obtain precursors, such as an alkoxide easily soluble in a solvent, as a main component.

  When the insulating film is formed of a dielectric material mainly composed of an organic polymer and the substrate is a glass substrate, a primer component is applied to the surface of the glass substrate in order to improve the adhesion between the organic polymer and the glass. Alternatively, it is preferable to perform UV ozone treatment. In addition, a method in which silicon alkoxide or colloidal silica is added to a coating solution in which a dielectric material containing an organic polymer as a main component is dissolved to improve adhesion with a glass substrate can be employed.

  Furthermore, when ITO is used for the conductive wire, the main component is an oxide of Ti, Zn, Nb, Ta, In, or Sn whose refractive index is close to that of ITO in order to reduce the interference effect of the film. A dielectric thin film may be used.

  Further, it is preferable that the substrate used in the element of the present invention has a rectangular shape, and the depression angle formed between the side of the substrate and the conductive wire is 20 to 45 degrees. The visible light transmission type planar coil element of the present invention is disposed on a display such as a liquid crystal display, a CRT display, an organic EL display, a PDP display, etc., when used in a sensor board, and therefore prevents the occurrence of moire. In addition, the angle is preferably set to 20 to 45 degrees.

  And, it is preferable that the distance between all conductive lines and the width of all conductive lines in the first layer and third layer pattern films are constant because the visibility of an image viewed through the element of the present invention is improved. . Depending on the design in which the distance between the conductive lines and the conductive line width are constant, a conductive line that is not used as a coil is generated. However, this may be used as a dummy.

  Further, from the viewpoint of integrating the coil circuit on the substrate, the visible light transmissive planar coil element has a structure in which the first-layer conductive wire and the third-layer conductive wire are joined at the ends of the conductive wires, respectively. It is preferable.

  In addition, from the viewpoint of improving the visibility of an image viewed through the element of the present invention, when the main component of the conductive wire is silver, copper, or gold, when viewed from the substrate side, It is preferable to mix a black pigment or dye into the conductive line so that the conductive line portion is blackened or to form a conductive line on the black pattern. This is preferable because the effect of improving the contrast of an image visually recognized through the element of the present invention is obtained.

  Since the planar coil element of the present invention can achieve visible light transmission, it can be used in a wide range of applications of the planar coil element that has been conventionally opaque and limited in use location. For example, since a sensor boat used in a tablet PC or the like can be made transparent, an input / output integrated display device called an overlay structure in which a sensor board is arranged on the display surface side of the display can be made regardless of the display type.

  The visible light transmissive planar coil element of the present invention will be described with reference to the drawings. FIG. 1 is a front view of the main part of the visible light transmission type planar coil element of the present invention, and FIGS. 2 and 3 show cross sections of the main part. As shown in FIG. 1, the first-layer conductive lines 3 and the third-layer conductive lines 5 formed on the substrate 2 are arranged so as to be orthogonal when viewed from the front.

  As shown in FIGS. 2 and 3, the conductive line 3 is joined to the third-layer conductive line 5 through the opening portion 7 provided in the second-layer insulating film 4. The conductive line 5 is joined to the first-layer conductive line 3 arranged in parallel with the previous conductive line 3, so that the first-layer conductive line 3 and the third-layer conductive line 5 are combined. Are joined at two points, and a coil such as a loop coil can be obtained.

  The third-layer conductive wire 5 exists in a different layer from the first-layer conductive wire 3 through the second-layer insulating film 4, but is joined at the opening portion 7. It is possible to provide a coil circuit group integrated in the same direction and a coil circuit group integrated in the orthogonal direction as shown in FIG.

  FIG. 4 is a diagram showing a portion that becomes a joint portion with an external circuit of a coil when the visible light transmission type planar coil element main part of the present invention is viewed from the front. FIG. 5 shows a cross-section of the main part serving as the joining site. In order to form a connection site between the coil and the external circuit, the insulating films 4 and 6 may not be formed on the peripheral edge of the glass. However, as shown in the cross section of FIG. It is preferable to provide an open portion 8 that does not have a degree of freedom in designing the coil circuit. A coil circuit such as a loop coil is connected to an external circuit (not shown) through the opening 8.

  FIG. 6 is a diagram showing an overall image when the visible light transmissive planar coil element of the present invention is viewed from the front. A masking layer 9 such as a black frame is preferably provided on the peripheral edge of the coil element 1 so as to cover and conceal the connection portion with the external circuit as described above and the external circuit. The conductive line 3 of the first layer pattern film and the conductive line 5 of the third layer are visually recognized in a mesh pattern, and the line width and the array width of the conductive lines are defined in the present invention, thereby making visible light visible. As a result, a visible light transmissive planar coil element is obtained.

  The masking layer 9 is preferably provided with a masking layer having an absorbance of 3, more preferably 4 or more. This masking layer can be formed by applying a preparation containing a thermosetting synthetic resin, a pigment, and a dye, and drying and heating. As the thermosetting synthetic resin, epoxy resin, acrylic silicon resin, alkyd resin, polyamide resin, fluorine resin, or the like can be used.

  The pigment is a mixture of one or more materials selected from iron oxide, copper oxide, chromium oxide, cobalt oxide, manganese oxide, aluminum oxide, zinc oxide, lead chromate, lead sulfate, lead molybdate, etc. Can be used.

  As the dye, dioxazine-based, phthalocyanine-based, anthraquinone-based organic substances, and the like can be used. As a medium for making this mixture into a paste for coating, a solvent such as diethylene glycol monobutyl ether acetate or ethylene glycol monobutyl ether can be used. Moreover, you may mix modified aliphatic polyamine resin, N-butanol, etc. as a hardening reaction accelerator.

  The masking layer 9 may be provided on either the coil circuit formation side or the side opposite to the circuit formation side. And it is preferable that the thickness is 35 micrometers or less, especially 30 micrometers or less.

  When the masking layer is formed on the side opposite to the side where the circuit is formed, if the thickness of the masking layer is larger than 35 μm, the step difference at the boundary between the masking layer surface and the glass substrate surface becomes large. When a dazzling film or a low reflection film is applied, air bubbles easily remain in the stepped portion. Further, even when the masking layer is formed on the circuit forming side, problems such as difficulty in forming a circuit are likely to occur if the above-described steps are increased.

  FIG. 1 to FIG. 6 show schematic diagrams when the main component of the conductive wire is silver, copper, or gold. When the main component of the conductive wire is ITO, the conductive wires 3 and 5 are As defined in the invention, the pattern becomes a thick pattern, and when viewed as a whole image as shown in FIG. 6, a portion without a conductive line is visually recognized as a mesh pattern.

  The substrate 2 is preferably a plate-like glass substrate such as soda lime silicate glass, borosilicate glass, aluminosilicate glass, barium borosilicate glass, or quartz glass, particularly a glass substrate manufactured by a float process. When using the glass manufactured by the float process, it is preferable to form the coil element of this invention in the surface which did not contact the tin bath at the time of glass manufacture, ie, a top surface side. Other than the glass substrate, a plate-like or film-like resin substrate such as polycarbonate resin, polyethylene terephthalate resin, acrylic resin, triacetyl cellulose resin, and polypropylene resin can be used. In consideration of the coil manufacturing process, the application of the overlay structure to the input / output integrated display device, etc., the substrate 2 is preferably a glass substrate.

  The conductive film 3 and 5 in the first layer pattern film and the third layer pattern film is a paste process using a silver paste or the like, a plating process using copper plating or silver plating, and an ITO patterning film production. It is possible to use a known wiring pattern such as a process.

When the conductive lines 3 and 5 are formed by a paste process, for example, a commercially available silver paste is used, and a linear object is formed within a range defined by the present invention using a known technique such as a screen printing method. A parallel pattern is formed on the substrate 2. Then, by heating the silver paste at a temperature necessary for firing, the thickness is 3 to 10 μm, preferably 4 to 8 μm, and the specific resistance is 3.0 × 10 ⁻⁶ Ω · cm to 1.0 × 10 ⁻⁵ Ω · A conductive wire of cm is obtained.

For example, using a metal organic compound (silver) paste XE109-8 (manufactured by NAMICS Co., Ltd.), a line width of 30 μm is formed on a soda-lime silicate glass substrate 2 by an 8-inch rectangular float method by screen printing. A pattern film of conductive lines can be formed by forming a pattern in which linear bodies are arranged in parallel so that the line spacing is 1 mm, and baking at 250 ° C. after drying. Thus, a conductive wire having a thickness of 6 μm and a specific resistance of 3.8 × 10 ⁻⁶ Ω · cm can be obtained.

In addition to the above, an inorganic type paste in which silver fine particles, a low-melting glass frit, and a resin such as ethyl cellulose are mixed with a vehicle such as a viscous material in which a solvent such as terpineol is dissolved can be used as the silver paste. In the inorganic type silver paste, the low melting point glass functions as an adhesive layer with the substrate glass. When an inorganic type silver paste is used, baking at 400 ° C. or higher is necessary in order to oxidize and volatilize the resin component by baking and to soften the low melting point glass frit to form an adhesive layer with the glass substrate. Therefore, the substrate 2 needs to be made of glass. Conductive lines inorganic type silver paste by ^{2.5 × 10 -6 Ω · cm~3.0 ×} 10 -6 Ω · cm can be obtained.

  Moreover, it is preferable to mix a black pigment or dye with a silver paste so that the specific resistance of a conductive wire may not fall so that the conductive wires 3 and 5 may be blackened. The black pigment is a mixture of one or more materials selected from iron oxide, copper oxide, chromium oxide, cobalt oxide, manganese oxide, aluminum oxide, zinc oxide, lead chromate, lead sulfate, lead molybdate, etc. As the dye, dioxazine-based, phthalocyanine-based, anthraquinone-based organic substances, and the like can be used.

When the conductive lines 3 and 5 are formed by a plating process, a conductive film formed in a pattern can be efficiently formed by using a semi-additive method. For example, a substrate 2 / chromium oxide / chromium / copper laminated film is formed on the substrate 2 by a known vapor deposition method such as a sputtering method, and defined by the present invention using a known patterning technique such as photolithography. A resist pattern in which linear objects are arranged in a range is formed on the laminated film. Then, by electroplating, a conductive wire having a thickness of 3 to 10 μm, preferably 4 to 8 μm, and a specific resistance of 1.7 × 10 ⁻⁶ Ω · cm to 1.0 × 10 ⁻⁵ Ω · cm is obtained. This process has the advantage that the specific resistance of the conductive line can be made relatively small, a conductive line pattern with a narrow line width can be easily obtained, and in addition, the blackening process using the optical interference effect between chromium oxide and chromium is easy. is there.

  An example of manufacturing a conductive film formed in a pattern using a plating process will be described below. A thin film of chromium oxide, chromium, and copper was sequentially laminated on a soda lime silicate glass substrate 2 by an 8-inch rectangular float method by a sputtering method to form a laminated film. On the conductive laminated film thus formed, a resist pattern in which linear objects are arranged in parallel is formed by photolithography. At this time, the opening width was 20 μm and the line width was 1 mm. Subsequently, a conductive film formed in a pattern of copper having a thickness of 5 μm is formed by electrolytic copper plating on the resist opening portion of 20 μm. The resist is peeled off by immersing this in acetone and ultrasonic cleaning.

Subsequently, chemical etching is performed by sequentially immersing the copper layer, the chromium layer, and the chromium oxide layer between the lines in an etchant solution that is optimal for each layer, and the specific resistance with a line width of 20 μm and a distance between the lines of 1 mm is 2 A pattern film of × 10 ⁻⁶ Ω · cm conductive wire is obtained. The pattern film thus obtained has a narrow line width and is blackened using the optical interference effect of chromium oxide and chromium. Therefore, when the element 1 of the present invention is disposed on the front surface of the display However, the visibility is not impaired.

  In the above description, the production of the conductive film using the electroplating method has been described. However, electroless plating may be used, and silver or gold may be used as the main component of the conductor in addition to the above-described copper.

  When the conductive lines 3 and 5 are formed by the ITO patterning film manufacturing process, the conductive film formed in a pattern can be efficiently formed by using the subtractive method. An ITO thin film is formed on the substrate 2 by a known vapor deposition method such as sputtering. At this time, in order to obtain a low resistance film, the glass substrate is preferably heated to 150 to 250 ° C. during vapor deposition. Then, using a known patterning technique such as photolithography, a resist pattern in which linear objects are arranged in parallel within a range defined by the present invention is formed on the ITO film.

Subsequently, the portion without the resist is chemically etched and the resist is removed, whereby the specific resistance is 1.8 × 10 ⁻⁴ Ω · cm to 1.0 × 10 ^{− with} a thickness of 50 to 400 nm, preferably 100 to 300 nm. A conductive wire of ³ Ω · cm is obtained. Since the conductive wire made of ITO is excellent in visible light transmission, it is preferable to use this process when priority is given to the visible light transmission of the element 1 over the specific resistance of the conductive wire.

  A specific example of manufacturing a conductive film formed in a pattern using ITO will be described below. An ITO thin film having a thickness of 200 nm was formed on a soda lime silicate glass substrate 2 by an 8-inch rectangular float method by a sputtering method. At this time, in order to obtain a low-resistance ITO thin film, heating was performed so that the glass substrate at the time of film formation was 200 ° C. On the ITO film thus formed, a resist pattern in which linear objects are arranged in parallel is formed by photolithography.

Subsequently, this was immersed in an etchant solution to chemically etch the ITO layer at the resist opening. Then, the resist was peeled off by immersing the article in acetone and ultrasonically cleaning the article. In this way, a conductive pattern film having a specific resistance of 2.0 × 10 ⁻⁴ Ω · cm, a line width of 1 mm, and a distance between lines of 50 μm is obtained.

  The insulating films 4 and 6 are formed by forming the openings 7 and 8 at the same time as forming the film, or by forming a uniform film first, and then forming a known patterning technique such as photolithography, laser ablation, It can be obtained by a method of forming the opening portions 7 and 8 by etching or the like. In the present invention, the former is referred to as a simultaneous formation method and the latter post formation method for convenience.

  A specific example of forming an insulating film having an opening by the simultaneous forming method will be described below. A screen plate prepared so as to have a circular opening with a diameter of 300 μm is prepared at a portion where the first-layer conductive wire and the third-layer conductive wire are connected. The printing paste has transparency that does not impair the visibility when the printed film is placed on the front of the display, and the first and third conductive lines are electrically connected. Any insulating material that does not short-circuit may be used.

  As such a material, an organic polymer such as silicone resin, urethane resin, polyethersulfone, and polyamide can be used. By mixing a silica precursor such as silicon alkoxide in a solution containing these organic polymers, an insulator which is a dielectric in which an organic polymer and a silicon oxide are combined can be obtained. The composite dielectric not only improves the adhesion to glass, but also has high film strength. Furthermore, the third conductive wire can be easily laminated due to the influence of silicon oxide. The effect of. Of the organic polymers, polyethersulfone is preferably used in consideration of heat resistance.

  Other than tetraethoxysilane as the silica precursor, trimethoxysilane, triethoxysilane, tripropoxysilane, tetramethoxysilane, tetrapropoxysilane, methyltrimethoxysilane, ethyltrimethoxysilane, propyltrimethoxysilane, methyltriethoxysilane , Ethyltriethoxysilane, propyltriethoxysilane, dimethyldimethoxysilane, diethyldiethoxysilane, γ-chloropropyltrimethoxysilane, γ-chloropropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxy Silane, γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, phenyl Li propoxysilane, diphenyl dimethoxysilane, diphenyl diethoxy silane, etc. may be used.

  Preferably, a known thickening agent such as cellulose or polyethylene glycol is added to the coating solution to obtain a paste-like coating solution, which is printed by a screen printing method to volatilize a volatile component of the solvent, a thickening agent, etc. By performing heat treatment at 400 ° C., insulating films 4 and 6 having opening portions 7 and 8 having a thickness of 2 to 8 μm are formed.

  A specific example of forming an insulating film having an opening by the post formation method will be described below. This post formation method is a known patterning technique such as photolithography in the part where the opening parts 7 and 8 are formed, for example, a thickness of 1 to 20 μm, preferably 5 to 15 μm, and a diameter of 50 to 500 μm, preferably 100 to A 400 μm cylindrical heat-resistant resist is formed, and then any of Si, Al, Ti, Zn, Nb, Ta, In, and Sn is formed on the substrate by a vacuum deposition method such as coating, sputtering, or ion plating. A colorless dielectric film made of such an oxide or nitride as a main component is formed.

  Then, the insulating films 4 and 6 having the opening portions 7 and 8 having a thickness of 0.05 to 4 μm are formed by detaching the resist by immersing the article in acetone and performing ultrasonic cleaning.

  In addition, a method of forming a dielectric film first and then using the openings 7 and 8 by laser ablation or etching can also be used as a post formation method.

  For example, a colorless material consisting mainly of an oxide or nitride of Si, Al, Ti, Zn, Nb, Ta, In, Sn by a vacuum deposition method such as a coating method, sputtering, or ion plating on a substrate. A dielectric film is formed.

  After that, the part connecting the first-layer conductive wire and the third-layer conductive wire is laser ablation, masking other than the hole with resist, and chemical etching with hydrofluoric acid solution, oxygen, hydrogen , Reactive ion etching using a reactive gas such as nitrogen, fluorine, argon, carbon fluoride, or carbon chloride. In this way, insulating films 4 and 6 having opening portions 7 and 8 having a thickness of 0.05 to 4 μm are formed.

It is a figure which shows the principal part when the front view of the visible light transmission type planar coil element of this invention is seen. It is a figure which shows the cross section of a-a 'of FIG. It is a figure which shows the cross section of b-b 'of FIG. It is a figure which shows the part used as the junction part with the external circuit of a coil when the visible light transmission type planar coil element of this invention is seen from the front. It is a figure which shows the cross section of c-c 'of FIG. It is a figure which shows the whole image when the visible light transmission type planar coil element of this invention is seen from the front.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Visible light transmission type planar coil element 2 Substrate 3 Conductive line 4 of the first layer pattern film 4 Insulating film 5 of the second layer 6 Conductive line 6 of the pattern film of the third layer 7 Insulating film 7 of the fourth layer Opening portion 8 provided in the second-layer insulating film to connect the conductive wire of the first-layer pattern film and the conductive wire of the third-layer pattern film 8 Conductivity of the first-layer pattern film Opening part 9 for joining the conductive line of the pattern film of the wire or the third layer and the external circuit 9 Masking layer

Claims (8)

A substrate having visible light permeability, a first layer pattern film in which linear conductive lines are arranged in parallel on the substrate, and a dielectric formed so as to have an opening at an arbitrary point on the conductive lines A second-layer insulating film and a third-layer pattern film in which linear conductive lines are arranged in parallel on the insulating film, and the first-layer conductive lines are the opening portions. A structure in which the third-layer conductive wire is joined at two points through the opening portion, or a structure in which the third-layer conductive wire is joined to the first-layer conductive wire at two points through the opening portion Thus, a coil is formed by the first layer conductive wire and the third layer conductive wire, and a conductive wire arranged in parallel in the first layer and a conductive wire arranged in parallel in the third layer are The coils can be integrated by being arranged orthogonally in front view of the substrate, and the main component of the conductive wire is silver, copper, or , The width of the conductive wire 1 m to 50 m, the visible light transmissive flat coil element, wherein a conductive wire distance in the same layer was 0.1 mm to 10 mm. It is formed to have a substrate having visible light transparency, a first layer pattern film in which linear conductive wires are arranged in parallel on the substrate, and an opening portion at an arbitrary point on the conductive wires. A second-layer insulating film made of a dielectric, and a third-layer pattern film in which linear conductive lines are arranged in parallel on the insulating film, and the first-layer conductive lines are The structure is such that the third layer conductive line is joined at two points through the opening part, or the third layer conductive line is joined at two points through the opening part. The first layer conductive wire and the third layer conductive wire form a coil, and the conductive wire arranged in parallel in the first layer and the conductive arranged in parallel in the third layer. The wires are arranged orthogonally in front view of the substrate, so that the coil can be integrated, and the main component of the conductive wire is ITO, conductive Visible light transmissive flat coil elements of width 0.1 mm to 10 mm, characterized in that the 1μm~50μm the conductive wire distance in the same layer. 3. The visible light transmissive planar coil element according to claim 1, wherein the thickness of the second layer insulating film is smaller than the thickness of the first layer pattern film. 4. The visible light transmission type planar coil element according to claim 1, wherein a fourth layer insulating film made of a dielectric is formed on the third layer pattern film. 5. The visible light transmission according to claim 4, wherein the fourth-layer insulating film has an opening portion for joining the first-layer and / or second-layer conductive wire to an external circuit. 6. Mold plane coil element. 6. The visible light transmissive planar coil element according to claim 1, wherein the substrate has a rectangular shape, and a depression angle formed by the side of the substrate and the conductive wire is 20 to 45 degrees. . 7. The visible light transmission according to claim 1, wherein the distance between all conductive lines and the width of all conductive lines in the first layer pattern film and the third layer pattern film are constant. Mold plane coil element. 8. The visible light transmissive planar coil according to claim 1, wherein the first-layer conductive wire and the third-layer conductive wire are joined at the ends of the conductive wires, respectively. element.

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