WO2007007654A1

WO2007007654A1 - Discharge lamp operation device and bulb-shaped fluorescent lamp

Info

Publication number: WO2007007654A1
Application number: PCT/JP2006/313545
Authority: WO
Inventors: Kunihiko Ikada; Toshiya Tanaka; Katsuyuki Kobayashi; Hiroshi Kubota; Shinya Hakuta; Mari Nakamura; Hitoshi Kawano
Original assignee: Toshiba Lighting & Technology Corporation
Priority date: 2005-07-07
Filing date: 2006-07-07
Publication date: 2007-01-18
Also published as: JPWO2007007654A1; JP4784772B2

Abstract

By using a ceramic chip capacitor, it is possible to reduce the size of a discharge lamp operation device of a bulb-shaped fluorescent lamp. Even when the ceramic chip capacitor is short-circuited, it is possible to suppress excessive temperature increase. The ceramic chip capacitor is a capacitor (C5) for preheating and start contributing to the resonance of the discharge lamp device connected in parallel to a light emitting tube (4). The capacitor (C5) is located between wrapping pins (61, 61) and mounted on the surface of a substrate (58). An inverter circuit limits the current supplied to the ceramic chip capacitor to the normal current multiplied by 1.5 or below even when the capacitor (C5) is short-circuited, thereby preventing excessive temperature increase of the capacitor (C5).

Description

Discharge lamp lighting device and bulb-type fluorescent lamp

Technical field

TECHNICAL FIELD [0001] The present invention relates to a discharge lamp lighting device for lighting an arc tube and a bulb-type fluorescent lamp.

Conventionally, an arc tube having a bent bulb, a cap attached to one end side and a cover that supports the arc tube on the other end side, a lighting device housed in the cover, and a cover covering the arc tube A bulb-type fluorescent lamp equipped with a glove attached to the other end side is used (for example, see Patent Document 1).

[0003] In recent years, such a bulb-type fluorescent lamp has been miniaturized to have a lamp length and a maximum outer diameter that are close to those of a general lighting bulb defined by JIS. In order to bring the light distribution characteristics close to that of a general lighting bulb, a small discharge lamp lighting device is required.

Patent Document 1: Japanese Patent Laid-Open No. 2002-75010 (Page 3, Figure 1-5)

Disclosure of the invention

Problems to be solved by the invention

[0004] In order to reduce the size of the discharge lamp lighting device, the lead wire is led out from the outer casing of the resin mold. Instead of a film capacitor as a so-called discrete component, a small ceramic chip with good heat resistance It is conceivable to use a capacitor.

[0005] However, if an excessive current flows, the ceramic chip capacitor may break in a short-circuited state, and if the excessive current continues to flow in a short-circuited state, the temperature rises excessively. The surrounding parts may be thermally affected.

[0006] The present invention has been made in view of these points, and an object of the present invention is to provide a discharge lamp lighting device and a bulb-type fluorescent lamp that are easy to make in a small size and can prevent an excessive temperature rise. To do.

Means for solving the problem [0007] The discharge lamp lighting device according to claim 1, wherein the ceramic chip capacitor is connected in parallel to the arc tube; the high frequency power is supplied to a load circuit including the arc tube and the ceramic chip capacitor; An inverter circuit in which the short-circuit capacitor current supplied to the ceramic chip capacitor when the ceramic chip capacitor is short-circuited is 1.5 times or less of the normal capacitor current supplied to the ceramic chip capacitor. It is something.

[0008] For example, a discharge lamp lighting device is used for a bulb-type fluorescent lamp including a base and an arc tube. The arc tube includes a bent arc tube in which a plurality of U-shaped bulbs are arranged in parallel to form a single discharge path, an arc tube in which a single bulb is spirally bent, and the like at both ends of the discharge path. A pair of electrodes is sealed. The inverter circuit is a lighting circuit mainly composed of electronic components that turn on the arc tube by applying high frequency power of 10 kHz or more to the arc tube. A ceramic chip capacitor is also called a multilayer ceramic chip capacitor. It is composed of a dielectric sheet printed with a metal paste printed in layers and fired, and electrodes are connected to both ends of the laminate. The For example, if a starting voltage is applied for a long time due to the continued non-lighting state of the arc tube at the end of its life, the ceramic thin film may be damaged and destroyed in a short-circuited state. If excessive current continues to flow, the temperature may rise excessively and may affect the surrounding components thermally.

[0009] By using a ceramic chip capacitor, the discharge lamp lighting device can be made more compact than a configuration using a conventional film capacitor. Even when the ceramic chip capacitor is short-circuited, the capacitor current at the time of short-circuit supplied by the inverter circuit is limited to 1.5 times or less of the normal capacitor current, so the ceramic chip capacitor is short-circuited at the end of life or other abnormalities. Even if broken, the excessive temperature rise of the ceramic chip capacitor is prevented.

[0010] A discharge lamp lighting device according to claim 2 is a ceramic chip capacitor for starting connected to the arc tube; an inverter circuit for supplying high-frequency power to a load including the arc tube and the ceramic chip capacitor; and a ceramic chip capacitor And a current control means connected in series to suppress an excessive current.

[0011] And, by using a ceramic chip capacitor, Compared with the configuration used, the small size of the discharge lamp lighting device is facilitated. Even when the ceramic chip capacitor is short-circuited, the current control means suppresses an excessive current, so that an excessive temperature rise of the ceramic chip capacitor is prevented.

[0012] The discharge lamp lighting device according to claim 3 is the discharge lamp lighting device according to claim 2, wherein the current control means is a current that cuts off the current by self-destruction when an excessive current flows. It is a blocking element.

[0013] For example, the current interrupt device may be a pattern fuse formed by printing on a substrate in addition to an impedance device such as a resistor that is broken in a short-circuit state due to an overcurrent flowing.

[0014] By connecting this current interrupting element in series to a ceramic chip capacitor, the current control means can be easily configured.

[0015] The bulb-type fluorescent lamp according to claim 4 is a light emitting tube; a substrate; a plurality of connection terminals connected to wires introduced from the light emitting tube by projecting from the substrate and connected to each electrode of the light emitting tube; A ceramic chip capacitor mounted between the connection terminals and mounted in the substrate so as to be electrically connected to each connection terminal and connected in parallel to the arc tube, and the arc tube and the ceramic chip capacitor. A discharge lamp lighting device including an inverter circuit for supplying high-frequency power to the load circuit.

[0016] The connection terminals are, for example, a plurality of terminal pins that are electrically connected to the respective electrodes of the arc tube and are connected by means such as winding or welding of a plurality of wires led out from the arc tube.

[0017] By mounting a ceramic chip capacitor using a relatively narrow mounting space formed between the connection terminals, the substrate can be made smaller than a configuration using a conventional film capacitor. This makes it possible to reduce the size of the bulb-type fluorescent lamp. In addition, when the connection terminal is arranged close to the arc tube, the force near the connection terminal becomes relatively high. Ceramic chip capacitors have excellent heat resistance, so they are used even in such cases. It is possible.

The invention's effect

[0018] According to the discharge lamp lighting device of claim 1, a ceramic chip capacitor is used. As a result, it is possible to easily reduce the size of the discharge lamp lighting device as compared with a configuration using a conventional film capacitor. Even when the ceramic chip capacitor is short-circuited, the capacitor current at the time of short-circuit supplied by the inverter circuit is limited to 1.5 times or less of the normal capacitor current. Even if it is destroyed, excessive temperature rise of the chip capacitor can be prevented, and the surrounding parts are prevented from being thermally affected.

[0019] According to the discharge lamp lighting device of claim 2, the use of the ceramic chip capacitor makes it easier to reduce the size of the discharge lamp lighting device as compared with a configuration using a conventional film capacitor. Even when the ceramic chip capacitor is short-circuited, the current control means suppresses an excessive current, so that an excessive temperature rise of the ceramic chip capacitor can be prevented.

[0020] According to the discharge lamp lighting device according to claim 3, in addition to the effect of the discharge lamp lighting device according to claim 2, the current control means can be easily configured.

[0021] According to the light bulb-type fluorescent lamp of claim 4, the substrate is mounted by mounting the ceramic chip capacitor using a narrow mounting space between the connection terminals, compared to the configuration using the conventional film capacitor. It is possible to reduce the size of the bulb-type fluorescent lamp. The connection terminals may become hot near the arc tube, but the ceramic chip capacitor is excellent in heat resistance and can be used without causing thermal trouble.

Brief Description of Drawings

FIG. 1 is a cross-sectional view of a bulb-type fluorescent lamp showing a first embodiment of the present invention as viewed from a direction intersecting with a direction in which bulbs are juxtaposed.

FIG. 2 is a cross-sectional view of the bulb-type fluorescent lamp as seen from the side-by-side force of the bulbs.

FIG. 3 is a perspective view of the cover of the bulb-type fluorescent lamp.

FIG. 4 is a partial cross-sectional view of the cover of the bulb-type fluorescent lamp.

FIG. 5 is an end view showing the positional relationship among the holder of the bulb-type fluorescent lamp, the arc tube, and the substrate.

FIG. 6 is a perspective view of a holder of the same bulb-type fluorescent lamp. 7] It is a perspective view of the inside of the holder combined with the arc tube of the bulb-type fluorescent lamp.

FIG. 8 is a circuit diagram of a lighting device for the bulb-type fluorescent lamp.

FIG. 9 is a graph showing the characteristics of the lighting device of the bulb-type fluorescent lamp.

FIG. 10 is a graph showing the characteristics of the lighting device of the bulb-type fluorescent lamp.

[FIG. 11] (a) and (b) are explanatory diagrams showing the operation of the lighting device for the bulb-type fluorescent lamp.

FIG. 12 is a schematic view of a lighting device using a bulb-type fluorescent lamp.

FIG. 13 is a circuit diagram of a bulb-type fluorescent lamp showing a second embodiment.

FIG. 14 is a side view of a part of the lighting device for the bulb-type fluorescent lamp.

FIG. 15 is a partial cross-sectional view of a lighting device for a bulb-type fluorescent lamp showing a third embodiment.

Explanation of symbols

[0023] 4 arc tube

7 Lighting device as discharge lamp lighting device

37 wires

61 Wrapping pins as connection terminals

72 Inverter circuit

C5 Capacitor as a ceramic chip capacitor

F2 Fuse as current control means

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 to FIG. 12 show a first embodiment, FIG. 1 is a cross-sectional view of the bulb-type fluorescent lamp viewed from a direction intersecting with the parallel direction of the bulb, and FIG. Fig. 3 is a perspective view of a cover of a bulb-type fluorescent lamp, Fig. 4 is a cross-sectional view of a part of a bulb-type fluorescent lamp cover, and Fig. 5 is a bulb-type fluorescent lamp. Fig. 6 is a perspective view of the holder of the bulb-type fluorescent lamp, and Fig. 7 is a perspective view of the inside of the holder combined with the bulb of the bulb-type fluorescent lamp. Fig. 8 is a circuit diagram of a light bulb type fluorescent lamp lighting device, and Fig. 9 is a light bulb type fluorescent lamp lighting device. Fig. 10 is a graph showing the characteristics of the lighting device for the bulb-type fluorescent lamp, Fig. 11 is an explanatory diagram of the operation of the lighting device for the bulb-type fluorescent lamp, and Fig. 12 is an illumination using the bulb-type fluorescent lamp. It is the schematic of an apparatus.

In FIG. 1 and FIG. 2, 1 is a bulb-type fluorescent lamp, and this bulb-type fluorescent lamp 1 is supported by a cover 3 having a base 2 at one end in the height direction, and the other end of the cover 3. The arc tube 4, the holder 5 that supports one end of the arc tube 4 and is attached to the cover 3, the globe 6 that covers the arc tube 4 and is attached to the cover 3, the base 2 and the cover 3 are stored inside. A lighting device 7 is provided as a discharge lamp lighting device. In addition, the rated power is formed to have substantially the same appearance as general lighting bulbs such as 40 W type, 60 W type, and 100 W type incandescent bulbs. This general lighting bulb is defined in JIS C 7501.

[0027] The base 2 is an Edison type E26 type or the like, and includes a cylindrical shell 11 having a thread, and an eyelet 13 provided on the top of one end of the shell 11 via an insulating portion 12. Yes. A threaded portion 11a, which is a male screw, is formed on one end side of the shell 11, and an annular fixing portion lib is formed on the other end side so as to cover the one end portion of the cover 3 and fix it by pressing or bonding. .

Further, as shown in FIGS. 1 to 4, the cover 3 is formed of a heat-resistant synthetic resin such as polybutylene terephthalate (PBT), and the fixing portion lib of the shell 11 of the base 2 is formed on one end side. A cylindrical base mounting portion 16 is formed, and an expanded annular cover portion 17 is formed on the other end side. A plurality of holder mounting portions for attaching the holder 5 to the inside of the cover portion 17 18 is formed.

[0029] The base mounting portion 16 has a pair of wall portions 19 projecting from the inside of the base 2 at a position offset from the center line force of the cover 3, and the cover 3 is provided inside each of the wall portions 19 A substrate holding portion 20 is formed along the center line. A pair of wall portions 19 of the base attachment portion 16 of the cover 3 is provided, and an opening 21 facing the inside of the base 2 is formed in the portion. The circumferential dimension (circumferential length) of the pair of wall portions 19 is not more than 50% of the circumferential dimension of the cover 3, and the pair of wall portions 19 are connected to the base 2. The ratio of the dimension hll protruding to the side is in the range of 50% or less of the dimension hl2 of the thread 11a of the shell 11 in the height direction. These ranges include the case where the pair of wall portions 19 are not projected (0%). The circumferential dimension of the pair of wall portions 19 is in the range of 0 to 50% (preferably 5 to 40%) of the circumferential dimension of the cover 3, and the pair of wall portions 19 are on the base 2 side. The ratio of the dimension hll projecting in the range of 0 to 50% (preferably 10 to 40%) of the dimension hl2 of the screw portion 11a of the shell 11 in the height direction is set. If it exceeds 50%, the facing area between the shell 11 and the electronic component 60 of the lighting device 7 is reduced, and the heat dissipation is reduced, which is not preferable. It should be noted that a thread is partially formed on the outside of the wall portion 19 so as to be screwed into the inside of the screw portion 11a of the shell 11 of the base 2.

[0030] On the inner peripheral surface of the cap mounting portion 16 of the cover 3, a substantially semi-circular vent hole forming portion 22 is formed to project, and the vent hole forming portion 22 vents the cap 2 side and the arc tube 4 side. Ventilation hole 23 is formed in at least one place. This vent 23 is preferably in a range corresponding to a circle with a diameter of 0.5 to 5 mm in terms of cross-sectional area at one location. In this range, both air permeability and heat shielding performance can be achieved. If it is 5mm or less, the air permeability is lowered, and if it is 5mm or more, the heat insulation performance is lowered.

[0031] A through-hole 24 is formed in the base mounting portion 16 of the cover 3 so as to penetrate the inner and outer sides of the cover 3 corresponding to the position of the vent 23. The through hole 24 and the vent 23 on the inner peripheral surface side of the base mounting part 16 are communicated with each other through a communication groove 25.

[0032] A through hole 24 is also formed at a position on the opposite side of the circumference with respect to the position where the vent hole 23 of the cover 3 is formed, and the inside of the through hole 24 and the base mounting part 16 A communication groove 25 communicating with the peripheral surface is formed.

Further, as shown in FIGS. 1 and 2, the arc tube 4 has at least three U-shaped bent valves 31, 32, 33, and these valves 31, 32, 33 are connected pipes. 34 are sequentially connected to form one continuous discharge path 35. Each of the communication pipes 34 is formed by joining openings formed by heating and melting the vicinity of the end where the valves 31, 32, 33 are connected and then blowing them.

[0034] The valves 31, 32, and 33 are formed in a substantially U shape having a top portion that is curved at the middle portion of the tube body having a substantially cylindrical cross section made of glass with a tube outer diameter of 3 to 8 mm. That is, each of the valves 31, 3 2, and 33 includes a bent portion that is curved and a pair of straight pipe portions that are continuous with the bent portion and are parallel to each other. Valves 31, 32, and 33 have the same height as valve 32 on both sides. It has a relationship higher than the height of 1, 33, and its U-shaped surfaces are arranged side by side so as to face each other in parallel.

[0035] For example, a three-wavelength phosphor is formed on the inner surface of the arc tube 4. Inside the arc tube 4, a rare gas such as argon (Ar), neon (Ne), or krypton (Kr) is formed. Sealed gas containing mercury and mercury.

A pair of electrodes 36 are sealed by stem seals or pinch seals at one end portions of the bulbs 31 and 33 on both sides located at both ends of the discharge path 35. Each electrode 36 has a filament coil, and this filament coil is supported by a pair of linear wells. Each well is, for example, a pair of forces that are led out to one end of the valves 31 and 33 on both sides and connected to the lighting device 7 via a jumet wire sealed on one end of the valves 31 and 33 on both sides. Is connected to No. 37 (see Fig. 7).

[0037] Cylindrical tubules that are sealed by stem seals or pinch seals and are also called exhaust pipes at one end where the electrodes 36 of the valves 31 and 33 on both sides are sealed, and at both ends of the central valve 32 38 is projecting in communication. These capillaries 38 are sequentially sealed by melting in the manufacturing process of the arc tube 4, and the capillaries 38 are sealed, and the exhaust inside the arc tube 4 is exhausted through a part. After the sealing gas is sealed and replaced, sealing is performed by fusing an unsealed part of each of the thin tubes 38.

[0038] Of the thin tubes 38 at both ends of the central valve 32, one thin tube 38 is formed long so that the tip end extends to the inside of the base 2 and is connected to the straight tube portion of the valve 32. It is formed in parallel straight lines, and the main amalgam 39 as an amalgam is enclosed at the tip of the end when sealed. This main amalgam 39 is a alloy composed of bismuth, tin and mercury, is formed in a substantially spherical shape, and has an action of controlling the mercury vapor pressure in the arc tube 4 within an appropriate range. In addition, as the main amalgam 39, it is also possible to use a material formed of an alloy combining indium, lead, etc. in addition to bismuth and tin. Also, auxiliary amalgam having mercury adsorption / release action is attached and sealed in the wells of the electrodes 31 and 33 at both ends. Further, an auxiliary amalgam similar to the auxiliary amalgam provided in the valves 31 and 33 at both ends is enclosed at the other end of the central valve 32.

[0039] The arc tube 4 includes a pair of electrode side end portions 40 in which a pair of electrodes 36 of bulbs 31, 32, and 33 are sealed. Is located on one end side in the height direction. Valves 31, 32, and 33 have a tube outer diameter of 3 to 8 mm and a maximum width bl in the width direction that intersects the height direction of 30 mm or less.

Further, as shown in FIGS. 5 to 7, the holder 5 is formed of a heat-resistant synthetic resin material such as polybutylene terephthalate (PBT), for example, and has a disk-like substrate portion 42, the substrate portion. The peripheral force of 42 is provided with a cylindrical tube portion 43 protruding to one end side.

[0041] A protrusion 44 that can be inserted between the insides of the bulbs 31, 32, 33 of the arc tube 4 is formed at the center of the substrate portion 42, and each nozzle 31 is formed on the peripheral surface of the protrusion 44. , 32, 33 are formed with arc-shaped recesses 45 as bulb mounting portions, which are fitted with the peripheral surface portions facing the center side of the arc tube 4, and each of these recesses 45 has a holder. A mounting hole 46 communicating with the inside of 5 is formed.

[0042] A through hole 47 is formed in the substrate portion 42 so as to oppose the end faces of the respective nozzles 31, 32, 33, and the end force of each valve 31, 32, 33 protrudes into each through hole 47. Each wire 37 and each thin tube 38 are inserted. The diameter of the through hole 47 is smaller than the diameter of the valve 31, 32, 33. The ends of the nozzles 31, 32, 33 do not enter the through hole 47.

[0043] After the arc tube 4 is combined with the holder 5, an adhesive such as silicone resin or epoxy resin is injected from the inside of the holder 5 through each mounting hole 46 and each through hole 47. The inner peripheral surface side facing the center side of the arc tube 4 and the end surfaces of the bulbs 31, 32, 33 are bonded and fixed to the holder 5.

A claw portion 48 that is attached to the holder attaching portion 18 of the cover 3 is formed at one end portion of the cylindrical portion 43. A pair of substrate mounting portions 50 having a pair of substrate mounting grooves 49 facing each other at a position where the center line force of the holder 5 is also offset are formed inside the cylindrical portion 43. The base plate mounting groove 49 is formed in parallel with the center line of the holder 5, and has an opening formed on one end side of the cylindrical portion 43. Further, the cylindrical portion 43 has a pair of cutout portions 51 on the opposite side to the side where the pair of substrate mounting portions 50 are formed offset.

Further, as shown in FIGS. 1 and 2, the globe 6 has a glass bulb shape of a general lighting bulb such as an incandescent bulb by using a material such as glass synthetic resin having transparency or light diffusibility. It is formed in a near smooth curved surface. An opening 54 is formed at one end of the globe 6, and an edge 55 of the opening 54 is fitted inside the cover 17 of the cover 3, for example. The corn resin is bonded and fixed by an adhesive having viscosity such as epoxy resin.

In addition, the lighting device 7 includes a substrate 58 on which a plurality of electronic components 60 constituting the lighting circuit 59 are mounted. The substrate 58 has a width dimension that allows insertion into the inside of the base 2 and is formed in a substantially rectangular shape whose height is longer than the width dimension, and both side edges of the substrate 58 are a pair of substrates of the holder 5. The holder 5 is inserted into and engaged with the mounting groove 49 and arranged vertically along the direction of the center axis of the holder 5, and is arranged at a position offset from the center line of the holder 5. That is, in a state where the base 2, the cover 3, and the holder 5 are combined, the substrate 58 is arranged vertically along the direction of the center line of the base 2 with respect to the inside of the base 2, and the base 2 It is arranged at a position offset with respect to the center line. The position of the substrate 58 in the direction intersecting the height direction is temporarily fixed by the substrate mounting portion 50 of the holder 5, and the substrate 2 is connected to the wire 37 of the arc tube 4 and a wrapping pin 61 described later, or the base 2 and the holder. The position in the height direction is held by being sandwiched between

[0047] Force that electronic component 60 is mounted on both sides of board 58 On one side of board 58 where the gap between base 2 is wide, a transformer such as a ballast choke as a current-limiting inductor of electronic component 60 is provided. Large electronic components 60 such as CT, capacitor Cl, electrolytic capacitor C2 as a smoothing capacitor are mounted, and on the other side of the board 58 where the distance from the base 2 is narrow, the electronic component 60 Of these, transistors with low height, chip capacitors (chip capacitors) C3, C5, and surface mount electronic components 60 such as rectifiers are mounted.

[0048] It should be noted that the MOS type N-channel field effect transistor Q1 and the MOS type P-channel field effect transistor Q2 as transistors are surface-mounted as one package component on the other surface.

[0049] The smoothing electrolytic capacitor C2 is mounted so as to be perpendicular to the substrate 58 in the central region in the width direction of one surface of the substrate 58. Thereby, the mounting efficiency of the substrate 58 is improved, and the substrate 58 can be made small.

An electronic component (not shown) located on the side in the width direction of the substrate 58 approaching the base 2 is disposed to be inclined toward the center in the width direction of the substrate 58. As a result, the electronic component 60 can be inserted without hitting the inside of the base 2, and the lighting device 7 can be efficiently stored inside the base 2. The The electronic component 60 to be tilted is a discrete component and is a so-called radial component that is mounted on the substrate 58 with two lead wires.

[0051] The substrate 58 is provided with four wrapping pins 61 projecting from the other end, which is the arc tube 4 side, by winding and connecting a pair of wires 37 of the electrodes 36 of the arc tube 4 as connection terminals. ing.

[0052] As an electronic component 60 to be connected by using the wrapping pin 61 of the substrate 58, the positive temperature characteristic resistance element PTC1 disposed at the center position in the width direction of the substrate 58 is disposed at both positions in the width direction of the substrate 58. Negative temperature characteristic resistance elements NTC1, NTC2, etc. Each of these elements PTC1, NTCI, NTC2 is a discrete part, and is a part that can be connected to each other by soldering or welding the two lead wires to the wrapping pin 61 as necessary. The positive temperature characteristic resistance element PTC1 is a relatively heat-resistant component among the electronic components 60 of the lighting circuit 59, and protrudes from the edge of the substrate 58 facing the arc tube 4 side, inside the protrusion 44 of the holder 5. That is, it is arranged between the bulbs 31, 32 and 33 of the arc tube 4. The negative temperature characteristic resistance elements NTC 1 and NTC 2 are arranged in the empty space on both sides of the transformer CT on the surface side of the substrate 58. The negative temperature characteristic resistance elements NTC1 and NTC2 are also relatively resistant to heat among the electronic components 60 of the lighting circuit 59, and together with the positive temperature characteristic resistance element PTC1, the arc tube 4 side of the substrate 58 It is also possible to project the edge force opposite to the inside of the projection 44 of the holder 5, that is, between the bulbs 31, 32 and 33 of the arc tube 4.

[0053] Between the wrapping pins 61 and 61 to which the positive temperature characteristic resistance element PTC1 is connected, a capacitor C5 as a ceramic chip capacitor is surface-mounted on the other surface where the distance between the substrate 58 and the base 2 is narrow. ing. This capacitor C5 is a preheating starting capacitor connected in parallel to the both end electrodes of the arc tube 4. By making the capacitor C5 a surface-mountable ceramic chip capacitor, the space between the wrapping pins 61 and 61 can be effectively used to increase the mounting efficiency of electronic components. Note that mounting the capacitor C5 between the connection terminals can also be applied to a lighting device in which the circuit board is placed horizontally with respect to the base 2; however, when it is placed vertically as in the present embodiment. Has a merit that it is possible to use a ceramic chip capacitor with excellent heat resistance because the connection terminal (wrapping pin 61) is located on the arc tube 4 side and is likely to become high temperature. Also this capacitor C5 is a so-called 3225 size of 3.2 mm X 2.5 mm, for example.

In the state where the cover 3 and the base 2 are combined, a space is formed between the tip of the wall portion 19 of the cover 3 and the insulating portion 12 of the base 2, and the edge of the substrate 58 passes through this space. Directly facing the shell 11 of the base 2 at a relatively short distance. The substrate 58 has an edge facing the space portion of the substrate 58, that is, one edge portion facing the inner surface of the shell 11 of the substrate 58 and an edge facing the insulating portion 12 on the wallet 13 side of the substrate 58. A wiring pattern 62 having the same potential as that of the shell 11 is formed along the corner that is the edge near the shell 11 at the edge, and the eyelet 13 is formed at the center of the edge of the substrate 58 facing the eyelet 13. A wiring pattern 63 having the same potential as that of the wiring pattern 63 is formed. A capacitor C1, which is the first electronic component 60 on the input side of the lighting device 7, is connected to the wiring patterns 62 and 63. As for the other side edge portion of the substrate 58, the wiring pattern 62 may be disposed in the same manner as the one side edge portion of the substrate 58, or the wiring pattern may be separated from the electronic components to increase the insulation distance. It may be secured.

One end of each of the lead wires 64 and 65 is connected to each wiring pattern 62 and 63, and the other end of each of the lead wires 64 and 65 is connected to the shell 11 and the eyelet 13 of the base 2. Each lead wire 64, 65 is a covered electric wire in which the core wire is covered with an insulating material, and one end portion of the conductive core wire protruding from the end portion of the insulating material is connected to each wiring pattern 62, 63, and the core wire The other end of each is electrically connected to the shell 11 and the eyelet 13.

Further, the tip end portion of the lead wire 64 connected to the shell 11 is connected by being sandwiched between the base attaching portion 16 of the cover 3 and the fixing portion 1 lb of the shell 11.

In addition, a narrow tube 38 in which a main amalgam 39 is enclosed is disposed between the surface of the substrate 58 where the distance from the base 2 is narrow. Thereby, the lighting device 7 and the thin tube 38 are efficiently arranged inside the base 2.

[0058] The offset amount of the substrate 58 with respect to the central axis of the base 2 is preferably in the range up to the position of 3Z4 of the inner diameter of the base 2. If this offset amount is closer to the inner surface of the base 2 than the position of 3Z4, the width of the board 58 is narrowed, and the mounting area of the board 58 is reduced, so the mounting efficiency of the electronic component 60 is reduced. Nah ...

[0059] Further, inside the cover 3, a heat blocking member 68 is provided that thermally blocks the base 2 side and the arc tube 4 side. This heat shielding member 68 is made of, for example, silicone resin or epoxy resin. And is injected so as to fill at least the opening between the inner peripheral surface of the cover 3 and the substrate 58 and the electronic component 60. At this time, the heat blocking member 68 is not injected into the force vent 23 which is injected into the inside of the cover 3 which is the inside of the vent forming portion 22, and the ventilation state is maintained. In addition, to thermally shut off the base 2 side and the arc tube 4 side, the opening between the vertically arranged substrate 2 and the inside of the force bar 3 may be sealed without gaps, and if the heat can be cut off, the gaps will be closed. It may be. Further, the heat shield member 68 may be provided to the inside of the base 2 or the inside of the holder 5. If the cover is provided to the inside of the base 2, the cover 3 and the base 2 are bonded and fixed. And the strength is improved. Further, if the inner side of the holder 5 is provided, the strength of the force bar 3 and the holder 5 is improved for the same reason.

In addition, a heat conductive member 69 that thermally connects the tip of the thin tube 38 enclosing the main amalgam 39 disposed in the base 2 and the base 2 is disposed inside the base 2. Yes. The heat conductive member 69 may be further thermally connected with some electronic components 60 such as an electrolytic capacitor C2 which is a heat generating component. The heat conductive member 69 is made of, for example, silicone resin or epoxy resin. For example, before combining the base 2, the tip of the capillary 38 accommodated in the base 2, the substrate 58, and the electronic component 60 Each component can be connected by the heat conductive member 69 by injecting the heat conductive member 69 into the above or by combining the base 2 into which the heat conductive member 69 is injected. It should be noted that the heat conductive member 69 may be filled in the entire inside of the base 2, that is, may be in contact with the heat blocking member 68.

FIG. 8 shows a circuit diagram of a lighting device as a discharge lamp lighting device. A capacitor C 1 constituting a filter is connected to the commercial AC power source e via a fuse F1, and an input terminal of a full-wave rectifier 71 is connected to the capacitor C 1 via an inductor L1 constituting the filter. Also, a smoothing electrolytic capacitor C2 is connected to the output terminal of the full-wave rectifier 71 to form an input power supply circuit E. The smoothing electrolytic capacitor C2 of the input power supply circuit E has an alternating current that generates high-frequency power. An inverter main circuit 73 of a half-bridge type inverter circuit 72 as a power source is connected.

[0062] The inverter main circuit 73 is a MOS type N-channel transistor that is complementary to each other and is a switching element in parallel with the smoothing electrolytic capacitor C2. Effect transistor Q2 is connected in series. N-channel field effect transistor Q1 and P-channel field effect transistor Q2 have their sources connected to each other!

[0063] Between the drain and the source of the field effect transistor Q2, the primary winding L2 of the transformer CT constituting the ballast choke as the resonant inductor, the capacitor C3 for direct current cut, and the fluorescent lamp as the arc tube 4 as the discharge lamp FL is connected. The field effect transistor Q2 of the fluorescent lamp FL has one end of each of the electrode filament coils FLa and FLb as filaments at both ends of the fluorescent lamp FL connected to the drain and source sides of the fluorescent lamp FL. A capacitor C5 for preheating and starting that contributes to resonance as a resonance capacitor is connected between the end and the other end of the other electrode filament coil FLb. The electrode filament coils FLa and FLb are coated with an emitter. Further, a positive temperature characteristic resistive element (Positive Temperature Coefficient) PTC 1 is connected in parallel to the fluorescent lamp FL.

[0064] Then, between the smoothing electrolytic capacitor C2 and the gate of the field effect transistor Q1 and the gate of the field effect transistor Q2, a starting resistor R1 constituting the starting circuit 75 is connected, and these field effect transistors are connected. A series circuit of a capacitor C6 and a capacitor C7 is connected between the gate of Q1 and the field effect transistor Q2 and the source of the field effect transistor Q1 and the field effect transistor Q2, and the capacitor C6 and the gate as a gate control means are connected. A series circuit of Zener diode ZD 1 and Zener diode ZD2 for gate protection of field effect transistor Q1 and field effect transistor Q2 is connected in parallel to the series circuit of capacitor C7 of control circuit 76. In addition, the primary winding L2 of the transformer CT is magnetically coupled to the secondary winding L3, and this secondary winding L3 is an inductor having one end connected to the connection point of the capacitors C6 and C7. It is connected to the connection point between the other end of L4 and the discharging resistor R2. Capacitor C6 also constitutes a trigger element of starter circuit 75, and discharge resistor R2 of starter circuit 75 is connected in parallel to the series circuit of capacitor C6 and inductor L4.

[0065] In addition, a parallel circuit of a resistor R3 of the starting circuit 75 and a capacitor C8 for improving switching is connected between the drain and source of the field effect transistor Q2.

[0066] Also, one end of each of the electrode filament coils FLa and FLb of the fluorescent lamp FL and the other Negative temperature characteristic resistors NTC1 and NTC2 are connected between the terminals.

[0067] The operation of the lighting device 7 will be described.

[0068] First, when the power is turned on, the voltage of the commercial AC power source e is full-wave rectified by the full-wave rectifier 71 and smoothed by the smoothing electrolytic capacitor C2.

[0069] A voltage is applied to the gate of the N-channel field effect transistor Q1 via the resistor R1, and the field effect transistor Q1 is turned on. When the field effect transistor Q1 is turned on, a voltage is applied to the closed circuit of the primary winding L2, the capacitor C3, and the capacitor C5 of the transformer CT, and a current flows through the primary winding L2, the capacitor C3, and the capacitor C5 of the transformer CT, and then accumulates. The current reverses and vibrates, forming a resonant circuit. At this time, the impedance component of the positive temperature characteristic resistance element PTC1 is included in a part of the resonance synthesis component. In addition, a resonant voltage waveform corresponding to the power ratio of the inductance component of the primary line L2 of the transformer CT is induced in the secondary line L3 of the transformer CT, and the LC series circuit of the capacitor C7 of the gate control circuit 76 and the inductor L4 Generates a voltage that turns on the field effect transistor Q1 and turns off the field effect transistor Q2 at a substantially constant frequency.

[0070] Next, when the resonance voltage of the primary winding L2, the capacitor C3, and the capacitor C5 of the transformer CT is inverted, a voltage opposite to the previous voltage is generated in the secondary winding L3, and the gate control circuit 76 has a field effect transistor. A voltage is generated that turns off Q1 and turns on field effect transistor Q2. Furthermore, when the resonance voltage of the primary winding L2, the capacitor C3, and the capacitor C5 of the transformer CT is inverted, the field effect transistor Q1 is turned on and the field effect transistor Q2 is turned off. Thereafter, similarly, the field effect transistor Q1 and the field effect transistor Q2 are alternately turned on and off to generate a resonance voltage, and a resonance current flows.

[0071] In a state where this resonance current has flown, since the temperature of the positive temperature characteristic resistance element PTC1 is low, the resistance value is low, for example, about 3 kQ to 5 kQ, and the current flowing through the positive temperature characteristic resistance element PTC1 is large. At this time, the resonance voltage generated between both ends of the fluorescent lamp FL becomes low.

[0072] When current flows through the positive temperature characteristic resistance element PTC1, Joule heat is generated, and when the resistance value of the positive temperature characteristic resistance element PTC 1 increases and the current flowing through the positive temperature characteristic resistance element PTC 1 decreases, resonance occurs. Since the composite component changes, the current flowing through the fluorescent lamp FL increases. As the resonance operation changes, the soft start operation is performed so that the resonance voltage gradually increases.

[0073] Since a part of the resonance current also flows through the capacitor C5 which is a part of the resonance capacitor via the electrode filament coils FLa and FLb of the fluorescent lamp FL, the electrode filament coils F La and FLb have a resonance voltage. It is directly preheated with sufficient time to rise.

[0074] After the fluorescent lamp FL is lit, the resistance value of the positive temperature characteristic resistance element PTC1 is about several tens of kΩ, and the equivalent resistance value of the fluorescent lamp FL is sufficiently smaller than the resistance value of the positive temperature characteristic resistance element PTC1. The resonance voltage is lowered and the fluorescent lamp FL is kept on. In addition, the current flowing through the electrode filament coils FLa and FLb can be reduced by connecting the positive temperature characteristic resistance element PTC1 in parallel to the fluorescent lamp FL on the inverter main circuit 73 side, which is not the capacitor C5. Therefore, power loss can be suppressed accordingly.

[0075] As described above, since the preheating of the electrode filament coils FLa and FLb of the fluorescent lamp FL can be made appropriate by the change in the resistance value of the positive temperature characteristic resistance element PTC1, the emitter is scattered undesirably (sputtering). Therefore, the number of flashing lifetimes of the fluorescent lamp FL can be improved.

[0076] In addition, when the temperature of the negative temperature characteristic resistance elements NTCl and NTC2 is low before the fluorescent lamp FL is started, the resistance value of the negative temperature characteristic resistance elements NTCl and NTC2 is high. It flows into the electrode filament coils FLa and FLb of the fluorescent lamp FL and preheats the electrode filament coils FLa and FLb appropriately. Furthermore, as the resonance current increases, the negative temperature characteristic resistance elements NTCl and NTC2 generate heat due to Joule heat due to a part of the resonance current that has also flowed in the negative temperature characteristics resistance elements NTCl and NTC2, and further, the fluorescent lamp FL As the temperature rises while receiving the thermal effect from the negative temperature characteristic resistance element NTCl, NTC2, the resistance value decreases. As a result, the current flowing in the electrode filament coils FLa and FLb gradually flows in the negative temperature characteristic resistance elements NTCl and NTC2.

[0077] Furthermore, when the temperature of the negative temperature characteristic resistance elements NTCl and NTC2 rises after the fluorescent lamp FL is turned on and the resistance value decreases as much as possible, most of the resonance current is transferred to the negative temperature characteristic resistance elements NTCl and NTC2. Since the electric current hardly flows into the electrode filament coils FLa and FLb, the power loss due to the electrode filament coils FLa and FLb can be reduced as much as possible.

[0078] Further, the substrate 58 extends from one end side that is the base 2 side to the other end side that is the arc tube 4 side. An output portion of an input power circuit E connected to the base 2, an inverter circuit 72 connected to the input power circuit E 2, and an inverter circuit 72 connected to the arc tube 4 are formed in this order. As a result, the wiring patterns formed on the substrate 58 are arranged in order in one direction from the input side to the output side, and the substrate 58 can be miniaturized.

[0079] Further, the inverter circuit 72 of the lighting device 7 is a load at the time of normal operation, that is, at the time of normal lighting of the arc tube 4, as shown in the graph of the load curve of FIG. 9 and FIG. 11 (a). When measured between the electrode filament coils FLa and FLb of the fluorescent lamp FL, a current IL of 135 mA is supplied at 80 kHz and 85 V. This load curve is set in a so-called standing state where the voltage drops sharply as the current increases compared to the characteristics of the conventional inverter circuit indicated by the broken line B in FIG. When the load is short-circuited, the inverter is configured to have a V–I characteristic that allows a current ILs (= 2.2IL) that is 2.2 times the normal value to flow. Capacitor C5 operates as a component of inverter circuit 72 having this V—I characteristic, and is a 3225 size ceramic chip capacitor. Fig. 10 shows a graph of the load curve when measured at both ends of the capacitor C5. As shown in Fig. 11 (b), when the normal capacitor current Ic is 220 mA, the normal capacitor current Ic 1. It shows a characteristic that is almost OV when the capacitor current Ics (= 1. 361c) flows when the short circuit current is 300mA or less, for example 300mA. The characteristics of this lighting device 7 are realized by, for example, setting of the secondary winding L3 and capacitor C7 of the transformer CT, setting of the primary winding L2 of the transformer CT, or setting of the capacitors C6 and C7. The Furthermore, as the current increases in this way, other characteristics can be improved by the characteristic that the voltage rapidly decreases.

[0080] Here, if a high voltage is applied to the capacitor C5 for a long time due to, for example, the non-lighting state at the start of the arc tube 4 at the end of life or the continued half-wave discharge, the ceramic chip The ceramic thin film that forms capacitor C5, which is a capacitor, may be damaged, resulting in a low-impedance state that includes a short circuit. In addition, in such a short-circuited state, if an excessive short-circuit capacitor current Ics that exceeds 330 mA, that is, 1.5 times the normal capacitor current Ic, continues to flow to the capacitor C5, the capacitor C5 will exceed 200 ° C. Excessive temperature rises caused the capacitor C5 itself to burn out, and the capacitor C5 could become red hot and cause adverse thermal effects on surrounding components. In this way, the short circuit The phenomenon in which the capacitor current Ics exceeds 1.5 times the normal capacitor current Ic and causes a malfunction is prominent when the element body of the ceramic chip capacitor is small enough to fit within a 3.5 mm square frame. Has been confirmed to occur. However, in this embodiment, since the V—I characteristic of the inverter circuit 72 is set so that only a current Ics of 300 mA flows at maximum through the capacitor C5, an excessive temperature rise of the capacitor C5 is prevented. Smoke, ignition and combustion of the product are prevented.

Next, in order to assemble the bulb-type fluorescent lamp 1, one end side of the arc tube 4 and the holder 5 are combined, and an adhesive is injected from the inside of the holder 5 through the mounting holes 46 and the through holes 47. The one end side of the arc tube 4 and the holder 5 are bonded and fixed.

[0082] Insert both side edges of the substrate 58 into the pair of substrate mounting grooves 49 of the holder 5, insert the substrate 58 inside the holder 5, and pull it out inside the holder 5! / Each wire 37 is wound around and connected to each wrapping pin 61 of the board 58 (illustration of this wound state is omitted).

The holder 5 and the cover 3 are combined and coupled, and the heat blocking member 68 is injected so as to fill the opening between the inner peripheral surface of the cover 3 and the substrate 58 and the electronic component 60.

[0084] The tip of one lead 65 connected to the input side of the substrate 58 is connected to the eyelet 13 of the base 2 and the tip of the other lead 64 is bent into a U shape to cover 3 The fixing part lib of the shell 11 of the base 2 is fitted to the outer periphery of the base mounting part 16 so that the leading end of the lead wire 64 is sandwiched, and the fixing part lib of the shell 11 is covered with the cover 3 Secure to the base mounting part 16 by caulking, and connect the other lead 64 to the shell 11 electrically and mechanically.

[0085] Before the base 2 is combined, the heat conductive member 69 is injected into the tip of the thin tube 38 accommodated in the base 2, the substrate 58, the electronic component 60, or the like. 69 is injected into the inside and the base 2 is combined to connect the tip of the thin tube 38, the substrate 58, the electronic component 60, and the base 2 with the heat conductive member 69.

[0086] The luminous bulb 4 is covered with a globe 6, and the globe 6 is fixed to the cover 3 with an adhesive.

[0087] Then, as shown in FIG. 12, the illuminating device 81, which is a downlight, for example, has a luminaire main body 82, and a socket 83 and a reflector 84 are attached in the luminaire main body 82. A light bulb shaped fluorescent lamp 1 is attached to the ket 83.

[0088] Then, according to the present embodiment, the lighting device 7 of the bulb-type fluorescent lamp having the LC resonance method is connected to the arc tube 4 in parallel and contributes to the resonance of the discharge lamp lighting device. Capacitor C5 is a ceramic chip capacitor, so the discharge lamp lighting device can be easily reduced in size compared to the conventional configuration using a film capacitor as a discrete component in which lead wires are derived from the outer casing of the resin mold. As a result, the bulb-type fluorescent lamp 1 can be easily brought close to the outer shape and light distribution characteristics of a general lighting bulb defined in JIS.

[0089] In addition, when a high voltage is applied to the capacitor C5 for a long time due to, for example, the non-lighting state at the start of the arc tube 4 at the end of life or the continued half-wave discharge, the ceramic thin film is formed. There is a possibility that it will be damaged and short-circuited.In addition, if excessive current continues to flow in the short-circuited state, an excessive temperature rise may occur. Even if a capacitor C5 is short-circuited, the V-I characteristic of the inverter circuit 72 is set so that only a capacitor current Ics of 1.5% or less of the normal capacitor current Ic flows to the capacitor C5! Therefore, excessive temperature rise of capacitor C5 can be prevented.

[0090] In the above embodiment, the capacitor C5, which is a ceramic chip capacitor, has a voltage V- of the inverter circuit 72 so that only a capacitor current Ics at a short-circuit of 1.5 times or less of a normal capacitor current Ic flows. Force that sets the I characteristic The ratio characteristic between the normal capacitor current Ic and the short-circuit capacitor current I _CS is more preferably in the range of 1.0 to 1.4 times. In other words, an excessive temperature rise of the capacitor C5 is surely prevented by setting it to 1.4 times or less. On the other hand, by setting it to 1.0 times or more, fixed frequency control or constant current control can be used, and it is possible to reliably prevent an excessive temperature rise of the capacitor C5.

[0091] Further, the capacitor C5, which is a ceramic chip capacitor, faces the other surface on the side where the distance between the substrate 58 and the base 2 is narrow between the wrapping pins 61 and 61 to which the positive temperature characteristic resistance element PT C1 is connected. Since it is mounted, the narrow mounting space between the wrapping pins 61 and 61 is effectively used to increase the mounting efficiency of electronic components, the board 58 is downsized, and the bulb-type fluorescent lamp 1 is downsized. wear. Furthermore, mounting the capacitor C5 between the connection terminals means that for the lighting device in which the circuit board is placed vertically with respect to the base 2, the connection terminal (wrapping pin 61) is located on the arc tube 4 side and the temperature is high. Therefore, it is effective to use a ceramic chip capacitor with excellent heat resistance.

Then, the bulb-type fluorescent lamp 1 configured as described above has a substrate 58 formed in a width dimension that can be inserted inside the base 2 in a vertical shape along the direction of the center line of the base 2. As a result, the substrate 58 and the electronic component 60 can be placed inside the base 2 and the cover 3 can be made compact.

[0093] By arranging the substrate 58 at a position offset with respect to the center line of the base 2, the large electronic component 60 of the electronic components 60 can be disposed on one side having a large distance from the base 2 of the substrate 58. Therefore, the lighting device 7 can be efficiently stored inside the base 2, and thus the cover 3 can be made compact.

[0094] Among the electronic components 60 to be mounted on the substrate 58, the smoothing electrolytic capacitor C 2 having a relatively high height can be mounted in the center region in the width direction of one surface of the substrate 58 in the direction perpendicular to the substrate 58. Therefore, the mounting efficiency of the board 58 is improved, and the board 58 can be miniaturized.

[0095] Since one end side force of the substrate 58 on the base 2 side is formed on the other end side of the substrate 58 on the arc tube 4 side, the output portions of the input power circuit E, the inverter circuit 72, and the inverter circuit 72 are formed in this order. The wiring pattern formed on the substrate 58 can be arranged in one direction in order from the input side to the output side, and the substrate 58 can be made compact.

[0096] Further, the main amalgam 39 of the narrow tube 38 of the arc tube 4 is formed by arranging the substrate 58 formed in a width dimension that can be inserted inside the base 2 in a vertical shape along the direction of the center line of the base 2. Can be placed between the base 58 and the substrate 58 inside the base 2 to reduce the heat effect from the arc tube 4 that is lit on the main amalgam 39, while the lighting device 7 and The narrow tubes 3 8 can be arranged efficiently, whereby the cover 3 can be made compact.

[0097] Since the substrate 58 is disposed at a position offset with respect to the center line of the base 2 and the narrow tube 38 is disposed between the surface side of the base 58 having a narrow space between the base 2 and the base 2 of the base 58, The large electronic component 60 can be arranged on the surface side where the gap is wide, and the lighting device 7 and the thin tube 38 can be arranged efficiently inside the base 2.

[0098] Further, the positive temperature characteristic resistance element PTC1 and the negative temperature characteristic resistance are connected to the wrapping pin 61 of the substrate 58. Since elements NTC1 and NTC2 can be wound and connected, these elements PTC1, NTC1 and NTC2 can be easily connected by retrofitting.

[0099] Since the positive temperature characteristic resistance element PTC1 protrudes from the edge of the substrate 58 facing the arc tube 4 side and is disposed inside the arc tube 4, the positive temperature characteristic resistance element PTC 1 can be efficiently arranged. The substrate 58 can be made small.

[0100] As shown in Fig. 1, the bulb-type fluorescent lamp 1 configured as described above has a maximum width bl in the width direction of the arc tube 4 having bulbs 31, 32, and 33 having a tube outer diameter of 3 to 8 mm. Formed to be 30 mm or less, excluding the base 2, the ratio of the dimension h2 of the cover 3 exposed from the base 2 to the lamp length dimension hi is 0 to 25%, the maximum outer diameter of the cover 3 b2 is outside the base 2 Diameter Dimension b3 1.0 to 1.5 times or Globe 6 maximum outer diameter b4 0.48 to 0.73 times, Globe 6 base 2 outer diameter dimension can be 40 mm or less . As a result, the appearance is almost the same as a general lighting bulb such as an incandescent bulb. Note that the ratio of the dimension h2 of the cover 3 exposed from the base 2 to the lamp length dimension hi excluding the base 2 is 0%. When the bulb-type fluorescent lamp 1 is viewed from the width direction, the force bar 3 is the base 2 In this case, the edge 55 of the opening 5 4 of the globe 6 fits into the shell 11 of the base 2.

[0101] Furthermore, the bulb-type fluorescent lamp 1 has an inner peripheral surface on one end side of the bulbs 31, 32, 33 in the hollow portion 45 of the holder 5 facing the center side force bulbs 31, 32, 33 of the arc tube 4. Is fixed with an adhesive, so the light emitted from the outer peripheral surface of one end of the valves 31, 32, 33 is used so that the outer peripheral surface of the one end of the valves 31, 32, 33 is not blocked by the holder 5. The luminous efficiency can be improved.

[0102] Also, by arranging the board 58 vertically along the direction of the center line of the base 2, the board 58 and the electronic component 60 are placed inside the base 2, and the cover 3 is reduced in size. In addition to having the same appearance as the electric bulb, even if there is an opening between the board 58 and the cover 3 due to the vertical arrangement of the board 58, the heat shielding member 68 placed inside the cover 3 can By thermally blocking the arc tube 4 side, the thermal influence from the arc tube 4 on the electronic component 60 disposed inside the base 2 can be reduced.

[0103] By the way, when the tip of the thin tube 38 enclosing the main amalgam 39, a part of the electronic component 60, and the base 2 are thermally connected by the heat conductive member 69 inside the base 2 The heat of the electronic component 60 is efficiently transferred to the base 2 to dissipate the heat, for example when the base 2 side lights up downward. In other words, when the temperature of the tip of the thin tube 38 is low, heat from the electronic component 60 is transferred to the tip of the thin tube 38. Therefore, in this case, it is possible to keep the temperature at the tip of the narrow tube 38 uniform by the heat conductive member 69 and to prevent the reduction of the total luminous flux.

[0104] The base 2 side and the arc tube 4 side are thermally shut off by these heat shut-off members 68, and the tip of the thin tube 3 8 and some of the electronic components 60 and the base 2 are made into the heat conductive member 69. If the base 2 of the bulb-type fluorescent lamp 1 is oriented upward, downward, horizontal, etc., the temperature of the tip of the narrow tube 38 in the base 2 and the electronic component 60, etc. Can be kept uniform, and the total light flux and luminous efficiency can be made constant.

[0105] Further, since the cover 3 is provided with the vent 23 for ventilating the base 2 side and the arc tube 4 side, the base 2 side and the arc tube 4 side are provided even if the heat shield member 68 is provided inside the cover 3. It is possible to ensure air permeability and to release the internal pressure of the globe 6 due to the heat generated by the arc tube 4 when it is lit to the base 2 side. Since the cover 3 is provided with a through-hole 24 that penetrates the inside and outside of the cover 3, the internal pressure of the lamp due to the heat generated during lighting can be released to the outside. For this reason, the glove 6 does not come off due to an increase in internal pressure. Also, the generated moisture such as silicone resin used in the adhesive, the heat shielding member 68 and the heat conductive member 69 can be released to the outside, and the adhesion to the inner surface of the globe 6 can be reduced.

[0106] Further, the circumferential dimension of the pair of wall portions 19 is set in a range of 0 to 50% of the circumferential dimension of the cover 3, or the pair of wall portions 19 protrudes toward the base 2 side. By setting the ratio of the dimension hll to be in the range of 0 to 50% of the dimension hl2 of the thread 11a of the shell 11 in the height direction, the electronic component 60 of the lighting device 7 and the shell 11 face each other, and the electronic component 60 The generated heat can be transferred well to the shell 11 of the base 2 and the heat dissipation can be improved.

[0107] Further, by arranging the substrate 58 vertically, the edge of the substrate 58 and the shell 11 of the base 2 face each other at a relatively short distance, so that the insulation distance becomes <<, but the shell 11 of the base 2 becomes By forming the wiring pattern 62 having the same potential as that of the shell 11 on the edge of the opposing substrate 58, the board area required for forming the wiring pattern can be reduced, thereby reducing the board shape.

[0108] In this way, the bulb-type fluorescent lamp 1 has substantially the same appearance as a general lighting bulb such as an incandescent bulb, and the light distribution to the base 2 is improved so that it can be used for general lighting such as an incandescent bulb. A light distribution characteristic close to that of a light bulb is obtained, and stable regardless of the orientation of the light bulb-type fluorescent lamp 1. Luminous flux and luminous efficiency can be obtained, and the rate of application to lighting fixtures using general lighting bulbs such as incandescent bulbs can be improved.

Next, FIG. 13 and FIG. 14 show a second embodiment, FIG. 13 is a circuit diagram of a bulb-type fluorescent lamp, and FIG. 14 is a side view of a part of a lighting device for the bulb-type fluorescent lamp. .

[0110] In the present embodiment, current control means for suppressing an excessive current is connected in series to the resonance capacitor C5. Thereby, excessive temperature rise of the chip capacitor can be easily prevented.

That is, in a discharge lamp lighting device of a bulb-type fluorescent lamp, a chip capacitor is used as an LC resonance type resonance capacitor, or a chip capacitor is used as a preheating capacitor in place of a conventional film capacitor. Use of ceramic chip capacitors makes it easy to reduce the size of parts and make it easier to reduce the size of a bulb-type fluorescent lamp.Since a ceramic chip capacitor has a thin ceramic film, the capacitor is short-circuited due to some circuit abnormality. If breakdown occurs, an excessive short-circuit current may flow, causing the capacitor to overheat.

Therefore, for example, as shown in FIG. 13 and FIG. 14, a pattern connected to one of the terminal portions of the capacitor C5 that is a chip capacitor, that is, the electrodes C5a and C5b is used as a current interrupting element of the current control means. For example, if a short-circuit current flows through the capacitor C5 by inserting a fuse F2 such as a pattern fuse, the fuse F2 is blown to prevent excessive temperature rise of the capacitor C5, and It can prevent ignition and combustion.

[0113] In addition, a resonant capacitor C4 is provided in parallel with the fluorescent lamp FL. Resonance capacitor C4 and resonance capacitor C5 are separately provided to divide the capacitance for resonance. The capacitance of capacitor C5 is preheated to electrode filament coils FLa and FLb and the fluorescent lamp FL is turned on. It is possible to make the current that flows from time to time appropriate, and it is possible to efficiently preheat the electrode filament coils FLa and FLb and to reduce the current that flows to the capacitor C5 after the fluorescent lamp FL is turned on. Decline can be prevented.

[0114] And the resistance value of the positive temperature characteristic resistance element PTC1 is increased! As the resonance component changes, the resonance current increases and the primary winding L2 of the transformer CT constituting the ballast choke is When saturated and the voltage rises to the voltage required for starting the lamp, the fluorescent lamp FL starts to discharge, starts and lights up.

[0115] Further, as a current limiting means, an impedance element such as a resistor having a specification with low heat resistance is used instead of the pattern fuse, and the circuit is operated by breaking the impedance element. It ’s okay.

Next, FIG. 15 shows a third embodiment, and FIG. 15 is a partial cross-sectional view of a lighting device for a bulb-type fluorescent lamp.

[0117] Resonant capacitor C4 and preheating / starting capacitor C5 that contributes to resonance, each chip capacitor for preheating for resonance, such as non-flammable or flame retardant and good thermal conductivity mucus For example, it can be covered with a protective layer formed by applying silicone resin, asphalt, resin, or the like. For example, as shown in FIG. 15, for a capacitor C5 in which electrodes C5a and C5b are mounted on a substrate 58 with a solder 103, as shown in FIG. 15, a silicone resin is applied to form a protective layer 105 that covers the capacitor C5 and the solder 103. The capacitor C5 can be efficiently dissipated through the protective layer 105. On the other hand, when a large current flows through the capacitor C5, the protective layer 105 can block the air supply and prevent combustion.

Heat can be transferred to nearby electrical components, which can destroy nearby electrical components and stop the operation of the circuit.

[0118] In each of the above embodiments, the number of bulbs 31, 32, 33 of the arc tube 4 is not limited to three, but two or four or more may be arranged in parallel to increase the discharge path length. It can be longer. Further, the arc tube 4 may be bent in a spiral shape so that the pair of electrode side end portions 40 in which the pair of electrodes 36 are sealed is located at one end side in the height direction.

[0119] In each of the above embodiments, the globe 6 can be omitted, and the arc tube 4 can be exposed. In this case, the external dimensions are approximately the same as those of a general lighting bulb such as an incandescent bulb. Light distribution characteristics, and the application rate to lighting fixtures that use general lighting bulbs such as incandescent bulbs can be further improved.

Industrial applicability

The present invention is a discharge lamp lighting device that can be easily miniaturized, and is used for a bulb-type fluorescent lamp and the like.

Claims

The scope of the claims

[1] a ceramic chip capacitor connected in parallel to the arc tube;

High frequency power is supplied to a load circuit including the arc tube and the ceramic chip capacitor, and the ceramic chip capacitor is supplied to the ceramic chip capacitor when the ceramic chip capacitor is short-circuited with respect to the normal capacitor current supplied to the ceramic chip capacitor during normal lighting. A discharge lamp lighting device comprising: an inverter circuit that reduces a supplied short-circuit capacitor current by 1.5 times or less;

[2] a starting ceramic chip capacitor connected to the arc tube;

An inverter circuit for supplying high frequency power to a load circuit including an arc tube and a ceramic chip capacitor;

Current control means connected in series with the ceramic chip capacitor to suppress excessive current;

A discharge lamp lighting device comprising:

[3] The current control means is a current interrupting element that interrupts the current by self-destruction when an excessive current flows.

The discharge lamp lighting device according to claim 2, wherein:

[4] arc tube;

A board, a plurality of connection terminals protruding from the board, connected to each electrode of the arc tube and connected to a wire introduced from the arc tube, and each connection terminal and the electrical circuit located between the connection terminals A discharge lamp lighting comprising a ceramic chip capacitor mounted on a substrate to be connected and connected in parallel to the arc tube, and an inverter circuit for supplying high-frequency power to a load circuit including the arc tube and the ceramic chip capacitor With the device;

A bulb-type fluorescent lamp characterized by comprising: