WO2006072959A1 - Aqueous-based dispersions of metal nanoparticles - Google Patents

Aqueous-based dispersions of metal nanoparticles Download PDF

Info

Publication number
WO2006072959A1
WO2006072959A1 PCT/IL2006/000031 IL2006000031W WO2006072959A1 WO 2006072959 A1 WO2006072959 A1 WO 2006072959A1 IL 2006000031 W IL2006000031 W IL 2006000031W WO 2006072959 A1 WO2006072959 A1 WO 2006072959A1
Authority
WO
WIPO (PCT)
Prior art keywords
dispersion
nanoparticles
metal
silver
aqueous
Prior art date
Application number
PCT/IL2006/000031
Other languages
French (fr)
Inventor
Shlomo Magdassi
Alexander Kamyshny
Shai Aviezer
Michael Grouchko
Original Assignee
Yissum Research Development Company Of The Hebrew University Of Jerusalem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yissum Research Development Company Of The Hebrew University Of Jerusalem filed Critical Yissum Research Development Company Of The Hebrew University Of Jerusalem
Priority to AT06700979T priority Critical patent/ATE461981T1/en
Priority to DE602006013100T priority patent/DE602006013100D1/en
Priority to US11/813,628 priority patent/US8227022B2/en
Priority to CN2006800020225A priority patent/CN101128550B/en
Priority to EP06700979A priority patent/EP1853673B1/en
Priority to JP2007550014A priority patent/JP2008527169A/en
Publication of WO2006072959A1 publication Critical patent/WO2006072959A1/en
Priority to IL184466A priority patent/IL184466A/en
Priority to US13/489,032 priority patent/US20120241693A1/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00Making metallic powder or suspensions thereof
    • B22F9/16Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00Making metallic powder or suspensions thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05Metallic powder characterised by the size or surface area of the particles
    • B22F1/054Nanosized particles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05Metallic powder characterised by the size or surface area of the particles
    • B22F1/054Nanosized particles
    • B22F1/0545Dispersions or suspensions of nanosized particles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/30Inkjet printing inks
    • C09D11/32Inkjet printing inks characterised by colouring agents
    • C09D11/322Pigment inks
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/52Electrically conductive inks
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24Electrically-conducting paints
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00Supplementary information concerning processes or compositions relating to powder metallurgy
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating
    • C23C18/30Activating or accelerating or sensitising with palladium or other noble metal
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/70Nanostructure
    • Y10S977/773Nanoparticle, i.e. structure having three dimensions of 100 nm or less
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/70Nanostructure
    • Y10S977/81Of specified metal or metal alloy composition

Definitions

  • the present invention relates to the field of metal nanoparticle dispersions. More particularly, the present invention relates to aqueous-based dispersions of metal nanoparticles, a method for their preparation and compositions such as ink comprising such dispersions.
  • Metallic nanoparticles draw intense scientific and practical interest due to their unique properties, which differ from those of bulk and atomic species. Such a difference is determined by peculiarity of electronic structure of the metal nanoparticles and extremely large surface afea with a high percentage of surface atoms. Metal nanoparticles exhibit a drastic decrease in melting point compared to that of the bulk material, they are characterized by enhanced reactivity of the surface atoms, high electric conductivity and unique optical properties. Virtually, nanosized materials are well-known materials with novel properties and promising applications in electrochemistry, microelectronics, optical, electronic and magnetic devices and sensors, in new types of active and selective catalysts, as well as in biosensors.
  • ink-jet inks may contain two types of colorants, dye or pigment, and are characterized by their main liquid, which is the vehicle for the ink.
  • the main liquid may be water (water-based inks), or an organic solvent (solvent-based inks).
  • the dye or pigment-based inks differ with respect to the physical nature of the colorant.
  • Pigment is a colored material that is insoluble in the liquid, while the dye is soluble in the liquid.
  • Each system has drawbacks: pigments tend to aggregate, and therefore clog the nozzles in the orifice plate, or the narrow tubings in the printhead, thus preventing the jetting of the ink while printing. Dyes tend to dry, and form a crust on the orifice plate, thus causing failure in jetting and misdirection of jets.
  • the terms "dye” or “pigment” are the general wordings for materials, which are soluble or insoluble, respectively, in the solvents comprising the ink. Therefore, metal nanoparticles may be considered, in this context, if introduced into ink, as pigments of metal, having a size in the nanometer range.
  • inks in ink-jet printers are water-based inks.
  • metal nanoparticles as pigments requires the elaboration of ink formulations containing stable concentrated aqueous metal colloid.
  • the synthesis of stable colloidal systems with high metal concentration is a serious problem.
  • a variety of substances have been used to stabilize silver colloids: amphiphilic nonionic polymers and polyelectrolytes, ionic and nonionic surfactants, polyphosphates, nitrilotriacetate, 3- aminopropyltrimethoxysilane, and CS 2 .
  • Stable water-soluble silver nanoparticles were also obtained by reduction of silver ions in the presence of amino- and carboxilate- terminated poly(amido amine) dendrimers, and crown ethers.
  • the preparations of stable silver colloids, having low metal concentrations are described in the literature, in procedures based on reduction of metal from solution. The metal concentrations in these procedures amount only to lO '2 M (about 0.1%) even in the presence of stabilizers (it is almost impossible to obtain a stable aqueous silver colloid with the metal concentrations higher then 10 "3 M without an additional stabilizer, due to fast particle aggregation).
  • the preparation of ink compositions having silver nanoparticle concentration of up to about 1.5wt% (during the reaction step) is described in WO 03/038002.
  • the synthesis of concentrated silver nanoparticles is described in:
  • ink-jet ink compositions contain, in addition to dyes or pigments, other additives, such as humectants, bactericides and fungicides and binders (polymeric additives, which improve the dye or pigment binding to substrate), the stabilizers should be compatible with these substances and should not change noticeably the physicochemical and rheological characteristics of inks (the most important characteristics are viscosity and surface tension).
  • One known method is based on an ink containing a reducing agent and receiving material containing the reducible silver compound (AgNO 3 or silver di(2- ethylhexyO-sulphosuccinate), and, on the contrary, an ink and a receiving support containing a silver compound and reducer, respectively. Heating the receiving support during or after the ink deposition resulted in an image formed by silver metal (U.S. Patent 5,501,150 to Leenders, et al; U.S. Patent 5,621,449 to Leenders, et al).
  • a reducible silver compound AgNO 3 or silver di(2- ethylhexyO-sulphosuccinate
  • Another approach for the deposition of metallic structures is based on ink-jet printing of organometallic precursor dissolved in organic solvent with subsequent conversion of the precursor to metal at elevated temperatures ( ⁇ 300°C).
  • metal silver
  • silver or other metal nanoparticles may be added to the ink along with the organometallic precursor.
  • Near-bulk conductivity of printed silver films has been achieved with such compositions (Vest, R. W.; Tweedell, E.P.; Buchanan, R.C. Int. J. Hybrid Microelectron. 1983, 5, 261; Teng, K.F.; Vest, R. W. IEEE Trans. Indust. Electron.
  • the inventors have previously described the preparation of stabilized nanodispersions with silver concentration up to 1.5 wt%, at the reaction step which were shown to be suitable pigments for water-based ink-jet inks (WO 03/038002; Magdassi, S.; Bassa, A.; Vinetsky, Y.; Kamyshny, A. Chem. Mater. 2003, 15, 2208).
  • the stabilizers used were ionic polymeric materials such as carboxymethyl cellulose (CMC) and polypyrrole (PPy), the silver nanoparticles size did not exceed 100 nm.
  • aqueous-based dispersion of metal nanoparticles preferably silver nanoparticles
  • metal nanoparticles preferably silver nanoparticles
  • is simplified in production which enables production of metal nanodispersion characterized by small diameter of the nanoparticles and high nanoparticle concentration and yet which is physically stable (i.e. does not undergo caking or agglomeration and can be easily redispersed if present as a sediment or a powder).
  • an aqueous based dispersion of metal nanoparticles with improved properties such as high electric conductivity when applied onto a substrate.
  • the present invention relates to a method for preparing an aqueous-based dispersion of metal nanoparticles comprising: (a) providing an aqueous suspension of a metal salt;
  • the present invention additionally relates to an aqueous-based dispersion comprising metal nanoparticles and at least one water soluble polymer, said aqueous- based dispersion is characterized by:
  • the concentration of said metal nanoparticles in said dispersion is in the range 0.5 -35wt%;
  • the size of said nanoparticles is below 20 nm in diameter;
  • the present invention further relates to an aqueous-based dispersion comprising metal nanoparticles and at least one water soluble dispersant, said aqueous-based dispersion is characterized by:
  • the concentration of said metal nanoparticles in said dispersion is in the range 5 - 80 wt%;
  • the size of said nanoparticles is below 20 nm in diameter; and (c) the weight ratio of said water soluble dispersant to said metal nanoparticles is below 0.1 : 1.
  • Figure 1 shows TEM images of nanoparticles in concentrated Ag dispersions
  • Figure 2 shows silver patterns printed by ink-jet printer onto polyimide film (ink formulation contains 8 wt% silver and 0.5% BYK 348 as a wetting agent).
  • ink formulation contains 8 wt% silver and 0.5% BYK 348 as a wetting agent.
  • Fig. 2A On the left side (Fig. 2A), the part of the line (12 mm length, 1.5 mm width, 3.5 ⁇ m thickness), on which the conductivity was measured, is shown (magnified in Fig. 2B).
  • Figure 3 shows High Resolution SEM micrographs of the image obtained with silver nanodispersion deposited on glass slide, dried and sintered at various temperatures (60 0 C, 150 0 C, 260 0 C, 320 0 C).
  • Figure 4 displays the conductivity ( ⁇ ) of deposited and sintered samples relative to the conductivity of bulk silver (6.3-10 7 ohm ' W).
  • Figure 5 shows optical and HR-SEM images of a ring formed on a glass substrate.
  • Fig. 6 presents the view of multiply twined nanoparticles prepared as described in Example 3.
  • aqueous-based dispersion of metal nanoparticles from an aqueous suspension of a metal salt by using water soluble polymers, which have a dual function:
  • One function is as initiators of the metal reduction process by providing a "pre-reduction” step while forming the metal nuclei, which serve as nucleation centers for subsequent reduction by reducing agent.
  • Another function is as stabilizers of the formed metal nuclei and the resulting nanoparticles (preventing their agglomeration).
  • the aqueous based dispersions of the present invention are characterized by high metal content, low particles size at the same or even lower stabilizer (water soluble polymer)-to-metal ratio compared to the prior art, high conductivity (after deposition onto substrates and drying).
  • the aqueous-based dispersions obtained by using an aqueous suspension of metal salt and these dual effect stabilizers (water soluble polymers) show the following advantageous properties:
  • the concentration of metal nanoparticles during the reaction step (before separation step) can be up to about 35 wt%. Since a powder of redispersible metal nanoparticles (preferably silver nanoparticles) can be prepared according to this patent application, concentrated dispersions (up to 80% wt%) may be prepared.
  • the metal nanoparticle dispersions can form, upon drying of droplets, densely packed rings, which are conductive even at room temperature, without further heat induced sintering.
  • the metal nanoparticle dispersions are prepared by a pre-reduction of a metal salt (present in the form of aqueous suspension) with a proper water soluble polymer, which functions as a reducer and a stabilizer, followed by full reduction (exhaustive reduction) obtained by a chemical reducer, such as tri-sodium citrate, ascorbic acid, di-sodium tartrate, hydrazine, sodium borohydride, or mixtures thereof.
  • a chemical reducer such as tri-sodium citrate, ascorbic acid, di-sodium tartrate, hydrazine, sodium borohydride, or mixtures thereof.
  • the preferred silver salt used in the preparation of the nanoparticles is silver acetate. Possibly due to: a) the action of acetate ion in aggregation of the nanoparticles. This allows easy separation of nanoparticles from the aqueous medium at the end of the reaction process (after full reduction with the chemical reducer), b) due to the low solubility of the silver acetate salt, the silver ion concentaration is kept below silver salt saturation value (for example about 2.5 wt% at 95 0 C), thus the undisolved silver acetate serves as reservoir of silver ion. The low concentration of silver ion enables production of smaller particles at high metal salt concentrations.
  • the nanoparticle size of the obtained dispersions after separation is preferably below 20 nm and can be as low as 5-8 mil. Due to the smaller particle size the sedimentation rate is very slow, and is hindered by the Brownian motion. This is advantageous when long term stability is required. Additionally the sintering temperature can be lowered compared to particles having a larger size.
  • the present invention is based on the findings that it is possible to obtain aqueous-based dispersions of metal nanoparticles by a new method which comprises metal ions reduction in an aqueous suspension of metal salt, using water soluble polymers which are capable of metal reduction followed by full reduction using a chemical reducer.
  • the method includes two-step reduction, first with a water soluble polymer to obtain metal nuclei, and then exhaustive reduction with a chemical reducer to form nanoparticles in dispersion.
  • the new method of preparation enables formation of physically stable dispersions (i.e. which do not undergo caking and agglomeration). Separation step may be very simple due to spontaneous formation of a sediment as a result of nanoparticle aggregartion.
  • centrifugation step may be omitted.
  • the new method enables formation of aggregated nanoparticles which can be easily separated from the aqueous medium and redispersed.
  • the formed sediment can be easily redispersed in a liquid (after separating from the aqueous medium) by using a suitable dispersing agent to form a stable and more concentrated dispersion.
  • the formed nanaparticles in the dispersion may be in an aggregated form (i.e. the nanoparticles maybe partially or mostly in an aggregated form).
  • the method utilizes metal salts (preferably silver salts) having low solubility in water (preferably up to 5% w/w, at a temperature of 100 0 C) which results in low concentration of metal ions in the solution phase of the reaction mixture.
  • metal salts preferably silver salts
  • stabilizer water soluble polymer
  • the weight ratio of the water soluble polymer (stabilizing polymer, protective agent) to metal that can be used according to this new method is much lower than in all known procedures, and may be only 0.01 : 1.
  • the new method enables to obtain nanodispersions or nanopowders (after the separation step) with organic: metal (preferably silver) weight ratio below 0.07:1 and this ratio can be as low as 0.03:1-0.05:1. Therefore, the obtained product is more pure and can be successfully used, for example, for formation of conductive patterns (due to low content of insulating organic material).
  • the size (diameter) of silver nanoparticles may be as low as 5-8 nm.
  • Rings produced by depositing drops of the obtained silver dispersion onto a substrate display high electric conductivity (up to 15 % of that for bulk silver) at room temperature, without sintering at elevated temperatures.
  • Various types of conductive patterns can be obtained by deposition of arrays of said rings by various means such as ink jet printing.
  • the present invention relates to a method for preparing an aqueous-based dispersion of metal nanoparticles comprising:
  • aqueous-based means that the dispersing medium of the dispersion comprises either water or an aqueous liquid or solution. Most preferably, the aqueous medium (dispersing medium) is all water, however the dispersing medium may also contain small amounts (preferably up to about 25 wt%, based on the total weight of the dispersing medium) of organic solvents which are miscible with water.
  • pre-reducing in step (b) is meant that the water soluble polymer initiates metal reduction and reduces part the metal ions in the aqueous suspension. Full reduction of the remaining metal ions is obtained in step (c).
  • metal nuclei an intermediate nanoparticle, wherein the average size of said nuclei is below the average size of the nanoparticles obtained in step (c).
  • the dispersion preparation may be also conducted by double jet method, (consisting of mixing two jets: of the dispersion obtained from step (b) and the chemical reducer from step (c).).
  • the method may further comprise at least one step (i.e. a step or repeated steps) of separating the nanoparticles obtained in step (c) from the aqueous medium of said dispersion and redispersing in a liquid to form a dispersion of nanoparticles.
  • at least one step i.e. a step or repeated steps of separating the nanoparticles obtained in step (c) from the aqueous medium of said dispersion and redispersing in a liquid to form a dispersion of nanoparticles.
  • the method comprises: (a) providing an aqueous suspension of a metal salt;
  • step (d) at least one step of separating the nanoparticles obtained in step (c) from the aqueous medium of said dispersion and redispersing in a liquid to form a dispersion of nanoparticles.
  • the separation is selected from centrifugation, decantation, filtration, ultrafiltration, and a combination thereof.
  • the redispersing is performed using a suitable dispersing agent and optionally a wetting agent.
  • the wetting agent may be added before or after the separation, preferably before the separation.
  • the dispersing agent is a water soluble dispersant.
  • the dispersing agent is selected from surfactants, water soluble polymers, and mixtures of any of the above.
  • the water soluble polymer is a polyelectrolyte.
  • the polyelectrolyte (dispersing agent) is selected from Disperbyk 190, Solsperse 40000, and mixtures of any of the above.
  • Disperbyk 190 is a High-molecular- weight block copolymer with acidic affinic groups (acid value 10 mg KOH g '1 ), which can be obtained from BYK Chemie Germany.
  • Solsperse 40000 is a Water-soluble anionic phosphated alkoxylated polymer, which can be obtained from Avecia, England.
  • the wetting agent may be a surfactant.
  • the surfactant may be for example BYK-154, BYK-348, Disperbyk 181, Disperbyk 184, LABS (such as LABS-W-100), and LABS salts, and mixtures of any of the above.
  • BYK-154 is an Ammonium salt of an acrylate copolymer, which can be obtained from BYK Chemie, Germany.
  • BYK-348 is a Polyether modified poly-dimethyl siloxane, which can be obtained from BYK Chemie, Germany.
  • Disperbyk 181 is an Alkanolammomium salt of a polyfunctional polymer (acid value 30 mg KOH g "1 ), which can be obtained from BYK Chemie, Germany.
  • Disperbyk 184 is a High-molecular- weight block copolymer with pigment affinic groups (acid value 10 mg KOH g "1 ), which can be obtained from BYK Chemie, Germany.
  • LABS is a Linear alkyl benzene sulphonic acid which may have different chain length.
  • LABS-W-100 is a Linear alkyl benzene sulphonic acid, which can be obtained from Zohar-Dalia, Israel.
  • the wetting agent may be for example a surfactant.
  • the liquid is an aqueous liquid (the liquid used for redispersing of the nanoparticles after separation from the aqueous medium).
  • the method may further comprise at least one step (i.e. a step or repeated steps) of separating the nanoparticles obtained in step (c) from the aqueous medium of said dispersion followed by removal of the water in order to obtain a powder of metallic particles.
  • the removal of the water can be obtained by various methods such as loyphilization, spray drying, oven drying, vacuum drying etc.
  • redispersing agents Prior to removal of the aqueous phase (medium) redispersing agents may be added such as wetting agents, dispersant etc.
  • the powder may be further redispersed in a liquid such as an aqueous liquid or non-aqueous liquid (such as organic solvents, oils etc.).
  • the obtained powder of metal nanoparticles is characterized by a weight ratio of the organic material to the metal nanoparticles of below 0.1 :1, more preferably below 0.07:1, still more preferably in the range 0.03:1- 0.05:1.
  • a powder is capable of redispersing in a liquid (aqueous liquid or non aqueous liquid such as organic solvents, or mixtures thereof), preferably without addition of a dispersant.
  • the particle size after redispersion is preferably less that 20 nm in diameter.
  • step (b) includes incubation for a period of at least 5 minutes, i.e. the aqueous metal suspension and the water soluble polymer are incubated for at least 5 minutes to form a metal nuclei. (Preferably for 5 -15 minutes).
  • the aqueous metal suspension and the water soluble polymer are incubated for a period of at least 5 minutes (preferably for 5 to 15 min) while stirring.
  • step (b) is conducted at a temperature range of 20-100 0 C. More preferably step (b) is conducted at a temperature range of 50-95 0 C.
  • step (c) is conducted at a temperature range of 20-100 0 C. More preferably step (c) is conducted at a temperature range of 50-95 0 C.
  • step (c) further includes a cooling step.
  • step (c) is conducted at a temperature range of 20-100 0 C, more preferably 50-95 0 C, followed by cooling to a temperature range 10-30 0 C, more preferably 15-25 0 C.
  • the metal nanoparticles are selected from silver nanoparticles, gold nanoparticles, platinum nanoparticles, palladium nanoparticles and a mixture of any of the above.
  • the metal nanoparticles are silver nanoparticles.
  • the metal salt is preferably a silver salt or a gold salt, most preferably a silver salt.
  • the metal salt may also be a platinum salt or palladium salt.
  • the metal salt have low water solubility.
  • the metal salt have a solubility (solubility in water) of up to 5% w/w at a temperature of
  • the metal salt (preferably silver salt) is selected from silver acetate, silver sulfate, silver carbonate, and mixtures of any of the above. Most preferably the metal salt is silver acetate.
  • the metal salt is a metal acetate salt, and most preferably the metal acetate salt is silver acetate.
  • the content of the metal salt in the suspension is in the range of 1.0 to 50 wt% (based on the total weight of the suspension).
  • the concentration of said metal salt in said suspension may be in the range of
  • the concentration of said metal nanopraticles in said dispersion is in the range 0.5-35 wt%, based on the total weight of the dispersion.
  • the concentration of said metal nanopraticles in said dispersion may be in the range 1.5-35 wt%, preferably 2-30 wt%, more preferably 3 - 25 wt%, and most preferably 5-25 wt%, based on the total weight of the dispersion.
  • the concentration may also be in the range 3-35 wt%, preferably 5-35 wt%, more preferably 5-30 wt%, still more preferably 5-25 wt%, based on the total weight of the dispersion.
  • particle size below a certain value in diameter for example by the term “particle size of said nanoparticles is below 50 nni in diameter” is meant that the mean particle diameter according to 90% by number of the particles (dgo) is under 50nm, as measured by Dynamic Light Scattering.
  • particle size of said nanoparticles is below 20 nm in diameter
  • 90% of mean particle diameter calculated by number is under 20nm, as measured by Dynamic Light Scattering.
  • the particle size of the nanoparticles may be below 50 nm in diameter, preferably below 40 nm in diameter. More preferably the particle size is below 20 nm in diameter, even more preferably below 18 nm in diameter, still more preferably in the range 5-15 nm in diameter, and most preferably in the range 5-8 nm in diameter.
  • the nanoparticles of the present invention may be spherical, rod-like shaped or a combination thereof. Most preferably the nanoparticles are spherical shaped.
  • the width of said particles is below 20 nm
  • the length to width ratio is up to 1 :5 (preferably the length to width ratio in the range of 1 : 1.2 to 1 :3)
  • the nanoparticles of the present invention may be multiply tweened particles
  • the multiply twined nanoparticles are capable of sintering at the temperature range of 90 -320 0 C, more preferably at the temperature range of 100-
  • the formed nanoparticle dispersion obtained after step (c) in the method described above may be in the form of aggregates of nanaoparticles which are physically stable (i.e. do not undergo caking in case a sediment is formed) and can be easily redispersed in a liquid following separation from the aqueous dispersion, thus allowing formation of a more concentrated stable dispersions.
  • the concentration of said metal nanopraticles in the dispersion is in the range 5 - 80 wt%, based on the total weight of the dispersion, and more preferably in the range 10-80 wt%, based on the total weight of the dispersion.
  • the concentration of said metal nanopraticles in the dispersion may be in the range 10 - 60 wt%, and more preferably in the range 20-60 wt%.
  • the concentration of the metal nanoparticles in the dispersion may also be in the range 35- 80 wt% and more preferably 40-60 wt%.
  • This preferred embodiment refers to the dispersion obtained after separating the nanoparticles obtained in step (c) from the aqueous medium of the dispersion and redispersing in a liquid to form a dispersion of nanoparticles.).
  • Suitable water soluble polymers are those meeting the following criteria: 1) Lack of gel formation in the presence of metal ions. Water soluble polymers, which do not form a gel at concentrations required to initiate metal reduction and form a metal nuclei, are selected. The concentration of the polymers in the obtained dispersion will depend on the type of the polymer and can be lower than 0.5 wt% for a polymer such as polypyrole (and higher up to 10 wt% for a polymer such as Sokolan HP80). 2) Stabilization of metal nanoparticles. Water soluble polymers, which are also capable of stabilizing the formed metal (such as silver) nuclei were chosen. Such protective agents are water soluble polymers possessing electrostatic and steric effects of stabilization. .
  • the water soluble polymer stabilizes that dispersion, such that the nanoparticles can be easily redispersed (i.e. prevents caking of the dispersion).
  • Water soluble polymers which fulfill all the above criteria, are chosen to be used in the aqueous dispersions of the present invention.
  • the water soluble polymer carries functional groups such as pyrrole, alkoxy, etheric, glycol, hydroxyl, amine groups, and combinations thereof.
  • functional groups such as pyrrole, alkoxy, etheric, glycol, hydroxyl, amine groups, and combinations thereof.
  • Such functional groups are capable of reducing metal ion.
  • the water soluble polymer is selected from polypyrrole, Sokalan HP80, Solsperse 40000, poly(ethylene glycol), and mixtures of any of the above.
  • Sokalan HP 80 is a Polycarboxylate ether, which can be obtained from BASF, Germany.
  • Solsperse 40000 is a Water-soluble anionic phosphated alkoxylated polymer, which can be obtained from Avecia, England.
  • the water soluble polymer is polypyrrole.
  • the metal salt is silver acetate and the water soluble polymer is polypyrrole.
  • the concentration of said water soluble polymer is in the range of 0.1-10.0 wt%.
  • the weight ratio of the water soluble polymer to the metal may be in the range of 0.01 : 1 to 1 : 1.
  • the weight ratio of the water soluble polymer to the metal is below 0.1 :1 (preferably in the range 0.01 :1-0.1 :1), more preferably in the range 0.01:1- 0.06:1, even more preferably in the range 0.01 :1-0.04:1, and most preferably in the range 0.01 :1-0.025:1.
  • the preferred concentration range is 0.1-1.0 wt%.
  • the preferred concentration range is 5.0-10.0 wt%.
  • the chemical reducer is selected from tri-sodium citrate, ascorbic acid, di-sodium tartrate, hydrazine, sodium borohydride, and mixtures of any of the above. Most preferably the chemical reducers are ascorbic acid and hydrazine.
  • the method further comprises adding a colorant to the dispersion.
  • the method may further comprise adding to the dispersion an additive selected from humectants, binders, surfactants, fungicides, rheology modifiers, pH adjusting agents, co-solvents, and mixtures thereof.
  • the aqueous-based dispersion is useful in preparing ink compositions, paints, or coatings.
  • the ink composition is for use in ink-jet printing.
  • the aqueous-based dispersion may be used in coating compositions to provide for example an optical effect on a substrate.
  • the dispersion is for use in obtaining conductive patterns by deposition of the dispersion on a substrate and optionally followed by sintering.
  • conductive rings are obtained as will be detailed below the step of sintering can be omitted.
  • the method further comprises placing or jetting drops of the dispersion as described in the present invention onto a substrate to obtain conductive rings.
  • the conductive rings have high electrical conductivity at room temperature.
  • the method further comprises dispensing a plurality of drops of the dispersion as described in the present invention onto a substrate to form arrays of conductive rings.
  • the arrays of conductive rings form a conductive pattern.
  • the substrate may be for example plastics, paper, photo-paper, films (such as polyimide films), glass or PCB (printed circuits boards).
  • the invention further relates to an aqueous-based dispersion comprising metal nanoparticles and at least one water soluble polymer capable of initiating metal reduction, wherein the concentration of said metal nanoparticles in said dispersion is in the range 0.5 - 35 wt% and wherein the size of said nanoparticles is below 20 run in diameter.
  • Such a dispersion is highly advantageous because of the combination of high nanoparticle concentration and low particle size of the nanoparticles provides superior properties to the dispersion such as high conductivity.
  • the aqueous- based dispersion is a substantially pure aqueous-based dispersion.
  • substantially pure aqueous-based dispersion is meant that the weight ratio of the water soluble polymer to the metal nanoparticles is preferably below 0.1 :1 wt%, and most preferaby in the range 0.01 :1 to 0.025:1 wt%.
  • the aqueous-based dispersion consists essentially of metal nanoparticles and at least one water soluble polymer capable of initiating metal reduction, wherein the concentration of said metal nanoparticles in said dispersion is in the range 0.5 - 35 wt% and wherein the size of said nanoparticles is below 20 nm in diameter.
  • the present invention additionally relates to an aqueous-based dispersion comprising metal nanoparticles and at least one water soluble polymer, said aqueous- based dispersion is characterized by: (a) the concentration of said metal nanoparticles in said dispersion is in the range 0.5 -35wt%;
  • the size of said nanoparticles is below 20 nm in diameter
  • the weight ratio of said water soluble polymer to said metal nanoparticles is below 0.1 :1.
  • concentration of said metal nanoparticles in said dispersion is in the range 1.5 - 35 wt%, more preferably in the range 2-30 wt%, more preferably in the range 3-25 wt%, and most preferably in the range 5-20 wt%.
  • the concentration may also be in the range 3-35 wt%, preferably 5-35 wt%, more preferably 5-30 wt%, still more preferably 5-25 wt%, based on the total weight of the dispersion.
  • the metal nanoparticles are selected from silver nanoparticles, gold nanoparticles, platinum nanoparticles, palladium nanoparticles and a mixture of any of the above. Most preferably the metal nanoparticles are silver nanoparticles.
  • the water soluble polymer is capable of initiating metal reduction.
  • the water soluble polymer carries functional groups such as pyrrole, alkoxy, etheric, glycol, hydroxyl, amine groups, and combinations thereof.
  • Such functional groups are capable of reducing metal ion.
  • the water soluble polymer is selected from polypyrrole, , Sokalan HP80 (Polycarboxylate ether) , Solsperse 40,000 (Water-soluble anionic phosphated alkoxylated polymer), poly(ethylene glycol), and mixtures of any of the above.
  • the water soluble polymer is polypyrrole.
  • the water soluble polymer is capable of initiating metal reduction to form metal nuclei during preparation of the dispersion.
  • the water soluble polymer also functions as a stabilizer during preparation of the dispersion and is capable of preventing metal nuclei aggregation and agglomeration after the pre-reduction step.
  • the water soluble polymer is further characterized in that it does not form a gel in the presence of metal ions, at concentrations used to prepare the dispersion.
  • the weight ratio of said water soluble polymer to said nanoparticles is below 0.1 :1.
  • the weight ratio of the water soluble polymer to the nanoparticles is in the range 0.01 :1-0.1 :1.
  • the weight ratio of said water soluble polymer to said nanoparticles is in the range 0.01:1 -0.06:1, even more preferably the weight ratio of said water soluble polymer to said nanoparticles is in the range 0.01 :1 -0.04:1. Most preferably the weight ratio of said water soluble polymer to said nanoparticles is in the range 0.01 :1 -0.025:1.
  • the size of said nanoparticles is below 18 nm in diameter.
  • the size of said nanoparticles is in the range 5-15 nm in diameter, more preferably the size of the nanoparticles is in the range 5-8 nm in diameter.
  • the aqueous dispersion may further comprise an organic solvent.
  • the organic solvent may be for example dipropyleneglycol methyl ether (DPM), 2-methoxyethyl ether (diglyme), triethyleneglycol dimethyl ether (triglyme), propylene glycol, sulfolane, polyethylene glycol, glycerol.
  • the concentration of the organic solvent may be up to 20 wt%, based on the total weight of the dispersion.
  • the aqueous dispersion is characterized in that the conductivity of the dispersion deposited onto substrate can be as high as 50% of that of the bulk metal.
  • the invention additionally relates to an aqueous-based dispersion comprising metal nanoparticles and at least one water soluble dispersant, wherein the concentration of said metal nanoparticles in said dispersion is in the range 5 - 80 wt% and wherein the size of said nanoparticles is below 20 nm in diameter.
  • the aqueous-based dispersion is a substantially pure aqueous-based dispersion.
  • substantially pure aqueous-based dispersion is meant that weight ratio of said water soluble dispersant to said nanoparticles is below 0.1 :1.
  • the aqueous-based dispersion consists essentially of metal nanoparticles and at least one water soluble dispersant, wherein the concentration of said metal nanoparticles in said dispersion is in the range 5 - 80 wt% and wherein the size of said nanoparticles is below 20 nm in diameter.
  • the present invention additionally relates to an aqueous-based dispersion comprising metal nanoparticles and at least one water soluble dispersant, said aqueous-based dispersion is characterized by:
  • the concentration of said metal nanoparticles in said dispersion is in the range 5 - 80 wt%;
  • the size of said nanoparticles is below 20 nm in diameter; and (c) the weight ratio of said water dispersant to said metal nanoparticles is below 0.1 :1.
  • the metal nanoparticles are selected from silver nanoparticles, gold nanoparticles, platinum nanoparticles, palladium nanoparticles and mixtures of any of the above. Most preferably the metal nanoparticles are silver nanoparticles.
  • the water soluble dispersant is selected from surfactants, water soluble polymers, and mixtures of any of the above.
  • the water soluble polymer is a polyelectrolyte.
  • the weight ratio of said water soluble dispersant to said nanoparticles is below 0.1:1, more preberably below 0.075:1, and most prefeably in the range 0.04 :1 - 0.06:1.
  • the weight ratio of the water soluble dispersant to the nanoparticles may also be in the range 0.04:1-0.1:1, and more preferably in the range 0.04:1-0.075:1.
  • the polyelectrolyte is selected from Disperbyk 190, Solsperse 40000, and mixtures of any of the above.
  • the aqueous-based dispersion is characterized in that the conductivity of the dispersion deposited onto substrate can be as high as 50% of that of the bulk metal.
  • the size of said nanoparticles is below 1 S nm in diameter.
  • the size of said nanoparticles is in the range 5-15 nm in diameter, more preferably the size of the nanoparticles is in the range 5-8 nm in diameter.
  • the nanoparticles may be spherical, rod-like shaped (as described above) or a combination thereof. Most preferably the nanoparticles are spherical shaped.
  • the nanoparticles may be multiply tweened particles (mtp).
  • the multiply twined nanoparticles are capable of sintering at the temperature range of 90 -320 0 C, more preferably at the temperature range of 100- 160 0 C.
  • aqueous-based dispersions of the present invention may further comprise a water soluble metal salt (such as silver salt).
  • the water soluble silver salt may be for example silver acetate, silver nitrate, silver sulfate, silver carbonate, silver lactate, silver perchlorate, or mixtures thereof. Most preferably the silver salt is silver acetate.
  • the silver salt is preferably added to the final dispersion (at a concentration range of preferably 0.05-5 wt%) to achieve further increase in conductivity of printed pattern, which decomposes during sintering that results in formation of metallic (silver) additive acting as "glue” for sintering silver nanoparticles.
  • the aqueous-based dispersions of the invention comprises an aqueous medium which can be either water, an aqueous liquid or an aqueous solution.
  • the aqueous-based dispersions of the present invention further comprising at least one member selected from humectants (such as dipropyleneglycol methyl ether (DPM), 2- methoxyethyl ether (diglyme), triethyleneglycol dimethyl ether (triglyme), propylene glycol, sulfolane, polyethylene glycol, glycerol), binders (such as polyvinylpyrrolidone (PVP), acrylic resins, acrylic latexes), surfactants (such as silwet L-77 , BYK 348, BYK 346, BYK 333), fungicides, rheology modifiers (such as colloidal silica, clays, water soluble polymers), deformers (such as silicon derivatives), pH adjusting agents (such as acids and bases), and mixtures of any of the above.
  • humectants such as dipropyleneglycol methyl ether (DPM), 2- methoxyethy
  • BYK-333 is a Polyether modified poly-dimethyl polysiloxane, which can be obtained from BYK Chemie, Germany.
  • BYK-346 is a Polyether modified poly-dimethyl-siloxane, which can be obtained from BYK Chemie, Germany.
  • Silwet L-77 is a Polyalkylencoxide modified Heptamethyltrisiloxane and Allyloxypolyethyleneglycol methyl ether solution, which can be obtained from Helena Chemical Company, USA.
  • the aqueous-based dispersions are characterized by organic material: metal weight ratio of below 0.1 :1, more preferably below 0.07:1. This ratio can be as low as 0.03: 1-0.05:1. Therefore, the obtained product is more pure and can be successfully used, for example, for formation of conductive patterns (due to low content of insulating organic material).
  • the aqueous-based dispersions of the present invention further comprising a colorant.
  • the colorant may be for example organic dye or pigments.
  • the present invention additionally provides an ink composition comprising an aqueous based dispersion as described in the present invention.
  • the ink of the present invention may be characterized by the following:
  • the metal nanoparticles concentrations in the ink are as high as 20 wt% if low viscosity ink is required (up to 5 cps) and can be up to 70-80 wt%, if high viscosity is required (up to 20 cps at jetting temperature).
  • the present invention provides compositions and methods for preparation of water-based inks (preferably ink-jet inks), in which the pigments are nanoparticles of metal, and composition and methods for preparing stable, concentrated dispersions of metallic nanoparticles.
  • the ink composition of the present invention overcomes a common problem in pigment containing ink-jet inks, namely sedimentation, since the particle size is very small, preferably below 20 nm in diameter, thus the sedimentation rate is very slow, and is hindered by the Brownian motion.
  • nanoparticles due to their very small size, would behave differently, when compared to large particles.
  • nanoparticles have a lower melting point than bulk metal, and a lower sintering temperature than that of bulk metal. This property is of particular importance when sintering is needed in order to obtain electrical conductivity.
  • the metallic patterns obtained by the aqueous dispersions of the present invention can be used for decoration purposes, even if the resulting pattern is not electrically conductive.
  • Another aspect of the invention is that the resulting pattern of the silver nanoparticles has an antimicrobial effect, due to the presence of silver nanoparticles, thus eliminating the need for antimicrobial agents which are often introduced into water based ink jet inks.
  • the present invention provides conductive rings produced by placing or jetting drops of a dispersionas described in the present invention onto a substrate.
  • the conductive rings have high electrical conductivity at room temperature.
  • the present invention provides conductive patterns obtained by dispensing a plurality of drops of a dispersion as described in the present invention onto a substrate to form arrays of conductive rings.
  • Ink-jet printing of conductive patterns by placing or jetting of dispersion droplets on a proper substrate may be applied in microelectronic industry.
  • Patterns can be used in microelectronics, for smart card obtaining, decorative coatings.
  • the high electrical conductivity is in the range of 5-50% of bulk silver for printed patterns (after sintering at 150-320 0 C), in the range of 10-15% of bulk silver for deposited rings at room temperature and in the range of 15-50% of bulk silver for deposited rings (after sintering at 150-320 0 C).
  • the present invention further provides a powder of metal nanoparticles characterized by a weight ratio of the organic material to the metal nanoparticles of below 0.1 :1, more preferably below 0.07:1, still more preferably in the range 0.03:1- 0.05:1.
  • a powder is capable of redispersing in a liquid (aqueous liquid or non aqueous liquid such as organic solvents, or mixtures thereof), preferably without addition of a dispersant.
  • the particle size after redispersion is preferably less that 20 run in diameter.
  • a solvent-based dispersion can be obtained by dispersing the powder in a solvent or a solvent mixture.
  • the dispersion may optionally include binders, surfactants and rheology modifiers etc. and may be for use in ink-jet inks.
  • Fine metal particles from micrometer to nanometer size can be synthesized by both physical methods (formation in gas phase, laser ablation) and chemical methods (sonochemical or photochemical reduction, electrochemical synthesis, chemical reduction), as are known in the art.
  • the former methods provide fine metal particles by decreasing the size by applying energy to the bulk metal, while in the latter methods, fine particles are produced by increasing the size from metal atoms obtained by reduction of metal ions in solution.
  • the chemical method for the preparation of silver nanoparticles is preferably employed, namely, fine particles were produced by reduction of silver salt in a solution or a suspension with the use of a proper reducing agent according to the following scheme: Me n+ + wRed ⁇ Me° + ⁇ x +
  • Silver nanoparticles can be prepared with the use of various reducing agents (chemical reducers), such as sodium borohydride, trisodium citrate, hydrazine, ascorbic acid, sugars and gaseous hydrogen.
  • chemical reducers such as sodium borohydride, trisodium citrate, hydrazine, ascorbic acid, sugars and gaseous hydrogen.
  • synthesis step pre-reduction of a silver salt by a water soluble polymer (synthetic or natural polymer), which is also a stabilizing agent, resulting in formation of silver nuclei; such nuclei serve as seeds for formation of silver nanoparticles (which can be in an aggregated form in dispersion), after addition of a proper chemical reducer;
  • separation and concentration step centrifugation is followed by decantation and redispersion of formed the silver nanoparticles in a proper dispersing medium.
  • separation step can be also performed by an ultrafiltration process.
  • the water from the dispersion can be further removed (by lyophiliztion, spray drying, vacuum drying oven drying etc.) and the obtained powder can be redispersed again in a small volume of water or organic solvent that results in formation of highly concentrated silver nanodispersion.
  • the advantage of such dispersion is the low content of organic materials.
  • conductive patterns with conductivity of about 50% of the conductivity of bulk silver can be obtained.
  • Dispersing agent Solsperse 40,000 (Avecia, England)
  • DSL Dynamic Light scattering
  • Procedure Nuckation step 1 g of AgAc was added to 10.605 ml of TDW in a 28 ml vial. The vial was heated in a hot bath to 95 0 C while stirring. After 5 min of stirring, 0.32 g of Ppy (5 wt%) was added.
  • reaction 15 min after addition of PPy, 0.865 g of ascorbic acid (30 wt%) was added, and reaction mixture was heated at 95 0 C for 5 min while stirring and then was cooled in ice bath. A spontaneous formation of sediment is obtained as a result of nanoparticles aggregation.
  • Silver concentration A precise amount of silver dispersion was placed in glass vial and heated at 600 0 C for 30 min. Silver content in obtained dispersion was found to be 6.4 wt%.
  • Particle size See Table 1 (measured by DLS).
  • Solsperse 40000 concentration relative to silver 5.7 wt%
  • Silver concentration A precise amount of silver dispersion was placed in glass vial and heated at 600 C for 30 min. Silver content in obtained dispersion was found to be 14.05 wt%.
  • Silver concentration A precise amount of silver dispersion was placed in glass vial and heated at 600 0 C for 30 min. Silver content in obtained dispersion was found to be
  • Dispersing agent Solsperse 40,000 (Avecia, England)
  • Nucleation step 1 g of AgAc was added to 5.3 ml of TDW in a 28 ml vial. The vial was heated in a hot bath to 95 0 C while stirring. After 5 min of stirring, 3.26 g of Sokalan HP80, 50 wt%, was added.
  • reaction 5 min after addition of Sokalan HP80, 3.46 g of ascorbic acid (15 wt%) was added, and reaction mixture was heated at 95 0 C for 5 min while stirring and then was cooled in the ice bath.
  • Sokalan HP80 concentration relative to silver 100 wt%
  • Solsperse 40000 concentration relative to silver 7.4 wt%
  • Silver concentration A precise amount of silver dispersion was placed in glass vial and heated at 600 0 C for 30 min. Silver content in obtained dispersion was found to be
  • Particle size See Table 1 (measured by DLS).
  • Niicleation 2 g of AgAc was added to 4.3 ml of TDW in a 28 ml vial. The vial was heated in a hot bath to 95 0 C while stirring. After 5 min of stirring, 3.26 g of Sokalan HP80, 50 wt%, was added. Reaction: 5 min after addition of Sokalan HP80, 3.46 g of ascorbic acid (15 wt%) was added, and reaction mixture was heated at 95 0 C for 5 min while stirring and then was cooled in the ice bath.
  • the obtained concentrated silver nanodispersion can be further lyophilized to yield a powder, optionally in the presence of a wetting agent (which optionally is added before lyphilization).
  • This powder can be easily redispersed in water, to yield a much more concentrated silver nanodispersion, up to 20-80 wt% of silver without change in the average particle size of silver nanoparticles compared to original dispersion (Fig. 1, right (Fig. IB)).
  • the suitability of prepared silver nanodispersions as pigments for ink-jet inks was evaluated with the use of Lexmark Z602 ink-jet printer.
  • Several ink-jet formulations are described in the following examples. Each formulation was capable of printing. Printing was performed on various substrates, such as paper, photo-paper, polyimide films, transparency, glass and PCB (printed circuits boards).
  • the new ink-jet ink contains the silver nanoparticles, and aqueous solution which may contain surfactants, additional polymers, humectants, cosolvents, buffering agent, antimicrobial agents and defoamers in order to ensure proper jetting and adhesion of the ink to specific substrates.
  • aqueous solution which may contain surfactants, additional polymers, humectants, cosolvents, buffering agent, antimicrobial agents and defoamers in order to ensure proper jetting and adhesion of the ink to specific substrates.
  • FIG. 2 presents an example of silver electrodes pattern printed onto polyimide film (ink formulation contains 8 wt% silver, 0.6 wt% Disperbyk 190 as a dispersing agent and 0.5% BYK 348 as a wetting agent).
  • ink formulation contains 8 wt% silver, 0.6 wt% Disperbyk 190 as a dispersing agent and 0.5% BYK 348 as a wetting agent.
  • the part of the line (12 mm length, 1.5 mm width, 3.5 ⁇ m thickness), on which the conductivity was measured.
  • printer requires inks with very low viscosities, a few cps.
  • industrial printhead such as those produced by Spectra, are functional at viscosities as high as 15-20 cps. Therefore, for such printheads more concentrated dispersions of silver nanoparticles can be utilized.
  • a silver dispersion having a silver content higher than 20 % (up to about 80% w/w) can be prepared by redispersion the silver
  • Silver nanodispersion (8 wt%) prepared as described above ,containing 0.2 wt% BYK 346 and 5 wt% DPM.
  • Example 2 Silver nanodispersion (8 wt%) and containing 0.5 wt% BYK 346 and 10 wt% DPM.
  • Example 3 Silver nanodispersion (8 wt%) with 0.2 wt% BYK 346 and 20 wt% DPM.
  • Silver nanodispersion (8 wt%) with 0.5 wt% BYK 346 and 15 wt% DPM.
  • Silver nanodispersion (8 wt%) with 0.5 wt% BYK 346 and 5 wt% DPM.
  • Silver nanodispersion (8 wt%) with 0.2 wt% BYK 346.
  • Silver nanodispersion (8 wt%) with 0.2 wt% BYK 348.
  • Silver nanodispersion (8 wt%) with 5 wt% DPM.
  • Silver nanodispersion (8 wt%) with 0.5 wt% BYK 348.
  • Example 11 Silver nanodispersion (8 wt%) with 0.5 wt% BYK 348 and 5 wt% Diglyme.
  • Silver nanodispersion (8 wt%) with 0.5 wt% BYK 348 and 5 wt% Triglyme.
  • Silver nanodispersion (8 wt%) with 0.5 wt% BYK 348 and 5 wt% Propylene glycol.
  • Silver nanodispersion (8 wt%) with 0.5 wt% BYK 348 and 5 wt% Polyethylene glycole 200.
  • Silver nanodispersion (8 wt%) with 0.5 wt% BYK 348 and 5 wt% Glycerol.
  • Silver nanodispersion (8 wt%) with 0.5 wt% BYK 348 and 0.2 wt% PVP (polyvinylpyrollidone) 10,000.
  • Example 17 Silver nanodispersion (8 wt%) with 0.5 wt% BYK 348 and 0.2 wt% PVP (polyvinylpyrollidone) 10,000.
  • Silver nanodispersion (8 wt%) with 0.5 wt% BYK 348 and 0.2 wt% PVP 40,000.
  • Example 18 Silver nanodispersion (8 wt%) with 0.5 wt% BYK 348 and 0.2 wt% PVP 55,000.
  • Silver nanodispersion (8 wt%) with 0.5 wt% BYK 348 and 0.1 wt% PVP 10,000.
  • Silver nanodispersion (8 wt%) with 0.5 wt% Sulfolane.
  • Silver nanodispersion (25 wt%) with 0.05 wt% BYK 348.
  • Silver nanodispersion (25 wt%) with 0.1 wt% BYK 348.
  • Example 23 Silver nanodispersion (37 wt%) with 0.05 wt% BYK 348.
  • Silver nanodispersion (37 wt%) with 0.1 wt% BYK 348.
  • Silver nanodispersion (25 wt%) with 0.1 wt% BYK 348 and 0.2 wt% PVP 40,000.
  • Silver nanodispersion 35 wt%) with 0.4 wt% silver acetate.
  • the conductive patterns can be obtained either by the direct printing (that can be repeated for several times) followed by sintering at a proper temperature (not higher than 320 0 C) or/and by using the first metallic pattern to induce formation of additional metal layers, such as encountered in "electroless process".
  • a decomposable silver salt such as silver acetate or silver nitrate, silver sulfate, silver carbonate and silver lactate, silver perchlorate can be added to the ink formulation.
  • Printing may be also followed by additional dipping in electroless bath, or by printing the electroless solution onto the printed pattern.
  • the printed nanoparticles can be used as templates for further crystallization and precipitation of other materials.
  • Example 10 40 ⁇ l of formulation of Example 10 was spread and dried on glass slide. Then the silver strip (70 mm length and 7 mm width) was sintered at 150 0 C and 320 0 C. It has been found that addition of silver acetate to the ink formulation results in decrease in resistance of silver strip from 9.3 to 7.0 ⁇ at 150 0 C and from 1.4 to 1.1 ⁇ at 320 0 C. To observe the changes in the silver layer after sintering, we viewed silver dispersion deposited onto glass slides, dried and heated at various temperatures (60 0 C,

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Colloid Chemistry (AREA)
  • Paints Or Removers (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Electric Cables (AREA)

Abstract

The invention relates to a method for preparing an aqueous-based dispersion of metal nanoparticles comprising: (a) providing an aqueous suspension of a metal salt; (b) pre-reducing the metal salt suspension by a water soluble polymer capable of metal reduction to form a metal nuclei; and (c) adding a chemical reducer to form metal nanoparticles in dispersion. The invention further relates to aqueous-based dispersions of metal nanoparticles, and to compositions such as ink comprising such dispersions.

Description

AQUEOUS-BASED DISPERSIONS OF METAL NANOPARTICLES
FIELD OF THE INVENTION
The present invention relates to the field of metal nanoparticle dispersions. More particularly, the present invention relates to aqueous-based dispersions of metal nanoparticles, a method for their preparation and compositions such as ink comprising such dispersions.
BACKGROUND OF THE INVENTION
Metallic nanoparticles draw intense scientific and practical interest due to their unique properties, which differ from those of bulk and atomic species. Such a difference is determined by peculiarity of electronic structure of the metal nanoparticles and extremely large surface afea with a high percentage of surface atoms. Metal nanoparticles exhibit a drastic decrease in melting point compared to that of the bulk material, they are characterized by enhanced reactivity of the surface atoms, high electric conductivity and unique optical properties. Virtually, nanosized materials are well-known materials with novel properties and promising applications in electrochemistry, microelectronics, optical, electronic and magnetic devices and sensors, in new types of active and selective catalysts, as well as in biosensors. Creation of stable concentrated nanocolloids of metals with low resistivity offers new prospects in computer-defined direct- write noncontact technologies, such as ink-jet printing, for deposition of metallic structures on various substrates. Microfabrications of such structures by lithographic and electroless techniques are time-consuming and expensive processes, and there is a real industrial need for direct digital printing of conductive patterns. Suggestions based on jetting small droplets of molten metals onto the substrate have met several problems, such as difficulty of adhering droplets onto a substrate, oxidation of the liquid metal, and the difficulty of fabrication a droplet- ejection mechanism compatible with high temperatures. Direct patterning by ink-jet printing, in addition to the conventional graphic applications, was reported in the last decade for various applications, such as fabrication of transistors and organic light emitting diodes, polymer films, structural ceramics and biotechnology. Conventional ink-jet inks may contain two types of colorants, dye or pigment, and are characterized by their main liquid, which is the vehicle for the ink. The main liquid may be water (water-based inks), or an organic solvent (solvent-based inks).
The dye or pigment-based inks differ with respect to the physical nature of the colorant. Pigment is a colored material that is insoluble in the liquid, while the dye is soluble in the liquid. Each system has drawbacks: pigments tend to aggregate, and therefore clog the nozzles in the orifice plate, or the narrow tubings in the printhead, thus preventing the jetting of the ink while printing. Dyes tend to dry, and form a crust on the orifice plate, thus causing failure in jetting and misdirection of jets. It is clear that the terms "dye" or "pigment" are the general wordings for materials, which are soluble or insoluble, respectively, in the solvents comprising the ink. Therefore, metal nanoparticles may be considered, in this context, if introduced into ink, as pigments of metal, having a size in the nanometer range.
Conventional pigments in ink-jet inks contain particles in the size range of 100-400 nm. In theory, reducing the particle size to 50 nni or less should show improved image quality and improved printhead reliability when compared to inks containing significantly larger particles.
The majority of inks in ink-jet printers are water-based inks. The use of metal nanoparticles as pigments requires the elaboration of ink formulations containing stable concentrated aqueous metal colloid. The synthesis of stable colloidal systems with high metal concentration is a serious problem. A variety of substances have been used to stabilize silver colloids: amphiphilic nonionic polymers and polyelectrolytes, ionic and nonionic surfactants, polyphosphates, nitrilotriacetate, 3- aminopropyltrimethoxysilane, and CS2. Stable water-soluble silver nanoparticles were also obtained by reduction of silver ions in the presence of amino- and carboxilate- terminated poly(amido amine) dendrimers, and crown ethers. The preparations of stable silver colloids, having low metal concentrations are described in the literature, in procedures based on reduction of metal from solution. The metal concentrations in these procedures amount only to lO'2 M (about 0.1%) even in the presence of stabilizers (it is almost impossible to obtain a stable aqueous silver colloid with the metal concentrations higher then 10"3 M without an additional stabilizer, due to fast particle aggregation). The preparation of ink compositions having silver nanoparticle concentration of up to about 1.5wt% (during the reaction step) is described in WO 03/038002. The synthesis of concentrated silver nanoparticles is described in:
B. H. Ryu et al.. Synthesis of highly concentrated silver nanoparticles, assisted polymeric dispersant, KEY ENGINEERING MATERIALS 264-268: 141-142 Part 1-3 2004; Beyong-Hwan Ryu et al., Printability of the synthesized silver nano sol in micro-patterning of electrode on ITO glass, Asia display/IMID 04 Proceedings, pages 1-4;
Ivan Sondi et al., Preparation of highly concentrated stable dispersions of uniform silver nanoparticles, Journal of colloid and Interface Science, 260 (2003) 75- 81 ;
Dan V. Goaia et al., Preparation of monodispersed metal particles. New J. Chem. 1998, pages 1203-1215.
Since ink-jet ink compositions contain, in addition to dyes or pigments, other additives, such as humectants, bactericides and fungicides and binders (polymeric additives, which improve the dye or pigment binding to substrate), the stabilizers should be compatible with these substances and should not change noticeably the physicochemical and rheological characteristics of inks (the most important characteristics are viscosity and surface tension). Several methods of the metallic image generation with the use of ink-jet technology have been described.
One known method is based on an ink containing a reducing agent and receiving material containing the reducible silver compound (AgNO3 or silver di(2- ethylhexyO-sulphosuccinate), and, on the contrary, an ink and a receiving support containing a silver compound and reducer, respectively. Heating the receiving support during or after the ink deposition resulted in an image formed by silver metal (U.S. Patent 5,501,150 to Leenders, et al; U.S. Patent 5,621,449 to Leenders, et al).
Another approach for the deposition of metallic structures is based on ink-jet printing of organometallic precursor dissolved in organic solvent with subsequent conversion of the precursor to metal at elevated temperatures (~300°C). To increase the metal (silver) loading of ink and to obtain higher decomposition rates, silver or other metal nanoparticles may be added to the ink along with the organometallic precursor. Near-bulk conductivity of printed silver films has been achieved with such compositions (Vest, R. W.; Tweedell, E.P.; Buchanan, R.C. Int. J. Hybrid Microelectron. 1983, 5, 261; Teng, K.F.; Vest, R. W. IEEE Trans. Indust. Electron. 1988, 55, 407; Teng, K.F.; Vest, R. W. IEEE Electron. Device Lett. 1988, 9, 591; Curtis, C; Rivkin, T.; Miedaner, A.; Alleman, J.; Perkins, J.; Smith, L.; Ginley, D. Proc. of the NCPV Program Review Meeting. Lakewood, Colorado, USA, 14-17 October 2001, p. 249).
Fuller et al. demonstrated ink-jet printing with the use of colloidal inks containing 5-7 nm particles of gold and silver in an organic solvent, α-terpineol, in order to build electrically and mechanically functional metallic structures. When sintered, the resistivity of printed silver structures was found to be 3 μΩ-cm, about twice of that for bulk silver (Fuller, S.B.; Wilhelm, E.J.; Jacobson, J.M. J. Microelectromeck Syst 2002, 11, 54).
The inventors have previously described the preparation of stabilized nanodispersions with silver concentration up to 1.5 wt%, at the reaction step which were shown to be suitable pigments for water-based ink-jet inks (WO 03/038002; Magdassi, S.; Bassa, A.; Vinetsky, Y.; Kamyshny, A. Chem. Mater. 2003, 15, 2208). The stabilizers used were ionic polymeric materials such as carboxymethyl cellulose (CMC) and polypyrrole (PPy), the silver nanoparticles size did not exceed 100 nm.
There is a widely recognized need and it will be highly advantageous to have a new method for obtaining aqueous-based dispersion of metal nanoparticles, preferably silver nanoparticles, which is simplified in production, which enables production of metal nanodispersion characterized by small diameter of the nanoparticles and high nanoparticle concentration and yet which is physically stable (i.e. does not undergo caking or agglomeration and can be easily redispersed if present as a sediment or a powder). Additionally it would be highly advantageous to have an aqueous based dispersion of metal nanoparticles with improved properties such as high electric conductivity when applied onto a substrate. SUMMARY OF THE INVENTION
The present invention relates to a method for preparing an aqueous-based dispersion of metal nanoparticles comprising: (a) providing an aqueous suspension of a metal salt;
(b) pre-reducing said metal salt suspension by a water soluble polymer capable of metal reduction to form metal nuclei; and
(c) adding a chemical reducer to form metal nanoparticles in dispersion.
The present invention additionally relates to an aqueous-based dispersion comprising metal nanoparticles and at least one water soluble polymer, said aqueous- based dispersion is characterized by:
(a) the concentration of said metal nanoparticles in said dispersion is in the range 0.5 -35wt%; (b) the size of said nanoparticles is below 20 nm in diameter; and
(c) the weight ratio of said water soluble polymer to said metal nanoparticles is below 0.1 :1.
The present invention further relates to an aqueous-based dispersion comprising metal nanoparticles and at least one water soluble dispersant, said aqueous-based dispersion is characterized by:
(a) the concentration of said metal nanoparticles in said dispersion is in the range 5 - 80 wt%;
(b) the size of said nanoparticles is below 20 nm in diameter; and (c) the weight ratio of said water soluble dispersant to said metal nanoparticles is below 0.1 : 1.
BRIEF DESCRIPTION OF FIGURES
Figure 1 shows TEM images of nanoparticles in concentrated Ag dispersions
(Fig. IA - 8 wt%; Fig. IB - 20 wt%).
Figure 2 shows silver patterns printed by ink-jet printer onto polyimide film (ink formulation contains 8 wt% silver and 0.5% BYK 348 as a wetting agent). On the left side (Fig. 2A), the part of the line (12 mm length, 1.5 mm width, 3.5 μm thickness), on which the conductivity was measured, is shown (magnified in Fig. 2B).
Figure 3 shows High Resolution SEM micrographs of the image obtained with silver nanodispersion deposited on glass slide, dried and sintered at various temperatures (600C, 1500C, 2600C, 3200C).
Figure 4 displays the conductivity (σ) of deposited and sintered samples relative to the conductivity of bulk silver (6.3-107 ohm'W).
Figure 5 shows optical and HR-SEM images of a ring formed on a glass substrate.
(Down left) Optical microscope image of a 2 mm diameter ring formed by drying a drop of silver dispersion and (up left) HR-SEM top-view image of the same ring, showing also the adjacent inner area enclosed by the ring and the gradual decrease in the particle density towards the center of the ring. (Right) HR-SEM image of the particles in the ring.
Fig. 6 presents the view of multiply twined nanoparticles prepared as described in Example 3.
DETAILED DESCRIPTION OF THE INVENTION
According to the present invention it is possible to obtain aqueous-based dispersion of metal nanoparticles from an aqueous suspension of a metal salt by using water soluble polymers, which have a dual function: One function is as initiators of the metal reduction process by providing a "pre-reduction" step while forming the metal nuclei, which serve as nucleation centers for subsequent reduction by reducing agent. Another function is as stabilizers of the formed metal nuclei and the resulting nanoparticles (preventing their agglomeration). The aqueous based dispersions of the present invention are characterized by high metal content, low particles size at the same or even lower stabilizer (water soluble polymer)-to-metal ratio compared to the prior art, high conductivity (after deposition onto substrates and drying). The aqueous-based dispersions obtained by using an aqueous suspension of metal salt and these dual effect stabilizers (water soluble polymers) show the following advantageous properties:
1) The concentration of metal nanoparticles during the reaction step (before separation step) can be up to about 35 wt%. Since a powder of redispersible metal nanoparticles (preferably silver nanoparticles) can be prepared according to this patent application, concentrated dispersions (up to 80% wt%) may be prepared.
2) The ratio of the water-soluble polymer to the metal can be decreased below that in the prior art in spite of much higher concentration of silver nanoparticles. This is highly advantageous since it enables production of a more pure product having low content of organic material which may interfere with the high conductivity properties.
3) The metal nanoparticle dispersions can form, upon drying of droplets, densely packed rings, which are conductive even at room temperature, without further heat induced sintering.
4) The metal nanoparticle dispersions are prepared by a pre-reduction of a metal salt (present in the form of aqueous suspension) with a proper water soluble polymer, which functions as a reducer and a stabilizer, followed by full reduction (exhaustive reduction) obtained by a chemical reducer, such as tri-sodium citrate, ascorbic acid, di-sodium tartrate, hydrazine, sodium borohydride, or mixtures thereof. This enables production of nanoparticles having high concentrations in dispersion and small size.
5) The preferred silver salt used in the preparation of the nanoparticles is silver acetate. Possibly due to: a) the action of acetate ion in aggregation of the nanoparticles. This allows easy separation of nanoparticles from the aqueous medium at the end of the reaction process (after full reduction with the chemical reducer), b) due to the low solubility of the silver acetate salt, the silver ion concentaration is kept below silver salt saturation value (for example about 2.5 wt% at 95 0C), thus the undisolved silver acetate serves as reservoir of silver ion. The low concentration of silver ion enables production of smaller particles at high metal salt concentrations. 6) The nanoparticle size of the obtained dispersions after separation is preferably below 20 nm and can be as low as 5-8 mil. Due to the smaller particle size the sedimentation rate is very slow, and is hindered by the Brownian motion. This is advantageous when long term stability is required. Additionally the sintering temperature can be lowered compared to particles having a larger size.
Thus, the present invention is based on the findings that it is possible to obtain aqueous-based dispersions of metal nanoparticles by a new method which comprises metal ions reduction in an aqueous suspension of metal salt, using water soluble polymers which are capable of metal reduction followed by full reduction using a chemical reducer. The method includes two-step reduction, first with a water soluble polymer to obtain metal nuclei, and then exhaustive reduction with a chemical reducer to form nanoparticles in dispersion. The new method of preparation enables formation of physically stable dispersions (i.e. which do not undergo caking and agglomeration). Separation step may be very simple due to spontaneous formation of a sediment as a result of nanoparticle aggregartion. Therefore centrifugation step may be omitted. The new method enables formation of aggregated nanoparticles which can be easily separated from the aqueous medium and redispersed. The formed sediment can be easily redispersed in a liquid (after separating from the aqueous medium) by using a suitable dispersing agent to form a stable and more concentrated dispersion.
Thus, the formed nanaparticles in the dispersion may be in an aggregated form (i.e. the nanoparticles maybe partially or mostly in an aggregated form). The method utilizes metal salts (preferably silver salts) having low solubility in water (preferably up to 5% w/w, at a temperature of 1000C) which results in low concentration of metal ions in the solution phase of the reaction mixture. At these conditions, small metallic nanoparticles are formed even at low concentrations of water soluble polymer (stabilizer). This method allows obtaining much higher concentration of metallic silver, at low stabilizer: silver ratio, after completion of reduction with a chemical reducer compared to all known procedures. This is highly advantageous since a more pure dispersion is obtained at the end of the process. This is important for example in applications where formation of conductive patterns is required. The weight ratio of the water soluble polymer (stabilizing polymer, protective agent) to metal that can be used according to this new method is much lower than in all known procedures, and may be only 0.01 : 1.
This is highly advantageous especially when low viscosity aqueous dispersion are required and if direct contact between the particles is required after application, for example, electrical conductivity and metallic appearance.
The new method enables to obtain nanodispersions or nanopowders (after the separation step) with organic: metal (preferably silver) weight ratio below 0.07:1 and this ratio can be as low as 0.03:1-0.05:1. Therefore, the obtained product is more pure and can be successfully used, for example, for formation of conductive patterns (due to low content of insulating organic material).
The size (diameter) of silver nanoparticles may be as low as 5-8 nm.
Rings produced by depositing drops of the obtained silver dispersion onto a substrate display high electric conductivity (up to 15 % of that for bulk silver) at room temperature, without sintering at elevated temperatures. Various types of conductive patterns can be obtained by deposition of arrays of said rings by various means such as ink jet printing.
Thus, the present invention relates to a method for preparing an aqueous-based dispersion of metal nanoparticles comprising:
(a) providing an aqueous suspension of a metal salt;
(b) pre-reducing of said metal salt suspension by a water soluble polymer capable of metal reduction to form metal nuclei; and
(c) adding a chemical reducer to form metal nanoparticles in dispersion.
The term "aqueous-based" as used herein, means that the dispersing medium of the dispersion comprises either water or an aqueous liquid or solution. Most preferably, the aqueous medium (dispersing medium) is all water, however the dispersing medium may also contain small amounts (preferably up to about 25 wt%, based on the total weight of the dispersing medium) of organic solvents which are miscible with water.
By the term "pre-reducing" in step (b) is meant that the water soluble polymer initiates metal reduction and reduces part the metal ions in the aqueous suspension. Full reduction of the remaining metal ions is obtained in step (c).
By the the term "metal nuclei" is meant an intermediate nanoparticle, wherein the average size of said nuclei is below the average size of the nanoparticles obtained in step (c).
The dispersion preparation may be also conducted by double jet method, (consisting of mixing two jets: of the dispersion obtained from step (b) and the chemical reducer from step (c).).
The method may further comprise at least one step (i.e. a step or repeated steps) of separating the nanoparticles obtained in step (c) from the aqueous medium of said dispersion and redispersing in a liquid to form a dispersion of nanoparticles.
Thus, according to a preferred embodiment of the present invention the method comprises: (a) providing an aqueous suspension of a metal salt;
(b) pre-reducing of said metal salt suspension by a water soluble polymer capable of metal reduction to form metal nuclei;
(c) adding a chemical reducer to form metal nanoparticles in dispersion; and
(d) at least one step of separating the nanoparticles obtained in step (c) from the aqueous medium of said dispersion and redispersing in a liquid to form a dispersion of nanoparticles.
According to a preferred embodiment of the present invention, the separation is selected from centrifugation, decantation, filtration, ultrafiltration, and a combination thereof.
Further according to a preferred embodiment of the present invention, the redispersing is performed using a suitable dispersing agent and optionally a wetting agent. The wetting agent may be added before or after the separation, preferably before the separation. Preferably the dispersing agent is a water soluble dispersant.
Still further according to a preferred embodiment of the present invention, the dispersing agent is selected from surfactants, water soluble polymers, and mixtures of any of the above. Additionally according to a preferred embodiment of the present invention, the water soluble polymer is a polyelectrolyte.
Further according to a preferred embodiment of the present invention, the polyelectrolyte (dispersing agent) is selected from Disperbyk 190, Solsperse 40000, and mixtures of any of the above.
Disperbyk 190 is a High-molecular- weight block copolymer with acidic affinic groups (acid value 10 mg KOH g'1), which can be obtained from BYK Chemie Germany.
Solsperse 40000 is a Water-soluble anionic phosphated alkoxylated polymer, which can be obtained from Avecia, England.
The wetting agent may be a surfactant. The surfactant may be for example BYK-154, BYK-348, Disperbyk 181, Disperbyk 184, LABS (such as LABS-W-100), and LABS salts, and mixtures of any of the above.
BYK-154 is an Ammonium salt of an acrylate copolymer, which can be obtained from BYK Chemie, Germany.
BYK-348 is a Polyether modified poly-dimethyl siloxane, which can be obtained from BYK Chemie, Germany.
Disperbyk 181 is an Alkanolammomium salt of a polyfunctional polymer (acid value 30 mg KOH g"1), which can be obtained from BYK Chemie, Germany. Disperbyk 184 is a High-molecular- weight block copolymer with pigment affinic groups (acid value 10 mg KOH g"1), which can be obtained from BYK Chemie, Germany.
LABS is a Linear alkyl benzene sulphonic acid which may have different chain length. LABS-W-100 is a Linear alkyl benzene sulphonic acid, which can be obtained from Zohar-Dalia, Israel.
The wetting agent may be for example a surfactant.
Preferably the liquid is an aqueous liquid (the liquid used for redispersing of the nanoparticles after separation from the aqueous medium).
The method may further comprise at least one step (i.e. a step or repeated steps) of separating the nanoparticles obtained in step (c) from the aqueous medium of said dispersion followed by removal of the water in order to obtain a powder of metallic particles. The removal of the water can be obtained by various methods such as loyphilization, spray drying, oven drying, vacuum drying etc. Prior to removal of the aqueous phase (medium) redispersing agents may be added such as wetting agents, dispersant etc. The powder may be further redispersed in a liquid such as an aqueous liquid or non-aqueous liquid (such as organic solvents, oils etc.).
Preferably the obtained powder of metal nanoparticles is characterized by a weight ratio of the organic material to the metal nanoparticles of below 0.1 :1, more preferably below 0.07:1, still more preferably in the range 0.03:1- 0.05:1. Such a powder is capable of redispersing in a liquid (aqueous liquid or non aqueous liquid such as organic solvents, or mixtures thereof), preferably without addition of a dispersant. The particle size after redispersion is preferably less that 20 nm in diameter.
Preferably step (b) includes incubation for a period of at least 5 minutes, i.e. the aqueous metal suspension and the water soluble polymer are incubated for at least 5 minutes to form a metal nuclei. (Preferably for 5 -15 minutes).
Preferably the aqueous metal suspension and the water soluble polymer are incubated for a period of at least 5 minutes (preferably for 5 to 15 min) while stirring.
According to another preferred embodiment of the present invention, step (b) is conducted at a temperature range of 20-100 0C. More preferably step (b) is conducted at a temperature range of 50-95 0C.
Additionally according to a preferred embodiment of the present invention, step (c) is conducted at a temperature range of 20-1000C. More preferably step (c) is conducted at a temperature range of 50-95 0C.
Preferably step (c) further includes a cooling step.
Moreover according to a preferred embodiment of the present invention step (c) is conducted at a temperature range of 20-1000C, more preferably 50-95 0C, followed by cooling to a temperature range 10-30 0C, more preferably 15-25 0C. Further according to a more preferred embodiment of the present invention, the metal nanoparticles are selected from silver nanoparticles, gold nanoparticles, platinum nanoparticles, palladium nanoparticles and a mixture of any of the above.
Most preferably the metal nanoparticles are silver nanoparticles.
The metal salt is preferably a silver salt or a gold salt, most preferably a silver salt.
The metal salt may also be a platinum salt or palladium salt.
Moreover according to a preferred embodiment of the present invention, the metal salt have low water solubility.
Moreover according to a preferred embodiment of the present invention, the metal salt have a solubility (solubility in water) of up to 5% w/w at a temperature of
1000C. According to an additional preferred embodiment of the present invention, the metal salt (preferably silver salt) is selected from silver acetate, silver sulfate, silver carbonate, and mixtures of any of the above. Most preferably the metal salt is silver acetate.
Preferably the metal salt is a metal acetate salt, and most preferably the metal acetate salt is silver acetate.
Further according to a preferred embodiment of the present invention, the content of the metal salt in the suspension is in the range of 1.0 to 50 wt% (based on the total weight of the suspension). The concentration of said metal salt in said suspension may be in the range of
15 to 35 wt%, and preferably in the range of 15 to 25 wt% (based on the total weight of the suspension).
Additionally, according to a preferred embodiment of the present invention, the concentration of said metal nanopraticles in said dispersion is in the range 0.5-35 wt%, based on the total weight of the dispersion.
The concentration of said metal nanopraticles in said dispersion (prior to the separation step) may be in the range 1.5-35 wt%, preferably 2-30 wt%, more preferably 3 - 25 wt%, and most preferably 5-25 wt%, based on the total weight of the dispersion. The concentration may also be in the range 3-35 wt%, preferably 5-35 wt%, more preferably 5-30 wt%, still more preferably 5-25 wt%, based on the total weight of the dispersion.
As used in the present invention by the term particle size below a certain value in diameter, for example by the term "particle size of said nanoparticles is below 50 nni in diameter" is meant that the mean particle diameter according to 90% by number of the particles (dgo) is under 50nm, as measured by Dynamic Light Scattering.
Similarly, as used herein by the term "particle size of said nanoparticles is below 20 nm in diameter" is meant that 90% of mean particle diameter calculated by number is under 20nm, as measured by Dynamic Light Scattering.
The particle size of the nanoparticles may be below 50 nm in diameter, preferably below 40 nm in diameter. More preferably the particle size is below 20 nm in diameter, even more preferably below 18 nm in diameter, still more preferably in the range 5-15 nm in diameter, and most preferably in the range 5-8 nm in diameter.
The nanoparticles of the present invention may be spherical, rod-like shaped or a combination thereof. Most preferably the nanoparticles are spherical shaped.
In the case where the nanoparticles are rod shaped, preferably the width of said particles is below 20 nm, the length to width ratio is up to 1 :5 (preferably the length to width ratio in the range of 1 : 1.2 to 1 :3)
The nanoparticles of the present invention may be multiply tweened particles
(mtp).
Preferably the multiply twined nanoparticles are capable of sintering at the temperature range of 90 -3200C, more preferably at the temperature range of 100-
1600C. The formed nanoparticle dispersion obtained after step (c) in the method described above, may be in the form of aggregates of nanaoparticles which are physically stable (i.e. do not undergo caking in case a sediment is formed) and can be easily redispersed in a liquid following separation from the aqueous dispersion, thus allowing formation of a more concentrated stable dispersions. Further according to a preferred embodiment of the present invention, the concentration of said metal nanopraticles in the dispersion (the obtained dispersion after separation step) is in the range 5 - 80 wt%, based on the total weight of the dispersion, and more preferably in the range 10-80 wt%, based on the total weight of the dispersion. The concentration of said metal nanopraticles in the dispersion may be in the range 10 - 60 wt%, and more preferably in the range 20-60 wt%. The concentration of the metal nanoparticles in the dispersion may also be in the range 35- 80 wt% and more preferably 40-60 wt%. (This preferred embodiment refers to the dispersion obtained after separating the nanoparticles obtained in step (c) from the aqueous medium of the dispersion and redispersing in a liquid to form a dispersion of nanoparticles.).
As may be understood by any person skilled in the art, there is a plurality of water soluble polymers (stabilizers), which are appropriate for use in the composition (aqueous-based dispersions) of the present invention and a man versed in the art can select for appropriate water soluble polymers using the following criteria:
Suitable water soluble polymers are those meeting the following criteria: 1) Lack of gel formation in the presence of metal ions. Water soluble polymers, which do not form a gel at concentrations required to initiate metal reduction and form a metal nuclei, are selected. The concentration of the polymers in the obtained dispersion will depend on the type of the polymer and can be lower than 0.5 wt% for a polymer such as polypyrole (and higher up to 10 wt% for a polymer such as Sokolan HP80). 2) Stabilization of metal nanoparticles. Water soluble polymers, which are also capable of stabilizing the formed metal (such as silver) nuclei were chosen. Such protective agents are water soluble polymers possessing electrostatic and steric effects of stabilization. .
After formation of nanoparticles in dispersion, the water soluble polymer stabilizes that dispersion, such that the nanoparticles can be easily redispersed (i.e. prevents caking of the dispersion).
3) Pre-reduction of metal ions with formation of metal nuclei. Polymers should pre-reduce metal (such as silver) ions with formation of metal nuclei, which serve as seeds for following formation of metal nanoparticles in dispersion after addition of the main chemical reducer.
Water soluble polymers, which fulfill all the above criteria, are chosen to be used in the aqueous dispersions of the present invention.
Preferably the water soluble polymer carries functional groups such as pyrrole, alkoxy, etheric, glycol, hydroxyl, amine groups, and combinations thereof. Such functional groups are capable of reducing metal ion.
According to a preferred embodiment of the present invention, the water soluble polymer is selected from polypyrrole, Sokalan HP80, Solsperse 40000, poly(ethylene glycol), and mixtures of any of the above.
Sokalan HP 80 is a Polycarboxylate ether, which can be obtained from BASF, Germany.
Solsperse 40000 is a Water-soluble anionic phosphated alkoxylated polymer, which can be obtained from Avecia, England.
Most preferably the water soluble polymer is polypyrrole.
Moreover according to a preffered embodiment of the present invention the metal salt is silver acetate and the water soluble polymer is polypyrrole.
Additionally according to a preferred embodiment of the present invention, the concentration of said water soluble polymer is in the range of 0.1-10.0 wt%. The weight ratio of the water soluble polymer to the metal may be in the range of 0.01 : 1 to 1 : 1. Preferably the weight ratio of the water soluble polymer to the metal is below 0.1 :1 (preferably in the range 0.01 :1-0.1 :1), more preferably in the range 0.01:1- 0.06:1, even more preferably in the range 0.01 :1-0.04:1, and most preferably in the range 0.01 :1-0.025:1.
In case the water soluble polymer is polypyrole , the preferred concentration range is 0.1-1.0 wt%.
In case the water soluble polymer is Sokalan HP80 , the preferred concentration range is 5.0-10.0 wt%. Further according to a preferred embodiment of the present invention, the chemical reducer is selected from tri-sodium citrate, ascorbic acid, di-sodium tartrate, hydrazine, sodium borohydride, and mixtures of any of the above. Most preferably the chemical reducers are ascorbic acid and hydrazine.
Preferably the method further comprises adding a colorant to the dispersion. The method may further comprise adding to the dispersion an additive selected from humectants, binders, surfactants, fungicides, rheology modifiers, pH adjusting agents, co-solvents, and mixtures thereof.
Preferably the aqueous-based dispersion is useful in preparing ink compositions, paints, or coatings.
Preferably the ink composition is for use in ink-jet printing. The aqueous-based dispersion may be used in coating compositions to provide for example an optical effect on a substrate.
Moreover according to a more preferred embodiment of the present invention, the dispersion is for use in obtaining conductive patterns by deposition of the dispersion on a substrate and optionally followed by sintering. In case conductive rings are obtained as will be detailed below the step of sintering can be omitted.
Further according to a preferred embodiment of the present invention, the method further comprises placing or jetting drops of the dispersion as described in the present invention onto a substrate to obtain conductive rings.
According to a preferred embodiment of the present invention the conductive rings have high electrical conductivity at room temperature.
Moreover according to a preferred embodiment of the present invention, the method further comprises dispensing a plurality of drops of the dispersion as described in the present invention onto a substrate to form arrays of conductive rings. The arrays of conductive rings form a conductive pattern.
The substrate may be for example plastics, paper, photo-paper, films (such as polyimide films), glass or PCB (printed circuits boards). The invention further relates to an aqueous-based dispersion comprising metal nanoparticles and at least one water soluble polymer capable of initiating metal reduction, wherein the concentration of said metal nanoparticles in said dispersion is in the range 0.5 - 35 wt% and wherein the size of said nanoparticles is below 20 run in diameter.
Such a dispersion is highly advantageous because of the combination of high nanoparticle concentration and low particle size of the nanoparticles provides superior properties to the dispersion such as high conductivity.
Moreover, formulating a dispersion characterized by high nanoparticles concentration and small particle size, and yet which is physically stable (does not undergo caking and aggregation) is a formulatory endeavor, and is non-obvious to obtain. According to a preferred embodiment of the present invention the aqueous- based dispersion is a substantially pure aqueous-based dispersion. By a "substantially pure aqueous-based dispersion" is meant that the weight ratio of the water soluble polymer to the metal nanoparticles is preferably below 0.1 :1 wt%, and most preferaby in the range 0.01 :1 to 0.025:1 wt%.
Preferably the aqueous-based dispersion consists essentially of metal nanoparticles and at least one water soluble polymer capable of initiating metal reduction, wherein the concentration of said metal nanoparticles in said dispersion is in the range 0.5 - 35 wt% and wherein the size of said nanoparticles is below 20 nm in diameter.
The present invention additionally relates to an aqueous-based dispersion comprising metal nanoparticles and at least one water soluble polymer, said aqueous- based dispersion is characterized by: (a) the concentration of said metal nanoparticles in said dispersion is in the range 0.5 -35wt%;
(b) the size of said nanoparticles is below 20 nm in diameter; and
(c) the weight ratio of said water soluble polymer to said metal nanoparticles is below 0.1 :1. Preferably the concentration of said metal nanoparticles in said dispersion is in the range 1.5 - 35 wt%, more preferably in the range 2-30 wt%, more preferably in the range 3-25 wt%, and most preferably in the range 5-20 wt%. The concentration may also be in the range 3-35 wt%, preferably 5-35 wt%, more preferably 5-30 wt%, still more preferably 5-25 wt%, based on the total weight of the dispersion.
According to a preferred embodiment of the present invention, the metal nanoparticles are selected from silver nanoparticles, gold nanoparticles, platinum nanoparticles, palladium nanoparticles and a mixture of any of the above. Most preferably the metal nanoparticles are silver nanoparticles.
The water soluble polymer is capable of initiating metal reduction. Preferably the water soluble polymer carries functional groups such as pyrrole, alkoxy, etheric, glycol, hydroxyl, amine groups, and combinations thereof. Such functional groups are capable of reducing metal ion.
Further according to a preferred embodiment of the present invention, the water soluble polymer is selected from polypyrrole, , Sokalan HP80 (Polycarboxylate ether) , Solsperse 40,000 (Water-soluble anionic phosphated alkoxylated polymer), poly(ethylene glycol), and mixtures of any of the above.
Most preferably the water soluble polymer is polypyrrole.
The water soluble polymer is capable of initiating metal reduction to form metal nuclei during preparation of the dispersion. The water soluble polymer also functions as a stabilizer during preparation of the dispersion and is capable of preventing metal nuclei aggregation and agglomeration after the pre-reduction step. The water soluble polymer is further characterized in that it does not form a gel in the presence of metal ions, at concentrations used to prepare the dispersion.
Additionally according to a preferred embodiment of the present invention, the weight ratio of said water soluble polymer to said nanoparticles is below 0.1 :1. Preferably the weight ratio of the water soluble polymer to the nanoparticles is in the range 0.01 :1-0.1 :1.
More preferably the weight ratio of said water soluble polymer to said nanoparticles is in the range 0.01:1 -0.06:1, even more preferably the weight ratio of said water soluble polymer to said nanoparticles is in the range 0.01 :1 -0.04:1. Most preferably the weight ratio of said water soluble polymer to said nanoparticles is in the range 0.01 :1 -0.025:1.
Further according to a preferred embodiment of the present invention, the size of said nanoparticles is below 18 nm in diameter.
Preferably the size of said nanoparticles is in the range 5-15 nm in diameter, more preferably the size of the nanoparticles is in the range 5-8 nm in diameter.
The aqueous dispersion may further comprise an organic solvent. The organic solvent may be for example dipropyleneglycol methyl ether (DPM), 2-methoxyethyl ether (diglyme), triethyleneglycol dimethyl ether (triglyme), propylene glycol, sulfolane, polyethylene glycol, glycerol. The concentration of the organic solvent may be up to 20 wt%, based on the total weight of the dispersion.
Moreover according to a preferred embodiment of the present invention, the aqueous dispersion is characterized in that the conductivity of the dispersion deposited onto substrate can be as high as 50% of that of the bulk metal.
The invention additionally relates to an aqueous-based dispersion comprising metal nanoparticles and at least one water soluble dispersant, wherein the concentration of said metal nanoparticles in said dispersion is in the range 5 - 80 wt% and wherein the size of said nanoparticles is below 20 nm in diameter.
Preferably the aqueous-based dispersion is a substantially pure aqueous-based dispersion. By the term "substantially pure aqueous-based dispersion" is meant that weight ratio of said water soluble dispersant to said nanoparticles is below 0.1 :1.
Preferably the aqueous-based dispersion consists essentially of metal nanoparticles and at least one water soluble dispersant, wherein the concentration of said metal nanoparticles in said dispersion is in the range 5 - 80 wt% and wherein the size of said nanoparticles is below 20 nm in diameter.
The present invention additionally relates to an aqueous-based dispersion comprising metal nanoparticles and at least one water soluble dispersant, said aqueous-based dispersion is characterized by:
(a) the concentration of said metal nanoparticles in said dispersion is in the range 5 - 80 wt%;
(b) the size of said nanoparticles is below 20 nm in diameter; and (c) the weight ratio of said water dispersant to said metal nanoparticles is below 0.1 :1.
According to a preferred embodiment of the present invention, the metal nanoparticles are selected from silver nanoparticles, gold nanoparticles, platinum nanoparticles, palladium nanoparticles and mixtures of any of the above. Most preferably the metal nanoparticles are silver nanoparticles.
Further according to a preferred embodiment of the present invention, the water soluble dispersant is selected from surfactants, water soluble polymers, and mixtures of any of the above.
Still further according to a preferred embodiment of the present invention, the water soluble polymer is a polyelectrolyte.
Preferably the weight ratio of said water soluble dispersant to said nanoparticles is below 0.1:1, more preberably below 0.075:1, and most prefeably in the range 0.04 :1 - 0.06:1.
The weight ratio of the water soluble dispersant to the nanoparticles may also be in the range 0.04:1-0.1:1, and more preferably in the range 0.04:1-0.075:1.
Preferably the polyelectrolyte (dispersant) is selected from Disperbyk 190, Solsperse 40000, and mixtures of any of the above. Moreover according to a more preferred embodiment of the present invention, the aqueous-based dispersion is characterized in that the conductivity of the dispersion deposited onto substrate can be as high as 50% of that of the bulk metal.
Further according to a preferred embodiment of the present invention, the size of said nanoparticles is below 1 S nm in diameter.
Preferably the size of said nanoparticles is in the range 5-15 nm in diameter, more preferably the size of the nanoparticles is in the range 5-8 nm in diameter.
The nanoparticles may be spherical, rod-like shaped (as described above) or a combination thereof. Most preferably the nanoparticles are spherical shaped. The nanoparticles may be multiply tweened particles (mtp). Preferably the multiply twined nanoparticles are capable of sintering at the temperature range of 90 -3200C, more preferably at the temperature range of 100- 1600C.
The aqueous-based dispersions of the present invention may further comprise a water soluble metal salt (such as silver salt).
The water soluble silver salt may be for example silver acetate, silver nitrate, silver sulfate, silver carbonate, silver lactate, silver perchlorate, or mixtures thereof. Most preferably the silver salt is silver acetate.
The silver salt is preferably added to the final dispersion (at a concentration range of preferably 0.05-5 wt%) to achieve further increase in conductivity of printed pattern, which decomposes during sintering that results in formation of metallic (silver) additive acting as "glue" for sintering silver nanoparticles.
The aqueous-based dispersions of the invention comprises an aqueous medium which can be either water, an aqueous liquid or an aqueous solution.
According to additional preferred embodiment of the present invention, the aqueous-based dispersions of the present invention further comprising at least one member selected from humectants (such as dipropyleneglycol methyl ether (DPM), 2- methoxyethyl ether (diglyme), triethyleneglycol dimethyl ether (triglyme), propylene glycol, sulfolane, polyethylene glycol, glycerol), binders (such as polyvinylpyrrolidone (PVP), acrylic resins, acrylic latexes), surfactants (such as silwet L-77 , BYK 348, BYK 346, BYK 333), fungicides, rheology modifiers (such as colloidal silica, clays, water soluble polymers), deformers (such as silicon derivatives), pH adjusting agents (such as acids and bases), and mixtures of any of the above.
BYK-333 is a Polyether modified poly-dimethyl polysiloxane, which can be obtained from BYK Chemie, Germany. BYK-346 is a Polyether modified poly-dimethyl-siloxane, which can be obtained from BYK Chemie, Germany.
Silwet L-77 is a Polyalkylencoxide modified Heptamethyltrisiloxane and Allyloxypolyethyleneglycol methyl ether solution, which can be obtained from Helena Chemical Company, USA.
Preferably the aqueous-based dispersions are characterized by organic material: metal weight ratio of below 0.1 :1, more preferably below 0.07:1. This ratio can be as low as 0.03: 1-0.05:1. Therefore, the obtained product is more pure and can be successfully used, for example, for formation of conductive patterns (due to low content of insulating organic material).
According to another preferred embodiment of the present invention, the aqueous-based dispersions of the present invention further comprising a colorant.
The colorant may be for example organic dye or pigments.
The present invention additionally provides an ink composition comprising an aqueous based dispersion as described in the present invention.
The ink of the present invention may be characterized by the following: The metal nanoparticles concentrations in the ink are as high as 20 wt% if low viscosity ink is required (up to 5 cps) and can be up to 70-80 wt%, if high viscosity is required (up to 20 cps at jetting temperature).
Thus, the present invention provides compositions and methods for preparation of water-based inks (preferably ink-jet inks), in which the pigments are nanoparticles of metal, and composition and methods for preparing stable, concentrated dispersions of metallic nanoparticles. The ink composition of the present invention overcomes a common problem in pigment containing ink-jet inks, namely sedimentation, since the particle size is very small, preferably below 20 nm in diameter, thus the sedimentation rate is very slow, and is hindered by the Brownian motion.
It should be mentioned that the nanoparticles, due to their very small size, would behave differently, when compared to large particles. For example, nanoparticles have a lower melting point than bulk metal, and a lower sintering temperature than that of bulk metal. This property is of particular importance when sintering is needed in order to obtain electrical conductivity.
It is clear that the metallic patterns obtained by the aqueous dispersions of the present invention can be used for decoration purposes, even if the resulting pattern is not electrically conductive. Another aspect of the invention is that the resulting pattern of the silver nanoparticles has an antimicrobial effect, due to the presence of silver nanoparticles, thus eliminating the need for antimicrobial agents which are often introduced into water based ink jet inks.
In addition, we recently discovered a new approach to obtain conductive patterns based on the so called "coffee stain effect" (Deegan, R.D.; Bakajin, O.;
Dupont, T.F.; Huber, G.; Nagel, S.R.; Witten, T.A. Nature, 1997, 389, 827), which becomes apparent when a spilled drop of coffee dries on a solid surface. This effect caused by capillary forces, results in formation of a dense ring along the perimeter of the drying droplet. We discovered that while drying droplets of silver dispersion, a very dense ring is formed at the perimeter of the droplet. This ring is composed of tightly packed silver nanoparticles, and it was surprisingly found that high electric conductivity of this ring is obtained even at room temperature.
Further, the present invention provides conductive rings produced by placing or jetting drops of a dispersionas described in the present invention onto a substrate.
According to a preferred embodiment of the present invention the conductive rings have high electrical conductivity at room temperature. Moreover, the present invention provides conductive patterns obtained by dispensing a plurality of drops of a dispersion as described in the present invention onto a substrate to form arrays of conductive rings.
Ink-jet printing of conductive patterns by placing or jetting of dispersion droplets on a proper substrate may be applied in microelectronic industry.
Patterns can be used in microelectronics, for smart card obtaining, decorative coatings. Preferably the high electrical conductivity is in the range of 5-50% of bulk silver for printed patterns (after sintering at 150-3200C), in the range of 10-15% of bulk silver for deposited rings at room temperature and in the range of 15-50% of bulk silver for deposited rings (after sintering at 150-3200C).
The present invention further provides a powder of metal nanoparticles characterized by a weight ratio of the organic material to the metal nanoparticles of below 0.1 :1, more preferably below 0.07:1, still more preferably in the range 0.03:1- 0.05:1. Such a powder is capable of redispersing in a liquid (aqueous liquid or non aqueous liquid such as organic solvents, or mixtures thereof), preferably without addition of a dispersant. The particle size after redispersion is preferably less that 20 run in diameter.
Thus a solvent-based dispersion can be obtained by dispersing the powder in a solvent or a solvent mixture. The dispersion may optionally include binders, surfactants and rheology modifiers etc. and may be for use in ink-jet inks.
Preparation of nanoparticles and dispersions
Fine metal particles from micrometer to nanometer size can be synthesized by both physical methods (formation in gas phase, laser ablation) and chemical methods (sonochemical or photochemical reduction, electrochemical synthesis, chemical reduction), as are known in the art. The former methods provide fine metal particles by decreasing the size by applying energy to the bulk metal, while in the latter methods, fine particles are produced by increasing the size from metal atoms obtained by reduction of metal ions in solution. In the present invention, the chemical method for the preparation of silver nanoparticles is preferably employed, namely, fine particles were produced by reduction of silver salt in a solution or a suspension with the use of a proper reducing agent according to the following scheme: Men+ + wRed ► Me° + πθx+
Two step reduction was employed, first with a water soluble polymer and second with a chemical reducer.
Silver nanoparticles can be prepared with the use of various reducing agents (chemical reducers), such as sodium borohydride, trisodium citrate, hydrazine, ascorbic acid, sugars and gaseous hydrogen.
Two principal stages are included in the procedure of preparation of concentrated and stable silver nanodispersions: a) synthesis step: pre-reduction of a silver salt by a water soluble polymer (synthetic or natural polymer), which is also a stabilizing agent, resulting in formation of silver nuclei; such nuclei serve as seeds for formation of silver nanoparticles (which can be in an aggregated form in dispersion), after addition of a proper chemical reducer; b) separation and concentration step: centrifugation is followed by decantation and redispersion of formed the silver nanoparticles in a proper dispersing medium. Such a method allows preparation of water-based nanodispersions with silver concentration as high as 10-80 wt%. The separation step can be also performed by an ultrafiltration process. The water from the dispersion can be further removed (by lyophiliztion, spray drying, vacuum drying oven drying etc.) and the obtained powder can be redispersed again in a small volume of water or organic solvent that results in formation of highly concentrated silver nanodispersion. The advantage of such dispersion is the low content of organic materials. Using the present invention, conductive patterns with conductivity of about 50% of the conductivity of bulk silver, can be obtained. EXAMPLES
1. Preparation of silver nanodispersions via silver salt suspension:
Examples 1-3
Materials and reagents:
Polypyrrole, 5% aqueous solution (PPy)
Ascorbic acid
Silver acetate (AgAc)
Dispersing agent Solsperse 40,000 (Avecia, England)
Triple distilled water (TDW)
Figure imgf000028_0001
Instalments: Hot plate with a stirrer Centrifuge (Sorvall superspeed RC2-B) Ultrasound bath (42 kHz)
DSL (Dynamic Light scattering) (Malvern HPPS/NanoSizer) Oven for heating at 6000C
Stock solutions:
Ascorbic acid 30 wt% Solsperse 40000 5 wt% Example 1
Procedure Nuckation step: 1 g of AgAc was added to 10.605 ml of TDW in a 28 ml vial. The vial was heated in a hot bath to 950C while stirring. After 5 min of stirring, 0.32 g of Ppy (5 wt%) was added.
Reaction: 15 min after addition of PPy, 0.865 g of ascorbic acid (30 wt%) was added, and reaction mixture was heated at 950C for 5 min while stirring and then was cooled in ice bath. A spontaneous formation of sediment is obtained as a result of nanoparticles aggregation.
Separation process: Cold Ag dispersion was centrifuged for 10 min at 5000 rpm, and all the supernatant liquid was decanted. 0.114 g (0.12 ml) of 30% Solsperse 40,000 was added to the rest. The resulting dispersion was treated in ultrasonic bath for 10 min and vortexed.
Mass balance: (in the reaction) Silver concentration: 5 wt% PPy concentration relative to silver: 2.5 wt% Solsperse 40000 concentration relative to silver: 5.7 wt%
Characteristics of obtained dispersion:
Silver concentration: A precise amount of silver dispersion was placed in glass vial and heated at 6000C for 30 min. Silver content in obtained dispersion was found to be 6.4 wt%.
Yield: The silver yield is 95.2%.
Particle size: See Table 1 (measured by DLS).
Example 2
Procedure: Nucleation: 2 g of AgAc was added to 8.45 ml of TDW in a 28 ml vial. The vial was heated in a hot bath to 950C while stirring. After 5 min of stirring, 0.64 g of Ppy (5 wt%) was added.
Reaction; 15 min after addition of PPy, 1.73 g of ascorbic acid (30 wt%) was added, and reaction mixture was heated at 950C for 5 min while stirring and then was cooled in ice bath. A spontaneous formation of sediment is obtained as a result of nanoparticles aggregation.
Separation process: Cold Ag dispersion was centrifuged for 10 min at 5000 ipm, and all the supernatant liquid was decanted. 0.228 g (0.12 ml) of 30% Solsperse 40,000 was added to the rest. The resulting dispersion was treated in ultrasonic bath for 10 min and vortexed.
Mass balance: (in the reaction) Silver concentration: 10 wt% PPy concentration relative to silver: 2.5 wt%
Solsperse 40000 concentration relative to silver: 5.7 wt%
Characteristics of obtained dispersion:
Silver concentration: A precise amount of silver dispersion was placed in glass vial and heated at 600 C for 30 min. Silver content in obtained dispersion was found to be 14.05 wt%.
Yield: The silver yield is 97.3%. Particle size: See Table 1 (measured by DLS).
Example 3
Procedure:
Nucleation: 2 g of AgAc was added to 3.415 ml of TDW in a 28 ml vial. The vial was heated in a hot bath to 950C while stirring. After 5 min of stirring, 0.256g of Ppy (5 wt%) was added. Reaction: 15 min after addition of PPy, 1.73 g of ascorbic acid (30 wt%) was added, and reaction mixture was heated at 950C for 5 min while stirring and then was cooled in ice bath. A spontaneous formation of sediment is obtained as a result of nanoparticles aggregation. Separation process: Cold Ag dispersion was centrifuged for 10 min at 5000 rpm, and all the supernatant liquid was decanted. 0.228 g (0.12 ml) of 30% Solsperse 40,000 was added to the rest. The resulting dispersion was treated in ultrasonic bath for 10 min and vortexed. Mass balance: (in the reaction) Silver concentration: 17.3 wt% PPy concentration relative to silver: 1 wt% Solsperse 40000 concentration relative to silver: 5.7 wt%
Characteristics of obtained dispersion:
Silver concentration: A precise amount of silver dispersion was placed in glass vial and heated at 6000C for 30 min. Silver content in obtained dispersion was found to be
18 wt%.
Yield: The silver yield is more than 97.3%. Particle size: See Table 1 (measured by DLS).
Examples 4-5 Materials and reagents: Sokalan HP80 Ascorbic acid
Silver acetate (AgAc)
Dispersing agent Solsperse 40,000 (Avecia, England)
Triple distilled water (TDW)
Figure imgf000031_0001
Instruments: Hot plate with a stirrer Centrifuge (Sorvall superspeed RC2-B) Ultrasound bath (42 IcHz) DSL (Dynamic Light scattering) (Malvern HPPS/NanoSizer) Oven for heating at 6000C
Stock solutions: Ascorbic acid 15 wt% Ascorbic acid 3 Owt% Solsperse 40000 5 wt% Sokalan HP80 50 wt%
Example 4
Procedure
Nucleation step: 1 g of AgAc was added to 5.3 ml of TDW in a 28 ml vial. The vial was heated in a hot bath to 950C while stirring. After 5 min of stirring, 3.26 g of Sokalan HP80, 50 wt%, was added.
Reaction: 5 min after addition of Sokalan HP80, 3.46 g of ascorbic acid (15 wt%) was added, and reaction mixture was heated at 950C for 5 min while stirring and then was cooled in the ice bath.
Separation process: Cold Ag dispersion was centrifuged forlO min at 5000 rpm, and all the supernatant liquid was decanted. 0.127 g (0.12 ml) of 30% Solsperse 40,000 was added to the rest. The resulting dispersion was treated in ultrasonic bath for 10 min and vortexed.
Mass balance: (in the reaction) Silver concentration: 5 wt%
Sokalan HP80 concentration relative to silver: 100 wt% Solsperse 40000 concentration relative to silver: 7.4 wt% Characteristics of obtained dispersion:
Silver concentration: A precise amount of silver dispersion was placed in glass vial and heated at 6000C for 30 min. Silver content in obtained dispersion was found to be
2.87 wt%.
Yield: The silver yield is 67.6%.
Particle size: See Table 1 (measured by DLS).
Example 5 Procedure:
Niicleation: 2 g of AgAc was added to 4.3 ml of TDW in a 28 ml vial. The vial was heated in a hot bath to 950C while stirring. After 5 min of stirring, 3.26 g of Sokalan HP80, 50 wt%, was added. Reaction: 5 min after addition of Sokalan HP80, 3.46 g of ascorbic acid (15 wt%) was added, and reaction mixture was heated at 950C for 5 min while stirring and then was cooled in the ice bath.
Separation process: Cold Ag dispersion was centrifuged for 10 min at 5000 rpm, and all the supernatant liquid was decanted. 0.22 g (0.21 ml) of 30% Solsperse 40,000 was added to the rest. The resulting dispersion was treated in ultrasonic bath for 10 min and vortexed.
Mass balance: (in the reaction) Silver concentration: 10 wt% PPy concentration relative to silver: 100 wt% Solsperse 40000 concentration relative to silver: ~7 wt%
Characteristics of obtained dispersion: Particle size: See Table 1 (measured by DLS). Table 1 : Particle size as measured by Dynamic Light Scattering (DLS)
Figure imgf000034_0001
Values in nm, represent mean diameter particle size. dgo means that 90% of mean particle diameter calculated by number is below the indicated value. d95 means that means that 95% of mean particle diameter calculated by number is below the indicated value.
2. Preparation of silver nanopowder The obtained concentrated silver nanodispersion can be further lyophilized to yield a powder, optionally in the presence of a wetting agent (which optionally is added before lyphilization). This powder can be easily redispersed in water, to yield a much more concentrated silver nanodispersion, up to 20-80 wt% of silver without change in the average particle size of silver nanoparticles compared to original dispersion (Fig. 1, right (Fig. IB)).
3. Preparation of ink-jet inks containing silver nanoparticles
The suitability of prepared silver nanodispersions as pigments for ink-jet inks was evaluated with the use of Lexmark Z602 ink-jet printer. Several ink-jet formulations are described in the following examples. Each formulation was capable of printing. Printing was performed on various substrates, such as paper, photo-paper, polyimide films, transparency, glass and PCB (printed circuits boards). In general, the new ink-jet ink contains the silver nanoparticles, and aqueous solution which may contain surfactants, additional polymers, humectants, cosolvents, buffering agent, antimicrobial agents and defoamers in order to ensure proper jetting and adhesion of the ink to specific substrates. Fig. 2 presents an example of silver electrodes pattern printed onto polyimide film (ink formulation contains 8 wt% silver, 0.6 wt% Disperbyk 190 as a dispersing agent and 0.5% BYK 348 as a wetting agent). On the left side, the part of the line (12 mm length, 1.5 mm width, 3.5 μm thickness), on which the conductivity was measured, is shown. It should be emphasized that that printer requires inks with very low viscosities, a few cps. However, industrial printhead such as those produced by Spectra, are functional at viscosities as high as 15-20 cps. Therefore, for such printheads more concentrated dispersions of silver nanoparticles can be utilized. A silver dispersion having a silver content higher than 20 % (up to about 80% w/w) can be prepared by redispersion the silver nanoparticles powder in a proper amount of aqueous phase.
Examples for ink compositions
Example 1 :
Silver nanodispersion (8 wt%) prepared as described above ,containing 0.2 wt% BYK 346 and 5 wt% DPM. Example 2: Silver nanodispersion (8 wt%) and containing 0.5 wt% BYK 346 and 10 wt% DPM.
Example 3: Silver nanodispersion (8 wt%) with 0.2 wt% BYK 346 and 20 wt% DPM.
Example 4:
Silver nanodispersion (8 wt%) with 0.5 wt% BYK 346 and 15 wt% DPM.
Example 5:
Silver nanodispersion (8 wt%) with 0.5 wt% BYK 346 and 5 wt% DPM.
Example 6:
Silver nanodispersion (8 wt%) with 1 wt% BYK 346 and 10 wt% DPM. Example 7:
Silver nanodispersion (8 wt%) with 0.2 wt% BYK 346.
Example 8:
Silver nanodispersion (8 wt%) with 0.2 wt% BYK 348.
Example 9:
Silver nanodispersion (8 wt%) with 5 wt% DPM.
Example 10:
Silver nanodispersion (8 wt%) with 0.5 wt% BYK 348.
Example 11 : Silver nanodispersion (8 wt%) with 0.5 wt% BYK 348 and 5 wt% Diglyme.
Example 12:
Silver nanodispersion (8 wt%) with 0.5 wt% BYK 348 and 5 wt% Triglyme.
Example 13:
Silver nanodispersion (8 wt%) with 0.5 wt% BYK 348 and 5 wt% Propylene glycol.
Example 14:
Silver nanodispersion (8 wt%) with 0.5 wt% BYK 348 and 5 wt% Polyethylene glycole 200.
Example 15:
Silver nanodispersion (8 wt%) with 0.5 wt% BYK 348 and 5 wt% Glycerol.
Example 16:
Silver nanodispersion (8 wt%) with 0.5 wt% BYK 348 and 0.2 wt% PVP (polyvinylpyrollidone) 10,000. Example 17:
Silver nanodispersion (8 wt%) with 0.5 wt% BYK 348 and 0.2 wt% PVP 40,000.
Example 18: Silver nanodispersion (8 wt%) with 0.5 wt% BYK 348 and 0.2 wt% PVP 55,000.
Example 19:
Silver nanodispersion (8 wt%) with 0.5 wt% BYK 348 and 0.1 wt% PVP 10,000.
Example 20:
Silver nanodispersion (8 wt%) with 0.5 wt% Sulfolane.
Example 21 :
Silver nanodispersion (25 wt%) with 0.05 wt% BYK 348.
Example 22:
Silver nanodispersion (25 wt%) with 0.1 wt% BYK 348.
Example 23 : Silver nanodispersion (37 wt%) with 0.05 wt% BYK 348.
Example 24:
Silver nanodispersion (37 wt%) with 0.1 wt% BYK 348.
Example 25:
Silver nanodispersion (25 wt%) with 0.1 wt% BYK 348 and 0.2 wt% PVP 40,000.
Example 26:
Silver nanodispersion (35 wt%) with 0.4 wt% silver acetate.
Example 27:
Silver nanodispersion (35 wt%) with 1.0 wt% silver acetate. 4. Obtaining the conductive patterns.
The conductive patterns can be obtained either by the direct printing (that can be repeated for several times) followed by sintering at a proper temperature (not higher than 3200C) or/and by using the first metallic pattern to induce formation of additional metal layers, such as encountered in "electroless process". To improve the interconnection between nanoparticles and to increase the conductivity, a decomposable silver salt, such as silver acetate or silver nitrate, silver sulfate, silver carbonate and silver lactate, silver perchlorate can be added to the ink formulation. Printing may be also followed by additional dipping in electroless bath, or by printing the electroless solution onto the printed pattern. Actually, the printed nanoparticles can be used as templates for further crystallization and precipitation of other materials.
It has been found that the use of formulations described in Examples 1, 6, 10 and 16, as ink-jet inks, allows obtaining printed silver patterns, which were characterized by electric conductivity (the resistance of lines of 12 mm length, 1.5 mm width and 3.5-5 μm thickness printed 1 to 10 times, was measured). The conductivity was shown to increase with the increase in the number of printed layers as well as with the increase in sintering temperature (Table 2).
Further increase in conductivity of printed pattern can be achieved by addition of silver acetate to the final dispersion, which decomposes during sintering that results in formation of metallic (silver) additive acting as "glue" for sintering the silver nanoparticles.
40 μl of formulation of Example 10 was spread and dried on glass slide. Then the silver strip (70 mm length and 7 mm width) was sintered at 1500C and 3200C. It has been found that addition of silver acetate to the ink formulation results in decrease in resistance of silver strip from 9.3 to 7.0 Ω at 1500C and from 1.4 to 1.1 Ω at 3200C. To observe the changes in the silver layer after sintering, we viewed silver dispersion deposited onto glass slides, dried and heated at various temperatures (600C,
1500C, 2600C, 3200C), by High Resolution SEM (Fi g. 3). At 3200C the electric conductivity can reach about 50% of that for the bulk metal (Fig. 4). The lower conductivity of printed lines compared to that of the deposited lines may result from defects and voids in the printed pattern. Table 2. Resistance of silver lines (15 mm length, 1.5 mm width) printed onto polyimide films.
Example No. Number of Sintering Sintering time Resistance of
printings temperature ( C) (nun) printed line (Ω)
1 5 320° 10 10
1 10 320° 10 1.9
6 10 320° 10 7.6
10 10 150° 240 4.8
10 10 200° 60 4.0
10 10 250° 60 2.4
10 1 320° 10 252
10 10 320° 10 2.6
16 10 150° 240 7.7
16 10 200° 60 4.3
16 10 250° 60 3.2
16 1 320° 10 73.3
16 10 320° 10 2.4 Formation of conductive rings while drying the drops of silver dispersion is another approach to obtaining the conductive patterns. It was found that during drying of individual drop of the silver dispersion of nanoparticles, a dense ring is formed at its perimeter. The ring preparation was performed as follows. A dispersion of silver nanoparticles containing 8 wt% of metal and 0.1 wt% of PPy was diluted 200 times, and the resulting concentrations of Ag and PPy were 0.04 and 0.0005 wt%, respectively. Then a drop of this dispersion (3 μl) was placed on glass slide and dried. The ring formed after drying the drop was shown to be composed of closely packed silver nanoparticles (Fig. 5). Such rings were shown to possess high electric conductivity (up to 15 % of that for bulk silver) already at room temperature without any additional treatment (e.g. sintering).
While this invention has been shown and described with reference to preferred embodiments thereof, it will be understood by those skilled in the art that many alternatives, modifications and variations may be made thereto without departing from the spirit and scope of the invention. Accordingly, it is intended to embrace all such alternatives, modifications and variations that fall within the spirit and broad scope of the appended claims.
All publications, patents and patent applications mentioned in this specification are herein incorporated in their entirety by reference into the specification, to the same extent as if each individual publication, patent or patent application was specifically and individually indicated to be incorporated herein by reference.

Claims

WHAT IS CLAIMED IS:
1. A method for preparing an aqueous-based dispersion of metal nanoparticles comprising:
(a) providing an aqueous suspension of a metal salt;
(b) pre-reducing said metal salt suspension by a water soluble polymer capable of metal reduction to form metal nuclei; and
(c) adding a chemical reducer to form metal nanoparticles in dispersion.
2. The method of claim 1 further comprising at least one step of separating the nanoparticles obtained in step (c) from the aqueous medium of said dispersion and redispersing in a liquid to form a dispersion of nanoparticles.
3. The method of claim 2 wherein said separation is selected from centrifugation, decantation, filtration, ultrafiltration, and a combination thereof.
4. The method of claim 2 wherein said redispersing is performed using a suitable dispersing agent and optionally a wetting agent.
5. The method of claim 4 wherein said dispersing agent is selected from surfactants, water soluble polymers, and mixtures of any of the above.
6. The method of claim 5 wherein said water soluble polymer is a polyelectrolyte.
7. The method of claim 6 wherein said polyelectrolyte is selected from Disperbyk 190, Solsperse 40000, and mixtures of any of the above.
8. The method of claim 4 wherein said wetting agent is a surfactant.
9. The method of claim 2 wherein said liquid is an aqueous liquid.
10. The method of claim 1 further comprising at least one step of separating the nanoparticles obtained in step (c) from the aqueous medium of said dispersion followed by removal of water in order to obtain a powder of metallic particles.
11. The method of claim 1 wherein said step (b) includes incubation for a period of at least 5 minutes.
12. The method of claim 1 wherein step (b) is conducted at a temperature range of 20-100 0C.
13. The method of claim 1 wherein step (c) is conducted at a temperature range of 20-1000C.
14. The method of claim 1 wherein said metal nanoparticles are selected from silver nanoparticles, gold nanoparticles, platinum nanoparticles, palladium nanoparticles, and a mixture of any of the above.
15. The method of claim 1 wherein said metal nanoparticles are silver nanoparticles.
16. The method of claim 1 wherein said metal salt have low water solubility.
17. The method of claim 1 wherein said metal salt have a solubility of up to 5% w/w at a temperature of 1000C.
18. The method of claim 1 wherein said metal salt is selected from silver acetate, silver sulfate, silver carbonate, and mixtures of any of the above.
19. The method of claim 1 wherein said metal salt is a metal acetate salt
20. The method of claim 19 wherein said metal acetate salt is silver acetate.
21. The method of claim 1 wherein the content of said metal salt in said suspension is in the range of 1.0 to 50 wt%.
22. The method of claim 1 wherein the concentration of said metal nanopraticles in said dispersion is in the range 0.5-35 wt%, based on the total weight of the dispersion.
23. The method of claim 1 wherein the particle size of said nanoparticles is below 20 nm in diameter.
24. The method of claim 2 wherein the concentration of said metal nanopraticles in said dispersion is in the range 5 - 80 wt%, based on the total weight of the dispersion.
25. The method of claim 1 wherein said water soluble polymer is selected from polypyiτole, Sokalan HP80, Solsperse 40,000, poly(ethylene glycol), and mixtures of any of the above.
26. The method of claim 1 wherein said metal salt is silver acetate and said water soluble polymer is polypyrrole.
27. The method of claim 1 wherein the concentration of said water soluble polymer is in the range of 0.1-10 wt%.
28. The method of claim 1 wherein the weight ratio of said water soluble polymer to said metal is below 0.1 :1.
29. The method of claim 1 wherein the weight ratio of said water soluble polymer to said metal is in the range 0.01 : 1- 0.06: 1.
30. The method of claim 1 wherein said chemical reducer is selected from tri- sodium citrate, ascorbic acid, di-sodium tartrate, hydrazine, sodium borohydride, and mixtures of any of the above.
31. The method of claim 1 further comprising adding a colorant to said dispersion.
32. The method according to anyone of the preceding claims further comprising adding to said dispersion an additive selected from humectants, binders, surfactants, fungicides, rheology modifiers, pH adjusting agents, co-solvents, and mixtures thereof.
33. The method according to anyone of the preceding claims wherein said dispersion is useful in preparing ink compositions, paints, or coatings.
34. The method according to anyone of the preceding claims wherein said dispersion is for use in obtaining conductive patterns by deposition of said dispersion on a substrate and optionally followed by sintering.
35. The method according to anyone of the preceding claims further comprising placing or jetting drops of the dispersion onto a substrate to obtain conductive rings.
36. The method according to claim 35 wherein said conductive rings have high electrical conductivity at room temperature.
37. The method according to anyone of the preceding claims further comprising dispensing a plurality of drops of the dispersion onto a substrate to form arrays of conductive rings.
38. The method according to claim 33 wherein said ink composition is for use in ink-jet printing.
39. An aqueous-based dispersion comprising metal nanoparticles and at least one water soluble polymer, said aqueous-based dispersion is characterized by:
(a) the concentration of said metal nanoparticles in said dispersion is in the range 0.5 -35wt%; (b) the size of said nanoparticles is below 20 nm in diameter; and
(c) the weight ratio of said water soluble polymer to said metal nanoparticles is below 0.1 :1.
40. An aqueous-based dispersion comprising metal nanoparticles and at least one water soluble dispersant, said aqueous-based dispersion is characterized by:
(a) the concentration of said metal nanoparticles in said dispersion is in the range 5 - 80 wt%; (b) the size of said nanoparticles is below 20 urn in diameter; and
(c) the weight ratio of said water soluble dispersant to said metal nanoparticles is below 0.1 :1.
41. An ink composition comprising an aqueous-based dispersion as defined in claims 39 or 40.
PCT/IL2006/000031 2005-01-10 2006-01-10 Aqueous-based dispersions of metal nanoparticles WO2006072959A1 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
AT06700979T ATE461981T1 (en) 2005-01-10 2006-01-10 WATER-BASED DISPERSIONS OF METAL NANOPARTICLES
DE602006013100T DE602006013100D1 (en) 2005-01-10 2006-01-10 WATER-BASED DISPERSIONS OF METAL NANOPARTICLES
US11/813,628 US8227022B2 (en) 2005-01-10 2006-01-10 Method of forming aqueous-based dispersions of metal nanoparticles
CN2006800020225A CN101128550B (en) 2005-01-10 2006-01-10 Aqueous-based dispersions of metal nanoparticles
EP06700979A EP1853673B1 (en) 2005-01-10 2006-01-10 Aqueous-based dispersions of metal nanoparticles
JP2007550014A JP2008527169A (en) 2005-01-10 2006-01-10 Aqueous dispersion of metal nanoparticles
IL184466A IL184466A (en) 2005-01-10 2007-07-05 Aqueous-based dispersions of metal nanoparticles
US13/489,032 US20120241693A1 (en) 2005-01-10 2012-06-05 Aqueous-based dispersions of metal nanoparticles

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US64211605P 2005-01-10 2005-01-10
US60/642,116 2005-01-10

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/489,032 Division US20120241693A1 (en) 2005-01-10 2012-06-05 Aqueous-based dispersions of metal nanoparticles

Publications (1)

Publication Number Publication Date
WO2006072959A1 true WO2006072959A1 (en) 2006-07-13

Family

ID=36046873

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IL2006/000031 WO2006072959A1 (en) 2005-01-10 2006-01-10 Aqueous-based dispersions of metal nanoparticles

Country Status (8)

Country Link
US (2) US8227022B2 (en)
EP (1) EP1853673B1 (en)
JP (1) JP2008527169A (en)
KR (1) KR101298804B1 (en)
CN (1) CN101128550B (en)
AT (1) ATE461981T1 (en)
DE (1) DE602006013100D1 (en)
WO (1) WO2006072959A1 (en)

Cited By (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007136382A1 (en) * 2006-05-24 2007-11-29 E.I. Du Pont De Nemours And Company Conductive inkjet ink formulation
WO2008051719A1 (en) * 2006-10-24 2008-05-02 3M Innovative Properties Company Conductive ink formulations
EP1984188A1 (en) * 2006-02-13 2008-10-29 Exax Inc. Silver organo-sol ink for forming electrically conductive patterns
WO2009052120A1 (en) * 2007-10-15 2009-04-23 Nanoink, Inc. Lithography of nanoparticle based inks
EP2074055A1 (en) * 2006-09-29 2009-07-01 LG Chem, Ltd. Ink for ink jet printing and method for preparing metal nanoparticles used therein
WO2010066335A1 (en) 2008-12-12 2010-06-17 Byk-Chemie Gmbh Method for producing metal nanoparticles and nanoparticles obtained in this way and use thereof
KR100970805B1 (en) 2007-08-29 2010-07-16 경남도립남해대학 산학협력단 Preparing Method Of Colloid Having Ag Nano-Particle and Colloid Having Ag Nano-Particle Using The Same
US7824580B2 (en) 2006-10-25 2010-11-02 Bayer Materialscience Ag Silver-containing aqueous formulation and its use to produce electrically conductive or reflective coatings
JP2010537057A (en) * 2007-08-31 2010-12-02 メタラー テクノロジーズ インターナショナル ソスィエテ アノニム Method for producing silver nanoparticles
US7850875B2 (en) * 2006-11-09 2010-12-14 Seiko Epson Corporation Ink composition and pattern forming method
EP2323757A2 (en) * 2008-09-09 2011-05-25 Guardian Industries Corp. Stable silver colloids and silica-coated silver colloids, and methods of preparing stable silver colloids and silica-coated silver colloids
WO2011051952A3 (en) * 2009-11-02 2011-06-23 Yissum Research Development Company Of The Hebrew University Of Jerusalem, Ltd. Transparent conductive coatings for optoelectronic and electronic devices
CN102131573A (en) * 2008-08-22 2011-07-20 日产化学工业株式会社 Metal microparticle-dispersing agent comprising branched polymeric compound having ammonium group
US20110262657A1 (en) * 2008-10-17 2011-10-27 Pope Dave S Method for Reducing Thin Films on Low Temperature Substrates
CN102343440A (en) * 2010-07-29 2012-02-08 同济大学 Method for preparing water-soluble nano silver by using actinidia as template
EP2468827A1 (en) 2010-12-21 2012-06-27 Agfa-Gevaert A dispersion comprising metallic, metal oxide or metal precursor nanoparticles
WO2012104534A1 (en) 2011-02-01 2012-08-09 Universite De Technologie De Troyes Method for manufacturing metal nanoparticles
US20120267151A1 (en) * 2009-09-30 2012-10-25 Mikiko Hojo Metal microparticle dispersion, process for production of electrically conductive substrate, and electrically conductive substrate
US8404160B2 (en) 2007-05-18 2013-03-26 Applied Nanotech Holdings, Inc. Metallic ink
US8422197B2 (en) 2009-07-15 2013-04-16 Applied Nanotech Holdings, Inc. Applying optical energy to nanoparticles to produce a specified nanostructure
EP2608218A1 (en) 2011-12-21 2013-06-26 Agfa-Gevaert A Dispersion comprising metallic, metal oxide or metal precursor nanoparticles, a polymeric dispersant and a thermally cleavable agent
EP2608217A1 (en) 2011-12-21 2013-06-26 Agfa-Gevaert A dispersion comprising metallic, metal oxide or metal precursor nanoparticles, a polymeric dispersant and a sintering additive
WO2013112440A1 (en) * 2012-01-24 2013-08-01 Eastman Kodak Company Ink having antibacterial and antifungal protection
US8506849B2 (en) 2008-03-05 2013-08-13 Applied Nanotech Holdings, Inc. Additives and modifiers for solvent- and water-based metallic conductive inks
US8512760B2 (en) 2007-11-23 2013-08-20 The University Court Of The University Of Dundee Nano-particle dispersions
EP2671927A1 (en) 2012-06-05 2013-12-11 Agfa-Gevaert A metallic nanoparticle dispersion
US8647979B2 (en) 2009-03-27 2014-02-11 Applied Nanotech Holdings, Inc. Buffer layer to enhance photo and/or laser sintering
ES2471667A1 (en) * 2012-12-21 2014-06-26 Universitat De Val�Ncia Method of obtaining metallic nano and micrometric structures from a nanocomposite, metallic structure obtained with the method and use thereof (Machine-translation by Google Translate, not legally binding)
US9028601B2 (en) 2011-02-03 2015-05-12 Seiko Epson Corporation Ink composition and printed matter
US9217088B2 (en) 2006-08-03 2015-12-22 Alpha Metals, Inc. Particles and inks and films using them
US9598776B2 (en) 2012-07-09 2017-03-21 Pen Inc. Photosintering of micron-sized copper particles
US9615463B2 (en) 2006-09-22 2017-04-04 Oscar Khaselev Method for producing a high-aspect ratio conductive pattern on a substrate
US9730333B2 (en) 2008-05-15 2017-08-08 Applied Nanotech Holdings, Inc. Photo-curing process for metallic inks
US9731263B2 (en) 2009-03-02 2017-08-15 Colorobbia Italia S.P.A. Process for preparing stable suspensions of metal nanoparticles and the stable colloidal suspensions obtained thereby
CN107573922A (en) * 2017-08-01 2018-01-12 北京梦之墨科技有限公司 A kind of liquid metal quantum material and preparation method thereof
US10231344B2 (en) 2007-05-18 2019-03-12 Applied Nanotech Holdings, Inc. Metallic ink
US10781324B2 (en) 2012-06-22 2020-09-22 C3Nano Inc. Metal nanostructured networks and transparent conductive material
US10870772B2 (en) 2014-07-31 2020-12-22 C3Nano Inc. Transparent conductive films with fused networks
US10895794B2 (en) 2013-09-10 2021-01-19 Nanyang Technological University Electrochromic device having a patterned electrode free of indium tin oxide (ITO)
WO2021038066A1 (en) 2019-08-29 2021-03-04 Societe Bic Process for preparing an aqueous gel ink with fixed color comprising silver or gold nanoparticles
WO2021246858A1 (en) * 2020-06-03 2021-12-09 Mimos Berhad Method of preparing silver nanoparticles for use as ink
US11274223B2 (en) 2013-11-22 2022-03-15 C3 Nano, Inc. Transparent conductive coatings based on metal nanowires and polymer binders, solution processing thereof, and patterning approaches
US11343911B1 (en) 2014-04-11 2022-05-24 C3 Nano, Inc. Formable transparent conductive films with metal nanowires
US11802214B2 (en) 2019-08-29 2023-10-31 Societe Bic Process of preparation of an aqueous gel ink with variable color comprising silver nanoparticles
US11807762B2 (en) 2018-11-22 2023-11-07 Societe Bic Process for preparing aqueous gel inks with variable color, and aqueous gel inks thereof
US11820905B2 (en) 2019-08-29 2023-11-21 Societe Bic Process of preparation of an aqueous gel ink with fixed color comprising gold nanoparticles
US11968787B2 (en) 2012-06-22 2024-04-23 C3 Nano, Inc. Metal nanowire networks and transparent conductive material

Families Citing this family (82)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1837394A1 (en) * 2006-03-21 2007-09-26 The Procter and Gamble Company Cleaning Method
KR100911439B1 (en) 2007-08-17 2009-08-11 나노씨엠에스(주) Aqueous conductive ink composition for inkjet printer using nano-silver colloidal solution and method forming electrode pattern by inkjet printing
KR100969479B1 (en) * 2008-01-31 2010-07-14 광주과학기술원 Synthesis method of gold nanoparticles capable of tuning a size of particles
JP2009191298A (en) * 2008-02-12 2009-08-27 Noritake Co Ltd Method for producing metal particulate-dispersed liquid
US8157886B1 (en) * 2008-02-19 2012-04-17 Sandia Corporation Bulk synthesis of nanoporous palladium and platinum powders
TWI403239B (en) * 2008-05-23 2013-07-21 Zhen Ding Technology Co Ltd Ink and method for manufacturing electrical traces using the same
US20110151110A1 (en) * 2008-07-25 2011-06-23 John Frank St Metal nanoparticle ink compositions
JP5431071B2 (en) * 2008-08-28 2014-03-05 三ツ星ベルト株式会社 Conductive substrate, precursor thereof, and production method thereof
JP5431073B2 (en) * 2008-09-01 2014-03-05 三ツ星ベルト株式会社 Method for producing a conductive substrate
US7846866B2 (en) * 2008-09-09 2010-12-07 Guardian Industries Corp. Porous titanium dioxide coatings and methods of forming porous titanium dioxide coatings having improved photocatalytic activity
US20100062265A1 (en) * 2008-09-09 2010-03-11 Guardian Industries Corp. Titanium Dioxide Coatings and Methods of Forming Titanium Dioxide Coatings Having Reduced Crystallite Size
US20100062032A1 (en) * 2008-09-09 2010-03-11 Guardian Industries Corp. Doped Titanium Dioxide Coatings and Methods of Forming Doped Titanium Dioxide Coatings
US8545899B2 (en) * 2008-11-03 2013-10-01 Guardian Industries Corp. Titanium dioxide coatings having roughened surfaces and methods of forming titanium dioxide coatings having roughened surfaces
JP5430922B2 (en) * 2008-12-24 2014-03-05 三ツ星ベルト株式会社 Method for producing conductive substrate
JP5368925B2 (en) * 2009-09-25 2013-12-18 三菱製紙株式会社 Method for producing silver ultrafine particles
US20110076450A1 (en) * 2009-09-29 2011-03-31 Sharma Pramod K Titanium dioxide coatings and methods of forming improved titanium dioxide coatings
KR101117177B1 (en) * 2009-11-11 2012-03-07 광주과학기술원 Method for synthesizing silver nanoparticles by solid-state reaction process and silver nanoparticles synthesized by the same
DE102010044329A1 (en) * 2010-09-03 2012-03-08 Heraeus Materials Technology Gmbh & Co. Kg Contacting agent and method for contacting electrical components
TWI401301B (en) * 2010-10-06 2013-07-11 Univ Nat Cheng Kung Sintering composition and sintering method
WO2012057205A1 (en) * 2010-10-27 2012-05-03 株式会社ミマキエンジニアリング Water-based ink
GB2486190A (en) 2010-12-06 2012-06-13 P V Nano Cell Ltd Concentrated dispersion of nanometric silver particles
JP2012162594A (en) * 2011-02-03 2012-08-30 Seiko Epson Corp Ink composition and printed matter
EP2698448A4 (en) * 2011-04-12 2015-01-07 Nissan Chemical Ind Ltd Electroless plating primer including hyperbranched polymer and metallic microparticles
JP6021804B2 (en) * 2011-04-12 2016-11-09 国立大学法人九州大学 Electroless plating base material containing hyperbranched polymer, metal fine particles and organic acid
US20120286502A1 (en) * 2011-05-13 2012-11-15 Xerox Corporation Storage Stable Images
WO2012173407A2 (en) * 2011-06-14 2012-12-20 주식회사 아모그린텍 Conductive metal nanoparticle ink and preparation method thereof
US9849512B2 (en) * 2011-07-01 2017-12-26 Attostat, Inc. Method and apparatus for production of uniformly sized nanoparticles
TWI462791B (en) * 2011-07-08 2014-12-01 Benq Materials Corp Method for forming nano sliver particles
US20130189499A1 (en) * 2012-01-24 2013-07-25 Thomas Nelson Blanton Antibacterial and antifungal protection for ink jet image
US9316645B2 (en) 2011-10-07 2016-04-19 Brown University Methods, compositions and kits for imaging cells and tissues using nanoparticles and spatial frequency heterodyne imaging
DE102011085642A1 (en) * 2011-11-03 2013-05-08 Bayer Materialscience Aktiengesellschaft Process for the preparation of a metal nanoparticle dispersion, metal nanoparticle dispersion and their use
CN102371358A (en) * 2011-11-18 2012-03-14 复旦大学 Aqueous-phase preparation method for re-dispersible nano-copper particles
CN108219591B (en) * 2012-02-29 2022-02-18 新加坡朝日化学及锡焊制品有限公司 Inks comprising metal precursor nanoparticles
WO2013133103A1 (en) * 2012-03-07 2013-09-12 住友金属鉱山株式会社 Silver powder and method for producing same
CN102627028B (en) * 2012-03-29 2014-10-15 中国科学院化学研究所 Method for preparing high-resolution pattern based on self-infiltration-removal of ink droplet
KR20150023794A (en) * 2012-06-18 2015-03-05 이노바 다이나믹스, 인코포레이티드 Agglomerate reduction in a nanowire suspension stored in a container
US9085699B2 (en) * 2013-01-22 2015-07-21 Eastman Kodak Company Silver metal nanoparticle composition
US9328253B2 (en) * 2013-01-22 2016-05-03 Eastman Kodak Company Method of making electrically conductive micro-wires
US8828536B2 (en) 2013-02-04 2014-09-09 Eastman Kodak Company Conductive article having silver nanoparticles
US8828502B2 (en) 2013-02-04 2014-09-09 Eastman Kodak Company Making a conductive article
US8828275B2 (en) 2013-02-04 2014-09-09 Eastman Kodak Company Metal nanoparticle composition with water soluble polymer
US9099227B2 (en) 2013-01-22 2015-08-04 Eastman Kodak Company Method of forming conductive films with micro-wires
WO2014171597A1 (en) 2013-04-15 2014-10-23 (주)플렉센스 Method for manufacturing nanoparticle array, surface plasmon resonance-based sensor and method for analyzing using same
US10060851B2 (en) 2013-03-05 2018-08-28 Plexense, Inc. Surface plasmon detection apparatuses and methods
JP2016521448A (en) 2013-05-10 2016-07-21 ユーシカゴ・アーゴン,エルエルシー Rechargeable nanoelectrofuel electrode and device for high energy density flow battery
FR3013607B1 (en) * 2013-11-27 2016-04-29 Genesink Sas INK COMPOSITION BASED ON NANOPARTICLES
US9155201B2 (en) 2013-12-03 2015-10-06 Eastman Kodak Company Preparation of articles with conductive micro-wire pattern
JP5991309B2 (en) * 2013-12-16 2016-09-14 住友金属鉱山株式会社 Manufacturing method of high-purity platinum powder
DE112015000622B4 (en) * 2014-02-03 2023-09-28 Du Pont China Ltd. Compositions for high speed printing of conductive materials for electrical circuit applications and methods related thereto
WO2016002881A1 (en) * 2014-07-02 2016-01-07 国立大学法人九州大学 Fine particle dispersion liquid, wiring pattern and method for forming wiring pattern
WO2016152017A1 (en) * 2015-03-23 2016-09-29 バンドー化学株式会社 Conductive coated composite body and method for producing same
US9839652B2 (en) 2015-04-01 2017-12-12 Attostat, Inc. Nanoparticle compositions and methods for treating or preventing tissue infections and diseases
EP3283580A4 (en) 2015-04-13 2019-03-20 Attostat, Inc. Anti-corrosion nanoparticle compositions
US11473202B2 (en) 2015-04-13 2022-10-18 Attostat, Inc. Anti-corrosion nanoparticle compositions
JP6743466B2 (en) * 2015-06-10 2020-08-19 株式会社リコー Method for forming thin film conductor layer and sintering apparatus for thin film conductor layer
CN106364198B (en) * 2015-07-22 2019-07-19 中国科学院理化技术研究所 Method for printing liquid metal on paper surface
CN105149609A (en) * 2015-09-07 2015-12-16 昆明仁旺科技有限公司 Method of preparing precious metal powder
CN108348884A (en) 2015-10-30 2018-07-31 科莱恩国际有限公司 The metal dispersion of stability with raising
US20190242064A1 (en) * 2016-01-14 2019-08-08 Folia Water, Inc. Substrates with metal nanoparticles, related articles, and a continuous process for making same
DE102016002890A1 (en) 2016-03-09 2017-09-14 Forschungszentrum Jülich GmbH Process for the preparation of an ink, ink and their use
US9877485B2 (en) * 2016-04-13 2018-01-30 Xerox Corporation Silver polyester-sulfonated nanoparticle composite filaments and methods of making the same
CA3030308C (en) 2016-07-29 2022-04-05 The Board Of Trustees Of Western Michigan University Magnetic nanoparticle-based gyroscopic sensor
CN107962180B (en) * 2016-10-19 2018-10-16 北京梦之墨科技有限公司 A kind of water soluble fluorescence liquid metal material and preparation method thereof
JP6820400B2 (en) 2016-10-25 2021-01-27 ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. Dispersions and injectable compositions containing cesium oxide tungsten nanoparticles and zwitterionic stabilizers
US11305486B2 (en) * 2016-10-25 2022-04-19 Hewlett-Packard Development Company, L.P. Dispersion and jettable composition containing metal oxide nanoparticles
US9975110B1 (en) 2016-11-23 2018-05-22 Honda Motor Co., Ltd. Method for producing metal catalyst nanoparticles
WO2018111686A1 (en) 2016-12-14 2018-06-21 The Charles Stark Draper Laboratory, Inc. Reactively assisted ink for printed electronic circuits
WO2018169672A1 (en) * 2017-03-13 2018-09-20 Eastman Kodak Company Silver-containing compositions containing cellulosic polymers and uses
JPWO2019022239A1 (en) * 2017-07-28 2020-05-28 コニカミノルタ株式会社 Image forming method, image formed product, and inkjet ink
JP7179536B2 (en) * 2017-10-13 2022-11-29 キヤノン株式会社 Inkjet recording method and inkjet recording apparatus
JP6935308B2 (en) * 2017-11-21 2021-09-15 ナガセケムテックス株式会社 Manufacturing method of base material with metal pattern and metal ink
US11646453B2 (en) 2017-11-28 2023-05-09 Attostat, Inc. Nanoparticle compositions and methods for enhancing lead-acid batteries
US11018376B2 (en) 2017-11-28 2021-05-25 Attostat, Inc. Nanoparticle compositions and methods for enhancing lead-acid batteries
JP6992497B2 (en) * 2017-12-26 2022-01-13 株式会社リコー Ink, recording method, and recording device
US12115250B2 (en) 2019-07-12 2024-10-15 Evoq Nano, Inc. Use of nanoparticles for treating respiratory infections associated with cystic fibrosis
US20220275225A1 (en) * 2019-08-29 2022-09-01 Societe Bic Process of preparation of an aqueous gel ink with fixed color comprising silver nanoparticles
CN110842215A (en) * 2019-12-23 2020-02-28 深圳农联天材科技开发有限公司 Synthetic method of crop leaf surface high-adhesion nano silver
US11492547B2 (en) 2020-06-04 2022-11-08 UbiQD, Inc. Low-PH nanoparticles and ligands
KR102307482B1 (en) * 2020-06-05 2021-09-30 주식회사 나노와 Method for producing high-concentration metal ink, andhigh-concentration metal ink produced by this method
US20230348745A1 (en) * 2020-08-13 2023-11-02 Kao Corporation Metal fine particle dispersion
AU2021394739A1 (en) * 2020-12-07 2023-02-23 Nobel /Noble Elements/ Llc Stable dispersions of silver nanoparticles and methods of preparation thereof
CN113579229B (en) * 2021-06-18 2023-04-18 西湖未来智造(杭州)科技发展有限公司 Nano metal 3D printing ink and application thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1180647A (en) * 1997-07-17 1999-03-26 Nippon Paint Co Ltd Colloidal solution of noble metal or copper and production thereof with paint composition and resin molded material
EP0911859A1 (en) * 1997-10-23 1999-04-28 Sumitomo Metal Mining Company Limited Transparent electro-conductive structure, process for its production, transparent electro-conductive layer forming coating fluid used for its production, and process for preparing the coating fluid
WO2003038002A1 (en) * 2001-11-01 2003-05-08 Yissum Research Development Company Of The Hebrew University Of Jerusalem Ink-jet inks containing metal nanoparticles
EP1571186A1 (en) * 2004-03-01 2005-09-07 Sumitomo Electric Industries, Ltd. Metallic colloidal solution and ink jet ink using it

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0641669B1 (en) 1993-09-07 1996-12-18 Agfa-Gevaert N.V. Ink jet recording method operating with a chemically reactive ink
US5389670A (en) 1993-12-21 1995-02-14 Eli Lilly Company Methods of inhibiting the symptoms of premenstrual syndrome/late luteal phase dysphoric disorder
WO2002087749A1 (en) * 2001-04-30 2002-11-07 Postech Foundation Colloid solution of metal nanoparticles, metal-polymer nanocomposites and methods for preparation thereof
JP4254313B2 (en) * 2003-04-09 2009-04-15 住友電気工業株式会社 Conductive ink and method for producing the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1180647A (en) * 1997-07-17 1999-03-26 Nippon Paint Co Ltd Colloidal solution of noble metal or copper and production thereof with paint composition and resin molded material
EP0911859A1 (en) * 1997-10-23 1999-04-28 Sumitomo Metal Mining Company Limited Transparent electro-conductive structure, process for its production, transparent electro-conductive layer forming coating fluid used for its production, and process for preparing the coating fluid
WO2003038002A1 (en) * 2001-11-01 2003-05-08 Yissum Research Development Company Of The Hebrew University Of Jerusalem Ink-jet inks containing metal nanoparticles
EP1571186A1 (en) * 2004-03-01 2005-09-07 Sumitomo Electric Industries, Ltd. Metallic colloidal solution and ink jet ink using it

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 08 30 June 1999 (1999-06-30) *

Cited By (82)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1984188A1 (en) * 2006-02-13 2008-10-29 Exax Inc. Silver organo-sol ink for forming electrically conductive patterns
EP1984188A4 (en) * 2006-02-13 2011-08-03 Exax Inc Silver organo-sol ink for forming electrically conductive patterns
GB2450656A (en) * 2006-05-24 2008-12-31 Du Pont Condutive inkjet ink formulation
WO2007136382A1 (en) * 2006-05-24 2007-11-29 E.I. Du Pont De Nemours And Company Conductive inkjet ink formulation
US9217088B2 (en) 2006-08-03 2015-12-22 Alpha Metals, Inc. Particles and inks and films using them
US10462908B2 (en) 2006-09-22 2019-10-29 Alpha Assembly Solutions Inc. Conductive patterns and methods of using them
US9615463B2 (en) 2006-09-22 2017-04-04 Oscar Khaselev Method for producing a high-aspect ratio conductive pattern on a substrate
US7867413B2 (en) * 2006-09-29 2011-01-11 Lg Chem, Ltd. Ink for ink jet printing and method for preparing metal nanoparticles used therein
EP2074055A1 (en) * 2006-09-29 2009-07-01 LG Chem, Ltd. Ink for ink jet printing and method for preparing metal nanoparticles used therein
EP2074055A4 (en) * 2006-09-29 2011-03-23 Lg Chemical Ltd Ink for ink jet printing and method for preparing metal nanoparticles used therein
WO2008051719A1 (en) * 2006-10-24 2008-05-02 3M Innovative Properties Company Conductive ink formulations
US7976736B2 (en) 2006-10-25 2011-07-12 Bayer Materialscience Ag Process for preparing silver-containing aqueous formulation useful for electrically conductive or reflective coatings
US7824580B2 (en) 2006-10-25 2010-11-02 Bayer Materialscience Ag Silver-containing aqueous formulation and its use to produce electrically conductive or reflective coatings
US7850875B2 (en) * 2006-11-09 2010-12-14 Seiko Epson Corporation Ink composition and pattern forming method
US8354045B2 (en) 2006-11-09 2013-01-15 Seiko Epson Corporation Ink composition and pattern forming method
US10231344B2 (en) 2007-05-18 2019-03-12 Applied Nanotech Holdings, Inc. Metallic ink
US8404160B2 (en) 2007-05-18 2013-03-26 Applied Nanotech Holdings, Inc. Metallic ink
KR100970805B1 (en) 2007-08-29 2010-07-16 경남도립남해대학 산학협력단 Preparing Method Of Colloid Having Ag Nano-Particle and Colloid Having Ag Nano-Particle Using The Same
KR101526335B1 (en) * 2007-08-31 2015-06-08 메탈러 테크놀로지스 인터내셔날 쏘시에떼아노님(메탈러 테 크놀로지스 인터내셔날 악티엔게젤샤프트)(메탈러 테크놀 로지스 인터내셔날 리미티드) Method for preparing silver nanoparticles
JP2010537057A (en) * 2007-08-31 2010-12-02 メタラー テクノロジーズ インターナショナル ソスィエテ アノニム Method for producing silver nanoparticles
JP2011502183A (en) * 2007-10-15 2011-01-20 ナノインク インコーポレーティッド Lithography of nanoparticle-based inks
WO2009052120A1 (en) * 2007-10-15 2009-04-23 Nanoink, Inc. Lithography of nanoparticle based inks
US8512760B2 (en) 2007-11-23 2013-08-20 The University Court Of The University Of Dundee Nano-particle dispersions
US8506849B2 (en) 2008-03-05 2013-08-13 Applied Nanotech Holdings, Inc. Additives and modifiers for solvent- and water-based metallic conductive inks
US9730333B2 (en) 2008-05-15 2017-08-08 Applied Nanotech Holdings, Inc. Photo-curing process for metallic inks
US10597491B2 (en) 2008-08-22 2020-03-24 Nissan Chemical Corporation Metal fine particle dispersant containing branched polymer compound having ammonium group
US8722562B2 (en) * 2008-08-22 2014-05-13 Nissan Chemical Industries, Ltd. Metal fine particle dispersant containing branched polymer compound having ammonium group
CN104785163A (en) * 2008-08-22 2015-07-22 日产化学工业株式会社 Metal microparticle-dispersing agent comprising branched polymeric compound having ammonium group
US20110183837A1 (en) * 2008-08-22 2011-07-28 Nissan Chemical Industries, Ltd. Metal fine particle dispersant containing branched polymer compound having ammonium group
CN104785163B (en) * 2008-08-22 2018-04-13 日产化学工业株式会社 The metal particle dispersant being made of the branched polymeric compound with ammonium
US20140288264A1 (en) * 2008-08-22 2014-09-25 Kyushu University Metal fine particle dispersant containing branched polymer compound having ammonium group
CN102131573A (en) * 2008-08-22 2011-07-20 日产化学工业株式会社 Metal microparticle-dispersing agent comprising branched polymeric compound having ammonium group
EP2323757A4 (en) * 2008-09-09 2012-08-01 Guardian Industries Stable silver colloids and silica-coated silver colloids, and methods of preparing stable silver colloids and silica-coated silver colloids
EP2323757A2 (en) * 2008-09-09 2011-05-25 Guardian Industries Corp. Stable silver colloids and silica-coated silver colloids, and methods of preparing stable silver colloids and silica-coated silver colloids
US20110262657A1 (en) * 2008-10-17 2011-10-27 Pope Dave S Method for Reducing Thin Films on Low Temperature Substrates
DE102009015470A1 (en) 2008-12-12 2010-06-17 Byk-Chemie Gmbh Process for the preparation of metal nanoparticles and metal nanoparticles obtained in this way and their use
KR101278939B1 (en) 2008-12-12 2013-06-28 비와이케이-케미 게엠베하 Method for producing metal nanoparticles and nanoparticles obtained in this way and use thereof
EP2358489A1 (en) * 2008-12-12 2011-08-24 BYK-Chemie GmbH Method for producing metal nanoparticles and nanoparticles obtained in this way and use thereof
WO2010066335A1 (en) 2008-12-12 2010-06-17 Byk-Chemie Gmbh Method for producing metal nanoparticles and nanoparticles obtained in this way and use thereof
US9731263B2 (en) 2009-03-02 2017-08-15 Colorobbia Italia S.P.A. Process for preparing stable suspensions of metal nanoparticles and the stable colloidal suspensions obtained thereby
US9131610B2 (en) 2009-03-27 2015-09-08 Pen Inc. Buffer layer for sintering
US8647979B2 (en) 2009-03-27 2014-02-11 Applied Nanotech Holdings, Inc. Buffer layer to enhance photo and/or laser sintering
US8422197B2 (en) 2009-07-15 2013-04-16 Applied Nanotech Holdings, Inc. Applying optical energy to nanoparticles to produce a specified nanostructure
US9497859B2 (en) * 2009-09-30 2016-11-15 Dai Nippon Printing Co., Ltd. Metal microparticle dispersion, process for production of electrically conductive substrate, and electrically conductive substrate
US20120267151A1 (en) * 2009-09-30 2012-10-25 Mikiko Hojo Metal microparticle dispersion, process for production of electrically conductive substrate, and electrically conductive substrate
US9807848B2 (en) 2009-11-02 2017-10-31 Yissum Research Development Company Of The Hebrew University Of Jerusalem Ltd. Transparent conductive coatings for optoelectronic and electronic devices
US9107275B2 (en) 2009-11-02 2015-08-11 Yissum Research Development Company Of The Hebrew University Of Jerusalem Ltd. Transparent conductive coatings for optoelectronic and electronic devices
WO2011051952A3 (en) * 2009-11-02 2011-06-23 Yissum Research Development Company Of The Hebrew University Of Jerusalem, Ltd. Transparent conductive coatings for optoelectronic and electronic devices
CN102343440A (en) * 2010-07-29 2012-02-08 同济大学 Method for preparing water-soluble nano silver by using actinidia as template
EP2468827A1 (en) 2010-12-21 2012-06-27 Agfa-Gevaert A dispersion comprising metallic, metal oxide or metal precursor nanoparticles
CN103249786A (en) * 2010-12-21 2013-08-14 爱克发-格法特公司 A dispersion comprising metallic, metal oxide or metal precursor nanoparticles
US9275773B2 (en) 2010-12-21 2016-03-01 Agfa-Gevaert N.V. Dispersion comprising metallic, metal oxide or metal precursor nanoparticles
WO2012084813A1 (en) 2010-12-21 2012-06-28 Agfa-Gevaert A dispersion comprising metallic, metal oxide or metal precursor nanoparticles
WO2012104534A1 (en) 2011-02-01 2012-08-09 Universite De Technologie De Troyes Method for manufacturing metal nanoparticles
US9028601B2 (en) 2011-02-03 2015-05-12 Seiko Epson Corporation Ink composition and printed matter
US9240258B2 (en) 2011-12-21 2016-01-19 Agfa-Gevaert Dispersion comprising metallic, metal oxide or metal precursor nanoparticles, a polymeric dispersant and a thermally cleavable agent
WO2013092450A1 (en) 2011-12-21 2013-06-27 Agfa-Gevaert A dispersion comprising metallic, metal oxide or metal precursor nanoparticles, a polymeric dispersant and a thermally cleavable agent
WO2013092576A1 (en) 2011-12-21 2013-06-27 Agfa-Gevaert A dispersion comprising metallic, metal oxide or metal precursor nanoparticles, a polymeric dispersant and a sintering additive
EP2608217A1 (en) 2011-12-21 2013-06-26 Agfa-Gevaert A dispersion comprising metallic, metal oxide or metal precursor nanoparticles, a polymeric dispersant and a sintering additive
EP2608218A1 (en) 2011-12-21 2013-06-26 Agfa-Gevaert A Dispersion comprising metallic, metal oxide or metal precursor nanoparticles, a polymeric dispersant and a thermally cleavable agent
WO2013112440A1 (en) * 2012-01-24 2013-08-01 Eastman Kodak Company Ink having antibacterial and antifungal protection
US9771485B2 (en) 2012-06-05 2017-09-26 Agfa-Gevaert Metallic nanoparticle dispersion
EP2671927A1 (en) 2012-06-05 2013-12-11 Agfa-Gevaert A metallic nanoparticle dispersion
WO2013182588A1 (en) 2012-06-05 2013-12-12 Agfa-Gevaert A metallic nanoparticle dispersion
US11987713B2 (en) 2012-06-22 2024-05-21 C3 Nano, Inc. Metal nanostructured networks and transparent conductive material
US11968787B2 (en) 2012-06-22 2024-04-23 C3 Nano, Inc. Metal nanowire networks and transparent conductive material
US10781324B2 (en) 2012-06-22 2020-09-22 C3Nano Inc. Metal nanostructured networks and transparent conductive material
US9598776B2 (en) 2012-07-09 2017-03-21 Pen Inc. Photosintering of micron-sized copper particles
ES2471667A1 (en) * 2012-12-21 2014-06-26 Universitat De Val�Ncia Method of obtaining metallic nano and micrometric structures from a nanocomposite, metallic structure obtained with the method and use thereof (Machine-translation by Google Translate, not legally binding)
US10895794B2 (en) 2013-09-10 2021-01-19 Nanyang Technological University Electrochromic device having a patterned electrode free of indium tin oxide (ITO)
US11274223B2 (en) 2013-11-22 2022-03-15 C3 Nano, Inc. Transparent conductive coatings based on metal nanowires and polymer binders, solution processing thereof, and patterning approaches
US11343911B1 (en) 2014-04-11 2022-05-24 C3 Nano, Inc. Formable transparent conductive films with metal nanowires
US10870772B2 (en) 2014-07-31 2020-12-22 C3Nano Inc. Transparent conductive films with fused networks
US11512215B2 (en) 2014-07-31 2022-11-29 C3 Nano, Inc. Metal nanowire ink and method for forming conductive film
US11814531B2 (en) 2014-07-31 2023-11-14 C3Nano Inc. Metal nanowire ink for the formation of transparent conductive films with fused networks
CN107573922B (en) * 2017-08-01 2018-11-16 北京梦之墨科技有限公司 A kind of liquid metal quantum material and preparation method thereof
CN107573922A (en) * 2017-08-01 2018-01-12 北京梦之墨科技有限公司 A kind of liquid metal quantum material and preparation method thereof
US11807762B2 (en) 2018-11-22 2023-11-07 Societe Bic Process for preparing aqueous gel inks with variable color, and aqueous gel inks thereof
WO2021038066A1 (en) 2019-08-29 2021-03-04 Societe Bic Process for preparing an aqueous gel ink with fixed color comprising silver or gold nanoparticles
US11802214B2 (en) 2019-08-29 2023-10-31 Societe Bic Process of preparation of an aqueous gel ink with variable color comprising silver nanoparticles
US11820905B2 (en) 2019-08-29 2023-11-21 Societe Bic Process of preparation of an aqueous gel ink with fixed color comprising gold nanoparticles
WO2021246858A1 (en) * 2020-06-03 2021-12-09 Mimos Berhad Method of preparing silver nanoparticles for use as ink

Also Published As

Publication number Publication date
JP2008527169A (en) 2008-07-24
CN101128550B (en) 2013-01-02
CN101128550A (en) 2008-02-20
US8227022B2 (en) 2012-07-24
ATE461981T1 (en) 2010-04-15
KR20080007310A (en) 2008-01-18
KR101298804B1 (en) 2013-08-22
DE602006013100D1 (en) 2010-05-06
US20090214766A1 (en) 2009-08-27
US20120241693A1 (en) 2012-09-27
EP1853673B1 (en) 2010-03-24
EP1853673A1 (en) 2007-11-14

Similar Documents

Publication Publication Date Title
EP1853673B1 (en) Aqueous-based dispersions of metal nanoparticles
US7963646B2 (en) Ink-jet inks containing metal nanoparticles
JP2005507452A5 (en)
EP2114114B1 (en) Bimetallic nanoparticles for conductive ink applications
Kosmala et al. Synthesis of silver nano particles and fabrication of aqueous Ag inks for inkjet printing
US8017044B2 (en) Bimodal metal nanoparticle ink and applications therefor
US7736693B2 (en) Nano-powder-based coating and ink compositions
US7601406B2 (en) Nano-powder-based coating and ink compositions
US7566360B2 (en) Nano-powder-based coating and ink compositions
CN102453374B (en) metal nanoparticle dispersion
CN100577328C (en) Method for producing surface-treated silver-containing powder and silver paste using surface-treated silver-containing powder
KR100768341B1 (en) Metallic ink, and method for forming of electrode using the same and substrate
US20090301344A1 (en) Photochemical synthesis of bimetallic core-shell nanoparticles
CN101116149A (en) Ink jet printable compositions
CN102970829A (en) Substrate and method for manufacturing same
WO2009031849A2 (en) Conductive ink compositions incorporating nano glass frit and nano metal for enhanced adhesion with glass and ceramic substrates used in displays
KR100729719B1 (en) Conductive ink composition for inkjet printing and method for metal pattern utilizing the same
EP3315564A1 (en) Metal nanoparticle ink compositions for printed electronic device applications
Zhao et al. Preparation of silver nanoparticles and application in water-based conductive inks
JP7200055B2 (en) Ink composition of metal nanoparticles
KR100728910B1 (en) Metallic ink, and method for forming of electrode using the same and substrate
EP3426735A1 (en) Method for producing an ink, ink, and use of same
IL184466A (en) Aqueous-based dispersions of metal nanoparticles
US20220388060A1 (en) A method to form copper nanoparticles

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application
DPE1 Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101)
WWE Wipo information: entry into national phase

Ref document number: 184466

Country of ref document: IL

WWE Wipo information: entry into national phase

Ref document number: 2007550014

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 200680002022.5

Country of ref document: CN

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2006700979

Country of ref document: EP

Ref document number: 1020077018301

Country of ref document: KR

WWP Wipo information: published in national office

Ref document number: 2006700979

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 11813628

Country of ref document: US