WO2006045588A1 - Photovoltaische zelle - Google Patents
Photovoltaische zelle Download PDFInfo
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- WO2006045588A1 WO2006045588A1 PCT/EP2005/011433 EP2005011433W WO2006045588A1 WO 2006045588 A1 WO2006045588 A1 WO 2006045588A1 EP 2005011433 W EP2005011433 W EP 2005011433W WO 2006045588 A1 WO2006045588 A1 WO 2006045588A1
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- 239000000463 material Substances 0.000 claims abstract description 43
- 239000004065 semiconductor Substances 0.000 claims abstract description 41
- 150000001875 compounds Chemical class 0.000 claims abstract description 13
- 239000010410 layer Substances 0.000 claims description 53
- 239000011701 zinc Substances 0.000 claims description 32
- 239000011572 manganese Substances 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 25
- 229910052710 silicon Inorganic materials 0.000 claims description 24
- 239000010703 silicon Substances 0.000 claims description 22
- 238000000151 deposition Methods 0.000 claims description 15
- 229910052714 tellurium Inorganic materials 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 12
- 238000004070 electrodeposition Methods 0.000 claims description 10
- 238000005477 sputtering target Methods 0.000 claims description 10
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 230000008021 deposition Effects 0.000 claims description 8
- 238000004544 sputter deposition Methods 0.000 claims description 8
- 229910052725 zinc Inorganic materials 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229910052698 phosphorus Inorganic materials 0.000 claims description 7
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 6
- 150000002500 ions Chemical class 0.000 claims description 6
- 239000010453 quartz Substances 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000011241 protective layer Substances 0.000 claims description 5
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 4
- 239000007864 aqueous solution Substances 0.000 claims description 3
- 239000000470 constituent Substances 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 3
- 229910052748 manganese Inorganic materials 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 claims description 3
- 229910052785 arsenic Inorganic materials 0.000 claims description 2
- 229910052733 gallium Inorganic materials 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- 238000000608 laser ablation Methods 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 20
- 229910007709 ZnTe Inorganic materials 0.000 description 8
- 239000012153 distilled water Substances 0.000 description 6
- 238000005868 electrolysis reaction Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000011574 phosphorus Substances 0.000 description 5
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000002800 charge carrier Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000005137 deposition process Methods 0.000 description 3
- 230000005284 excitation Effects 0.000 description 3
- SKJCKYVIQGBWTN-UHFFFAOYSA-N (4-hydroxyphenyl) methanesulfonate Chemical compound CS(=O)(=O)OC1=CC=C(O)C=C1 SKJCKYVIQGBWTN-UHFFFAOYSA-N 0.000 description 2
- 239000011149 active material Substances 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 239000008151 electrolyte solution Substances 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 description 1
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229910017231 MnTe Inorganic materials 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- JAONJTDQXUSBGG-UHFFFAOYSA-N dialuminum;dizinc;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Al+3].[Al+3].[Zn+2].[Zn+2] JAONJTDQXUSBGG-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- -1 oxygen ion Chemical class 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000001055 reflectance spectroscopy Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 150000004772 tellurides Chemical class 0.000 description 1
- 230000004584 weight gain Effects 0.000 description 1
- 235000019786 weight gain Nutrition 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
- H01L31/0321—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 characterised by the doping material
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/0296—Inorganic materials including, apart from doping material or other impurities, only AIIBVI compounds, e.g. CdS, ZnS, HgCdTe
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- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
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- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
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- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
- H01L31/03925—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate including AIIBVI compound materials, e.g. CdTe, CdS
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- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
- H01L31/03926—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate comprising a flexible substrate
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- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
Definitions
- the invention relates to photovoltaic cells and the photovoltaically active semiconductor material contained therein.
- Photovoltaically active materials are semiconductors that convert light into electrical energy.
- the basics have been known for a long time and are used technically. Almost most of the technically used solar cells are based on crystalline silicon (monocrystalline or polycrystalline). In a boundary layer between p- and n-type silicon, incident photons excite electrons of the semiconductor, so that they are lifted from the valence band into the conduction band.
- the height of the energy gap between the valence band and the conduction band limits the maximum possible efficiency of the solar cell. For silicon, this is about 30% when exposed to sunlight. In practice, on the other hand, an efficiency of about 15% is achieved because some of the charge carriers are re-combined by different processes or deactivated by further mechanisms and thus removed from use.
- silicon With an energy gap around 1, 1 eV, silicon has a fairly good value for use. By reducing the energy gap, more charge carriers are transported into the conduction band, but the cell voltage becomes lower. Correspondingly, higher cell voltages are achieved with larger energy gaps, but since fewer photons are present for excitation, lower usable currents are available.
- tandem cells Many arrangements, such as the series arrangement of semiconductors with different energy gaps, in so-called tandem cells have been proposed in order to achieve higher efficiencies. Due to their complex structure, however, these are hardly economically feasible.
- a new concept is to generate an intermediate level within the energy gap (up-conversion). This concept is described, for example, in the Proceedings of the 14th Workshop on Quantum Solar Energy Conversion Quantasol 2002, March, 17-23, 2002, Rauris, Salzburg, Austria, "Improving Solar Cells Efficiencies by the Up-Conversion", T. Trupke, MA Green, P. Cube or "Increasing the Efficiency of Ideal Solar Cells by Photon Induced Tranisitions at intermediate levels ", A. Luque and A. Marti, Phys. Rev. Letters, Vol. 78, No. 26, June 1997, 5014-5017. For a band gap of 1.995 eV and an energy of the intermediate level at 0.713 eV, a maximum efficiency of 63.17% is calculated.
- the desired intermediate energy level in the bandgap is increased by replacing part of the telluran ions in the anion lattice with the substantially more electronegative oxygen ion.
- Tellurium was replaced by ion implantation in thin films by oxygen.
- a major disadvantage of this class of substances is that the solubility of the oxygen in the semiconductor is extremely low. It follows that, for example, the compounds Zn Vx Mn x Te Vy O y with y greater than 0.001 are not thermodynamically stable. Upon irradiation for a long time, they will lapse into the stable tellurides and oxides. Use of up to 10 at% tellurium by oxygen would be desirable, but such compounds are not stable.
- Zinc telluride which has a direct band gap of 2.32 eV at room temperature, would be an ideal semiconductor for the intermediate level technology because of this large band gap.
- Zinc can be replaced by manganese continuously in zinc telluride, whereby the band gap increases to about 2.8 eV with MnTe ("Optical Properties of epitaxial Zn Mn Te and ZnMgTe films for a wide range of alloy compostions", X. Liu et al., J. Appl. Phys., Vol. 91, No. 5, March 2002, 2859-2865; "Bandgap of Znv x Mn x Te: non linear dependence on compostion and temperature", HC Mertins et al., Semicond. Sci. Technol. 8 (1993) 1634-1638).
- Zn 1 ⁇ Mn x Te can be p-type doped with up to 0.2 mol% phosphorus, with an electrical conductivity between 10 and 30 ⁇ '1 cm ' 1 is achieved ("Electrical and Magnetic Properties of Phosphorus Doped BuIk Znv x Mn x Te ", Le Van Khoi et al., Moudavian Journal of Physical Sciences, No. 1, 2002, 11-14.)
- n-type species are obtained (" aluminum-doped n-type ZnTe layers grown by molecular beam epitaxy ", JH Chang et al., Appl. Phys. Letters, VoI 79, No.
- the object of the present invention is to provide a photovoltaic cell with a high efficiency and a high electric power, which avoids the disadvantages of the prior art. Furthermore, it is the object of the present invention in particular to provide a photovoltaic cell with a thermodynamically stable photovoltaically active semiconductor material, wherein the semiconductor material contains an intermediate level in the energy gap.
- a photovoltaic cell with a photovoltaically active semiconductor material characterized in that the photovoltaically active semiconductor material is a p- or an n-doped semiconductor material with mixed compounds of the formula (I):
- x number from 0.01 to 0.99
- y number from 0.001 to 0.2
- a number from 1 to 2
- b number from 1 to 3.
- the task is surprisingly solved completely different than the literature mentioned could be expected.
- the tellurium is not replaced by a much more electronegative element, but rather silicon is introduced into the semiconductor material with the formula Zn 1-11 Mn x Te. This is surprising insofar as the electronegativity of silicon differs only slightly from that of 2.1 with tellurium 2.1.
- the variable x can assume values of 0.01 to 0.99
- y can assume values of 0.001 to 0.2, preferably of 0.005 to 0.1.
- the variable a can take values from 1 to 2
- b can take values from 1 to 3.
- the photovoltaic cell according to the invention has the advantage that the photovoltaically active semiconductor material used is thermodynamically stable even after introduction of silicon telluride. Furthermore, the photovoltaic cell according to the invention has a high degree of efficiency (up to 60%) since the silicon telluride Si a Te b generates intermediate levels in the energy gap of the photovoltaically active semiconductor material. Without intermediate level, only such photons can be electrons or Lift charge carriers from the valence band into the conduction band, which have at least the energy gap energy. Photons of higher energy also contribute to the efficiency, the excess of energy with respect to the band gap being lost as heat. With an intermediate level present in the semiconductor material used for the present invention, which can be partially occupied, more photons can contribute to the excitation.
- the photovoltaic cell of the present invention is constructed to include a p-doped and an n-doped semiconductor material, these two semiconductor materials adjoining each other to form a p-n junction.
- both the p- and the n-doped semiconductor material largely consists of mixed compounds of the formula (I), wherein the material is further doped with donor ions in the p-doped Halbleiterma ⁇ material and acceptor ions in the n-doped semiconductor material.
- the p-doped semiconductor material contains at least one element from the group As and P with an atomic concentration of up to 0.1 at% and the n-doped semiconductor material at least one element from the group AI, In and Ga with an atomic concentration of up to to 0.5 at%.
- Preferred dopants are aluminum and phosphorus.
- this comprises a substrate, in particular an electrically conductive substrate, a p-layer of the p-doped semiconductor material having a thickness of 0.1 to 10 .mu.m, preferably 0.3 to 3 .mu.m, and an n Layer of the n-doped semiconductor material having a thickness of 0.1 to 10 .mu.m, preferably 0.3 to 3 microns.
- the substrate is a flexible metal foil or a flexible metal sheet.
- inflexible substrates such as glass or silicon
- wind forces have to be absorbed by complex supporting constructions in order to avoid breakage of the solar module.
- twisting is possible by means of flexibility, it is possible to use very simple and inexpensive supporting structures which do not have to be torsionally stiff.
- a stainless steel sheet is particularly used in the present invention.
- the invention further relates to a method for producing a photovoltaic cell according to the invention, comprising coating a substrate with at least one respective layer of the p-doped semiconductor material and a layer of the n-doped semiconductor material, the layers having a thickness of 0 , 1 to 10 microns, preferably from 0.3 to 3 microns.
- the coating of the substrate with the p or n layer preferably comprises at least one deposition method selected from the group sputtering, laser ablation, electrochemical deposition or electroless deposition.
- the already p- or n-doped semiconductor material with mixed compounds of the formula (I) can be applied to the substrate as a layer.
- a layer of the semiconductor material may be first generated without p- or n-doping by the deposition process and this layer then p- or n-doped.
- the introduction of silicon in the form of silicon telluride according to the invention is (if the respective layer produced by one of the abovementioned deposition methods has not yet been formed accordingly) preferably carried out subsequent to the performance of the deposition process (and optionally to the p- or n-doping).
- Sputtering refers to the ejection of atoms from a sputtering target serving as an electrode by accelerated ions and the deposition of the ejected material on a substrate (eg stainless steel).
- a substrate eg stainless steel
- sputtering targets containing zinc, manganese, tellurium and silicon are produced by fusing together the constituents or individual constituents of the semiconductor material are sputtered onto the substrate one after the other and then to a temperature of 400 to 900 0 C heated.
- zinc, manganese, tellurium and silicon in a purity of at least 99.5% are used to produce the sputtering target.
- Zinc, manganese, tellurium and silicon telluride (Si a Te b ) are fused in a dehydrated quartz tube under vacuum at temperatures of 1200 to 1400 0 C, for example.
- doping elements for a p-type or n-type doping are preferably introduced into the sputtering target.
- the doping elements preferably aluminum for n-conduction and phosphorus for p-conduction, are accordingly added to the sputtering target from the outset.
- the compounds AITe or Zn 3 P 2 are so temperature stable that they survive the sputtering process without significant change in stoichiometry.
- a layer with a doping is then sputtered onto the substrate and immediately thereafter a further layer with the opposite doping.
- Another preferred deposition method according to the invention is the electrochemical deposition of Zn 1 Mn x Te on the electrically conductive substrate.
- the electrochemical deposition of ZnTe is described in "Thin Films of ZnTe Electrodeposited on Stainless Steel", AE Rakhsan and Pradup, Appl. Phys. A (2003), Pub., Online, Dec. 19, 2003, Springer-Verlag; "Electrodeposition of ZnTe for photovoltaic alls", B. Bozzini et al., Thin Solid Films, 361-362, (2000) 288-295; "Electrochemical Deposition of ZnTe Thins films ", T.
- the substrate contains an aqueous solution containing Zn 2+, Mn 2+ and TeO 3 2 ions, at temperatures of 30 to 90 0 C is crosslinked with hypophosphorous acid (H 3 PO 2 ) as a reducing agent.
- hypophosphorous acid H 3 PO 2
- the hypophosphorous acid reduces TeO 3 2 " to Te 2" . This also depositions on electrically non-conductive substrates are possible.
- the method according to the invention comprises the following method steps:
- the electrically conductive substrate is coated, for example by sputtering, electrochemical deposition or electroless deposition, with a first layer of Zn 1 Mn x Te.
- the substrate is preferably a metal sheet or a metal foil.
- silicon is introduced into this first layer in step b) to produce mixed compounds of the formula (I).
- the introduction of silicon takes place, for example, by applying Si 2 Te 3 to the first layer by sputtering and then by a thermal post-treatment at 600 to 1200 0 C, preferably 800 to 1000 0 C, a mixed crystallization and thus the desired composition er ⁇ is sufficient.
- a p- or n-doping is then generated by doping with donor atoms or acceptor atoms.
- the first layer is doped either with phosphorus (for example from PCI 3 ) to the p-type conductor or with aluminum (for example from AICI 3 ) to the n-type conductor.
- step d) the second layer of Zn 1 -x Mn x Te is then deposited on the first layer. This can be done, for example, the same deposition method as in step a).
- step e silicon is introduced into the second layer as described with reference to the first layer for step b).
- step f) The doping generated in step f) is opposed to the doping generated in step c), so that one layer has a p-type doping and the other layer has an n-type doping.
- an electrically conductive transparent layer and a protective layer are applied to the second layer.
- the electrically conductive transparent layer may be, for example, a layer of indium tin oxide or aluminum zinc oxide. It also preferably carries printed conductors for the electrical contacting of the photovoltaic cell according to the invention.
- the protective layer can be, for example, a layer of SiO x , which is preferably applied by CVD or PVD.
- a layer of a material may serve as a protective layer which is produced in the prior art for aroma-tight films (eg coffee packaging).
- Si 2 Te 3 were weighed into a quartz tube with an inner diameter of 11 mm and a length of about 15 cm.
- the Si 2 Te 3 wur ⁇ de previously separately prepared by adding silicon and tellurium were taken at 1,000 0 C in an evacua- wholesome quartz tube to react.
- the tube was heated under vacuum to 300 ° C. for 10 minutes to drain and then under a pressure lower than 0.1 mbar melted off.
- the tube was heated in an oven at 300 ° C / h to 1300 0 C, the temperature for 10 h at 1300 0 C left and then allowed to cool the oven.
- the furnace was tilted about a drive 30 times per hour about its longitudinal axis to see through the melt in the quartz tube.
- this material is sputtered onto a substrate.
- electrolyses were carried out in a 500 ml flat-bottomed reaction vessel with double jacket, internal thermometer and bottom outlet valve.
- the cathode used was a stainless steel sheet (100 ⁇ 70 ⁇ 0.5).
- the anode consisted of MKUSF04 (graphite).
- the deposition was carried out at a cathode area of -50 cm 2 ( ⁇ 2 mA / cm z ). After completion of the electrolysis, the cathode was removed, rinsed with distilled water and dried. The weight gain is 26.9 mg. The deposit has a deep dark brown color.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
- Silicon Compounds (AREA)
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NZ553938A NZ553938A (en) | 2004-10-26 | 2005-10-25 | Photovoltaic cell |
CA002582253A CA2582253A1 (en) | 2004-10-26 | 2005-10-25 | Photovoltaic cell |
AU2005298825A AU2005298825A1 (en) | 2004-10-26 | 2005-10-25 | Photovoltaic cell |
US11/577,993 US20090133744A1 (en) | 2004-10-26 | 2005-10-25 | Photovoltaic cell |
JP2007538324A JP2008518448A (ja) | 2004-10-26 | 2005-10-25 | 光起電力セル |
EP05798617A EP1807873A1 (de) | 2004-10-26 | 2005-10-25 | Photovoltaische zelle |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004052014A DE102004052014A1 (de) | 2004-10-26 | 2004-10-26 | Photovoltaische Zelle |
DE102004052014.3 | 2004-10-26 |
Publications (1)
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WO2006045588A1 true WO2006045588A1 (de) | 2006-05-04 |
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PCT/EP2005/011433 WO2006045588A1 (de) | 2004-10-26 | 2005-10-25 | Photovoltaische zelle |
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US (1) | US20090133744A1 (de) |
EP (1) | EP1807873A1 (de) |
JP (1) | JP2008518448A (de) |
KR (1) | KR20070084519A (de) |
CN (1) | CN101048876A (de) |
AU (1) | AU2005298825A1 (de) |
CA (1) | CA2582253A1 (de) |
DE (1) | DE102004052014A1 (de) |
NZ (1) | NZ553938A (de) |
TW (1) | TW200631189A (de) |
WO (1) | WO2006045588A1 (de) |
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WO2011131801A1 (es) * | 2010-04-22 | 2011-10-27 | Bermudez Benito Veronica | Material semiconductor para utilizar como capa activa/absorbedor de dispositivos fotovoltaicos, metodo para formar dicha capa activa, asi como celula fotovoltaica que incorpora dicha capa |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3372997A (en) * | 1966-12-22 | 1968-03-12 | Du Pont | Ternary copper, zinc, cadmium and manganese dichalcogenides having the pyrite-type crystal structure |
EP1291927A2 (de) * | 2001-08-31 | 2003-03-12 | Basf Aktiengesellschaft | Photovoltaisch aktive Materialien und diese enthaltende photovoltaischen Zellen |
EP1388597A1 (de) * | 2001-04-04 | 2004-02-11 | Nikko Materials Company, Limited | VERFAHREN ZUR HERSTELLUNG VON ZnTe-VERBINDUNGSHALBLEITER-EINKRISTALL, ZNTE-VERBINDUNGSHALBLEITER-EINKRISTALL UND HALBLEITERVORRICHTUNG |
-
2004
- 2004-10-26 DE DE102004052014A patent/DE102004052014A1/de not_active Withdrawn
-
2005
- 2005-10-24 TW TW094137209A patent/TW200631189A/zh unknown
- 2005-10-25 JP JP2007538324A patent/JP2008518448A/ja not_active Withdrawn
- 2005-10-25 US US11/577,993 patent/US20090133744A1/en not_active Abandoned
- 2005-10-25 AU AU2005298825A patent/AU2005298825A1/en not_active Abandoned
- 2005-10-25 CN CNA2005800364327A patent/CN101048876A/zh active Pending
- 2005-10-25 EP EP05798617A patent/EP1807873A1/de not_active Withdrawn
- 2005-10-25 NZ NZ553938A patent/NZ553938A/en unknown
- 2005-10-25 KR KR1020077011726A patent/KR20070084519A/ko not_active Application Discontinuation
- 2005-10-25 WO PCT/EP2005/011433 patent/WO2006045588A1/de active Application Filing
- 2005-10-25 CA CA002582253A patent/CA2582253A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3372997A (en) * | 1966-12-22 | 1968-03-12 | Du Pont | Ternary copper, zinc, cadmium and manganese dichalcogenides having the pyrite-type crystal structure |
EP1388597A1 (de) * | 2001-04-04 | 2004-02-11 | Nikko Materials Company, Limited | VERFAHREN ZUR HERSTELLUNG VON ZnTe-VERBINDUNGSHALBLEITER-EINKRISTALL, ZNTE-VERBINDUNGSHALBLEITER-EINKRISTALL UND HALBLEITERVORRICHTUNG |
EP1291927A2 (de) * | 2001-08-31 | 2003-03-12 | Basf Aktiengesellschaft | Photovoltaisch aktive Materialien und diese enthaltende photovoltaischen Zellen |
Non-Patent Citations (2)
Title |
---|
BENALLOUL P ET AL: "THIN FILM ELECTROLUMINESCENCE OF ZN1-XMNXS1-YTEY", JOURNAL OF CRYSTAL GROWTH, ELSEVIER, AMSTERDAM, NL, vol. 101, no. 1 / 4, 1 April 1990 (1990-04-01), pages 976 - 980, XP000174085, ISSN: 0022-0248 * |
YU Y-M ET AL: "Effect of Mn concentration on photoluminescence characteristics of Zn1-xMnxTe epilayers", PREPARATION AND CHARACTERIZATION, ELSEVIER SEQUOIA, NL, vol. 426, no. 1-2, 24 February 2003 (2003-02-24), pages 265 - 270, XP004414925, ISSN: 0040-6090 * |
Also Published As
Publication number | Publication date |
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CN101048876A (zh) | 2007-10-03 |
JP2008518448A (ja) | 2008-05-29 |
CA2582253A1 (en) | 2006-05-04 |
DE102004052014A1 (de) | 2006-05-04 |
TW200631189A (en) | 2006-09-01 |
EP1807873A1 (de) | 2007-07-18 |
KR20070084519A (ko) | 2007-08-24 |
NZ553938A (en) | 2009-08-28 |
AU2005298825A1 (en) | 2006-05-04 |
US20090133744A1 (en) | 2009-05-28 |
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