WO2006045460A1

WO2006045460A1 - Cutting tool, method for producing the same and the use thereof

Info

Publication number: WO2006045460A1
Application number: PCT/EP2005/011087
Authority: WO
Inventors: Peter Gluche; André Flöter
Original assignee: Gfd Gesellschaft Für Diamantprodukte Mbh
Priority date: 2004-10-26
Filing date: 2005-10-14
Publication date: 2006-05-04
Also published as: DE102004052068B4; DE102004052068A1

Abstract

The invention relates to a cutting tool which consists of a material that contains metal and/or a mechanically resistant material. The cutting edge has a radius of curvature < 10 νm and a surface roughness < 5 νm.

Description

Cutting tool, method for its manufacture and its use

The invention relates to a cutting tool made of a metallic and / or hard material containing Materi¬, wherein the cutting edge has a radius of curvature <10 microns and a surface roughness <5 microns auf¬ has.

With cutting tools, in particular with shaving razes, it is crucial that the cutting edge as such not only has an extreme sharpness, but also that its stability during continuous operation is ensured. In this case, the solution proposed is, inter alia, to carry out the cutting edge as such in the form of a profile, eg in wave profile, and / or that the cutting edge is sharpened as such by physical post-processing. Although there are already numerous solutions in the prior art, the creep rupture strength is constant while the sharpness of the cutting edge is constant

at the same sharpness of the cutting edge in continuous operation not satisfactory.

In the cutting tools of the prior art, it has hitherto additionally been extremely difficult to realize internal cutting edges in a cutting tool by means of grinding. Also, a production of such cutting tools with internal cutting edges, as they are increasingly gaining importance today, is only possible with difficulty or with great technical complexity.

Proceeding from this, it is the object of the present invention to provide a cutting tool whose cutting edge is subject to no impairment in continuous operation in its sharpness and thus has a long service life. Another object is that also cutting tools with internal cutting edge can be produced. An additional object is to specify a production method for a derer¬ tiges cutting tool, which is procedurally simple and inexpensive.

The object is achieved with respect to the cutting tool by the features of patent claim 1 and with respect to the method of manufacture by the features of claim 22. The dependent claims show advantageous developments.

The cutting tool according to the invention is thus distinguished by the fact that it has a radius of curvature r _c of <10 μm, whereby at the same time a surface roughness R _w <5 μm is present. It is particularly noteworthy in the stringing tool according to the invention that it is also possible to realize a cutting tool whose rounding radius <2 μm, preferably <1 μm, particularly preferably <O _/ 5 μm. It has been shown that even rounding radii can be realized which lie in the nanometer range, ie from 100 nm to 20 nm.

The surface roughness R _m is also controllable by the production method described in more detail below in such a way that a surface roughness kieit

<5 μm, preferably <1 μm, more preferably even

<0.5 microns, is feasible.

In combination with a specific choice of materials made of hard materials or metals, it is thus possible to produce a cutting tool which has an extremely small radius of curvature with simultaneously low surface roughness. When used as MateriaL selected hard materials, also an excellent creep resistance is achieved.

It is preferred in the case of the cutting tool according to the invention if this is made up of at least two layers, wherein the first layer represents a layer of a metallic material and the second layer, which also incorporates the cutting edge, is formed of hard material.

Examples of metallic materials are aluminum, copper, titanium, nickel and chromium and iron-containing materials such as steel. Also suitable is Mo, MoC, Niobr WC, tantalum and tungsten. In the case of the hard materials, examples are ceramics, for example. carbon-containing and nitrogen-containing ceramics, in particular silicon carbide, silicon nitride or boron nitride, tantalum, tantalum carbide, tungsten, tungsten carbide, molybdenum, molybdenum carbide, vanadium, diamond, titanium nitride, TiAlN, TiCN, CBN, TiB ₂ , aluminum oxides and aluminum-based ceramics. Furthermore, diamond-like carbon layers are particularly suitable. In the diamond-like carbon layers are hydrogen-free amorphous carbon layers (aC), tetrahedral hydrogen-free amorphous carbon layers (ta-C), metal-containing hydrogen-free amorphous carbon layers (aC: Me), hydrogen-containing amorphous carbon layers (aC: H), tetrahedral hydrogen-containing amorphous carbon layers (ta-C: H) and metal-containing, hydrogen-containing amorphous carbon layers (aC: H: Me) and modified hydrogen-containing amorphous carbon layers (aC: H: X) , Of course, other known from the prior art hard materials can be used.

With regard to the structuring of the cutting edge and the cutting geometry, the cutting tool according to the invention is not subject to any restrictions due to the production method, as will be explained below.

Thus, the cutting tool according to the invention can be formed such that it has at least one outer cutting edge. Such cutting tools are then used, for example, for cutting substrates, such as carpets, plastic substrates or plastic composites. A cutting tool according to the invention with an outer cutting edge can also be designed so that it has two tapered cutting edges, which are formed in the form of a spear tip. The structured profile with decreasing layer thickness can also be adapted to the application. A further preferred embodiment of the Schneid¬ tool according to the invention provides that this has at least one inner cutting edge. The inner cutting edge can in this case have a continuous contour of any desired shape. Of course, the invention also encompasses all other Ausfüϊirungsformen of cutting tools with an inner cutting edge, for example, a El lipose or a curved contour. The cutting tool can also be designed so that 2 to 50 of these inner cutting edges are arranged in the cutting tool. The distances bz-w. The arrangement of these cutting edges in the cutting tool can be set arbitrarily ein¬ depending on the application.

A further embodiment of the invention then provides that the inner cutting edge represents a scurf system, which consists of two mutually facing cutting edges, which are spaced apart. According to the invention, this cutting tool can be designed such that a metir value of such cutting systems, preferably 2 to 50, are provided in the cutting tool. The arrangement of the two cutting edges with one another in such a cutting tool can be parallel or else in a shape deviating from the parallel one, and the spacing can vary in the range from 0.03 mm to 20 mm Cutting tools then have a cutting edge length that is preferably in the range of 0.03 mm to 100 μm.

The specific roughnesses already described in more detail above are earmarked in the cutting tool according to the invention in that a specific ^ dry chemical etching is used as described below.

The invention further relates to a method for producing a cutting tool as described above. In the manufacturing process, the procedure is such that, in a first step, a layer of material containing metal and / or hard material is made available. In this layer of predetermined thickness, e.g. may be from 0.05 mm to 10 now, then a Vertie¬ tion is incorporated. The recess can be made according to the invention by hot or Kaltverfσrmung, such as. by embossing, are produced. As a result of this first method step, a pre-contour is thus already introduced into the metal- and hard-material-containing layer. As a result of the etching which follows: Step by step, with which a uniform removal takes place, a corresponding contour is automatically formed with a cutting edge in the cutting tool.

Depending on the embodiment of the present invention, i. Whether a single-layered material or a two-layered material of hard material and metalli¬ cal material is used, a single or e is applied in Zweistufenätzprozess.

The introduction of the depression into the layer can, for example, also take place according to the invention in such a way that the depression is impressed into the metallic layer, for example, by means of a pressure tool. For the embodiment in which internal cutting edges or several cutting systems are realized, embossing by means of a roller can also be effected on a fed layer. In this way, a very cost-effective low-cost production possible.

For the case that a two-layered construction is provided, after introduction of the depressions into the metallic layer, a hard material layer, which is also present e.g. diamond-containing carbon layer or: may be a diamond layer aufge¬ introduced. After that, then by the. zwe¬ stage etching step introduced the structured profile with decreasing layer thickness.

The invention will be explained in more detail with reference to Figures 1 to 6.

Figure 1 shows schematically the structure of a cutting tool according to the invention from two layers.

FIG. 2 shows the arrangement of a cutting system consisting of two cutting edges facing each other.

FIG. 3 schematically shows the introduction of depressions by means of a pressure roller, ie a metallic carrier layer.

FIG. 4 shows the schematic sequence of the etching process and the formation of the structured profile.

Figure 5 gives an overview of various

Possibilities of arrangement of the cutting systems.

FIG. 6 shows schematically the construction of two plants for dry-chemical etching. Figure 1 show ^~ t the schematic structure of a domestic erff to the invention the cutting tool 1 from a metal Ii's carrier layer 4 and a hard material layer 5 which forms the cutting edge. 3 For better clarity, it is shown in FIG. 1b what, according to the invention, is understood to mean a rounding radius (r _c ). The surface roughness of the struc tured profile 2 can in the example of the Julus leadership form of Figure 1 for the hard material layer

(R _M s2) and for the metal-containing Trägerschic ht

(RMSI) be the same or different. However, it is preferred if the surface roughness R _M si corresponds approximately to that of R _MS2 .

Figure 2a zei ςjt again schematically the structure e ines cutting system according to the invention comprises two mutually facing cutting edges _3/3 '. In Figure 2b, a possible arrangement is shown how such zueinamder the spaced cutting edges 3, 3 'Eug can be arranged in Schneidwerkz. In the case of the embodiment according to FIG. 2, in this case the cutting tool again consists of a two-layer structure, namely a metallic support layer 4 and a hard material cladding 5. The arrangement shown in FIG. 2b has proven to be particularly preferred. In FIG. 2 b, symbolically a hair is represented by 10, which is separated particularly clearly by the obliquely arranged cutting edges 3, 3 '. The arrow schematically shows the direction in which the cutting tool is moved.

FIG. 3 shows a possible embodiment in which the recesses can be introduced into the layer. In the example of Figure 3 is in a rne- Ta3lisch containing carrier layer 4 by means of pressure rollers 11, which have a predetermined structured Pro¬ fiIL impressed a corresponding shape. The further process sequence for producing a corresponding cutting tool can then be taken from FIG. 4.

FIG. 4 a shows the state in which the hard material layer 5, here diamond in the example, has been applied to the rear side of the structured profile. Of course, it is also possible to apply a layer of hard material 5 on both sides of the carrier layer 4. FIG. 4b now shows the state which is produced by the etching. The etching attack results in a uniform material removal, so that, as shown in the image sequence 4b) -d), a structured profile is formed. In the example, all according to FIG. 4, a metallic substrate was etched with a titanium-etching plasma. Subsequently, a simultaneous etching with a titanium and a diamond-etching plasma is then carried out (FIG. 4 c) until the structured profile 2 with the cutting edge 3 is created.

FIGS. 5a to e now show some examples of how the cutting systems 6 can be arranged in a carrier material 4. Of course, the invention also includes all of these deviating embodiments.

Ficj. Figure 6 now shows various equipment that can be used for the etching step.

Fiςj. 6A shows a RIE (Reactive Ion. Etching) system with purely capacitive operation. This system has a chamber 20 in which a layer 26 (eg layer 4,5 as in FIG. 4) is arranged on a base 21b. The layer 26 opposite to an electrode 21 a is arranged. The electrode 21a and the base 21b are connected via lines 22a and 22b to a voltage source 23, which generates a power between 1 W and 30O0W. As a result, a plasma 25 is generated from a gas mixture (Ar, O _z , CF ₄ ) between the substrate 26 and the electrode 21 a, which etches the substrate over a large area. This results in a bias bias with negative potential. The self-bias voltage can be superimposed with an additional, forced voltage. This is done by inserting a DC generator between electrode and ground. By means of the etching parameters, the etching attack (rate and isotropy) can be specifically set for the metallic carrier material as well as for the hard material splitter 5.

FIG. 6B shows another system according to the ICP method (Inctuctive Coupled Plasma). Here as well as zuvox g-leiche or similar components are provided with the same or similar reference numerals as in the other figures. Instead of the electrode 21a, an electrode 21a with a coil is now arranged within the chamber 20, via which the power is inductively coupled into the plasma 25. The chamber 20 and the base 21b are also connected to one another via a tension source 23.

For etching, the hard material splitter, e.g. DLC odeαr Di¬ amant, the self-bias voltage is advantageously 20 to 1000 V, preferably 250 to 800 V, preferably between 350 and 700 V.

Essential parameters in the etching process are gas composition, the chamber pressure and the partial pressure conditions.

In particular, the chamber pressure is essential for the high anisotropy of the etching attack. The aim is a low chamber pressure at the same time sufficient amount of reactive species. Values <150 mTorr, preferably <75 mTorr, preferably <35 itiTTorr, were determined as suitable pressure values for the hard material layer for the RIE system. For the ICP system, the chamber pressure is preferably 0, 1 to 20 mTorr.

The mentioned ranges of the chamber pressure lead to an anisotropic etching, whereby at high pressure there are too many atoms in the chamber which distract the argon ions during the bombardment. If the chamber pressure is too high, therefore, an isotropic etching is effected.

In the novel Verfahiren also a blending of noble gases can selbstverständ¬ Lich done so-that a physical Komporxente is inserted, whereas _CF4 and oxygen reactive Komponen¬ te represent.

In particular for the hard material layer, the etching rate and thus also the anisotropy of the etching can be influenced via the partial pressure ratios. Preferably, the gas flow of the individual gases is in the following ratio: Ar: 8; 0 ₂ : 17; CF ₄ : 14; N ₂ : 10. From the systems shown in FIG. 6, etch rates of between 100 nm / hour and 10 μm / hour result in the above-mentioned parameter range. In the metal layer (4b in FIG. 4) it is also possible to dispense with the reactive component of the hardcoat layer (O2) in the future. The rates are then up to 100 μm / h. Instead of argon and oxygen or N ₂ and CF ₄ as plasma gases, other systems can also be used. In particular, instead of argon, all the eclipse gases of the second main group of the periodic table of the elements come into question. Instead of CF ₄ , all gases come into question, the layer 4 with the metal-containing carrier form a volatile compound. Instead of oxygen as the reactive gas, all gases which can make a fluid connection with the hard-material layer are possible, in particular

1. chlorine-containing gases, for example Cl ₂ , CCl ₂ , BCl ₃ , PCl ₃ and also other chlorine-containing gases and / or mixtures thereof;

2. fluorine-containing gases, for example F, F _2r CF ₄ , CF _n , C ₂ F ₆ , SF ₄ , SF ₆ , SF ₄ and other fluorine-containing gases and their compounds and / or mixtures;

3. Oxygen-containing gases O2, CC> CO2 and other oxygen-containing gases and / or their mixtures;

4. Gases which contain fluorine and / or chloride and / or oxygen, for example CClF ₂ , CClF ₅ , CClF ₃ and / or mixtures thereof.

Claims

claims

1. cutting tool (1) made of a material containing metal and / or hard material with a structured profile (2) with decreasing Schichtdi¬ bridge, wherein the cutting edge (3) of the Schneidwerk¬ zeugs a rounding radius r _c <10 microns auf¬ has and the surface roughness R _{1n of} the structured profile with decreasing Schicht¬ thickness <5 microns.

2. Cutting tool according to claim 1, characterized gekenn¬ characterized in that the rounding radius: r _c <2 microns.

3. Cutting tool according to claim 2, daduxch gekenn¬ characterized in that the radius of curvature JΓ _C <0.5 is.

4. Cutting tool according to claim 3, characterized gekenn¬ characterized in that the rounding radius r _c <100 nm.

5. Cutting tool according to claim 4, characterized dadunrch gekenn¬ characterized in that the rounding radius ar _c <20 nm.

6. Cutting tool according to at least one of An¬ claims 1 to 5, characterized in that the surface roughness R ₁ , <1 micron.

7. Cutting tool according to claim 6, characterized gekenn¬ characterized in that the surface roughness R _m <0.5 microns.

8. Cutting tool according to at least one of An¬ claims 1 to 7, characterized in that the metallic material is selected from aluminum, copper, titanium, N-Lekel, chromium, niobium, tungsten, tungsten carbide, tantalum, tantalum carbide, molybdenum, Molybdenum carbide and / or ferrous materials such as steel.

9. Cutting tool according to at least one of An¬ claims 1 to 7, characterized in that the hard materials are selected from carbon and / or nitrogen-containing ceramics, such as Sili¬ ziumkarbid, silicon nitride and boron nitride, tal tal, tantalum carbide, tungsten, tungsten carbide, Molybdenum, molybdenum carbide, vanadium, platinum, diamond, diamond-like carbon layers, titanium nitrides, TiAlN, TiCN and / or TiB ₂ .

10. Cutting tool according to at least one of An¬ claims 1 to 9, characterized in that it is composed of at least two Schizϊiten (4, 5), and the first layer: a metal (5) Ent¬ holding carrier layer (4) and the second layer is a hard material-containing layer, wherein the hard material layer forms the cutting edge (3).

11. Cutting tool according to Anspxuch 10, characterized ge indicates that between the metal enthal¬ border layer (4) and the cutting edge (3) forming Hartstoffschichi: (5) intermediate layers for adhesion improvement and / or nucleation support are arranged.

12. Cutting tool according to at least one of An¬ claims 1 to 11, characterized in that it has at least one outer cutting edge (3).

13. Cutting tool according to at least one of An¬ claims 1 to 12, characterized in that it has at least one inner cutting edge.

14. Cutting tool according to claim 13, characterized ge indicates that the inner Schneidkan¬ te is formed in a closed contour.

15. Cutting tool according to claim 14, characterized ge indicates that 2 to 5O cutting edges are present vor¬.

16. Cutting tool according to claim 13, characterized ge indicates that two inner Schneid¬ edges a cutting system (6) of two mutually facing cutting edges (3, 3 '), which are spaced form.

17. Cutting tool according to claim 16, characterized ge indicates that it durcln 2 to 50 Schneidsys¬ systems (6), which are spaced apart, is formed.

18. Cutting tool according to claim 16 or 17, da¬ characterized in that the distance of the zu¬ each other facing cutting edges (3, 3 ') is 0.03 to 20 mm.

19. Cutting edge according to claim 18, characterized gekenn¬ characterized in that the length of the cutting edges (3, 3 ') 0.03 mm to 100 mm beträmägt.

20. Cutting tool according to at least one of An¬ claims 16 to 19, characterized in that the mutually facing cutting edges (3, 3 ') are arranged in parallel.

21. Cutting tool according to at least one of An¬ claims 16 to 20, characterized in that the mutually facing cutting edges (3, 3 ') of the parallel arrangement deviating, ausge¬ are.

22. Cutting tool according to at least one of An¬ claims 1 to 21, characterized in that the profile of decreasing layer thickness (2) has been prepared by dry chemical etching.

23. A method for producing a cutting tool according to at least one of claims 1 to 22, characterized in that at least one recess is incorporated into a flat layer, which consists of a metallic and / or hard material, and that closing the cutting edge is formed from the at least one recess by a dry chemical etching step.

24. The method according to claim 23, characterized gekennzeich¬ net, that the incorporation is carried out by cold deformation or hot deformation.

25. The method according to claim 23, characterized gekennzeich¬ net, that a metal ent¬ holding layer is used as a sheet-like layer and in the Me¬ tal-containing layer, the at least one recess is introduced and that subsequently ßend on the opposite side of the recess planar layer applied a layer of hard material wi_rd.

26. The method according to any one of claims 23 to 25, characterized in that the introduction of the recesses takes place by means of a pressure roller.

27. The method according to claim 25 or 26, characterized ge indicates that the formation of the struktu¬ profiled profile is carried out by a two-stage Ätz¬ step.

28. Method according to claim 22, characterized in that the first etching step serves to etch the layer containing metal and that the second etching step is used to struc- ture the hard material layer.

29. The method according to claim 28, characterized gekennzeich¬ net, that the first Ätzschrritt with a Titan¬ etching plasma and the second etching step by simultaneous etching of titanium and a diamond-like carbon-etching plasma takes place.

30. The method according to at least one of claims 24 to 29, characterized gekennzeich.net that the Ober¬ surface roughness is determined by selecting the Ätzparameter such as pressure, temperature, gas composition and / or bias voltage and power.

31. Use of the cutting tool according to at least one of claims 1 to 22 as a razor blade.

32. Use of the cutting tool according to at least one of claims 1 to 22 in a rotating or oscillating device.

33. Use of the cutting tool according to at least one of claims 1 to 22 as a cutting blade, in particular for substrates, such as carpets, Kunst¬ substrates or Verto materials.

34. Use of the cutting tool according to at least one of claims 1 to 22 as a surgical cutting tool, in particular as a scalpel.