WO2006038771A1 - An improved integrated silicone contactor - Google Patents

An improved integrated silicone contactor Download PDF

Info

Publication number
WO2006038771A1
WO2006038771A1 PCT/KR2005/002800 KR2005002800W WO2006038771A1 WO 2006038771 A1 WO2006038771 A1 WO 2006038771A1 KR 2005002800 W KR2005002800 W KR 2005002800W WO 2006038771 A1 WO2006038771 A1 WO 2006038771A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
silicone
end portion
contactor
improved integrated
Prior art date
Application number
PCT/KR2005/002800
Other languages
French (fr)
Inventor
Dong-Ho Ha
Original Assignee
Isc Technology Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Isc Technology Co., Ltd. filed Critical Isc Technology Co., Ltd.
Publication of WO2006038771A1 publication Critical patent/WO2006038771A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Definitions

  • the present invention relates to a socket contactor for semiconductor testing equipment (test jig, etc.), and more particularly, to an improvement of the prior art (which is disclosed in Korean Patent Application No. 10-2001-75606 entitled “Integrated silicone contactor (ISC), and apparatus and method for manufacturing the integrated silicone contactor”) as previously filed by the same applicant as the present invention.
  • ISC Integrated silicone contactor
  • FIG.1 is a sectional view showing an integrated silicone contactor 10 employed in the prior art.
  • the integrated silicone contactor 10 includes a plurality of conductive silicone parts 12 which are in close contact with a plurality of ball leads 22 of a ball grid array (BGA) type semiconductor device 20, and a plurality of insulation silicone parts 14 positioned between the conductive silicone parts 12 in such a fashion that each insulation silicone part is interposed between two adjacent insulation silicone parts, so as to serve as an insulation layer.
  • the silicone contactor 10 is mounted on a socket board 24 acting as a printed circuit board (PCB) that conducts testing for the semiconductor device 20.
  • PCB printed circuit board
  • the plurality of conductive silicone parts 12 are contacted correspondingly with a plurality of contact pads 26 disposed on the socket board 24 such that the ball leads 22 of the semiconductor device 20 are electrically connected to the contact pads 26 on the socket board 24.
  • Each of the conductive silicone parts 12 is made by mixing conductive powder with silicone and hardening the mixed material, such that it can act as a conductor along which electric current flows. Further, the silicone has elasticity, and thus, even though the conductive silicone parts 12 are not in a horizontal relation with the socket board 24 or the semiconductor device 20, they can be in good electric contact with the contact pads 26.
  • the insulation silicone pails 14 are arranged in such a fashion as to be filled between the two adjacent conductive silicone parts 12, for allowing the whole silicone contactor 10 to be stably disposed between the semiconductor device 20 and the socket board 24 and allowing the conductive silicone parts 12 to be erected vertically into their original shapes when the ball leads 22 of the semiconductor device 20 are pressed against the top surface of the integrated silicone contactor 10.
  • the conductive silicone parts 12 are limited in the diameter size thereof (that is, the diameter thereof cannot be increased beyond a given size) since the semiconductor device of the BGA package has a restriction in the diameter of terminals thereof. Therefore, an increase in current capacity is restricted, thereby making it impossible to extend the length of each conductive silicone part 12.
  • the quantity of conductive powder contained in each conductive silicone part 12 has to be increased. In this case, however, there occur still several problems in that an increase in the quantity of conductive powder is still limited and the production costs are raised. Disclosure of Invention
  • the present invention has been made to address and overcome the above-mentioned problems occurring in the conventional prior arts, and it is an object of the present invention to provide an improved integrated silicone contactor that includes a conductive lead inserted into the inside of each of a plurality of conductive silicone parts of the integrated silicone contactor as disclosed in the prior art previously filed by the same applicant as this invention, thereby increasing current capacity, improving conductivity, and extending the length of each conductive silicone part.
  • Another object of the present invention is to provide an improved integrated silicone contactor that includes a conductive lead inserted into the inside of each of a plurality of conductive silicone parts of existing integrated silicone contactors, thereby improving conductivity and increasing current capacity.
  • an improved integrated silicone contactor comprising a plurality of conductive silicone parts provided with a first end portion adapted to be in close contact with a terminal of a semiconductor device and with a second end portion adapted to be in close contact with a test pad of testing equipment of the semiconductor device, each of the conductive silicone parts serving as a passageway for allowing the terminal and the test pad to be electrically conducted with each other, the improvement wherein each of the plurality of conductive silicone parts is provided with a conductive lead inserted into the inside thereof in such a fashion as to extend from a position adjacent to the first end portion to a position adjacent to the second end portion.
  • the conductive lead may be in close contact with the first end portion of the conductive silicone part at one end thereof and with the second end portion of the conductive silicone part at the other end thereof.
  • the conductive lead may have a round or polygonal shape in section.
  • the improved integrated silicone contactor of the present invention is made under relatively simple process and structure, thereby improving conductivity of existing integrated silicone contactors and increasing current capacity. Additionally, the integrated silicone contactor of the present invention is provided with the conductive lead inserted into the inside of the conductive silicone part, such that even though the density of powder within the conductive silicone part is relatively low, electric resistance can be maintained over a predetermined level.
  • FIG. 1 is a cross-sectional view showing an integrated silicone contactor employed in the prior art as previously filed by the same applicant as the present invention
  • FIG. 2 is a cross-sectional view showing an improved integrated silicone contactor according to the present invention.
  • FIGs. 3 a to 3 c are perspective views showing the conductive leads having different sections. Best Mode for Invention
  • FIG. 2 shows various types of conductive silicone parts 12 that can be embodied according to the present invention.
  • each of the plurality of conductive silicone parts 12 has a conductive lead 100a, 100b, and 100c inserted into the inside thereof in such a fashion as to extend from an top portion (hereinafter, referred to as 'first end portion') of the conductive silicone part 12 to a bottom portion (hereinafter, referred to as 'second end portion') thereof.
  • the conductive leads 100a, 100b and 100c are not necessarily in close contact with the first and second end portions of the corresponding conductive silicone parts 12, but may be disposed adjacent to the first and second end portions thereof, so that the present invention can be realized sufficiently.
  • the conductive leads 100a, 100b and 100c are modified freely in their shapes, without any restriction.
  • they may be formed in other various shapes such as linear, curved, bent, spiral, etc.
  • the shapes of the conductive leads may be modified by an intention of a designer of this invention, and since a given shape is not necessarily taken in the manufacturing process, low allowance during the processing does not matter.
  • the conductive lead 100 can have various sectional shapes, as shown in FIGs. 3a to 3c. As shown in FIG. 3a to 3c, the conductive lead 100 is formed in a rectangular, square or round shape.
  • the thickness and material of the conductive lead 100 are determined randomly.
  • a copper wire having a thickness between 0.02 mm and 0.5 mm is used as the conductive lead 100, but the thickness and material of the conductive lead, may be properly determined depending on use purposes in consideration of various design parameters during the designing.
  • a process of inserting the conductive lead 100 into the inside of the conductive silicone part 12 may be conducted during the molding of the conductive silicone part 12.
  • the manufacturing process of the conductive silicone part 12 is described in detail in the prior art as filed by the same applicant as this invention, and referring to the manufacturing process, conductive powder as a magnetic material is mixed with melted silicone and is then a resultant mixture is put into a mold.
  • the conductive powder particles are aligned in a line, thus to form the conductive silicone part 12.
  • the conductive lead 100 is inserted into the inside of the conductive silicone part 12, and then, the conductive silicone part 12 is hardened, thereby completing the conductive silicone part 12 employed in to the present invention.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Leads Or Probes (AREA)
  • Connecting Device With Holders (AREA)

Abstract

Disclosed herein is an improved integrated silicone contactor that includes a conductive lead inserted into the inside of each of a plurality of conductive silicone parts of an existing integrated silicone contactor, thereby increasing current capacity and improving conductivity. The inventive improved integrated silicone contactor has a plurality of conductive silicone parts (12) provided with a first end portion adapted to be in close contact with a terminal (22) of a semiconductor device (20) and with a second end portion adapted to be in close contact with a contact pad (16) of a test board. Each of the plurality of conductive silicone parts (12) is provided with a conductive lead inserted into the inside thereof in such a fashion as to extend from a position adjacent to the first end portion to a position adjacent to the second end portion.

Description

AN IMPROVED INTEGRATED SILICONE CONTACTOR
Technical Field
The present invention relates to a socket contactor for semiconductor testing equipment (test jig, etc.), and more particularly, to an improvement of the prior art (which is disclosed in Korean Patent Application No. 10-2001-75606 entitled "Integrated silicone contactor (ISC), and apparatus and method for manufacturing the integrated silicone contactor") as previously filed by the same applicant as the present invention.
Background Art
FIG.1 is a sectional view showing an integrated silicone contactor 10 employed in the prior art. As shown in FIG. 1, the integrated silicone contactor 10 includes a plurality of conductive silicone parts 12 which are in close contact with a plurality of ball leads 22 of a ball grid array (BGA) type semiconductor device 20, and a plurality of insulation silicone parts 14 positioned between the conductive silicone parts 12 in such a fashion that each insulation silicone part is interposed between two adjacent insulation silicone parts, so as to serve as an insulation layer. The silicone contactor 10 is mounted on a socket board 24 acting as a printed circuit board (PCB) that conducts testing for the semiconductor device 20. The plurality of conductive silicone parts 12 are contacted correspondingly with a plurality of contact pads 26 disposed on the socket board 24 such that the ball leads 22 of the semiconductor device 20 are electrically connected to the contact pads 26 on the socket board 24. Each of the conductive silicone parts 12 is made by mixing conductive powder with silicone and hardening the mixed material, such that it can act as a conductor along which electric current flows. Further, the silicone has elasticity, and thus, even though the conductive silicone parts 12 are not in a horizontal relation with the socket board 24 or the semiconductor device 20, they can be in good electric contact with the contact pads 26. The insulation silicone pails 14 are arranged in such a fashion as to be filled between the two adjacent conductive silicone parts 12, for allowing the whole silicone contactor 10 to be stably disposed between the semiconductor device 20 and the socket board 24 and allowing the conductive silicone parts 12 to be erected vertically into their original shapes when the ball leads 22 of the semiconductor device 20 are pressed against the top surface of the integrated silicone contactor 10.
In the silicone contactor 10 under such the construction as mentioned above, however, the conductive silicone parts 12 are limited in the diameter size thereof (that is, the diameter thereof cannot be increased beyond a given size) since the semiconductor device of the BGA package has a restriction in the diameter of terminals thereof. Therefore, an increase in current capacity is restricted, thereby making it impossible to extend the length of each conductive silicone part 12. In order to increase the current capacity at a state where the same physical dimension is still maintained without any increase, the quantity of conductive powder contained in each conductive silicone part 12 has to be increased. In this case, however, there occur still several problems in that an increase in the quantity of conductive powder is still limited and the production costs are raised. Disclosure of Invention
Technical Problem
Therefore, the present invention has been made to address and overcome the above-mentioned problems occurring in the conventional prior arts, and it is an object of the present invention to provide an improved integrated silicone contactor that includes a conductive lead inserted into the inside of each of a plurality of conductive silicone parts of the integrated silicone contactor as disclosed in the prior art previously filed by the same applicant as this invention, thereby increasing current capacity, improving conductivity, and extending the length of each conductive silicone part. Another object of the present invention is to provide an improved integrated silicone contactor that includes a conductive lead inserted into the inside of each of a plurality of conductive silicone parts of existing integrated silicone contactors, thereby improving conductivity and increasing current capacity.
Technical Solution
To achieve the above objects, according to the present invention, there is provided an improved integrated silicone contactor comprising a plurality of conductive silicone parts provided with a first end portion adapted to be in close contact with a terminal of a semiconductor device and with a second end portion adapted to be in close contact with a test pad of testing equipment of the semiconductor device, each of the conductive silicone parts serving as a passageway for allowing the terminal and the test pad to be electrically conducted with each other, the improvement wherein each of the plurality of conductive silicone parts is provided with a conductive lead inserted into the inside thereof in such a fashion as to extend from a position adjacent to the first end portion to a position adjacent to the second end portion.
Preferably, the conductive lead may be in close contact with the first end portion of the conductive silicone part at one end thereof and with the second end portion of the conductive silicone part at the other end thereof. Preferably, the conductive lead may have a round or polygonal shape in section.
Advantageous Effects
The improved integrated silicone contactor of the present invention is made under relatively simple process and structure, thereby improving conductivity of existing integrated silicone contactors and increasing current capacity. Additionally, the integrated silicone contactor of the present invention is provided with the conductive lead inserted into the inside of the conductive silicone part, such that even though the density of powder within the conductive silicone part is relatively low, electric resistance can be maintained over a predetermined level.
Description of Drawings
FIG. 1 is a cross-sectional view showing an integrated silicone contactor employed in the prior art as previously filed by the same applicant as the present invention; FIG. 2 is a cross-sectional view showing an improved integrated silicone contactor according to the present invention; and
FIGs. 3 a to 3 c are perspective views showing the conductive leads having different sections. Best Mode for Invention
Now, an explanation on a preferred embodiment of the present invention will be in detail given with reference to attached drawings.
FIG. 2 shows various types of conductive silicone parts 12 that can be embodied according to the present invention. As shown in FIG. 2, each of the plurality of conductive silicone parts 12 has a conductive lead 100a, 100b, and 100c inserted into the inside thereof in such a fashion as to extend from an top portion (hereinafter, referred to as 'first end portion') of the conductive silicone part 12 to a bottom portion (hereinafter, referred to as 'second end portion') thereof. In the preferred embodiment of the present invention, as shown in FIG.2, the conductive leads 100a, 100b and 100c are not necessarily in close contact with the first and second end portions of the corresponding conductive silicone parts 12, but may be disposed adjacent to the first and second end portions thereof, so that the present invention can be realized sufficiently. In addition, the conductive leads 100a, 100b and 100c are modified freely in their shapes, without any restriction. For example, as shown in FIG.2, they may be formed in other various shapes such as linear, curved, bent, spiral, etc. Of course, the shapes of the conductive leads may be modified by an intention of a designer of this invention, and since a given shape is not necessarily taken in the manufacturing process, low allowance during the processing does not matter.
Furthermore, the conductive lead 100 can have various sectional shapes, as shown in FIGs. 3a to 3c. As shown in FIG. 3a to 3c, the conductive lead 100 is formed in a rectangular, square or round shape.
The thickness and material of the conductive lead 100 are determined randomly. In this embodiment, for example, a copper wire having a thickness between 0.02 mm and 0.5 mm is used as the conductive lead 100, but the thickness and material of the conductive lead, may be properly determined depending on use purposes in consideration of various design parameters during the designing. A process of inserting the conductive lead 100 into the inside of the conductive silicone part 12 may be conducted during the molding of the conductive silicone part 12. The manufacturing process of the conductive silicone part 12 is described in detail in the prior art as filed by the same applicant as this invention, and referring to the manufacturing process, conductive powder as a magnetic material is mixed with melted silicone and is then a resultant mixture is put into a mold. Thereafter, when a magnet is placed at both sides of the mold, the conductive powder particles are aligned in a line, thus to form the conductive silicone part 12. After the process, the conductive lead 100 is inserted into the inside of the conductive silicone part 12, and then, the conductive silicone part 12 is hardened, thereby completing the conductive silicone part 12 employed in to the present invention.
While the present invention has been described with reference to the particular illustrative embodiments, it is not to be restricted by the embodiments but only by the appended claims. It is to be appreciated that those skilled in the ait can change or modify the embodiments without departing from the scope and spirit of the present invention.

Claims

Claims
1. An improved integrated silicone contactor comprising a plurality of conductive silicone parts provided with a first end portion adapted to be in close contact with a terminal of a semiconductor device and with a second end portion adapted to be in close contact with a test pad of testing equipment of the semiconductor device, each of the conductive silicone parts serving as a passageway for allowing the terminal and the test pad to be electrically conducted with each other, the improvement wherein each of the plurality of conductive silicone parts is provided with a conductive lead inserted into the inside thereof in such a fashion as to extend from a position adjacent to the first end portion to a position adjacent to the second end portion.
2. The improved integrated silicone contactor according to claim 1, wherein the conductive lead is in close contact with the first end portion of the conductive silicone part at one end thereof and with the second end portion of the conductive silicone part at the other end thereof.
3. The improved integrated silicone contactor according to claim I5 wherein the conductive lead has a round shape in section.
4. The improved integrated silicone contactor according to claim 1, wherein the conductive lead has a polygonal shape in section.
PCT/KR2005/002800 2004-08-27 2005-08-25 An improved integrated silicone contactor WO2006038771A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20-2004-0024555 2004-08-27
KR20-2004-0024555U KR200368242Y1 (en) 2004-08-27 2004-08-27 An improved integrated silicon contactor

Publications (1)

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WO2006038771A1 true WO2006038771A1 (en) 2006-04-13

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WO (1) WO2006038771A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101588844B1 (en) * 2014-12-30 2016-01-26 주식회사 아이에스시 Test connector with coil type Carbon Nano Tube
KR101726399B1 (en) 2016-03-17 2017-04-13 주식회사 오킨스전자 Test socket having bottom metal plate bump and method for manufacturing thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000322938A (en) * 1999-05-13 2000-11-24 Jsr Corp Anisotropic conductive sheet, its manufacture, and electrical test device and electrical test method for circuit device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000322938A (en) * 1999-05-13 2000-11-24 Jsr Corp Anisotropic conductive sheet, its manufacture, and electrical test device and electrical test method for circuit device

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