JP2003178848A - Socket for semiconductor package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a socket for a semiconductor package wherein losing a reliability of inspection is prevented and further an assembling workability can be made superior. <P>SOLUTION: This is the socket 1 for the semiconductor package provided with a substrate 2 wherein an electroconductive layer 7 is installed and an electric conductor 3 consisting of plural coiled springs 9 arranged on a surface of this substrate 2. A stationary plate 4 and a movable plate 5 having through holes 14, 16 are arranged and installed on the face of the substrate 2, and these are installed via a driving member 15 to drive them in the mutually separating direction. The electric conductor 3 is constituted so that this other end side is contacted with the electroconductive layer 7 and one end side is contacted with a terminal 13 of a semiconductor package 12 through the respective through holes 14, 16 of the stationary plate 4 and the movable plate 5. When its one end side is contacted with the terminal 13 and contracted, an electroconductive member 11 to electrically connect its one end side and the other end side is installed at the electric conductor 3. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package socket used for, for example, a BGA (ball grid array) type or LGA (land grid array) type semiconductor package. The present invention relates to a semiconductor package socket used for inspecting electrical characteristics of a package.

[0002]

2. Description of the Related Art In recent years, electronic devices have become smaller and lighter, and accordingly, semiconductor packages of small size and high mounting efficiency have been demanded. BGA (ball grid array) type, LGA (land grid array) type, and the like have been attracting attention as semiconductor packages that meet such demands, and QFP (Quad Flat P) that has been generally used until now.
It has been used as an alternative to the ackage type. Compared with QFP, BGA and LGA have advantages that a lead frame is not used, there is no fear of lead bending and handling is easy, and that the mounting area can be reduced with an equivalent number of terminals, so that mounting efficiency is good.

As a classification of methods for inspecting the continuity of the semiconductor package, there are burn-in type and test type. In such an inspection, a semiconductor package socket is usually used as an interposer between a terminal of an inspection device and a terminal of a semiconductor package to electrically connect them.

A semiconductor package socket includes a substrate and a large number of conductors provided on one surface of the substrate. The conductors are brought into contact with the terminals of the semiconductor package to electrically connect them. In general, the wiring and the terminal for connecting to the conductor are formed in or on the outside of the substrate so that the wiring can be connected to the terminal of the inspection device. By the way, in the semiconductor package socket having the above-mentioned structure, it is indispensable to elastically contact the terminals of the semiconductor package so as not to damage the terminals. Therefore, conventionally, for example, a coil spring is used as a conductor.

[0005]

However, the semiconductor package socket has the following disadvantages.
With the miniaturization of semiconductor packages, the distance between the terminals tends to become shorter, and therefore the coil springs serving as conductors are correspondingly becoming smaller. However, as miniaturization progresses in this way, the wire diameter of the spring also becomes thinner, so if electricity is passed along the wire of this spring, the electrical resistance will increase, and the reliability of the inspection may be impaired. is there.

Further, the conductor composed of the coil spring is configured to contact the terminals of the semiconductor package.
In that case, the ends of the coil spring may come into contact with the terminals of the semiconductor package, which may damage them. Then, powder generated from a material such as solder that forms the terminals is generated by this, and the powder is dropped onto the substrate to cause a short circuit between the conductive parts of the substrate,
As a result, the reliability of the inspection may be impaired.

Further, as the coil spring is miniaturized, it becomes more difficult to assemble it into a semiconductor package socket, and therefore it is desired to provide a structure capable of improving the assemble workability. The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a semiconductor package socket that can prevent the reliability of inspection from being impaired and can also improve assembly workability. Especially.

[0008]

In a semiconductor package socket of the present invention, a substrate provided with a plurality of conductive layers on one surface, and a substrate disposed on one surface of the substrate,
And a conductor composed of a plurality of coil springs provided so that the direction of expansion and contraction thereof is substantially perpendicular to the surface on the one side, and one end side of the conductor is configured to contact a terminal of the semiconductor package. In a semiconductor package socket, a fixed plate having a plurality of through holes corresponding to the conductors and a movable plate are arranged in this order on one surface of the substrate, and the fixed plate and The conductor is provided via an urging member that urges the movable plate in a direction away from each other, and the conductor has its other end contacted with the conductive layer and one end penetrating the fixed plate and the movable plate. The conductor is configured to come into contact with the terminal of the semiconductor package through the hole, and the one end of the conductor contacts the terminal of the semiconductor package and contracts when the conductor contracts. That the conductive member for electrically connecting the end side and the other end is provided with a solution of the above problems.

According to this semiconductor package socket, when one end side of the conductor is electrically connected to the terminals of the semiconductor package and the whole contracts, the one end side and the other end side are electrically connected. Since the conductive member is provided, conduction between the terminals of the semiconductor package and the conductive portion of the substrate is achieved not only by the wire of the coil spring that constitutes the conductor but also by the conductive member, so that its electrical resistance is reduced. Getting smaller,
Therefore, by improving the conductivity, the reliability of the inspection is improved.

Further, in another semiconductor package socket of the present invention, a substrate having a plurality of conductive layers on one surface thereof and a direction of expansion and contraction of the substrate disposed on one surface of the substrate. Includes a conductor composed of a plurality of coil springs provided so as to be substantially perpendicular to the surface on the one side,
A semiconductor package socket configured such that one end side of the conductor contacts a terminal of the semiconductor package,
A fixed plate and a movable plate having a plurality of through holes corresponding to the conductors are arranged in this order on one surface of the substrate, and the fixed plate and the movable plate are separated from each other. Is provided via an urging member for urging the conductor, the other end of the conductor is brought into contact with the conductive layer, and one end of the conductor is the fixing plate,
One end of the conductor, which is in contact with the terminal of the semiconductor package, and the other end of which is in contact with the conductive layer, are spherical contacts, which are configured to contact the terminals of the semiconductor package through the respective through holes of the movable plate. Being a child was taken as a means for solving the above problems.

According to this semiconductor package socket, one end of the conductor contacting with the terminal of the semiconductor package and the other end contacting with the conductive layer are spherical contacts. Even if the child comes into contact with the terminals of the semiconductor package or the conductive layer of the board, they are not damaged, and therefore the inconvenience of causing a short circuit between the conductive parts of the board due to the powder of the material for forming the terminals is prevented. Improves reliability.

According to another aspect of the semiconductor package socket of the present invention, a conductive body electrically connects one end side and the other end side of the conductor when the one end side comes into contact with the terminals of the semiconductor package and contracts. Of a conductive material is provided,
One of the means for solving the above-mentioned problems is that one end of the semiconductor package that contacts the terminal and the other end that contacts the conductive layer are spherical contacts.

According to this semiconductor package socket, when one end side of the conductor is electrically connected to the terminal of the semiconductor package and the whole is contracted, the one end side and the other end side are electrically connected. Since the conductive member is provided, the electrical resistance thereof is reduced as described above, and the conductivity thereof is improved, so that the reliability of the inspection is improved. In addition, since one end of the conductor that comes into contact with the terminal of the semiconductor package and the other end that comes into contact with the conductive layer are spherical contacts, as described above, the powder made of the material for forming the terminal is used. As a result, the inconvenience of causing a short circuit between the conductive parts of the substrate is prevented, and the reliability of the inspection is improved.

In the semiconductor package socket, the through hole of the fixing plate has a small diameter small diameter portion on the lower side and a large diameter large diameter portion on the upper side.
A stepped portion is formed between the small diameter portion and the large diameter portion, and the conductor is a small diameter portion whose lower side is inserted into the small diameter portion of the through hole of the fixing plate, and an upper portion of the small diameter portion. It is preferable that the intermediate portion is a large diameter portion having a diameter larger than the small diameter portion of the through hole of the fixing plate. If you do this,
By inserting the small diameter portion of the conductor into the through hole of the fixed plate, and inserting the small diameter portion of the conductor into the small diameter portion of the through hole,
The middle portion of the conductor is caught by the stepped portion of the through hole and stands up in the through hole, so that the assembling workability is improved.

Further, in the semiconductor package socket, the through hole of the movable plate is arranged at the small diameter portion and the lower side of the small diameter portion, and gradually goes from the small diameter portion to the lower surface of the movable plate. The conductor is formed with a taper portion that expands in diameter, and the conductor has a small diameter portion whose upper side is inserted into a small diameter portion of the through hole of the movable plate, and an intermediate portion below the small diameter portion is the small diameter portion. It is preferable that the diameter of the through hole of the movable plate is larger than that of the small diameter portion.
With this arrangement, the conductors are inserted into the through holes of the fixed plate to stand them up, and then the movable plate is placed on the fixed plate so that the small diameter portion above the conductor is tapered by the movable plate. Since it is guided by the portion and is inserted into the small diameter portion, the assembling workability is improved.

Further, in the semiconductor package socket, at least one of both ends of the conductor is preferably formed by a contact pin provided with a conductive member. With this configuration, it becomes easy to incorporate the conductive member into the conductor made of the coil spring, and the assembling workability is improved.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION The semiconductor package socket of the present invention will be described in detail below with reference to its embodiments.
FIG. 1 is a diagram showing an embodiment of a semiconductor package socket according to the present invention, in which reference numeral 1 is a semiconductor package socket. This semiconductor package socket 1 includes a substrate 2, a plurality of conductors 3 provided on one surface of the substrate 2, a fixed plate 4 and a movable plate 5 for holding the conductor 3 on the substrate 2 side. The base 6 for holding the fixed plate 4 and the movable plate 5 on the substrate 2 is configured.

The substrate 2 has a rectangular or square shape, and a large number of pads (conductive layers) 7 formed by plating (eg, gold plating) or the like are vertically and horizontally formed in the center of one surface of the substrate 2, as shown in FIG. Are formed in line with each other. In addition,
A conductive portion (not shown) made of solder or the like is formed on these pads 7 as needed. Also, in the substrate 2, a wiring pattern (not shown) made of copper foil or the like is provided inside the substrate 2.
Are formed so as to be connected to the pads 7, respectively, and further, as shown in FIG. 1, pins 8 connecting to these wiring patterns are provided so as to extend to the other surface side of the substrate 2. . The pin 8 is directly or indirectly connected to a terminal of the inspection device via another socket called a parent socket.

As shown in FIGS. 2 and 3, the conductor 3 is formed by a coil spring 9 and a substantially columnar contact pin 10 provided on the upper end of the coil spring 9.
As shown in FIG. 3, the coil spring 9 has a small diameter portion 9 on its lower side.
a, and the intermediate portion above the small diameter portion 9a is the small diameter 9a.
The larger diameter portion 9b has a larger diameter. In addition,
In this example, the small diameter portion 9a is simply wound in a coil shape and does not expand or contract, and therefore the expansion and contraction of the coil spring 9 is basically performed by the large diameter portion 9b which is an intermediate portion. It has become so.

The contact pin 10 is provided with a conductive member 11 made of a metal rod-shaped rigid body on the bottom surface side, and is configured so that its upper end portion contacts the terminal 13 of the semiconductor package 12. is there. Further, the contact pin 10 has a small diameter portion whose upper side is formed to have a smaller diameter than the large diameter portion 9b of the coil spring 9.
A taper portion 10a is formed on the bottom thereof, the diameter of which gradually increases as it goes further downward from the lower portion of the contact pin 10, and on the top surface thereof, as will be described later, a concave portion for receiving a terminal 13 formed of a solder ball. A terminal receiving portion 10b including (not shown) is formed. The conductive member 11
Has its lower end portion 11a extended to the vicinity of the central portion of the large diameter portion 9b of the coil spring 9, and when the coil spring 9 is contracted as will be described later, the tip of this lower end portion 11a is inside the small diameter portion 9a of the coil spring 9. The contact pin 10 comes into direct contact with the small diameter portion 9a. The lower end 11a of the conductive member 11 is formed to be sharp, which makes it easy to enter the small diameter portion 9a.

The fixing plate 4 is placed on the central portion of the substrate 2 as shown in FIG. 2, or is fixed and held on the central portion of the substrate 2 by a holding means such as an adhesive or a screw.
It is an insulating material having a plurality of through holes 14 corresponding to the conductors 3. The through hole 14 is provided corresponding to the position of the terminal 13 of the semiconductor package 12 as shown in FIG. 3, and the lower side opening to the bottom surface side has a small diameter portion 14 having a small diameter.
a and a large diameter portion 14b having a large diameter on the upper side opening to the upper surface side
Further, a step portion 14c is formed between the small diameter portion 14a and the large diameter portion 14b. Small diameter part 14a
Is formed to have a larger diameter and a smaller diameter than the large diameter portion 9b so that the small diameter portion 9a of the coil spring 9 of the conductor 3 can be inserted therethrough. Also, the large diameter portion 14b is
The coil spring 9 is formed to have a larger diameter than the large diameter portion 9b of the coil spring 9 so that the coil spring 9 can be inserted therethrough. With such a configuration, when the small diameter portion 9a of the conductor 3 is inserted into the through hole 14, the small diameter portion 9a is inserted into the small diameter portion 14a of the through hole 14, and the large diameter portion 9b is stepped. The portion 14c is caught and stands up in the through hole 14.

The movable plate 5 is of an insulating type whose planar shape is the same as that of the fixed plate 4, and is arranged directly above the fixed plate 4. As shown in FIG. 2, the movable plate 5 is provided on the fixed plate 4 via a biasing member 15 formed of a coil spring so as to be in a normally floating state. That is, the urging member 15 is configured to urge the fixed plate 4 and the movable plate 5 in the direction in which they are separated from each other, whereby the movable plate 5 does not accommodate the semiconductor package 12 and therefore the load of a predetermined value or more. In the normal state in which no strain is applied, the fixed plate 4 is separated from the fixed plate and floats. The biasing member 15 is attached between the recesses formed at the four corners of the fixed plate 4 and the movable plate 5, respectively.

Further, in the movable plate 5 as well as the fixed plate 4, a plurality of through holes 1 corresponding to the conductors 3 are formed.
6 is formed. The through hole 16 has an upper taper portion 16 that opens to the upper surface side of the movable plate 5 as shown in FIG.
a, a lower taper portion 16b opening to the lower surface, and a small diameter portion 16c located between the upper taper portion 16a and the lower taper portion 16b. Small diameter part 16c
Is formed to have a diameter that allows the upper side of the contact pin 9 to be inserted therethrough, and the lower taper portion 16b is formed such that the diameter gradually increases from the small diameter portion 16c to the lower surface of the movable plate 5. It was done. According to this structure, the conductor 3 passes through the small diameter portion 14a of the through hole 14 on the upper side of the contact pin 10, but the tapered portion 1
0a cannot pass through the small diameter portion 14a and is pressed against the lower taper 16b.

The upper taper portion 16a has a small diameter portion 16a.
It is formed so that the diameter gradually increases from c to the upper surface of the movable plate 5, and in particular, it serves as a guide portion for making it easier to receive the terminal 13 of the BGA type semiconductor package 12, that is, the terminal 13 made of a solder ball. Has become. It should be noted that the conductor 3 is normally configured such that the upper end of the contact pin 10 does not protrude above the upper surface of the movable plate 5 but only inside the upper taper portion 16a. The fixed plate 4 and the movable plate 5 also function as a spacer that prevents the adjacent conductors 3 from contacting each other.

As shown in FIG. 1, the base 6 is a square or rectangular plate made of an insulating resin, and in this example, the semiconductor package 12 having a square shape in plan view is accommodated on the upper surface of the central portion thereof. The opening 17 for storing the fixed plate 4 and the movable plate 5 is formed on the lower surface side of the central portion. The opening 17 has almost the same shape as the outer shape of the semiconductor package 12, and has a size with a sufficient clearance as compared with the outer shape of the semiconductor package 12. As a result, the opening 17 allows the semiconductor package 12 to be opened. Can be positioned. A notch (not shown) continuous with the opening 17 is formed around the opening 17, and the semiconductor package 12 accommodated in the opening 17 by inserting a finger into the notch. Can be easily removed.

The opening 18 is formed to be larger than the opening 17, and is formed to have an inner size that substantially matches the outer diameters of the fixed plate 17 and the movable plate 18. The base 6 has the four corners on which the substrate 2 is attached.
The fixed plate 4 and the movable plate 5 housed in the opening 18 are fixed to the substrate 2 by means of screws.
It is supposed to be kept on top.

When inspecting the semiconductor package 12 with the semiconductor package socket 1 having such a structure, the pins 8 of the semiconductor package socket 1 are connected to an inspection device or the like in advance, and in that state. Base 6
The semiconductor package 12 is accommodated in the opening 17 of the. At this time, since the upper end of the contact pin 10 of the conductor 3 is buried in the through hole 16 of the movable plate 5 before the semiconductor package 12 is placed on the movable plate 5 on the substrate 2, Package 12 is conductor 3
Therefore, the semiconductor package 12 does not catch the conductor 3.

Then, the semiconductor package 12 is placed on the movable plate 5, and, for example, the semiconductor package socket 1
When the semiconductor package 12 is pressed by closing a lid (not shown) provided at the terminal, the terminals 13 of the semiconductor package 12 enter the upper taper portion 16a of the movable plate 5 and project into the upper taper portion 16a. It contacts the terminal receiving portion 10b of the pin 10. In addition, when the semiconductor package 12 is pressed, the movable plate 5
Approaches the fixed plate 4 side against the urging force of the urging member 15, whereby the tapered portion 10a of the contact pin 10 of the conductor 3 is pressed by the lower tapered portion 16b of the through hole 16 of the movable plate 5. The coil spring 9 contracts. Then, due to the contraction of the coil spring 9, the tip end side (lower end side) of the conductive member 11 provided on the contact pin 10 reaches the inside of the small diameter portion 9a of the coil spring 9, whereby the contact pin 10 directly contacts the small diameter portion 9a. Get in touch.

By thus contacting the terminals 13 of the semiconductor package 12 with the conductor 3, the terminals 13 of the semiconductor package 12 and the inspection equipment are electrically connected through the semiconductor package socket 1. This allows inspection of the semiconductor package 12 and the like. Further, when the semiconductor package 12 is removed from the movable plate 5 after the inspection or the like is completed, the movable plate 5 causes the biasing member 1 to move.
It is separated from the fixed plate 4 again by the urging force of 5, so that the coil spring 9 of the conductor 3 extends and returns to the original state.

Such a semiconductor package socket 1
In this case, since the conductive member 11 is provided on the contact pin 10 of the conductor 3, when the semiconductor package 12 is placed on the movable plate 5 and the movable plate 5 descends and the coil spring 9 contracts, the conductive property is reduced. The conductive member 11 is brought into direct contact with the small-diameter portion 9a of the coil spring 9, so that the conduction between the terminal 13 of the semiconductor package 12 and the pad 7 of the substrate 2 is
Not only the wire of the coil spring 9 constituting the conductor 3 but also the conductive member 11 is used. Therefore, the electrical resistance between the terminal 13 and the pad 7 is reduced and the conductivity is improved. , Which improves the reliability of the inspection.

Since the step portion 14c is formed in the through hole 14 of the fixed plate 4, the coil spring 9 of the conductor 3 is inserted into the through hole 14 of the fixed plate 4 at the time of assembly, and the small diameter portion 9a thereof is inserted into the through hole 14. By being inserted into the small diameter portion 14a, the large diameter portion 9b of the coil spring 9 is caught by the step portion 14c of the through hole 14 and stands up in the through hole 14. Therefore, at the time of assembly, by applying, for example, vibration while the coil spring 9 of the conductor 3 is inserted into the through hole 14 of the fixing plate 4, the conductor 3 is automatically set to the upright state, whereby the assembling workability is extremely excellent. become.

Further, since the lower tapered portion 16b is formed in the through hole 16 of the movable plate 5, the conductor 3 is inserted into the through hole 14 of the fixed plate 4 so as to stand up during assembly, as described above. After that, by covering the fixed plate 4 with the movable plate 5, the upper side of the contact pin 10 can be guided by the lower tapered portion 16b and inserted into the small diameter portion 16c, so that the assembling workability is further improved. Can be

Further, since one end side of the conductor 3 is formed by the contact pin 10 provided with the conductive member 11, the conductive member 11 of the contact pin 10 is assembled at the time of assembly.
Is inserted into the large diameter portion 9b of the coil spring 9,
The conductive member 11 is incorporated in the coil spring 9 so that the conductor 3
Can be assembled, and therefore the assembling workability can be improved.

It should be noted that the present invention is not limited to the above-mentioned embodiment, and various modifications can be made without departing from the gist of the present invention. For example, in FIG. A leaf spring may be used, and an elastic body such as rubber may be used.

Further, particularly for the conductor 3, the contact pin 20 is provided on the upper end side of the coil spring 19 as shown in FIG.
And attach the contact pin 21
May be attached. The coil spring 19 in this conductor is the large diameter portion 9 of the coil spring 9 shown in FIG.
It has the same outer diameter as b, and is inserted into the large diameter portion 14b of the through hole 14 of the fixed plate 4. The contact pin 20 is the contact pin 10 shown in FIG.
Compared to the above, the conductive member 22 has a shorter length than the conductive member 11. Further, the contact pin 21 has the same configuration as the contact pin 20 except that the lower end contacting the pad 7 has a hemispherical shape, and has the same conductive member 23 as the conductive member 22. Has become.

Even with such a conductor, when the semiconductor package 12 is placed on the movable plate 5 and the movable plate 5 descends and the coil spring 19 contracts, the conductive member 22 and the conductive member 23 are separated from each other. Come into direct contact.
Therefore, the electrical resistance between the terminal 13 of the semiconductor package 12 and the pad 7 is reduced, the conductivity thereof is improved, and the reliability of the inspection is improved. In this example, as shown in FIG. 4, the stepped portion 14c of the through hole 14 of the fixed plate 4 has a tapered shape in which the diameter gradually increases from the small diameter portion 14a side to the large diameter portion 14b side. Has become. Based on such a configuration, this step portion 14c
Engages with and supports a tapered portion (not shown) of the contact pin 21.

FIG. 5 is a view showing another example of the conductor, in which the conductor is mainly composed of only the coil spring 24 without using contact pins. That is, the conductor has a small-diameter portion 24a serving as a lower end and an upper end,
It is formed by a coil spring 24 composed of a large diameter portion 24c which is an intermediate portion thereof, and hemispherical contacts 25 and 26 are formed at the lower and upper ends thereof. These contacts 25 and 26 are formed by applying a solder material or melting and solidifying a spring material. Also, from the small diameter portion 24b to the large diameter portion 2
4c is provided with a linear or rod-shaped conductive member 27 therein, and when the coil spring 24 contracts,
The lower end side of the conductive member 27 enters into and contacts the small diameter portion 24a. The conductive member 27 is fixed by being held by the contactor 26 or being sandwiched by the small diameter portion 24b.

In such a conductor, since the hemispherical contactors 25 and 26 are provided at positions where they come into contact with the pads 7 or the terminals 13 of the semiconductor package 12, in particular,
Even if these contacts 25 and 26 come into contact with the pads 7 and the terminals 13, they are not damaged. Therefore, the metal powder made of the material forming the pads 7 and the terminals 13 causes a short circuit between the pads 7 and 7. Inconveniences can be prevented, and the reliability of inspection can be improved. Further, by having the conductive member 27 as in the previous example, the electrical resistance between the terminal 13 of the semiconductor package 12 and the pad 7 is reduced to improve its conductivity, and The reliability can be improved.

Regarding this conductor, the conductive member 27 is provided from the small diameter portion 24b on the upper side to the large diameter portion 24c, but it may be provided from the small diameter portion 24a on the lower side to the large diameter portion 24c. Therefore, such an electric conductor can be arbitrarily arranged in the through hole without paying attention to the upper and lower sides at the time of assembling, whereby the assembling property can be further improved. Further, this conductor may have a configuration in which the contacts 25 and 26 are simply provided without providing a conductive member as shown in FIG. Also,
In the conductors shown in FIGS. 3 to 5, linear or rod-shaped members were used as the conductive member. However, for example, a large number of metal fibers are twisted or bundled to form a rod-shaped member. The molded body may be housed in the coil spring.

In addition, the contact 26 that contacts the terminal 13 in particular
7A and 7B instead of the end of the coil spring 24.
It may be configured as shown in. That is, the coil spring 2
The upper end 24d of No. 4 is formed such that the coil diameter thereof is smaller than that of the neighboring portion 24e, and thus the upper end 24d is formed so as to enter the inside of the neighboring portion 24a. If formed in this way, especially the semiconductor package 12 is BG
In the case of A type, not only the upper end 24d but also the vicinity 24
Since e also comes into contact with the terminal 13, the contact effect with respect to the terminal 13 is enhanced, the conductivity here is enhanced, and the reliability of the inspection is improved. In the above example, the case where the semiconductor package 12 is the BGA type has been described, but it goes without saying that the semiconductor package socket 1 of the present invention is also applicable to the case of the LGA (land grid array) type. is there.

[0041]

As described above, in the semiconductor package socket of the present invention, when the conductor is electrically connected to the terminals of the semiconductor package at its one end side and the whole contracts,
Since the conductive member electrically connecting the one end side and the other end side is provided, the conduction between the terminal of the semiconductor package and the conductive portion of the substrate is only the wire of the coil spring forming the conductor. Instead, it is also performed by a conductive member. Therefore, the electrical resistance becomes small and the conductivity becomes good, so that the reliability of the inspection can be improved.

Further, in another semiconductor package socket of the present invention, one end of the conductor, which comes into contact with the terminals of the semiconductor package, and the other end which comes into contact with the conductive layer are spherical contacts. Therefore, even if the contacts come into contact with the terminals of the semiconductor package or the conductive layer of the substrate, they are not damaged, and therefore the powder of the material for forming the terminals causes a short circuit between the conductive portions of the substrate. It can prevent and improve the reliability of the inspection.

[Brief description of drawings]

FIG. 1 is a side sectional view showing a schematic configuration of an embodiment of a semiconductor package socket of the present invention.

FIG. 2 is a side sectional view of a main part of the semiconductor package socket shown in FIG.

FIG. 3 is a side sectional view of an essential part for explaining a schematic configuration of a conductor in the semiconductor package socket shown in FIG.

FIG. 4 is a side sectional view of an essential part for explaining a modified example of a conductor in the semiconductor package socket shown in FIG.

5 is a side sectional view of an essential part for explaining a modified example of a conductor in the semiconductor package socket shown in FIG.

FIG. 6 is a side sectional view of an essential part for explaining a modified example of a conductor in the semiconductor package socket shown in FIG.

7 is a view for explaining a modified example of the conductor in the semiconductor package socket shown in FIG.
(A) is a plan view and (b) is a side view of a main part.

[Explanation of symbols]

1 ... Socket for semiconductor package, 2 ... Board, 3 ... Conductor, 4 ... Fixed plate, 5 ... Movable plate, 7 ... Pad (conductive layer), 9 ... Coil spring, 10 ... Contact pin,
11 ... Conductive member, 12 ... Semiconductor package, 13 ... Terminal, 14 ... Through hole, 15 ... Energizing member, 16 ... Through hole, 1
9 ... Coil spring, 20, 21 ... Contact pin, 22,
23 ... Conductive member, 24 ... Coil spring, 25, 26 ... Contact, 27 ... Conductive member

Claims (6)

[Claims] 1. A substrate having a plurality of conductive layers provided on one surface thereof, and a substrate arranged on one surface of the substrate and extending and contracting in a direction substantially perpendicular to the one surface. A semiconductor package socket comprising: a conductor composed of a plurality of coil springs provided in such a manner that one end side of the conductor contacts a terminal of the semiconductor package; A fixed plate and a movable plate having a plurality of through holes corresponding to the conductors are arranged on the surface in this order, and the fixed plate and the movable plate are biased in a direction in which they are separated from each other. The other end side of the conductor is brought into contact with the conductive layer, and one end side of the conductor contacts the terminals of the semiconductor package through the through holes of the fixed plate and the movable plate. The conductor is provided with a conductive member that electrically connects the one end side and the other end side when the one end side comes into contact with the terminals of the semiconductor package and contracts. Characteristic semiconductor package socket. 2. A substrate having a plurality of conductive layers provided on one surface thereof, and a substrate arranged on one surface of the substrate and extending and contracting in a direction substantially perpendicular to the one surface. A semiconductor package socket comprising: a conductor composed of a plurality of coil springs provided in such a manner that one end side of the conductor contacts a terminal of the semiconductor package; A fixed plate and a movable plate having a plurality of through holes corresponding to the conductors are arranged on the surface in this order, and the fixed plate and the movable plate are biased in a direction in which they are separated from each other. The other end side of the conductor is brought into contact with the conductive layer, and one end side of the conductor contacts the terminals of the semiconductor package through the through holes of the fixed plate and the movable plate. Is configured to, said conductor, one end in contact with the terminals of the semiconductor package, and the other end in contact with the conductive layer, a semiconductor package socket, characterized in that has a spherical contact. 3. A substrate having a plurality of conductive layers provided on one surface thereof, and a substrate arranged on one surface of the substrate and extending and contracting in a direction substantially perpendicular to the one surface. A semiconductor package socket comprising: a conductor composed of a plurality of coil springs provided in such a manner that one end side of the conductor contacts a terminal of the semiconductor package; A fixed plate and a movable plate having a plurality of through holes corresponding to the conductors are arranged on the surface in this order, and the fixed plate and the movable plate are biased in a direction in which they are separated from each other. The other end side of the conductor is brought into contact with the conductive layer, and one end side of the conductor contacts the terminals of the semiconductor package through the through holes of the fixed plate and the movable plate. The conductor is provided with a conductive member that electrically connects the one end side and the other end side when the one end side contracts by contacting the terminal of the semiconductor package. 1. A semiconductor package socket, wherein one end of the semiconductor package that comes into contact with the terminal and the other end that comes into contact with the conductive layer are spherical contacts. 4. The through hole of the fixing plate has a small diameter small diameter portion on the lower side and a large diameter large diameter portion on the upper side, and a step portion between the small diameter portion and the large diameter portion. The conductor is a small diameter portion whose lower side is inserted into the small diameter portion of the through hole of the fixed plate, and the intermediate portion above the small diameter portion is larger than the small diameter portion of the through hole of the fixed plate. The semiconductor package socket according to claim 1, wherein the socket has a large diameter. 5. The through hole of the movable plate has a small diameter portion and a taper portion which is arranged below the small diameter portion and which gradually increases in diameter from the small diameter portion to the lower surface of the movable plate. The conductor has a small diameter portion whose upper side is inserted into a small diameter portion of the through hole of the movable plate, and an intermediate portion below the small diameter portion has a small diameter portion of the through hole of the movable plate. The semiconductor package socket according to any one of claims 1 to 4, wherein the socket has a larger diameter portion. 6. The semiconductor package socket according to claim 1, wherein at least one of both ends of the conductor is formed by a contact pin including a conductive member.