WO2006037499A3 - Kontaktierung thermoelektrisch aktiver antimonide - Google Patents

Kontaktierung thermoelektrisch aktiver antimonide Download PDF

Info

Publication number
WO2006037499A3
WO2006037499A3 PCT/EP2005/010365 EP2005010365W WO2006037499A3 WO 2006037499 A3 WO2006037499 A3 WO 2006037499A3 EP 2005010365 W EP2005010365 W EP 2005010365W WO 2006037499 A3 WO2006037499 A3 WO 2006037499A3
Authority
WO
WIPO (PCT)
Prior art keywords
antimonides
contacting
thermoelectric active
relates
contacting thermoelectric
Prior art date
Application number
PCT/EP2005/010365
Other languages
English (en)
French (fr)
Other versions
WO2006037499A2 (de
Inventor
Hans-Josef Sterzel
Original Assignee
Basf Ag
Hans-Josef Sterzel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Ag, Hans-Josef Sterzel filed Critical Basf Ag
Publication of WO2006037499A2 publication Critical patent/WO2006037499A2/de
Publication of WO2006037499A3 publication Critical patent/WO2006037499A3/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Powder Metallurgy (AREA)

Abstract

Die Erfindung betrifft die temperaturstabile Kontaktierung von Halbleitermaterialen auf der Basis von Antimoniden mit silberhaltigen Loten ohne weitere Barriereschicht zum Einsatz in thermoelektrischen Generatoren und Peltier-Anordnungen sowie Verfahren zur Herstellung solcher thermoelektrischer Module.
PCT/EP2005/010365 2004-09-30 2005-09-24 Kontaktierung thermoelektrisch aktiver antimonide WO2006037499A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004048221A DE102004048221A1 (de) 2004-09-30 2004-09-30 Kontaktierung thermoelektrisch aktiver Antimonide
DE102004048221.7 2004-09-30

Publications (2)

Publication Number Publication Date
WO2006037499A2 WO2006037499A2 (de) 2006-04-13
WO2006037499A3 true WO2006037499A3 (de) 2006-08-03

Family

ID=35466484

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2005/010365 WO2006037499A2 (de) 2004-09-30 2005-09-24 Kontaktierung thermoelektrisch aktiver antimonide

Country Status (3)

Country Link
DE (1) DE102004048221A1 (de)
TW (1) TW200625704A (de)
WO (1) WO2006037499A2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010125411A1 (en) * 2009-04-27 2010-11-04 Szenergia Kft. Procedure for producing a device containing metal and intermetallic semiconductor parts joined together with an electrically conductive and heat conducting connection, especially a rod suitable for use with thermoelectric modules
CN103210513A (zh) * 2010-10-05 2013-07-17 奥胡斯大学 稳定的热电装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1112693A (en) * 1965-11-23 1968-05-08 Westinghouse Electric Corp Method for producing self-spacing solder composition
DE1924522A1 (de) * 1969-05-14 1970-11-19 Siemens Ag Lot zum Kontaktieren eines Thermoelementschenkels
US20020179135A1 (en) * 2001-03-26 2002-12-05 Naoki Shutoh Thermoelectric module and heat exchanger
US20020189661A1 (en) * 2001-01-17 2002-12-19 Thierry Caillat Thermoelectric unicouple used for power generation
EP1324400A1 (de) * 2000-09-13 2003-07-02 Sumitomo Special Metals Company Limited Thermoelektrisches umsetzungselement
JP2004342879A (ja) * 2003-05-16 2004-12-02 Central Res Inst Of Electric Power Ind 熱電変換モジュールの組立方法および当該モジュールの組立てに用いられるろう材

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1112693A (en) * 1965-11-23 1968-05-08 Westinghouse Electric Corp Method for producing self-spacing solder composition
DE1924522A1 (de) * 1969-05-14 1970-11-19 Siemens Ag Lot zum Kontaktieren eines Thermoelementschenkels
EP1324400A1 (de) * 2000-09-13 2003-07-02 Sumitomo Special Metals Company Limited Thermoelektrisches umsetzungselement
US20020189661A1 (en) * 2001-01-17 2002-12-19 Thierry Caillat Thermoelectric unicouple used for power generation
US20020179135A1 (en) * 2001-03-26 2002-12-05 Naoki Shutoh Thermoelectric module and heat exchanger
JP2004342879A (ja) * 2003-05-16 2004-12-02 Central Res Inst Of Electric Power Ind 熱電変換モジュールの組立方法および当該モジュールの組立てに用いられるろう材

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 2003, no. 12 5 December 2003 (2003-12-05) *

Also Published As

Publication number Publication date
DE102004048221A1 (de) 2006-04-06
TW200625704A (en) 2006-07-16
WO2006037499A2 (de) 2006-04-13

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