WO2006035766A1 - 光導波路の製造方法 - Google Patents
光導波路の製造方法 Download PDFInfo
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- WO2006035766A1 WO2006035766A1 PCT/JP2005/017732 JP2005017732W WO2006035766A1 WO 2006035766 A1 WO2006035766 A1 WO 2006035766A1 JP 2005017732 W JP2005017732 W JP 2005017732W WO 2006035766 A1 WO2006035766 A1 WO 2006035766A1
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- optical waveguide
- core
- layer
- laser processing
- clad
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/136—Integrated optical circuits characterised by the manufacturing method by etching
Definitions
- the present invention relates to a method for manufacturing an optical waveguide using laser processing.
- optical waveguides have attracted attention as optical transmission media because of the demand for large capacity and high speed information processing in optical communication systems and computers.
- a typical example of such an optical waveguide is a quartz-based waveguide, but there are problems such as requiring a special manufacturing apparatus and a long manufacturing time.
- Japanese Laid-Open Patent Publication No. 2003-195081 is an optical waveguide composed of a lower clad layer, a core portion, and an upper clad layer, and at least one of the lower clad layer and the core portion is formed using a dry film.
- a method for forming an optical waveguide is disclosed.
- Japanese Patent Laid-Open No. 10-307226 discloses that a core material, which has a refractive index higher than that of a polymer clad substrate when cured, is injected in a monomer state into a groove formed on the surface of the polymer clad substrate.
- a method for producing a polymer optical waveguide for curing a core material in a state a method for injecting a core material in a monomer state after forming a coating layer on the inner wall surface of a groove on the surface of a polymer clad substrate is disclosed. Yes.
- a through hole or a non-through hole is provided in a layer constituting the optical waveguide.
- Japanese Patent Laid-Open No. 6-3538 discloses that a carbon dioxide laser is used when forming a through hole in a substrate constituting an embedded optical waveguide formed of an inorganic material.
- the manufacture of optical waveguides using organic materials such as various types of resin can simplify the manufacturing apparatus and the manufacturing process compared to the silica-based waveguide described above and the manufacturing method thereof. There is an advantage that finer processing is possible. However, there is a limit to reducing the number of processes when patterning the resin layer using photolithography with a resist. Depending on the type and quality of the optical waveguide, the manufacturing process can be further simplified. It was desired to provide technology that can achieve this. In addition, a method of providing a through hole or a non-through hole in an optical waveguide in which at least one of a core part and a clad part is made of an organic material has become necessary.
- a first object of the present invention is to provide a technique capable of further simplifying a manufacturing process in manufacturing an optical waveguide.
- a second object of the present invention is to provide a technique capable of accurately providing a through hole or a non-through hole in an optical waveguide using an organic material.
- a first aspect of the present invention is a method of manufacturing an optical waveguide having a core portion and a cladding portion. In the manufacturing process of at least one of the core portion and the cladding portion, laser processing for removing an organic material is performed. It is a manufacturing method of an optical waveguide characterized by including processing.
- the laser processing is performed by irradiating a predetermined portion of an organic material layer for forming a core portion or a clad portion provided on the substrate with a laser, so that the organic material in the irradiation portion is applied to the substrate. It is preferable that the treatment is performed by removing the material from the substrate and imparting a predetermined shape to the core or cladding.
- the processing step for obtaining the shape of the core portion or the clad portion includes laser processing, and a process using conventional photolithography for patterning of these portions.
- the optical waveguide can be manufactured in a simpler process.
- the second aspect of the present invention provides an optical waveguide having a core portion and a cladding portion, at least one of which is made of an organic material, and at least one of a through hole and a non-through hole.
- at least one of the through hole and the non-through hole is formed by laser processing.
- the laser processing is performed by irradiating a predetermined portion of the core portion and the Z or clad portion formed with the organic material force to remove the organic material in the irradiated portion to remove a through hole or a non-hole.
- a treatment for forming a through hole is preferable.
- at least one of the core part and the clad part also has organic material force.
- Laser processing is used to form a through hole or a non-through hole in the optical waveguide. Holes or non-through holes can be provided.
- FIG. 1 is a diagram for explaining a first embodiment of the present invention.
- FIG. 2 is a diagram for explaining an embodiment of the first present invention.
- FIG. 3 is a diagram for explaining an embodiment of the first invention.
- FIG. 4 is a diagram for explaining an embodiment of the first present invention.
- FIG. 5 is a diagram for explaining an embodiment of the first present invention.
- FIG. 6 is a diagram for explaining the first embodiment of the present invention.
- FIG. 7 is a diagram for explaining an embodiment of the second invention.
- FIG. 8 is a diagram for explaining the second embodiment of the present invention.
- FIG. 9 is a diagram for explaining the second embodiment of the present invention.
- the laser processing machine used in the present invention is a machine that can form a core or a clad portion of an optical waveguide and irradiate the material with a laser to obtain a shape of a desired size. If there is no particular limitation, it can be used.
- the type of laser, irradiation conditions, and the like may be appropriately selected according to the material used for the core portion and the clad portion. In particular, it is preferable to use laser light having an oscillation wavelength of 400 nm or less for this laser processing.
- Laser light used for laser processing is CO laser in the infrared region (wavelength 9.3-10.
- YAG laser (wavelength of fundamental wave: 1.06 m), YAG, YLF, YAP, YVO laser (wavelength of third harmonic: 355 nm, ArF wavelength: 193 nm) in the ultraviolet region are currently processed
- Laser processing using wavelengths in the infrared region is thermal processing or pyrolytic processing compared to machining in metal drills, and laser processing using wavelengths in the ultraviolet region is called photolytic processing using photochemical reactions. .
- lasers in the ultraviolet or vacuum ultraviolet region are particularly preferred for processing fine patterns of 30 / zm or less.
- laser processing machines There are two types of laser processing machines, which are broadly divided in view of processing method power. That is, laser groups that can narrow the beam shape from several ⁇ to several tens of ⁇ , such as carbon dioxide laser and YAG laser, and excimer lasers that cannot narrow the beam. A group of nitrogen lasers.
- X It is possible to scan a laser beam in an area of about 30 mm, and it is possible to process a large area at high speed by using a pattern recognition system equipped with a CCD camera together with a mechanism that moves the XY stage. is there. In this case, it is not necessary to prepare an exposure mask for beam scanning.
- the beam shape can be freely changed by using a metal mask which does not necessarily need to be circular. For excimer lasers that cannot be focused to a very small beam, it is necessary to accurately align a metal mask with through holes in the bump pattern of the substrate.
- a large area can be processed by using a mechanism that moves the XY stage.
- the light intensity, the number of pulses, the spot diameter, etc. in each pulse can be adjusted, so that the layer to be processed can reach a predetermined depth. Removal is also possible.
- a through hole or a non-through hole formed by laser processing can be filled with an inorganic material or an organic material depending on the application.
- a thermally conductive material By filling the hole with a thermally conductive material, a function such as heat dissipation can be imparted to the site where the hole is provided.
- the branched structure of the optical waveguide can also be obtained by forming the non-through hole up to the core portion and filling the core portion with a material capable of forming the core portion.
- FIG. 1 is a diagram for explaining a first embodiment of the first invention.
- a layer 2 serving as a lower cladding part and a layer 3 serving as a core part are sequentially laminated on a substrate 1.
- laser irradiation 5 capable of removing a predetermined portion of layers 2 and 3 is performed by laser processing power.
- a groove having a predetermined width shown in FIG. 1 (d) is formed, and a laminated structure of the lower cladding part 2 and the core part 3 is obtained between the grooves.
- the side surface of this laminated structure is a cut surface in laser processing.
- an upper cladding layer 4 covering the laminated structure on the substrate 1 is formed to complete the optical waveguide.
- a material force that can use the substrate 1 as a lower clad part is also formed, and a core part and an upper clad part may be formed in the same manner as described above to form an optical waveguide.
- FIG. 2 is a diagram for explaining a second embodiment of the first invention.
- a layer 2 serving as a lower cladding part, a layer 3 serving as a core part, and a layer 4 serving as an upper cladding part are sequentially laminated on the substrate 1.
- laser irradiation 5 capable of removing predetermined portions of the laser processing mechanical layers 2 and 3 is performed.
- a groove having a predetermined width shown in FIG. 2 (d) is formed, and a laminated structure of the lower clad part 2, the core part 3 and the upper clad part 4 is obtained between the grooves.
- the side surface of this laminated structure is a cut surface in laser processing.
- a layer 6 serving as a side cladding portion covering the laminated structure on the substrate 1 is formed to complete the optical waveguide.
- FIG. 3 is a diagram for explaining a third embodiment of the first invention.
- a layer 2 serving as a lower clad portion and a layer 3 serving as a core portion are sequentially laminated on a substrate 1.
- laser irradiation 5 capable of selectively removing only a predetermined portion of the layer 2 is performed with the laser processing power.
- a groove having a predetermined width shown in FIG. 3 (d) is formed, and a laminated structure of the lower clad portion 2 and the core portion 3 is obtained between the grooves.
- the side surface of the core part 2 in this laminated structure is a cut surface in laser processing.
- a layer 4 serving as an upper clad portion covering the laminated structure on the substrate 1 is formed to complete the optical waveguide.
- FIG. 4 is a diagram for explaining a fourth embodiment of the first invention.
- a layer 2 serving as a lower clad part and a layer 6 serving as a side clad part are sequentially laminated on a substrate 1.
- laser irradiation 5 that can selectively remove only a predetermined amount of the layer 6 from the laser processing machine is performed.
- a groove 3a having a predetermined width shown in FIG. 4 (d) is formed.
- the surface of the side clad portion becomes a cut surface in laser processing.
- the groove 3a is filled with a material for forming the core portion 3, and the portion above the side cladding portion 6 above the layer 3b is removed by a method such as polishing.
- the upper cladding portion 4 is provided to complete the optical waveguide.
- FIG. 5 is a diagram for explaining a third embodiment of the first invention.
- the layer 3 serving as the core portion is laminated on the substrate la.
- laser irradiation 5 capable of removing a predetermined portion of the laser processing mechanical layer 3 is performed.
- FIG. 5 (c) grooves having a predetermined width shown in FIG. 5 (c) are formed, and the core portion 3 is obtained between the grooves.
- the side surface of the core portion 3 in the laminated structure is a cut surface in laser processing.
- transfer is performed on the layer 2 serving as the lower cladding on the substrate lb.
- the layer 4 serving as the upper clad portion covering the core portion 3 is formed to complete the optical waveguide.
- FIG. 7B shows a through-hole 7 penetrating between two opposing surfaces of the embedded optical waveguide having the core portion 3 in the lower cladding portion 2 and the upper cladding portion 4, that is, from the upper surface to the lower surface.
- FIG. The through-hole 7 is formed by processing by laser irradiation from the upper surface in a state where the optical waveguide structure shown in FIG. 7 (a) is completed. Note that even if the optical waveguide is an embedded optical waveguide formed on the substrate 1 as shown in FIG. 7 (c), the through hole at that time is formed as shown in FIG. 7 (d). .
- FIGS. 9 (a) and 9 (b) are diagrams showing a structure in which non-through holes are provided by laser irradiation on the optical waveguide having the structure of FIG. 7 (c). is there.
- the position of light irradiation from the laser processing machine in forming the through hole or the non-through hole in the optical waveguide can be controlled by an irradiation position control means provided in the laser processing machine.
- an optical waveguide structure having a core portion and a cladding portion has already been completed at the time of forming a through hole or a non-through hole, so that the refractive index is high!
- a dummy core portion for alignment between the optical waveguide and the laser processing machine is formed in a portion that does not affect the function of the optical waveguide at a position where the positional relationship with the core portion of the optical waveguide is specified,
- the dummy core portion may be detected and used for alignment between the optical waveguide and the laser processing machine.
- the optical waveguide can be formed using an organic material for at least one of the core part and the clad part.
- a layer 2 of a thermosetting resin composition for forming a lower clad portion is formed on a substrate 1, and a layer 3 made of a photosensitive resin composition is formed thereon.
- FIG. 7 (c) having two surfaces (upper surface and lower surface) facing each other by forming an upper clad portion 4 covering the obtained core portion 3 by forming a core portion 3 by light irradiation and development after installation.
- An optical waveguide having the following structure can be obtained.
- an optical waveguide having the configuration of FIG. 7 (a) can be obtained.
- the method of manufacturing the optical waveguide in which the through hole or the non-through hole is provided by laser processing is not limited to the above method, and various known methods can be used.
- a groove is provided in a layer to be a lower cladding part, and a material to be a core part is filled in the groove and then covered with an upper cladding layer, or a spot position is specified in a layer made of a photobleaching material.
- a method of providing a core by irradiating with a laser can also be used.
- the optical waveguide to be laser processed has at least the clad portion of the core portion and the clad portion formed with an organic material force.
- the clad portion is formed of an organic material, it is more preferable to form both the core portion and the organic material force in consideration of the manufacturing process and the characteristics of the optical waveguide.
- the substrate 1 for forming the optical waveguide is an optical waveguide substrate. It is preferable to use a material that has all the mechanical strength and physical properties and is not cut under the conditions of laser treatment in the formation of the core and the clad. For example,
- a metal, glass, ceramic, a resin board, etc. can be used.
- the workability with a laser is sufficient.
- Various material forces can be selected in consideration. Further, when the clad part is formed with different material forces, it is sufficient if the clad part having a higher refractive index than the core part can be formed.
- At least one of the core part and the clad part is formed of resin, for example, as a material for forming at least one of them, thermoplastic resin, curable resin, etc. ⁇ ⁇ can be used.
- thermoplastic resins include acrylic resins, epoxy resins, silicone resins, polycarbonate resins, siloxane resins, polyimide resins, polyurethane resins, oxetane resins.
- Fat polyethersulfone-based resin, polysulfide-based resin, polyetherimide-based resin, polysulfone-based resin, polyetherketone-based resin, polyamide-based resin S, polyethylene-based resin S, polypropylene Series ⁇ S, polyethylene terephthalate (PET) series, phenol novolac series resin, ethylene butyl alcohol copolymer, ethylene acetate butyl copolymer, polystyrene series resin, fluorinated series resin, polybutylene terephthalate series resin
- Polyacetal resin polyether-tolyl resin, polyamide resin, polyolefin Bromide copolymer, Aramido system ⁇ , liquid crystal polymers, Porie Teruketon system ⁇ , like Shi
- the curable resin examples include a thermosetting resin, a room temperature curable resin, and an active energy ray curable resin. In addition, it has the properties of both thermosetting and active energy ray curable, and later for lj.
- an active energy ray-curable resin When used, it can be used as a layer made of a cured product by irradiating the entire surface of an uncured or semi-cured layer as necessary.
- thermosetting resin for example, a combination of a heat-reactive functional group in a base resin and a curing agent having a functional group that reacts with the functional group by heat, an N-methylol group, N Alkoxy Any self-crosslinking type such as a methylol group can be used.
- the combination of the reactive functional groups by heat include a carboxyl group and an epoxy group (oxysilane group), a carboxylic acid anhydride and an epoxy group (oxysilane group), an amino group and an epoxy group (oxysilane group), and a carboxyl group.
- room temperature curable resin examples include an oxidative curable unsaturated resin and an isocyanate curable resin.
- the active energy ray-curable resin two or more ring-opening polymerizable functional group-containing compounds are essential components in the molecule, and those containing an active energy ray polymerization initiator as necessary. It is particularly preferable to use an unsaturated compound, an unsaturated resin and, if necessary, an active energy ray polymerization initiator. In addition, the same negative active energy linear resin as described below can be used.
- the film formed from the resin becomes insoluble in the developer by curing the film part irradiated with energy rays such as ultraviolet rays, visible light, and heat rays.
- energy rays such as ultraviolet rays, visible light, and heat rays.
- a core layer can be formed, and conventionally known ones can be used without particular limitation.
- two or more ring-opening polymerizable functional group-containing compounds are essential components in the molecule, and if necessary, those containing an active energy linear polymerization initiator, polymerizable unsaturated compounds, It is particularly preferable to use an unsaturated resin and, if necessary, an active energy ray polymerization initiator.
- the film formed from the resin has a solubility in a developer due to decomposition of the film part irradiated with energy rays such as ultraviolet rays, visible rays, and heat rays.
- energy rays such as ultraviolet rays, visible rays, and heat rays.
- a known material can be used without particular limitation.
- the positive type energy sensitive linear resin for example, a quinone diazide sulfonic acid is bonded to a substrate resin such as an acrylic resin having an ion forming group.
- a substrate resin such as an acrylic resin having an ion forming group.
- quinonediazide group is photolyzed by light irradiated
- a naphthoquinonediazide photosensitive composition using a reaction that forms indenecarboxylic acid via ketene; forms a crosslinked coating that is insoluble in an alkaline developer or acidic developer by heating, and is further exposed to an acid group by irradiation with light.
- a positive photosensitive composition utilizing a mechanism in which the bridge structure is cut by a photoacid generator that generates water and the irradiated part becomes soluble in an alkaline developer or an acidic developer JP-A-6-295064, Representative examples include JP-A-6-308733, JP-A-6-313134, JP-A-6-313135, JP-A-6-313136, JP-A-7-146552, and the like. I can get lost.
- the photoacid generator is a compound that generates an acid upon exposure.
- the generated acid is used as a catalyst to decompose the resin, and those having a conventional force can be used.
- a positive heat-sensitive resin composition having a conventionally known strength for example, a heat-sensitive resin, an ether bond-containing olefinic unsaturated compound, and a thermal acid generator. Things can be used. Examples of this include those disclosed in Japanese Patent Application Laid-Open No. 2000-187326.
- thermoplastic resins can be suitably used as the lower cladding layer and the upper cladding layer, and the curable resin can be used. Those that can be patterned by development or the like can be suitably used for forming the core portion.
- a suitable amount of methyl ethyl ketone solvent is placed in a flask equipped with a reflux, and 39.4 g of dimethylolbutanoic acid having two hydroxyl groups and one carboxyl group in one molecule is contained in one molecule.
- 7.6 g of 1,6-hexanediol having 2 hydroxyl groups, 6.7 g of neopentyl glycol having 2 hydroxyl groups in one molecule, and toluene diisosodium having 2 isocyanate groups in the molecule 46.3 g of cyanate and 500 ppm of dibutyltin dilaurate as a reaction catalyst were added, and the temperature was raised to 75 ° C while stirring. After raising the temperature by 75 ° C, As a result of reaction while stirring for 12 hours, the objective carboxyl group-containing urethane compound A-1 was obtained.
- a suitable amount of methyl ethyl ketone solvent is placed in a flask equipped with a refluxer, and 35.7 g of dimethylolbutanoic acid having two hydroxyl groups and one carboxyl group in one molecule is contained in one molecule.
- the mixture was added and heated to 75 ° C with stirring. After the temperature was raised at 75 ° C., the reaction was carried out with stirring for 12 hours while maintaining this temperature. As a result, the target carboxyl group-containing urethane compound A-2 was obtained.
- this solution was applied onto a polyethylene terephthalate film (film thickness 25 ⁇ m) with a knife edge coater, and then dried at 80 ° C. for 30 minutes to dry a curable dry film with a film thickness of 30 ⁇ m.
- D—1 was obtained.
- this solution was applied on a polyethylene terephthalate film (film thickness 25 ⁇ m) with a knife edge coater, and then dried at 80 ° C for 30 minutes, so that the curable dry film with a film thickness of 80 m D-3 Got.
- this solution was applied onto a polyethylene terephthalate film (film thickness 25 ⁇ m) with a knife edge coater, and then dried at 80 ° C for 30 minutes, so that the curable dry film with a film thickness of 30 m D-3 Got.
- dry film D-2 was transferred onto the surface of the silicon substrate by atmospheric pressure hot roll pressing (temperature: 100 ° C), and an ultraviolet ray with a wavelength of 365 nm and an illuminance of lOOmWZcm 2 was applied for 10 seconds. After the irradiation, a lower clad layer having a thickness of 20 m was obtained by thermosetting at 150 ° C. for 30 minutes using a hot plate. The refractive index of the lower cladding layer after hardening was measured at 850 nm using an Abbe refractometer.
- the dry film D-1 was transferred onto the lower clad layer by atmospheric pressure roll thermocompression bonding (temperature: 100 ° C), and then ultraviolet rays with a wavelength of 365 nm and an illuminance of lOmWZcm 2 were applied. Irradiated for 100 seconds.
- the refractive index of this core layer was 1.520 as a result of measurement using an Abbe refractometer at a wavelength of 850 °.
- a pulsed Nd: YAG laser was applied to a 40 ⁇ m thick two-layer structure consisting of a cladding layer and a core layer formed using dry films D-2 and D-1, respectively. Processing was performed. The processing conditions are a wavelength of 355 nm, a pulse energy of 3. lmj, a pulse width of 4.3 ns, and a repetition rate of 10 Hz.
- the laser beam was fixed, and the processed substrate was moved on a vertical stage with positioning accuracy of 5 ⁇ m.
- Processing material Using the third harmonic (355nm) of YAG laser, the resin part was scanned so that the resin part had a width of 30 / zm. Also, at this stage, the core Z lower cladding structure with a rectangular cross section with a line width of 30 m is formed with high accuracy. confirmed.
- the over clad solution OC-1 was applied with a knife edge coater. After that, after irradiating with ultraviolet rays having a wavelength of 365 ⁇ m and an illuminance of lOOmWZcm 2 for 10 seconds, the substrate was baked at 150 ° C for 60 minutes to obtain an optical waveguide.
- the refractive index after curing of the upper clad layer was 1.497 as a result of measurement at a wavelength of 850 nm using an Abbe refractometer.
- the obtained optical waveguide had the structure shown in Fig. 1 (e).
- the waveguide transmission loss was determined by the cutback method by measuring the amount of light that was incident on the light with a wavelength of 850 nm and exiting the other end, and found to be 0.4 dBZcm. It was.
- the dry film D-3 was replaced with the atmospheric pressure hot roll press method (temperature 100 ° C) instead of the over clad solution OC-1. Transcribed. After that, after irradiating with ultraviolet rays having a wavelength of 365 nm and an illuminance of lOOmWZcm 2 for 10 seconds, post-baking was performed at 150 ° C. for 60 minutes to obtain an optical waveguide.
- the refractive index after curing of the upper clad layer was 1.497 as a result of measurement using an Abbe refractometer at a wavelength of 850 nm.
- the obtained optical waveguide had the structure shown in Fig. 1 (e).
- a lower clad layer was formed on the substrate in the same manner as in Example 1-1.
- dry film D-4 was further transferred by atmospheric pressure hot roll pressing (temperature 100 ° C), and ultraviolet light with a wavelength of 365 nm and an illuminance of 100 mW / cm 2 was applied for 10 seconds.
- post-baking was performed at 150 ° C for 60 minutes to form a layer for the side cladding.
- This side cladding layer was laser processed under the same conditions as in Example 11 to obtain a width of 30 / ⁇ ⁇ and a depth of Grooves were formed in a rectangular line with a length of 30 m, and the bottom surface of the lower cladding layer was exposed on the bottom. Further, the liquid core forming liquid LC-1 is filled into the line-shaped groove by a knife edge coater, irradiated with ultraviolet rays having a wavelength of 365 nm and an illuminance of lOOmWZcm 2 for 10 seconds, and then heated by heating at 150 ° C. for 30 minutes. Curing was performed to form the core, and the structure shown in Fig. 4 (e) was obtained.
- the core part that protrudes from the upper part is removed by polishing to form a surface on which the upper surface of the side cladding part is exposed, and then the dry film D-3 is transferred by a normal pressure hot roll pressure bonding method (temperature 100 ° C). Then, after irradiating ultraviolet rays having a wavelength of 365 nm and an illuminance of lOOmWZcm 2 for 10 seconds, post-baking was performed at 150 ° C. for 60 minutes to obtain an optical waveguide.
- the obtained optical waveguide has the structure shown in Fig. 4 (f).
- the waveguide transmission loss of the obtained optical waveguide was determined by the cutback method in the same manner as in Example 1-1, and found to be 0.4 dB / cm.
- dry film D-2 was transferred onto the surface of the silicon substrate by atmospheric pressure hot roll pressing (temperature: 100 ° C), and an ultraviolet ray with a wavelength of 365 nm and an illuminance of lOOmWZcm 2 was applied for 10 seconds. After irradiation, a lower clad layer with a thickness of 20 m was obtained by thermosetting using a hot plate at 150 ° C for 30 minutes. The refractive index of the lower cladding layer after hardening was measured at 850 nm using an Abbe refractometer.
- the dry film D-1 was transferred onto the lower clad layer by atmospheric pressure roll thermocompression bonding (temperature: 100 ° C), and then ultraviolet rays with a wavelength of 365 nm and an illuminance of lOmWZcm 2 were applied. Irradiated for 100 seconds.
- the refractive index of this core layer was 1.520 as a result of measurement using an Abbe refractometer at a wavelength of 850 °.
- the core layer was subjected to laser processing using a pulsed Nd: YAG laser.
- the processing conditions are the same as in Example 1-1.
- the overclad solution OC-1 is It was applied with an effect coater. After that, ultraviolet rays with a wavelength of 365 nm and an illuminance of lOOmWZcm 2 were irradiated for 10 seconds, and then post-baked at 150 ° C. for 60 minutes to obtain an optical waveguide.
- the refractive index after curing of the upper clad layer was 1.497 as a result of measurement using an Abbe refractometer at a wavelength of 85 Onm.
- the obtained optical waveguide had the structure shown in Fig. 3 (e).
- dry film D-2 was transferred onto the surface of the silicon substrate by atmospheric pressure hot roll pressing (temperature: 100 ° C), and an ultraviolet ray with a wavelength of 365 nm and an illuminance of lOOmWZcm 2 was applied for 10 seconds. After irradiation, a lower clad layer having a thickness of 20 m was obtained by thermosetting at 150 ° C. for 30 minutes using a hot plate. The refractive index after curing of the lower clad layer was 1.497 as a result of measurement using an Abbe refractometer at a wavelength of 850 nm.
- the dry film D-1 was transferred onto the lower clad layer by atmospheric pressure roll thermocompression bonding (temperature: 100 ° C), and then ultraviolet rays with a wavelength of 365 nm and an illuminance of lOmWZcm 2 were applied. Irradiated for 100 seconds.
- the refractive index of this core layer was 1.520 as a result of measurement using an Abbe refractometer at a wavelength of 850 °.
- the dry film D-3 was transferred by a normal pressure hot-hole pressure bonding method (temperature 100 ° C.). Thereafter, ultraviolet rays having a wavelength of 365 nm and an illuminance of lOOmWZcm 2 were irradiated for 10 seconds, and then post-baked at 150 ° C. for 60 minutes. As a result, a three-layer structure consisting of a lower cladding layer, a core layer, and an upper cladding layer as shown in Fig. 2 (b) was obtained.
- dry film D-2 was transferred onto the surface of the silicon substrate by atmospheric pressure hot roll pressing (temperature: 100 ° C), and an ultraviolet ray with a wavelength of 365 nm and an illuminance of lOOmWZcm 2 was applied for 10 seconds. After the irradiation, a lower clad layer having a thickness of 20 m was obtained by thermosetting at 150 ° C. for 30 minutes using a hot plate. On the other hand, the curable resin layer (film thickness: 30 m) of dry film D-4 was subjected to laser treatment under the same conditions as in Example 11 to obtain a wire with a width of 30 m and a height of 30 m A pattern was formed.
- a dry film having this linear pattern is laminated on the surface of the lower clad layer provided on the silicon substrate from the linear pattern side, and subjected to a normal pressure hot roll pressing method (temperature 100 ° C).
- the linear pattern was transferred to the surface of the silicon substrate.
- ultraviolet rays with a wavelength of 365 nm and an illuminance of 10 OmWZcm 2 were irradiated for 10 seconds, and then post-baked at 150 ° C. for 60 minutes to obtain a core part.
- Example 1-1 an upper waveguide layer was laminated in the same manner as in Example 1-1 to obtain an optical waveguide.
- the waveguide transmission loss of the obtained optical waveguide was determined by the cutback method in the same manner as in Example 1-1, it was 0.4 dBZcm.
- Example 2-1 formation of waveguide
- Dry film D-2 is applied to the surface of the silicon substrate at normal pressure to form the lower cladding layer.
- Transferred by hot-roll pressure bonding method (temperature: 100 ° C), irradiated with ultraviolet rays with a wavelength of 365 nm and illuminance of 100 mW / cm 2 for 10 seconds, and then heat-cured using a hot plate at 150 ° C for 30 minutes
- a lower cladding layer having a thickness of 20 m was obtained.
- the refractive index of the lower cladding layer after hardening was measured at 850 nm using an Abbe refractometer.
- the dry film D-1 was transferred onto the lower clad layer by the normal pressure roll thermocompression method (temperature: 100 ° C), and then transferred to the transferred dry film D-1.
- a photomask having a line pattern of 30 m in width ultraviolet rays having a wavelength of 365 nm and an illuminance of 10 mW / cm 2 were irradiated for 100 seconds to cure a predetermined portion of the dry film in a line shape.
- the substrate having the dry film irradiated with ultraviolet rays was immersed in a developing solution having a power of 1.5 wt% aqueous sodium carbonate (temperature 35 ° C.) to dissolve the unexposed portion of the dry film. In this way, a core portion having a line pattern having a width of 30 m was formed.
- the refractive index of the core portion was 1.520 as a result of measurement using an Abbe refractometer at a wavelength of 850 nm.
- the over clad liquid OC-1 was applied with a knife edge coater. Thereafter, ultraviolet light having a wavelength of 365 nm and an illuminance of 100 m WZcm 2 was irradiated for 10 seconds, and then post-baked at 150 ° C. for 60 minutes to obtain an optical waveguide.
- the refractive index after curing of the upper clad layer was 1.497 as a result of measurement using an Abbe refractometer at a wavelength of 850 nm.
- the obtained optical waveguide had the structure shown in Fig. 7 (c).
- Laser processing is performed on the substrate having the optical waveguide described above using a pulsed Nd: YAG laser. Processing conditions are wavelength 355nm, pulse energy 3.lmj, pulse width 4.3n s, 10 Hz repetition rate.
- the laser beam was fixed and the processed substrate was moved on an XY stage with a positioning accuracy of 5 m.
- the moving speed of the work material was 81 ⁇ m / sec, and the condensing shape was a circle of 15 ⁇ .
- the base film of the dry film D-2 is used as the substrate, and after forming the optical waveguide in the same manner as in Example 21, drilling is performed to reach the base film, and then the base film is peeled off.
- the structure shown in Fig. 7 (b) was fabricated.
- Example 2-5 filling of through hole with conductive member
- Metal paste (eg, Harima Kasei NP series) was filled into the through holes of the optical waveguides obtained in Examples 1 and 2 by screen printing.
- the through-hole filled with the metal paste has a separate member on the upper surface of the substrate having the optical waveguide when the substrate having the optical waveguide is sandwiched between different circuit boards or semiconductor substrates on the upper and lower sides thereof to form a laminated structure. It is possible to ensure electrical continuity with another member on the lower surface, or to function as a passage ensuring thermal conductivity.
- An optical waveguide was formed in the same manner as in Examples 2-1 (1) to (3). Next, laser processing is performed under the same conditions as in Example 2-1, and a hole (non-through hole) reaching the upper surface of the core portion is formed in a predetermined portion of the upper cladding layer, and the structure shown in FIG. An optical waveguide having Further
- UV irradiation with a wavelength of 365 nm and an illuminance of lOOmW Zcm 2 was applied for 30 seconds, and then heated at 120 ° C for 30 minutes using a hot plate. By curing, a branched structure in which the optical waveguide branches upward with respect to the core portion was formed.
- a lower cladding layer and a core layer were formed on the surface of the silicon substrate in the same manner as in Examples 2-1 (1) and (2).
- the curable dry film D-3 for optical waveguide is transferred onto the upper surface of the lower clad layer having the core portion by a normal pressure hot roll pressing method (temperature: 100 ° C), and 120 ° using a hot plate. C, pre-beta for 30 minutes.
- ultraviolet light with a wavelength of 365 nm and an illuminance of lOOmWZcm 2 was irradiated for 10 seconds and post-baked at 150 ° C for 30 minutes to create an optical waveguide structure with the structure shown in Fig. 7 (c).
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JP2004-284690 | 2004-09-29 | ||
JP2004284689A JP2006098731A (ja) | 2004-09-29 | 2004-09-29 | 光導波路の製造方法 |
JP2004-284689 | 2004-09-29 | ||
JP2004284690A JP2006098732A (ja) | 2004-09-29 | 2004-09-29 | 光導波路の製造方法 |
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US5106211A (en) * | 1991-02-14 | 1992-04-21 | Hoechst Celanese Corp. | Formation of polymer channel waveguides by excimer laser ablation and method of making same |
JP2000180648A (ja) * | 1998-12-21 | 2000-06-30 | Sharp Corp | 光導波路素子の加工方法 |
JP2000227524A (ja) * | 1999-02-05 | 2000-08-15 | Sony Corp | 光導波装置および光送受信装置、ならびにそれらの製造方法 |
JP2000347051A (ja) * | 1999-03-30 | 2000-12-15 | Toppan Printing Co Ltd | 光・電気配線基板及びその製造方法並びに実装基板 |
JP2002169042A (ja) * | 2000-11-30 | 2002-06-14 | Nec Corp | 光導波路結合構造、光導波路及びその製造方法、並びに光導波路付き光素子部品及びその製造方法 |
JP2002365460A (ja) * | 2001-04-03 | 2002-12-18 | Fujikura Ltd | 光導波路部品の製造方法 |
JP2003050328A (ja) * | 2001-08-06 | 2003-02-21 | Toppan Printing Co Ltd | 光・電気配線基板及びその製造方法並びに実装基板 |
JP2003222747A (ja) * | 2002-01-30 | 2003-08-08 | Kyocera Corp | 光回路基板 |
JP2003227951A (ja) * | 2002-02-05 | 2003-08-15 | Canon Inc | 光導波装置、その製造方法、およびそれを用いた光電気混載基板 |
JP2004086185A (ja) * | 2002-06-28 | 2004-03-18 | Matsushita Electric Ind Co Ltd | 受発光素子内蔵光電気混載配線モジュールとその製造方法及びその実装体 |
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2005
- 2005-09-27 WO PCT/JP2005/017732 patent/WO2006035766A1/ja active Application Filing
- 2005-09-29 TW TW094133919A patent/TW200626977A/zh unknown
Patent Citations (10)
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US5106211A (en) * | 1991-02-14 | 1992-04-21 | Hoechst Celanese Corp. | Formation of polymer channel waveguides by excimer laser ablation and method of making same |
JP2000180648A (ja) * | 1998-12-21 | 2000-06-30 | Sharp Corp | 光導波路素子の加工方法 |
JP2000227524A (ja) * | 1999-02-05 | 2000-08-15 | Sony Corp | 光導波装置および光送受信装置、ならびにそれらの製造方法 |
JP2000347051A (ja) * | 1999-03-30 | 2000-12-15 | Toppan Printing Co Ltd | 光・電気配線基板及びその製造方法並びに実装基板 |
JP2002169042A (ja) * | 2000-11-30 | 2002-06-14 | Nec Corp | 光導波路結合構造、光導波路及びその製造方法、並びに光導波路付き光素子部品及びその製造方法 |
JP2002365460A (ja) * | 2001-04-03 | 2002-12-18 | Fujikura Ltd | 光導波路部品の製造方法 |
JP2003050328A (ja) * | 2001-08-06 | 2003-02-21 | Toppan Printing Co Ltd | 光・電気配線基板及びその製造方法並びに実装基板 |
JP2003222747A (ja) * | 2002-01-30 | 2003-08-08 | Kyocera Corp | 光回路基板 |
JP2003227951A (ja) * | 2002-02-05 | 2003-08-15 | Canon Inc | 光導波装置、その製造方法、およびそれを用いた光電気混載基板 |
JP2004086185A (ja) * | 2002-06-28 | 2004-03-18 | Matsushita Electric Ind Co Ltd | 受発光素子内蔵光電気混載配線モジュールとその製造方法及びその実装体 |
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