WO2006024990A1 - Chip comprising different chip contacts for different operating modes - Google Patents
Chip comprising different chip contacts for different operating modes Download PDFInfo
- Publication number
- WO2006024990A1 WO2006024990A1 PCT/IB2005/052772 IB2005052772W WO2006024990A1 WO 2006024990 A1 WO2006024990 A1 WO 2006024990A1 IB 2005052772 W IB2005052772 W IB 2005052772W WO 2006024990 A1 WO2006024990 A1 WO 2006024990A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- chip
- contact
- operating mode
- contacts
- contactless
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/20—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose
- B42D25/22—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose for use in combination with accessories specially adapted for information-bearing cards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
Definitions
- Chip comprising different chip contacts for different operating modes
- the invention relates to a chip, which chip is provided and designed for use in various chip cards, which chip cards in a first embodiment are suitable only for a contactless operating mode and in a second embodiment are suitable only for a contact operating mode and in a third embodiment are suitable both for the contactless operating mode and for the contact operating mode, and which chip has a semiconductor body and an integrated circuit formed in the semiconductor body and a passivation layer designed to protect the integrated circuit and contactless operating mode chip contacts and contact operating mode chip contacts, which chip contacts each have a contact layer lying below the passivation layer.
- the invention furthermore relates to a chip card comprising a chip.
- a chip of the type mentioned in the first paragraph is commercially available from the Applicant in various design variants and is therefore known.
- the known chip is used in various variants of chip cards, and specifically in a first variant of chip cards which have been designed and used only for a contactless operating mode, and in a second variant of chip cards which have been designed and used only for a contact operating mode, and in a third variant of chip cards which have been designed and used both for a contactless operating mode and for a contact operating mode.
- the design of the contactless operating mode chip contacts and of the contact operating mode chip contacts is such that all these chip contacts have just one contact layer lying below the passivation layer.
- a chip according to the invention is provided with features according to the invention so that a chip according to the invention can be characterized as follows, namely:
- a chip which chip is provided and designed for use in various chip cards, which chip cards in a first embodiment are suitable only for a contactless operating mode and in a second embodiment are suitable only for a contact operating mode and in a third embodiment are suitable both for the contactless operating mode and for the contact operating mode, and which chip has a semiconductor body and an integrated circuit formed in the semiconductor body and a passivation layer designed to protect the integrated circuit and contactless operating mode chip contacts and contact operating mode chip contacts, which chip contacts each have a contact layer lying below the passivation layer, wherein the contactless operating mode chip contacts and at least some of the contact operating mode chip contacts each have a contact head which is connected to the contact layer and projects through a hole in the passivation layer, and wherein each contact head has a given head height in relation to the region of the passivation layer adjacent to the contact head, and wherein the head height of the contact heads of the contactless operating mode chip contacts is greater than the head height of the contact heads of the contact operating mode chip contacts, s
- the chip card is provided with a chip according to the invention.
- Providing the features according to the invention means that both the contactless operating mode chip contacts and also at least some of the contact operating mode chip contacts have a contact head, wherein all the contact heads can be produced by means of a single manufacturing method, so that very simple and cost-effective manufacture is ensured.
- the fact of providing the contact heads in the abovementioned chip contacts means that, in a simple manner, by virtue of the fact that the contact heads of the contactless operating mode chip contacts have a greater head height, it is possible to ensure that a stable and aging-resistant electrically conductive connection which can be produced in a simple manner using flip-chip technology and takes up only a small overall thickness can be established between the contactless operating mode chip contacts and terminals of transmission means which are assigned to these contactless operating mode chip contacts, which transmission means are provided and designed for the contactless transmission of signals.
- providing the features according to the invention means that, in the case where the contactless operating mode chip contacts are connected in flip-chip technology to the terminals of transmission means of a data carrier and the data carrier is designed and used only for a contactless operating mode, it is not possible for the contact operating mode chip contacts, which are not used in this case, to give rise to any disruptive effects, in particular to any short circuits with the transmission means for the contactless transmission of signals and data, and in the case of the contact operating mode chip contacts, which are not used here and are provided with a contact head, the contact layers of these contact operating mode chip contacts are well protected against environmental influences and other disruptive influences by means of the contact heads which are present in any case, so that corrosion and other undesirable changes to the contact layers is prevented without any separate protection means being required for this purpose.
- the contact operating mode chip contacts are suitable, by means of the contact heads having a smaller head height, for establishing in a simple manner a wire bond connection between the small contact heads of the contact operating mode chip contacts and countercontacts of the data carrier which are assigned to these contact operating mode chip contacts and are accessible from outside the data carrier in a known manner, wherein the other contact heads with their greater head height fulfill, as a result of the greater head height, a certain protection function for the bond wires connected to the smaller contact heads.
- the head height of the contact heads of the contactless operating mode chip contacts may be greater than 25 ⁇ m and may for example have values of between 30 ⁇ m and 50 ⁇ m.
- the head height of the contact heads of the contactless operating mode chip contacts lies in a range between 15 ⁇ m and 25 ⁇ m.
- Such contact heads require relatively little manufacturing time and material in relation to their large head height.
- the head height of the contact heads of the contact operating mode chip contacts may be greater than 10 ⁇ m and may for example have values of between 12 ⁇ m and 30 ⁇ m.
- the head height of the contact heads of the contact operating mode chip contacts lies in a range between 1 ⁇ m and 10 ⁇ m.
- Such contact heads require relatively little manufacturing time and material in relation to their large head height.
- the head height of the contact heads of the contactless operating mode chip contacts is 18 ⁇ m.
- the head height of the contact heads of the contact operating mode chip contacts is 5 ⁇ m.
- the contact heads may be made of silver or palladium.
- all the contact heads are made of gold and are produced by means of an electroplating method. This is particularly advantageous because means and measures which have been known for a long time per se are used to manufacture the contact heads of a chip according to the invention.
- Fig. 1 schematically shows, in a view from above, a data carrier, namely a chip card comprising a chip according to one example of embodiment of the invention.
- Fig. 2 shows, in a view from above and on a larger scale than Fig. 1, part of the chip card of Fig. 1, said part containing the chip.
- Fig. 3 shows, in a section along the line III-III in Fig. 2, the part of the chip card shown in Fig. 2 with the chip.
- Figs. 1, 2 and 3 show a chip card 1 which has a card body 2 which has been manufactured by means of a lamination process using a plurality of films.
- the card body 2 may also have been manufactured by means of an injection-molding process.
- the chip card 1 is designed and suitable for carrying out both a contactless operating mode and a contact operating mode. For this reason, the chip card 1 firstly has a transmission coil 3 embedded in the card body 2 as a contactless transmission means for transmitting signals and data, and secondly has a contact array 4.
- the transmission coil 3 has four (4) coil windings 5, 6, 7, 8 and two coil terminals 9, 19.
- the contact array 4 has eight (8) card contacts 10, 11, 12, 13, 14, 15, 16, 17, which card contacts 10, 11, 12, 13, 14, 15, 16, 17 are accessible from outside the chip card 1 for countercontacts of a read/write station, so that contact transmission of ' signals and data is possible.
- the eight (8) card contacts 10, 11, 12, 13, 14, 15, 16, 17 of the contact array 4 are provided on a carrier 18 of the contact array 4, which carrier 18 is made of an electrically insulating material.
- the carrier 18 is made of a printed board material.
- the carrier 18 may also be formed by a plastic film.
- the chip card 1 furthermore contains a chip 20 which is not shown in Fig. 1 but rather only in Figs. 2 and 3.
- the chip 20 is shown here to be larger in terms of its chip surface in relation to the contact array 4 than the chip 20 is in reality. The thickness ratios shown in Fig. 3 are thus not realistic but rather have been selected to be larger for the sake of clarity.
- the chip 20 is provided and designed for use in various chip cards. In the case shown in Figs. 1 to 3, the chip card 1 is designed and suitable for carrying out both a contactless operating mode and a contact operating mode, as mentioned above.
- the chip 20 may however also be used in a chip card which is suitable only for a contactless operating mode.
- the chip 20 may furthermore also be used in a chip card which is suitable only for a contact operating mode.
- the chip 20 has a semiconductor body 21.
- An integrated circuit 22, shown schematically in Fig. 3, is formed in the semiconductor body 21.
- the chip 20 furthermore has a passivation layer 23, which is essentially designed to protect the integrated circuit 22.
- the chip 20 furthermore has two (2) contactless operating mode chip contacts 24 and 25 and eight (8) contact operating mode chip contacts 26, 27, 28, 29, 30, 31, 32, 33.
- the aforementioned ten (10) chip contacts 24 to 33 each have a contact layer lying below the passivation layer 23, of which contact layers only some are shown in Fig. 3 and can be seen in Fig. 3, namely the contact layers of the contacts 24, 25, 27, 31, which contact layers are provided with the references 34, 35, 36, 37.
- the chip 20 particularly advantageously has a design in which each contactless operating mode chip contact 24, 25 and each contact operating mode chip contact
- each contact head 38 to 47 has a given head height in relation to the region of the passivation layer 23 adjacent to the respective contact head 38 to 47. In respect of the contact heads, it should also be mentioned that not all the contact operating mode chip contacts 26, .
- 27, 28, 29, 30, 31, 32, 33 necessarily have to have a contact head 40 to 47 which is connected to the contact layer 34, 35, 36, 37 and projects through a hole in the passivation layer 23, but rather it is also possible for only some of the contact operating mode chip contacts 26, 27, 28, 29, 30, 31, 32, 33 to have a contact head, for example if only some of the contact operating mode chip contacts 26, 27, 28, 29, 30, 31, 32, 33 are actually provided and used for connecting to chip card contacts, because then the contact operating mode chip contacts which are not used may be designed without a contact head.
- the head height H of the contact heads 38, 39 of the contactless operating mode chip contacts 24, 25 is particularly advantageously greater than the head height h of the contact heads 40 to 47 of the contact operating mode chip contacts 26 to 33.
- the greater head height H of the contact heads 38, 39 of the contactless operating mode chip contacts 24, 25 is nominally selected to be 18 ⁇ m.
- the smaller head height h of the contact heads 40 to 47 of the contact operating mode chip contacts 26 to 33 is nominally selected to be 5 ⁇ m.
- All ten (10) contact heads 38 to 47 are made of gold and have been produced by means of an electroplating method.
- the ten (10) contact heads 38 to 47 may have been produced in a different way, for example by means of a printing method. However, it is advantageous if the contact heads 38 to 47 are formed by so-called bumps, in particular gold bumps.
- the contact heads 38, 39 of the contactless operating mode chip contacts 24, 25 are connected to the coil terminals 9, 19 by means of a flip-chip technology, wherein an underfill (not shown in any greater detail) is provided between the passivation layer 23 and the transmission coil 3, said underfill consisting of a plastics material.
- the contact heads 40 to 47 of the contact operating mode chip contacts 26 to 33 are electrically conductively connected to the card contacts 10, 11, 12, 13, 14, 15, 16, 17 by means of a wire bond technology using in each case one bond wire 48, 49, 50, 51, 52, 53, 54, 55, wherein the bond wires 48, 49, 50, 51, 52, 53, 54, 55 are each passed through a hole 56, 57, 58, 59, 60, 61, 62, 63 in the carrier 18 of the contact array 4.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007529089A JP2008511891A (en) | 2004-08-31 | 2005-08-24 | Chip with different chip contacts for different operating modes |
EP05775726A EP1789914A1 (en) | 2004-08-31 | 2005-08-24 | Chip comprising different chip contacts for different operating modes |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04104176.5 | 2004-08-31 | ||
EP04104176 | 2004-08-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006024990A1 true WO2006024990A1 (en) | 2006-03-09 |
Family
ID=35169447
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2005/052772 WO2006024990A1 (en) | 2004-08-31 | 2005-08-24 | Chip comprising different chip contacts for different operating modes |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1789914A1 (en) |
JP (1) | JP2008511891A (en) |
KR (1) | KR20070068354A (en) |
CN (1) | CN100498830C (en) |
WO (1) | WO2006024990A1 (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5598032A (en) * | 1994-02-14 | 1997-01-28 | Gemplus Card International | Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module |
WO1997005571A1 (en) * | 1995-08-01 | 1997-02-13 | Austria Card Plastikkarten Und Ausweissysteme Gesellschaft Mbh | Data carrier with a component-containing module and with a coil, method of producing such a data carrier and module therefor |
US20040124540A1 (en) * | 2002-12-30 | 2004-07-01 | Yu-Wen Chen | [flip chip package structure] |
-
2005
- 2005-08-24 KR KR1020077007358A patent/KR20070068354A/en not_active Application Discontinuation
- 2005-08-24 CN CNB2005800370915A patent/CN100498830C/en not_active Expired - Fee Related
- 2005-08-24 EP EP05775726A patent/EP1789914A1/en not_active Withdrawn
- 2005-08-24 WO PCT/IB2005/052772 patent/WO2006024990A1/en active Application Filing
- 2005-08-24 JP JP2007529089A patent/JP2008511891A/en not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5598032A (en) * | 1994-02-14 | 1997-01-28 | Gemplus Card International | Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module |
WO1997005571A1 (en) * | 1995-08-01 | 1997-02-13 | Austria Card Plastikkarten Und Ausweissysteme Gesellschaft Mbh | Data carrier with a component-containing module and with a coil, method of producing such a data carrier and module therefor |
US20040124540A1 (en) * | 2002-12-30 | 2004-07-01 | Yu-Wen Chen | [flip chip package structure] |
Also Published As
Publication number | Publication date |
---|---|
JP2008511891A (en) | 2008-04-17 |
CN101048789A (en) | 2007-10-03 |
EP1789914A1 (en) | 2007-05-30 |
CN100498830C (en) | 2009-06-10 |
KR20070068354A (en) | 2007-06-29 |
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