WO2006018904A1 - 土壁ボード及び土壁ボードの成形方法 - Google Patents
土壁ボード及び土壁ボードの成形方法 Download PDFInfo
- Publication number
- WO2006018904A1 WO2006018904A1 PCT/JP2004/012507 JP2004012507W WO2006018904A1 WO 2006018904 A1 WO2006018904 A1 WO 2006018904A1 JP 2004012507 W JP2004012507 W JP 2004012507W WO 2006018904 A1 WO2006018904 A1 WO 2006018904A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wall
- adhesive
- earth
- soil
- board
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/06—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B7/00—Moulds; Cores; Mandrels
- B28B7/40—Moulds; Cores; Mandrels characterised by means for modifying the properties of the moulding material
- B28B7/46—Moulds; Cores; Mandrels characterised by means for modifying the properties of the moulding material for humidifying or dehumidifying
- B28B7/465—Applying setting liquid to dry mixtures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B19/00—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B19/00—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica
- B32B19/04—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica next to another layer of the same or of a different material
- B32B19/046—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica next to another layer of the same or of a different material of paper or cardboard
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
- B32B29/04—Layered products comprising a layer of paper or cardboard next to a particulate layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/16—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer formed of particles, e.g. chips, powder or granules
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04C—STRUCTURAL ELEMENTS; BUILDING MATERIALS
- E04C2/00—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels
- E04C2/02—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/03—3 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/025—Particulate layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/12—Mixture of at least two particles made of different materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/716—Degradable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2419/00—Buildings or parts thereof
- B32B2419/04—Tiles for floors or walls
Definitions
- the present invention relates to a board that can be widely used as a building material such as an inner wall material, an outer wall material, and a ceiling material of a building, and more particularly to a novel earth wall board using a wall earth material.
- Patent Document 1 proposes making a soil board in advance at a factory so that it can be carried. This soil board is made by mixing the soil used as the raw material, adding water, mixing and mixing with a mixer, filling it into a mold and drying it.
- this conventional soil board like the painted wall, requires a large amount of water in order to produce the soil that is the raw material by melting it with water and making it into mud. take time.
- the earth board dries and solidifies, the earth shrinks, and it is difficult to form the board into a predetermined dimension. In particular, the thickness variation becomes large.
- Patent Document 1 JP-A-11-350654 Disclosure of the invention
- the present invention has been made to solve the above-described problems of the prior art, and the object of the present invention is to accurately mold a product with a certain size while taking advantage of the characteristics of the earth wall.
- the object is to provide a low cost, recyclable and environmentally friendly earth wall board and a method for forming the earth wall board.
- the invention according to claim 1 is characterized in that a plate-like board body is formed by compressing a granular soil material.
- the wall soil is kneaded in a muddy shape
- the present invention is a material in which the wall soil material is compressed and hardened in a granular state.
- the granular state means an aggregate of powders and grains, and means a state that behaves as a loose granular body in a plasticized form such as a lump of clay or mud. It tends to harden if it has some moisture.
- the invention according to claim 2 is characterized in that the wall body material is hardened with an adhesive and the board body is cured.
- the invention according to claim 3 is characterized in that a binder is mixed in the compressed wall material.
- the invention according to claim 4 is characterized in that a coating material is pasted on the surface of the board body.
- the invention according to claim 5 is characterized in that the adhesive is a water-soluble adhesive.
- the invention according to claim 6 is characterized in that seaweed paste is used as the water-soluble adhesive.
- the invention according to claim 7 is characterized in that the binder is a natural fiber material such as hemp.
- the invention according to claim 8 is characterized in that diatomaceous earth is used as the wall soil material.
- the method for forming a clay wall board according to claim 9 is characterized in that the wall earth material in a granular state is filled into a mold and compressed into a plate shape by compression to mold the board body. .
- the invention according to claim 10 is characterized in that other materials are mixed with the wall soil material in a granular state, kneaded, and then filled into the mold.
- Other materials include binders, aggregates, deodorants, and other additives.
- Empty kneading means mixing in a granular state, and includes mixing without adding water and mixing with a little water. Even if the water is collected, it should not be added until it becomes a lump or mud of clay.
- the invention according to claim 11 is characterized in that after compression molding, an adhesive is infiltrated into the wall soil material constituting the board body and cured.
- the invention according to claim 12 is characterized in that the compression is performed by adding an adhesive to the wall soil material before compression molding.
- the wall soil material may be filled with a liquid adhesive, kneaded and filled into the mold, or as in claim 14. It is also possible to cover the adhesive when the wall soil material is filled in the mold.
- the board itself is made of wall soil, it can be recycled any number of times, saving resources. Moreover, even if it is discarded, it does not have an adverse effect on the environment because it is originally soil.
- the wall body material is compressed in a granular state to form the board body, so that moisture evaporates as in the case of muddy molding. It is possible to form a dimension in the thickness direction that does not shrink due to a constant thickness.
- the wall soil material compressed by the adhesive is tightly coupled, and a board having sufficient strength as a building material for various uses can be realized.
- the invention of claim 3 it is reinforced by mixing the connecting material into the wall soil material, and the occurrence of cracks in the board body can be prevented.
- the covering material by attaching the covering material to the surface of the board main body, it is possible to prevent the soil on the surface from falling off and to further enhance the surface rigidity and the like.
- the viscosity can be adjusted to an optimum value for penetration into the wall soil material by adding water.
- seaweed paste is used as in the invention according to claim 6, it is a natural material, so it is naturally decomposed at the time of disposal and has no environmental impact.
- the binder is a natural fiber material such as hemp, it is decomposed at the time of disposal and does not affect the environment.
- the wall soil material includes diatomaceous earth
- the heat insulating property, the hygroscopic property and the like can be further enhanced.
- the adhesive is infiltrated into the wall soil material constituting the board body after compression molding, the compressed wall soil material is tightly coupled, and is sufficient as a building material for various uses.
- a board with high strength can be realized.
- the adhesive material is uniformly dispersed in the wall soil material. This increases the strength of the board body.
- the adhesive since the adhesive is added when the wall soil material is filled in the formwork, the adhesive is uniformly dispersed in the wall soil material as in claim 13. Can increase the strength of the board body.
- FIG. 1 shows a clay wall board according to an embodiment of the present invention.
- This clay wall board 1 is composed of a powdered wall earth material 2 mixed with a binder 3 and compressed into a plate shape to form a board body 4.
- the covering materials 5, 5 are provided on both sides of the board body 4. It is pasted.
- the compressed earth wall material 2 is hardened by an adhesive, and the strength of the board body 4 is increased by the adhesive. That is, the particles of the wall soil material 2 and the connecting material 3 pressed and compacted by compression are more firmly bonded and fixed by the adhesive, and the strength of the board body 4 is increased.
- FIG. 1 (B) since the adhesive layer 5a between the covering material 5 and the board body 4 cannot be expressed as the adhesive material itself that hardens the described board body 4, no reference numeral is given.
- the board body 4 has a planar quadrangular shape and is formed to a predetermined thickness.
- the thickness of the board body 4 can be set arbitrarily according to the application. For example, it can accommodate the standard sizes of existing plasterboard used for inner wall materials, 9mm and 15mm, and can also be used to form thick boards of about 30mm. If it is a thick board, it can be used as an outer wall material.
- the cross-sectional shape of the board body 4 can be formed into an arbitrary shape. For example, when it is used as a ceiling material, it can be formed into a shape having unevenness 9 as shown in FIG. 1 (C). .
- Rough wall soil such as Arakida soil, intermediate coating soil such as joint soil and powdered soil, jurassic soil, rust Domestic wall soils such as soil, white soil, Inariyama soil, and top coat soil such as shallow yellow soil
- clay soil can be used as wall soil, not only domestic but also foreign soil can be widely used.
- it is pressure-molded in a granular state, it is desirable to have a moderate moisture.
- diatomaceous earth excellent in heat insulation and moisture absorption may be used.
- Aggregate 7 is blended as needed. As aggregate 7, sand, gravel, and various lightweight aggregates can be used. Lightweight aggregates include volcanic rocks, slaked lime, incinerated ash, charcoal, firewood, and cement.
- binder 3 various fibers such as natural fibers such as hemp grass, cocoon grass and paper grass, and synthetic fibers such as rock wool and glass fibers can be used. A fiber is preferred. In particular, hemp suspension such as Manila hemp is preferable in terms of strength. Further, as the additive 8, a deodorant such as activated carbon, a fragrance material, a waterproof material or the like can be mixed.
- a deodorant such as activated carbon, a fragrance material, a waterproof material or the like can be mixed.
- the adhesive various kinds of glue such as seaweed glue, starch glue, etc. used for soil walls, or synthetic glue can be used.
- seaweed paste Kakumata, Ginkgo grass, Funari, etc. can be applied, and in particular, fungi are suitable.
- synthetic resins such as methyl cellulose (MC), polybutyl alcohol, carboxyl methyl cellulose, and emulsion can be used.
- the covering materials 5 and 5 have a function of protecting the surface of the board body 4 and enhancing the rigidity, and paper materials, synthetic resin films, etc. can be used.
- the paper materials Is preferred.
- various paper materials such as Japanese paper and cardboard can be used. When used for fire resistance, flame retardant paper and non-combustible paper are used.
- synthetic resin can be used as long as it is breathable and biodegradable.
- Various adhesives can be used as the adhesive for attaching the covering material 5 in the same manner as the adhesive for hardening the board body 4, but seaweed paste is preferable in consideration of air permeability and environmental measures.
- FIG. 2 shows an example of a method for forming the earth wall board.
- the binder 3 is put into the wall material 2 in a granular state in the mixer 20 and mixed with stirring. Aggregate 7, additive 8, etc. are mixed as appropriate.
- Empty kneading means mixing in a granular state, including mixing without adding water and mixing with some water. In the present embodiment, a slight amount of water is added to give a slight moisture. The one that gets harder when it gets wet. However, the amount of water should be such that the powdered state is maintained without adding it until it becomes a lump or mud of plasticized clay.
- the filling step as shown in FIG. 2 (B), the wall material 2 that has been kneaded is filled into the mold 10. The filled wall material 2 is scraped off on the upper surface of the mold 10.
- a bottom plate 12 is provided in the mold 10 so as to be relatively movable up and down, and a filling amount (filling depth) is set at the position of the bottom plate 12.
- the pressing plate 11 compresses and compresses with a predetermined pressure.
- the applied pressure is determined according to the material, application, etc., but it is preferable to compress to about half the filling depth. Due to the compression, the granule and the connecting material 3 constituting the wall soil material 2 are intimately bonded together. If the compression density is increased, the contact area between the particles increases and the particles are firmly fixed.
- the base plate 4 is released from the mold 10 by relatively pushing up the bottom plate 12 (see FIG. 2 (C)).
- the infiltration process of the adhesive 6 is performed by spraying the adhesive 6 on the upper surface of the board body 4 as shown in FIGS. 3 (A) and 1 (C).
- the sprayed adhesive 6 penetrates into the fine gaps in the grain structure of the compressed wall soil material 2 and the micropores in the soil grain and reaches the inside of the board body 4 (cross-hatched portion L in the figure).
- the concentration is low.
- the concentration is too low, the strength decreases as the binding strength of the paste is weakened. Therefore, it is preferable to reduce the concentration as much as possible to obtain the desired strength.
- FIGS. 4 (A) to (C) after spraying on one side, it may be reversed and sprayed on the other side, or as shown in FIG. 4 (D).
- the board body 4 may be vertically sprayed from the left and right at the same time, or may be sprayed simultaneously from both the top and bottom as shown in FIG. 4 (E).
- the process of filling, compressing, and infiltrating the soil layer with a thickness that allows the adhesive 6 to penetrate is repeated in the mold 10 to increase the thickness.
- the adhesive 6 is naturally dried or forcibly dried as shown in FIG. 2 (F). Moisture evaporates and solidifies from the adhesive 6 that has penetrated into the fine gaps, and the soil grain structure of the compressed wall soil material 2 is three-dimensionally joined to form a strong structure. The adhesive 6 that has entered the fine gap shrinks when dried and solidified, and the fine gap is not blocked.
- water-soluble adhesives such as seaweed paste that leave fine gaps to evaporate and dry and solidify are suitable for taking advantage of the characteristics of the earth wall.
- air permeability is not particularly required, so it is effective to use a quick-drying resin-based adhesive rather than a water-soluble adhesive such as seaweed paste, which takes time to dry and solidify. It is.
- the covering material 5 is attached to both the front and back surfaces of the board body 4 with an adhesive, and the soil as shown in FIG. 2 (H) is obtained.
- Wall board 1 is completed.
- an adhesive material is selected for the covering material 5 according to the material.
- the adhesive 6 that has penetrated into the interior can be used, before the drying process of the adhesive 6, the covering material 5 is adhered using the liquid adhesive adhering to the surface. Let it dry and solidify in a bonded state.
- the wall soil material 2 As the wall soil material 2, an intermediate coating was used, and a sample having a thickness of about 15 mm was prepared.
- a glue with a very low concentration as the adhesive spraying the glue from the upper surface of the sample, the glue passes through the inside of the board body and penetrates to the lower surface, and the dried sample board is more than the plaster board. A hard thing was made.
- the molding process described above is an embodiment of the method for molding a clay wall board of the present invention, and can be molded by various other molding processes.
- FIG. 5 shows another embodiment of a method for forming a clay wall board according to the present invention.
- the adhesive 6 is added to the wall soil material 2 at the stage before the compression molding of the board body 4. It is what you do.
- the adhesive is added in the air kneading process by adding the adhesive 6 together with the binder 3, aggregate 7 and additive 8 to the wall material 2 in the granular state. , Mix.
- seaweed paste such as Funori is suitable, and instead of adding water, an aqueous solution of seaweed paste is added and air-kneaded.
- the adhesive material is added to the falling wall soil material 2, the binder material 3, the aggregate material 7, the various additive materials 8, and the mist from the nozzle 21 as shown in Fig. 5 (B). It is only necessary to spray the adhesive material in a shape, and attach the adhesive material to the raw material to fill the mold 10.
- the raw material including the filled wall material 2 is compressed to form the board body 4 (Fig. 5 (C)), and then released to dry and solidify the adhesive (Fig. 5 (D),)).
- the earthen board is completed by applying the covering material 5 (Fig. 5 (F), (G)).
- FIG. 6 shows still another embodiment of a method for forming a clay wall board according to the present invention.
- the covering material is pasted after the board body is molded.
- the covering material 5 is previously laid on the bottom plate in the mold, and this covering material is used. 5 is filled with wall material 2 (Fig. 6 (C)) and compressed (Fig. 6 (D)).
- the adhesive 6 that hardens the wall soil material 2 may be added after compression molding as in the first embodiment, or may be added before compression molding as in the second embodiment, but in the illustrated example, before the compression molding. An example is shown (Fig. 6 (A)).
- the covering material 5 is bonded to the lower surface of the board body 4, and the covering board 5 is completed by attaching the covering material 5 to the upper surface of the board body 4 (Fig. 6 (F), (G) ).
- the covering material 5 in the mold 10 and the board body 4 are bonded together by an adhesive 6 attached to the wall soil material 2.
- an adhesive 6 attached to the wall soil material 2.
- an adhesive may be applied to the covering material 5 in advance.
- the binder 3 is mixed with the wall soil material 2 and compressed, and is solidified with the adhesive 6 so that the board body 4 is configured. It is also possible to compress and harden only the wall soil material 2 with la. Further, even when the adhesive 6 is used, the adhesive 6 may not be penetrated over the entire thickness, but may be from the surface to a predetermined depth.
- the board body 4 can be constructed by simply compressing and pressing the wall material 2 without using the adhesive 6. In this case as well, it is possible to use only the wall soil material 2 or to mix the wall material 2 with the connecting material 3. In either case, aggregates and additives are added as necessary.
- the covering material 5 may be attached to both the front and back surfaces of the board body 4, or only one surface may be used, or the covering material may be omitted.
- a core material may be embedded inside.
- FIG. 1 shows a clay wall board according to an embodiment of the present invention.
- FIG. 1 (A) is a schematic exploded perspective view
- FIG. 1 (B) is an enlarged sectional view of a main part.
- FIG. 3C is an enlarged cross-sectional view of the main part in a form in which irregularities are formed on the surface.
- FIG. 2 (A) to (H) are diagrams schematically showing an example of a forming step of a method for forming a clay wall board according to Embodiment 1 of the present invention.
- FIG. 3 (A) to (C) are diagrams schematically showing adhesive penetration penetration in FIG.
- FIGS. 4A to 4K are diagrams showing various methods of adding an adhesive to a thick board body.
- FIGS. 5 (A) to (G) are explanatory views schematically showing a forming step of a method for forming a clay wall board according to Embodiment 2 of the present invention.
- 6 (A) to 6 (G) are explanatory views schematically showing a forming process of a method for forming a clay wall board according to Embodiment 3 of the present invention.
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Abstract
Description
Claims
Applications Claiming Priority (2)
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JP2004239976 | 2004-08-19 | ||
JP2004-239976 | 2004-08-19 |
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WO2006018904A1 true WO2006018904A1 (ja) | 2006-02-23 |
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PCT/JP2004/012507 WO2006018904A1 (ja) | 2004-08-19 | 2004-08-31 | 土壁ボード及び土壁ボードの成形方法 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009256897A (ja) * | 2008-04-14 | 2009-11-05 | Meisei Fudosan Kk | 籾殻炭利用の建築材とその製造方法 |
WO2010054029A2 (en) * | 2008-11-04 | 2010-05-14 | Ashtech Industries, L.L.C. | Utility materials incorporating a microparticle matrix formed with a setting system |
US8997924B2 (en) | 2007-03-21 | 2015-04-07 | Ashtech Industries, Llc | Utility materials incorporating a microparticle matrix |
US9076428B2 (en) | 2007-03-21 | 2015-07-07 | Ashtech Industries, Llc | Sound attenuation building material and system |
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JPH08267439A (ja) * | 1995-03-31 | 1996-10-15 | Matsushita Electric Works Ltd | 無機質セメント板の製造方法 |
JPH1081559A (ja) * | 1996-08-30 | 1998-03-31 | Shine Kk | 土壁原料並びに土壁接合板及び土壁パネル板と焼成 その製造方法。 |
JP2001300925A (ja) * | 2000-04-25 | 2001-10-30 | Kenzai Gijutsu Kenkyusho:Kk | 化粧板材の製造方法 |
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2004
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Patent Citations (3)
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JPH08267439A (ja) * | 1995-03-31 | 1996-10-15 | Matsushita Electric Works Ltd | 無機質セメント板の製造方法 |
JPH1081559A (ja) * | 1996-08-30 | 1998-03-31 | Shine Kk | 土壁原料並びに土壁接合板及び土壁パネル板と焼成 その製造方法。 |
JP2001300925A (ja) * | 2000-04-25 | 2001-10-30 | Kenzai Gijutsu Kenkyusho:Kk | 化粧板材の製造方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8997924B2 (en) | 2007-03-21 | 2015-04-07 | Ashtech Industries, Llc | Utility materials incorporating a microparticle matrix |
US9076428B2 (en) | 2007-03-21 | 2015-07-07 | Ashtech Industries, Llc | Sound attenuation building material and system |
JP2009256897A (ja) * | 2008-04-14 | 2009-11-05 | Meisei Fudosan Kk | 籾殻炭利用の建築材とその製造方法 |
WO2010054029A2 (en) * | 2008-11-04 | 2010-05-14 | Ashtech Industries, L.L.C. | Utility materials incorporating a microparticle matrix formed with a setting system |
WO2010054029A3 (en) * | 2008-11-04 | 2010-08-26 | Ashtech Industries, L.L.C. | Utility materials incorporating a microparticle matrix formed with a setting system |
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