WO2006011522A1 - 発光モジュールおよびその製造方法 - Google Patents
発光モジュールおよびその製造方法 Download PDFInfo
- Publication number
- WO2006011522A1 WO2006011522A1 PCT/JP2005/013752 JP2005013752W WO2006011522A1 WO 2006011522 A1 WO2006011522 A1 WO 2006011522A1 JP 2005013752 W JP2005013752 W JP 2005013752W WO 2006011522 A1 WO2006011522 A1 WO 2006011522A1
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- WO
- WIPO (PCT)
- Prior art keywords
- light emitting
- substrate
- emitting module
- conductive
- module according
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 116
- 238000000034 method Methods 0.000 claims abstract description 31
- 239000011521 glass Substances 0.000 claims abstract description 21
- 239000010410 layer Substances 0.000 claims description 56
- 239000012790 adhesive layer Substances 0.000 claims description 37
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 26
- 239000011888 foil Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 17
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 238000005530 etching Methods 0.000 claims description 8
- 239000004033 plastic Substances 0.000 claims description 8
- 229920003023 plastic Polymers 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000006071 cream Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 238000007740 vapor deposition Methods 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 28
- 229910052709 silver Inorganic materials 0.000 abstract description 26
- 239000004332 silver Substances 0.000 abstract description 26
- 238000007650 screen-printing Methods 0.000 abstract description 8
- 239000010408 film Substances 0.000 description 27
- 229920000139 polyethylene terephthalate Polymers 0.000 description 9
- 239000005020 polyethylene terephthalate Substances 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 238000007639 printing Methods 0.000 description 5
- 229920000515 polycarbonate Polymers 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- BAUGPFZKDROCKT-UHFFFAOYSA-N butyl acetate;ethene Chemical compound C=C.CCCCOC(C)=O BAUGPFZKDROCKT-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920006290 polyethylene naphthalate film Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 108700024661 strong silver Proteins 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10165—Functional features of the laminated safety glass or glazing
- B32B17/10541—Functional features of the laminated safety glass or glazing comprising a light source or a light guide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
- B32B17/10018—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising only one glass sheet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
- B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10788—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing ethylene vinylacetate
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2367/00—Polyesters, e.g. PET, i.e. polyethylene terephthalate
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Definitions
- the present invention relates to a light emitting module and a method for manufacturing the same, and more particularly, for example, large lighting such as small lighting or wall lighting combined with solar cells or other batteries, guide signs, warning lights, etc.
- the present invention relates to a light emitting module that can be used in a light emitting device and a method for manufacturing the same.
- a metal substrate is used as a base material, and the base material is insulated with an insulating layer, and then a circuit pattern is formed.
- a type that mounts (LED) and a type that mounts LEDs by forming a circuit pattern based on a glass epoxy substrate that does not transmit visible light, as described in Patent Document 2. Mainstream.
- Patent Document 1 JP 2000-31546 A
- Patent Document 2 JP 2001-351418 A
- the light emitting modules described in Patent Document 1 and Patent Document 2 have substrates determined and are formed only by their respective manufacturing methods.
- when mounting a chip LED it is generally mounted using cream solder, and heat resistance is required. Therefore, the type of substrate to be mounted is limited, and further, the chip is mounted. It was necessary to use a reinforcing material to reinforce the LED.
- the object of the present invention is to solve such problems of the prior art, and can transmit visible light, have high reliability, have excellent durability, and reflectivity depending on the intended use.
- Light emitting modules that can flexibly support a wide range of applications, such as It is to provide a manufacturing method capable of easily manufacturing such a light emitting module.
- a conductive layer, a conductive adhesive layer, a predetermined number of light-emitting element groups, a transparent adhesive layer, and a light-transmitting property are formed on a first substrate having an insulating property.
- a light emitting module comprising a structure in which a second substrate is sequentially stacked, and a conductive layer having a circuit pattern for causing a light emitting element group to emit light.
- the conductive adhesive layer electrically connects the circuit pattern and the light emitting element group.
- At least one conductive layer, a conductive adhesive layer, and a predetermined number of light emitting element groups are sequentially stacked on the insulating first substrate.
- a light emitting module is provided in which a body is sandwiched between a second substrate having translucency and a third substrate via an adhesive layer.
- a plurality of structures in which at least a conductive layer, a conductive adhesive layer, and a predetermined number of light emitting element groups are sequentially stacked on a first substrate having an insulating property.
- a light emitting module characterized in that a body is connected to each other in a planar manner and is sandwiched between an optically transparent second substrate and a third substrate via an adhesive layer, respectively.
- the circuit pattern of the conductive layer is formed by printing or applying a conductive paste on the first substrate in a predetermined pattern, and then thermally curing the paste.
- a method for manufacturing a light emitting module is provided.
- a method for manufacturing a light emitting module according to the first, second, or third aspect of the present invention, wherein a metal foil is bonded onto a first substrate with an adhesive. Laminate, apply a resist material on this metal foil, then expose and develop in a predetermined pattern, remove unnecessary parts by etching, and then remove the resist material, thereby removing the circuit pattern of the conductive layer.
- a method for manufacturing a light emitting module is provided.
- a method for manufacturing a light emitting module according to the first, second or third aspect of the present invention, wherein a metal film is deposited or sputtered on a first substrate. Then, a resist material is applied on the metal film, and then exposed in a predetermined pattern.
- a method for manufacturing a light emitting module characterized in that a circuit pattern of a conductive layer is obtained by developing, removing unnecessary portions by etching, and then removing a resist material.
- a seventh aspect of the present invention there is provided a method for manufacturing a light emitting module according to the first, second or third aspect of the present invention, wherein the light emitting element group is formed into a conductive layer by a conductive adhesive layer.
- a predetermined pattern of a conductive adhesive layer is formed on the first substrate with a conductive paste for bonding, a light emitting element group is mounted on the same pattern, and then the paste is thermally cured.
- a method for manufacturing a light emitting module according to the first, second or third aspect of the present invention, wherein the light emitting element group is formed into a conductive layer by a conductive adhesive layer.
- a predetermined pattern of a conductive adhesive layer is formed on the first substrate with cream solder, a light emitting element group is mounted on the pattern, and then heat treatment is performed in a reflow furnace.
- a method of manufacturing a featured light emitting module is provided.
- a light emitting device comprising the light emitting module according to the first, second or third aspect of the present invention and a solar cell.
- visible light can be transmitted, reliability is high, durability is excellent, and reflection performance is improved depending on the intended use. For example, it can flexibly handle a wide range of applications.
- the light-transmitting light-emitting element module having high reliability is obtained. Can be obtained.
- the light emitting module according to the third aspect of the present invention it is possible to obtain a light emitting module having a large area.
- a conductive paste such as a silver paste that can be cured at a temperature of 150 ° C or lower is used as the first substrate.
- a cost-effective PET (polyethylene terephthalate) film can be used, and a circuit pattern can be formed on the first substrate.
- the first substrate Even when a glass substrate or the like is used, a material having good adhesion between the first substrate and the conductive layer can be obtained by changing the type of the conductive paste.
- a circuit pattern can be easily formed on a substrate that can withstand the etching chemical used.
- a circuit pattern can be easily formed on a substrate that can withstand the etching chemical used.
- a conductive paste such as a silver paste that can be cured at a temperature of 150 ° C or lower is used as the first substrate.
- a PET film that is particularly advantageous, and the issuing element group can be mounted on the circuit pattern formed on the first substrate.
- a conductive paste having good adhesion can be used as the conductive paste for bonding the conductive adhesive layer.
- a first substrate that can withstand a reflow process such as glass or polyimide film
- the light emitting element group is used.
- the conductive film which is a circuit pattern are further improved, and a light-emitting element module can be provided with high reliability and high reliability.
- the light emitting module according to the ninth aspect of the present invention it is possible to realize a light emitting device having the above-described characteristic effects produced by the light emitting module.
- FIG. 1 is a schematic plan view schematically showing one light emitting module according to the present invention.
- FIG. 2 is a cross-sectional view taken along line A—A ′ of FIG.
- FIG. 3 is a plan view showing a circuit pattern necessary for connecting the light emitting element groups.
- FIG. 4 is another diagram according to the present invention. It is a schematic sectional drawing which shows typically the light emitting module.
- FIG. 5 is a schematic plan view schematically showing still another light emitting module according to the present invention.
- FIG. 6 is a cross-sectional view taken along the line CC ′ and a cross-sectional view taken along the line DD ′ of FIG.
- the first substrate and the second substrate have a film, glass substrate, or plastic substrate force.
- a light emitting module having a wide range of usage can be provided.
- the first substrate and the second substrate have a thickness of, for example, about 0.1 to about LOmm and have a glass plate or plastic plate force.
- the conductive layer has a conductive paste and a metal foil. Or it may consist of a metal film. In this case, a light emitting module having a wide range of usage can be easily provided.
- the metal foil or metal film is preferably a foil or film made of silver, aluminum, gold, copper, etc. with a thickness of about 0.01 mm to 0.1 mm. It is necessary to select it in consideration of the cost, the type of the first board, and so on.
- the first substrate may have a film strength
- the film may have a metal foil layer or a metal film layer inside.
- the film having the laminated structure needs to be transparent on the light emitting element side.
- films include PET films and PEN (polyethylene naphthalate) films.
- the metal foil layer or metal film layer herein include a foil layer or a film layer having a strength of about 7 to 20 / ⁇ ⁇ , such as aluminum and silver.
- the circuit pattern of the light emitting module according to the first aspect of the present invention is preferably a pattern in which a plurality of rows of light emitting element groups connected in series are further connected in parallel.
- the light emitting element group can emit light in a scattered pattern easily and surely.
- the transparent adhesive layer also has a low-temperature cross-linking EVA (ethylene butyl acetate) force capable of cross-linking at, for example, about 100 ° C to about 130 ° C. Yes.
- EVA ethylene butyl acetate
- a plastic substrate having a low heat resistance temperature such as polycarbonate can be used for the first substrate and the second substrate.
- the third substrate is made of a film, a glass substrate or a plastic substrate.
- a light emitting module having a wide range of usage can be provided.
- the first substrate and the second substrate have a thickness of, for example, about 0.1 to about LOmm and have a glass plate or plastic plate force.
- a reflective layer covering the entire surface or a part of the surface of the third substrate is provided between the third substrate and the adhesive layer. May be. In this case, it is possible to adopt a structure in which the light emitted from the light emitting element group and leaked to the first substrate side can be reflected by the reflective layer.
- Embodiment 1 will be described with reference to FIGS. 1 to 3.
- a glass substrate having a thickness of 1.8 mm was used as the first substrate 1 having an insulating property.
- the first substrate 1 can be a plastic substrate or a film, and can be selected in consideration of the intended use and the form of use.
- a light transmissive insulating substrate is used as the first substrate.
- the first substrate use a glass substrate, a PET substrate, a polycarbonate (PC) substrate, or the like that transmits light.
- PC polycarbonate
- the first substrate 1 a three-layer film sandwiched between aluminum foils such as PET / A1 / PET can also be used. If light transmission is required, use a glass substrate, fluorine film, or glass fiber laminated film.
- a circuit pattern 10 as shown in FIG. 1 was formed.
- a silver paste which is a conductive paste for circuit formation was used.
- Silver paste was printed by screen printing to obtain a printing thickness of 50 m. Thereafter, the silver paste was thermally cured at a temperature of 150 ° C. for 30 minutes.
- the silver paste is composed of at least silver powder as a filler, a resin as a binder, and solvent power.
- the noinda can be made of polyester, phenol, epoxy, or a mixture thereof, and the first substrate 1 and In consideration of the adhesiveness and shrinkage of the resin, it is appropriately selected.
- the conductive adhesive silver paste as the conductive adhesive layer 3 was printed on the land patterns 2 2 and 22 at both ends of the gap 23 in the circuit pattern 10 as shown in FIG. 3 by screen printing.
- the strong silver paste using the printing process may be applied using a dispenser or the like.
- either method can be selected in consideration of the stability of the adhesive.
- cream solder may be used as the conductive layer 2 in order to improve the adhesion with the chip LED 4.
- the solder paste may be printed on the land patterns 22 and 22 by the screen printing method, and the chip LED 4 may be mounted, passed through a reflow furnace, and bonded.
- an EVA layer was used as the transparent adhesive layer 5.
- a glass plate having a thickness of 4.0 mm was used as the second substrate 6 having translucency.
- the EVA layer 5 for bonding the first board 1 and the second board 6 holds the EVA body, which is thicker than the chip LED4 height, at a temperature of 130 ° C for 20 minutes to protect the chip LED4. After the EVA body is melted, the EVA body is held at a temperature of 150 ° C for 45 minutes to crosslink the EVA.
- the light emitting module manufactured as described above has excellent reliability.
- a light-emitting module since it transmits light, installing a light-emitting module on the opposite side of the light-receiving surface of a daylighting solar cell or a see-through solar cell will not interfere with daylighting. Even if it is installed on the back side of a glass plate or polycarbonate plate for daytime light removal in an arcade or a route, it does not interfere with daylighting. Therefore, a highly reliable light transmissive light emitting module that can sufficiently withstand outdoor use can be provided by a simple manufacturing method. Further, the light emitting module of the present invention uses the chip LED 4 to move from the gap 23 of the circuit pattern 10 formed of a conductive paste or the like to the side of the second substrate 6 having translucency.
- the double-sided power illuminant can be visually recognized by the light emitted from the light source or the reflected light from the first substrate 1, so the road center band warning light or the road side belt warning light, the road side band illumination at the road corner, etc. It becomes possible to use for.
- the first substrate 1 is a three-layer film in which a black PET layer (thickness 50 ⁇ m) / AIM (thickness 7 m) / white PET layer (thickness 50 ⁇ m) is laminated from the outside to the inside. Using. Then, a circuit pattern 10 as shown in FIG. 3 was formed.
- an aluminum foil was used as the conductive layer 2.
- about 10 m of aluminum foil is adhered to both sides of PET with an adhesive, and a resist material (photosensitive film) is adhered, exposed with a predetermined pattern, developed, and then etched to remove the resist material.
- a desired circuit pattern 10 was obtained.
- an aluminum foil is used here, but another metal foil such as a copper foil or a silver foil may be used. It is necessary to make an appropriate selection according to the intended use and considering the appearance.
- a salty ferric solution or the like can be used in the case of an aluminum foil, and a phosphoric acid-based etching solution or the like can be used in the case of a copper foil.
- the metal foil is bonded with an adhesive, but the conductive layer 2 which is a metal film may be formed by sputtering or vapor deposition.
- a conductive adhesive silver paste as a conductive adhesive layer 3 was printed on the land patterns 22 and 22 at both ends of the gap 23 by a screen printing method.
- the silver paste may be applied using a dispenser or the like. Depending on the physical properties of the conductive adhesive silver paste used, either method can be selected in consideration of the stability of the adhesive.
- the two poles of the chip LED4 are made of silver paste printed on the land patterns 22 and 22 at both ends of the gap 23 so that the circuit pattern 10 is not insulated by the gap 23. It mounted using the mounter so that it might conduct
- an EVA layer was used as the transparent adhesive layer 5, an EVA layer was used.
- the second substrate 6 having translucency is shown in FIG.
- a 4.2 mm thick glass plate, which is a curved substrate 61 was used.
- the EVA layer 5 for bonding the three-layer film which is the first substrate 1 and the curved substrate 61 which is the second substrate 6 is an EVA body thicker than the height of the chip LED 4 in order to protect the chip LED 4. It is formed by sandwiching and holding at a temperature of 140 ° C for 20 minutes, melting the EVA body, holding at a temperature of 150 ° C for 45 minutes, and crosslinking the EVA.
- a polycarbonate substrate is used as the curved substrate 61 of the second substrate 6, an EVA that crosslinks at a low temperature of about 100 ° C to 130 ° C may be used.
- a film such as a fluorine-based film is used as the second substrate 6, a moisture-proof coating material is applied to protect the conductive layer 2 and the conductive adhesive layer 4 in order to transmit moisture. There is a need. Depending on the place of use, it is necessary to add an ultraviolet absorber or the like.
- a flexible light emitting module that can be wound around a cylindrical object can be provided.
- Embodiment 3 will be described with reference to FIGS. 1 to 3, FIG. 5, and FIG.
- the first substrate 1 four rectangular PET sheets (sheet size: 268 mm X 300 mm) having a thickness of 188 ⁇ m were used.
- a circuit pattern 10 as shown in FIG. 3 was formed on each first substrate 1.
- the conductive layer 2 a silver paste for circuit formation was used. Silver paste was printed by screen printing to a printing thickness of 50 m. Thereafter, it was cured at a temperature of 150 ° C. for 30 minutes.
- a conductive adhesive silver paste as the conductive adhesive layer 3 was printed on the land patterns 22 and 22 at both ends of the gap 23 by a screen printing method.
- the chip LED4 as the light emitting element
- the conductive adhesive silver paste printed on the land patterns 22 and 22 on both ends of the gap 23 the both sides of the chip LED4 are used so that the circuit pattern 10 is not insulated in the gap 23. It mounted using the mounter so that it might conduct
- thermosetting was performed at a temperature of 150 ° C. for 10 minutes, the chip LED 4 was adhered, and a structure 111 as shown in FIGS. 5 and 6 was produced.
- a 4.0 mm thick glass substrate (substrate size: 560 mm)
- an EVA layer was formed as the adhesive layer 8.
- structure 111 4 The sheets 111 were arranged in a plane and the structures 111 were connected by wiring 7. Furthermore, an EVA layer as an adhesive layer 5 was formed thereon. In other words, sandwich the EV A layer 8 thicker than the chip LED4, and place a 4.0mm thick glass as the second insulating substrate 6 on it, hold it at a temperature of 130 ° C for 20 minutes, EVA After melting, the EVA was crosslinked at a temperature of 150 ° C for 45 minutes to crosslink the EVA.
- the light emitting module manufactured as described above can emit light in a dotted pattern with a large area by a simple method, and has excellent reliability.
- the combination of the first substrate 1, the second substrate 6, and the third substrate 9 it is possible to provide a large-area light emitting module suitable for various applications.
- the light-emitting module of the present invention can be widely applied to light-emitting devices such as small-sized or large-sized lighting or guide signs in combination with solar cells or other batteries.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/658,309 US20080284330A1 (en) | 2004-07-28 | 2005-07-27 | Light Emitting Module, and Method for Producing the Same |
EP05767394.9A EP1788640A4 (en) | 2004-07-28 | 2005-07-27 | Light-emitting module and manufacturing method therefor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-220850 | 2004-07-28 | ||
JP2004220850A JP4031784B2 (ja) | 2004-07-28 | 2004-07-28 | 発光モジュールおよびその製造方法 |
Publications (1)
Publication Number | Publication Date |
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WO2006011522A1 true WO2006011522A1 (ja) | 2006-02-02 |
Family
ID=35786272
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/013752 WO2006011522A1 (ja) | 2004-07-28 | 2005-07-27 | 発光モジュールおよびその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20080284330A1 (ja) |
EP (1) | EP1788640A4 (ja) |
JP (1) | JP4031784B2 (ja) |
WO (1) | WO2006011522A1 (ja) |
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Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6149482A (ja) * | 1984-08-17 | 1986-03-11 | Sanyo Electric Co Ltd | 光起電力装置 |
JPH0343687U (ja) * | 1989-09-06 | 1991-04-24 | ||
JP2001274463A (ja) * | 2000-02-23 | 2001-10-05 | Vishay Semiconductor Gmbh | 半導体電子素子の製造方法 |
JP2001351418A (ja) * | 2000-06-07 | 2001-12-21 | Showa Shell Sekiyu Kk | 太陽光発電利用発光モジュール |
JP2003133482A (ja) * | 2001-10-24 | 2003-05-09 | Rohm Co Ltd | チップ部品およびその製造方法 |
JP2003242804A (ja) * | 2002-02-14 | 2003-08-29 | Aatekku International:Kk | 表示用光源装置 |
JP2003303504A (ja) * | 2002-04-10 | 2003-10-24 | Meiji Natl Ind Co Ltd | 発光ダイオードを用いた照明器具 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3757511A (en) * | 1971-05-17 | 1973-09-11 | Motorola Inc | Light emitting diode display for electronic timepiece |
US4845405A (en) * | 1986-05-14 | 1989-07-04 | Sanyo Electric Co., Ltd. | Monolithic LED display |
JP2994219B2 (ja) * | 1994-05-24 | 1999-12-27 | シャープ株式会社 | 半導体デバイスの製造方法 |
JP3694085B2 (ja) * | 1996-02-27 | 2005-09-14 | ローム株式会社 | 面発光照明装置 |
JP2002299694A (ja) * | 2001-03-29 | 2002-10-11 | Mitsubishi Electric Lighting Corp | 照明用led光源デバイス及び照明器具 |
JP4113118B2 (ja) * | 2001-08-13 | 2008-07-09 | 仗祐 中田 | 半導体デバイス及びその製造方法 |
GB0216787D0 (en) * | 2002-07-19 | 2002-08-28 | Pilkington Plc | Laminated glazing panel |
US7084935B2 (en) * | 2002-08-28 | 2006-08-01 | Adaptive Micro Systems, Llc | Display device with molded light guide |
JP2004127135A (ja) * | 2002-10-04 | 2004-04-22 | Konica Minolta Holdings Inc | 認証識別カード及び認証識別カードの製造方法 |
JP3862723B2 (ja) * | 2002-10-25 | 2006-12-27 | 森山産業株式会社 | 発光モジュール |
BE1015302A3 (fr) * | 2003-01-10 | 2005-01-11 | Glaverbel | Vitrage comportant des composants electroniques. |
US7380690B2 (en) * | 2003-01-17 | 2008-06-03 | Ricoh Company, Ltd. | Solution jet type fabrication apparatus, method, solution containing fine particles, wiring pattern substrate, device substrate |
US6871982B2 (en) * | 2003-01-24 | 2005-03-29 | Digital Optics International Corporation | High-density illumination system |
US20060043382A1 (en) * | 2003-02-07 | 2006-03-02 | Nobuyuki Matsui | Metal base wiring board for retaining light emitting elements, light emitting source, lightning apparatus, and display apparatus |
JP4607429B2 (ja) * | 2003-03-25 | 2011-01-05 | 東レ・ダウコーニング株式会社 | 半導体装置の製造方法および半導体装置 |
JP4135565B2 (ja) * | 2003-06-06 | 2008-08-20 | 松下電器産業株式会社 | 電子回路装置およびその製造方法 |
DE102004034166B4 (de) * | 2003-07-17 | 2015-08-20 | Toyoda Gosei Co., Ltd. | Lichtemittierende Vorrichtung |
US20050116235A1 (en) * | 2003-12-02 | 2005-06-02 | Schultz John C. | Illumination assembly |
US6881980B1 (en) * | 2004-06-17 | 2005-04-19 | Chunghwa Picture Tubes, Ltd. | Package structure of light emitting diode |
-
2004
- 2004-07-28 JP JP2004220850A patent/JP4031784B2/ja not_active Expired - Fee Related
-
2005
- 2005-07-27 US US11/658,309 patent/US20080284330A1/en not_active Abandoned
- 2005-07-27 EP EP05767394.9A patent/EP1788640A4/en not_active Withdrawn
- 2005-07-27 WO PCT/JP2005/013752 patent/WO2006011522A1/ja active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6149482A (ja) * | 1984-08-17 | 1986-03-11 | Sanyo Electric Co Ltd | 光起電力装置 |
JPH0343687U (ja) * | 1989-09-06 | 1991-04-24 | ||
JP2001274463A (ja) * | 2000-02-23 | 2001-10-05 | Vishay Semiconductor Gmbh | 半導体電子素子の製造方法 |
JP2001351418A (ja) * | 2000-06-07 | 2001-12-21 | Showa Shell Sekiyu Kk | 太陽光発電利用発光モジュール |
JP2003133482A (ja) * | 2001-10-24 | 2003-05-09 | Rohm Co Ltd | チップ部品およびその製造方法 |
JP2003242804A (ja) * | 2002-02-14 | 2003-08-29 | Aatekku International:Kk | 表示用光源装置 |
JP2003303504A (ja) * | 2002-04-10 | 2003-10-24 | Meiji Natl Ind Co Ltd | 発光ダイオードを用いた照明器具 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017504171A (ja) * | 2014-01-27 | 2017-02-02 | 上海三思▲電▼子工程有限公司Shanghai Sansi Electronic Engineering Co.,Ltd. | Led照明装置 |
US20210384394A1 (en) * | 2019-11-27 | 2021-12-09 | Avary Holding (Shenzhen) Co., Limited. | Multi-sided light-emitting circuit board and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
EP1788640A1 (en) | 2007-05-23 |
JP4031784B2 (ja) | 2008-01-09 |
EP1788640A4 (en) | 2014-07-23 |
JP2006041290A (ja) | 2006-02-09 |
US20080284330A1 (en) | 2008-11-20 |
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