WO2006010822A3 - Dispositifs de refroidissement perfectionnes pour applications diverses - Google Patents

Dispositifs de refroidissement perfectionnes pour applications diverses Download PDF

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Publication number
WO2006010822A3
WO2006010822A3 PCT/FR2005/001586 FR2005001586W WO2006010822A3 WO 2006010822 A3 WO2006010822 A3 WO 2006010822A3 FR 2005001586 W FR2005001586 W FR 2005001586W WO 2006010822 A3 WO2006010822 A3 WO 2006010822A3
Authority
WO
WIPO (PCT)
Prior art keywords
mini
manifolds
radiator
heater
different applications
Prior art date
Application number
PCT/FR2005/001586
Other languages
English (en)
Other versions
WO2006010822A2 (fr
WO2006010822B1 (fr
Inventor
Jean Paul Domen
Original Assignee
Technologies De L Echange Ther
Jean Paul Domen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR0406911A external-priority patent/FR2872265A1/fr
Priority claimed from FR0411122A external-priority patent/FR2872266A1/fr
Priority claimed from FR0413932A external-priority patent/FR2880107B1/fr
Application filed by Technologies De L Echange Ther, Jean Paul Domen filed Critical Technologies De L Echange Ther
Priority to EP05778868A priority Critical patent/EP1766682A2/fr
Priority to US11/571,210 priority patent/US20070184320A1/en
Publication of WO2006010822A2 publication Critical patent/WO2006010822A2/fr
Publication of WO2006010822A3 publication Critical patent/WO2006010822A3/fr
Publication of WO2006010822B1 publication Critical patent/WO2006010822B1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01P—COOLING OF MACHINES OR ENGINES IN GENERAL; COOLING OF INTERNAL-COMBUSTION ENGINES
    • F01P3/00—Liquid cooling
    • F01P3/20—Cooling circuits not specific to a single part of engine or machine
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02M—SUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
    • F02M26/00—Engine-pertinent apparatus for adding exhaust gases to combustion-air, main fuel or fuel-air mixture, e.g. by exhaust gas recirculation [EGR] systems
    • F02M26/13—Arrangement or layout of EGR passages, e.g. in relation to specific engine parts or for incorporation of accessories
    • F02M26/22—Arrangement or layout of EGR passages, e.g. in relation to specific engine parts or for incorporation of accessories with coolers in the recirculation passage
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/06—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01P—COOLING OF MACHINES OR ENGINES IN GENERAL; COOLING OF INTERNAL-COMBUSTION ENGINES
    • F01P5/00—Pumping cooling-air or liquid coolants
    • F01P5/10—Pumping liquid coolant; Arrangements of coolant pumps
    • F01P5/12—Pump-driving arrangements
    • F01P2005/125—Driving auxiliary pumps electrically
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01P—COOLING OF MACHINES OR ENGINES IN GENERAL; COOLING OF INTERNAL-COMBUSTION ENGINES
    • F01P2050/00—Applications
    • F01P2050/30—Circuit boards
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01P—COOLING OF MACHINES OR ENGINES IN GENERAL; COOLING OF INTERNAL-COMBUSTION ENGINES
    • F01P2060/00—Cooling circuits using auxiliaries
    • F01P2060/02—Intercooler
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0031—Radiators for recooling a coolant of cooling systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Combustion & Propulsion (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Sustainable Development (AREA)
  • Human Computer Interaction (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)

Abstract

Refroidisseur (110) à eau en écoulement laminaire pour microprocesseur. Comprenant un radiateur monobloc (112), à ailettes creuses et minces, fabriqué par compression contrôlée des soufflets biconvexes d'une ébauche en polymère ou en verre, réalisée par thermosoufflage. Pour constituer un circuit fermé, rempli d'eau à pression atmosphérique, les collecteurs (113-115) de ce radiateur (112) sont reliés à ceux d'un composant original (114), formé par une mini-chaudière (116), pourvue d'une plaque de chauffe en cuivre, à face interne rainurée, et par une mini-pompe (118), à moteur électrique sans balai et turbine centrifuge, tous deux installés dans une durite rigide en polymère moulé, de petites dimensions.
PCT/FR2005/001586 2004-06-24 2005-06-23 Dispositifs de refroidissement perfectionnes pour applications diverses WO2006010822A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP05778868A EP1766682A2 (fr) 2004-06-24 2005-06-23 Dispositifs de refroidissement perfectionnes pour applications diverses
US11/571,210 US20070184320A1 (en) 2004-06-24 2005-06-23 Cooling devices for various applications

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
FR0406911 2004-06-24
FR0406911A FR2872265A1 (fr) 2004-06-24 2004-06-24 Procede et dispositif de refroidissement notamment pour microprocesseurs
FR0411122 2004-10-20
FR0411122A FR2872266A1 (fr) 2004-06-24 2004-10-20 Refroidisseurs a eau perfectionnes procedes pour leur mise en oeuvre
FR0413932A FR2880107B1 (fr) 2004-12-27 2004-12-27 Perfectionnements aux refroidisseurs a eau pour microprocesseurs
FR0413932 2004-12-27

Publications (3)

Publication Number Publication Date
WO2006010822A2 WO2006010822A2 (fr) 2006-02-02
WO2006010822A3 true WO2006010822A3 (fr) 2006-05-11
WO2006010822B1 WO2006010822B1 (fr) 2006-07-13

Family

ID=35169656

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2005/001586 WO2006010822A2 (fr) 2004-06-24 2005-06-23 Dispositifs de refroidissement perfectionnes pour applications diverses

Country Status (3)

Country Link
US (1) US20070184320A1 (fr)
EP (1) EP1766682A2 (fr)
WO (1) WO2006010822A2 (fr)

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TWI353507B (en) * 2008-01-17 2011-12-01 Chang Jung Christian University A water cooling type cooler for a computer chip
US8802266B2 (en) * 2009-05-26 2014-08-12 The Invention Science Fund I, Llc System for operating an electrical energy storage device or an electrochemical energy generation device using microchannels based on mobile device states and vehicle states
US20100304258A1 (en) * 2009-05-26 2010-12-02 Chan Alistair K System and method of altering temperature of an electrical energy storage device or an electrochemical energy generation device using high thermal conductivity materials
US20100304259A1 (en) * 2009-05-26 2010-12-02 Searete Llc. A Limited Liability Corporation Of The State Of Delaware Method of operating an electrical energy storage device or an electrochemical energy generation device using high thermal conductivity materials during charge and discharge
US8715875B2 (en) * 2009-05-26 2014-05-06 The Invention Science Fund I, Llc System and method of operating an electrical energy storage device or an electrochemical energy generation device using thermal conductivity materials based on mobile device states and vehicle states
US9065159B2 (en) * 2009-05-26 2015-06-23 The Invention Science Fund I, Llc System and method of altering temperature of an electrical energy storage device or an electrochemical energy generation device using microchannels
KR20170062544A (ko) * 2010-05-27 2017-06-07 존슨 컨트롤스 테크놀러지 컴퍼니 냉각탑을 채용한 냉각장치를 위한 써모싸이폰 냉각기
DE102010017561B4 (de) * 2010-06-24 2023-08-31 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Kühlvorrichtung für eine Batterie
JP5766993B2 (ja) 2010-11-25 2015-08-19 現代自動車株式会社Ｈｙｕｎｄａｉｍｏｔｏｒ Ｃｏｍｐａｎｙ 車両用マルチ冷却装置
US9291097B2 (en) * 2013-06-04 2016-03-22 Caterpillar Inc. Cooling module for electronic engine components
US10175005B2 (en) * 2015-03-30 2019-01-08 Infinera Corporation Low-cost nano-heat pipe
DE112016001891T5 (de) * 2015-04-24 2018-01-04 Denso Corporation Fahrzeugbeschlagschutzvorrichtung
CN111669948A (zh) * 2020-06-29 2020-09-15 东莞捷荣技术股份有限公司 一种头戴式智能终端的散热结构
US11523547B2 (en) 2021-05-04 2022-12-06 Vertiv Corporation Electrical devices with buoyancy-enhanced cooling
CN113479841B (zh) * 2021-05-24 2024-05-28 中国电子科技集团公司第五十五研究所 一种硅基微流道基板制备方法
CN115693002A (zh) * 2021-07-30 2023-02-03 蔚来汽车科技(安徽)有限公司 电池包以及对电池包进行热管理的方法
CN114754839B (zh) * 2022-06-14 2022-09-02 河北华创测控技术有限公司 一种用于铁水包的液位监测装置及系统
CN115014028B (zh) * 2022-06-24 2024-02-09 浙江俊博汽车部件有限公司 一种节约能耗的汽车空调压缩机用电磁离合器及其加工设备

Citations (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3205938A (en) * 1963-05-10 1965-09-14 Westinghouse Electric Corp Cooling means for electrical apparatus
GB1159125A (en) * 1966-10-01 1969-07-23 Ford Motor Co Cooling Radiators
US3892209A (en) * 1973-04-03 1975-07-01 Amiot F Liquid-cooled reciprocating engines, more particularly marine engines
US4502286A (en) * 1982-08-11 1985-03-05 Hitachi, Ltd. Constant pressure type boiling cooling system
JPH0267450A (ja) * 1988-08-31 1990-03-07 Kubota Ltd 横形液冷式エンジンの排熱回収装置
EP0453763A1 (fr) * 1990-04-27 1991-10-30 International Business Machines Corporation Capot flexible de refroidissement par fluide
EP0550422A2 (fr) * 1988-08-23 1993-07-07 Honda Giken Kogyo Kabushiki Kaisha Circuit de refroidissement pour un moteur multicylindres
US5263251A (en) * 1991-04-02 1993-11-23 Microunity Systems Engineering Method of fabricating a heat exchanger for solid-state electronic devices
US5316077A (en) * 1992-12-09 1994-05-31 Eaton Corporation Heat sink for electrical circuit components
EP0710811A2 (fr) * 1994-11-04 1996-05-08 Nippondenso Co., Ltd. Echangeur de chaleur à ailettes ondulées
US5587880A (en) * 1995-06-28 1996-12-24 Aavid Laboratories, Inc. Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation
FR2746177A1 (fr) * 1996-03-14 1997-09-19 Denso Corp Dispositif de refroidissement utilisant un refrigerant en ebullition et se condensant
US5901037A (en) * 1997-06-18 1999-05-04 Northrop Grumman Corporation Closed loop liquid cooling for semiconductor RF amplifier modules
US6005772A (en) * 1997-05-20 1999-12-21 Denso Corporation Cooling apparatus for high-temperature medium by boiling and condensing refrigerant
US6019165A (en) * 1998-05-18 2000-02-01 Batchelder; John Samuel Heat exchange apparatus
US6029742A (en) * 1994-01-26 2000-02-29 Sun Microsystems, Inc. Heat exchanger for electronic equipment
FR2809170A1 (fr) * 2000-05-22 2001-11-23 Denso Corp Echangeur de chaleur a gaz d'echappement
WO2001090867A1 (fr) * 2000-05-25 2001-11-29 Kioan Cheon Ordinateur a refroidisseur et echangeur thermique de ce refroidisseur
US20020029873A1 (en) * 2000-09-14 2002-03-14 Hajime Sugito Cooling device boiling and condensing refrigerant
US6360814B1 (en) * 1999-08-31 2002-03-26 Denso Corporation Cooling device boiling and condensing refrigerant
US20020039280A1 (en) * 2000-09-29 2002-04-04 Nanostream, Inc. Microfluidic devices for heat transfer
US20020041814A1 (en) * 2000-10-06 2002-04-11 Torrington Research Company Light-weight electric motor driven fluid pump assembly
EP1204143A2 (fr) * 2000-11-03 2002-05-08 Cray Inc. Refroidissement de semiconducteur à flux circulaire et radial
US6388317B1 (en) * 2000-09-25 2002-05-14 Lockheed Martin Corporation Solid-state chip cooling by use of microchannel coolant flow
WO2002050902A1 (fr) * 2000-12-20 2002-06-27 Cool Structures Production And Sales Gmbh Micro-echangeur thermique
US20020085356A1 (en) * 2000-12-26 2002-07-04 Junichi Ishimine Electronic device
JP2002195106A (ja) * 2000-12-22 2002-07-10 Hino Motors Ltd Ｅｇｒ装置
US20020149909A1 (en) * 2001-03-30 2002-10-17 Konstad Rolf A. Computer system that can be operated without a cooling fan
US20030072656A1 (en) * 2001-09-25 2003-04-17 Kyo Niwatsukino Ultra-thin pump and cooling system including the pump
US6600649B1 (en) * 2002-05-24 2003-07-29 Mei-Nan Tsai Heat dissipating device
WO2003062686A2 (fr) * 2002-01-22 2003-07-31 Khanh Dinh Coude de tuyau de chauffage associe a une pompe
US20030200762A1 (en) * 2002-04-25 2003-10-30 Masao Nakano Cooling device for semiconductor elements
US20030209343A1 (en) * 2002-05-08 2003-11-13 Bingler Douglas J. Pump system for use in a heat exchange application
US20040042176A1 (en) * 2002-05-15 2004-03-04 Kyo Niwatsukino Cooling device and an electronic apparatus including the same
US20040052048A1 (en) * 2002-09-13 2004-03-18 Wu Bo Jiu Integrated fluid cooling system for electronic components
US20040066625A1 (en) * 2002-10-02 2004-04-08 Heinrich Meyer Microstructure cooler and use thereof
FR2848653A1 (fr) * 2002-12-13 2004-06-18 Technologies De L Echange Ther Echangeur thermique procedes et moyens de fabrication de cet echangeur
US20050117301A1 (en) * 2003-03-31 2005-06-02 Ravi Prasher Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling
EP1538884A2 (fr) * 2003-12-02 2005-06-08 Hitachi, Ltd. Système de refroidissement à liquide d'un appareil électronique

Patent Citations (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3205938A (en) * 1963-05-10 1965-09-14 Westinghouse Electric Corp Cooling means for electrical apparatus
GB1159125A (en) * 1966-10-01 1969-07-23 Ford Motor Co Cooling Radiators
US3892209A (en) * 1973-04-03 1975-07-01 Amiot F Liquid-cooled reciprocating engines, more particularly marine engines
US4502286A (en) * 1982-08-11 1985-03-05 Hitachi, Ltd. Constant pressure type boiling cooling system
EP0550422A2 (fr) * 1988-08-23 1993-07-07 Honda Giken Kogyo Kabushiki Kaisha Circuit de refroidissement pour un moteur multicylindres
JPH0267450A (ja) * 1988-08-31 1990-03-07 Kubota Ltd 横形液冷式エンジンの排熱回収装置
EP0453763A1 (fr) * 1990-04-27 1991-10-30 International Business Machines Corporation Capot flexible de refroidissement par fluide
US5263251A (en) * 1991-04-02 1993-11-23 Microunity Systems Engineering Method of fabricating a heat exchanger for solid-state electronic devices
US5316077A (en) * 1992-12-09 1994-05-31 Eaton Corporation Heat sink for electrical circuit components
US6029742A (en) * 1994-01-26 2000-02-29 Sun Microsystems, Inc. Heat exchanger for electronic equipment
EP0710811A2 (fr) * 1994-11-04 1996-05-08 Nippondenso Co., Ltd. Echangeur de chaleur à ailettes ondulées
US5587880A (en) * 1995-06-28 1996-12-24 Aavid Laboratories, Inc. Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation
FR2746177A1 (fr) * 1996-03-14 1997-09-19 Denso Corp Dispositif de refroidissement utilisant un refrigerant en ebullition et se condensant
US6005772A (en) * 1997-05-20 1999-12-21 Denso Corporation Cooling apparatus for high-temperature medium by boiling and condensing refrigerant
US5901037A (en) * 1997-06-18 1999-05-04 Northrop Grumman Corporation Closed loop liquid cooling for semiconductor RF amplifier modules
US6019165A (en) * 1998-05-18 2000-02-01 Batchelder; John Samuel Heat exchange apparatus
US6360814B1 (en) * 1999-08-31 2002-03-26 Denso Corporation Cooling device boiling and condensing refrigerant
FR2809170A1 (fr) * 2000-05-22 2001-11-23 Denso Corp Echangeur de chaleur a gaz d'echappement
WO2001090867A1 (fr) * 2000-05-25 2001-11-29 Kioan Cheon Ordinateur a refroidisseur et echangeur thermique de ce refroidisseur
US20020029873A1 (en) * 2000-09-14 2002-03-14 Hajime Sugito Cooling device boiling and condensing refrigerant
US6388317B1 (en) * 2000-09-25 2002-05-14 Lockheed Martin Corporation Solid-state chip cooling by use of microchannel coolant flow
US20020039280A1 (en) * 2000-09-29 2002-04-04 Nanostream, Inc. Microfluidic devices for heat transfer
US20020041814A1 (en) * 2000-10-06 2002-04-11 Torrington Research Company Light-weight electric motor driven fluid pump assembly
EP1204143A2 (fr) * 2000-11-03 2002-05-08 Cray Inc. Refroidissement de semiconducteur à flux circulaire et radial
WO2002050902A1 (fr) * 2000-12-20 2002-06-27 Cool Structures Production And Sales Gmbh Micro-echangeur thermique
JP2002195106A (ja) * 2000-12-22 2002-07-10 Hino Motors Ltd Ｅｇｒ装置
US20020085356A1 (en) * 2000-12-26 2002-07-04 Junichi Ishimine Electronic device
US20020149909A1 (en) * 2001-03-30 2002-10-17 Konstad Rolf A. Computer system that can be operated without a cooling fan
US20030072656A1 (en) * 2001-09-25 2003-04-17 Kyo Niwatsukino Ultra-thin pump and cooling system including the pump
WO2003062686A2 (fr) * 2002-01-22 2003-07-31 Khanh Dinh Coude de tuyau de chauffage associe a une pompe
US20030200762A1 (en) * 2002-04-25 2003-10-30 Masao Nakano Cooling device for semiconductor elements
US20030209343A1 (en) * 2002-05-08 2003-11-13 Bingler Douglas J. Pump system for use in a heat exchange application
US20040042176A1 (en) * 2002-05-15 2004-03-04 Kyo Niwatsukino Cooling device and an electronic apparatus including the same
US6600649B1 (en) * 2002-05-24 2003-07-29 Mei-Nan Tsai Heat dissipating device
US20040052048A1 (en) * 2002-09-13 2004-03-18 Wu Bo Jiu Integrated fluid cooling system for electronic components
US20040066625A1 (en) * 2002-10-02 2004-04-08 Heinrich Meyer Microstructure cooler and use thereof
FR2848653A1 (fr) * 2002-12-13 2004-06-18 Technologies De L Echange Ther Echangeur thermique procedes et moyens de fabrication de cet echangeur
WO2004055462A1 (fr) * 2002-12-13 2004-07-01 Technologies De L'echange Thermique Echangeur thermique procedes et moyens de fabrication de cet echangeur
US20050117301A1 (en) * 2003-03-31 2005-06-02 Ravi Prasher Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling
EP1538884A2 (fr) * 2003-12-02 2005-06-08 Hitachi, Ltd. Système de refroidissement à liquide d'un appareil électronique

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 014, no. 247 (M - 0978) 25 May 1990 (1990-05-25) *
PATENT ABSTRACTS OF JAPAN vol. 2002, no. 11 6 November 2002 (2002-11-06) *

Also Published As

Publication number Publication date
WO2006010822A2 (fr) 2006-02-02
US20070184320A1 (en) 2007-08-09
WO2006010822B1 (fr) 2006-07-13
EP1766682A2 (fr) 2007-03-28

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