WO2006002779A1 - Procede de production d'une coquille a revetement antiadhesif - Google Patents
Procede de production d'une coquille a revetement antiadhesif Download PDFInfo
- Publication number
- WO2006002779A1 WO2006002779A1 PCT/EP2005/006534 EP2005006534W WO2006002779A1 WO 2006002779 A1 WO2006002779 A1 WO 2006002779A1 EP 2005006534 W EP2005006534 W EP 2005006534W WO 2006002779 A1 WO2006002779 A1 WO 2006002779A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- silicon
- weight
- container
- silicon nitride
- nitride powder
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 7
- 239000011248 coating agent Substances 0.000 title description 8
- 238000000576 coating method Methods 0.000 title description 8
- 230000000181 anti-adherent effect Effects 0.000 title 1
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 27
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000000843 powder Substances 0.000 claims abstract description 21
- 239000011230 binding agent Substances 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 9
- 238000002844 melting Methods 0.000 claims abstract description 7
- 230000008018 melting Effects 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims abstract description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 39
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 38
- 229910052710 silicon Inorganic materials 0.000 claims description 38
- 239000010703 silicon Substances 0.000 claims description 38
- 235000012239 silicon dioxide Nutrition 0.000 claims description 17
- 239000000377 silicon dioxide Substances 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 8
- -1 ferrous metals Chemical class 0.000 claims description 6
- 229910052729 chemical element Inorganic materials 0.000 claims description 4
- 238000002425 crystallisation Methods 0.000 claims description 4
- 230000008025 crystallization Effects 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 239000008187 granular material Substances 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 abstract 1
- 239000010453 quartz Substances 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B11/00—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
- C30B11/002—Crucibles or containers for supporting the melt
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/10—Crucibles or containers for supporting the melt
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B35/00—Apparatus not otherwise provided for, specially adapted for the growth, production or after-treatment of single crystals or of a homogeneous polycrystalline material with defined structure
- C30B35/002—Crucibles or containers
Definitions
- the invention relates to a method for producing a container for melting and / or crystallizing non-ferrous metals, in particular of silicon.
- the invention further relates to a container produced by the erfindungsge ⁇ MAESSEN container.
- the invention relates to Weite ⁇ Ren the use of a container according to the invention for receiving silicon melt.
- WO 2004/053207 A1 discloses a container for receiving silicon and a production method for such a container, wherein a coating comprising metallic silicon, silicon nitride and silicon dioxide is sprayed onto the inner walls of the container.
- the metallic silicon serves as a binder for the silicon nitride and silicon dioxide and is an essential component of the coating.
- a disadvantage of containers coated in this way is that they are costly to produce as a result of the required finely dispersed and highly pure silicon powder having a particle size distribution corresponding to the silicon nitride powder and the silicon dioxide powder.
- the metallic silicon furthermore contains metallic impurities, which in turn contaminate the silicon absorbed in the container, which has a negative effect on its quality.
- the invention has for its object to provide a method for producing a container for melting and / or crystallizing non-ferrous metals and a corresponding container which is pondere ⁇ low and in which there is no adhesion of the non-ferrous metal to the container interior wall.
- the essence of the invention is to apply a layer of silicon nitride powder and an inorganic, heat-resistant binder to the inner wall of the container.
- the inorganic binder has no metallic silicon, which conversely means that the inorganic binder essentially comprises chemical compounds of at least two different chemical elements.
- the term "essentially” is to be understood here as meaning that chemical elements or chemical compounds from a chemical element may be present in the context of unavoidable impurities, but their addition or presence is not intentionally introduced or desired.
- the inorganic binder nevertheless providing the desired adhesion and inertness of the layer to non-ferrous metals accommodated in the container , such as iron or titanium, is reduced in the layer, which leads to an improvement in the quality of the non-ferrous metal crystallizing in the container
- the binder binds the silicon nitride to the inner wall of the container
- An example of the binder l is silicon dioxide.
- the binder acts as an inorganic adhesion promoter, which is not decomposed even at the high temperatures of a silicon melt.
- the coating produced in this way offers a substantially higher resistance to caking and sticking between the solidified silicon and the container wall and has a substantially lower contamination of the crystallized block surface of the silicon with the coating.
- the mold blank is provided with a non-stick layer at least on its inner walls.
- the non-stick layer consists of a mixture of silicon nitride powder and finely dispersed silica as an inorganic binder.
- the mixture may contain 1 to 50% by weight of silicon dioxide and a corresponding proportion of silicon nitride powder.
- the silicon dioxide powder is finely dispersed silicon dioxide, which may be hydrophilic or hydrophobic.
- the Siliziumnitridpul ⁇ ver and the silica powder are dispersed in a solvent.
- the inorganic binder has no, in particular less than 1 wt .-%, in particular less than 0, 1 wt .-%, in particular less than 0.01 wt .-%, and in particular less than 0.001 wt .-% of metallic silicon.
- the application of the mixture of silicon nitride powder, silica powder and solvent is carried out, for example, by brushing, spraying, spraying, dipping or by electrostatic application of a suspension or a slurry. It is also possible to apply the mixture of silicon nitride powder and silicon dioxide in powder form to the mold inner walls.
- the finely dispersed silicon dioxide powder and / or the silicon nitride powder have an alkali and alkaline earth metal content of ⁇ 2000 ppm, in particular ⁇ 1000 ppm, a fluoride content of ⁇ 3000 ppm, in particular ⁇ 2000 ppm, a chloride content of ⁇ 3000 ppm, in particular ⁇ 2000 ppm, a total carbon content of ⁇ 3000 ppm, in particular ⁇ 2000 ppm, and an iron, chromium, cobalt, nickel, tungsten and / or titanium content of ⁇ 1000 ppm, in particular ⁇ 500 ppm
- the silicon dioxide powder used has a silicon dioxide concentration of at least 95% by weight, in particular at least 99% by weight, in particular at least 99.8% by weight.
- the finely dispersed silicon dioxide has a specific surface area of at most 300 m 2 / g and an average size of the primary particles of at least 5 nm.
- the silicon nitride powder has an oxygen content of 0.1 wt .-% to 10 wt .-%, in particular 0.3 wt .-% to 5 wt .-%, in particular 1 wt .-% to 3 wt .-% to ,
- the ratio of length to diameter of the particles of the silicon nitride powder is less than 10.
- the particle size of the silicon nitride powder is .ltoreq.100 .mu.m, in particular ⁇ 50 .mu.m, in particular ⁇ 30 .mu.m.
- the silicon nitride powder contains, among other phases of silicon nitride 1% to 100% in the beta phase.
- the silicon nitride powder may be amorphous.
- the resulting non-stick coated molds are particularly suitable for receiving liquid silicon and for crystallization of liquid silicon to silicon ingots, rods, billets or granules.
- the silicon produced can be used to produce silicon wafers.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004031880 | 2004-06-30 | ||
DE102004031880.8 | 2004-06-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006002779A1 true WO2006002779A1 (fr) | 2006-01-12 |
Family
ID=34970498
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2005/006534 WO2006002779A1 (fr) | 2004-06-30 | 2005-06-17 | Procede de production d'une coquille a revetement antiadhesif |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2006002779A1 (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009048741A1 (de) | 2009-03-20 | 2010-09-30 | Access E.V. | Tiegel zum Schmelzen und Kristallisieren eines Metalls, eines Halbleiters oder einer Metalllegierung, Bauteil für einen Tiegelgrundkörper eines Tiegels und Verfahren zum Herstellen eines Bauteils |
WO2013160603A1 (fr) | 2012-04-24 | 2013-10-31 | Saint-Gobain Centre De Recherches Et D'etudes Europeen | Creuset en nitrure de silicium et son procédé de fabrication |
WO2014068230A1 (fr) | 2012-10-31 | 2014-05-08 | Saint-Gobain Centre De Recherches Et D'etudes Europeen | Creuset incorporant un revetement sialon |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0963464B1 (fr) * | 1997-02-06 | 2001-07-18 | Deutsche Solar GmbH | Creuset muni de couches de protection en silicium, procede d'application la couche de protection en silicium et utilisation |
WO2002040182A1 (fr) * | 2000-11-15 | 2002-05-23 | G.T. Equipment Technologies Inc. | Revetement antiadherent pour creusets |
JP2003041357A (ja) * | 2001-07-27 | 2003-02-13 | Tocalo Co Ltd | シリコン保持容器およびその製造方法 |
WO2004053207A1 (fr) * | 2002-12-06 | 2004-06-24 | Vesuvius France S.A. | Recipient destine a conserver du silicium et son procede de production |
-
2005
- 2005-06-17 WO PCT/EP2005/006534 patent/WO2006002779A1/fr active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0963464B1 (fr) * | 1997-02-06 | 2001-07-18 | Deutsche Solar GmbH | Creuset muni de couches de protection en silicium, procede d'application la couche de protection en silicium et utilisation |
WO2002040182A1 (fr) * | 2000-11-15 | 2002-05-23 | G.T. Equipment Technologies Inc. | Revetement antiadherent pour creusets |
JP2003041357A (ja) * | 2001-07-27 | 2003-02-13 | Tocalo Co Ltd | シリコン保持容器およびその製造方法 |
WO2004053207A1 (fr) * | 2002-12-06 | 2004-06-24 | Vesuvius France S.A. | Recipient destine a conserver du silicium et son procede de production |
Non-Patent Citations (3)
Title |
---|
CHEMICAL ABSTRACTS + INDEXES, AMERICAN CHEMICAL SOCIETY. COLUMBUS, US, vol. 105, no. 4, 28 July 1986 (1986-07-28), XP000185916, ISSN: 0009-2258 * |
HIDE I ET AL: "Mould shaping silicon crystal growth with a mould coating material by the spinning method", JOURNAL OF CRYSTAL GROWTH, NORTH-HOLLAND, AMSTERDAM, NL, vol. 79, no. 1-3, December 1986 (1986-12-01), pages 583 - 589, XP002252583, ISSN: 0022-0248 * |
PATENT ABSTRACTS OF JAPAN vol. 2003, no. 06 3 June 2003 (2003-06-03) * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009048741A1 (de) | 2009-03-20 | 2010-09-30 | Access E.V. | Tiegel zum Schmelzen und Kristallisieren eines Metalls, eines Halbleiters oder einer Metalllegierung, Bauteil für einen Tiegelgrundkörper eines Tiegels und Verfahren zum Herstellen eines Bauteils |
WO2013160603A1 (fr) | 2012-04-24 | 2013-10-31 | Saint-Gobain Centre De Recherches Et D'etudes Europeen | Creuset en nitrure de silicium et son procédé de fabrication |
WO2014068230A1 (fr) | 2012-10-31 | 2014-05-08 | Saint-Gobain Centre De Recherches Et D'etudes Europeen | Creuset incorporant un revetement sialon |
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