WO2005117095A1 - Procédé et dispositif de liaison ultrasonique - Google Patents

Procédé et dispositif de liaison ultrasonique Download PDF

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Publication number
WO2005117095A1
WO2005117095A1 PCT/JP2005/006594 JP2005006594W WO2005117095A1 WO 2005117095 A1 WO2005117095 A1 WO 2005117095A1 JP 2005006594 W JP2005006594 W JP 2005006594W WO 2005117095 A1 WO2005117095 A1 WO 2005117095A1
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WO
WIPO (PCT)
Prior art keywords
ultrasonic
applying
ultrasonic vibration
joining
vibration
Prior art date
Application number
PCT/JP2005/006594
Other languages
English (en)
Japanese (ja)
Inventor
Yuzo Higashiyama
Original Assignee
Murata Manufacturing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co., Ltd. filed Critical Murata Manufacturing Co., Ltd.
Priority to JP2006513821A priority Critical patent/JP4345815B2/ja
Publication of WO2005117095A1 publication Critical patent/WO2005117095A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/75353—Ultrasonic horns
    • H01L2224/75355—Design, e.g. of the wave guide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/1026—Compound semiconductors
    • H01L2924/1032—III-V
    • H01L2924/10329—Gallium arsenide [GaAs]

Definitions

  • the present invention relates to an ultrasonic bonding method and an ultrasonic bonding apparatus for applying ultrasonic vibration to a bonding member to bond to a surface to be bonded.
  • Ultrasonic bonding apparatuses are widely used when electronic components such as semiconductor elements and piezoelectric elements are flip-chip mounted on a substrate or the like.
  • Patent Literature 1 discloses an ultrasonic welding apparatus that joins a joining member to a surface to be joined while applying a pressing load and ultrasonic vibration to the joining member.
  • a vibrator 71 for applying longitudinal vibration in the longitudinal direction of the horn 70 is attached to one end of a horn 70 having a tapered shape, and the standing vibration of the horn 70 is established.
  • a bonding tool 72 is mounted from the horn 70 in a direction substantially perpendicular to the direction of longitudinal vibration.
  • a connection portion 73 with a pressing means for applying a pressing load is provided at a substantially central portion of the horn 70.
  • Patent Document 1 JP 2001-44242 A
  • the vibration transmitting force to the joining member 74 depends on the frictional force between the contact portion 72 a of the bonding tool 72 and the joining member 74. Therefore, if the frictional force between the joining member 74 and the contact surface 75 is larger than the frictional force between the contact portion 72a of the bonding tool 72 and the joining member 74, the contact force between the contacting portion 72a of the bonding tool 72 and the joining member 74 becomes larger. There is a problem that slippage occurs and vibration is not sufficiently transmitted to the joining member 74, resulting in poor joining. In addition, since the amplitude of the ultrasonic vibration is small (approximately 0.6 ⁇ m is the limit) and the joining energy is small, there is a problem that the joining takes time and it is difficult to join at room temperature.
  • Patent Document 2 does not disclose the position of the joining member in the ultrasonic vibration direction with respect to the suction tool.
  • An ultrasonic bonding apparatus that prevents the occurrence of such a problem has been disclosed. That is, as shown in FIG. 6, a chamfered portion 80a is formed in advance on the upper surface of the joining member 80, and is brought into contact with the chamfered portions 81a provided on the two sides of the bonding tool 81 in the ultrasonic vibration direction. Prevents displacement of member 80.
  • Patent Document 2 Japanese Patent Application Laid-Open No. 2001-110850
  • the chamfered portion 80a of the joining member 80 and the chamfered portion 81a of the bonding tool 81 are in contact with each other, the chamfered portion 80a is not affected by the frictional force as shown in FIG. There is a problem that the cost increases due to the necessity of forming a new one. Further, when the joining member 80 is attracted, the chamfered portions 80a and 81a do not always contact accurately, and the joining member 80 may be inclined. Further, since a large force is generated in the chamfered portion 80a of the joining member 80, the joining member 80 may be cracked or chipped.
  • an object of the present invention is to provide an ultrasonic bonding method capable of efficiently transmitting ultrasonic vibration of an applying member to a bonding member without performing processing such as chamfering on the bonding member, and obtaining good bonding quality.
  • An ultrasonic bonding apparatus is provided.
  • Another object is to provide an ultrasonic bonding method and an ultrasonic bonding apparatus capable of reducing a load applied to a bonding member and obtaining good bonding quality even with a bonding member having low mechanical strength. .
  • the invention according to claim 1 relates to an ultrasonic bonding method for applying ultrasonic vibration to a bonding member and bonding the bonding member to a surface to be bonded.
  • the ultrasonic vibration transmitted from the applying member causes the ultrasonic vibration transmitted from the applying member to have the same direction and substantially the same amplitude as the applying member.
  • An ultrasonic bonding method characterized by having:
  • the invention according to claim 6 is an ultrasonic bonding apparatus that applies ultrasonic vibration to a bonding member and bonds the bonded member to a surface to be bonded.
  • An application member that supports one side of the ultrasonic vibration direction and applies ultrasonic vibration generated by the vibrator to the joining member; and a contact portion that abuts one side of the ultrasonic vibration direction of the application member,
  • the above-mentioned force of the applying member is caused by the ultrasonic vibration transmitted to the holding member, which oscillates in the same direction and substantially the same amplitude as the applying member, and the other side of the joining member, which is provided in the holding member, in the ultrasonic vibration direction.
  • a supporting elastic member connected to a node portion of the holding member, a contact portion of the holding member abutting on one side surface of the applying member in the ultrasonic vibration direction, and the elastic member connecting the joining member to the applying member. Operate in the direction of pressing against And an actuation means.
  • both sides of the joining member in the ultrasonic vibration direction are sandwiched between the applying member for applying the ultrasonic vibration and the elastic member of the sandwiching member, and the contact portion of the sandwiching member contacts the applying member.
  • the ultrasonic vibration of the applying member is transmitted to the holding member via the contact portion, and the applying member, the joining member, and the holding member vibrate in synchronization with each other, and the joining member causes relative displacement with respect to the applying member.
  • the vibration of the applying member can be efficiently transmitted to the joining member. As a result, good joining quality can be obtained.
  • the holding force of the joining member is obtained by the spring deformation (deflection) of the elastic member that is not dependent on the pressing force of the holding member.
  • the amount of deflection of the elastic member can be made substantially constant when the contact portion of the holding member contacts the application member. That is, since the holding force of the joining member is determined by the bending force of the elastic member, the holding force of the joining member can be set to an optimum value by setting the spring constant of the elastic member. Therefore, the joining member having a small mounting area has low mechanical strength, and even if the joining member is used, it can be joined without causing damage such as cracking.
  • the feature of the present invention resides in that the force for transmitting vibration to the sandwiching member and the force for vibrating the joint member can be set independently. Therefore, the mechanical strength is low. Vibration can be transmitted sufficiently without damaging even a joining member. Furthermore, since there is no need to apply a new force such as chamfering to the joining member, good joining quality can be obtained at low cost.
  • vibration can be transmitted to the joining member without being affected by the frictional force, it is possible to cause the joining member to vibrate with a large amplitude (for example, 1 ⁇ m or more) and a small variation. Therefore, a large bonding energy can be generated at the bonding portion, and short-time bonding and room-temperature bonding can be performed.
  • the resonance frequency of the elastic member is set sufficiently higher than the frequency of the ultrasonic vibration.
  • the applying member, the holding member, and the elastic member vibrate integrally and synchronously.
  • the vibration of the elastic member becomes larger than the vibration of the sandwiching member or the phase shifts, so that the integrated vibration does not occur.
  • the joining member causes a phase shift with respect to the applying member, and the ultrasonic vibration energy from the applying member is not sufficiently transmitted, and the joining quality may be degraded.
  • the resonance mode is not only one but also high. There is a next resonance mode, and there is a concern that higher-order resonance modes may occur near the ultrasonic frequency.
  • the primary resonance frequency of the elastic member is shifted in a direction higher than the ultrasonic frequency, the higher-order resonance mode is further away from the ultrasonic frequency, so that there is no problem.
  • the frequency characteristic of the ratio of the elastic member amplitude to the input amplitude is obtained, and the lower frequency at which the ratio is 1.1 is determined.
  • a method of making the frequency higher than the ultrasonic frequency or a method of setting the ratio between the resonance frequency of the elastic member and the ultrasonic frequency to a predetermined value (eg, 1.1) or more can be used.
  • the resonance frequency of the holding member may be shifted with respect to the frequency of the ultrasonic vibration so that the amplitude of the holding member and the amplitude of the application member are substantially equal.
  • the holding member is moved by the ultrasonic vibration transmitted from the applying member through the abutting portion. It is set so as to synchronously vibrate in the same direction and substantially the same amplitude as the material.
  • the resonance frequency of the holding member may be set to be the same as the frequency of the ultrasonic vibration.In that case, however, depending on the structure of the holding member, the amplitude of the holding member becomes larger than the amplitude of the applying member, and the joining member becomes Alternatively, there is a possibility that the contact with the holding member is repeated. As a result, a relatively large gap is generated between the joining member, the applying member, and the holding member, and the efficiency of transmitting vibration to the joining member may decrease.
  • the maximum amplitude can be suppressed, and the amplitude of the holding member can be made as close as possible to the applying member, and the gap generated between the joining member and the applying member and the holding member can be reduced. As a result, the efficiency of transmitting vibration to the joining member can be maintained high. It is desirable that the amplitude difference between the applying member and the holding member be 10% or less.
  • a pressing load may be applied to the applying member in a direction in which the joining member is pressed against the surface to be joined, and the pressing load may be controlled.
  • the facing distance between the joining member and the surface to be joined may be controlled simultaneously with the application of the ultrasonic vibration.
  • the gap between the joining member and the surface to be joined can be controlled.
  • the bonding member is a high-frequency component having bumps
  • the gap between the chip and the substrate affects the characteristics, so that the accuracy of the gap after bonding is required.
  • Controlling the gap amount is also important in controlling the degree of penetration of resin such as underfill into the gap.
  • a predetermined pressure is required to generate the frictional force, so that gap control is not possible.
  • the bonding member is held between the applying member and the elastic member of the holding member, and the holding member is transmitted through the abutting portion of the applying member cover. Since the vibration is synchronized by the ultrasonic vibration, the vibration is efficiently transmitted from the applying member to the joining member. Since the operating means for operating the holding member in the direction of holding the joining member with the applying member is connected to the node portion of the holding member, no vibration is transmitted to the operating means. Therefore, the vibration of the vibrator is efficiently transmitted to the applying member, the joining member, and the holding member (elastic member).
  • the holding member is preferably supported by a member different from the applying member in order to prevent the ultrasonic vibration from leaking to the outside.
  • the holding member can be arbitrarily selected such as a member that vibrates radially and a member that vibrates longitudinally.
  • an actuator such as a cylinder or a solenoid may be used, or a simple spring material may be used.
  • the joining member can be easily held and released, so that the operation relating to the joining operation is not delayed.
  • a spring material it is preferable to provide some mechanism for releasing the urging force of the spring material when taking out the force between the application member and the holding member of the joining member.
  • the application member includes a first surface that supports one side surface of the bonding member in the ultrasonic vibration direction, and a second surface that is substantially parallel to the surface to be bonded and supports the upper surface of the bonding member.
  • a suction hole for sucking the joining member is provided on the second surface.
  • the applying member is provided with the first surface supporting the side surface of the bonding member and the second surface supporting the upper surface, the pressing load from the applying member to the bonding member can be easily applied, and the pressing force on the bonding member can be easily reduced.
  • the control of the setting amount is also easy.
  • the suction hole is provided on the second surface, the upper surface of the joining member can be held on the second surface, and the inclination when holding the joining member by suction can be eliminated. And can be joined almost in parallel.
  • Claim 8 uses an ultrasonic horn formed in a substantially inverted bilaterally symmetrical substantially inverted triangular shape as the applying member.
  • a transducer is attached to at least one of the left and right tops of the ultrasonic horn.
  • an output section for applying ultrasonic vibration to the joining member was provided at the lower apex of the ultrasonic horn. At this time, the ultrasonic vibration in the horizontal direction is output from the output unit.
  • the ultrasonic vibration in the horizontal direction is obtained at the lower apex portion, which is the output portion, and the ultrasonic horn does not have a radius, so that the ultrasonic vibration in the horizontal direction can be given to the joining member, High quality bonding can be realized.
  • a minimum amplitude region exists near the center of the upper side facing the lower apex of the horn.
  • the above node area is used as a load input part, and if a downward pressing load is applied to this input part, the vibration of the ultrasonic horn is not disturbed and the load Ultrasonic vibration does not propagate to the application means and does not adversely affect it.
  • the connection between the load applying means and the ultrasonic horn is located on or near the axis of the pressing vector, no bending stress is generated on the ultrasonic horn, and the pressing load is applied to the object to be joined. It can work directly.
  • the contact portion of the holding member is brought into contact with one side surface of the applying member in the ultrasonic vibration direction, and both side surfaces of the joining member in the ultrasonic vibration direction are held with the applying member. Since the holding member is held between the elastic members, the applying member, the joining member, and the holding member vibrate in synchronization with each other, and the vibration of the applying member is efficiently transmitted to the joining member. Therefore, vibration can be stably transmitted to the joining member without performing special processing such as chamfering on the joining member, and good joining quality can be obtained at low cost.
  • the joining member can be vibrated with a large amplitude, and large joining energy can be generated at the joining portion. Room temperature bonding becomes possible. Further, since both sides of the joining member in the ultrasonic vibration direction are sandwiched between the applying member and the elastic member of the sandwiching member, the clamping force of the joining member can be determined by the bending force of the elastic member, and the clamping force of the joining member can be determined. Can be made almost constant. Therefore, even if the joining member has a small mounting area and a low mechanical strength, the joining member can be joined without damaging the joining member.
  • the ultrasonic bonding method according to claim 1 can be performed with a simple device. Further, since the operating means for operating the holding member in the direction of holding the joining member with the applying member is connected to the node portion of the holding member, the vibration of the vibrator which does not allow the operating means to transmit the vibration is applied to the applying member. It is efficiently transmitted to the joining member and the holding member.
  • FIG. 1 is an overall perspective view of a bonding apparatus provided with an ultrasonic bonding apparatus according to the present invention.
  • FIG. 2 is a front view of the lifting block shown in FIG. 1.
  • FIG. 3 is a left side view of the lifting block shown in FIG. 2.
  • FIG. 4 is an enlarged cross section of an example of the ultrasonic bonding apparatus shown in FIG.
  • FIG. 5 is a front view of an example of a conventional ultrasonic bonding apparatus.
  • FIG. 6 is a partial cross-sectional view of another example of the conventional ultrasonic bonding apparatus.
  • FIG. 1 shows an example of a bonding apparatus provided with an ultrasonic bonding apparatus according to the present invention, and particularly shows an entire configuration of an apparatus for mounting a chip component with a bump face down on a substrate.
  • a mounting stage 2 for mounting and supporting a substrate B which is an example of a surface to be bonded
  • the component transport stage 6 and the component supply unit 7 that supplies the component P extracted from the component supply unit 3 to the component transport stage 6 and the component P that is supplied to the component transport stage 6 are received.
  • Ultrasonic bonding device 8 for bonding to substrate B on mounting stage 2 and supporting ultrasonic bonding device 8 A lifting block 5 for raising and lowering is provided.
  • the mounting stage 2 is configured to be horizontally movable in the X and Y directions for positioning with respect to the component P held by the ultrasonic bonding apparatus 8, and is supported thereon.
  • Substrate B is heated by the built-in heater.
  • the component transport stage 6 carries the component P supplied by the component supply unit 7 into the vertical movement path of the ultrasonic bonding device 8 and transfers it to the ultrasonic bonding device 8 in the Z direction and the X direction. It is configured to be movable.
  • FIGS. 2 and 3 show an example of a specific structure of the lifting block 5, and FIG. 4 shows a detailed structure of an example of the ultrasonic bonding apparatus 8.
  • the lifting block 5 includes a base 40, a lifting / lowering driving device 41 having a servomotor and the like fixed to the base 40, and a slide plate 43, which is vertically movably mounted on the base 40 by a guide portion 42, and a slide plate 43. It is equipped with a load application device 30 and the like, which have a fixed air cylinder and the like.
  • the rotating shaft of the lifting drive device 41 is constituted by a screw shaft 41a, and the screw shaft 41a is screwed into a nut portion 48 provided on the slide plate 43.
  • the tip of the screw shaft 41a is rotatably supported by a bearing 49.
  • the load applying device 30 has a piston rod 31, and a pressing jig 32 is fixed to a lower end of the piston rod 31.
  • the pressing jig 32 is connected to the connecting portion 18 of the ultrasonic horn 10 as described later.
  • a panel 46 for canceling its own weight is stretched between the slide plate 43 and the pressing jig 32.
  • the panel 46 cancels the weight of all the components suspended from the panel 46, such as the pressing jig 32 which is connected only by the weight of the ultrasonic horn 10 and the actuator 33 therein. Therefore, the pressing load from the ultrasonic horn 10 to the joining object (the component P and the substrate B) is not affected by the own weight of these components, and can be set only by the air pressure supplied to the chamber 30a of the load applying device 30. It is like that. It is also possible to cancel the own weight by supplying pressurized air to the other chamber 30b via the pipe 45 instead of the panel 46.
  • the force using the air cylinder as the load applying device 30 is not limited to this, and other means such as a voice coil motor, a combination of a motor and a ball screw mechanism may be used.
  • a voice coil motor a combination of a motor and a ball screw mechanism
  • the height of the ultrasonic horn 10 can be freely controlled, and thus, by controlling the descending amount of the ultrasonic horn 10, the gap between the component P and the board B (opposing distance) Can be controlled with high precision.
  • the ultrasonic bonding apparatus 8 bonds the bumped component P to the substrate B by applying a pressing load and ultrasonic vibration, and forms an inverted isosceles triangular ultrasonic horn. It has ten.
  • the main body of the ultrasonic horn 10 is integrally formed of a metal material such as an aluminum alloy, a cemented carbide, a titanium alloy, and stainless steel.
  • a cut surface is provided on each of the lower apex portion 11 and the left and right apex portions 12 and 13 of the ultrasonic horn 10.
  • the cut surface of the lower apex 11 is parallel to the upper side 14, and the cut surfaces of the left and right apexes 12 and 13 are substantially perpendicular to the hypotenuses 15 and 16, respectively.
  • the apex angle ⁇ ⁇ of the lower apex 11 of this embodiment is set in the range of 60 ° to 150 °, preferably 90 ° to 120 °.
  • the upper side 14 of the ultrasonic horn 10 is formed in a concave shape having two slopes 14a, 14b and one bottom surface 14c.
  • the upper side 14 may be flat or convex. Yes.
  • a piezoelectric vibrator 20 is fixed to the cut surface of one of the right and left apexes (here, the right apex 13) of the ultrasonic horn 10, and is parallel to the hypotenuse 16 with respect to the right apex 13 of the ultrasonic horn 10.
  • Supersonic vibration Uin is given.
  • the vibration direction may have an angle deviation of about ⁇ 10 ° with respect to the hypotenuse 16.
  • the vibration frequency for example, a range of 20 kHz to 200 kHz is desirable, but here, about 60 kHz was used. Since the ultrasonic horn 10 has a symmetrical shape, the same operation and effect can be obtained even if the vibrator 20 is provided on any of the left and right tops 12 and 13.
  • Flange-like connecting portions 18 are protruded from both the front and back surfaces near the center of the upper side 14 facing the lower top 11 and slightly below the upper side 14.
  • the connecting portion 18 is provided at a vibration node of the horn 10, and the projecting length of the connecting portion 18 is designed so as not to resonate at the ultrasonic vibration frequency.
  • the connecting portion 18 includes a piston rod 31 of the load applying device 30. Are connected via a pressing jig 32.
  • the pressing jig 32 has two legs 32b projecting downward, and these legs 32b are fixed to the connecting portion 18 by fasteners 38 such as bolts. Therefore, the pressing jig 32 does not come into contact with a portion other than the connecting portion 18 of the ultrasonic horn 10.
  • the connecting portion 18 provided in the node region of the ultrasonic horn 10 is used as a load input portion, and the load applying device 30 (the pressing jig 32) is connected to the input portion 18, the connecting portion is provided.
  • Ultrasonic vibration does not propagate from 18 to the load application device 30, and no disturbance vibration is generated.
  • the load applying device 30 When a downward pressing load is applied by the load applying device 30, the vector of the pressing load passes through the lower apex portion 11, so that the ultrasonic horn 10 does not generate a radius, and the pressing load is applied directly to the lower apex portion 11. Can be Therefore, the ultrasonic vibration and the pressing load can be uniformly applied to the entire bonding surface 2, and a uniform and good bonding can be obtained.
  • a contact member 17 made of a wear-resistant material (for example, cemented carbide, ceramic, diamond, or the like) is detachably fixed to the cut surface of the lower top portion 11 of the ultrasonic horn 10.
  • the contact member 17 is an L-shaped cross-sectional member having a surface 17a that supports one side surface of the component P in the ultrasonic vibration direction and a surface 17b that supports the upper surface of the component P, as shown in FIG.
  • the other side surface of the component P4 in the ultrasonic vibration direction is elastically supported by an elastic member 37 provided at a distal end portion of a holding member 35 described later.
  • the contact member 17 has a suction hole 17c for sucking the component P.
  • the suction hole 17c is connected to a vacuum suction device (not shown) via a suction hole 10a provided in the ultrasonic horn 10 and a vacuum pipe 47 (see FIG. 2).
  • the vacuum pipe 47 should be made of a hose made of soft elastic material! /.
  • the pressing jig 32 is formed in a box shape, and a direct-acting actuator 33 having a force such as a air cylinder is fixed inside the pressing jig 32, for example. Operation of actuator 33
  • the shaft 33a moves in the horizontal direction in FIG. 2, and a node portion at the upper end of the holding member 35 is pivotally supported on the operating shaft 33a via a rotatable pin.
  • Reference numeral 33b denotes an air pipe for operating the actuator 33.
  • a pair of bearing portions 32a are vertically suspended from the lower surface of the pressing jig 32, and between the bearing portions 32a, both ends of a driving shaft 36 fixed to an intermediate node portion of the holding member 35. The part is bearing.
  • the holding member 35 of this embodiment is a rod-shaped member whose material and shape are designed so as to make a third-order radial vibration near the frequency (for example, 60 kHz) of the ultrasonic vibration generated by the horn 10. Penetrates the vertical hole 10b vertically without contact.
  • the swing shaft 36 also penetrates through the lateral hole 10c of the horn 10 in a front and rear direction without contact. Therefore, the holding member 35 and the swing shaft 36 are not in contact with the horn 10.
  • the horn 10 has a vertical hole 10d for balance at a position symmetrical to the vertical hole 10b.
  • the holding member 35 is tertiary as shown in FIG.
  • the vibration is hardly transmitted to the operating shaft 33a and the swinging shaft 36, and the leakage of the vibration can be prevented.
  • a flange-shaped contact portion 35a is provided on the body. The contact portion 35a is in contact with one side surface of the contact member 17 fixed to the lower end of the ultrasonic horn 10 in the ultrasonic vibration direction, and the ultrasonic vibration is transmitted from the contact member 17.
  • the elastic member 37 is attached to the contact portion 35a.
  • the elastic member 37 presses one side of the component P in the ultrasonic vibration direction in the direction of the contact member 17 and the elastic force of the elastic member 37 is applied. Part P is pinched.
  • the elastic member 37 of this embodiment is formed of a leaf spring.
  • a leaf spring For example, when the component P is a GaAs element having a size of 0.5 mm X 0.5 mm, a copper alloy (such as beryllium copper or phosphor bronze) or a SUS-based spring is used. A material with a size of about H: lmm, W: lmm, t: 0.15 mm is used.
  • the bending force at this time is designed to be lower than the minimum load at which the component P is damaged (about 5N in the case of a 0.5 ⁇ 0.5 mm GaAs device).
  • the elastic member 37 causes the holding member 35 and the holding member 35 to move by ultrasonic vibration transmitted from the ultrasonic horn 10.
  • the resonance frequency of the elastic member 37 should be sufficiently higher than the ultrasonic frequency (about 60 kHz).
  • the resonance frequency is about 100 kHz, and the elastic member 37 can be vibrated integrally with the holding member 35.
  • the resonance frequency of the elastic member 37 is set to about 100 kHz with respect to the ultrasonic frequency of 60 kHz as in the embodiment, the resonance frequency is equal to the ultrasonic frequency 1.7. According to the experiment of the inventor, it was confirmed that the sandwiching member 35 and the elastic member 37 vibrate integrally when the resonance frequency Z ultrasonic frequency is in the range of 1.1 to 2.4.
  • the material of the sandwiching member 35 is a cemented carbide (Young's modulus 580 GPa, density 13.9 ⁇ 10 3 kg / m 3 ), and the resonance frequency of the third order radial vibration is about 61 kHz. Is set to. That is, the resonance frequency of the holding member 35 is intentionally shifted by 1 kHz with respect to the frequency of the ultrasonic vibration (60 kHz). Therefore, the amplitude at the frequency of the ultrasonic vibration of the holding member 35 becomes smaller than the amplitude (maximum amplitude) at the resonance frequency, and the contact portion 35a provided at the lower end of the holding member 35 is moved below the ultrasonic horn 10.
  • Vibration can be performed while maintaining a contact state with the contact member 17 attached to the top portion 11.
  • the amplitude difference between the contact member 17 and the contact portion 35a is preferably within 10%.
  • the frequency difference is shifted by 1 kHz, and the amplitude difference is set to about 5%. Note that the amount of frequency shift varies depending on the material, size, and the like of the holding member 35.
  • Both sides of the component P in the ultrasonic vibration direction are sandwiched between the contact member 17 provided on the horn 10 and the elastic member 37 provided on the sandwiching member 35.
  • the contact portion 35a contacts one side surface of the contact member 17 provided on the horn 10 in the ultrasonic vibration direction, and vibrates synchronously. Therefore, the contact member 17 provided on the horn 10, the contact portion 35a provided on the holding member 35, the flexible member 37, and the component P vibrate synchronously with the body, and the vibration of the horn 10 is efficiently performed. It is transmitted to part P.
  • the component P is supported by the antinode of the vibration of the holding member 35 (elastic member 37), so that the vibration of the horn 10 is transmitted to the component P with almost no loss.
  • the substrate B mounted and supported on the mounting stage 2 is heated in advance by a heater built in the mounting stage 2.
  • Part P abutment member 1 In order to hold the actuator between the elastic member and the elastic member, the actuator 33 is driven in a direction in which the tip of the holding member opens from the contact member. The contact member 17 is brought into contact with the upper surface of the component P supplied on the component transfer stage 6 and is vacuum-sucked. Next, the actuator 33 is driven in the closing direction, and both sides of the component P are sandwiched between the contact member 17 and the elastic member 37. At the same time, the contact portion 35 a of the holding member 35 is brought into contact with the side surface of the contact member 17.
  • the ultrasonic bonding device 8 is lowered, the component P is brought into contact with the substrate B, and a predetermined pressing load is applied by the load applying device 30.
  • vibration Uin is applied from the piezoelectric vibrator 20 to the right top 13 of the ultrasonic horn 10
  • vibration Uout substantially parallel to the surface 2 to be bonded is generated in the contact member 17
  • Vibration is transmitted to part P.
  • the vibration is also transmitted to the holding member 35 via the contact portion 35a, and the holding member 35 vibrates synchronously with the horn 10.
  • the elastic member 37 provided on the holding member 35 also oscillates synchronously, and the horn 10, the holding member 35 and the elastic member 37 vibrate integrally with the component P, so that the component P is securely joined to the substrate B. .
  • the pressing load of the load applying device 30, that is, the air pressure supplied to the chamber 30a is controlled to be constant at the same time as the application of the ultrasonic vibration, the joining quality between the component P and the substrate B can be controlled to be constant. Also, by controlling the amount of depression of the load applying device 30, that is, the amount of movement of the piston rod 31, the pressing jig 32, or the ultrasonic horn 10, the gap (facing distance) between the component P and the substrate B can be fixed, and the bump Can be made constant.
  • the component P can be vibrated with a large amplitude (for example, 1 ⁇ m or more). it can. Therefore, a large bonding energy can be generated for the bonding surface, and bonding in a short time and room temperature can be performed.
  • both sides of the component P in the ultrasonic vibration direction are elastically clamped by the horn 10 (the contact member 17) and the elastic member 37 provided on the clamping member 35, compared to the case where the conventional chamfer is provided.
  • the flip-chip mounting of the bumped component on the substrate has been described.
  • Force The present invention can be applied to bonding of a chip having a plurality of leads called TAB to a tape and bonding of metals.
  • the present invention is applicable to all devices that join metals using ultrasonic vibration.
  • the contact portion 35a is integrally provided at the lower end portion of the holding member 35, and the elastic member 37 is attached to the contact portion 35a, but the separate contact portion 35a is attached to the holding member 35. It may be detachable, and an elastic member 37 may be provided on the contact portion 35a. In the case where the elastic member 37 is provided on the contact portion 35a detachable from the holding member 35, when the contact portion 35a or the elastic member 37 is deteriorated, the contact portion 35a can be easily replaced. Can be exchanged.
  • the elastic member of the present invention is not limited to the leaf spring as in the embodiment, but may be an elastic body such as rubber.
  • the force of attaching the contact member to the lower apex of the ultrasonic horn 10 may be directly provided on the lower apex with a support surface that abuts one side or the upper surface in the ultrasonic vibration direction of the bonding member.
  • the vibrator is attached to the left or right top of the ultrasonic horn 10, it is also possible to attach the vibrator to both the left and right tops. In this case, a large output can be obtained at the lower top, which is the output section. However, in that case, it is necessary to make the frequency of each vibrator the same and to invert the phase.
  • the swing shaft 36 of the holding member 35 can be supported by the node of the force horn 10 supported by the bearing 32a of the pressing jig 32 different from the ultrasonic horn 10.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Wire Bonding (AREA)

Abstract

[PROBLEMES] Fournir un procédé de liaison ultrasonique capable de garantir une excellente qualité de liaison même si un élément à coller avec une faible résistance mécanique est collé par transmission efficace d’une vibration ultrasonique à l’élément par des éléments d’application. [MOYENS POUR RESOUDRE LES PROBLEMES] Dans ce procédé de liaison ultrasonique pour coller une pièce (P) à un substrat (B) en appliquant la vibration ultrasonique à la pièce (P), les deux faces latérales de la pièce (P) dans le sens de vibration ultrasonique sont maintenues par les éléments d’application (10) et (17) en appliquant la vibration ultrasonique spécifique à la pièce (P) et un élément de maintien (35). Une pièce de contact (35a) au contact de l’élément d’application (17) et un élément élastique (37) sont installés sur l’élément de maintien (35) et la pièce (P) est maintenue par la force de flexion de l’élément élastique (37). L’élément de maintien (35) est soumis de manière synchrone à la vibration ultrasonique transmise des éléments d’application (10) et (17) à ceux-ci par le biais de la pièce de contact (35a) pour coller la pièce (P) au substrat (B) avec la pièce (P) comprimée contre les éléments d’application (10) et (17).
PCT/JP2005/006594 2004-05-25 2005-04-04 Procédé et dispositif de liaison ultrasonique WO2005117095A1 (fr)

Priority Applications (1)

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JP2006513821A JP4345815B2 (ja) 2004-05-25 2005-04-04 超音波接合方法および超音波接合装置

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JP2004154103 2004-05-25
JP2004-154103 2004-05-25

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WO2005117095A1 true WO2005117095A1 (fr) 2005-12-08

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9595491B2 (en) 2014-09-26 2017-03-14 Fuji Electric Co., Ltd. Apparatus for manufacturing semiconductor device and the semiconductor device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1145912A (ja) * 1997-07-28 1999-02-16 Matsushita Electric Ind Co Ltd バンプ付電子部品のボンディング装置およびボンディング方法
JP2003318230A (ja) * 2002-02-25 2003-11-07 Murata Mfg Co Ltd 超音波ホーンおよびこの超音波ホーンを用いた超音波接合装置
JP2004146786A (ja) * 2002-08-29 2004-05-20 Murata Mfg Co Ltd 超音波接合方法および超音波接合装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1145912A (ja) * 1997-07-28 1999-02-16 Matsushita Electric Ind Co Ltd バンプ付電子部品のボンディング装置およびボンディング方法
JP2003318230A (ja) * 2002-02-25 2003-11-07 Murata Mfg Co Ltd 超音波ホーンおよびこの超音波ホーンを用いた超音波接合装置
JP2004146786A (ja) * 2002-08-29 2004-05-20 Murata Mfg Co Ltd 超音波接合方法および超音波接合装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9595491B2 (en) 2014-09-26 2017-03-14 Fuji Electric Co., Ltd. Apparatus for manufacturing semiconductor device and the semiconductor device

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JPWO2005117095A1 (ja) 2008-04-03

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