WO2005101503A3 - Vorrichtung, insbesondere intelligentes leistungsmodul, mit planarer verbindungstechnik - Google Patents
Vorrichtung, insbesondere intelligentes leistungsmodul, mit planarer verbindungstechnik Download PDFInfo
- Publication number
- WO2005101503A3 WO2005101503A3 PCT/EP2005/051645 EP2005051645W WO2005101503A3 WO 2005101503 A3 WO2005101503 A3 WO 2005101503A3 EP 2005051645 W EP2005051645 W EP 2005051645W WO 2005101503 A3 WO2005101503 A3 WO 2005101503A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- power module
- intelligent power
- layer
- planar connection
- particular intelligent
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Dc-Dc Converters (AREA)
- Power Conversion In General (AREA)
- Combinations Of Printed Boards (AREA)
- Inverter Devices (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/568,058 US20090231822A1 (en) | 2004-04-19 | 2005-04-14 | Device, in particular intelligent power module with planar connection |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004019447A DE102004019447A1 (de) | 2004-04-19 | 2004-04-19 | Vorrichtung, insbesondere intelligentes Leistungsmodul, mit planarer Verbindungstechnik |
DE102004019447.5 | 2004-04-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005101503A2 WO2005101503A2 (de) | 2005-10-27 |
WO2005101503A3 true WO2005101503A3 (de) | 2006-02-23 |
Family
ID=34964929
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2005/051645 WO2005101503A2 (de) | 2004-04-19 | 2005-04-14 | Vorrichtung, insbesondere intelligentes leistungsmodul, mit planarer verbindungstechnik |
Country Status (3)
Country | Link |
---|---|
US (1) | US20090231822A1 (de) |
DE (1) | DE102004019447A1 (de) |
WO (1) | WO2005101503A2 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008035993B4 (de) * | 2008-08-01 | 2018-10-11 | Infineon Technologies Ag | Leistungshalbleitermodul |
DE102010002138A1 (de) * | 2010-02-19 | 2011-08-25 | Robert Bosch GmbH, 70469 | Substratanordnung für ein elektronisches Steuergerät einer Kraftfahrzeugkomponente |
DE102011080153A1 (de) | 2011-07-29 | 2013-01-31 | Infineon Technologies Ag | Flexible verbindung von substraten in leistungshalbleitermodulen |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6359331B1 (en) * | 1997-12-23 | 2002-03-19 | Ford Global Technologies, Inc. | High power switching module |
WO2003030247A2 (de) * | 2001-09-28 | 2003-04-10 | Siemens Aktiengesellschaft | Verfahren zum kontaktieren elektrischer kontaktflächen eines substrats und vorrichtung aus einem substrat mit elektrischen kontaktflächen |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3746604B2 (ja) * | 1997-12-09 | 2006-02-15 | 株式会社ルネサステクノロジ | 半導体装置およびその製造方法 |
JP2656416B2 (ja) * | 1991-12-16 | 1997-09-24 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法、並びに半導体装置に用いられる複合基板および複合基板の製造方法 |
US6025995A (en) * | 1997-11-05 | 2000-02-15 | Ericsson Inc. | Integrated circuit module and method |
ATE268050T1 (de) * | 1998-02-05 | 2004-06-15 | Univ City Hong Kong | Betriebstechniken für kernlose pcb- transformatoren |
US5959357A (en) * | 1998-02-17 | 1999-09-28 | General Electric Company | Fet array for operation at different power levels |
US6239980B1 (en) * | 1998-08-31 | 2001-05-29 | General Electric Company | Multimodule interconnect structure and process |
DE10227658B4 (de) * | 2002-06-20 | 2012-03-08 | Curamik Electronics Gmbh | Metall-Keramik-Substrat für elektrische Schaltkreise -oder Module, Verfahren zum Herstellen eines solchen Substrates sowie Modul mit einem solchen Substrat |
-
2004
- 2004-04-19 DE DE102004019447A patent/DE102004019447A1/de not_active Withdrawn
-
2005
- 2005-04-14 WO PCT/EP2005/051645 patent/WO2005101503A2/de active Application Filing
- 2005-04-14 US US11/568,058 patent/US20090231822A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6359331B1 (en) * | 1997-12-23 | 2002-03-19 | Ford Global Technologies, Inc. | High power switching module |
WO2003030247A2 (de) * | 2001-09-28 | 2003-04-10 | Siemens Aktiengesellschaft | Verfahren zum kontaktieren elektrischer kontaktflächen eines substrats und vorrichtung aus einem substrat mit elektrischen kontaktflächen |
Also Published As
Publication number | Publication date |
---|---|
WO2005101503A2 (de) | 2005-10-27 |
DE102004019447A1 (de) | 2005-11-10 |
US20090231822A1 (en) | 2009-09-17 |
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