WO2005088268A1 - Sensormodul mit einem kondensator emv- und esd-schutz - Google Patents
Sensormodul mit einem kondensator emv- und esd-schutz Download PDFInfo
- Publication number
- WO2005088268A1 WO2005088268A1 PCT/EP2004/052986 EP2004052986W WO2005088268A1 WO 2005088268 A1 WO2005088268 A1 WO 2005088268A1 EP 2004052986 W EP2004052986 W EP 2004052986W WO 2005088268 A1 WO2005088268 A1 WO 2005088268A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sensor module
- housing part
- sensor
- housing
- interior
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/069—Protection against electromagnetic or electrostatic interferences
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/142—Multiple part housings
- G01L19/143—Two part housings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
Definitions
- the invention relates to a sensor module, in particular a pressure sensor module with the features of the preamble of independent claim 1.
- ESD protection Protection against electrostatic discharge (ESD protection) is used in sensor modules EMC capacitors. Although it is possible to integrate such capacitors in the semiconductor pressure transducer, this requires a not inconsiderable additional outlay in the production of the pressure transducer. In addition, the integrated capacitors often meet the requirements for an effective ESD
- the capacitors are therefore installed in the sensor housing at a different location than the sensor arrangement.
- a two-chamber pressure sensor module is known.
- the housing has a housing part with electrical conductors partially embedded therein, which are contacted with a printed circuit board via solid wire connections.
- the sensor housing furthermore has a pressurized first interior, in which a sensor arrangement is arranged, and a second interior, which is sealed off from the first interior, and in which an EMC protection circuit with protective capacitors is arranged. Sensor arrangement and EMC protection circuit are arranged together on a circuit board. The electrical connection of the protective circuit to the sensor arrangement is established via conductor tracks of the printed circuit board.
- the sensor housing In the first interior of the sensor housing there is also a frame-like receiving part with a receptacle formed by a circumferential wall, into which receptacle the sensor arrangement is inserted and for protection with a protective cover filled into the receptacle, for example a silicone gel is covered.
- a protective cover filled into the receptacle for example a silicone gel is covered.
- the sensor module according to the invention with the characterizing features of claim 1 enables a simple and compact design of the sensor module, it being possible to dispense with a printed circuit board as an electrical connecting means.
- the sensor arrangement with the sensor element is inserted into a receiving part filled with a protective cover and contacted with electrical connecting elements arranged on the receiving part.
- the receiving part is arranged in the first interior of the sensor housing.
- the connection elements are connected directly to connection sections of the electrical conductors, which can advantageously be done by welding.
- the at least one EMC capacitor arranged in the second interior is connected to at least one of the electrical conductors via an electrically conductive photo material, in particular a conductive adhesive. It is particularly advantageous that the capacitors arranged in the second interior do not have to be protected with a gel cover. Interactions between the gel and the conductive adhesive are avoided.
- the gel covers the entire first interior space and air inclusions in the gel damage the sensor arrangement or the bond wire connections between the sensor arrangement and the electrical ones Can run connections. Since the electrical conductors, which are partially embedded in the housing part, are led to the second interior space, air could otherwise get from the second interior space along the electrical conductors into the first interior space if there is a negative pressure in the first housing interior space. If this air were to escape directly under the gel, air bubbles would form in the gel, which tend to expand explosively when there are pressure fluctuations and cause damage to the sensor element and, in particular, to the bond wire connections.
- air which enters the first interior space along the electrical conductors can advantageously not escape below the protective cover of the sensor arrangement, since this is located in the receiving part together with the bonding wires. This prevents air bubbles in the protective cover of the sensor element.
- the receiving part is advantageously inserted in a second receptacle formed on the first housing part, which second receptacle has a wall surrounding the receiving part. Between the wall surrounding the receiving part and the receiving part, a material covering the electrical connection point of the electrical conductors and the electrical connection elements is filled, whereby the connecting parts are protected against aggressive substances. Since the electrical connection of the electrical connection elements to the electrical conductors can be made, for example, by welding and is therefore very robust, damage to the electrical connection point by air escaping within the second receptacle is not possible. In addition, other materials that prevent the ingress of air can be selected here than for the protective cover of the sensor arrangement.
- the first housing part is particularly simple to manufacture the first housing part as an injection molded part, in which the electrical conductors are partially embedded as lead frame parts.
- the sensor housing advantageously has a first housing part and at least a second housing part, a partition being formed on the first housing part or the second housing part and wherein at least the first interior space and preferably also the second interior space are formed by placing the second housing part on the first housing part is formed.
- the seal can advantageously be arranged in only one level in a single process step.
- the sensor module according to the invention can advantageously be configured both as an absolute pressure sensor with one pressure connection and as a relative pressure sensor with two pressure connections.
- FIG. 1 shows a first exemplary embodiment of the invention with a sensor module designed as an absolute pressure sensor
- Fig. 2 shows a second embodiment of the invention with a sensor module designed as a relative pressure sensor.
- the pressure sensor module 1 shows a first exemplary embodiment of a sensor module which is designed as a pressure sensor module for measuring absolute pressure.
- the pressure sensor module 1 has a sensor housing 1 with a first housing part 2, which is manufactured as an injection molded part with electrical conductors 4 partially embedded therein.
- the electrical conductors 4 can be formed, for example, as lead frame parts, wherein a plurality of lead frame tracks which are electrically separated from one another are embedded in the plastic of the housing part 1.
- the electrical conductors 4 can be guided on one side of the sensor housing 1 to a plug connection 5 of the sensor module, where connecting sections 4d of the conductors or connected plug pins are excluded from the plastic sleeve.
- a second housing part 3 is provided as a cover, which, for example, is also made as an injection molded part made of plastic and is placed on the first housing part 1.
- a partition wall 22 and a peripheral wall 29 are formed on the second housing part 3.
- the second interior space 10 and a second interior space 11 being separated from the first interior space 10 by the partition wall 22 and being sealed off from it, so that different atmospheres and pressures can exist in the two interior spaces.
- the second housing part 3 also has a pressure connection 20 with a pressure channel 21 which leads into the first interior 10 opens, so that a pressure P applied to the pressure connection 20 also prevails in the interior 10.
- the electrical conductors 4 have connection sections 4a, 4b and 4c, which are not embedded in the plastic of the housing part 2, but rather on the inside facing the first interior 10 or the second interior 11 of the sensor housing of the first housing part 2 are excluded from the casing.
- At least one capacitor 7 arranged in the second housing interior 11 is contacted with a connection section 4c of an electrical conductor 4, preferably by means of a conductive adhesive arranged between the connection section 4c and the capacitor 7.
- the capacitor 7 is a protective capacitor to improve the electromagnetic compatibility (EMC protection) of the sensor module and to protect against electrostatic discharges. It is therefore arranged between the connection sections 4d of the plug connection 5 and connection sections 4a, 4b, which are provided for contacting the sensor arrangement.
- the sensor arrangement 12, 13 comprises a sensor element 12, for example one
- the sensor arrangement is inserted into a box-shaped receiving part 6 (premold), which has a receptacle 18 formed by a base 17 and a circumferential wall 16 ,
- the receiving part 6 can be made of plastic, for example.
- the receiving part 6 also has connecting elements 19, which extend from the receptacle 18 through the circumferential fende Wall 16 are guided into the first interior 10 and there are connected to the connecting sections 4a, 4b (two connecting sections 4a and 4b are shown in FIG. 1) arranged on the inside of the first housing part 2 of the electrical conductors 4, for example by welding.
- connection sections 4a, 4b By soldering or press contacting or in another suitable manner.
- the ends of the connection elements 19 which are not connected to the conductors 4 are connected to the sensor element 12 in the interior of the receptacle 18, for example via bond wire connections.
- the receptacle 18 of the receiving part 6 is filled with a protective cover 14, for example a gel, to protect the sensor element. When the interior 10 is pressurized, the pressure is transmitted to the sensor element 12 via the elastic gel.
- the inside of the first housing part 2 facing the first interior 10 has a second receptacle 26 which is formed by a recess on the inside of the first housing part 2 and which delimits the second receptacle 26 has peripheral wall 25.
- the Aufiiahmeteil 6 is arranged inside the Aufiisuit 26 delimited by the peripheral wall 25.
- a material 9, for example an adhesive, in particular a silicone adhesive, covering the electrical connecting parts of the electrical conductors 4 and the electrical connecting elements 19 is arranged between the wall 25 and the receiving part 6.
- the adhesive can advantageously be applied to the first housing part 1 together with the filling of the grooves 28.
- the receiving part 6 is here arranged above the pressure channel 21 and provided with a recess in the base 17 for carrying out a pressure P1.
- the base 13 also has a recess, so that the sensor membrane of the sensor element 12 can be acted on from below with a first pressure P1 which does not prevail in the first interior 10, since the pressure channel 21 is sealed against the first interior 10 here.
- the second housing part 3 has a second pressure connection 30, through which the first interior 10 and, via the flexible cover 14 made of gel, the top of the sensor membrane of the sensor element 12 can be pressurized with a pressure P2 as a reference pressure.
- a pressure P2 as a reference pressure.
- the sensor element 12 and the bonding wire connection to the connection elements 19 are particularly well protected against damage, since air which could get into the first interior space 10 from the second interior space 11 along the electrical conductors 4 injected in plastic, there emerges below the covering material and can therefore not cause any damage to the bond wire connection, since the bond wire connection is arranged protected from the ingress of air within the receiving part 6.
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006523019A JP2007501937A (ja) | 2004-03-12 | 2004-11-17 | センサモジュール |
DE502004012185T DE502004012185D1 (de) | 2004-03-12 | 2004-11-17 | Sensormodul mit einem kondensator emv- und esd-schutz |
EP04821722A EP1728060B1 (de) | 2004-03-12 | 2004-11-17 | Sensormodul mit einem kondensator emv- und esd-schutz |
US10/592,631 US7426868B2 (en) | 2004-03-12 | 2004-11-17 | Sensor module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004012593A DE102004012593A1 (de) | 2004-03-12 | 2004-03-12 | Sensormodul |
DE102004012593.7 | 2004-03-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005088268A1 true WO2005088268A1 (de) | 2005-09-22 |
Family
ID=34895389
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2004/052986 WO2005088268A1 (de) | 2004-03-12 | 2004-11-17 | Sensormodul mit einem kondensator emv- und esd-schutz |
Country Status (5)
Country | Link |
---|---|
US (1) | US7426868B2 (de) |
EP (1) | EP1728060B1 (de) |
JP (1) | JP2007501937A (de) |
DE (2) | DE102004012593A1 (de) |
WO (1) | WO2005088268A1 (de) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007315858A (ja) * | 2006-05-24 | 2007-12-06 | Denso Corp | 圧力センサ |
WO2009000611A2 (de) * | 2007-06-27 | 2008-12-31 | Robert Bosch Gmbh | Baugruppe mit einem asic und einem gehäuse für den asic |
EP2060877A2 (de) * | 2007-11-14 | 2009-05-20 | INOR Process AB | Transmitter und verfahren zur herstellung eines transmitters |
EP3187848A1 (de) * | 2015-12-31 | 2017-07-05 | Honeywell International Inc. | Drucksensoranordnung |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008005153A1 (de) * | 2008-01-18 | 2009-07-23 | Robert Bosch Gmbh | Druckmessmodul |
DE102009000597B4 (de) * | 2009-02-04 | 2020-10-15 | Robert Bosch Gmbh | Haltekörper zur spielfreien Montage von Sensoren |
EP2224218B1 (de) * | 2009-02-25 | 2018-11-28 | Sensirion Automotive Solutions AG | Sensor in einer geformten Verpackung und Herstellungsverfahren dafür |
DE102009028966A1 (de) * | 2009-08-28 | 2011-03-03 | Robert Bosch Gmbh | Drucksensor |
US8390083B2 (en) | 2009-09-04 | 2013-03-05 | Analog Devices, Inc. | System with recessed sensing or processing elements |
DE102009054734A1 (de) | 2009-12-16 | 2011-06-22 | Robert Bosch GmbH, 70469 | Drucksensoranordnung |
DE102010001075A1 (de) * | 2010-01-21 | 2011-07-28 | Robert Bosch GmbH, 70469 | Niederdrucksensor |
DE102010001418A1 (de) * | 2010-02-01 | 2011-08-04 | Robert Bosch GmbH, 70469 | Sensormodul, Verfahren zur Herstellung eines Sensormoduls |
DE102010039599A1 (de) | 2010-08-20 | 2012-02-23 | Robert Bosch Gmbh | Sensormodul zur Aufnahme eines Drucksensorchips und zur Montage in einem Sensorgehäuse |
WO2012051340A1 (en) | 2010-10-12 | 2012-04-19 | Analog Devices, Inc. | Microphone package with embedded asic |
DE102011079446A1 (de) * | 2011-07-20 | 2013-02-07 | Robert Bosch Gmbh | Sensoreinrichtung, insbesondere für die Verwendung in einem Kraftfahrzeug |
CN104576883B (zh) | 2013-10-29 | 2018-11-16 | 普因特工程有限公司 | 芯片安装用阵列基板及其制造方法 |
KR101438571B1 (ko) * | 2013-11-25 | 2014-09-12 | 한국지질자원연구원 | 유도형 광대역 3성분 시추공 자기장 계측센서 및 이를 이용한 시추공 전자탐사방법 |
JP5870989B2 (ja) * | 2013-12-03 | 2016-03-01 | 株式会社デンソー | 車両用圧力検出装置 |
DE102014221067A1 (de) * | 2014-10-16 | 2016-04-21 | Robert Bosch Gmbh | Drucksensor zur Erfassung eines Drucks eines fluiden Mediums |
DE102014225861A1 (de) * | 2014-12-15 | 2016-06-16 | Robert Bosch Gmbh | Sensoreinrichtung, insbesondere für die Verwendung in einem Kraftfahrzeug |
US9666558B2 (en) | 2015-06-29 | 2017-05-30 | Point Engineering Co., Ltd. | Substrate for mounting a chip and chip package using the substrate |
DE102015223850A1 (de) * | 2015-12-01 | 2017-06-01 | Robert Bosch Gmbh | Verfahren zur Herstellung einer Vorrichtung zur Erfassung mindestens einer Eigenschaft eines fluiden Mediums in einem Messraum |
US10060820B2 (en) * | 2015-12-22 | 2018-08-28 | Continental Automotive Systems, Inc. | Stress-isolated absolute pressure sensor |
JPWO2017138647A1 (ja) * | 2016-02-10 | 2018-11-29 | 日本電産トーソク株式会社 | 圧力検出装置とその製造方法 |
JP6471118B2 (ja) | 2016-05-24 | 2019-02-13 | 日本電産トーソク株式会社 | 圧力検出装置、および圧力検出装置を格納した電動油圧ポンプ |
CN209326840U (zh) | 2018-12-27 | 2019-08-30 | 热敏碟公司 | 压力传感器及压力变送器 |
DE102021134430A1 (de) * | 2021-12-22 | 2023-06-22 | Systec Automotive Gmbh | Vorrichtung zur Druck-, Kraft- oder Temperaturmessung |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5948991A (en) * | 1996-12-09 | 1999-09-07 | Denso Corporation | Semiconductor physical quantity sensor device having semiconductor sensor chip integrated with semiconductor circuit chip |
US6272913B1 (en) * | 1997-07-22 | 2001-08-14 | Robert Bosch Gmbh | Apparatus for detecting the pressure and temperature in the intake tube of an internal combustion engine, and method for producing it |
US20030115967A1 (en) * | 2000-11-01 | 2003-06-26 | Winfried Kuhnt | Pressure sensor module |
US6615669B1 (en) * | 1999-05-28 | 2003-09-09 | Mitsubishi Denki Kabushiki Kaisha | Pressure sensor device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10052406A1 (de) * | 2000-10-20 | 2002-05-23 | Bosch Gmbh Robert | Drucksensormodul |
DE10223357A1 (de) * | 2002-05-25 | 2003-12-04 | Bosch Gmbh Robert | Vorrichtung zur Druckmessung |
DE10331967A1 (de) * | 2003-07-15 | 2005-02-03 | Robert Bosch Gmbh | Sensoreinrichtung |
-
2004
- 2004-03-12 DE DE102004012593A patent/DE102004012593A1/de not_active Withdrawn
- 2004-11-17 JP JP2006523019A patent/JP2007501937A/ja active Pending
- 2004-11-17 US US10/592,631 patent/US7426868B2/en active Active
- 2004-11-17 DE DE502004012185T patent/DE502004012185D1/de active Active
- 2004-11-17 WO PCT/EP2004/052986 patent/WO2005088268A1/de active Application Filing
- 2004-11-17 EP EP04821722A patent/EP1728060B1/de active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5948991A (en) * | 1996-12-09 | 1999-09-07 | Denso Corporation | Semiconductor physical quantity sensor device having semiconductor sensor chip integrated with semiconductor circuit chip |
US6272913B1 (en) * | 1997-07-22 | 2001-08-14 | Robert Bosch Gmbh | Apparatus for detecting the pressure and temperature in the intake tube of an internal combustion engine, and method for producing it |
US6615669B1 (en) * | 1999-05-28 | 2003-09-09 | Mitsubishi Denki Kabushiki Kaisha | Pressure sensor device |
US20030115967A1 (en) * | 2000-11-01 | 2003-06-26 | Winfried Kuhnt | Pressure sensor module |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007315858A (ja) * | 2006-05-24 | 2007-12-06 | Denso Corp | 圧力センサ |
WO2009000611A2 (de) * | 2007-06-27 | 2008-12-31 | Robert Bosch Gmbh | Baugruppe mit einem asic und einem gehäuse für den asic |
WO2009000611A3 (de) * | 2007-06-27 | 2009-02-19 | Bosch Gmbh Robert | Baugruppe mit einem asic und einem gehäuse für den asic |
EP2060877A2 (de) * | 2007-11-14 | 2009-05-20 | INOR Process AB | Transmitter und verfahren zur herstellung eines transmitters |
EP2060877A3 (de) * | 2007-11-14 | 2014-02-05 | INOR Process AB | Transmitter und verfahren zur herstellung eines transmitters |
EP3187848A1 (de) * | 2015-12-31 | 2017-07-05 | Honeywell International Inc. | Drucksensoranordnung |
US10215655B2 (en) | 2015-12-31 | 2019-02-26 | Honeywell International Inc. | Pressure sensor assembly |
Also Published As
Publication number | Publication date |
---|---|
US20080034877A1 (en) | 2008-02-14 |
EP1728060B1 (de) | 2011-02-09 |
US7426868B2 (en) | 2008-09-23 |
EP1728060A1 (de) | 2006-12-06 |
JP2007501937A (ja) | 2007-02-01 |
DE502004012185D1 (de) | 2011-03-24 |
DE102004012593A1 (de) | 2005-09-29 |
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