WO2005074015A1

WO2005074015A1 - Method and device for supporting plate member, stage device, exposure device, and method of manufacturing device

Info

Publication number: WO2005074015A1
Application number: PCT/JP2005/001224
Authority: WO
Inventors: Kazuya Ono; Kenichi Ashida; Koue Mukaide
Original assignee: Nikon Corporation
Priority date: 2004-01-29
Filing date: 2005-01-28
Publication date: 2005-08-11
Also published as: JPWO2005074015A1; TW200534424A

Abstract

A method and a device for supporting a plate member capable of suppressing the deterioration of the surface accuracy of the plate member due to its deformation when the plate member for which high flatness is requested is fixed to a pedestal on a substrate stage. The plate member supporting device (10) comprises the plate member (1) on which an area (AR) having a specified surface accuracy is formed and the pedestal (2) supporting the plate member (1). Only one end part (1a) of the plate member (1) is fixedly supported on the pedestal (2).

Description

Specification

Plate member support method, plate member support device, stage device, exposure device, and device manufacturing method

Technical field

The present invention relates to a technique relating to an exposure apparatus used in a lithographic process for manufacturing a highly integrated semiconductor circuit element, and particularly to an apparatus for supporting a plate member used for various measurements. The present application Pama, January 29, 2004 ίPatent application No. 2004-021456 filed in the present application [The priority is claimed here, the content of which is incorporated herein.

Background art

[0002] Devices such as semiconductor elements, liquid crystal display elements, and thin-film magnetic heads are manufactured by repeating a film forming process, an exposure process, an etching process, and the like a plurality of times. In this exposure processing step, an exposure apparatus that transfers a circuit pattern formed on a photomask onto a photosensitive substrate is used, and a substrate stage on which a substrate is placed and a two-dimensionally moving substrate stage and a mask having the circuit pattern are placed. A mask stage that is placed and two-dimensionally moved, and transfers a circuit pattern formed on the mask to the substrate via the projection optical system while sequentially moving the mask stage and the substrate stage.

When performing the exposure processing, the substrate is accurately aligned with the circuit pattern formed on the mask, or the surface of the substrate (exposed surface) is leveled with respect to the imaging surface of the circuit pattern. Or need to ring.

For this reason, various plate members or sensors serving as references for measuring the position or orientation of the mask or the substrate are arranged on the substrate stage or the like.

Patent Document 1: Japanese Patent Application Laid-Open No. 2001-338868

Disclosure of the invention

Problems to be solved by the invention

[0003] The above-mentioned plate members and the like are required to have high flatness with the miniaturization of circuit patterns. Conventionally, there is a problem that it is difficult to maintain the surface accuracy even if a plate member having high flatness is used. That is, the plate member is mounted on a stage such as a substrate stage. When being fixed on the seat, the plate member is deformed by the influence of the surface accuracy of the pedestal, and the surface accuracy is deteriorated. In particular, when a fastening means such as a screw is used, the plate member is deformed by the fastening force, thereby deteriorating the surface accuracy. In addition, a difference in thermal expansion between the plate member and the pedestal may deteriorate the surface accuracy of the plate member.

Furthermore, there is a technique for solving the above-mentioned problem by fixing the plate member via an elastic body such as a panel. However, the acceleration of the substrate stage causes the elastic body to be deformed, and the positioning accuracy of the plate member is reduced. However, there is also a problem that the measurement accuracy using the plate member deteriorates.

The present invention has been made in view of the above circumstances, and when fixing a plate member requiring high flatness to a pedestal on a substrate stage or the like, the surface accuracy of the plate member due to deformation of the plate member is reduced. An object of the present invention is to provide a supporting method, a supporting device, and the like that can suppress deterioration. Means for solving the problem

[0005] In the method for supporting a plate member, the plate member supporting apparatus, the stage apparatus, the exposure apparatus, and the device manufacturing method according to the present invention, the following means are employed in order to solve the above problems. The first invention is a method for supporting a plate member (1) in which an area (AR) having a predetermined surface accuracy is formed, wherein only one end (la) of the plate member (1) is supported. According to the present invention, the plate member on which the region having the predetermined surface accuracy is formed is cantilevered, so that the contact area with the member supporting the plate member is reduced, and the plate member is fixed to the support member. Deformation can be suppressed.

[0006] Further, in a configuration in which a shock absorber (6) for suppressing the transmission of deformation from one end is provided between the one end (la) and the area (AR), the deformation generated at one end is a predetermined amount. Since it is difficult to transmit to the area having the surface accuracy, the surface accuracy of the plate member can be further maintained.

For example, as the buffer section (6), a slit (7) for separating an area (AR) having a predetermined surface accuracy from one end (la) can be used. Also, an elastic hinge (8) connecting the region (AR) and the one end (la) can be used.

[0007] Further, in the method for supporting a plate member (21) having an area (AR) having a predetermined surface accuracy, the method includes the step of interposing a region (21a) between the area (AR) and the fixed area (21a) in the plate member (21). In addition, a buffer (26) for suppressing the transmission of deformation from the fixed area is provided. According to the present invention, since the deformation generated in the fixed region becomes difficult to be transmitted to the region having the predetermined surface accuracy, The surface accuracy of the plate member can be easily maintained.

For example, as the buffer section (26), a slit (27) for separating the area (AR) having a predetermined surface accuracy from the fixed area (2 la) can be used. Further, an elastic hinge (28) for connecting the area (AR) and the fixed area (21a) can be used.

A member (2, 22) having a surface (2b, 22b) opposed to the fixed region (la, 21a) of the plate member (1, 21) via a narrow gap (CL1, CL2) is arranged. In the case of suppressing the vibration of the plate member, the vibration of the plate member can be attenuated by the squeeze effect generated between the fixed area and the facing surface, so that various measurements using the plate member can be performed with high precision. The ability to do S.

[0008] A second invention provides a plate member support device (10) including a plate member (1) in which an area (AR) having a predetermined surface accuracy is formed, and a pedestal (2) for supporting the plate member. In the above, only one end of the plate member is fixed to and supported on the pedestal. According to the present invention, the plate member on which the region having the predetermined surface accuracy is formed is cantilevered, so that the contact area with the pedestal is reduced, and deformation of the plate member caused by fixing to the pedestal is suppressed. Can be.

[0009] Further, in a configuration in which a shock absorber (6) for suppressing the transmission of deformation from one end is provided between the one end (la) and the area (AR), the deformation generated at one end is a predetermined value. Since it is difficult to transmit to the area having the surface accuracy, the surface accuracy of the plate member can be further maintained.

For example, a slit (7) for separating an area (AR) having a predetermined surface accuracy from one end (la) can be used as the buffer section (6). Further, an elastic hinge (8) connecting the region (AR) and the one end (la) can be used.

[0010] Further, a plate member supporting device (20) including a plate member (21) in which an area (AR) having a predetermined surface accuracy is formed, and a pedestal (22) supporting the plate member is provided. Thus, between the region and the fixed region (21a) of the plate member, a buffer portion (26) for suppressing the transmission of deformation from the fixed region is provided. According to the present invention, it is difficult for the deformation generated in the fixed region to be transmitted to the region having the predetermined surface accuracy, so that the surface accuracy of the plate member can be easily maintained.

For example, as the buffer section (26), a slit (27) for separating the area (AR) having a predetermined surface accuracy from the fixed area (2 la) can be used. Also, the area (AR) and the fixed area An elastic hinge (28) for connecting with (21a) can be used.

In the case where the opposing surfaces (2b, 22b) facing the fixed areas (la, 21a) of the plate members (1, 21) with a narrow gap are provided on the pedestal (2, 22), the vibration of the plate members is reduced. Since the attenuation can be achieved by the squeeze effect generated between the fixed area and the facing surface, various measurements using the plate member can be performed with high accuracy.

Further, when the plate members (1, 21) are formed of ceramics or glass, deformation of the plate members due to thermal deformation can be suppressed.

[0011] The third invention is directed to a stage device (RST, WST) having a movable member (RS, XYS) movable on a mounting surface (RH, WH) with a plate (R, W) mounted thereon. In), the plate member supporting device (10, 20) using the method of the first invention or the plate member supporting device (10, 20) of the second invention is provided on the moving member. According to the present invention, since the stage device is provided with the plate member having the predetermined surface accuracy, it can be used as a reference for various measurements of the stage device.

In addition, the plate-like body (R, W) and the high flatness area (AR) of the plate member (BFP, AIS, WFP) supported by the plate member support device (10, 20) are at the same height. In the arrangement, the plate member can be used as a reference for measurement of the plate-like body.

A fourth invention has a mask stage (RST) holding a mask (R) and a substrate stage (WST) holding a substrate (W), and a pattern (PA) formed on the mask In the exposure apparatus (EX) for exposing the substrate to the substrate, the stage device (WST, RST) of the third invention is used for at least one of the mask stage and the substrate stage. According to the present invention, measurement of a mask or a substrate can be performed with high accuracy.

[0013] In a fifth invention, in a device manufacturing method including a lithographic process, the exposure apparatus (EX) of the fourth invention is used in the lithographic process. According to the present invention, a device having a fine pattern can be manufactured.

A sixth invention is an exposure apparatus for a display element for forming a predetermined pattern on a substrate mounted on a substrate stage, wherein an area (AR) having a predetermined surface accuracy is formed on the substrate stage. A plate member (1) and a pedestal (2) for supporting the plate member (1) are provided, and the plate member (1) is supported by fixing only one end (la) thereof to the pedestal (2). did. A seventh invention is an exposure apparatus for a display element for transferring a pattern formed on a mask mounted on a mask stage onto a substrate mounted on a substrate stage, wherein the mask stage and the substrate At least one of the stages is provided with a plate member (1) on which an area (AR) having a predetermined surface accuracy is formed and a pedestal (2) for supporting the plate member (1), and the plate member (1) is attached to the stage. Only one end (la) is fixed to the pedestal (2) and supported.

The invention's effect

According to the present invention, the following effects can be obtained.

According to a first aspect of the present invention, in a method for supporting a plate member on which a region having a predetermined surface accuracy is formed, only one end of the plate member is supported. According to the present invention, since the plate member on which the region having the predetermined surface accuracy is formed is cantilevered, the contact area with the member supporting the plate member is reduced, and the plate member is fixed to the support member. S can suppress deformation. Thus, the surface accuracy of the plate member is maintained, and various measurements and the like using the plate member can be performed with high accuracy.

Further, in the method for supporting a plate member having an area having a predetermined surface accuracy, a buffer for suppressing the transmission of the deformation of the fixed area force is provided between the area and the fixed area of the plate member. It was provided. According to the present invention, since the deformation generated in the fixed region is less likely to be transmitted to the region having the predetermined surface accuracy, the force S can easily maintain the surface accuracy of the plate member. Thereby, various measurements using the plate member can be performed with high accuracy.

[0015] A second invention is a plate member supporting device including a plate member in which a region having a predetermined surface accuracy is formed, and a pedestal supporting the plate member, wherein only one end of the plate member is fixed to the pedestal. To support. According to the present invention, since the plate member having the region having the predetermined surface accuracy is cantilevered, the contact area with the pedestal is reduced, and deformation of the plate member due to being fixed to the pedestal can be suppressed. it can. Thereby, the surface accuracy of the plate member is maintained, and various measurements and the like using the plate member can be performed with high accuracy.

Further, in a plate member supporting device including a plate member having a region having predetermined surface accuracy and a pedestal for supporting the plate member, a region between the region and the region to be fixed in the plate member, A buffer is provided to suppress the transmission of the deformation. According to the invention Then, it is difficult for the deformation generated in the fixed region to be transmitted to the region having the predetermined surface accuracy, so that the surface accuracy of the plate member can be easily maintained. Thereby, various measurements using the plate member can be performed with high accuracy.

[0016] A third invention is a stage device having a movable member on which a plate-shaped body can be mounted and movable, on a mounting surface, wherein the plate member supporting device using the method of the first invention on the movable member, Alternatively, a plate member supporting device according to the second invention is provided. According to the present invention, since the stage device is provided with the plate member having the predetermined surface accuracy, it can be used as a standard for various measurements of the stage device. Thereby, the force S for improving the positioning accuracy and the like of the stage device can be obtained.

[0017] A fourth invention is an exposure apparatus that has a mask stage for holding a mask and a substrate stage for holding a substrate, and that exposes a pattern formed on the mask to the substrate. On the other hand, the stage device of the third invention is used. According to the present invention, measurement of a mask or a substrate can be performed with high accuracy. As a result, the alignment between the mask and the substrate can be performed with high accuracy.

[0018] In a fifth aspect, in the device manufacturing method including the lithographic process, the exposure apparatus according to the fourth aspect is used in the lithographic process. According to the present invention, a device having a fine pattern can be manufactured. As a result, it is possible to increase the capacity of the semiconductor memory and increase the speed and integration of the CPU processor.

According to the sixth aspect, in the exposure apparatus for a display element, it is possible to measure a substrate with high accuracy.

Further, according to the seventh aspect, in the exposure apparatus for a display element, it is possible to measure a mask or a substrate with high accuracy.

Brief Description of Drawings

FIG. 1A is a plan view showing a first embodiment of a plate member supporting device.

FIG. 1B is a side view showing the first embodiment of the plate member supporting device.

[Figure 2] Diagram showing slits provided on plate member

FIG. 3A is a plan view showing a form in which an elastic hinge is provided on a plate member.

FIG. 3B is a side view showing an embodiment in which an elastic hinge is provided on a plate member. FIG. 4A is a plan view showing a second embodiment of the plate member supporting device.

FIG. 4B is a sectional view showing a second embodiment of the plate member supporting device.

FIG. 5A is a view showing a modification of the plate member supporting device.

FIG. 5B is a view showing a modification of the plate member supporting device.

[FIG. 6] A schematic diagram showing an exposure apparatus

[FIG. ₇ ] Diagrams showing various reference plates arranged on a wafer stage

FIG. 8 is a flowchart showing an example of a semiconductor device manufacturing process.

Explanation of symbols

[0020] 1, 21 plate member la—end (fixed area) 2, 22 pedestal (member) 2b, 22b facing portion (facing surface) 6, 26 cushioning portion 7 slit portion 8, 28 elastic hinge 10, 20 plate Member support device 21a Outer circumference (fixed area) 27 Slit hole CL1, CL2 Clearance AR area, surface to be inspected R reticle (plate, mask) PA circuit pattern (pattern) RH reticle holder (mounting surface) RS stage (Moving member) RST Reticle stage (stage device, mask stage) W Wafer (plate, substrate) WH Wafer holder (mounting surface) XY S XY stage (moving member) WST Wafer stage (stage device, substrate stage) EX Exposure equipment

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, a plate member supporting method and a plate member supporting device according to a first embodiment of the present invention will be described with reference to the drawings. 1A and 1B are diagrams showing a plate member supporting device 10, FIG. 1A is a plan view, and FIG. 1B is a side view.

The plate member supporting device 10 includes a plate member 1 on which an area AR having a predetermined surface accuracy is formed, and a pedestal 2 on which one end of the plate member 1 is supported. And the so-called cantilevered support. The pedestal 2 supporting the plate member 1 is also fastened and supported on the table 3 by fastening members 5 such as bolts. The plate member 1 is a plate-like member formed of low thermal expansion ceramics or glass, and includes one end (fixed area) la and a central part lc and a tip part lb. The region AR formed on the upper surface of the central portion lc has, for example, a flatness on the order of nanometers. Since the plate member 1 is made of a material with low thermal expansion, the accuracy of area AR due to thermal deformation is poor. Can be suppressed.

The pedestal (member) 2 is a plate-like member formed of a metal, a ceramic material, or the like, and has, on its upper surface, a joining portion 2a in contact with the plate member 1, a groove 2c dug down from the joining portion 2a, and a joining portion. An opposing portion (opposing surface) 2b formed slightly lower than the portion 2a is formed.

Then, as shown in FIG. 1, when the plate member 1 is cantilevered on the pedestal 2 by the fastening member 4, only one end la of the plate member 1 and the joint 2a of the pedestal 2 come into close contact, and the plate member 1 A gap of about several millimeters is formed between the center part lc of the base member 2 and the groove part 2c of the pedestal 2, and a gap of about 110 to 30 xm is formed between the tip part lb of the plate member 1 and the facing part 2b of the pedestal 2. CL1 is formed. As a result, the plate member 1 comes into contact with only the one end la in contact with the joint 2a of the pedestal 2, and comes into contact with any other members in the other portions.

As described above, the plate member 1 on which the region AR having high surface accuracy is formed is cantilevered on the pedestal 2, and the surface of the region AR generated by fastening the plate member 1 to the pedestal 2 Accuracy can be prevented from deteriorating. This is because, when the plate member 1 is supported on the pedestal 2 by a so-called double-sided support, or when substantially the entire surface of the plate member 1 is supported (closely attached) on the pedestal 2, the plate member 1 is deformed along the upper surface of the pedestal 2. Because it will do. That is, the area AR of the plate member 1 is affected by the surface accuracy of the upper surface of the pedestal 2. In order to avoid such inconvenience, it is necessary to form the upper surface of the pedestal 2 with high surface accuracy.

By supporting the plate member 1 on the pedestal 2 in a cantilevered manner as in the plate member supporting device 10 of the present embodiment, the deformation of the plate member 1 along the upper surface of the pedestal 2 is reduced. Therefore, the surface accuracy of the area AR of the plate member 1 can be maintained.

Further, since a gap CL1 of about 110 μm is formed between the distal end portion lb of the plate member 1 and the facing portion 2b of the pedestal 2, when the plate member 1 is vibrated in the vertical direction, In addition, this vibration can be suppressed by the squeeze effect generated in the gap CL1.

Here, the squeeze effect is defined as the fluid (air) existing between the two surfaces (gap CL1) when the relative distance between the two surfaces (tip lb, opposing portion 2b) fluctuates periodically. The effect is that the relative distance between the two surfaces fluctuates due to the kinematic viscosity of the surface. When the fluid existing between the two surfaces is air as in the present embodiment, the gap CL1 is preferably set to the above-described level. As described above, the vibration of the plate member 1 is suppressed by the squeeze effect generated in the gap CL1, and the surface accuracy of the area AR of the plate member 1 can be dynamically maintained.

[0024] Further, between the one end la of the plate member 1 and the area AR having high surface accuracy, a buffering section for suppressing the distortion of the one end la caused by the axial force or the like of the fastening member 4 from being transmitted to the area AR. 6 may be provided.

FIG. 2 is a diagram showing a configuration in which a slit portion 7 is provided in the configuration of FIGS. 1A and 1B, and FIGS. 3A and 3B are diagrams showing a configuration in which an elastic hinge 8 is provided in the configuration of FIGS. 1A and 1B.

As described above, when the slit section 7 is provided as the buffer section 6, the distortion generated at one end la is transmitted so as to be interrupted by the slit section 7 or to bypass the slit section 7. Therefore, the influence on the area AR is reduced. In addition, when the elastic hinge 8 is provided, the distortion generated at the one end la is released (the elastic hinge 8 is deformed) in the elastic hinge 8 having low rigidity, so that the influence on the area AR is reduced.

As described above, the provision of the buffer portion 6 between the one end la of the plate member 1 and the region AR having high surface accuracy suppresses the influence of the axial force of the fastening member 4 and the like, and furthermore, the region of the plate member 1 Area The surface accuracy of AR can be maintained.

Next, a plate member supporting method and a plate member supporting device according to a second embodiment will be described with reference to the drawings. 4A and 4B are views showing the plate member supporting device 20, FIG. 4A is a plan view, and FIG. 4B is a cross-sectional view along AA in FIG. 4A. Note that the same members as those of the plate member supporting device 10 according to the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

The plate member supporting device 20 is composed of a plate member 21 in which an area AR having a predetermined surface accuracy is formed, and a pedestal 22 on which the plate member 21 is supported. Is fastened and supported by a fastening member 4 such as a bolt. The pedestal 22 supporting the plate member 21 is also fastened and supported on the table 3 by the fastening members 5 such as bolts on the three feet 22d provided on the outer periphery of the pedestal 22. In FIGS. 4A and 4B, two bolts are used for each fastening point.

The plate member 21 is a flat plate-shaped member formed of low thermal expansion ceramic or glass, and has a central portion 21c where an area AR having a predetermined surface accuracy is formed, and a central hole 21c formed by a slit hole. Opening and surrounding a frame-shaped outer part (fixed area) 21a, center part 21c and outer part It is configured with three elastic hinges 28 connecting the 21a and the force. The area AR formed on the upper surface of the central portion 21c is formed, for example, with a flatness of nanometer order. Since the plate member 21 is formed of a material having low thermal expansion, it is possible to suppress the deterioration of the accuracy of the area AR due to thermal deformation.

The pedestal (member) 22 is a plate-shaped member formed of a metal, a ceramic material, or the like, and has on its upper surface an opposing portion 22b (opposing surface) opposing the central portion 21c of the plate member 21, and an opposing portion 22b. An outer peripheral portion 22a formed so as to surround b and also has a lower opposed portion 22b, and three protruding portions 22c formed on the outer peripheral portion 22a and in contact with the outer peripheral portion 21a of the plate member 21. You. Further, on the outer periphery of the pedestal 22, the above-described three feet 22d are provided via elastic hinges 29. The lower surface of the foot portion 22d (the contact surface with the table 3) is formed slightly below the lower surface of the pedestal 22 (table 3 side).

Then, as shown in FIGS. 4A and 4B, when the plate member 21 is fastened and supported on the pedestal 22 by the fastening member 4, only the outer peripheral portion 21a of the plate member 21 and the protruding portion 22c of the pedestal 22 come into close contact, and the plate member 21 A gap is formed between the base member 22 and the pedestal 22, and a gap CL2 of about 110 / im is formed between the central portion 21c of the plate member 21 and the facing portion 22b of the pedestal 22.

Further, when the pedestal 22 is fastened and supported on the table 3 by the fastening member 5, the foot 22 d of the pedestal 22 and the upper surface of the table 3 come into close contact with each other, and about 1 to 30 A gap CL3 of about μm is formed.

As described above, by supporting the plate member 21 on which the area AR having high surface accuracy is formed on the pedestal 22 via the slit hole 27 and the elastic hinge 28, the plate member 21 is fastened to the pedestal 22. The resulting area AR can be prevented from deteriorating in surface accuracy. This is because between the outer peripheral portion 21a to be fastened and supported and the central portion 21c in which the region AR is formed, a buffer portion for suppressing the distortion of the outer peripheral portion 21a caused by the axial force or the like of the fastening member 4 from being transmitted to the region AR. This is because the slit hole 27 and the elastic hinge 28 as 26 are provided. That is, the transmission of the distortion generated in the outer peripheral portion 21 a by the axial force of the fastening member 4 is cut off by the slit hole 27. Furthermore, since the distortion transmitted so as to bypass the slit hole 7 is released to the elastic hinge 28 having low rigidity (the elastic hinge 28 is deformed), the influence on the area AR is reduced. In order to obtain such an effect, the elastic hinge 28 is separated from the fastening member 4 as much as possible. It is desirable to provide them at spaced positions. The reason for this is that the distortion transmission distance from the outer peripheral portion 21a to the area AR is increased to reduce the influence on the area AR.

Thus, by providing the buffer portion 26 between the outer peripheral portion 2 la of the plate member 21 and the central portion 21 c where the region AR having high surface precision is formed, the influence of the axial force of the fastening member 4 is suppressed. The surface accuracy of the area AR of the plate member 21 can be maintained.

The pedestal 22 itself is also fastened and supported on the table 3 by the fastening member 5, but since the elastic hinge 29 is provided between the foot 22d and the outer peripheral portion 22a, the distortion generated in the foot 22d is reduced by the elastic hinge. Thus, the transmission to the outer peripheral portion 22a is suppressed.

In this manner, the influence of the axial force or the like of the fastening members 4 and 5 can be suppressed, and the surface accuracy of the area AR of the plate member 21 can be maintained.

[0028] Further, since a gap CL2 of about 110 to 30 xm is formed between the central portion 21c of the plate member 21 and the facing portion 22b of the pedestal 2, the vertical vibration generated in the plate member 21 is reduced. Vibration can be controlled by the squeeze effect of CL2. Further, a gap CL3 of about 110 / im is formed between the upper surface of the table 3 and the lower surface of the pedestal 22, so that the upward and downward vibration generated in the pedestal 22 is controlled by the squeezing effect of the gap CL3. Can be shaken.

Thus, even if the table 3 vibrates, the vibration of the plate member 21 is suppressed by the squeeze effect generated in the gaps CL2 and CL3, and the surface accuracy of the area AR of the plate member 21 is dynamically maintained. it can.

Next, a modification of the plate member supporting device of the second embodiment will be described. 5A and 5B are views showing a modification of the plate member supporting device 20. FIG. The same members as those of the plate member supporting device 20 in the second embodiment are denoted by the same reference numerals, and description thereof will be omitted.

The plate member supporting device 20 shown in FIG. 5A changes the fastening position between the plate member 21 and the pedestal 22. That is, the positions of the three fastening members 4 are substantially evenly arranged on the outer peripheral portion 21a of the plate member 21. Then, the positions of the three elastic hinges 28 are also substantially equally arranged so as to be separated from the three fastening members 4 respectively. For this reason, in terms of shape, the force S at which the elements are arranged in a well-balanced manner, and the outer peripheral portion 21a of the plate member 21 is slightly over-restricted to the central portion 21c. That is, the three fastening members 4 bind the same component in the same horizontal direction. However, the plate member supporting device 20 can also provide a The surface accuracy of the area AR of the material 21 can be sufficiently maintained.

The plate member supporting device 20 shown in FIG. 5B is one in which an outer peripheral portion 21a and a central portion 21c of a plate member 21 are connected by two elastic hinges 28. For this reason, the outer peripheral portion 21a of the plate member 21 does not become excessively restrained with respect to the central portion 21c. However, one of the elastic hinges 28 is disposed close to the fastening member 4. Further, since the center portion 21c is supported by the two elastic hinges 28, the support is somewhat unstable. However, even with such a plate member supporting device 20, the surface accuracy of the area AR of the plate member 21 can be sufficiently maintained.

Note that, in the configuration of FIGS. 1A to 5B, instead of fixing the plate members 1 and 21 to the pedestals 2 and 22, the plate members 1 and 21 may be fixed directly to the table 3. In this case, predetermined gaps CL1 and CL2 may be formed between the plate members 1 and 21 and a part of the upper surface of the tape holder 3, and the damping action by the squeeze effect may be obtained in these gaps CL1 and CL2. .

Next, an embodiment of a stage apparatus, an exposure apparatus, and a device manufacturing method using the above-described plate member supporting apparatuses 10 and 20 will be described with reference to the drawings. FIG. 6 is a conceptual diagram showing an exposure apparatus EX of the present invention.

The exposure apparatus EX irradiates the reticle (plate, mask) R with the exposure light EL, and relatively synchronously moves the reticle R and the eno, (plate, substrate) W in the one-dimensional direction. The exposure apparatus EX, which is a so-called “scanning” stepper, is a step-and-scan type scanning exposure apparatus that transfers the circuit pattern PA formed on the reticle R onto the wafer W via the projection optical system PL. As shown in the figure, the exposure light source 101, the illumination optical system IL that illuminates the reticle R with uniform illuminance with the exposure light EL based on the light beam emitted from the light source 101, the reticle stage RST that supports the reticle R, and the reticle R The projection optical system PL that irradiates the wafer W with the exposure light EL emitted from the force, the wafer stage WST that supports the wafer W, the focal position detection system sensor AF, and various alignment optical system sensors RA, WA1, WA2, etc. Is provided.

In the following description, the direction coincident with the optical axis AX of the projection optical system PL is defined as the Z-axis direction, and the synchronous movement direction (running direction) between the reticle R and the wafer W is defined as X in a plane perpendicular to the Z-axis direction. The direction perpendicular to the axial direction, the Z-axis direction, and the X-axis direction (non-running direction) is the Y-axis direction. Change The directions around the X axis, the Y axis, and the Z axis are the Θ Θ, θ Υ, and Θ Ζ directions, respectively.

As the light source 101, vacuum ultraviolet rays having a wavelength of about 120 nm to about 190 nm, for example, an ArF excimer laser (wavelength: 193 nm), a fluorine (F) laser (157 nm), a krypton (Kr) laser (1

twenty two

46 nm) and a light source that generates an argon (Ar) laser (126 nm) or the like is used. This implementation

2

In the embodiment, an ArF excimer laser beam is used.

The light source 101 is also provided with a light source control device (not shown). The light source control device responds to an instruction from the control device CONT to control the oscillation center wavelength and the spectral half-width of the emitted exposure light EL. Control, trigger control of pulse oscillation, etc.

[0034] The illumination optical system IL includes optical components such as a relay lens system, an optical path bending mirror, and a condenser lens system arranged in a predetermined positional relationship within the housing.

Then, the laser beam emitted from the light source 101 enters the illumination optical system IL, and the illumination beam (exposure light) EL whose cross-sectional shape of the laser beam is shaped and the illuminance distribution is substantially uniform is obtained, and the reticle stage RST The circuit pattern area of the reticle R supported by the reticle is irradiated with a substantially uniform illuminance distribution.

The wavelength of the exposure light EL is substantially equal to the wavelength of the light source 101.

[0035] Reticle stage (stage device, mask stage) RST scans reticle R with reticle holder (placement surface) RH that holds reticle R by suction using a vacuum suction method or a method using an electrostatic chuck or an electromagnet. A stage (moving member) RS that moves by a predetermined stroke in the direction, and a reticle stage driving unit RSTD such as a linear motor that moves these stages. The stage RS has a rectangular opening, and the reticle R is held by a reticle holder RH provided around the opening by vacuum suction or the like. A movable mirror 110 extending in the Y-axis direction and a movable mirror (not shown) extending in the X-axis direction are provided on the stage RS. The movable mirror 110 is irradiated from the laser interferometer 121 via the measuring beam power S mirror 122. The reflected light from the movable mirror 110 is received by a detector in the laser interferometer 121, and the position of the reticle R in the X-axis direction is detected based on the result of the reception. Similarly, a movable mirror extending in the X-axis direction is also irradiated with a measurement beam from a laser interferometer (not shown), and the position of the reticle R in the Y-axis direction is detected based on the reflected light. The detection result of the laser interferometer 121 etc. is output to the controller CONT. It is.

The projection optical system PL is formed by sealing a plurality of projection lens systems such as a lens made of a fluoride crystal such as fluorite and lithium fluoride and a reflecting mirror with a projection system housing, and directly below the reticle stage RST. Is provided. As the projection lens system, a reduction system that reduces the exposure light EL emitted through the reticle R at a predetermined projection magnification (for example, 1Z4) is used.

Then, when the reticle R is irradiated with illumination light (ultraviolet light) from the illumination optical system IL, a portion of the pattern area formed on the reticle R from the portion illuminated by the ultraviolet light is irradiated. The imaging light flux enters the projection optical system PU, and a partial inverted image of the circuit pattern PA is elongated in the Y-axis direction at the center of the field of view on the image plane side of the projection optical system PL for each pulse irradiation of the ultraviolet pulse light. The image is limited to a slit shape or a rectangular shape (polygon). As a result, the projected partial inverted image of the circuit pattern PA is reduced and transferred to one of the plurality of shot areas on the wafer W arranged on the image plane of the projection optical system PL.

[0037] Wafer stage (stage device, substrate stage) WST is a XY stage (moving member) XYS, which can move within a two-dimensional plane (XY plane) by a wafer stage driving unit WSTD equipped with a linear motor. ZΘ stage ZS provided on stage XYS and micro-rotatable in and around the Z-axis by wafer stage driver WSTD, and ZΘ stage ZS provided on ZΘ stage ZS for vacuum chucking of wafer W ゃ electrostatic chuck It has a wafer holder (placement surface) WH that holds by suction in a system. The XY stage XYS has a structure in which a pair of blocks that can move in directions perpendicular to each other are stacked, and can move in the X-axis direction and the Y-axis direction on the equipment base based on the drive of the wafer stage drive unit WSTD. Has become. Further, the wafer stage WST is provided so as to be movable also in the direction of inclination with respect to the optical axis of the projection optical system PL, so that when the wafer W is supported, position adjustment including leveling adjustment of the wafer W is enabled. I have.

Further, a movable mirror 111 extending in the Y-axis direction and a movable mirror 112 (see FIG. 7) extending in the X-axis direction are provided on wafer stage WST. The movable mirror 111 is irradiated with a measurement beam from a laser interferometer 123 via a mirror 124. Then, the reflected light from the moving mirror 111 is received by a detector in the laser interferometer 123, and the X-ray A position in the axial direction is detected. Similarly, a movable mirror 112 extending in the X-axis direction is irradiated with a measurement beam from a laser interferometer (not shown), and the position of the wafer W in the Y-axis direction is detected based on the reflected light. Then, the detection result of the laser interferometer 123 and the like is output to the control device CONT.

FIG. 7 is a diagram showing various reference plates arranged on the wafer stage. As shown in Fig. 7, the positions on the wafer stage WST that do not interfere with the wafer holder WH are used for the baseline measurement of the reference plane plate BFP used to adjust the focus position detection sensor AF and the baseline measurement of the wafer alignment sensor WA1. The reference plane plate AFP used for measurement of the position of the reticle R by the reticle alignment sensor RA of the VRA method and the reference plane plate WFP for alignment measurement used for the baseline measurement of the wafer alignment sensors WA1 and WA2. Provided.

These reference plane plates (plate members) BFP, AFP, and WFP are made of a member having a low expansion coefficient such as ceramics or glass, and the upper surface thereof (the surface (area) AR to be detected by various sensors described later) has a predetermined plane. It is formed to have a degree.

Further, the surface AR to be inspected (the height and inclination in the Z-axis direction) is set so as to substantially coincide with the surface (exposed surface) of the wafer W (see FIG. 1B). Below the reference plane plate AFP, an AIS light receiving system (not shown) capable of receiving light passing through the reference plane plate AFP is embedded in the wafer stage WST.

Then, an AIS mark (not shown) is formed on the reference flat plate AFP by chromium evaporation or the like.

Similarly, on the surface of the reference flat plate WFP for alignment measurement, various reference marks (Fiduciary marks) FM (not shown) are formed by chromium evaporation or the like. The reference mark group FM includes VRA marks used in the reticle alignment sensor RA, LSA marks used in the wafer alignment sensors WA1 and WA2, LIA marks, and FIA marks (the positional deviation is not shown). In. These marks are formed at predetermined positions determined in advance based on the VRA marks.

The mark force corresponding to the AIS mark and the VRA mark is formed at a predetermined position on the lower surface side of the reticle R by chromium evaporation or the like. The above-mentioned plate member supporting devices 10 and 20 are applied to these reference plane plates BFP, AFP and WFP. As a result, the test surface AR of the reference flat plates BFP, AFP, and WFP is installed without distortion due to fastening or the like, and a predetermined flatness is maintained.

Referring back to FIG. 6, the focus position detection system (autofocus) sensor AF is a sensor for detecting the position (focal position) of the surface of the wafer W in the Z-axis direction, and is provided on the side of the projection optical system PL. It includes a light transmitting unit 151 and a light receiving unit. The illustration of the light receiving unit is omitted.

The non-photosensitive detection light is emitted from the light transmitting unit 151 to the wafer W. A number of slits are provided between the light transmitting unit and the wafer W, and the detection light illuminates a plurality of slit lights, and the images of these slit lights are inclined with respect to the optical axis of the projection optical system PL. Is projected onto the wafer W. The light receiving unit detects the detection light reflected on the wafer W. When detecting the best imaging plane (best focus plane), the wafer stage WST is driven to change the position of the wafer W in the Z-axis direction while moving from the light transmitting part of the focus position detection sensor AF to the wafer W. On the other hand, the detection light is irradiated, and the light receiving unit detects the light generated by the wafer W force by the irradiation of the detection light, and the best imaging plane is detected based on the detection result. Since the focus position detection sensor AF is a multipoint AF sensor, the inclination of the wafer W can also be detected.

The exposure apparatus EX includes a reticle alignment system RA of a TTR (Through The Reticule) system and a video reticle alignment system (VRA) as a reticle alignment system. In addition, as an off-axis wafer alignment system, an FIA (Field Image Alignment) type wafer alignment system sensor WA1 is provided. Further, as a wafer alignment system of a TTL (through the lens) system, a wafer alignment system sensor WA2 of an LSA (Laser Step Alignment) system or an LIA (Laser Interferometric Alignment) system is provided.

The reticle alignment sensor RA is provided between the illumination optical system IL and the reticle stage RST, and uses exposure light EL as alignment light. The VRA type reticle alignment sensor RA includes an optical system 145 that guides the exposure light EL as alignment light to the reference plane plate WFP, and a light receiving unit that receives light generated from the FIA mark by the irradiation of the alignment light. 146.

Then, the reticle alignment sensor RA corresponds to the reticle R provided with a predetermined mark. Illuminates the alignment light based on the exposure light EL emitted from the illumination optical system IL, and irradiates the reference mark group FM provided on the reference plane plate WFP on the wafer stage WST via the projection optical system PL . Further, reticle alignment sensor RA receives light (reflected light) generated by reticle R force by irradiation of alignment light and light (reflected light) generated from reference plane plate WFP of wafer stage WST via projection optical system PL. ) Is received and reticle R is aligned.

[0042] The wafer alignment sensor WA1 of the FIA type or the out-of-axis type is provided on the side of the projection optical system PL, and includes an alignment light source 134 for emitting alignment light having a wavelength different from that of the exposure light EL. The optical system includes optical systems 135 and 137 for guiding the alignment light emitted from the alignment light source 134 to the reference mark group FM, and a light receiving unit 136 for receiving light generated from the FIA mark by the irradiation of the alignment light.

Prior to performing the alignment process, the wafer alignment sensor WA1 irradiates a mark for AIS and a mark for FIA, and based on the measurement result, determines the relative position between the reticle R and the wafer alignment sensor WA2. Is obtained.

An LSA or LIA type wafer alignment sensor WA2 includes an alignment light source 131, optical systems 132 and 138 for causing the alignment light emitted from the alignment light source 131 to enter the projection optical system PL, and alignment light. And a light receiving unit 133 that receives light generated from the reference mark group FM by the irradiation of the light.

The LSA alignment system is disclosed in detail in, for example, Japanese Patent Application Laid-Open No. 60-130742. Further, the alignment system of the LIA system is disclosed in detail in, for example, JP-A-61-215905.

Then, prior to performing the alignment process, the LSA mark and the LIA mark formed on the reference mark group FM are irradiated, and the position measurement reference of the wafer W is obtained based on the measurement result.

Subsequently, an exposure operation by the exposure apparatus EX having the above configuration will be briefly described.

First, a preparation operation is performed prior to the exposure operation under the control of the controller CONT.

Specifically, multiple slit lights are sent from the focus position detection sensor AF to the reference plane plate BFP. By projecting light, offset adjustment (origin adjustment) of a plurality of slit lights is performed.

Then, after various exposure conditions are set, the reticle alignment sensor RA measures the reference flat plate WFP and performs reticle alignment. In addition, the wafer alignment sensor WA1 measures the reference plane plate AFP, and the baseline measurement of the alignment sensor is performed. Further, the reference flat plate WFP is measured by the wafer alignment sensors WA1 and WA2, and fine alignment of the wafer W (enhanced Grono no alignment (EGA), etc.) is performed. Thus, the arrangement coordinates of the plurality of shot areas on the wafer W are obtained.

When the above-described alignment operation is completed, the control device CONT monitors the measurement values of the X-axis laser interferometer 123 and the Y-axis laser interferometer on the wafer W side based on the alignment result, and performs the first shot of the wafer W (first time). The wafer stage drive WSTD is commanded to move the wafer stage WST to the acceleration start position (running start position) for exposure of the (th shot area).

Then, at the scanning start position, under the control of the control device CONT, a plurality of slit lights are projected from the focus position detection system sensor AF to the wafer W, and the Z stage ZS is driven, so that the circuit pattern PA of the reticle R is formed. The work of adjusting the exposure surface of the wafer W to the image plane (focusing) is performed.

When the preparation work is completed, the controller CONT instructs the reticle stage driving unit RSTD and the wafer stage driving unit WSTD to start scanning in the X-axis direction with the reticle stage RST and the wafer stage WST (XY stage XYS). When the reticle stage RST and the wafer stage WST reach their respective target scanning speeds, the exposure light EL irradiates the pattern area of the reticle R, and scanning exposure starts.

Then, different areas of the pattern area of the reticle R are sequentially illuminated with the exposure light EL, and the illumination of the entire pattern area is completed, thereby completing the scanning exposure for the first shot area on the wafer W. As a result, the circuit pattern PA of the reticle R is reduced and transferred to the resist layer in the first shot area on the wafer W via the projection optical system PL. When the scanning exposure for this first shot area is completed, the controller CONT Then, the wafer stage WST moves stepwise in the X and Y axis directions, and moves to the acceleration start position for exposure in the second shot area. That is, an inter-shot stepping operation is performed.

Then, the scanning exposure described above is performed on the second shot area.

In this way, the running exposure of the shot area of the wafer W and the stepping operation for the exposure of the next shot area are repeatedly performed, and the circuit pattern の of the reticle R is present in all the exposure target shot areas on the wafer W. The images are sequentially transferred.

As described above, in the preparatory work prior to the exposure work, the various sensors (AF, RA, WAl, WA2) described above apply the reference planes BFP, AFP, WFP to each of the test surface AR or the test surface AR. The various marks formed are measured.

At this time, the surface AR to be inspected of the reference plane plates BFP, AFP, and WFP maintains high flatness, so that the surface AR to be inspected or various marks formed on the surface AR can be measured with high accuracy. S can do it. In addition, the vibration of the reference plane plates BFP, AFP, and WFP caused by the movement of the wafer stage WST is also damped by the squeeze effect. Can be measured.

Thereby, the alignment of the reticle R and the wafer W and the leveling of the wafer W are performed with high precision, so that the fine circuit pattern PA can be exposed on the wafer W. In addition, it is possible to increase the capacity of the semiconductor memory and increase the speed and increase the integration of the CPU processor.

[0047] The operation procedure described in the above-described embodiment, or the various shapes and combinations of the constituent members are merely examples, and may be based on the process conditions, design requirements, and the like without departing from the gist of the present invention. Various changes can be made. The present invention includes, for example, the following changes.

[0048] In the exposure apparatus EX, the plate members to which the plate member supporting devices 10, 20 are applied include the reference plane plates BFP, AFP, and WFP. For example, the present invention may be applied to a member for measuring an illuminance amount and illuminance unevenness arranged on a wafer stage.

The force S described in the case where the plate members BFP, AFP, and WFP to which the plate member supporting devices 10 and 20 are applied is placed on the wafer stage WST, for example, on the reticle stage RST May be arranged.

An exposure apparatus to which the present invention is applied uses a step-and-repeat type exposure apparatus that exposes a pattern of a mask while keeping the mask and the substrate stationary and sequentially moves the substrate in steps. Is also good.

Further, as an exposure apparatus to which the present invention is applied, a proximity exposure apparatus that exposes a mask pattern by bringing a mask into close contact with a substrate without using a projection optical system may be used.

The application of the exposure apparatus is not limited to an exposure apparatus for manufacturing semiconductor devices. For example, an exposure apparatus for a liquid crystal for exposing a liquid crystal display element pattern to a square glass plate and a thin film magnetic head are manufactured. It can be widely applied to an exposure apparatus for performing the above.

In addition, the present invention appropriately takes necessary liquid countermeasures also for an immersion exposure apparatus that forms a predetermined pattern on a substrate via a liquid supplied between a projection optical system and a substrate (wafer). Is applicable. The structure and exposure operation of the immersion exposure apparatus are disclosed, for example, in WO 99/49504, JP-A-6-124873, and JP-A-10-303114. To the extent permitted by national legislation in the designated country (or selected elected country) specified in this international application, the disclosures in the above publications and corresponding US patents are incorporated herein by reference.

The present invention is also applicable to a twin-stage type exposure apparatus. The structure and exposure operation of a twin-stage type exposure apparatus are disclosed in, for example, JP-A-10-163099 and JP-A-10-214783, and JP-T-2000-505958, which are disclosed in US Pat. No. 6,208,407. I have. To the extent permitted by national legislation in the designated country (or selected elected country) specified in this international application, the disclosures in the above publications and corresponding US patents shall be incorporated by reference into the description of the wood specification.

Further, as disclosed in Japanese Patent Application Laid-Open No. 11-135400, an exposure stage capable of holding and moving a substrate to be processed, such as a wafer, and a measurement stage having various measurement members and sensors. The present invention can also be applied to an exposure apparatus having: To the extent permitted by national law in the designated country (or selected elected country) specified in this international application, the disclosures in the above publications and corresponding US patents are hereby incorporated by reference. The light source of the exposure apparatus to which the present invention is applied includes not only a KrF excimer laser (248 nm), an ArF excimer laser (193 nm), an F2 laser (157 nm), but also g-line (436 nm) and i-line. (365 nm) or the like can be used. Furthermore, the magnification of the projection optical system is not limited to the reduction system, but may be the same magnification or magnification system, or may be shifted.

When a linear motor is used for the wafer stage and the reticle stage, either an air levitation type using an air bearing or a magnetic levitation type using Lorentz force or reactance force may be used. The stage may be a type that moves along a guide or a guideless type that does not have a guide. Further, when a planar motor is used as the stage driving device, one of the magnet unit (permanent magnet) and the armature unit is connected to the stage, and the other of the magnet unit and the armature unit is connected to the stage moving surface ( Base).

The reaction force generated by the movement of the wafer stage is mechanically controlled by using a frame member as described in JP-A-8-166475 and US Pat. No. 5,528,118 corresponding thereto. You may escape to the floor (earth). To the extent permitted by national law of the designated country (or selected elected country) specified in this international application, the disclosures in the above publications and corresponding US patents are incorporated by reference into this specification.

[0055] The reaction force generated by the movement of the reticle stage can be measured mechanically by using a frame member as described in JP-A-8-330224 and the corresponding US Patent 5,874,820. You may escape to the floor (ground). To the extent permitted by national law in the designated country (or selected elected country) specified in this international application, the disclosures in the above publications and corresponding US patents are hereby incorporated by reference.

[0056] Further, the exposure apparatus to which the present invention is applied controls various subsystems including the respective constituent elements recited in the claims of the present application while maintaining predetermined mechanical accuracy, electrical accuracy, and optical accuracy. So, it is manufactured by assembling. To ensure these various precisions, before and after this assembly, adjustments to achieve optical precision for various optical systems, adjustments to achieve mechanical precision for various mechanical systems, and adjustments to achieve mechanical precision, Adjustments are made to achieve electrical accuracy for various electrical systems. The assembly process from the various subsystems to the exposure apparatus involves mechanical connections, electrical circuit wiring connections, and pneumatic circuit piping between the various subsystems. Connections are included. It goes without saying that there is an individual assembly process for each subsystem before the assembly process from these various subsystems to the exposure apparatus. When the process of assembling the various subsystems into the exposure equipment is completed, comprehensive adjustments are made to ensure the various precisions of the entire exposure equipment. It is desirable that the exposure apparatus be manufactured in a tallied room where the temperature, cleanliness, etc. are controlled.

As shown in FIG. 8, a microdevice such as a semiconductor device has a step 201 for designing the function and performance of the microdevice, a step 202 for fabricating a mask (reticle) based on the design step, and a device substrate. Step 203 of manufacturing a certain substrate, substrate processing step 204 of exposing a mask pattern to the substrate by the exposure apparatus EX of the above-described embodiment, device assembling step (including dicing step, bonding step, package step) 205, inspection製造 Manufactured through Step 206 etc.

Claims

The scope of the claims

[I] In a method for supporting a plate member on which an area having a predetermined surface accuracy is formed,

A method for supporting a plate member, wherein only one end of the plate member is supported.

[2] The method of supporting a plate member according to claim 1, wherein a buffering portion for suppressing transmission of deformation from the one end is provided between the one end and the region.

3. The method of supporting a plate member according to claim 2, wherein the buffer section is a slit that separates the area from the one end.

4. The method according to claim 2, wherein the buffer is an elastic hinge connecting the region and the one end.

[5] In a method for supporting a plate member on which an area having a predetermined surface accuracy is formed,

A method of supporting a plate member, comprising: providing a buffer between the region and a fixed region of the plate member for suppressing transmission of deformation from the fixed region.

6. The method according to claim 5, wherein the buffer is a slit that separates the region from the fixed region.

7. The method according to claim 5, wherein the buffer is an elastic hinge that connects the area and the fixed area.

[8] The method according to any one of [1] to [7], wherein a member having a surface facing a fixed region of the plate member via a narrow gap is disposed to suppress vibration of the plate member. The method for supporting a plate member according to claim 1.

[9] In a plate member supporting device including: a plate member having an area having a predetermined surface accuracy formed thereon; and a pedestal supporting the plate member.

A plate member supporting device, wherein only one end of the plate member is fixed and supported on the pedestal.

10. The plate member supporting device according to claim 9, wherein a buffer for suppressing the transmission of deformation from the one end is provided between the one end and the region.

[II] The plate member supporting apparatus according to claim 10, wherein the buffer section is a slit for separating the area from the one end.

[12] The buffer is an elastic hinge connecting the region and the one end. The plate member supporting device according to claim 10 or 11, wherein

[13] A plate member supporting device including a plate member having an area having a predetermined surface accuracy and a pedestal supporting the plate member,

A plate member supporting device, comprising: a buffering portion that suppresses transmission of deformation from the fixed region between the region and a fixed region of the plate member.

14. The plate member supporting method according to claim 13, wherein the buffer section is a slit that separates the area from the fixed area.

15. The plate member supporting method according to claim 13, wherein the buffer section is an elastic hinge connecting the area and the fixed area.

[16] The plate member support according to any one of [9] to [15], wherein an opposing surface facing the fixed region of the plate member via a narrow gap is provided on the pedestal. apparatus.

17. The plate member supporting device according to claim 9, wherein the plate member is formed of ceramic or glass.

[18] In a stage device having a movable member that can move the plate-shaped body on the mounting surface, the method according to any one of claims 1 to 5 is performed on the movable member. 18. A stage device comprising the plate member support device according to claim 9, or the plate member support device according to any one of claims 9 to 17.

19. The stage device according to claim 18, wherein the plate-like body and the high flatness region of the plate member supported by the plate member supporting device are arranged at the same height.

[20] An exposure apparatus having a mask stage for holding a mask and a substrate stage for holding a substrate, and exposing a pattern formed on the mask to the substrate.

Claim 18 or Claim 18, wherein at least one of the mask stage and the substrate stage is provided.

20. An exposure apparatus using the stage apparatus according to 19.

[21] A method for manufacturing a device, comprising using the exposure apparatus according to claim 20 in a method for manufacturing a device including a lithographic process.

[22] An exposure apparatus for a display element for forming a predetermined pattern on a substrate mounted on a substrate stage, The substrate stage includes a plate member on which a region having a predetermined surface accuracy is formed, and a pedestal supporting the plate member, wherein the plate member has only one end of the plate member fixed to the pedestal. An exposure apparatus, wherein the exposure apparatus is supported.

An exposure apparatus for a display element for transferring a pattern formed on a mask mounted on a mask stage onto a substrate mounted on a substrate stage, comprising:

At least one of the mask stage and the substrate stage includes a plate member in which a region having a predetermined surface accuracy is formed, and a pedestal supporting the plate member, wherein the plate member includes an end portion of the plate member. An exposure apparatus, wherein only the pedestal is fixedly supported by the pedestal.