JP2006066589A - Stage device and exposure equipment, device-manufacturing method and method of driving stage device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a stage device by which vibrations are suppressed and stabilization time can be reduced. <P>SOLUTION: The stage device 10 is provided with a base member 1 having an upper surface 3, a movable member 2 which has a lower surface 4 facing the upper surface 3 and moves relative to the base member 1, an air bearing 5 which supplies gas between the upper surface 3 and the lower surface 4, and an adjustment system 11, which adjusts at least either the rigidity or the damping ratio of the air bearing 5 according to the state of movement of the movable member 2. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a stage apparatus, an exposure apparatus, a device manufacturing method, and a stage apparatus driving method.

Semiconductor devices and liquid crystal display devices are manufactured by a so-called photolithography technique in which a pattern formed on a mask is transferred onto a photosensitive substrate. An exposure apparatus used in this photolithography process has a mask stage for supporting a mask and a substrate stage for supporting a substrate, and a mask pattern is transferred via a projection optical system while sequentially moving the mask stage and the substrate stage. It is transferred to the substrate. Conventionally, in the above-described substrate stage and mask stage (hereinafter, collectively referred to as “stage apparatus” as appropriate), the movable member is supported in a non-contact manner with respect to the base member using a fluid bearing (gas bearing, hydrostatic bearing). A configuration in which the movable member is driven by a driving device such as a linear motor is employed. The following patent document discloses an example of a technique related to a stage apparatus provided with a gas bearing.
JP 2003-232352 A

  By the way, the stage apparatus of the exposure apparatus has a configuration in which the movable member holding the substrate or the mask moves on the base member. In order to improve the throughput of the exposure apparatus, the settling time of the movable member is as much as possible. It is preferable to shorten it. Here, the settling time refers to the time until the moving state is stabilized after the moving state of the movable member reaches a predetermined range (allowable range) with respect to the target state. In order to perform exposure with high accuracy, it is preferable to perform exposure in a state where generation of vibration is suppressed.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a stage apparatus that can suppress the occurrence of vibration and can shorten the settling time. It is another object of the present invention to provide an exposure apparatus that can accurately expose with high throughput using such a stage apparatus, and a device manufacturing method using the exposure apparatus. It is another object of the present invention to provide a method for driving a stage apparatus that can suppress the occurrence of vibration and can shorten the settling time.

  In order to solve the above-described problems, the present invention adopts the following configuration corresponding to FIGS. 1 to 10 shown in the embodiment. However, the reference numerals with parentheses attached to each element are merely examples of the element and do not limit each element.

  According to the first aspect of the present invention, the first member (1) having the first member (1) having the first surface (3) and the second surface (4) opposed to the first surface (3). ) In a stage apparatus including a second member (2) that moves relative to the first member (2) and a fluid bearing (5) that supplies fluid between the first surface (3) and the second surface (4). A stage device (10) is provided that includes an adjusting device (11) that adjusts at least one of the rigidity and the damping ratio of the fluid dynamic bearing (5) according to the movement state of the second member (2). .

  According to the first aspect of the present invention, when the second member is supported in a non-contact manner on the first member by the fluid bearing, the adjusting device can adjust the rigidity and damping ratio of the fluid bearing according to the moving state of the second member. The vibration of the second member can be suppressed by adjusting at least one of them. That is, in a state where the second member is supported in a non-contact manner on the first member by the fluid bearing, vibration is suppressed when the damping ratio of the fluid bearing is increased. Therefore, when the vibration of the second member is to be suppressed, the adjustment device can suppress the vibration of the second member by increasing the damping ratio of the fluid bearing. Therefore, in the vicinity of the timing when the moving state of the second member reaches a predetermined range (allowable range) with respect to the target state, the adjusting device increases the damping ratio of the fluid bearing without causing vibrations. The moving state of the second member can be immediately stabilized. Therefore, the settling time can be shortened. On the other hand, if the second member is moved at a large acceleration, for example, with the damping ratio of the fluid bearing increased, the non-contact state between the first member and the second member is not well maintained, and the first member and the second member are not maintained. There is a possibility that the inconvenience of contact with the member may occur. However, in such a moving state, the adjustment device can prevent the above inconvenience by increasing the rigidity of the fluid bearing.

  Here, as described above, the settling time refers to the time until the moving state is stabilized after the moving state of the second member reaches a predetermined range (allowable range) with respect to the target state.

  According to the second aspect of the present invention, in the exposure apparatus that exposes the substrate (P) while moving the stage apparatus (MST, PST), an exposure apparatus that uses the stage apparatus (10) of the above aspect as the stage apparatus ( EX1, EX2) are provided.

  According to the second aspect of the present invention, the exposure apparatus can expose the substrate with high accuracy and high throughput by using the stage apparatus that can shorten the settling time and suppress the vibration.

  According to the third aspect of the present invention, a device manufacturing method using the exposure apparatus (EX1, EX2) of the above aspect is provided.

  According to the third aspect of the present invention, since the substrate can be exposed with high precision and high throughput, a device having a desired performance can be manufactured with high productivity.

  According to the fourth aspect of the present invention, the first member (1) has the first member (1) having the first surface (3) and the second surface (4) facing the first surface (3). ) Stage device comprising a second member (2) that moves relative to the first member (2) and a fluid bearing (5) that supplies fluid between the first surface (3) and the second surface (4). In the driving method of 10), there is provided a driving method of the stage apparatus including adjusting at least one of rigidity and damping ratio of the fluid dynamic bearing (5) according to a moving state of the second member (2). The

  According to the fourth aspect of the present invention, when the second member is supported in a non-contact manner on the first member by the fluid bearing, the adjusting device can adjust the rigidity and damping ratio of the fluid bearing according to the moving state of the second member. The vibration of the second member can be suppressed by adjusting at least one of them. That is, in a state where the second member is supported in a non-contact manner on the first member by the fluid bearing, vibration is suppressed when the damping ratio of the fluid bearing is increased. Therefore, when the vibration of the second member is to be suppressed, the adjustment device can suppress the vibration of the second member by increasing the damping ratio of the fluid bearing. Therefore, in the vicinity of the timing when the moving state of the second member reaches a predetermined range (allowable range) with respect to the target state, the adjusting device increases the damping ratio of the fluid bearing without causing vibrations. The moving state of the second member can be immediately stabilized. Therefore, the settling time can be shortened. On the other hand, if the second member is moved at a large acceleration, for example, with the damping ratio of the fluid bearing increased, the non-contact state between the first member and the second member is not well maintained, and the first member and the second member are not maintained. There is a possibility that the inconvenience of contact with the member may occur. However, in such a moving state, the adjustment device can prevent the above inconvenience by increasing the rigidity of the fluid bearing.

  ADVANTAGE OF THE INVENTION According to this invention, generation | occurrence | production of a vibration can be suppressed and the stage apparatus which can shorten settling time can be provided. Therefore, it is possible to provide an exposure apparatus capable of performing exposure with high throughput and accuracy by performing exposure while moving the mask or the substrate using such a stage apparatus. Thereby, the device which has desired performance can be manufactured.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto.

<Stage device>
FIG. 1 is a schematic view showing an embodiment of the stage apparatus of the present invention. Here, in the following description, an XYZ orthogonal coordinate system is set, and the description will be made with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as the X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as the Y-axis direction, and a direction orthogonal to the X-axis direction and the Y-axis direction (that is, the vertical direction) is defined as the Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

  In FIG. 1, the stage device 10 has a base member (first member) 1 having an upper surface (first surface) 3 and a lower surface (second surface) 4 opposite to the upper surface 3. A movable movable member (second member) 2 and an air bearing (fluid bearing) 5 for supporting the movable member 2 in a non-contact manner with respect to the base member 1 are provided. The air bearing 5 is provided on the lower surface 4 of the movable member 2 and supplies gas between the upper surface 3 of the base member 1 and the lower surface 4 of the movable member 2 including the lower surface (pad surface) of the air bearing 5. . The air bearing 5 supplies a gas between the upper surface 3 of the base member 1 and the lower surface 4 of the movable member 2, and a gas between the upper surface 3 of the base member 1 and the lower surface 4 of the movable member 2. And an intake port 5B for suction. Each of the upper surface 3 and the lower surface 4 is a surface substantially parallel to a plane (XY plane) including the X axis and the Y axis. The air bearing 5 has a constant gap (gap) between the upper surface 3 of the base member 1 and the lower surface 4 of the movable member 2 due to the balance between the repulsive force caused by the blowing of gas from the supply port 5A and the suction force generated by the intake port 5B. ) To support the movable member 2 in a non-contact manner with respect to the upper surface 3 of the base member 1. The movable member 2 is guided to the upper surface 3 of the base member 1 in a state where the lower surface 4 of the movable member 2 and the upper surface 3 of the base member 1 are opposed to each other, and is driven by the driving device 13 such as a linear motor. It can move in a predetermined direction.

  Furthermore, the stage device 10 connects the gas supply device 6 that sends out the gas as utility, the gas supply device 6 and the supply port 5A of the air bearing 5, and the flow path 8 (8A to 8C) through which the gas flows, A pressure adjusting device 7 provided in the middle of the flow path 8 and capable of adjusting the pressure of gas supplied between the upper surface 3 of the base member 1 and the lower surface 4 of the movable member 2 from the supply port 5A of the air bearing 5; It has. The pressure adjusting device 7 includes, for example, an electropneumatic regulator. A controller 9 is connected to the pressure adjusting device 7, and the operation of the pressure adjusting device 7 is controlled by the controller 9.

  The gas supply device 6 and the pressure adjustment device 7 are connected by a pipe member 8A that forms a flow path, and the gas sent from the gas supply device 6 flows through the flow path of the pipe member 8A to the pressure adjustment device 7. Sent. The pressure adjusting device 7 and the supply port 5A of the air bearing 5 are connected via a tube member 8B that forms a flow channel and an internal flow channel 8C that is formed inside the movable member 2. The delivered gas flows through the flow path of the pipe member 8B and the internal flow path 8C, and is blown out between the upper surface 3 of the base member 1 and the lower surface 4 of the movable member 2 from the supply port 5A.

  The controller 9 controls the operation of the pressure adjusting device 7 to control the amount of gas supplied to the supply port 5A per unit time, and thus the amount of gas supplied between the upper surface 3 and the lower surface 4 from the supply port 5A. Adjust the pressure (supply pressure). That is, in this embodiment, the adjusting device 11 that adjusts the pressure of the gas supplied from the supply port 5A is configured to include the pressure adjusting device 7 and the controller 9 that controls the operation of the pressure adjusting device 7. .

  The movable member 2 is provided with an acceleration sensor 12 capable of measuring the acceleration of the movable member 2 that moves on the base member 1. The acceleration sensor 12 is configured to measure acceleration information about at least the X-axis direction and the Y-axis direction of the movable member 2 that moves. Of course, the acceleration sensor 12 may be configured to measure acceleration information regarding the Z-axis direction, the θX, θY, and θZ directions in addition to the X-axis direction and the Y-axis direction. The measurement result of the acceleration sensor 12 is output to the controller 9.

  The adjusting device 11 can adjust the rigidity (spring component) and the damping ratio (damper component) of the air bearing 5 by adjusting the pressure (supply pressure) of the gas supplied from the supply port 5A. More specifically, the adjusting device 11 can adjust the rigidity and damping ratio of the gas between the upper surface 3 and the lower surface 4.

  In the air bearing 5, the rigidity increases as the supply pressure from the supply port 5A increases, and the rigidity decreases as the supply pressure decreases. Further, in the air bearing 5, when the supply pressure from the supply port 5A decreases, the damping ratio increases. On the other hand, when the supply pressure increases, the damping ratio decreases. Therefore, the adjustment device 11 can adjust the rigidity and the damping ratio, which are the dynamic characteristics of the air bearing 5, by adjusting the supply pressure from the supply port 5A. The adjusting device 11 can also adjust the resonance frequency and vibration mode by adjusting the rigidity and damping ratio of the air bearing 5.

  Then, the adjusting device 11 adjusts the supply pressure from the supply port 5A according to the movement state of the movable member 2 on the base member 1, thereby adjusting at least one of the rigidity and the damping ratio of the air bearing 5. adjust.

  Here, the moving state of the movable member 2 is a relative moving state of the movable member 2 with respect to the base member 1 in the X-axis direction or the Y-axis direction, and the movable member 2 is accelerated relative to the base member 1. The acceleration of the movable member 2 is changed to a steady state including an acceleration state, a moving state at a constant speed, and a stationary state, a decelerating deceleration state, and a transition from an acceleration or deceleration state to a steady state. Includes settling conditions until stable. Furthermore, the moving state of the movable member 2 includes the acceleration value of the movable member 2 in each of an acceleration state, a deceleration state, a steady state, and a settling state.

  In the present embodiment, the adjusting device 11 adjusts the supply pressure from the supply port 5 </ b> A according to the acceleration in the X axis direction or the Y axis direction of the movable member 2 with respect to the base member 1.

<Driving method of stage device>
Next, a method for driving the stage apparatus 10 having the above-described configuration will be described. In the present embodiment, an example in which the moving state of the movable member 2 in a predetermined direction (for example, the X-axis direction) is changed in the order of the acceleration state, the deceleration state, and the stop state (steady state) and those states are repeated. I will explain.

  FIG. 2 is a graph showing the moving state of the movable member 2 that changes in the order of the acceleration state, the deceleration state, the settling state, and the stop state, where the horizontal axis is the elapsed time, and the vertical axis is the acceleration of the second member 2. . In FIG. 2, an acceleration time T <b> 1 is a time during which the movable member 2 is in an accelerated state with respect to the base member 1. The deceleration time T2 is a time during which the movable member 2 is in a deceleration state with respect to the base member 1. The stop time (steady time) T4 is a time during which the movable member 2 is in a stopped state with respect to the base member 1. The settling time T3 is a time during which the movable member 2 is in a settling state. After the acceleration of the movable member 2 reaches a predetermined range (allowable range) with respect to a target value (in this case, zero), Time until acceleration stabilizes (completely zero).

  In the present embodiment, the supply pressure from the supply port 5A is adjusted using the adjusting device 11 so that the settling time T3 is as short as possible. In order to shorten the settling time T3, it is necessary to quickly suppress the damped vibration in the transient state when transitioning from the deceleration state to the stop state. Further, in the present embodiment, the supply pressure from the supply port 5A is adjusted using the adjustment device 11 so that the vibration of the movable member 2 in the stopped state (steady state) is suppressed as much as possible.

  Here, when the damping ratio of the air bearing 5 is increased, the vibration of the movable member 2 is suppressed. Therefore, when the adjustment device 11 wants to suppress the vibration of the movable member 2 (that is, in the settling state or the stopped state (steady state)), the adjustment device 11 is connected to the supply port 5A so that the damping ratio of the air bearing 5 is increased. Adjust to reduce supply pressure.

  Specifically, the adjusting device 11 decreases the supply pressure from the supply port 5A and increases the damping ratio of the air bearing 5 at a predetermined timing when the movable member 2 transitions from the deceleration state to the stop state. In the present embodiment, the adjusting device 11 receives the signal from the supply port 5A at the timing t1 when the acceleration of the movable member 2 reaches a predetermined set value A1 in the deceleration state of the movable member 2 (during the deceleration time T2). The supply pressure is made smaller than the supply pressure when the acceleration of the movable member 2 is larger than the set value A1. As a result, the damping ratio of the air bearing 5 is increased during the settling time T3, so that damping vibration in a settling state can be quickly suppressed and the settling time T3 can be shortened.

  Even when the movable member 2 is in the stopped state, the adjustment device 11 reduces the supply pressure from the supply port 5A to increase the damping ratio of the air bearing 5, thereby allowing the movable member 2 in the stopped state to move. Vibration can be suppressed.

  On the other hand, as shown in the schematic diagram of FIG. 3, when the movable member 2 is moved in the X-axis direction by the drive device 13 such as a linear motor, the position of the center of gravity G of the movable member 2 and the movable member 2 are If the position of the thrust acting point F by the driving device 13 for movement is different, the movable member 2 rotates in the θY direction, and the positional relationship (relative distance) between the lower surface 4 of the movable member 2 and the upper surface 3 of the base member 1. , Gap) fluctuates. Such inconvenience becomes significant when the acceleration of the movable member 2 is large. That is, when the position of the center of gravity G of the movable member 2 and the position of the thrust acting point F for moving the movable member 2 are different, if the movable member 2 moves with a large acceleration, the movable member 2 and the base member 1 are moved. There is a high possibility that a situation (so-called “galling”) will occur. Similarly, when the movable member 2 is decelerated rapidly, the possibility of galling increases.

  Therefore, when the acceleration of the movable member 2 is large, the adjustment device 11 increases the pressure of the gas supplied from the supply port 5A and increases the rigidity of the air bearing 5. By increasing the rigidity of the air bearing 5, even if a force in the θY direction acts on the movable member 2, the high rigidity of the air bearing 5 can prevent the movable member 2 from rotating in the θY direction. As a result, it is possible to avoid the situation (galling) in which the movable member 2 and the base member 1 are in contact with each other.

  That is, as shown in FIG. 2, in the section K1 in which the movable member 2 moves at an acceleration (including acceleration and deceleration) larger than a predetermined acceleration A1, the above-described galling is relatively high. In the section K2 in which gas is supplied from the supply port 5A at the first pressure and moved at an acceleration smaller than the acceleration A1, the gas is supplied at a second pressure smaller than the first pressure in order to suppress the vibration of the movable member 2. The movable member 2 can be moved while realizing both suppression of vibration and prevention of galling.

  Here, the adjustment device 11 can adjust the supply pressure from the supply port 5 </ b> A based on the measurement result of the acceleration sensor 12 provided in the movable member 2. Since the measurement result of the acceleration sensor 12 is output to the controller 9, the controller 9 determines that the acceleration of the movable member 9 is larger than the predetermined value A1 based on the measurement result of the acceleration sensor 12. At this time, gas is supplied from the supply port 5A at a relatively high first pressure so that the above-mentioned galling does not occur. On the other hand, when it is determined that the acceleration of the movable member 9 is smaller than the predetermined value A1 based on the measurement result of the acceleration sensor 12, the second pressure is relatively low so that the movable member 2 does not vibrate. Then, gas is supplied from the supply port 5A.

  Alternatively, in the case where the movable member 2 is configured to be moved by a driving device 13 such as a linear motor based on predetermined control information (acceleration profile), the controller 9 does not depend on the measurement result of the acceleration sensor 12. Alternatively, the measurement result of the acceleration sensor 12 may be used together, and the pressure of the gas supplied from the supply port 5A may be adjusted based on the control information. In this case, the controller 9 may store the control information in advance, or the control device that controls the driving device 13 may adjust the control information to the adjusting device 11 (controller) in synchronization with the movement of the movable member 2. 9), the adjustment device 11 (pressure adjustment device 7) may be adjusted. Moreover, when controlling the pressure regulator (electropneumatic regulator) 7 according to the acceleration of the movable member 2, it is preferable to control in consideration of the response time (response delay) of the pressure regulator 7.

  As described above, when the movable member 2 is supported on the base member 1 by the air bearing 5 in a non-contact manner, the adjusting device 11 adjusts the damping ratio of the air bearing 5 according to the moving state of the movable member 2. Thus, both suppression of vibration of the movable member 2 and prevention of galling can be realized. That is, when the vibration of the movable member 2 is desired to be suppressed, the adjustment device 11 can suppress the vibration of the movable member 2 by increasing the damping ratio of the air bearing 5. Then, in the vicinity of the timing t1 when the moving state of the movable member 2 reaches a predetermined range (allowable range) with respect to the target state (stopped state), the adjustment device 11 increases the damping ratio of the air bearing 5; The moving state of the movable member 2 can be immediately stabilized without generating vibration. Therefore, the settling time T3 can be shortened. On the other hand, when the movable member 2 is moved with a large acceleration while the damping ratio of the air bearing 5 is increased, the non-contact state between the base member 1 and the movable member 2 is not well maintained, and the base member 1 and the movable member 2 are not maintained. However, in such a moving state, the adjustment device 11 can prevent galling by increasing the rigidity of the air bearing 5. In the present embodiment, the rigidity and damping ratio of the air bearing 5 can be adjusted with a simple configuration in which only the supply pressure is changed without changing the structure of the air bearing 5.

  In the present embodiment, when the acceleration of the movable member 2 is the first acceleration larger than A1, the adjustment device 11 supplies gas at the first pressure from the supply port 5A, and the acceleration of the movable member 2 increases. When the second acceleration is smaller than A1, the supply pressure is adjusted in two stages such that gas is supplied from the supply port 5A at the second pressure ((1) First acceleration ≧ A1; second acceleration <two steps of A1, or (2) first acceleration> A1; second acceleration ≦ two steps of A1). However, the present invention is not limited to this, and the pressure of the gas supplied from the supply port 5A may be adjusted according to the acceleration of the movable member 2 in any two or more stages, or in a stepless manner. Depending on the acceleration of the member 2, the pressure of the gas supplied from the supply port 5A may be adjusted. In the description with reference to FIG. 2, the pressures of the gas supplied from the supply port 5A in the settling section T3 and the steady section T4 are the same, but may be different. Then, among the movable member 2 that moves in a predetermined section, when the acceleration is at a peak, the supply pressure from the supply port 5A is maximized, and when the acceleration is zero, that is, when the movable member 2 is stopped or fixed. By controlling so that the supply pressure from the supply port 5A is minimized when moving at high speed, it is possible to obtain both effects of preventing vibration and preventing galling.

  In the present embodiment, the position of the base member 1 is fixed, and the movable member 2 moves on the base member 1, but a configuration in which the base member 1 also moves is conceivable. In the case of such a configuration, the adjusting device 11 uses the pressure of the gas supplied from the supply port 5 </ b> A according to the relative acceleration between the base member (first member) 1 and the movable member (second member) 2. Can be adjusted.

<First Embodiment of Exposure Apparatus>
Next, the case where the above-described stage apparatus is applied to an exposure apparatus will be described as an example. FIG. 4 is a schematic block diagram that shows the first embodiment of the exposure apparatus, in which the pattern of the mask M is exposed on the substrate P while the mask M and the substrate P are stationary, and the substrate P is sequentially moved stepwise. It is a step-and-repeat type exposure apparatus.

  In FIG. 4, an exposure apparatus EX1 includes a mask stage MST that supports a mask M, a substrate stage PST that supports a substrate P, and an illumination optical system IL that illuminates the mask M supported by the mask stage MST with exposure light EL. A projection optical system PL that projects and exposes an image of the pattern of the mask M illuminated by the exposure light EL onto the substrate P supported by the substrate stage PST, and a control device CONT that controls the overall operation of the exposure apparatus EX1. It has. Here, the “substrate” includes a semiconductor wafer coated with a resist, and the “mask” includes a reticle on which a device pattern to be reduced and projected on the substrate is formed. In FIG. 4, the direction (vertical direction) coinciding with the optical axis AX of the projection optical system PL is the Z-axis direction, the predetermined direction in the horizontal plane is the X-axis direction, and the Z-axis direction and the X-axis direction are in the horizontal plane. The direction orthogonal to the Y-axis direction.

The illumination optical system IL illuminates the mask M supported by the mask stage MST with the exposure light EL, and the exposure light source, and an optical integrator and an optical integrator for uniformizing the illuminance of the light beam emitted from the exposure light source A condenser lens that collects the exposure light EL from the lens, a relay lens system, a field stop for setting an illumination area on the mask M by the exposure light EL, and the like. A predetermined illumination area on the mask M is illuminated with the exposure light EL having a uniform illuminance distribution by the illumination optical system IL. As the exposure light EL emitted from the illumination optical system IL, for example, far ultraviolet light (g-line, h-line, i-line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, DUV light), vacuum ultraviolet light (VUV light) such as ArF excimer laser light (wavelength 193 nm) and F ₂ laser light (wavelength 157 nm), or the like is used.

  The mask stage MST is a movable member that can move while supporting the mask M, and can be slightly moved on the base member 21 in the X-axis direction and the Y-axis direction and can be slightly rotated in the θZ direction. An air bearing 25 is provided on the lower surface 24 of the mask stage MST. Mask stage MST is supported in a non-contact manner by air bearing 25 with respect to upper surface (guide surface) 23 of base member 21. A movable mirror 40 for the laser interferometer 41 is provided on the mask stage MST. The two-dimensional direction position and rotation angle of the mask M on the mask stage MST are monitored by the laser interferometer 41. The laser interferometer 41 and the control device CONT are connected, and the measurement result of the laser interferometer 41 is output to the control device CONT. The control device CONT is supported by the mask stage MST by driving the mask stage MST using a mask stage driving device MSTD including a linear motor or the like based on the measurement result of the laser interferometer 41. The mask M is positioned.

  The projection optical system PL projects and exposes the pattern of the mask M onto the substrate P at a predetermined projection magnification β, and is composed of a plurality of optical elements. These optical elements are supported by a lens barrel PK. . In the present embodiment, the projection optical system PL is a reduction system having a projection magnification β of, for example, 1/4 or 1/5. Note that the projection optical system PL may be either an equal magnification system or an enlargement system.

  The substrate stage PST is a movable member that can move while supporting the substrate P. The substrate stage PST can move in the X-axis direction and the Y-axis direction on the base member 31 and can rotate in the θZ direction. An air bearing 35 is provided on the lower surface 34 of the substrate stage PST. The air bearing 35 is provided with a supply port 35A for blowing out gas. The air bearing 35 also has an intake port for sucking gas, but this is not shown in FIG. The substrate stage PST is supported in a non-contact manner by an air bearing 35 with respect to the upper surface (guide surface) 33 of the base member 31. Furthermore, the substrate stage PST can be tilted in the θX direction and the θY direction, and can also be moved in the Z-axis direction. A movable mirror 42 for the laser interferometer 43 is provided on the substrate stage PST. The two-dimensional position and rotation angle of the substrate P on the substrate stage PST are monitored by the laser interferometer 43. Further, the position in the Z-axis direction and the tilt angle of the surface of the substrate P on the substrate stage PST are detected by a focus detection system (not shown). The laser interferometer 43 and the focus detection system are connected to the control device CONT, and the measurement results of the laser interferometer 43 and the focus detection system are output to the control device CONT. Based on the measurement result of the laser interferometer 43, the control device CONT drives the substrate stage PST using the substrate stage driving device PSTD including a linear motor, thereby positioning the substrate P supported by the substrate stage PST. . Further, the control device CONT drives the substrate stage PST using the substrate stage driving device PSTD based on the detection result of the focus detection system, so that the surface of the substrate P supported by the substrate stage PST and the projection optical system Match with the PL image plane.

  A substrate alignment system 45 that detects an alignment mark on the substrate P or a reference mark (not shown) provided on the substrate stage PST is provided near the tip of the projection optical system PL. In the substrate alignment system 45 of the present embodiment, for example, as disclosed in Japanese Patent Laid-Open No. 4-65603, the substrate stage PST is stopped and illumination light such as white light from a halogen lamp is irradiated on the mark. Thus, an FIA (Field Image Alignment) system is employed in which an image of the obtained mark is captured within a predetermined imaging field by an image sensor and the position of the mark is measured by image processing.

  A mask alignment system 44 that detects a reference mark (not shown) provided on the substrate stage PST via the mask M and the projection optical system PL is provided in the vicinity of the mask stage MST. In the mask alignment system 44 of the present embodiment, for example, as disclosed in JP-A-7-176468, the mark is irradiated with light, and image data of the mark imaged by a CCD camera or the like is subjected to image processing. The VRA (Visual Reticle Alignment) method is used to detect the mark position.

  FIG. 5 is a plan view showing the substrate P supported on the substrate stage PST of the exposure apparatus EX1. In FIG. 5, on the substrate P, a plurality of shot areas S1 to S16 to which the pattern image of the mask M is transferred are preset in a matrix. In FIG. 5, each of the shot areas S1 to S16 is set in a substantially square shape. The projection area AR of the projection optical system PL is also set in a square shape according to the shot areas S1 to S16.

  Next, a procedure for exposing the substrate P will be described. Before the substrate P is exposed, a baseline that is the distance between the projection area AR of the projection optical system PL and the detection area of the substrate alignment system 45 is measured using the mask alignment system 44 and the substrate alignment system 45. When performing baseline measurement, the reference mark provided on the substrate stage PST is measured by the mask alignment system 44 and the substrate alignment system 45. For example, when the reference mark on the substrate stage PST is measured using the substrate alignment system 45, the control device CONT moves the substrate stage PST, arranges the reference mark below the substrate alignment system 45, and the substrate stage. With the PST substantially stopped, the reference mark on the substrate stage PST is measured using the substrate alignment system 45. When the substrate P is exposed, the alignment mark provided along with the shot areas S1 to S16 on the substrate P is measured using the substrate alignment system 45. Also when measuring the alignment mark provided on the substrate P, the control device CONT moves the substrate stage PST, arranges the alignment mark below the substrate alignment system 45, and substantially stops the substrate stage PST. In this state, the alignment mark on the substrate P is measured using the substrate alignment system 45.

  Thus, when measuring the reference mark or alignment mark using the substrate alignment system 45 (or the mask alignment system 44), the control device CONT moves the substrate stage PST while accelerating and decelerating the base member 31. Then, a reference mark or alignment mark is placed under the substrate alignment system 45, and measurement is performed with the substrate stage PST substantially stopped. In the state where the substrate stage PST is moving while accelerating or decelerating, the control device CONT is connected to the air bearing 35 in order to prevent the substrate stage PST and the base member 31 from being galled. 11 is used to increase the supply pressure from the supply port 35A of the air bearing 35 and decrease the damping ratio of the air bearing 35 (increase the rigidity). On the other hand, in the state where the substrate stage PST is stopped or in the settling state immediately before stopping the substrate stage PST, the control device CONT uses the adjustment device 11 to supply the supply port in order to suppress the vibration of the substrate stage PST. The supply pressure from 35A is reduced to increase the damping ratio of the air bearing 35. Since the control device CONT can measure the reference marks and the alignment marks by the alignment systems 44 and 45 while suppressing the vibration of the substrate stage PST, the measurement accuracy of the alignment systems 44 and 45 can be improved.

  Further, when exposing each of the shot areas S1 to S16 on the substrate P, the control device CONT moves the substrate stage PST, so that the first shot area (for example, S1) among the plurality of shot areas S1 to S16. And the projection area AR of the projection optical system PL are aligned, and the pattern of the mask M is exposed to the first shot area with the substrate P (substrate stage PST) stopped. Then, after the exposure for the first shot area is completed, the controller CONT moves stepwise while accelerating and decelerating the substrate stage PST, and a second shot area (for example, S2) different from the first shot area. And the projection area AR of the projection optical system PL are aligned, and the pattern of the mask M is exposed to the second shot area with the substrate P (substrate stage PST) stopped.

  Even when the plurality of shot areas S1 to S16 are sequentially exposed, in order to prevent the substrate stage PST and the base member 31 from galling in a state where the substrate stage PST is moving stepwise while accelerating or decelerating, the above-described shot areas S1 to S16 are exposed. As in the embodiment described above, the adjustment device 11 connected to the air bearing 35 increases the supply pressure from the supply port 35A of the air bearing 35 and decreases the damping ratio of the air bearing 35 (increases the rigidity). ). On the other hand, in the state where the substrate stage PST is stopped in order to expose the shot areas S1 to S16 or in the settling state immediately before the substrate stage PST is stopped, the adjustment device 11 is used to suppress the vibration of the substrate stage PST. However, the supply pressure from the supply port 35A is reduced, and the damping ratio of the air bearing 35 is increased. Since the exposure apparatus EX1 can expose the pattern of the mask M onto the substrate P in a state where the vibration of the substrate stage PST is suppressed, the exposure accuracy can be improved.

  It is of course possible to connect the adjusting device 11 to the air bearing 25 that supports the mask stage MST with respect to the base member 21 in a non-contact manner. In that case, during exposure of the substrate P (during irradiation of the exposure light EL to the mask M), the adjustment device 11 increases the attenuation ratio of the air bearing 25 provided in the mask stage MST, thereby During exposure, the vibration of the mask stage MST can be suppressed.

<Second Embodiment of Exposure Apparatus>
Next, a second embodiment of the exposure apparatus will be described. In the following description, the same or equivalent components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted. FIG. 6 is a schematic block diagram that shows the second embodiment of the exposure apparatus, which is a scanning exposure apparatus (so-called scanning stepper) that exposes the pattern of the mask M onto the substrate P while moving the mask M and the substrate P synchronously. It is.

  As in the first embodiment, the illumination optical system IL of the exposure apparatus EX2 according to the second embodiment includes an exposure light source 51, an optical integrator 52, relay lens systems 53 and 56, a bending mirror 57, a condenser lens 58, and the like. However, the illumination optical system IL in the exposure apparatus EX2 according to the second embodiment is an auto reticle that moves following the movement of the mask M as disclosed in, for example, WO 99/63585. A blind 55 is provided. This auto-reticle blind 55 also has a movable blade 55B that is supported in a non-contact manner by an air bearing with respect to a base member (not shown in FIG. 6). It is driven by the driving device 55A. A fixed blind 54 is disposed near the movable blade 55B. Further, the mask stage MST according to the second embodiment can move on the base member 21 with a predetermined stroke in the X-axis direction when the synchronous movement direction (scanning direction) of the mask M and the substrate P is the X-axis direction. Is provided.

  FIG. 7 is a plan view showing the substrate P supported on the substrate stage PST of the exposure apparatus EX2. In FIG. 7, on the substrate P, a plurality of shot areas S1 to S16 to which the pattern image of the mask M is transferred are preset in a matrix. In the present embodiment, the projection area AR of the projection optical system PL is set to a rectangular shape (slit shape) having a smaller size in the X-axis direction than the shot areas S1 to S16.

  Next, a procedure for exposing the substrate P will be described. Similar to the first embodiment, before the substrate P is exposed, measurement processing using the mask alignment system 44 and the substrate alignment system 45 is performed. When the shot areas S1 to S16 on the substrate P are exposed after the measurement process is completed, the control unit CONT moves the mask stage MST supporting the mask M and the substrate stage PST supporting the substrate P in the X-axis direction. The pattern image of the mask M is projected and exposed onto the substrate P while moving in the (scanning direction). During scanning exposure, a part of the pattern image of the mask M is projected into the projection area via the projection optical system PL, and is synchronized with the movement of the mask M in the −X direction (or + X direction) at a substantially constant speed V. Then, the substrate P moves with respect to the projection area in the + X direction (or -X direction) at a substantially constant speed β · V (β is the projection magnification). Then, after the exposure to the first shot area (for example, S1) among the plurality of shot areas S1 to S16 set on the substrate P, the next second shot area (for example, S2) is performed by the stepping movement of the substrate P. ) Is moved to the scanning start position, and scanning exposure processing is sequentially performed on each of the shot regions S1 to S16 while moving the substrate P by the step-and-scan method.

  Even when the plurality of shot regions S1 to S16 are sequentially scanned and exposed, the substrate stage PST and the base member 31 are prevented from being galled when the substrate stage PST is moving stepwise while accelerating or decelerating. In addition, as in the above-described embodiment, the adjusting device 11 connected to the air bearing 35 increases the supply pressure from the supply port 35A of the air bearing 35 and decreases the damping ratio of the air bearing 35 (stiffness). Increase). Further, when the substrate stage PST is moving stepwise, the mask stage MST moves greatly while accelerating and decelerating from the exposure end position to the exposure start position, but the air bearing 25 provided on the mask stage MST also moves. Since the adjustment device 11 is connected, when the mask stage MST is moving greatly while accelerating or decelerating, the adjustment device 11 is used to prevent galling between the mask stage MST and the base member 21. The supply pressure from the supply port 25A of the air bearing 25 provided in the MST is increased to reduce the damping ratio of the air bearing 25 (increase the rigidity). Further, like the mask stage MST, the movable blade 55B of the auto reticle blind 55 may move greatly while accelerating and decelerating, but the adjusting device 11 is also connected to the air bearing provided in the auto reticle blind 55. . Therefore, when the movable blade 55B of the auto reticle blind 55 is moving greatly while accelerating or decelerating, the adjusting device 11 is provided on the auto reticle blind 55 to prevent the movable blade 55B and the base member from being galling. The supply pressure from the air bearing supply port is increased to reduce the air bearing damping ratio (increase the rigidity).

  On the other hand, in order to expose the shot areas S1 to S16, the substrate stage PST is moved at a constant speed, or the settling state when the substrate stage PST is moved from the accelerated or decelerated state to the steady state where the substrate stage PST is moved at a constant speed. In order to suppress the vibration of the substrate stage PST, the adjustment device 11 decreases the supply pressure from the supply port 35A and increases the damping ratio of the air bearing 35. Since the exposure apparatus EX2 can expose the pattern of the mask M onto the substrate P in a state where the vibration of the substrate stage PST is suppressed, the exposure accuracy can be improved.

  Similarly, during exposure of the shot areas S1 to S16, the mask stage MST and the movable blade 55B of the auto reticle blind 55 also move at a constant speed, but the adjustment device 11 is an air bearing 25 provided on the mask stage MST. By reducing the supply pressure from the supply port 25A and the supply pressure from the supply port of the air bearing provided in the auto reticle blind 55, the mask stage MST and the auto reticle are exposed during the exposure of the shot areas S1 to S16. Blind vibration can be suppressed.

  FIG. 8 is a perspective view showing an example of the substrate stage PST, and FIG. 9 is a cross-sectional view taken along the line AA in FIG. 8 and 9, the substrate stage PST is guided in the X-axis direction by the X guide member 120 and moved in the X-axis direction by the X linear motor 121. Here, the X linear motor 121 includes a mover 121M provided on the substrate stage PST and a stator 121C provided on the X guide member 120. As shown in FIG. 9, the substrate stage PST has a frame member 130 provided so as to surround the X guide member 120, and the substrate stage PST is placed on the lower surface 34 with respect to the upper surface 33 of the base member 31. An air bearing 35 for non-contact support is provided. The air bearing 35 supports the substrate stage PST including the frame member 130 in a non-contact manner with respect to the base member 31, so that the ceiling surface 130 </ b> A and the bottom surface 130 </ b> B of the frame member 130 and the X guide member 120 are related to the Z-axis direction. The gap Gz is maintained. An air bearing 135 having a supply port 135A is provided on the inner side surface 130C of the frame member 130. By this air bearing 135, the pad surface of the air bearing 135, and consequently the inner side surface 130C of the frame member 130, A gap Gy with respect to the guide member 120 in the Y-axis direction is maintained.

  Further, as shown in FIG. 8, the X guide member 120 is provided in the Y axis direction by the guide portions 123B at the upper end portions of the support members 123 that are substantially L-shaped in side view provided on both sides of the base member 31 in the X axis direction. Guided to move to. The guide part 123B (support member 123) is provided at a position corresponding to each of both ends of the X guide member 120, and a guided part corresponding to the guide part 123B is provided at each of both ends of the X guide member 120. 124 is provided. An air bearing is interposed between the guide portion 123B and the guided portion 124, and the guided portion 124 is supported in a non-contact manner with respect to the guide portion 123B.

  The X guide member 120 is provided so as to be movable in the Y axis direction by a Y linear motor 122. The substrate stage PST can move in the Y-axis direction together with the X guide member 120 by driving the Y linear motor 122. The Y linear motor 122 includes a mover 122M provided at each of both ends in the longitudinal direction of the X guide member 120, and an air bearing on the flat portion 123A of the support member 123 so as to correspond to the mover 122M. And a stator 122C supported in a non-contact manner. When the mover 122M of the Y linear motor 122 is driven with respect to the stator 122C, the X guide member 120 moves in the Y axis direction together with the substrate stage PST. Further, the X guide member 120 can be rotated in the θZ direction by adjusting the driving of the Y linear motors 122 and 122. Therefore, the Y linear motors 122 and 122 enable the substrate stage PST to move in the Y axis direction and the θZ direction almost integrally with the X guide member 120. Here, since the stator 122C is supported in a non-contact manner by the air bearing with respect to the plan view 123A of the support member 123, the X guide member 120 and the substrate stage PST in the + Y direction (−Y direction) according to the law of conservation of momentum. The stator 122C moves in the −Y direction (+ Y direction) in accordance with the movement. The movement of the stator 122C cancels the reaction force accompanying the movement of the X guide member 120 and the substrate stage PST, and can prevent the change of the center of gravity. That is, the stator 122C has a function as a so-called counter mass.

  When the substrate stage PST moves in the Y-axis direction while accelerating or decelerating, as described above, the adjusting device 11 connected to the air bearing 35 supplies the supply pressure from the supply port 35A of the air bearing 35. To reduce the damping ratio of the air bearing 35 (increase the rigidity) and increase the supply pressure from the supply port 135A of the air bearing 135 to reduce the damping ratio of the air bearing 135 (to increase the rigidity). Enlarge). Thereby, the inconvenience that the air bearing 135 (the inner surface 130C of the frame member 130) and the X guide member 120 come into contact with each other can be prevented. On the other hand, when the shot areas S1 to S16 are exposed, the adjustment device 11 reduces the supply pressure from the supply port 35A of the air bearing 35 to suppress the vibration of the substrate stage PST and thereby attenuates the air bearing 35. The ratio is increased, and the supply pressure from the supply port 135A of the air bearing 135 is decreased to increase the damping ratio of the air bearing 135. By doing so, the exposure apparatus EX2 can expose the pattern of the mask M onto the substrate P in a state where the vibration of the substrate stage PST is suppressed, so that the exposure accuracy can be improved.

  In each of the above-described embodiments, the air bearing using air as the fluid bearing has been described as an example. However, the present invention is not limited to this and can be applied to a bearing using another gas or liquid as the fluid.

  As the substrate P in each of the above-described embodiments, not only a semiconductor wafer for a semiconductor device but also a glass substrate for a liquid crystal display device, a ceramic wafer for a thin film magnetic head, or a mask or reticle original plate used in an exposure apparatus ( Synthetic quartz, silicon wafer) or the like is applied.

  The type of exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor device that exposes a semiconductor device pattern on a wafer, but an exposure apparatus for manufacturing a liquid crystal display element that exposes a liquid crystal display element pattern on a square glass plate, The present invention can be widely applied to an exposure apparatus for manufacturing a thin film magnetic head, an image sensor (CCD) or a mask.

In addition, as a light source for exposure illumination light, bright lines (g-line (436 nm), h-line (404.7 nm), i-line (365 nm)) generated from an ultra-high pressure mercury lamp, KrF excimer laser (248 nm), ArF excimer laser (193 nm), F ₂ laser (157 nm) as well as charged particle beams such as X-rays and electron beams can be used. For example, when an electron beam is used, thermionic emission type lanthanum hexabolite (LaB ₆ ) or tantalum (Ta) can be used as the electron gun. Further, when an electron beam is used, a configuration using the mask M may be used, or a pattern may be formed directly on the wafer without using the mask M. Further, a high frequency such as a YAG laser or a semiconductor laser may be used.

As the projection optical system PL, when using far ultraviolet rays such as an excimer laser, a material that transmits far ultraviolet rays such as quartz or fluorite is used as a glass material, and when using an F ₂ laser or X-ray, a catadioptric system or a refractive system is used. (The mask M is also of a reflective type), and when an electron beam is used, an electron optical system comprising an electron lens and a deflector may be used as the optical system. Needless to say, the optical path through which the electron beam passes is in a vacuum state. Further, the present invention can be applied to a proximity exposure apparatus that exposes the pattern of the mask M by bringing the mask M and the substrate P into close contact without using the projection optical system PL.

  When a linear motor is used for the substrate stage PST and the mask stage MST as in the above embodiment, the magnetic levitation type using a Lorentz force or a reactance force may be used instead of the air levitation type using an air bearing. Each stage PST, MST may be a type that moves along a guide, or may be a guideless type that does not have a guide.

  The reaction force generated by the movement of the substrate stage PST may be released mechanically to the floor (ground) using a frame member as described in JP-A-8-166475. Further, the reaction force generated by the movement of the mask stage MST may be released mechanically to the floor (ground) using a frame member as described in JP-A-8-330224.

  As described above, the exposure apparatus EX according to the present embodiment maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 10, the semiconductor device has a step 201 for designing a function / performance of the device, a step 202 for producing a mask (reticle) based on the design step, and a step 203 for producing a substrate as a base material of the device. The substrate is manufactured through the substrate processing step 204 for exposing the mask pattern onto the substrate by the exposure apparatus EX of the above-described embodiment, the device assembly step (including the dicing process, bonding process, and package process) 205, the inspection step 206, and the like.

It is a schematic block diagram which shows one Embodiment of the stage apparatus of this invention. It is a figure for demonstrating the movement state of a movable member. It is a schematic diagram which shows the positional relationship of a movable member and a base member. It is a schematic block diagram which shows 1st Embodiment of exposure apparatus. It is a schematic diagram which shows the state in which the shot area | region on a board | substrate is exposed. It is a schematic block diagram which shows 2nd Embodiment of exposure apparatus. It is a schematic diagram which shows the state in which the shot area | region on a board | substrate is exposed. It is a schematic perspective view which shows an example of a substrate stage. It is an AA cross-sectional arrow view of FIG. It is a flowchart figure which shows an example of the manufacturing process of a semiconductor device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Base member (1st member), 2 ... Movable member (2nd member), 3 ... Upper surface (1st surface), 4 ... Lower surface (2nd surface), 5 ... Air bearing (fluid bearing), 5A ... Supply 7 ... Pressure adjusting device, 8 ... Flow path, 10 ... Stage device, 11 ... Adjusting device, 12 ... Acceleration sensor (measuring device), 13 ... Drive device, EX1, EX2 ... Exposure device, MST ... Mask stage, PST ... Board stage

Claims (10)

A first member having a first surface; a second member having a second surface opposite to the first surface; and moving relative to the first member; the first surface and the second surface; In a stage apparatus provided with a fluid bearing for supplying fluid between
A stage device including an adjusting device that adjusts at least one of rigidity and damping ratio of the fluid bearing according to a moving state of the second member. The fluid bearing has a supply port for supplying a fluid between the first surface and the second surface,
The stage device according to claim 1, wherein the adjustment device adjusts a pressure of a fluid supplied from the supply port. A supply device for delivering a fluid; and a flow path for connecting the supply device and the supply port and through which the fluid flows;
The stage device according to claim 2, wherein the adjustment device includes a pressure adjustment device that is provided in the middle of the flow path and adjusts the pressure of the fluid supplied from the supply port.   The stage device according to claim 2 or 3, wherein the adjustment device adjusts the pressure in accordance with a relative acceleration between the first member and the second member. The first member and the second member relatively move in a predetermined direction within a plane substantially parallel to the first surface and the second surface, with the first surface and the second surface facing each other. And
The adjusting device supplies fluid at a first pressure in a first section that moves at a first acceleration, and moves the first space in a second space that moves at a second acceleration that is smaller than the first acceleration. The stage apparatus according to claim 4, wherein the fluid is supplied at a second pressure that is smaller than the pressure. A measuring device for measuring the acceleration;
The stage device according to claim 4, wherein the adjustment device performs the adjustment based on a measurement result of the measurement device. A driving device that relatively moves the first member and the second member based on predetermined control information;
The stage device according to claim 1, wherein the adjustment device performs the adjustment based on the control information. In an exposure apparatus that exposes a substrate while moving a stage apparatus,
An exposure apparatus using the stage apparatus according to claim 1 as the stage apparatus.   A device manufacturing method using the exposure apparatus according to claim 1. A first member having a first surface; a second member having a second surface opposite to the first surface; and moving relative to the first member; the first surface and the second surface; In a driving method of a stage apparatus provided with a fluid bearing for supplying fluid between
A stage apparatus driving method comprising adjusting at least one of rigidity and damping ratio of the fluid bearing according to a moving state of the second member.

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