JP2007247704A - Fluid bearing, fluid bearing, stage system and aligner - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress an unexpected behavior even when a recess is present in a base member. <P>SOLUTION: A fluid bearing comprises a first fluid blowoff part 11 provided inside a groove part 14 formed in a first surface 10A of a first member and a second fluid blowoff parts 21A, 21B provided to an area in the first surface 10A different from the groove part 14. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a fluid bearing, a fluid bearing, a stage apparatus, and an exposure apparatus.

Semiconductor devices and liquid crystal display devices are manufactured by a so-called photolithography technique in which a pattern formed on a mask is transferred onto a photosensitive substrate. An exposure apparatus used in this photolithography process has a mask stage for supporting a mask and a substrate stage for supporting a substrate, and a mask pattern is transferred via a projection optical system while sequentially moving the mask stage and the substrate stage. It is transferred to the substrate. Conventionally, in the substrate stage and the mask stage, the movable member is driven by a driving device such as a linear motor while the movable member is supported in a non-contact manner by a fluid bearing (gas bearing, hydrostatic bearing, etc.) with respect to the base member. It has been adopted. For example, Patent Document 1 discloses a technique related to an air bearing as a fluid bearing.
JP 2003-194059 A

However, the following problems exist in the conventional technology as described above.
When the base member has a concave portion called a pore, when the fluid blowing portion of the air pad passes over the concave portion, the air pad moves up and down with a small amount, so that an unexpected behavior of so-called pad jumping is shown. It has been found. In addition, when there is a recess, in addition to the vertical movement of the air pad, there is a possibility that a so-called pitching error occurs in which the stage is displaced around the direction intersecting the moving direction.
These behaviors are considered to be caused by changes in the vortex flow due to the presence of the recesses, moment rigidity accompanying changes in the fluid pressure blown out from the fluid blowing portion, changes in the load capacity of the air pad, and the like.

  If such a behavior is exhibited, there is a possibility of adversely affecting the stage drive characteristics and, consequently, the pattern transfer accuracy in the exposure process, so a step of performing a visual inspection or a microscopic inspection and filling the detected concave portion is provided. However, there is a problem that the work time required for inspection and burying increases and productivity decreases.

  The present invention has been made in consideration of the above points, and provides a fluid bearing, a fluid bearing and a stage apparatus, and an exposure apparatus that can suppress unexpected behavior even when a recess is present in a base member. For the purpose.

In order to achieve the above object, the present invention adopts the following configuration corresponding to FIGS. 1 to 14 showing the embodiment.
The hydrodynamic bearing of the present invention is different from the groove portion in the first fluid blowing portion (11) provided inside the groove portion (14) formed in the first surface (10A) of the first member (1). It has the 2nd fluid blowing part (21, 21A, 21B) provided in the area | region in the 1st surface, It is characterized by the above-mentioned.

  Accordingly, in the fluid dynamic bearing of the present invention, the fluid blown out from the first fluid blowing portion (11) passes through the groove, and the supporting surfaces (second surface, 2A, 51A), and a gap is formed between the first surface and the second surface by the pressure of the fluid, so that relative movement is possible with a small frictional resistance. During this relative movement, when the first fluid blowing section passes over the concave portion of the support surface, a change in vortex flow, moment stiffness accompanying a change in fluid pressure, a change in load capacity of the fluid bearing, and the like occur. However, the fluid blown out from the second fluid outlet (21, 21A, 21B) is supplied between the support surface (2A, 51A) of the support member (2, 51), and the first surface, Since a gap is formed between the two surfaces, the pressure change generated in the first fluid outlet (11) can be reduced. This makes it possible to suppress the occurrence of unexpected behavior such as so-called pad jump.

Moreover, the fluid bearing of the present invention includes a first member (1) having the fluid bearing described above and a second member (51A) having a second surface (51A) facing the first surface (10A) of the first member. (51).
Therefore, in the fluid bearing of the present invention, the first member (1) is relatively moved along the second surface (51A) of the second member (51) with a small frictional resistance in a state where unexpected behavior is suppressed. The first member can be driven with desired driving characteristics.

The stage device of the present invention is a stage device (50) in which the moving stage (41, 42, 46) moves on the support member (51), and the moving surface (51A) of the moving stage is first moved to the stage device (50). The fluid bearing described is used.
Therefore, in the stage apparatus of the present invention, the moving stage can be relatively moved along the moving surface (51A) of the support member (51) with a small frictional resistance in a state where unexpected behavior is suppressed. The moving stage can be driven with desired driving characteristics.

  The exposure apparatus of the present invention is an exposure apparatus (EX) that exposes the pattern of the mask (M) held on the mask stage (MST) onto the substrate (P) held on the substrate stage (PST), The stage device described above is used for at least one of the mask stage and the substrate stage.

Therefore, in the exposure apparatus of the present invention, it is possible to relatively move at least one of the mask (M) and the substrate (P) in a state where unexpected behavior is suppressed, and the mask (M) At least one of the substrate (P) can be driven with desired drive characteristics, and the mask pattern can be transferred to the substrate with high accuracy.
In order to explain the present invention in an easy-to-understand manner, the description has been made in association with the reference numerals of the drawings showing one embodiment, but it goes without saying that the present invention is not limited to the embodiment.

  In the present invention, it is possible to suppress the occurrence of behavior such as pad jumping and pitching error even if there is a recess in the base member. In addition, according to the present invention, it is possible to drive the moving stage with stable driving characteristics and to prevent the production efficiency from being lowered.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a fluid bearing, a fluid bearing and a stage apparatus, and an exposure apparatus according to the present invention will be described below with reference to FIGS.
(First embodiment)
1 is a schematic perspective view showing a fluid dynamic bearing according to the first embodiment, FIG. 2 is a plan view showing the fluid dynamic bearing, FIG. 3 is a partial sectional view taken along line AA in FIG. 1, and FIG. It is a fragmentary sectional view which follows the -B line. In the following description, the fluid bearing (hydrostatic bearing) is referred to as an “air pad” as appropriate, as it blows out air.

In FIG. 1, the air pad 10 is provided on the surface 1 </ b> A of the first member 1. The second surface 2 </ b> A of the second member 2 is disposed at a position facing the pad surface 10 </ b> A (the surface of the pad main body 12 and the bush 13; the first surface) that is the surface of the air pad 10. On this pad surface 10A, an aperture groove (groove portion) 14 is formed in a square shape in plan view. The first member 1 and the second member 2 constitute an air bearing (fluid bearing).
As shown in FIG. 2, the air pad 10 is surrounded by a first air outlet (first fluid outlet) 11 provided inside the throttle groove 14 and a throttle groove 14 on the pad surface 10A. Four second air outlets (second fluid outlets) 21A and 21B arranged in the recesses are formed.
The 1st air blower outlet 11 is arrange | positioned in the position (substantially center position by planar view) corresponding to the gravity center of the air pad 10 in 10 A of pad surfaces. The second air outlets 21 </ b> A and 21 </ b> B are arranged in pairs symmetrically across the first air outlet 11.

  As shown in FIGS. 3 and 4, the air pad 10 includes a pad main body 12 and bushes 13 </ b> A and 13 </ b> B that are separate from the pad main body 12. As a material for forming the pad main body 12 and the bush 13, alumina, zirconia, and plastic can be used. Further, the pad main body 12 and the bush 13 can be manufactured by, for example, an injection molding method. Further, when the bush 13 (pad body 12) is made of metal, for example, a micro electric discharge machining method can be used. Of course, you may form the whole flow path 20 based on the micro electrical discharge machining method. Or you may cut (drill) using a drill.

  Each bush 13 </ b> A, 13 </ b> B has a cylindrical shape and is disposed in a hole 12 </ b> H formed in the center of the pad main body 12. The shape (cross section) of the hole 12H is substantially the same as the shape (cross section) of the bushes 13A and 13B. The bushes 13A and 13B are fitted in the hole 12H and are padded by the adhesive filled in the grooves 15. It is fixed to the main body 12. A flow path (orifice) 20 extending in the axial direction is formed inside the cylindrical bushes 13A and 13B. One end of the channel 20 is connected to the air outlet 11 or 21A, 21B. The first air outlet 11 and the second air outlets 21A and 21B are adjusted to have the same opening diameter, air blowing amount, air pressure, etc. so as to blow air with substantially the same blowing characteristics. Yes.

FIG. 5 is a perspective view showing a configuration of an XY stage including the air pad 10 described above.
The XY stage (stage device) 50 includes a surface plate (second member, support member) 51, an X guide bar 30, and an air slide element member 40. The X guide bar 30 is provided on the upper surface (second surface, moving surface) 51A of the rectangular surface plate 51, and guides the air slide element member 40 in the X-axis direction. The air slide element member 40 includes an X direction slide member and a Y direction slide member.

The X-direction slide member includes moving members (first members) 41 and 42 and a Y guide bar 43. The moving member 41 that moves in the X-axis direction along the X guide bar 30 is parallel to the moving member 42, and each of the moving member 41 and the moving member 42 extends in the X direction.
The Y guide bar 43 extends in the Y-axis direction, and both ends of the Y guide bar 43 are fixed to an intermediate portion of the moving member 41 and an intermediate portion of the moving member 42, respectively. That is, the X-direction slide member has a substantially H shape.
The air pad 10 described above is provided on the lower surface of the moving member 41 and the lower surface of the moving member 42, and the moving member 41 and the moving member 42 are moved relative to the upper surface 51 A of the surface plate 51 by the compressed air discharged from the orifice of the air pad 10. It is lifted and supported so that it can move freely.

The Y-direction slide member has a pair of holding members 45 and a base (first member) 46. A pair of engaging members 45 extending in the Y-axis direction are integrally provided on the upper surface of the base 46, and a guide groove is formed by the pair of engaging members 45. The guide groove engages with the Y guide bar 43, and the engagement member 45 is guided by the Y guide bar 43 and moves in the Y axis direction together with the base 46.
The above-described air pad 10 is provided on the lower surface of the base 46, and the base 46 is floated and supported with respect to the upper surface 51 </ b> A of the surface plate 51 by the compressed air discharged from the orifice of the air pad 10.

Next, the action of the air pad 10 when the moving members 41 and 42 and the base 46 move relative to the surface plate 51 in the XY stage 50 having the above configuration will be described with reference to FIGS. 6 to 9.
Here, as shown in FIG. 6, a case will be described in which a recess (pore) 51 </ b> B exists on the movement path of the first air outlet 11 when the air pad 10 moves on the upper surface 51 </ b> A of the surface plate 51. Further, here, as shown in FIGS. 6A to 6C, when the air pad 10 moves from the left side to the right side in the figure, the state before the first air outlet 11 reaches the recess 51B ( 1) The state where the first air outlet 11 is positioned on the recess 51B (2), and the state after the first air outlet 11 passes over the recess 51B is the state (3). The case where both the first air outlet 11 and the second air outlets 21A and 21B are provided and the case where only the first air outlet 11 is provided without the second air outlets 21A and 21B will be described. .

  In any case, the recess 51B has a length (width) of about 200 μm and a depth of about 100 μm, and the first air outlet 11 and the second air outlets 21A and 21B have a diameter. Is about 200 μm and air is supplied at a pressure of about 0.5 MPa, and the supplied air is exhausted at a pressure of about 0.1 MPa by a suction device (not shown). The air pad 10 uses a model that moves relative to the surface plate 51 at a speed of 500 mm / s, and the load capacity, dynamic unbalance moment, and turbulent energy in each case will be described.

(Load capacity)
FIG. 7 is a diagram showing the load capacity of the air pad 10 in each of the above-described states (1) to (3). FIG. 7 (a) shows that the first air outlets are not provided with the second air outlets 21A and 21B. 7 shows the load capacity of the first air outlet 11 when only 11 is provided, and FIG. 7B shows the second air when both the first air outlet 11 and the second air outlets 21A and 21B are provided. FIG. 7C shows the load capacity of the air outlet 21A, FIG. 7C shows the load capacity of the second air outlet 21B, and FIG. Here, the vertical scale in FIG. 7A and the vertical scale in FIGS. 7B to 7D are combined.

In the case of the single air supply model shown in FIG. 7A, the load capacity of the air pad 10 decreases when the first air outlet 11 passes over the recess 51B. 42 and base 46) will be displaced in the Z direction.
On the other hand, in the case of a multiple air supply model having both the first air outlet 11 and the second air outlets 21A and 21B, as shown in FIG. 7 (b), from state (1) to state (2) The load capacity at the second air outlet 21A decreases, and the load capacity at the second air outlet 21B increases from the state (2) to the state (3) as shown in FIG. 7C. As can be seen by comparing FIG. 7 (a) and FIG. 7 (d), the load capacity generated at the first air outlet 11 greatly changes in the single air supply model, but hardly changes in the multiple air supply model. do not do. That is, the second air outlets 21A and 21B bear the load capacity change that occurs in the first air outlet 11 from the state (1) to the state (3), as shown in FIG. As for the load capacity of the first air outlet 11, the fluctuation is suppressed as compared with the case of the single air supply model shown in FIG.
Further, as can be seen by comparing FIG. 7 (a) with FIGS. 7 (b) and 7 (d), the change in the load capacity at the second air outlets 21A and 21B is also single in the multiple supply model. Smaller than the Ki model. That is, in the multiple air supply model, fluctuations in load capacity are suppressed.

(Dynamic unbalance moment)
FIG. 8 is a diagram showing the dynamic unbalance moment of the air pad 10 in each of the states (1) to (3) described above, and FIG. 8 (a) shows the first air outlet 11 moment in the case of a single air supply model. 8 (b) shows the moment of the second air outlet 21A in the case of the multiple supply model, FIG. 8 (c) shows the moment of the second air outlet 21B, and FIG. 8 (d) shows the first air outlet. It is a figure which shows 11 moments. Here, the vertical scale in FIG. 8A and the vertical scale in FIGS. 8B to 8D are combined.
The moment values in these figures are shown with the clockwise direction as the positive direction in FIG.

In the case of the single air supply model shown in FIG. 8A, a positive moment acts on the air pad 10 until the first air outlet 11 passes over the recess 51B, and the first air outlet After 11 passes over the recess 51B, a negative moment is applied.
In the case of the multiple air supply model, as shown in FIG. 8B, a positive moment acts on the second air outlet 21A until the state (2), and after the state (2), No moment acts on the second air outlet 21A.
On the other hand, as shown in FIG. 8C, no moment is applied to the second air outlet 21B until the state (2), and a negative moment is applied after the state (2).

  That is, the moment applied to the air pad 10 (first air outlet 11) by the state (2) is borne by the second air outlet 21A, and the air pad 10 (first air outlet 11) is applied after the state (2). The moment is borne at the second air outlet 21B. As shown in FIG. 8D, the moment acting on the first air outlet 11 is compared with the moment shown in FIG. Fluctuations are greatly suppressed. Further, as to the moment acting on the second air outlets 21A and 21B, as can be seen by comparing FIG. 8A, FIG. 8B and FIG. In addition, it is suppressed to about ½ of the moment in the case of a single air supply model.

(Turbulent energy)
FIG. 9 is a diagram showing the amount of turbulent energy applied to the air pad 10 in each of the states (1) to (3) described above. FIG. 9A shows the first air outlet 11 in the case of a single air supply model. FIG. 9B shows the turbulent energy acting, FIG. 9B shows the turbulent energy acting on the second air outlet 21A in the case of the multiple supply model, and FIG. 9C shows the second air in the case of the multiple supply model. It is a figure which shows the turbulent energy which acts on the blower outlet 21B. Here, the vertical scale in FIG. 9A and the vertical scale in FIGS. 9B to 9D are combined.

In the case of the single air supply model shown in FIG. 9A, the turbulent energy with respect to the air pad 10 decreases when the first air outlet 11 passes over the recess 51B from the state (1) to the state (3). Therefore, the air pad 10 (therefore, the moving members 41 and 42 and the base 46) is displaced in the Z direction.
On the other hand, in the case of the multiple supply model, as shown in FIG. 9B, the turbulent energy with respect to the second air outlet 21A decreases from the state (1) to the state (2), and FIG. As shown, the turbulent energy for the second air outlet 21B increases from state (2) to state (3). That is, from the state (1) to the state (3), the change of the turbulent energy with respect to the first air outlet 11 is borne by the second air outlets 21A and 21B, and as shown in FIG. The fluctuation of the turbulent energy with respect to the first air outlet 11 is greatly suppressed as compared with the case of the single air supply model shown in FIG.

  As described above, in the present embodiment, in addition to the first air outlet 11 provided on the inner side of the throttle groove 14, the air pad 10 is provided with the second air outlets 21 </ b> A and 21 </ b> B provided on the pad surface 10 </ b> A. Therefore, even when the concave portion 51B exists on the upper surface 51A of the surface plate 51 and the first air outlet 11 passes over the concave portion 51B, the load capacity change, dynamic unbalance moment, turbulent flow It is possible to suppress the occurrence of behavior such as pad jumping and pitching error due to energy fluctuations.

Therefore, in the XY stage 50 of this embodiment provided with such an air pad 10, the moving members 41, 42 and the base 46 provided with the air pad 10 are driven with stable driving characteristics without causing unexpected behavior. Can do.
Moreover, in this embodiment, even if the surface plate 51 has a recess (pore), the movable stage can be driven stably, so that the recess existing in the surface plate 51 can be detected by visual inspection or microscopic inspection. It is not necessary to provide a detecting step and a step of filling the detected concave portion, and it is possible to prevent the production efficiency using the XY stage 50 from being lowered.

Moreover, in the said embodiment, since the 2nd air blower outlet 21A, 21B is arrange | positioned symmetrically on both sides of the 1st air blower outlet 11, the unexpected behavior which may arise in the 1st air blower outlet 11 is stabilized. And it becomes possible to suppress effectively. In particular, in this embodiment, when the 1st air blower outlet 11 is arrange | positioned in the position corresponding to the gravity center of the air pad 11, the unstable behavior factor which acts on the 1st air blower outlet 11 is borne more effectively. Is possible.
Furthermore, in the present embodiment, the first air outlet 11 and the second air outlets 21A and 21B employ a configuration in which air is blown out with substantially the same blowing characteristics, and therefore, the air supply system is handled as a single system. It is possible to contribute to downsizing and cost reduction of the apparatus.

(Second Embodiment)
FIG. 10 is a plan view showing the second embodiment of the air pad 10.
The air pad 10 in the first embodiment is provided with a first air outlet 11 at a position corresponding to the center of gravity, and second air outlets 21A and 21B are arranged symmetrically across the first air outlet 11. Although it is a structure, 2nd Embodiment demonstrates using the example in the case of taking the reverse arrangement structure. In this figure, the same reference numerals are given to the same elements as those of the first embodiment shown in FIG. 2, and the description is simplified.

  As shown in FIG. 10, on the pad surface 10A of the air pad 10, the narrowing grooves 14 are provided separately in a U-shape along the left and right side edges. A second air outlet (second fluid outlet) 21 is provided at a position corresponding to the center of gravity of the pad surface 10 </ b> A of the air pad 10. The first air outlets 11 and 11 are provided inside the throttle groove 14 symmetrically across the second air outlet 21.

  In the air pad 10 having the above-described configuration, for example, even if the stage is enlarged and a plurality of first air outlets 11 need to be provided and are not arranged at positions corresponding to the center of gravity, the same as in the first embodiment Actions and effects are obtained, and it is possible to suppress the occurrence of behavior such as pad jumping and pitching error due to the presence of the concave portion of the surface plate 51.

For example, as shown in FIG. 11, the throttle groove 14 is formed at a position including the center of gravity G of the pad surface 10A, and the first air outlet 11 and the second air outlets 21A and 21B cannot be arranged at the center of gravity G. In this case, it is preferable to arrange the second air outlets 21A and 21B symmetrically with the center of gravity G in between.
Thereby, the same operation and effect as those of the first and second embodiments can be obtained, and it is possible to suppress the occurrence of behavior such as pad jumping and pitching error due to the presence of the concave portion of the surface plate 51.
In addition, when providing the 2nd air blower outlet symmetrically on both sides of the position corresponding to the gravity center of 10 A of pad surfaces, in order to suppress the pitching error mentioned above effectively, it corresponds to the gravity center in the relative movement direction of the air pad 10. It is preferable to provide the second air outlets symmetrically with respect to the position to be performed.

Next, another embodiment of the air pad 10 of the present invention will be described. In the following description, the same or equivalent components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.
12 is a plan view showing the first member 1 provided with a plurality of air pads 10 on the surface 1A, and FIG. 13 is a cross-sectional view taken along the line BB of FIG. In the present embodiment, an aperture groove (surface aperture) 14 is formed in a cross shape on the pad surface 10 </ b> A of the air pad 10.

  The surface 1A of the first member 1 has a pad surface 10A including a throttle groove 14 provided with the first air outlet 11 and second air outlets 21A and 21B, and a pad surface 10A adjacent to the pad surface 10A. And a squeeze surface 24 provided independently from each other. The squeeze surface 24 is provided to adjust the dynamic characteristics of the air pad 10. A groove (concave portion) 26 is provided between the pad surface 10 </ b> A and the squeeze surface 24. In FIG. 12, four (plural) air pads 10 are provided. In each air pad 10, the first air outlet 11 is provided at a position corresponding to the center of gravity of each air pad 10, and the second air outlets 21 </ b> A and 21 </ b> B are arranged symmetrically across the first air outlet 11. ing.

A plurality of squeeze surfaces 24 are provided at positions adjacent to the pad surface 10 </ b> A of the air pad 10 via the groove portions 26. Specifically, the squeeze surface 24 is disposed between the squeeze surfaces 24A and a substantially L-shaped squeeze surface 24A provided in a position adjacent to each of the plurality (four) of pad surfaces 10A. And a plurality of (four) squeeze surfaces 24B.
Further, as shown in FIG. 13, the pad surface 10A and the squeeze surface 24 of the air pad 10 are provided substantially flush with each other (substantially the same height), and the surface 1A and the second surface 2A facing the surface 1A (see FIG. 1). Is formed so that the pad surface 10A and the squeeze surface 24 are equal to each other. Further, the pad surface 10A and the squeeze surface 24 are flat surfaces.

  In addition, as shown in FIG. 12, a suction port 25 for sucking gas is provided at each of a plurality of predetermined positions of the groove portion 26. The air pad 10 has a certain gap (air gap) between the first member 1 and the second member 2 due to the balance between the repulsive force caused by the blowing of gas from the first air outlet 11 and the suction force caused by the suction port 25. The second member 2 is supported in a non-contact manner with respect to the first member 1. Furthermore, an air release hole 27 is provided at each of a plurality of predetermined positions of the groove 26.

The suction port 25 is connected to, for example, a vacuum source, and can generate a preload on the pad surface 10 </ b> A at the suction port 25. As a result, the air pad 10 has a constant gap between the first member 1 and the second member 2 due to the balance between the repulsive force caused by the gas blown from the first air outlet 11 and the suction force at the suction port 25. A preload type gas bearing that maintains the (gap) is configured, and the second member 2 is supported in a non-contact manner with respect to the first member 1.
The gas film disposed between the first surface (1A, 10A) and the second surface (2A) facing each other generates a squeeze action that generates pressure in the film thickness direction. In the present embodiment, the dynamic characteristics of the air pad 10 are adjusted using the squeeze action. In order to generate the squeeze action, a squeeze surface 24 that is substantially flush with the pad surface 10A is provided at a position adjacent to the pad surface 10A of the air pad 10. Then, depending on the target value of the dynamic characteristics of the air pad 10, the size (area) and shape of the squeeze surface 24, the height relative to the pad surface 10A, or the surface roughness of the squeeze surface 24 is optimized. Dynamic characteristics can be obtained.

By adjusting the height, size, or surface roughness of the squeeze surface 24, the dynamic characteristics of the air pad 10, specifically, the rigidity component (spring component) and damping component (damper component) of the air pad 10, and consequently the resonance frequency and The attenuation rate can be adjusted. For example, the spring component and the damper component can be increased by increasing the area of the squeeze surface 24, and conversely, the spring component and the damper component can be decreased by decreasing the area of the squeeze surface 24. Further, the spring component and the damper component can be increased by increasing the height of the squeeze surface 24 (decreasing the gap between the squeeze surface 24 and the second surface). In this manner, desired dynamic characteristics (resonance frequency, attenuation factor) can be obtained simply by adjusting the squeeze surface 24 in accordance with the use state of the air pad 10.
Even when such an air pad 10 is used, by providing the second air outlets 21 </ b> A and 21 </ b> B in addition to the first air outlet 11, behaviors such as pad jumping and pitching error occur due to the presence of the recesses. Can be suppressed.

  Next, a stage apparatus and an exposure apparatus provided with the air pad 10 according to the present invention will be described with reference to FIG. FIG. 14 is a schematic block diagram showing an embodiment of an exposure apparatus according to the present invention. The exposure apparatus EX in the present embodiment is a so-called scanning stepper that transfers a pattern provided on the mask M onto the substrate P via the projection optical system PL while moving the mask M and the photosensitive substrate P synchronously. . In the following description, the direction that coincides with the optical axis AX of the projection optical system PL is the Z-axis direction, and the synchronous movement direction (scanning direction) in a plane perpendicular to the Z-axis direction is the Y-axis direction, Z-axis direction, and Y-axis. The direction perpendicular to the direction (non-scanning direction) is taken as the X-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively. Here, the “substrate” includes a semiconductor wafer coated with a photoresist, which is a photosensitive material, and the “mask” includes a reticle on which a device pattern to be reduced and projected on the substrate is formed.

In FIG. 14, an exposure apparatus EX uses a mask stage MST that can move while holding a mask M, a substrate stage PST that can move while holding a substrate P, and a mask M held on the mask stage MST as exposure light EL. And an optical projection system PL that projects an image of the pattern of the mask M illuminated by the exposure light EL onto the substrate P held by the substrate stage PST. The projection optical system PL is a reduction system having a projection magnification of, for example, 1/4 or 1/5. The projection optical system PL may be either an equal magnification system or an enlargement system. Mask stage MST is provided so as to be movable on a mask surface plate (support member) 103 having a guide surface formed on the upper surface. The lower surface of the mask stage MST faces the guide surface of the mask surface plate 103. The substrate stage PST is movably provided on the substrate surface plate 105. The substrate surface plate 105 is supported on a base plate 101 installed on the floor surface via a vibration isolation unit 108. A main column 102 is provided on the base plate 101. A support column 109 that supports the illumination optical system IL is provided on the main column 102.
The main column 102 includes an upper step portion 102A and a lower step portion 102B that protrude inward. The mask surface plate 103 is supported on the upper step 102 </ b> A of the main column 102 via a vibration isolation unit 106. A plurality of optical elements constituting the projection optical system PL are held by a lens barrel PK. Projection optical system PL (lens barrel PK) is supported by barrel base plate 104. The lens barrel surface plate 104 is supported on the lower step portion 102 </ b> B of the main column 102 via a vibration isolation unit 107.

  The illumination optical system IL illuminates the mask M held on the mask stage MST with the exposure light EL. As the exposure light EL, for example, far ultraviolet light (DUV light) such as ultraviolet emission lines (g-line, h-line, i-line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF excimer laser, etc. Light (wavelength 193 nm) and vacuum ultraviolet light (VUV light) such as F2 laser light (wavelength 157 nm) are used.

Mask stage MST is provided to be movable while holding mask M. A plurality of air pads 10 are provided on the bottom surface of the mask stage MST, and the mask stage MST is supported in a non-contact manner by the air pads 10 so as to be movable with respect to the support surface (second surface) 103A of the mask surface plate 103. Each of the mask stage MST and the mask surface plate 103 is provided with openings 114A and 114B through which the pattern image can pass through the mask M.
The mask stage MST includes a mask coarse movement stage MST1 provided on the mask surface plate 103, a mask fine movement stage MST2 provided on the mask coarse movement stage MST1, and the coarse movement stage MST1 on the mask surface plate 103. A pair of Y linear motors (not shown) that can move in the direction with a predetermined stroke, and a pair of Y guide portions 111 and 111 that guide the coarse movement stage MST1 that moves in the Y-axis direction are provided.

  The substrate stage PST is provided so as to be movable while holding the substrate P, and has a substrate holder PH for holding the substrate P. A plurality of air pads 10 are provided on the bottom surface of the substrate stage PST. The substrate stage PST is supported in a non-contact manner so as to be movable with respect to a substrate surface plate (support member) 105 having a guide surface formed on the upper surface by the air pad 10. The lower surface of the substrate stage PST faces the guide surface (second surface) 105A of the substrate surface plate 105. The substrate stage PST can move in a two-dimensional direction along the XY plane on the substrate surface plate 105 while holding the substrate P. Substrate stage PST is guided to move in the X-axis direction by X guide stage 120. The substrate stage PST is moved in the X-axis direction by the X linear motor 121 provided on the X guide stage 120. Further, the X guide stage 120 is guided to move in the Y-axis direction by a guide portion 123B at the upper end of a substantially L-shaped support member 123 provided on the base plate 101 in a side view. Guide portions 123B (support members 123) are provided at positions corresponding to both ends of the X guide stage 120, and guided portions 124 corresponding to the guide portions 123B are provided at both ends of the X guide stage 120, respectively. Is provided. The air pad 10 is interposed between the guide portion 123B and the guided portion 124, and the guided portion 124 is supported in a non-contact manner with respect to the guide portion 123B. The substrate stage PST moves in the Y axis direction together with the X guide stage 120 by driving the Y linear motor 122.

  In the present embodiment, since the air pad 10 according to the present invention is used for the mask stage MST and the substrate stage PST, it is possible to suppress the occurrence of behavior such as pad jumping and pitching error. Therefore, the mask stage MST and the substrate stage PST provided with such an air pad 10 can be driven with stable driving characteristics without causing unexpected behavior, and the moving accuracy and positioning accuracy of the stage are improved. Therefore, exposure can be performed with high accuracy.

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

For example, in the above-described embodiment, the air pad 10 has a configuration in which the pad main body 12 and the bush 13 are combined, and the flow path 20 has a configuration formed in the bush 13. You may comprise only 12. In that case, the flow path 20 may be formed inside the pad body 12 and the first air outlet 11 connected to the flow path 20 may be formed on the surface of the pad body 12.
Moreover, in the said embodiment, although it was set as the structure which provides 2nd air blower outlet 21A, 21B in the recess part surrounded by the throttle groove 14, it is not limited to this, The throttle groove 14 is 10 A of pad surfaces. It is good also as a structure provided in an outer land surface. Furthermore, the arrangement of the second air outlet does not necessarily need to be symmetric with respect to the position corresponding to the center of gravity of the air pad 10, and the second air outlet may be arranged at a position that becomes the apex of a triangle, for example. . In this case, it is preferable that the center of gravity of the triangle matches the position corresponding to the center of gravity of the air pad 10 on the pad surface 10A.

In the above-described embodiment, an example in which an air pad is used as the fluid pad has been described. However, the fluid to be used is not limited to air, and is photochemically inactive such as other gases such as nitrogen and helium. It is good also as composition which uses gas.
Moreover, in the said embodiment, although the stage apparatus using the air pad which concerns on this invention was demonstrated as what is applied to an exposure apparatus, it is not limited to this, It is applicable also to the machine tool which has a moving stage. .

  In addition, as the substrate P of the above embodiment, not only a semiconductor wafer for a semiconductor device, but also a glass substrate for a liquid crystal display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus ( Synthetic quartz, silicon wafer) or the like is applied.

As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus that scans and exposes the pattern of the mask M by synchronously moving the mask M and the substrate P, the mask M and the substrate P are stationary. Thus, the present invention can also be applied to a step-and-repeat type projection exposure apparatus that exposes the pattern of the mask M and sequentially moves the substrate P stepwise.
The type of exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor device that exposes a semiconductor device pattern on a wafer, but an exposure apparatus for manufacturing a liquid crystal display element that exposes a liquid crystal display element pattern on a square glass plate, The present invention can be widely applied to an exposure apparatus for manufacturing a thin film magnetic head, an image sensor (CCD) or a mask.

  In addition, as a light source for exposure illumination light, bright lines (g-line (436 nm), h-line (404.7 nm), i-line (365 nm)) generated from an ultra-high pressure mercury lamp, KrF excimer laser (248 nm), ArF excimer laser In addition to (193 nm) and F2 laser (157 nm), charged particle beams such as X-rays and electron beams can be used. For example, when using an electron beam, thermionic emission type lanthanum hexabolite (LaB6) and tantalum (Ta) can be used as the electron gun. Further, when an electron beam is used, a configuration using the mask M may be used, or a pattern may be formed directly on the wafer without using the mask M. Further, a high frequency such as a YAG laser or a semiconductor laser may be used.

  As the projection optical system PL, when using far ultraviolet rays such as an excimer laser, a material that transmits far ultraviolet rays such as quartz or fluorite is used as a glass material. When using an F2 laser or X-ray, a catadioptric system or a refractive system is used. When an optical system is used (mask M is also of a reflective type) and an electron beam is used, an electron optical system comprising an electron lens and a deflector may be used as the optical system. Needless to say, the optical path through which the electron beam passes is in a vacuum state. Further, the present invention can be applied to a proximity exposure apparatus that exposes the pattern of the mask M by bringing the mask M and the substrate P into close contact without using the projection optical system PL.

  In the case where a linear motor is used for the substrate stage PST and the mask stage MST as in the above embodiment, it is not limited to the air levitation type using an air bearing, and a magnetic levitation type using Lorentz force or reactance force may be used. Each stage PST, MST may be a type that moves along a guide, or may be a guideless type that does not have a guide.

  The reaction force generated by the movement of the substrate stage PST may be released mechanically to the floor (ground) using a frame member as described in JP-A-8-166475. Further, the reaction force generated by the movement of the mask stage MST may be released mechanically to the floor (ground) using a frame member as described in JP-A-8-330224.

  As described above, the exposure apparatus EX according to the present embodiment maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection, and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 15, the semiconductor device has a step 201 for designing the function / performance of the device, a step 202 for producing a mask (reticle) based on the design step, and a step 203 for producing a substrate as a base material of the device. The substrate is manufactured through the substrate processing step 204 for exposing the mask pattern onto the substrate by the exposure apparatus EX of the above-described embodiment, the device assembly step (including the dicing process, bonding process, and package process) 205, the inspection step 206, and the like.

It is a schematic perspective view which shows the fluid bearing which concerns on 1st Embodiment. It is a top view which shows a fluid bearing. It is a fragmentary sectional view which follows the AA line of FIG. It is a fragmentary sectional view which follows the BB line of FIG. It is a perspective view which shows the structure of XY stage provided with an air pad. It is a figure where an air pad moves on a surface plate. It is a figure which shows the load capacity of an air pad. It is a figure which shows the dynamic unbalance moment of an air pad. It is a figure which shows the amount of turbulent energy added to an air pad. It is a top view which shows 2nd Embodiment of an air pad. It is a top view which shows another form of an air pad. It is a top view which shows another embodiment of an air pad. It is the BB sectional view taken on the line of FIG. It is a schematic block diagram which shows one Embodiment of the exposure apparatus of this invention. It is a flowchart figure which shows an example of the manufacturing process of a semiconductor device.

Explanation of symbols

EX ... Exposure apparatus, M ... Mask (reticle), MST ... Mask stage, P ... Substrate (wafer), PST ... Substrate stage, 1 ... First member, 2 ... Second member, 2A ... Second surface, 10 ... Air pad (Fluid bearing), 10A ... pad surface (first surface), 11 ... first air outlet (first fluid outlet), 14 ... throttle groove (groove), 21, 21A, 21B ... second air outlet ( (Second fluid outlet), 41, 42 ... moving member (first member), 46 ... base (first member), 50 ... XY stage (stage device), 51 ... surface plate (second member, support member), 51A ... Upper surface (second surface, moving surface), 103 ... Mask surface plate (support member), 105 ... Substrate surface plate (support member), 105A ... Guide surface (second surface)

Claims (8)

A first fluid outlet provided inside a groove formed on the first surface of the first member;
A fluid bearing having a second fluid outlet provided in a region in the first surface different from the groove. The fluid dynamic bearing according to claim 1,
One of said 1st fluid blowing part and said 2nd fluid blowing part is arrange | positioned symmetrically across the other of said 1st fluid blowing part and said 2nd fluid blowing part, The fluid bearing characterized by the above-mentioned. The hydrodynamic bearing according to claim 1 or 2,
The fluid bearing according to claim 1, wherein the second fluid outlet is disposed symmetrically across a position corresponding to the center of gravity of the first surface. The fluid dynamic bearing according to any one of claims 1 to 3,
The fluid bearing according to claim 1, wherein the first fluid blowing portion and the second fluid blowing portion blow out fluid with substantially the same blowing characteristics.   A fluid bearing comprising: a first member having the fluid bearing according to claim 1; and a second member having a second surface facing the first surface of the first member. . A stage device in which a moving stage moves on a support member,
6. A stage apparatus, wherein a fluid bearing according to claim 5 is used on a moving surface of the moving stage. The stage apparatus according to claim 6, wherein
The moving stage is provided with a plurality of the fluid bearings,
The stage device, wherein each of the plurality of fluid bearings is provided with the second fluid outlet. An exposure apparatus that exposes a mask pattern held on a mask stage onto a substrate held on a substrate stage,
8. An exposure apparatus, wherein the stage apparatus according to claim 6 or 7 is used for at least one of the mask stage and the substrate stage.

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