JP2009209962A - Fluid bearing, stage apparatus, exposure device, and device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a fluid bearing capable of preventing stability from being decreased and unexpected behavior from occurring. <P>SOLUTION: The fluid bearing includes a first recess formed in a first surface of a first member, a second recess formed inside the first recess, and a fluid blowoff part provided inside the second recess. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a fluid dynamic bearing, a stage apparatus, an exposure apparatus, and a device manufacturing method.

An exposure apparatus used in a photolithography process illuminates a mask with exposure light, and exposes the substrate with exposure light from the mask. The exposure apparatus includes a stage apparatus having a movable member that can move relative to a base member, such as a mask stage that moves while holding a mask, and a substrate stage that moves while holding a substrate. The moving member is supported in a non-contact manner on the guide surface of the base member, for example, by a fluid bearing (a gas bearing or a hydrostatic bearing) as disclosed in Patent Documents 1 and 2 below.
JP 2005-257030 A JP 2007-247704 A

  When a minute hole called a pore exists in the guide surface of the base member, a phenomenon that the moving member slightly vibrates in the vertical direction (so-called pad jump phenomenon) occurs when the moving member passes over the hole. there is a possibility. Depending on the structure of the hydrodynamic bearing, it is possible to suppress the occurrence of vibration caused by the holes in the guide surface, but on the other hand, for example, the stability may be reduced and the hydrodynamic bearing may behave unexpectedly. When the hydrodynamic bearing exhibits unexpected behavior, the performance of the stage apparatus may be deteriorated, for example, the moving member cannot stably move with respect to the base member. As a result, an exposure failure may occur and a defective device may occur.

  An object of an aspect of the present invention is to provide a fluid dynamic bearing capable of suppressing a decrease in stability and suppressing unexpected behavior. Another object of the present invention is to provide a stage apparatus that can suppress a decrease in performance. Another object of the present invention is to provide an exposure apparatus that can suppress the occurrence of exposure failure. Another object of the present invention is to provide a device manufacturing method that can suppress the occurrence of defective devices.

  According to the first aspect of the present invention, the first recess formed in the first surface of the first member, the second recess formed inside the first recess, and the inside of the second recess. A fluid bearing comprising a fluid outlet is provided.

  According to a second aspect of the present invention, there is provided a stage apparatus including a base member having a guide surface, and a moving member having a facing surface facing the guide surface and capable of moving relative to the base member. At least one of the guide surface and the opposing surface is provided with a stage apparatus including the fluid bearing of the first aspect.

  According to a third aspect of the present invention, there is provided an exposure apparatus for exposing a substrate with exposure light, the exposure apparatus comprising the stage device of the second aspect capable of moving an object with respect to the optical path of the exposure light. The

  According to a fourth aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure apparatus according to the third aspect and developing the exposed substrate.

  According to the present invention, it is possible to suppress a decrease in stability of the fluid bearing and to suppress unexpected behavior. Moreover, according to this invention, the fall of the movement performance of a stage apparatus can be suppressed. Further, according to the present invention, it is possible to suppress the occurrence of exposure failure and suppress the occurrence of defective devices.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as the X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as the Y-axis direction, and a direction orthogonal to each of the X-axis direction and Y-axis direction (that is, the vertical direction) is defined as the Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a plan view showing an example of a fluid bearing (gas bearing) 1 according to the first embodiment, FIG. 2 is a side sectional view, FIG. 3 is a perspective view showing a partial section of the fluid bearing 1, and FIG. FIG. 3 is a perspective view showing an example of a state in which the fluid bearing 1 arranged on the surface 14 of the first object 13 supports the second object 15 in a non-contact manner. In the present embodiment, a case where the fluid dynamic bearing 1 is a gas bearing (static pressure bearing) using gas will be described as an example. In the present embodiment, air is used as the gas. In the following description, the gas bearing 1 is appropriately referred to as an air pad 1.

  In FIGS. 1, 2, 3, and 4, the air pad 1 includes a first recess 4 formed on the surface (land surface) 3 of the pad forming member 2 and a first recess formed on the inner side of the first recess 4. 2 recessed part 5 and the gas blower outlet 6 which is arrange | positioned inside the 2nd recessed part 5 and blows off air is provided.

  In the present embodiment, the pad forming member 2 includes a pad body 2A, a pad body 2A, and another bush 2B. The bush 2B is a cylindrical member. The bush 2B is disposed in a hole 2H formed in the pad main body 2A. The inner shape of the hole 2H and the outer shape of the bush 2B are substantially the same. The bush 2B is fitted into the hole 2H. The pad body 2A and the bush 2B are fixed by, for example, an adhesive.

  The bush 2 </ b> B has an internal flow path (orifice) 7. The internal flow path 7 is formed to extend in the axial direction of the bush 2B. The gas outlet 6 is disposed at one end of the internal flow path 7. In the present embodiment, there is one gas outlet 6.

  As shown in FIG. 4, the air pad 1 disposed on the surface 14 of the first object 13 supports the second object 15 disposed at a position facing the land surface 3 in a non-contact manner. The air pad 1 supplies gas from the gas outlet 6 between the surface 16 of the second object 15 disposed at a position facing the land surface 3 and supports the second object 15 in a non-contact manner. In the present embodiment, the surface 14 of the first object 13 is a plane. The surface 16 of the second object 15 that faces the land surface 3 is also a flat surface. A predetermined gap is formed between the land surface 3 of the air pad 1 and the surface 16 of the second object 15 by the gas supplied from the gas outlet 6.

  The first concave portion 4 and the second concave portion 5 formed on the land surface 3 form a surface diaphragm of the air pad 1. The first recess 4 is a first throttle groove formed in the land surface 3. The second recess 5 is a second throttle groove formed inside the first throttle groove. In the present embodiment, the shape of the first recess 4 in the XY plane parallel to the land surface 3 is substantially square. The shape of the second recess 5 in the XY plane is substantially a cross shape.

  In the present embodiment, in the XY plane, the first concave portion 4 is disposed at substantially the center of the land surface 3, and the second concave portion 5 is disposed at substantially the center of the first concave portion 4.

  In the following description, the land surface 3 disposed around the first recess 4 and capable of facing the surface 16 of the second object 15 is appropriately referred to as a first facing surface 3. In the present embodiment, the first facing surface 3 is a plane substantially parallel to the XY plane.

  The first recess 4 faces the surface 16 of the second object 15 disposed at a position facing the first facing surface 3, and the second facing surface 8 that is separated from the first facing surface 3 with respect to the surface 16. , And a first inner side surface 9 disposed around the second facing surface 8. The second recess 5 faces the surface 16 of the second object 15, the third facing surface 10 that is away from the second facing surface 8 with respect to the surface 16, and the second facing that is disposed around the third facing surface 10. 2 inner surface 11.

  The second facing surface 8 is disposed around the third facing surface 10 in the XY plane. Further, the first facing surface 3 is arranged around the second facing surface 8 in the XY plane. In the present embodiment, the center of the second facing surface 8 and the center of the third facing surface 10 substantially coincide with each other in the XY plane. Further, in the XY plane, the center of the first facing surface 3 and the center of the second facing surface 8 substantially coincide.

  In the present embodiment, the gas outlet 6 is disposed on the third facing surface 10 of the second recess 5. In the present embodiment, the gas outlet 6 is disposed substantially at the center of the third facing surface 10. Therefore, in this embodiment, the gas blower outlet 6, the 3rd opposing surface 10, the 2nd opposing surface 8, and the 1st opposing surface 3 are arrange | positioned substantially concentrically.

  In the present embodiment, the second facing surface 8 is a flat surface. In the present embodiment, the third facing surface 10 is a flat surface. In the present embodiment, the first facing surface 3, the second facing surface 8, and the third facing surface 10 are substantially parallel.

  The first inner surface 9 is a surface connecting the first facing surface 3 and the second facing surface 8. The first inner surface 9 faces in a different direction from the first facing surface 3 and the second facing surface 8. The second inner surface 11 is a surface that connects the second facing surface 8 and the third facing surface 10. The second inner surface 11 faces a different direction from the second facing surface 8 and the third facing surface 10.

  In the present embodiment, the first inner surface 9 and the second inner surface 11 are each substantially perpendicular to the XY plane. That is, the angle formed between the first facing surface 3 and the first inner side surface 9 is approximately 90 degrees, and the angle formed between the second facing surface 8 and the first inner side surface 9 is approximately 90 degrees. The angle formed between the second facing surface 8 and the third inner side surface 11 is approximately 90 degrees, and the angle formed between the third facing surface 10 and the third inner side surface 11 is approximately 90 degrees. In the present embodiment, a step is formed between the first facing surface 3 and the second facing surface 8, and a step is formed between the second facing surface 8 and the third facing surface 10.

  In the present embodiment, the first facing surface 3 and the second facing surface 8 are disposed on the pad main body 2A. A part of the third facing surface 10 is disposed on the pad main body 2A, and a part is disposed on the bush 2B. That is, in the present embodiment, the third facing surface 10 is disposed across the pad main body 2A and the bush 2B. Moreover, the gas blower outlet 6 is arrange | positioned at the bush 2B.

  As shown in FIG. 2, in the present embodiment, the distance H1 between the first facing surface 3 and the second facing surface 8 in the Z-axis direction is about 1 μm to 500 μm, and the second facing surface 8 and the third facing surface. The distance H2 with the surface 10 is about 1 μm to 500 μm. Moreover, the magnitude | size (diameter) D of the gas blower outlet 6 is about 0.01 mm-1.0 mm. In the present embodiment, as an example, the distance H1 is about 10 μm, and the distance H2 is about 10 μm. The size D is about 0.2 mm. Further, as shown in FIG. 1, the size W1 of the first facing surface 3 in the XY plane is about 40 mm, the size W2 of the second facing surface 8 is about 10 mm, and the third facing surface 10 The size W3 is about 6 mm. These numerical values are examples, and are appropriately changed according to static characteristics (for example, load capacity, rigidity) required for the air pad 1.

  As shown in FIGS. 2 and 3, a gas outlet 6 is disposed at one end of the internal flow path 7, and a gas from a gas supply device (not shown) flows into the other end of the internal flow path 7. An inlet 12 is disposed. The gas flows into the internal channel 7 from the inlet 12, flows through the internal channel 7, and then blows out from the gas outlet 6. In the present embodiment, the gas outlet 6 is smaller than the inlet 12. The internal flow path 7 gradually becomes narrower from the inlet 12 toward the gas outlet 6.

  In the present embodiment, alumina, zirconia, and plastic can be used as a material for forming the pad main body 2A and the bush 2B. The pad main body 2A and the bush 2B can be molded by, for example, an injection molding method. In addition, when the bush 2B (pad body 2A) is made of metal, it can be molded using a micro electric discharge machining method. Moreover, the internal flow path 7 can be formed using a micro electrical discharge machining method. The internal flow path 7 can be formed by cutting (drilling) using a drill.

  FIG. 5 is a perspective view showing an example of the stage device 20 including the air pad 1 described above. In FIG. 5, the stage device 20 includes a base member (surface plate) 22 having an upper surface (guide surface) 21 and a moving member 24 having a lower surface facing the upper surface 21 and movable with respect to the base member 22. I have.

  The moving member 24 includes a first moving member 24X and a second moving member 24Y. The first moving member 24X is movable on the upper surface 21 with respect to the base member 22 in the X-axis direction. The second moving member 24Y is movable on the upper surface 21 with respect to the base member 22 in the Y-axis direction.

  The first moving member 24 </ b> X includes a pair of slide members 25 and 26 and a guide bar 27. Each of the slide member 25 and the slide member 26 is long in the X-axis direction. The slide member 25 and the slide member 26 are parallel. The guide bar 27 is long in the Y-axis direction. Both ends of the guide bar 27 are fixed to the center of the slide member 25 and the center of the slide member 26, respectively.

  The stage device 20 includes a guide bar 23 that is disposed on the upper surface 21 and guides the movement of the first moving member 24X. The guide bar 23 is long in the X-axis direction. In the present embodiment, the guide bar 23 guides the slide member 25 and guides the first moving member 24X in the X-axis direction.

  The second moving member 24 </ b> Y includes a pair of plate members 28 and 29 and a slide member 30. Each of the plate member 28 and the plate member 29 is long in the Y-axis direction. Each of the plate member 28 and the plate member 29 is fixed to the upper surface of the slide member 30. Thereby, a guide groove 31 is formed between the plate member 28, the plate member 29, and the slide member 30.

  A guide bar 27 is disposed in the guide groove 31. The guide bar 27 guides the movement of the second moving member 24Y. The guide bar 27 guides the second moving member 24Y in the Y-axis direction.

  In the present embodiment, the above-described air pad 1 is disposed on the lower surface of the first moving member 24 </ b> X facing the upper surface 21. In the present embodiment, the air pad 1 is disposed on the lower surfaces of the slide members 25 and 26 facing the upper surface 21. The air pad 1 arranged on the lower surface of the first moving member 24 </ b> X blows gas from the gas outlet 6 toward the upper surface 21. Accordingly, a gap of, for example, about 5 μm to 10 μm is formed between the lower surface of the first moving member 24X and the upper surface 21 of the base member 22, and the first moving member 24X is not in contact with the upper surface 21 of the base member 22. Supported by contact.

  In the present embodiment, the above-described air pad 1 is disposed on the lower surface of the second moving member 24Y facing the upper surface 21. In the present embodiment, the air pad 1 is disposed on the lower surface of the slide member 30 facing the upper surface 21. The air pad 1 arranged on the lower surface of the second moving member 24 </ b> Y blows gas from the gas outlet 6 toward the upper surface 21. Thereby, a gap of, for example, about 5 μm to 10 μm is formed between the lower surface of the second moving member 24Y and the upper surface 21 of the base member 22, and the second moving member 24Y is not in contact with the upper surface 21 of the base member 22. Supported by contact.

  Next, the operation of the air pad 1 according to this embodiment will be described. In the following description, the operation of the air pads J1 and J2 according to the comparative example as shown in FIGS. 6A and 6C, and the air pad 1 according to the present embodiment as shown in FIG. 6B. Each of the actions will be described.

  An air pad J1 shown in FIG. 6 (A) is an air pad according to a comparative example, and is arranged inside the throttle groove 4J and the throttle groove 4J formed in the land surface 3J facing the upper surface 21 of the base member 22. The gas outlet 6 and gas outlets 6A and 6B different from the gas outlet 6 are provided. That is, the air pad J1 is a multiple air supply type air pad provided with a plurality of gas outlets 6, 6A, 6B.

  An air pad J2 shown in FIG. 6C is an air pad according to a comparative example, and is disposed inside the throttle groove 4J formed on the land surface 3J facing the upper surface 21 of the base member 22 and the throttle groove 4J. And a gas outlet 6. That is, the air pad J2 is a single air supply type air pad provided with one gas outlet 6.

  An air pad 1 shown in FIG. 6B is an air pad according to the present embodiment, and includes a first recess (first aperture) formed on a land surface (first facing surface) 3 facing the upper surface 21 of the base member 22. Groove) 4, a second recess (second throttle groove) 5 formed inside the first recess 4, and a gas outlet 6 disposed inside the second recess 5.

  Hereinafter, as shown in the schematic diagram of FIG. 7, a case where a hole (pore) PO exists on the movement path of the gas outlet 6 when the air pads 1, J <b> 1, J <b> 2 move on the upper surface 21 of the base member 22. explain. In the following description, as shown in FIGS. 7A to 7C, when the air pads 1, J1, and J2 move from the + Y side to the -Y side, the gas outlet 6 reaches the hole PO. The state immediately before the first state S1, the state where the gas outlet 6 is positioned on the hole PO, the second state S2, the state immediately after the gas outlet 6 passes over the hole PO, the third state S3 , Respectively.

  The length (width) of the hole PO is about 0.4 mm and the depth is about 0.1 mm. The size D of the gas outlet 6 is 0.2 mm, and air is supplied at a pressure of about 0.5 MPa, and the supplied air is discharged at a pressure of about 0.1 MPa by a suction device (not shown). Shall. In addition, the air pads 1, J1, and J2 move with respect to the base member 22 at a speed of about 500 mm / s.

  FIG. 8 is a diagram illustrating load capacities of the air pads 1, J1, and J2 in the first to third states S1 to S3 described above. FIG. 8 (A) shows the load capacity of the gas outlet 6 of the multi-air supply type air pad J1, FIG. 8 (B) shows the load capacity of the gas outlet 6 according to the present embodiment, and FIG. C) shows the load capacity of the gas outlet 6 of the single air supply type air pad J2. The vertical scales of FIGS. 8A, 8B, and 8C are combined.

  As shown in FIG. 8A, in the first state S1 to the third state S3, the maximum value of the load capacity applied to the gas outlet 6 of the multiple supply type air pad J1 is about 1.01 times the minimum value. It is.

  As shown in FIG. 8B, the maximum value of the load capacity applied to the gas outlet 6 of the air pad 1 according to the present embodiment in the first state S1 to the third state S3 is about 1.11 times the minimum value. It is.

  As shown in FIG. 8C, the maximum value of the load capacity applied to the gas outlet 6 of the single-supply air pad J2 in the first state S1 to the third state S3 is about 1.22 times the minimum value. It is.

  As described above, the amount of change in the load capacity due to the hole PO is the smallest for the multi-air supply type air pad J1, the second smallest for the air pad 1 according to the present embodiment, and the largest for the single air supply type air pad J2. .

  If the amount of change in the load capacity when passing over the hole PO is large, the amount of displacement in the vertical direction (Z-axis direction) of the air pad (the moving member on which the air pad is arranged) becomes large, and the amount of change in the load capacity is small. Then, the amount of displacement of the air pad (moving member) in the Z-axis direction becomes small. Therefore, when the air pad passes over the hole PO, the air pad having a smaller change amount of the load capacity can suppress the phenomenon of so-called pad jump phenomenon that vibrates (displaces) in the Z-axis direction.

  Therefore, among the air pad 1, the air pad J1, and the air pad J2, the multiple air supply type air pad J1 can suppress the occurrence of pad jumping most.

  On the other hand, the multi-air supply type air pad J1 may be less stable, for example, its rigidity is reduced and self-excited vibration called a pneumatic hammer phenomenon is likely to occur. For example, when the rigidity decreases, the gap between the air pad (land surface) and the guide surface is not maintained well due to the generation of moment when the air pad (moving member) moves relative to the guide surface. There is a high possibility that a phenomenon (so-called galling phenomenon) in which the air pad comes into contact will occur. As described above, there is a possibility that the air supply J1 of the multiple supply type may not obtain sufficient stability, and may exhibit unexpected behavior such as a galling phenomenon due to a decrease in rigidity or occurrence of self-excited vibration. Get higher. One of the causes of a decrease in the stability of the multi-air supply type air pad J1 is that a large amount of air is supplied between the air pad J1 and the guide surface 21. For this reason, reducing the size D of the gas outlet 6 of the multi-air supply type air pad J1 is considered as an example of a measure for suppressing a decrease in the stability of the air pad J1. However, when the size D of the gas outlet 6 is reduced, another problem occurs that a phenomenon that foreign matters adhere to the gas outlet 6, that is, a so-called clogging phenomenon is likely to occur.

  According to the air pad 1 according to the present embodiment, although the change amount of the load capacity is larger than that of the multi-air supply type air pad J1, it is possible to suppress a decrease in rigidity, generation of self-excited vibration, and the like. The air pad 1 according to the present embodiment can increase the rigidity several times compared to the multi-air supply type air pad J1. Further, the air pad 1 according to the present embodiment can reduce the amount of change in the load capacity to almost half as compared with the single air supply type air pad J2.

  As described above, the air pad 1 of the present embodiment can suppress the occurrence of unexpected behavior such as the occurrence of a galling phenomenon due to a decrease in rigidity, the occurrence of self-excited vibration, and the occurrence of a pad jump phenomenon. it can. Therefore, the moving member 24 on which the air pad 1 is arranged can move favorably on the guide surface 21. Therefore, the stage apparatus 20 can obtain good movement performance.

  Further, according to the air pad 1 of the present embodiment, even if the guide surface 21 has a slight hole PO, the pad skipping phenomenon can be suppressed, so that the inspection process, processing process, etc. of the base member 22 including the guide surface 21 can be performed. It can be simplified or omitted. For example, in the case of using an air pad that cannot sufficiently suppress the pad jump phenomenon, it may be necessary to perform a visual inspection, a microscopic inspection, etc. on the base member 22 including the guide surface 21 and sufficiently perform a process of filling the detected hole PO. There is sex. In that case, the work time required for the inspection process, the machining process, etc. becomes long, and there arises a problem that the productivity of the stage device 20 including the base member 22 is lowered and the manufacturing cost is increased. According to this embodiment, even if such an inspection process, a processing process, etc. are simplified or omitted, the pad jump phenomenon can be suppressed. Accordingly, it is possible to suppress a decrease in productivity of the stage apparatus 20 including the base member 22.

Second Embodiment
Next, a second embodiment will be described. In the following description, the same or equivalent components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted. Hereinafter, an example of the air pad 1 will be described with reference to FIGS. 9 to 20.

  As shown in FIG. 9, the gas outlet 6 may be disposed at a position different from the center of the third facing surface 10.

  As shown in FIG. 10, a plurality of gas outlets 6 may be arranged on the third facing surface 10. In the example illustrated in FIG. 10, the number of the gas outlets 6 is two, but may be any number of three or more.

  As shown in FIG. 11, the shape of the second facing surface 8 in the XY plane may be circular. Further, the shape of the third facing surface 10 in the XY plane may be a circle.

  As shown in FIG. 12, the center of the second facing surface 8 and the center of the third facing surface 10 do not have to coincide with each other. Although not shown, the center of the first facing surface 3 and the center of the second facing surface 8 do not have to coincide with each other.

  As shown in FIG. 13, a plurality of second recesses 5 may be formed inside the first recess 4. In the example illustrated in FIG. 13, the number of the second recesses 5 is two, but may be any number of three or more.

  As shown in FIG. 14, when a plurality of second recesses 5 are formed inside the first recess 4, there may be a second recess 5 in which the gas outlet 6 is not disposed.

  As shown in FIG. 15, the second recess 5 may be a combination of a plurality of grooves that are long in the X-axis direction and grooves that are long in the Y-axis direction.

  As shown in FIG. 16, the 1st, 2nd opposing surfaces 3 and 8 and the 3rd opposing surface 10 do not need to be parallel. The third facing surface 10 shown in FIG. 16 is inclined with respect to the first and second facing surfaces 3 and 8. The third facing surface 10 is inclined so as to gradually approach the second facing surface 8 with respect to the radial direction with respect to the gas outlet 6. Further, the second inner surface (11) may be omitted. In the example shown in FIG. 16, there is no step between the second facing surface 8 and the third facing surface 10.

  As shown in FIG. 17, the 1st, 3rd opposing surfaces 3 and 10 and the 2nd opposing surface 8 do not need to be parallel. The second facing surface 8 shown in FIG. 17 is inclined with respect to the first and third facing surfaces 3 and 10. The second facing surface 8 is inclined so as to gradually approach the first facing surface 3 with respect to the radial direction with respect to the gas outlet 6. Further, the first inner surface (9) may be omitted. In the example shown in FIG. 17, there is no step between the first facing surface 3 and the second facing surface 8.

  As shown in FIG. 18, the 1st opposing surface 3, the 2nd opposing surface 8, and the 3rd opposing surface 10 do not need to be parallel. The second opposing surface 8 shown in FIG. 18 is inclined with respect to the first opposing surface 3, and the third opposing surface 10 is also inclined with respect to the first opposing surface 3. The second opposing surface 8 is inclined so as to gradually approach the first opposing surface 3 with respect to the radial direction with respect to the gas outlet 6, and the third opposing surface 10 is the first opposing surface with respect to the radial direction with respect to the gas outlet 6. It is inclined to approach 3 gradually. Further, in the example shown in FIG. 18, the angle formed by the first facing surface 3 and the second facing surface 8, the first facing surface 3 and the third facing surface 10 (the third facing surface in the same plane as the third facing surface 10). The angle formed by the virtual surface larger than the surface 10 is different. In other words, the second facing surface 8 and the third facing surface 10 face different directions with respect to the first facing surface 3. In the example shown in FIG. 18, the angle formed by the first facing surface 3 and the second facing surface 8 is larger than the angle formed by the first facing surface 3 and the third facing surface 10. The angle formed by the first facing surface 3 and the second facing surface 8 may be smaller than the angle formed by the first facing surface 3 and the third facing surface 10. The first and second inner surfaces (9, 11) may be omitted. In the example shown in FIG. 18, there is no step between the first facing surface 3 and the second facing surface 8, and there is no step between the second facing surface 8 and the third facing surface 10.

  As shown in FIG. 19, at least a part of the third facing surface 10 may be a curved surface. In the example shown in FIG. 19, there is no step between the second facing surface 8 and the third facing surface 10.

  As shown in FIG. 20, at least a part of the second facing surface 8 may be a curved surface. In the example shown in FIG. 20, the third facing surface 10 is also a curved surface. In the example shown in FIG. 20, there is no step between the first facing surface 3 and the second facing surface 8, and there is no step between the second facing surface 8 and the eighth facing surface 10. .

<Third Embodiment>
Next, a third embodiment will be described. In the following description, the same or equivalent components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted. The exposure apparatus EX having the air pad 1 described in each of the above embodiments will be described below.

  FIG. 21 is a schematic block diagram that shows an example of an exposure apparatus EX according to the present embodiment. In FIG. 21, an exposure apparatus EX exposes a mask stage 41 that can move while holding a mask M, a substrate stage 42 that can move while holding a substrate P, and a mask M held on the mask stage 41 as exposure light. An illumination system IL that illuminates with EL and a projection optical system PL that projects an image of the pattern of the mask M illuminated with the exposure light EL onto the substrate P held on the substrate stage 42 are provided.

  The substrate P is a substrate for manufacturing a device. The substrate P includes a substrate in which a photosensitive film is formed on a base material such as a semiconductor wafer such as a silicon wafer. The photosensitive film is a film of a photosensitive material (photoresist).

  The mask M includes a reticle on which a device pattern projected onto the substrate P is formed. In the present embodiment, the mask M is a transmissive mask in which a predetermined pattern is formed on a transparent plate such as a glass plate using a light shielding film such as chrome. The mask M may be a reflective mask.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that exposes the substrate P with the exposure light EL from the mask M while moving the mask M and the substrate P synchronously in a predetermined scanning direction. . In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The exposure apparatus EX moves the substrate P in the Y-axis direction with respect to the projection area of the projection optical system PL, and synchronizes with the movement of the substrate P in the Y-axis direction with respect to the illumination area of the illumination system IL. The mask M is illuminated with the exposure light EL while moving the mask M in the Y-axis direction, and the substrate P is irradiated with the exposure light EL from the mask M via the projection optical system PL. Accordingly, the substrate P is exposed through the mask M and the projection optical system PL, and an image of the pattern of the mask M is projected onto the substrate P.

  The exposure apparatus EX includes, for example, a body 45 including a first column 43 provided on a floor surface FL in a clean room and a second column 44 provided on the first column 43. The first column 43 includes a plurality of first struts 44 and a first base member 46 supported by the first struts 44 via a vibration isolator 45. The second column 44 includes a plurality of second support columns 47 provided on the first base member 46 and a second base member 48 supported by the second support columns 47.

The illumination system IL illuminates a predetermined illumination area on the mask M with exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as a bright line (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, Vacuum ultraviolet light (VUV light) such as ArF excimer laser light (wavelength 193 nm) and F ₂ laser light (wavelength 157 nm) is used. In the present embodiment, ArF excimer laser light that is ultraviolet light (vacuum ultraviolet light) is used as the exposure light EL.

  The mask stage 41 is moved in the three directions of the X axis, the Y axis, and the θZ direction on the second base member 48 while holding the mask M by the operation of the mask stage driving device including an actuator such as a linear motor. Is possible. The mask stage 41 is supported by the air pad 1 in a non-contact manner on the upper surface (guide surface) of the second base member 48. The air pad 1 is disposed on the lower surface of the mask stage 41 facing the upper surface of the second base member 48. For example, when the substrate P is exposed, the mask stage 1 can move the mask M with respect to the optical path of the exposure light EL.

  The mask stage 41 has a first opening 41K through which the exposure light EL passes. The second base member 48 has a second opening 48K through which the exposure light EL passes. The exposure light EL emitted from the illumination system IL and illuminating the mask M passes through the first opening 41K and the second opening 48K, and then enters the projection optical system PL.

  Further, on the second base member 16, the mask stage 41 moves in the direction opposite to the mask stage 41 (for example, −Y direction) according to the movement of the mask stage 41 in one direction (for example, + Y direction) in the Y axis direction. A counter mass 49 is provided. The counter mass 49 is supported on the upper surface (guide surface) of the second base member 16 in a non-contact manner by a self-weight canceling mechanism including the air pad 1. In the present embodiment, the counter mass 49 is provided around the mask stage 41.

  An example of a technique related to an exposure apparatus including a mask stage and a counter mass that are supported by an air pad in a non-contact manner with respect to the upper surface of the second base member is disclosed in, for example, International Publication No. 2004/073053, US Patent Publication No. 2005. No. 2,048,744 and the like.

  The projection optical system PL projects an image of the pattern of the mask M onto the substrate P at a predetermined projection magnification. A plurality of optical elements of the projection optical system PL are held in the lens barrel 50. The lens barrel 50 has a flange 51. The flange 51 is supported by the first base member 46. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis AX of the projection optical system PL is parallel to the Z axis. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  The substrate stage 42 holds the substrate P by the operation of a substrate stage driving device including actuators 57 and 58 such as linear motors, and the X-axis, Y-axis, Z-axis, θX, It can move in six directions, θY and θZ. The substrate stage 42 is supported by the air pad 1 on the upper surface (guide surface) of the third base member 52 in a non-contact manner. The air pad 1 is disposed on the lower surface of the substrate stage 42 facing the upper surface of the third base member 52. The third base member 52 is supported on the floor surface FL via a vibration isolator 53. For example, when the substrate P is exposed, the substrate stage 42 can move the substrate P with respect to the optical path of the exposure light EL.

  The substrate stage 52 is guided in the Y-axis direction by the guide bar 54. The guide bar 54 is guided in the X-axis direction by a guide portion 55B at the upper end of the support member 55. At both ends of the guide bar 54, guide grooves 56 corresponding to the guide portions 55B are provided. The air pad 1 is disposed between the guide portion 55B and the guide groove 56, and the guide groove 56 is supported by the guide portion 55B in a non-contact manner.

  In the present embodiment, since the air pad 1 is arranged on the mask stage 41 and the substrate stage 42, unexpected behavior such as occurrence of a galling phenomenon, occurrence of a pneumatic hammer phenomenon (self-excited vibration), and occurrence of a pad jump phenomenon occurs. Generation | occurrence | production can be suppressed. As a result, the substrate P can be exposed satisfactorily using the mask stage 41 and the substrate stage 42 having good movement accuracy, positioning accuracy, and the like.

  The substrate P of the present embodiment is not limited to a semiconductor wafer for manufacturing a semiconductor device, but a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask (reticle) used in an exposure apparatus (synthesis). Quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Further, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system in a state where the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure of a region almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

  As the exposure apparatus EX, US Pat. No. 6,341,007, US Pat. No. 6,400,441, US Pat. No. 6,549,269, US Pat. No. 6,590,634, US Pat. No. 6,208,407, and US Pat. The present invention can also be applied to a twin stage type exposure apparatus having a plurality of substrate stages as disclosed in the specification of Japanese Patent No. 6262796.

  Further, as disclosed in US Pat. No. 6,897,963, European Patent Application No. 1713113, etc., a substrate stage for holding a substrate, a reference member on which a reference mark is formed, and / or various photoelectric devices. The present invention can also be applied to an exposure apparatus that includes a measurement stage equipped with a sensor. An exposure apparatus including a plurality of substrate stages and measurement stages can be employed.

  Further, the present invention can also be applied to an immersion exposure apparatus that exposes a substrate with exposure light via a liquid as disclosed in, for example, International Publication No. 99/49504 pamphlet.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern onto the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

  In the above-described embodiment, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in US Pat. No. 6,778,257, a variable shaped mask (also called an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. ) May be used. Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element.

  In the above-described embodiment, the exposure apparatus provided with the projection optical system PL has been described as an example. However, the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL.

  The exposure apparatus of the above-described embodiment is manufactured by assembling various subsystems including the constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. The In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 22, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a base material of the device. Substrate processing step 204, including substrate processing (exposure processing) including exposing the substrate with exposure light from a mask and developing the exposed substrate according to the above-described embodiment, device assembly It is manufactured through steps (including processing processes such as a dicing process, a bonding process, and a package process) 205, an inspection step 206, and the like.

  In this embodiment, the case where the stage apparatus using the air pad 1 is applied to the exposure apparatus has been described as an example. However, the present invention can also be applied to a machine tool having a moving stage, for example.

  In the first to third embodiments described above, the pad forming member 2 includes the pad main body 2A and the bush 2B, and the internal flow path 7 is formed in the bush 2B, but the bush 2B is omitted. The pad forming member 2 may be composed of only the pad main body 2A. In that case, the internal flow path 7 and the gas outlet 6 are formed in the pad main body 2B.

  In each of the above-described embodiments, the case where the fluid bearing (gas bearing) 1 is an air pad that uses air has been described as an example. However, other gases such as nitrogen, helium, and the like are photochemically inert gases. May be used.

  Note that the requirements of the above-described embodiments can be combined as appropriate. In addition, the disclosures of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

It is a top view which shows an example of the fluid bearing which concerns on 1st Embodiment. It is a sectional side view which shows an example of the fluid bearing which concerns on 1st Embodiment. It is a perspective view showing a partial section of a fluid dynamic bearing concerning a 1st embodiment. It is a perspective view which shows an example of the state which the fluid bearing arrange | positioned on the surface of the 1st object is supporting the 2nd object in non-contact. It is a perspective view which shows an example of the stage apparatus which concerns on this embodiment. 6A and 6B are schematic diagrams for explaining the operation of the fluid bearing, in which FIG. 6A shows a fluid bearing according to a comparative example, FIG. 6B shows a fluid bearing according to the present embodiment, and FIG. (C) is a figure which shows the fluid bearing which concerns on a comparative example. It is a schematic diagram for demonstrating the state to which a fluid bearing moves on a guide surface. FIG. 8A is a schematic diagram for explaining a load capacity of a fluid dynamic bearing, FIG. 8A is a diagram illustrating a load capacity of a fluid dynamic bearing according to a comparative example, and FIG. 8B is a load of the fluid dynamic bearing according to the present embodiment. The figure which shows a capacity | capacitance and FIG.8 (C) are figures which show the load capacity | capacitance of the fluid bearing which concerns on a comparative example. It is a top view which shows an example of the fluid bearing which concerns on 2nd Embodiment. It is a top view which shows an example of the fluid bearing which concerns on 2nd Embodiment. It is a top view which shows an example of the fluid bearing which concerns on 2nd Embodiment. It is a top view which shows an example of the fluid bearing which concerns on 2nd Embodiment. It is a top view which shows an example of the fluid bearing which concerns on 2nd Embodiment. It is a top view which shows an example of the fluid bearing which concerns on 2nd Embodiment. It is a top view which shows an example of the fluid bearing which concerns on 2nd Embodiment. It is a sectional side view which shows an example of the fluid bearing which concerns on 2nd Embodiment. It is a sectional side view which shows an example of the fluid bearing which concerns on 2nd Embodiment. It is a sectional side view which shows an example of the fluid bearing which concerns on 2nd Embodiment. It is a sectional side view which shows an example of the fluid bearing which concerns on 2nd Embodiment. It is a sectional side view which shows an example of the fluid bearing which concerns on 2nd Embodiment. It is a schematic block diagram which shows an example of the exposure apparatus which concerns on 3rd Embodiment. It is a flowchart which shows an example of the manufacturing process of a semiconductor device.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Air pad, 2 ... Pad formation member, 2A ... Pad main body, 2B ... Bush, 3 ... 1st opposing surface, 4 ... 1st recessed part, 5 ... 2nd recessed part, 6 ... Gas outlet, 7 ... Internal flow path, DESCRIPTION OF SYMBOLS 8 ... 2nd opposing surface, 9 ... 1st inside surface, 10 ... 3rd opposing surface, 11 ... 2nd inside surface, 12 ... Inlet, 13 ... 1st object, 14 ... Surface, 15 ... 2nd object, 16 ... Surface, 20 ... Stage device, 21 ... Guide surface, 22 ... Base member, 41 ... Mask stage, 42 ... Substrate stage, 48 ... Second base member, 52 ... Third base member, EL ... Exposure light, EX ... Exposure device , M ... Mask, P ... Substrate

Claims (21)

A first recess formed in the first surface of the first member;
A second recess formed inside the first recess;
A fluid bearing comprising: a fluid outlet disposed inside the second recess.   The fluid bearing according to claim 1, wherein the number of the fluid outlets is one. The first concave portion includes a second surface facing a predetermined surface disposed at a position facing the first surface and being separated from the first surface with respect to the predetermined surface,
The second recess includes a third surface facing the predetermined surface and separated from the second surface with respect to the predetermined surface,
The fluid bearing according to claim 1, wherein the fluid outlet is disposed on the third surface.   The fluid bearing according to claim 3, wherein the fluid outlet is disposed substantially at the center of the third surface.   The fluid bearing according to any one of claims 1 to 4, wherein a plurality of the fluid outlets are arranged.   The hydrodynamic bearing according to claim 3, wherein the second surface is disposed around the third surface.   The hydrodynamic bearing according to claim 6, wherein a center of the second surface and a center of the third surface substantially coincide with each other.   The hydrodynamic bearing according to claim 3, wherein the first surface is disposed around the second surface.   The hydrodynamic bearing according to claim 8, wherein a center of the first surface and a center of the second surface substantially coincide with each other.   The hydrodynamic bearing according to claim 3, wherein the first surface is a flat surface.   The fluid bearing according to claim 3, wherein the second surface is a flat surface.   The hydrodynamic bearing according to claim 3, wherein the third surface is a flat surface.   The hydrodynamic bearing according to claim 10, wherein the first surface, the second surface, and the third surface are substantially parallel.   The hydrodynamic bearing according to claim 10, wherein at least one of the second surface and the third surface is inclined with respect to the first surface.   The hydrodynamic bearing according to any one of claims 3 to 14, further comprising a first connection surface that faces a direction different from the first surface and the second surface and connects the first surface and the second surface.   The hydrodynamic bearing according to any one of claims 3 to 15, further comprising a second connection surface that faces a direction different from the second surface and the third surface and connects the second surface and the third surface.   The hydrodynamic bearing according to any one of claims 3 to 16, wherein at least a part of the third surface and the fluid outlet are disposed on a second member different from the first member. A stage apparatus comprising: a base member having a guide surface; and a moving member having a facing surface facing the guide surface and movable relative to the base member,
The stage device including the hydrodynamic bearing according to claim 1, wherein at least one of the guide surface and the facing surface. An exposure apparatus that exposes a substrate with exposure light,
The exposure apparatus provided with the stage apparatus of Claim 18 which can move an object with respect to the optical path of the said exposure light.   The exposure apparatus according to claim 19, wherein the object includes the substrate. Exposing the substrate using the exposure apparatus according to claim 19 or 20,
Developing the exposed substrate; and a device manufacturing method.

Images