WO2005071747A1 - Heat pipe radiator of heat-generating electronic component - Google Patents

Heat pipe radiator of heat-generating electronic component Download PDF

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Publication number
WO2005071747A1
WO2005071747A1 PCT/CN2004/000356 CN2004000356W WO2005071747A1 WO 2005071747 A1 WO2005071747 A1 WO 2005071747A1 CN 2004000356 W CN2004000356 W CN 2004000356W WO 2005071747 A1 WO2005071747 A1 WO 2005071747A1
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WO
WIPO (PCT)
Prior art keywords
heat
electronic component
heat pipe
pipe radiator
casing
Prior art date
Application number
PCT/CN2004/000356
Other languages
English (en)
French (fr)
Inventor
Hongwu Yang
Original Assignee
Hongwu Yang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongwu Yang filed Critical Hongwu Yang
Priority to EP04727496.4A priority Critical patent/EP1708261B1/en
Publication of WO2005071747A1 publication Critical patent/WO2005071747A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a heat sink, in particular to an integrated heat pipe type heat sink with a three-dimensional condensing heat dissipation network, which can be used for heat dissipation of electronic components, and is prepared by adjusting the arrangement of the heat dissipation fins, the liquid wick and the overall heat pipe arrangement.
  • the reliability and life of a computer are closely related to its operating temperature, and the higher the degree of integration of a chip, the higher the heat it generates. 8% ⁇
  • the normal operating temperature inside a computer chip is ⁇ 1 30 D C, and for every 1 degree increase, the reliability of its work will be reduced by 3.8%. If this heat cannot be dissipated in a timely manner, the reliability of the computer's work will not be guaranteed, and even it will not run properly.
  • the heat generated by chips and other electronic components in the work cannot be effectively solved, data processing equipment with faster speed, higher power, and smaller size cannot be developed.
  • the heat dissipation method of computers and electronic components is usually to install a comb-shaped heat sink made of aluminum alloy material on the body of a chip or other electronic component to create a large heat dissipation area.
  • a fan is used to dissipate the heat. This reduces the temperature.
  • FIG. 1 shows a heat dissipation device using a heat pipe, which includes a frame 1.
  • a plurality of heat dissipation fins 2 made of thin metal sheets are densely mounted on the bottom plate of the frame 1.
  • the heat pipe 3 penetrates the lower part of the heat dissipation fin 2 and projects upward and bends 180 degrees to penetrate into the upper part of the heat dissipation fin 2. All the radiating fins 2 are closely connected with the heat pipes 3.
  • In the heat pipe 3, a liquid working medium that is vaporized by heat and precondensed is placed.
  • the heat generated by the chip vaporizes the liquid working medium in the heat pipe 3 lying on the bottom plate of the frame 1, and the heat enters the upper part of the heat dissipation fin 2 with the vaporized liquid working medium.
  • the heat pipe 3 meets the condensation junction, and the heat is radiated to the outside through the heat dissipation fins 2.
  • the forced air cooling fan 4 is installed on the top of the heat dissipation fin 2, the heat is more easily dissipated. Because the heat pipe has extremely high heat transfer efficiency, the heat generated by the chip can be quickly transferred to the radiating fins at a distance to achieve the purpose of heat dissipation.
  • This method has higher heat dissipation efficiency than the conventional comb-shaped heat sink method. Since the temperature of the heat sink on the comb-shaped heat sink is often far from the chip, the temperature is low, and the temperature near the bottom of the chip is high. This temperature gradient phenomenon wastes a lot of heat dissipation area, so it does not have Higher heat dissipation efficiency, and the use of heat pipes can overcome the shortcomings of the poor heat dissipation effect of the comb-shaped heat sink.
  • the heat pipe cooling device shown in FIG. 1 has a good heat dissipation effect, due to its structural shortcomings (the heat source and the bottom plate, the heat pipe and the bottom plate, and the heat pipe and the fins are relatively high). Thermal resistance) and considering the strength of the heat sink, the fins cannot be made very thin, and the thicker fins not only waste material and occupy a limited space, but also cannot obtain more heat dissipation area, so this way It still cannot meet the heat dissipation requirements of very large integrated circuits, high-power electronic devices, and high-speed chips, which has limited its application.
  • chip heat sink made by using the principle of heat pipe heat dissipation, which uses a hollow case filled with a liquid working medium, and a plurality of comb-shaped heat sinks are extended on the surface of the shell.
  • the heat of the chip flows into the hollow case, and the vaporized liquid working medium sends the heat to the surface of the hollow case, and the heat is dissipated through a plurality of comb-shaped heat sinks.
  • This chip heat sink has better heat dissipation efficiency than the heat pipe heat sink shown in Figure 1.
  • Due to the limitation of internal vaporization space and surface heat dissipation space its heat dissipation efficiency still cannot fully meet today's high-speed chips and continuous research and development Heat dissipation requirements for larger scale integrated circuit chips.
  • the problem to be solved by the present invention is to provide a heat pipe radiator for heat-generating electronic components, which aims at the current situation that traditional radiators cannot fully meet the heat dissipation requirements of electronic components and cannot adapt to the rapid development of today's electronic technology.
  • the radiator uses liquid
  • the working principle of the heat pipe that conducts heat quickly is to set up a condensing network in a three-dimensional space, so that the heat generated by the heat source can achieve an optimized matching combination with the heat dissipation area, which provides a new solution to the problem of heat dissipation of electronic components.
  • the present invention proposes the following technical solutions:
  • a heat pipe radiator for a heat-generating electronic component includes a tubular casing, and further includes a tubular thin-walled fluid channel, the tubular thin-walled fluid channel is disposed in the housing, and an edge of the tubular thin-channel fluid channel is connected to the housing through an end panel.
  • the edge of the shell is hermetically sealed, so that a closed space is formed between the inner wall of the shell and the outer side of the tubular thin-walled fluid channel.
  • the closed space is a vacuum, and the interior is filled with vaporized by heat and condensed by heat. Liquid working fluid.
  • a thin-walled fluid passage is provided with more than one layer of heat-dissipating fins which are convenient for the heat to be carried out when the cooling fluid passes through.
  • a liquid wick is arranged on the inner surface of the casing in the closed space, and the liquid wick has a capillary force that can absorb liquid and Make it stretch the void.
  • a filling port for evacuating and filling the liquid working medium is provided on the end plate, and the filling port is evacuated in the closed space and closed after filling the liquid working medium.
  • the shell can be made of metal or organic materials with good thermal conductivity.
  • the heat-generating electronic component When the heat-generating electronic component is radiated and cooled, the surface of the casing is attached to the heat-radiating surface of the heat-generating electronic component, and the heat-radiating surface of the heat-generating electronic component is used as a heat source, so that heat is transmitted to the liquid working medium through the housing.
  • the liquid shield began to vaporize gradually when exposed to heat. The vaporized liquid working medium quickly brings heat to any position in the closed space. When it encounters the outer surface of the lower temperature tubular thin-walled fluid channel, it transfers the heat to the radiating fins and condenses itself into a liquid state. And return or return to the original position through the wick.
  • the liquid working medium does not collect on the heat-radiating surface of the heating electronic component.
  • the Capillary force can also bring the liquid working fluid to the position of the heating electronic component, and as the vaporization continues, the liquid working fluid will continue to flow to the heating position, thereby forming a liquid-to-gas cycle of the liquid working fluid. It guarantees that the electronic equipment can work stably under any circumstances.
  • the heat dissipation fin greatly increases the heat dissipation area.
  • the heat dissipation fin makes the heat dissipation effect better.
  • the shape of the shell can be made into a rectangular or circular or hexagonal tube body or any shape according to actual needs.
  • the absorbent core can be composed of a multi-layer fiber woven mesh, or a multi-layer metal wire mesh, or a plate-shaped body with micropores made by powder sintering process.
  • the wick can be laid on the inside surface of the casing by bonding or welding.
  • the wick can also be manufactured in another way. It can be a band-shaped body made of a thin sheet of metal or organic material by continuous bending or bending. A hole is provided on the surface of the sheet, and the sheet is attached to the inner wall of the shell through a detailed connection or an adhesive ring.
  • the wick made in this way not only has the characteristics of the above-mentioned wick to attract the liquid working medium, but also because the thin metal sheet itself has good thermal conductivity, it can directly participate in heat transfer and heat conduction.
  • the liquid wick can directly and rapidly vaporize the liquid working medium located far away from the heat source, thereby improving the heat conduction speed, and then greatly improving the heat dissipation efficiency of the heat pipe radiator of the entire heating electronic component.
  • one or more tubular thin-walled fluid channels can be made according to specific heat dissipation requirements.
  • the end panel is hermetically sealed with the edges of multiple thin-walled fluids and the edge of the shell through its edges, so that a tubular thin-walled fluid channel is formed between the inner wall of the shell and the outside of the multiple tubular thin-walled fluid channels. Closed spaces that run through each other.
  • the installation of multiple tubular thin-walled fluid channels will reduce the total heat dissipation area of the heat dissipation fins, but it will increase the volume of the enclosed space and facilitate the vaporized heat transfer of the liquid working fluid. .
  • the determination of the number of tubular thin-walled fluid channels depends on the matching requirements between the heat emitted from the heat source and the amount of heat dissipation. Therefore, by adjusting the tubular thin-walled flow The number of body channels can achieve the optimal matching design of heat dissipation.
  • the limited space can be effectively used, and the space for the cooling fluid to pass through in the tubular thin-walled fluid channel can be effectively used.
  • the ratio of the volume of the volume to the volume of the enclosed space reached a better matching value.
  • the tubular thin-walled fluid channel can be made of a metal material with good thermal conductivity.
  • a support rod or a support plate made of a metal material may be provided in the tubular thin-walled fluid channel.
  • a support rod or a support plate passes through the heat dissipation fin and is fixed on the inner wall of the tubular thin-walled fluid channel, and the heat dissipation fin is tightly connected with the support rod or the support plate.
  • a thin-walled heat pipe made of a metal material can also be provided in the tubular thin-walled fluid channel. The thin-walled heat pipe passes through the heat-dissipating fin and is tightly connected to the heat-dissipating fin.
  • the inner wall of the tubular thin-walled fluid channel penetrates the enclosed space. This can not only play a role of fixing the heat dissipation fins, but also can use the thin-walled heat pipe to transfer heat to the heat dissipation fins, which is equivalent to increasing the volume of the enclosed space and the area of heat transfer to the heat dissipation fins. Cooling effect.
  • the end panel is an important component that closes the enclosed space.
  • the surface periphery of the end panel may be convexly arranged for welding or bonding to the inner wall of the housing and
  • the flange on the outer surface of the tubular thin-walled fluid channel may be provided inside the closed space or outside the closed space. The flange can improve the strength of the heat pipe radiator of the entire heating electronic component, and is suitable for mass production.
  • the radiating fins are made of metal sheets, which can be wavy, or can be a fin group consisting of metal sheets that are continuously bent in a "Z" shape. Vias can also be provided on the surface of the cooling fins for the cooling fluid to pass through, or vertical thorns can be formed on the surface of the cooling fins, which can cause turbulent flow of the cooling fluid, so that the cooling effect is better.
  • a forced cooling fan may be provided outside the tubular thin-walled fluid channel of the heat pipe radiator of the heating electronic component.
  • the cooling of the fan may be matched and arranged on the edge of the casing.
  • an outer tubular fluid made of a material with good thermal conductivity is also fixed on the outer surface of the casing.
  • a channel, an axis of the outer tubular fluid channel is parallel to the axis of the tubular thin-walled fluid channel, and a heat dissipation fin is fixed on an inner wall thereof.
  • the radiating fins in the outer tubular fluid channel absorb the heat on the outer surface of the casing, which greatly increases the radiating area outside the casing, thereby speeding up the heat dissipation and improving the heat dissipation efficiency.
  • the assistive scheme provided by the present invention can also provide heat dissipation for multiple heat-generating electronic components at the same time, and in order to improve the efficiency of heat transfer from the heat-generating electronic components to the enclosed space in the housing, one or Multiple capable with A heat-conducting plate with the heat-dissipating surface of the external heat-generating electronic component in close contact with the heat-conducting plate is embedded in the surface of the housing, or a dedicated recess is opened on the surface of the housing, and the heat-conducting plate is used as the bottom surface of the dedicated recess.
  • the heat-radiating surface of the external heat-generating electronic component can be embedded in the special recess, and the heat-radiating surface of the external heat-emitting electronic component can be closely attached to the heat-conducting plate.
  • the heat-conducting plate is a rectangle or a circle made of a metal plate or an organic flexible plate with good heat-conducting performance or any shape that matches the shape of the heat-dissipating surface of the heating electronic component.
  • the present invention also provides a technical solution for directly heat-dissipating the integrated circuit itself.
  • This solution also provides high-power transistor, high-temperature
  • a good method for direct heat dissipation of a high-frequency transistor is as follows: On the basis of the above technical solution, one or more openings are opened in the casing, and a device substrate matching its size is embedded in the opening. The periphery of the device substrate is tightly sealed with the casing. A surface of the device substrate located in the closed space is provided with an inner core of integrated electronic circuits or electronic components. The lead wires of the inner core of the integrated electronic circuit or electronic component are disposed on a surface of the device substrate on the outside of the housing.
  • the liquid wick is laid on the inner core of the integrated electronic circuit or electronic component.
  • the liquid working medium is an electrically insulating material and is chemically and electrically compatible with the core material of the integrated electronic circuit or electronic component.
  • the device substrate can be a chip backplane of an integrated circuit, and the VLSI on its surface is directly set in an enclosed space and directly contacts the liquid working medium, so that the heat transfer is faster and there is no thermal resistance.
  • the base plate of a high-power transistor can also be made into the device substrate, and the P-N junction consolidated on its surface directly contacts the liquid working medium, thereby eliminating the heat dissipation of the traditional transistor.
  • the phenomenon that the insulating material of the die base is derived makes the heat dissipation efficiency of the transistor greatly improved, thereby improving and extending the reliability and service life of the transistor, especially the high-power transistor and the high-frequency transistor.
  • the present invention utilizes the principle of heat pipe heat transfer, and forms a closed space for vaporized heat transfer of the liquid working medium by setting a tubular thin-walled fluid channel in the tubular casing, and uses the thin-walled fluid channel
  • the internal heat dissipation fins constitute a heat dissipation network with a three-dimensional space, which enables the heat dissipation fins to be ultra-thin and high-density, and obtains a heat dissipation area much larger than that of a conventional heat pipe heat sink.
  • the invention has a simple structure, a fast heat transfer speed, The heat conduction is uniform, easy to use, and has high reliability. It can be made into various styles according to the specific conditions of electronic devices to meet the needs of different equipment.
  • the present invention also provides an effective solution for direct heat dissipation for the heat dissipation problems of VLSI and various heat-generating electronic devices now and in the future. BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a schematic structural diagram of a heat pipe heat sink device currently used
  • FIG. 2 is a schematic structural diagram of a heat pipe radiator of a heating electronic component provided by the present invention
  • FIG. 3 is a schematic structural diagram of an end panel of the heat pipe radiator shown in FIG. 2;
  • FIG. 4 is a schematic structural diagram of a specific embodiment of a wick used in the present invention.
  • FIG. 5 is a schematic structural diagram of another specific embodiment of a liquid wick used in the present invention.
  • FIG. 6 is a schematic structural diagram of a specific embodiment of a thin-sheet liquid wick used in the present invention.
  • FIG. ⁇ is a schematic structural diagram of another embodiment of a thin-film wick used in the present invention.
  • FIG. 8 is a schematic structural diagram of another embodiment of a thin-film wick used in the present invention.
  • FIG. 9 is a schematic structural diagram of an embodiment provided by the present invention.
  • FIG. 10 is a schematic structural diagram of another embodiment provided by the present invention.
  • FIG. 11 is a structural side view of the embodiment shown in FIG. 10;
  • FIG. 12 is a schematic diagram of another connection manner of an end panel according to the present invention.
  • FIG. 13 is a schematic structural diagram of a specific embodiment of a heat dissipation fin according to the present invention.
  • FIG. 14 is a schematic structural diagram of another specific embodiment of a heat dissipation fin according to the present invention.
  • 15 is a schematic structural diagram of an embodiment with an outer tubular fluid channel provided by the present invention.
  • 16 is a schematic structural diagram of an embodiment for reducing thermal resistance provided by the present invention.
  • FIG. ⁇ is a schematic structural diagram of an embodiment for eliminating thermal resistance and direct heat dissipation provided by the present invention. detailed description
  • FIG. 2 is a schematic structural diagram of a heat pipe radiator of a heating electronic component provided by the present invention.
  • the heat sink includes a tubular casing 5 (the rectangle is shown in the figure, but other shapes are also possible).
  • a tubular thin-walled fluid channel 6 is provided in the casing 5, and the shape of the tubular thin-walled fluid channel 6 is also rectangular.
  • the tubular thin-walled fluid channel 6 and the casing 5 are hermetically sealed along the edges by two front and rear parallel end plates 7, so that an enclosed space 51 is formed between the inner wall of the casing 5 and the outer side of the tubular thin-walled fluid channel 6.
  • the closed space 51 is a vacuum, and the interior thereof is filled with a liquid working medium 52 which is vaporized by heat and condensed by condensation.
  • the tubular thin-walled fluid channel 6 is made of a thin metal plate with good thermal conductivity, and a plurality of heat-dissipating fins 61 are fixed in the inside.
  • the multi-layered radiating fins 61 are densely arranged in parallel, and their sides are connected to the inner wall of the tubular thin-walled fluid passage 6. When the cold fluid passes through the tubular thin-walled fluid passage 6, the heat is dissipated through the radiating fins 61.
  • a liquid-absorbent wick 8 is placed around the inner surface of the casing 5 in the closed space 51, and the inside and the surface of the liquid-absorbent wick 8 There are voids that generate capillary forces that allow liquid to adsorb on and extend through its surface.
  • the wick 8 can be fixed to the inner surface of the casing 5 by being connected or bonded early, and partially immersed in the liquid working medium 52.
  • the end panel 7 is provided with a filling port 71 for evacuating and filling the liquid working shield 52.
  • the filling port 71 is closed after the closed space 51 is evacuated and filling the liquid working medium 52.
  • the heat pipe radiator of the heating electronic component When the heat pipe radiator of the heating electronic component is used, it is mounted on the surface of the heating electronic device (such as a CPU chip), and the heat generated by the heating electronic device is transmitted to the liquid working medium 52 through the bottom of the casing 5 The mass 52 then vaporizes, and the unheated part flows to the vaporized part to supplement it. The vaporized liquid working medium 52 moves upward along the inside of the enclosed space 51 and performs heat exchange with the outside of the tubular thin-walled fluid passage 6, and the heat is transferred to the multi-layered heat sink fin 61.
  • the heating electronic device such as a CPU chip
  • the vaporized liquid working medium 52 re-condenses into a liquid state, and falls back to the original position, and continues to flow to the vaporized part, so that a phase change cycle of the liquid working medium 52 is formed inside the closed space 51 Movement, in this phase change cycle movement, the heat of the heating electronic device is quickly discharged.
  • the densely arranged multi-layered heat-dissipating fins 61 have a larger heat dissipation area than the surface of the heat-generating electronic device, thereby ensuring timely heat dissipation.
  • the liquid working medium 52 When the electronic device is moving (such as during transportation) or working in a side-by-side or upside-down state, the liquid working medium 52 deviates from the position of the heat-generating electronic device.
  • the capillary force absorbs the liquid working medium 52 so that the liquid working medium 52 extends to the location of the heating electronic device, and provides vaporized heat dissipation for it, thereby ensuring that the phase change cycle movement of the liquid working medium 52 will not be interrupted.
  • the shape of the end plate 7 used in the present invention is a shape formed between the outside of the tubular thin-walled fluid passage 6 and the inside of the housing 5.
  • the shape of the end plate 7 is a quadrangular shape.
  • the cross section of the end panel 7 can be made into a concave shape as shown in FIG. 3.
  • the surface perimeter of the end panel 7 is convexly provided with a flange 72 toward the inner periphery of the enclosed space.
  • the flange 72 can be used to easily weld or bond the end panel 7 to the inner wall of the casing and the thin-walled fluid channel of the tube.
  • On the outside surface it is not only easy to operate, but also has good sealing performance.
  • the protruding direction of the flange 72 may be outside the closed space, but the volume of the closed space may be reduced.
  • the wick 8 used in the present invention can be made in various forms.
  • Figure 4 shows a multilayer stack made of a multi-layer wire mesh 81.
  • the multi-layer metal wire mesh 81 has abundant voids between itself and itself, which can produce a better liquid adsorption effect.
  • Fig. 5 is a partial schematic diagram of a porous wick manufactured by a powder sintering process.
  • the wick relies on the micropores 82 on the inside and the surface to generate capillary force to adsorb liquid.
  • Figure 6 shows a band-shaped liquid wick made of a metal sheet with good thermal conductivity according to a "U" shape, which is continuously bent back and forth.
  • a plurality of "U” shaped grooves were formed in the band-shaped liquid wick.
  • a hole 83 is formed in the surface of the metal sheet of the band-shaped liquid wick.
  • the hole 83 may be a rectangular or circular slot opening, and it may be provided in a convex or concave manner.
  • Such a band-shaped liquid wick can be firmly connected to the inner wall of the casing. Compared with other wicks, Good capillary adsorption.
  • a strip-shaped liquid wick made of a metal sheet can also be made into a strip-shaped liquid wick made by bending a metal sheet in a "V" shape continuously and repeatedly as shown in Fig. 7; As shown in Figure 8, the metal foil is wicked in a band-like shape formed by bending the metal flakes back and forth according to the " ⁇ " shape.
  • holes 83 are formed on the surface of the band-shaped wick, which is used for vaporization of the liquid working medium through the surface.
  • the liquid working medium can be conveniently placed in its interior.
  • the ends of the "U” -shaped groove, the "V” -shaped groove, and the " ⁇ " -shaped groove can be closed.
  • the above-mentioned band-shaped liquid wicks made of metal flakes have the function of transmitting liquid by capillary force in addition to the traditional liquid wick, and also have two other special beads functions, which make the present invention have better use effect. It can be as follows:
  • the strength of the shell can be greatly enhanced. Therefore, when manufacturing the shell, a thin material can be used. This can not only further reduce the thermal resistance and speed up the heat conduction, but also reduce the weight of the casing without reducing the mechanical strength of the casing. This has a great impact on the development, production, and use of future miniaturized electronic equipment. The significance of this is especially important when the electronic equipment is used in cutting-edge equipment such as aerospace.
  • the wick passes through a bent sheet and is provided with a large number of holes on its surface, when the wick is welded to the casing and transmits heat, the fold edges and the edges of the openings It often has a relatively high temperature, which makes the liquid working medium located there easily boil, resulting in the effect of strengthening boiling, so that the heat generated by the electronic device can be transferred faster through boiling.
  • the vf in FIG. 9 is a specific embodiment provided with two tubular thin-walled fluid channels provided by the present invention.
  • both of the tubular thin-walled fluid channels 6 are made rectangular according to the shape of the casing 5.
  • the shape of the end panel (shown in the figure) is the same as the shape formed between the two thin-walled fluid passages 6 and the casing 5, and the closed connection method is the same as the above-mentioned principle structure, so it will not be repeated here.
  • a plurality of thin-walled heat pipes 62 made of a metal material are also provided in the tubular thin-walled fluid passage 6.
  • the thin-walled heat pipes 62 pass through the heat-dissipating fins 61 and are closely connected to the heat-dissipating fins 61. .
  • Both ends of the thin-walled heat pipe 62 are fixed to the inner wall of the tubular thin-walled fluid passage 6, and the inner cavity thereof penetrates the closed space 51.
  • the establishment of the thin-walled heat pipe 62 provides support for the densely arranged heat dissipation fins 61, increases the strength of the heat dissipation fins 61, and increases the heat exchange area.
  • the volume of the enclosed space 51 is increased, which is more conducive to the heat transfer of the vaporized liquid working medium to the outside world, and accelerates the phase transition speed of the liquid working medium from gaseous to liquid, thereby improving the heat pipe radiator of the entire heating electronic component. Cooling efficiency.
  • FIG. 10 is a schematic structural diagram of another embodiment of a circular shell provided by the present invention.
  • the casing 5 is circular, and the bottom thereof is flat (used to be closely mounted on the surface of the integrated circuit chip).
  • the casing 5 is provided with ten thin-walled tubular fluid channels 6 similar to orange petals. .
  • the radiating fins 61 in the tubular thin-walled fluid passage 6 are densely arranged in a circular arc shape.
  • This embodiment has a good heat dissipation effect, and its round casing can be conveniently equipped with a strong cooling fan, so that the heat dissipation speed is faster.
  • a drainage cover 53 capable of introducing cooling fluid into the tubular thin-walled fluid channel 6 is also provided on the edge of the casing 5.
  • the shape of the casing 5 is similar (as shown in FIG. 11).
  • the inside of the drainage hood 53 is large outside and small inside.
  • reinforcing plates 54 are also provided in the closed space 51, and the shape of the reinforcing plate 54 is the same as the orthographic projection of the closed space 51 in the axial direction of the casing 5. That is, the outer shape is the same as that of the end panel 7 and is arranged in parallel with the end panel 7.
  • the reinforcing plate 54 is also provided with openings or gaps through which liquid workers can pass, which does not affect the phase change cycle movement.
  • connection manner between the end panel and the edge of the housing and the edge of the tubular thin-walled fluid channel may also be as shown in FIG. 12 (the figure only shows Schematic diagram of the connection structure between the end panel and the casing).
  • the edge of the end plate 7 and the edge of the casing 5 can be connected by bending the bite, and can be welded or adhesively fixed at the connection.
  • the end plate 7 and the edge of the tubular thin-walled fluid passage can also be connected in this manner.
  • This connection method is suitable for industrial mass production of heat pipe radiators for some heating electronic components.
  • a larger enclosed space can be obtained, and the larger enclosed space can help the vaporization and dissipation of liquid working fluid.
  • the reason why the present invention has high heat dissipation efficiency is that the arrangement of the heat dissipation fins is optimized and a specific technical solution for manufacturing a thin metal plate is proposed, as shown in FIG. 13.
  • FIG. 13 shows a specific arrangement scheme of the heat dissipation fins.
  • the heat dissipation fins 61 ⁇ are made of a thin metal sheet, which is continuously bent according to a “Z” shape to form the heat dissipation fins 61 into a heat dissipation fin.
  • the sheet group is installed in the tubular thin-walled fluid channel 6.
  • a support plate 63 is further provided in the middle of the heat radiation fin 61.
  • the support plate 63 is made of a metal material and passes vertically through the radiating fins 61.
  • the support plate 63 is welded and fixed to the inner wall of the tubular thin-walled fluid channel 6 through its upper and lower sides.
  • the radiating fins 61 and the support plate 63 pass through a flat plate. Closely connected.
  • the bent ends of the radiating fins 61 are also connected to the inner wall of the tubular thin-walled fluid channel 6 through a rigid connection.
  • the support plate 63 actually functions as a rib.
  • the support plate 63 is made of a metal material and is closely connected to the heat radiation fin 61, the heat transfer efficiency is improved, and the thin heat radiation fin 61 is also advanced. One step increases the effective heat dissipation area.
  • FIG. 14 is another specific arrangement scheme of the heat dissipation fins.
  • the heat dissipation fins 61 are made of metal sheets in a wave shape, and are arranged in parallel as a group fixed on the inner wall of the tubular thin-walled fluid channel 6.
  • a plurality of standing thorns 6 1 1 are also provided on each of the heat dissipation fins.
  • via holes may be provided on the surface of the radiating fins 61 for the cooling fluid to pass through, so as to maximize the radiating efficiency.
  • the two solutions disclosed in Figures 13 and 14 not only effectively increase the heat dissipation area, but also provide a space volume for the cooling fluid to pass through in the tubular thin-walled fluid channel.
  • the space volume usually needs to be greater than twice the volume of the closed space.
  • the volume of the space through which the fluid passes can be increased as much as possible.
  • the present invention may also provide another embodiment in which an outer tubular fluid channel is added to the outer side of the housing, and its structure is shown in FIG. 15.
  • three outer tubular fluid channels 58 made of a material with good thermal conductivity are also fixed on the surface of the casing 5.
  • the axis of the outer tubular fluid passage 58 is parallel to the axis of the tubular thin-walled fluid passage 6, and the inner wall is fixedly provided with a radiating fin 61.
  • the arrangement manner of the radiating fins 61 in the outer tubular fluid passage 58 is as shown in FIG. 13, and a parallel arrangement manner may also be adopted.
  • the heat radiating fin 61 absorbs heat on the outer surface of the casing 5, which greatly increases the heat dissipation area outside the casing 5, thereby speeding up the heat dissipation speed and improving the heat dissipation efficiency.
  • the shell of the present invention can be made of metal materials, and can also be produced in batches by using engineering plastics.
  • engineering plastic in order to reduce the contact thermal resistance, a heat conducting plate may be fixed on the casing, and the heat conducting plate and the heat-dissipating surface of the heating electronic component are closely adhered.
  • the heat-conducting plate can be directly embedded in the housing, or a recess can be opened on the surface of the housing, and the heat-conducting plate is used as the bottom surface of the recess. At this time, the heat-conducting plate has been extended into the enclosed space, thereby reducing the past. Thermal resistance for contact heat transfer.
  • Fig. 16 shows a specific embodiment of extending the heat conducting plate into the enclosed space. It can be seen from the figure that, at the bottom of the casing 5, a recess 55 capable of embedding an integrated circuit chip (CPU chip) is provided, and the bottom surface of the recess 55 is the heat conducting plate 56 described above.
  • CPU chip integrated circuit chip
  • the depression 55 is located in the closed space 51, and the liquid wick 8 is laid on the other side of the heat conducting plate 56, and the depression 55 is located in the liquid shield 52 as a whole.
  • the thermally conductive plate 56 may be made of a metal plate with good thermal conductivity, or may be made of an organic soft plate with good thermal conductivity.
  • the organic flexible board can closely adhere to the surface of the chip under a certain mounting pressure, so that the heat of the chip can be quickly transferred into the liquid Working fluid 52.
  • the heat-conducting plate 56 can be made into a rectangular, circular or other shape according to the specific shape of the heat-generating electronic component with the anti-EJ depression 55. Moreover, a plurality of depressions 55 can be opened on the housing 5 in this way, so as to generate heat to the heat.
  • the present invention can also directly soak the heat-generating point of the heat-generating electronic component in the liquid working medium.
  • the specific implementation example is as follows:
  • An opening 57 is provided at the bottom of the casing 5, and a device substrate 9 matching its size is embedded in the opening 57, and the periphery of the device substrate 9 is tightly connected to the casing 5.
  • An integrated electronic circuit 91 is provided on a surface of the device substrate 9 located in the closed space 51.
  • a plurality of lead-out pins 92 of the integrated electronic circuit 91 extend outward through the device counter 9 and can be directly mounted on a circuit board.
  • the integrated electronic circuit 91 is directly immersed in the liquid working fluid 52, and the wick 8 is laid on the surface of the integrated electronic circuit 91.
  • the wick 8 may be made of an electrically insulating non-metallic material, and the liquid working medium is also an electrically insulating material, and is chemically and electrically compatible with the integrated electronic circuit 91.
  • the other structures of this embodiment are the same as those of the above embodiment.
  • the heat generated by the integrated electronic circuit 91 is directly transferred into the liquid working medium 52, so that the heat dissipation efficiency is increased, thereby eliminating the transfer thermal resistance phenomenon.
  • the integrated electronic circuit 91 may be first fabricated on the surface of the device substrate 9, and then the device substrate 9 may be sealed and fixed in a pre-set opening 57 in the housing 5. Finally, the closed space 51 may be evacuated and filled. Operation of the liquid working medium 52.
  • a plurality of device substrates 9 can be mounted on the surface of the casing 5 to form a heat pipe radiator having integrated heat-generating electronic components with integrated heat dissipation of multiple chips.
  • This embodiment can also be used for manufacturing a high-power transistor element of a heat pipe heat sink having a heat-generating electronic element itself, and a heat pipe heat sink of an integrated heat-radiating integrated heat-generating electronic element having a plurality of transistor elements. In production, you only need to
  • the PN junction is consolidated on the opposite surface of the device, so that the heat generated by the PN junction is directly dissipated through the liquid working medium 52, thereby solving the problem that in the past, heat could only be extracted through the insulating material of the die base with low thermal conductivity, so that the heat dissipation effect Not good and cause transistor damage.

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Description

发热电子元件的热管散热器 技术领域
本发明涉及一种散热器， 尤其是一种通过调整散热鳍片、吸液芯及整体热管排布方式而 制成的具有三维冷凝散热网络可用于电子元件散热的集成热管式散热器。 背景技术
随着电子、 电力技术的快速发展， 特别是随着集成电路的集成度大幅度提高， 电子元器 件的散热问题已成为制约电子设备的运行速度及输出功率的重要问题之一。
以计算机 C J芯片为例， 三十年内其集成度提高了近两万倍， 其产生的热流量已经达到 了 l OOW/cm2的程度， 而且， 这一数据还将随着集成电路的集成度的提高而继续增加。
众所周知， 计算机工作的可靠性及寿命与其工作温度有着密切的关系， 而芯片的集成度 越高， 其产生的热量就越高。 正如人们所知， 计算机芯片内部的正常工作温度为≤1 30DC，而 每升高 1度， 其工作的可靠性就会降低 3. 8%。如果不能及时将这些热量散去， 计算机工作的 可靠性就得不到保障， 甚至出现无法正常运行。 对于计算机开发研究机构来说， 如果不能有 效的解决芯片以及其他电子元器件在工作中产生的热量，就无法研制出速度更快、功率更高、 体积更小的数据处理设备。
目前，计算机以及电子元件的散热方式通常是将铝合金材料制造的梳状散热板安装在芯 片或其它电子元件的本体上， 制造一个较大的散热面积， 同时， 配以风扇将热量散幵， 从而 降低温度。 这种方式虽然结构简单、 成本低廉， 但只能适用于运算速度不高， 功率不大的电 子设备中的元器件散热。
1998 年， 美国桑迪亚国立实验室利用热管技术进行计算机芯片的散热， 取得了较好的 效果。
图 1所示为目前使用的一种采用热管的散热装置， 它包括一个框体 1。 框体 1的底板上 紧密安装有多个用薄金属片制成的， 且密集分布的散热鳍片 2。 框体 1内底板上卧设有热管 3 (热管的数量可以是二支或三支）。 热管 3穿出散热鰭片 2的下部， 向上伸出弯转 180度穿 入散热鰭片 2的上部。 所有的散热鳍片 2都与热管 3紧密贴设连接。 在热管 3中放置有遇热 汽化， 预冷凝结的液体工质。 当框体 1被安装在芯片上时， 芯片产生的热量使卧设在框体 1 内底板上的热管 3内的液体工质汽化，热量随着汽化的液体工质进入位于散热鳍片 2上部的 热管 3中， 并遇冷凝结， 而热量则通过散热鳍片 2向外界散出。 当散热鳍片 2顶部再安装强 制风冷风扇 4后， 热量更容易散出。 由于热管具有极高的传热效率，所以，芯片产生的热量能够较快的被传递到远处的散热 鳍片上， 达到散热目的。 这种方式比起以往的梳状散热板方式具有更高的散热效率。 由于梳 状散热板上散热片的温度往往是距离芯片较远的位置， 温度较低， 而靠近芯片的底部位置温 度较高， 这种温度梯度现象浪费了大量的散热面积， 因此， 不会具有较高的散热效率， 而利 用热管则能够克服梳状散热板所存在的散热效果不良的缺点。
图 1所示的热管散热装置虽然具有较好的散热效果，但是， 由于其自身在结构上存在的 不足（热源与底板之间、 热管与底板之间、 热管与鳍片之间都存在较高的热阻）以及考虑到 散热器强度的问题， 不能把鳍片做得很薄， 而较厚的鰭片不仅浪费材料、 占据有限空间， 而 且不能获得更多的散热面积， 所以， 这种方式仍然不能满足超大集成电路、 大功率电子器件 以及高速芯片对散热所提出的要求， 使它的应用^ ^展受到了一定的限制。
同样，还有一种利用热管散热原理制成的芯片散热装置，它是采用一个内部灌装液体工 质的中空壳体， 在壳体表面延伸设置多个梳状散热片。 当中空壳体安装在芯片表面时， 芯片 的热量传入中空壳体内， 汽化的液体工质将热量送至中空壳体表面， 并通过多个梳状散热片 将热量散出。 这种芯片散热装置比图 1所示的热管散热装置具有了更好的散热效率，但受到 内部汽化空间的限制及表面散热空间的限制，其散热效率仍然不能充分满足当今高速芯片以 及不断研制开发的更大规模集成电路芯片对散热的要求。
由此， 如何利用热管传热原理， 为满足电子元器件对散热所提出的更高要求， 而设计 并能够大规模制造出具有更高散热效率的散热器,'现已成为业内人士亟待解决的问题之一。 发明内容
本发明所要解决的问题在于针对目前传统的散热器不能充分满足电子元器件的散热要 求以及无法适应当今电子技术的快速发展的现状， 提供一种发热电子元件的热管散热器， 该 散热器利用液体工质快速传导热量的热管原理， 通过在三维空间设置冷凝网络， 使热源所产 生的热量能够与散热面积之间达到优化的匹配組合，为解决电子元件的散热问题提供了一条 新的解决途径。 为此， 本发明提出如下技术方案：
一种发热电子元件的热管散热器， 它包括一管状的壳体， 它还包括管状的管状薄壁流体 通道， 该管状薄壁流体通道设置在所述壳体内， 其边缘通过端面板与所述壳体的边缘密闭封 接， 使所述壳体的内壁与所述管状薄壁流体通道的外侧之间形成封闭空间， 该封闭空间为真 空， 其内部灌装有遇热汽化， 遇冷凝结的液体工质。
管状薄壁流体通道内固设有一层以上便于冷却流体通过时将热量带出的散热鳍片。封闭 空间内位于所述壳体的内侧表面敷设有吸液芯，该吸液芯内具有产生毛细力能够吸附液体并 使其延展的空隙。
端面板上设有用于抽真空并灌装所述液体工质的灌注口，该灌注口在所述封闭空间抽真 空并灌装所述液体工质后封闭。
壳体可以采用导热性能良好的金属材料或有机材料制成。在对发热电子元件进行散热降 温时， 将所述壳体的表面贴设在发热电子元件的散热表面上， 以发热电子元件的散热表面为 热源， 使热量通过壳体传送到所述液体工质， 液体工盾遇热后开始逐步汽化。 汽化的液体工 质将热量迅速带到封闭空间内的任意位置， 当遇到温度较低的管状薄壁流体通道的外侧表面 时，将热量传到散热鳍片上，其自身则重新凝结为液态，并回流或通过吸液芯返回初始位置。 当电子设备（如计算机）在移动状态下，或者处于躺倒放置状态下工作时， 由于重力的原因， 使液体工质没有聚集在发热电子元件的散热表面处， 此时，依靠吸液芯的毛细力也能够使液 体工质向发热电子元件位置聚拢， 并且随着汽化的不断进行， 液体工质将不断的流向发热位 置， 从而形成液体工质的液相一一气相循环转变。保证了电子设备在任何情况下都能够稳定 的工作。
在上述技术方案中，散热鳍片使散热面积得到了大幅增加， 在有冷风吹过管状薄壁流体 通道时， 散热鳍片使散热的效果更好。
在制造中， 壳体的形状可以根据实际需要制成矩形或圓形或六角形管体或任何形状。 吸液芯可以采用多层纤维编织网组成， 也可以采用多层金属丝网叠设组成， 还可以采用 粉末烧结工艺制成的具有微孔的板状体。吸液芯可以通过粘接或焊接敷设在所迷壳体的内侧 表面上。
吸液芯还可以采用另一种方式制造，它可以是由金属或有机材料薄片通过往复连续弯折 或弯曲所制成的带状体。 在薄片表面开设有孔， 并通过详接或粘接环周贴设在所述壳体的内 壁上。 这种方式制成的吸液芯不仅具有上述吸液芯吸引液体工质的特点， 而且， 由于薄金属 片本身就具有良好的热传导性， 使其自身可以直接参与传热、 导热。 该吸液芯可以将位置距 离热源较远处的液体工质直接快速汽化， 从而提高了热传导速度， 进而大大提高了整个发热 电子元件的热管散热器的散热效率。
在上述技术方案中， 管状薄壁流体通道可以才艮据具体散热要求制成一个或一个以上。 所 述端面板通过其边缘与多个薄壁流体的边缘以及壳体的边缘密闭封接，使管状薄壁流体通道 与所述壳体内壁之间以及多个管状薄壁流体通道外侧之间形成相互贯通的封闭空间。
当壳体的体积及散热鳍片的层数一定时， 设置多个管状薄壁流体通道， 会降低散热鳍片 的总散热面积， 但是却能增加封闭空间的容积， 利于液体工质汽化传热。 管状薄壁流体通道 数量的确定， 取决于热源发出的热量与散热量之间的匹配要求， 因此， 通过调整管状薄壁流 体通道的数量就可以达到散热的最优化匹配设计。 另外， 通过调整管状薄壁流体通道的截面 形状， 如将其制成矩形或圆形或六角形或其他形状， 可以有效的利用有限的空间， 使管状薄 壁流体通道内供冷却流体通过的空间的容积与所迷封闭空间的容积比例达到一个较佳的匹 配数值。 实验结果表明： 冷却流体通过的空间的容积应大于或等于所述封闭空间的容积的 2 倍。
管状薄壁流体通道可以采用导热性能良好的金属材料制造。 为使散热鰭片牢固， 可以在 管状薄壁流体通道内设置由金属材料制成的支撑杆或支撑板。支撑杆或支撑板穿过所述散热 鳍片并固接在所述管状薄壁流体通道的内壁上，并使散热鳍片与所述支撑杆或支撑板紧密连 接。 还可以在管状薄壁流体通道内设置由金属材料制成的薄壁热管， 该薄壁热管穿过所述散 热鳍片， 并与所述散热鳍片紧密连接， 其两端固接在所迷管状薄壁流体通道的内壁上， 并与 所述封闭空间贯通。 这样不仅可以起到固定散热鳍片的作用， 还能够利用该薄壁热管向散热 鳍片传递热量， 相当于加大了封闭空间的容积， 以及向散热鳍片传递热量的面积， 因此， 具 有良好的散热效果。
上迷方案中， 端面板是封闭所述封闭空间的重要部件， 为使其封闭牢靠并且便于生产， 可以将所述的端面板的表面周边凸设便于焊接或粘接在所述壳体内壁及所述管状薄壁流体 通道外侧表面的凸缘， 该凸缘可以向封闭空间内设置， 也可以向封闭空间外设置。 通过凸缘 的设置可以提高整个发热电子元件的热管散热器的强度， 并适合大量生产。
所迷的散热鳍片为金属片制成， 可以是波浪形， 也可以是由金属片依照 "Z" 字形连续 弯折所构成的散热鳍片組。 在散热鳍片的表面还可以开设供冷却流体穿过的过孔， 或者在其 表面竖设有可造成冷却流体紊流的立刺， 使散热效果更佳。
为进一步提高散热效率，可以在发热电子元件的热管散热器的管状薄壁流体通道的外部 设置强制冷却风扇， 为此， 可以在所述的壳体边缘上匹配设置将所迷冷却风扇吹出的冷却流 体导入管状薄壁流体通道内的引流罩，该引流罩的外形与所述壳体或管状薄壁流体通道的形 状相同。
为充分利用封闭空间内液体工质的传热能力， 最大限度的利用散热鳍片的集中散热能 力， 在所述的壳体外侧表面上还固定贴设有用导热性能良好的材料制造的外侧管状流体通 道， 该外侧管状流体通道的轴线与所述管状薄壁流体通道的轴线平行， 其内壁上固定设有散 热鳍片。 外侧管状流体通道内的散热鳍片吸收壳体外侧表面上的热量， 使壳体外侧的散热面 积大大增加， 从而加快了散热速度， 使散热效率得到提高。
本发明所提供的扶术方案还可以为多个发热电子元件同时提供散热，并且为提高发热电 子元件向壳体内的封闭空间传递热量的效率，在所述的壳体上可以固设有一个或多个能够与 外部发热电子元件的散热面紧密贴合的导热板， 该导热板嵌入所述壳体表面， 或者是在所述 壳体表面开设专用凹陷， 并将导热板作为专用凹陷的底面。 外部发热电子元件的散热面可以 嵌入该专用凹陷中， 并使其散热表面紧贴在导热板上。 导热板是由具有良好导热性能的金属 板或有机软板制成的矩形或圆形或根据发热电子元件的散热表面的形状制成与之相配的任 何形状。
为满足超大规模集成电路技术的快速发展所带来的更高的芯片散热要求，本发明还提供 了可直接对集成电路本身进行热管散热的技术方案， 该方案还同时提供对大功率晶体管、 高 频晶体管进行直接散热的良好途径， 其具体方案为： 在上述技术方案的基础上， 在所述的壳 体上开设一个或多个开孔， 在该开孔中嵌入与其尺寸相匹配的器件基板， 该器件基板的周边 与所述壳体严密封接。器件基板位于所述封闭空间内的表面上设有集成电子线路或电子元件 的内芯。集成电子线路或电子元件的内芯的引脚线设置在所述器件基板位于壳体外侧的表面 上。
吸液芯敷设在所述集成电子线路或电子元件的内芯上。 液体工质为电绝缘材料， 并与所 述集成电子线路或电子元件的内芯材料化学相容、 电相容。
在这一方案中， 器件基板可以是集成电路的芯片底板， 其表面的超大规模集成电路被直 接设置在封闭空间内， 并与液体工质直接接触， 使热量的传递更加快捷， 没有热阻， 从而最 大限度的提高了对芯片进行散热的能力， 保证了其工作的稳定性， 延长了芯片的使用寿命。 同理， 大功率晶体管的底板也可以做成所述的器件基板， 其表面固結的 P- N结也直接与液体 工质接触，从而消除了传统晶体管的散热只能通过热传导效率不高的结片底座绝缘材料导出 的现象， 使晶体管的散热效率得到大幅提高， 从而提高并延长了晶体管， 特别是大功率晶体 管、 高频晶体管的可靠性及使用寿命。
由以上各项技术方案可知， 本发明利用热管传热原理， 通过在管状壳体内设置管状薄壁 流体通道而组成可供液体工质汽化传热的封闭空间，并利用设置在管状薄壁流体通道内的散 热鳍片， 构成一个具有三维空间的散热网络， 使散热鳍片实现了超薄化、 高密度化， 获得了 远大于传统热管散热装置所具有的散热面积。电子元件的发热量与散热器的散热效率之间获 得了良好的优化匹配， 可以在不增加散热器体积的情况下， 提高散热器的散热效率， 而且， 本发明结构简单、 传热速度快、 热传导均匀、 使用方便、 工作可靠性高， 可以根据电子器件 的具体情况制成多种样式， 以满足不同设备的需要。
另外，本发明还为现在乃至今后的超大规模集成电路及各种发热电子器件的散热问题提 供了直接散热的有效解决方案。 附图说明
图 1为目前使用的一种热管散热装置结构示意图；
图 2为本发明所提供发热电子元件的热管散热器原理结构示意图；
图 3为图 2所示热管散热器的端面板结构示意图；
图 4为本发明所采用吸液芯的一个具体实施例结构示意图；
图 5为本发明所采用吸液芯的另一个具体实施例结构示意图；
图 6为本发明所采用的薄片吸液芯的一个具体实施例结构示意图；
图 Ί为本发明所采用的薄片吸液芯的另一个具体实施例结构示意图；
图 8为本发明所采用的薄片吸液芯的又一个具体实施例结构示意图；
图 9为本发明所提供一个实施例的结构示意图；
图 10为本发明所提供另一个实施例的结构示意图；
图 11为图 10所示实施例的结构侧示图；
图 12为本发明所涉及端面板的另一个连接方式示意图；
图 13为本发明所涉及散热鳍片的一个具体实施方案结构示意图；
图 14为本发明所涉及散热鳍片的另一个具体实施方案结构示意图；
图 15为本发明所提供具有外侧管状流体通道的实施例结构示意图；
图 16为本发明所提供的一个降低热阻的实施例结构示意图；
图 Π为本发明所提供的一个消除热阻直接散热的实施例结构示意图。 具体实施方式
以下， 通过具体实施例并结合附图对本发明做进一步的详细说明。
图 2所示为本发明所提供发热电子元件的热管散热器的原理结构示意图。 该散热器包 括一管状的壳体 5 (图中所示为矩形， 也可以是其它形状）。在壳体 5内设有一个管状薄壁流 体通道 6 , 该管状薄壁流体通道 6的形状也为矩形。 管状薄壁流体通道 6与壳体 5之间通过 前后两块平行的端面板 7沿边缘处密闭封接，使壳体 5的内壁与管状薄壁流体通道 6的外侧 之间形成封闭空间 51 , 该封闭空间 51为真空， 其内部灌装有遇热汽化， 遇冷凝结的液体工 质 52。
管状薄壁流体通道 6采用导热性能良好的金属薄板制成， 在其内部固设有多层散热鳍 片 61。 多层散热鰭片 61密集平行排列， 它们的侧边与管状薄壁流体通道 6的内壁连接。 当 冷 流体穿过管状薄壁流体通道 6时， 热量通过散热鳍片 61散出。
在封闭空间 51内位于壳体 5的内侧表面环周敷设有吸液芯 8 ,该吸液芯 8的内部及表面 具有产生毛细力使液体能够吸附在其表面并通过其表面延伸的空隙。吸液芯 8可以通过; t早接 或粘接固定在壳体 5的内侧表面， 并部分浸泡在液体工质 52中。
在端面板 7上设有用于抽真空并灌装所述液体工盾 52的灌注口 71 , 该灌注口 71在封 闭空间 51被抽真空并灌装所述液体工质 52后封闭。
上述发热电子元件的热管散热器在使用时， 将其安装在发热电子器件的表面 （如 CPU 芯片 ), 发热电子器件所产生的热量通过壳体 5的底部传到液体工质 52中， 液体工质 52随 即发生汽化， 而未遇热部分则向被汽化部分流动补充。 汽化的液体工质 52沿封闭空间 51的 内部向上移动，并与管状薄壁流体通道 6的外侧进行热交换，热量被传递到多层散热鰭片 61 上。 放出热量的汽化液体工质 52随着温度的降低， 重新凝结为液态， 并落回初始位置， 向 被汽化部分接续流动补充， 如此， 在封闭空间 51内部形成了液体工质 52的相变循环运动， 在这一相变循环运动中， 发热电子器件的热量被迅速排出。
在管状薄壁流体通道 6的内部，密集排布的多层散热鳍片 61获得了逸远大于发热电子 器件表面的散热面积， 从而能够保证热量的及时散出。
当电子设备在移动（如运输途中）或者在侧置、 倒置状态下工作时， 液体工质 52偏离 了发热电子器件所处的位置， 此时， 吸液芯 8利用其内部的空隙而产生的毛细力吸附液体工 质 52 , 使液体工质 52向发热电子器件所在位置延展， 为其提供汽化散热， 从而确保了液体 工质 52的相变循环运动不会间断。
本发明所采用的端面板 7的形状是管状薄壁流体通道 6外侧与壳体 5内侧之间所形成 的形状， 上述例子中， 端面板 7的形状为四方框形。 为了安装方便、 牢固、 密封性好， 可以 将该端面板 7的截面制成如图 3所示的凹形。 图 3中， 端面板 7的表面周边向所迷封闭空间 内环周凸设有凸缘 72， 通过该凸缘 72能够方便的将端面板 7焊接或粘接在壳体的内壁、 管 状薄壁流体通道的外侧表面上， 不仅操作方便， 而且密封性好。 凸缘 72的凸设方向也可以 向封闭空间外， 但是会减少封闭空间的容积。
本发明所采用的吸液芯 8可以制成多种形式。图 4所示是采用多层金属丝网 81焊接叠 设組成的。 多层金属丝网 81之间以及本身具有丰富的空隙， 能够产生较好的液体吸附效果。
图 5所示是采用粉末烧结工艺制造的多孔吸液芯的局部示意图， 该吸液芯依靠其内部 及表面的微孔 82产生毛细力， 对液体进行吸附。
图 6所示是一种采用具有良好导热性能的金属薄片依照 "U"字形通过往复连续弯折制 成的带状体吸液芯。 使该带状体吸液芯内形成了多个 "U" 形槽。 在该带状体吸液芯的金属 薄片表面开设有孔 83。 孔 83可以是长方形或圆形缝隙口， 它可以采用凸设或凹设的方式设 置。 这种带状体吸液芯可以悍接在壳体的内壁上。 与上迷其他吸液芯相比较， 它不仅具有良 好的毛细吸附力， 同时， 由于其自身就是热的良好导体， 因此， 在使用时， 它可以直接参与 导热， 并且能够快速将热量向远处的液体工质传递， 并通过其表面的孔 83进行较大面积的 汽化散热， 因 jt匕， 它比上述多层金属丝网吸液芯、 粉末烧结工艺制造的多孔吸液芯具有更好 的散热效果。
金属薄片制成的带状体吸液芯也可以制成如图 7所示的将金属薄片依照 "V"字形通过 往复连续弯折制成的带状体吸液芯； 也可以制成如图 8所示的将金属薄片依照 "Ω" 形通过 往复连续弯折 >」成的带状体吸液芯。 在图 7、 图 8中， 带状体吸液芯的表面都开设有孔 83, 用于液体工质通过其表面汽化。
通过孔 8 3及图 6、 图 7、 图 8中分别自然形成的多个 "U" 形槽、 多个 "V" 形槽以及 多个 形樯可以方便的使液体工质在其内部
为便于 ^体工质的汽化、 延展， 可以将 "U" 形槽、 "V" 形槽以及 "Ω" 形槽的端 口封闭。
上述几个由金属薄片制成的带状体吸液芯除具有传统吸液芯依靠毛细力传送液体的功 能外， 还具有另外两项特珠功能， 使本发明具有更好的使用效果， 其更能如下：
第一， 当该吸液芯焊接在课题内侧表面上时， 由于其自身具有牢固的结构， 因此使 壳体的强度能够得到极大的加强， 故而在制造壳体时， 可以采用薄形材料， 这样不仅可以进 一步减少热阻， 加快热传导速度， 而且， 还能够在不降低壳体机械强度的基础上， 减少壳体 的重量， 这对亍未来小型化电子设备的研制、 生产、 使用具有较大的意义， 特别是当该电子 设备应用在航天等尖端设备装置中时， 尤为重要。
第二， 由于该吸液芯通过弯折薄片， 并在其表面开设有众多的孔， 因此， 当该吸液 芯焊接在壳体上并在传送热量时， 弯折边缘及开孔的边缘上往往具有相对更高的温度， 使位 于该处的液体工质极易沸腾， 造成强化沸腾的效果， 从而使电子器件所产生的热量能够更快 的通过沸腾传递出去。
图 9所 vf 为本发明所提供的具有两个管状薄壁流体通道的具体实施例。 图中， 两个管 状薄壁流体通道 6都依照壳体 5的形状制成矩形。 端面板（图中为示出）的形状与两个与管 状薄壁流体通道 6与壳体 5之间构成的形状相同， 其封闭连接方式与上述原理结构相同， 故 不赘述。
在本实施例中， 管状薄壁流体通道 6内还设有多个由金属材料制成的薄壁热管 62 , 该 薄壁热管 62垂直穿过散热鰭片 61 , 并与散热鰭片 61紧密连接。 薄壁热管 62的两端固接在 管状薄壁流体通道 6的内壁上， 其内腔与封闭空间 51贯通。 薄壁热管 62的设立，一方面为 密集排布的散热鳍片 61提供了支撑， 增加了散热鳍片 61的强度， 同时增大了热交换面积， 另一方面增加了封闭空间 51的容积， 更加有利于汽化的液体工质对外界的传热， 加快了液 体工质由气态到液态的相变速度， 从而提高了整个发热电子元件的热管散热器的散热效率。
图 10所示为本发明所提供的另一个圆形壳体实施例的结构示意图。本实施例中， 壳体 5为圆形， 其底部为平面 （用于紧贴安装在集成电路芯片的表面）， 该壳体 5内设有 10个类 似桔子瓣形的管状薄壁流体通道 6。在管状薄壁流体通道 6内的散热鳍片 61为圆弧形密集排 布。 本实施例具有良好的散热效果， 其圆形的壳体可以方便的配装强制冷风扇， 使散热速度 更快。 为使强制冷风扇吹出的冷气流具有更高的散热率， 在壳体 5边缘上还匹配设有能够将 冷却流体导入管状薄壁流体通道 6内的引流罩 53 , 该引流罩 53的外形与壳体 5的形状相似 (如图 11所示）。 引流罩 53的内侧为外大内小的雉形， 当强制冷风扇安装在引流罩 53的外 端， 并向管状薄壁流体通道 6内吹风时， 引流罩 53的锥形斜面能够引导尽可能多的冷却风 进入管状薄壁流体通道 6 , 使散热效率提高。
在本实施例中， 为了提高整个散热器的结构强度， 在封闭空间 51内还设有三层加强板 54, 该加强板 54的形状与封闭空间 51在壳体 5的轴线方向上的正投影相同， 即， 与端面板 7的外形相同， 并与端面板 7平行设置。在加强板 54上还开设有供液体工庾流过， 不影响相 变循环运动的开孔或缺口，。
在上述发热电子元件的热管散热器的具体实施例中， 端面板与壳体的边缘以及管状薄 壁流体通道的边缘的连接方式还可以采用如图 12所示的方式（图中只示出了端面板与壳体 的连接结构示意图）。 图中， 端面板 7的边缘与壳体 5的边缘可以通过弯折咬口进行连接， 并且可以在连接处进行焊接或粘接固定。端面板 7与管状薄壁流体通道的边缘也可以采用这 种方式连接。 这种连接方式对于有些发热电子元件的热管散热器来说适合工业化大批量生 产，而且，还可以获得较大的封闭空间，而较大的封闭空间可以有助于液体工质的汽化散热。
本发明之所以具有较高的散热效率， 还在于将散热鳍片的设置进行了优化设计， 并提 出了采用金属薄板制造的具体技术方案， 如图 1 3所示。
图 13所示为散热鳍片的一个具体设置方案， 图中， 散热鳍片 61釆用薄型金属片制造， 该金属片依照 "Z" 字形连续弯折， 将散热鳍片 61制成一个散热鳍片组并安装在管状薄壁流 体通道 6内。 在散热鰭片 61的中间还设有一个支撑板 63。 该支撑板 63采用金属材料制成， 并垂直穿过散热鳍片 61 ,通过其上下两个边焊接固定在管状薄壁流体通道 6的内壁上，同时， 散热鳍片 61与支撑板 63通过坪接而紧密连接。 散热鳍片 61的弯折端还分别通过悍接与管 状薄壁流体通道 6的内壁连接。 这样， 可以选择厚度尽可能小的金属片制造散热鰭片 61而 不影响其结构的牢固性。 支撑板 63实际上起到了肋的作用。 另外， 由于采用金属材料制造 支撑板 63 , 并将其与散热鳍片 61紧密连接， 使传热效率得到提高， 而薄型散热鳍片 61也进 一步增加了有效散热面积。
图 14为散热鳍片的另一个具体设置方案， 在该方案中， 散热鳍片 61是由金属片制成 波浪形， 并平行设置为一组固定在管状薄壁流体通道 6的内壁上。 在每一片散热鳍片上还设 有多个立刺 61 1。 当冷却流体通过管状薄壁流体通道 6时，波浪形的散热鳍片 61可以使冷却 流体起伏流动， 延长了与散热鳍片 61表面的接触时间， 增加了散热能力， 而立刺 611可以 造成冷却流体的紊流现象， 从而使冷却流体能够带出更多的热量。
另夕卜， 在散热鰭片 61的表面还可以开设一些供冷却流体穿过的过孔， 这样可以尽量增 加散热效率。
图 13、 图 14所揭示的两个方案不仅有效的增加了散热面积， 而且还提供了管状薄壁 流体通道内供冷却流体通过的空间容积， 该空间容积通常需要大于封闭空间容积的 2倍， 而 当制造体积较小的发热电子元件的热管散热器时， 由于不能无限护大散热面积， 因此， 采用 这种方式可以使流体通过的空间容积尽量增加。
当允许使用的散热空间较大时， 本发明还可以提供另一个在壳体外侧增设外侧管状流 体通道的实施例， 其结构如图 15所示。
图中， 壳体 5的表面上还固定贴设有三个用导热性能良好的材料制造的外侧管状流体 通道 58。 外侧管状流体通道 58的轴线与管状薄壁流体通道 6的轴线平行， 其内壁上固定设 有散热鳍片 61。 外侧管状流体通道 58内的散热鳍片 61的设置方式采用图 13所示的方式， 也可以采用平行设置方式。在使用中，散热鰭片 61吸收壳体 5外侧表面上的热量，使壳体 5 外侧的散热面积大大增加， 从而加快了散热速度， 使散热效率得到提高。
本发明的壳体可以采用金属材料制造， 也可以采用工程塑料进行批量生产。 当采用工程 塑料时， 为降氐接触热阻， 可以在壳体上固定设置导热板， 并使该导热板与发热电子元件的 散热面紧密贴合。
导热板可以釆用直接嵌入壳体中的方式， 也可以采用在壳体表面开设一个凹陷， 将导热 板作为该凹陷的底面， 此时， 导热板已经伸入封闭空间内， 从而减少了过去那种接触式传热 的热阻。 图 16 所示就是将导热板伸入封闭空间内的一个具体实施例。 从图中可以看出， 在 壳体 5的底部， 开设有一个可以嵌入集成电路芯片 （CPU芯片）的凹陷 55 , 该凹陷 55的底 面就是所述的导热板 56。 凹陷 55处于封闭空间 51内， 吸液芯 8敷设在导热板 56的另一面 上， 而且， 凹陷 55整体处于液体工盾 52中。 这种设置方式， 使芯片所产生的热量非常容易 通过液体工质 52排出， 其散热效率极高。
导热板 56 可以采用导热性能良好的金属板制成， 也可以采用导热性能良好的有机软板 制成。有机软板能够在一定的安装压力下与芯片的表面严密贴合， 使芯片热量快速传入液体 工质 52中。
导热板 56以反 EJ陷 55还可以根据发热电子元件的具体形状制成矩形、圆形或其他形状， 而且，在壳体 5上可以用这种方式开设多个凹陷 55 ,从而制成对发热电子元件进行集成散热 的发热电子元件热管散热器。
为彻底消除发热电子元件在散热中所存在的热阻问题，本发明还可以将发热电子元件的 发热点直接浸泡在液体工质中， 其具体实施例如下：
参考图 17。 在壳体 5的底部设置开孔 57， 该开孔 57中嵌入与其尺寸相匹配的器件基板 9 , 该器件基板 9的周边与壳体 5严密连接。 在器件基板 9位于封闭空间 51内的表面上设有 集成电子线路 91，该集成电子线路 91的多个引出脚 92通过器件 反 9向外伸出，可以直接 安装在电路板上。 集成电子线路 91直接浸泡在液体工质 52中， 吸液芯 8敷设在集成电子线 路 91的表面。 在本实施例中， 吸液芯 8可以采用电绝缘的非金属材料制造， 而液体工质也 是电绝缘材料， 并与集成电子线路 91化学相容、 电相容。
本实施例的其他结构与上述实施例相同， 在使用中集成电子线路 91所产生的热量被直 接传入液体工质 52中， 使散热效率达到组大化， 从而消除了传递热阻现象。 在具体生产中， 可以首先将集成电子线路 91制作在器件基板 9的表面， 再将器件基板 9密封固定在壳体 5 上预先设置的开孔 57中， 最后对封闭空间 51进行抽真空、 灌装液体工质 52的操作。
采用上述方式， 可以在壳体 5的表面安装多个器件基板 9， 从而制成具有多个芯片集成 散热的一体化发热电子元件的热管散热器。
本实施例也可以用于制造自身具有发热电子元件的热管散热器的大功率晶体管元件以 及具有多个晶体管元件的集成散热一体化发热电子元件的热管散热器。 在生产中， 只需要将
P-N结固结在器件 ^反 的表面，使 P-N结产生的热量直接通过液体工质 52散出，从而解决 了过去只能通过热传导效率不高的结片底座的绝缘材料导出热量，使散热效果不好而导致晶 体管损坏的现象。 最后所应说明的是， 以上实施例仅用以说明本发明的技术方案而非限制， 尽管参照较佳 实施例对本发明进行了详细说明， 本领域的普通技术人员应当理解， 可以对本发明的技术方 案进行修改或者等同替换， 而不脱离本发明技术方案的精神和范围， 其均应涵盖在本发明的 权利要求范围当中。

Claims

权利要 求
1、 一种发热电子元件的热管散热器， 它包括一管状的壳体， 其特征在于： 它还包括管状薄壁流体通道，该管状薄壁流体通道设置在所述壳体内，其边缘通 过端面板与所述壳体的边缘密闭封接，使所述壳体的内壁与所述管状薄壁流体通 道的外侧之间形成封闭空间， 并且， 该封闭空间为真空， 在封闭空间内部灌装有 遇热汽化， 遇冷凝结的液体工质；
所述管状薄壁流体通道内固定设有散热鳍片；
所迷 †闭空间内位于所述壳体的内侧表面敷设有吸液芯，该吸液芯具有能够 产生吸附液体的毛细力并使液体在该吸液芯上伸展的空隙；
所述端面板或壳体上设有用于抽真空并灌装所述液体工质的灌注口，该灌注 口在所述去†闭空间抽真空并灌装所述液体工质后封闭。
2、 据权利要求 1所迷的发热电子元件的热管散热器， 其特征在于： 所述 的壳体是采用导热性能良好的材料制造的矩形或圆形或六角形管体。
3、 才艮据权利要求 1所述的发热电子元件的热管散热器， 其特征在于： 所述 的吸液芯是由多层纤维编织网或多层金属丝网叠设组成，或者是采用粉末烧结制 成的具有微孔的板状体。
4、 据权利要求 1所述的发热电子元件的热管散热器， 其特征在于： 所述 的吸液芯是由金属或有机材料薄片通过往复连续弯折或弯曲所制成的带状体；所 述薄片表面开设有孔， 并通过焊接或粘接贴设在所述壳体的内壁上。
5、 据权利要求 4所述的发热电子元件的热管散热器， 其特征在于： 所述 的带状体由所述薄片依照 "U"字形或 "V"字形或 ' "形往复弯折或弯曲制成， 使该带状体内形成多个 "U" 形槽或 Τ 形槽或 'Ώ" 形槽。
6、 才艮据权利要求 5所述的发热电子元件的热管散热器， 其特征在于： 所述 的带状体上位于所述 "U" 形槽或 "V" 形槽或 "Ω" 形槽的槽口端面为封闭。
7、 根据权利要求 4所述的发热电子元件的热管散热器， 其特征在于： 所迷 的孔为长孔或圆孔或凸设的缝隙口， 并均匀分布设置在所述薄片的表面。
8、根据权利要求 1 -7任一所述的发热电子元件的热管散热器，其特征在于： 所述的管；)夫薄壁流体通道为一个或一个以上；所述端面板与多个管状薄壁流体通 道的边缘以及所述壳体的边缘密闭封接，使管状薄壁流体通道与所述壳体内壁之 间以及多个管状薄壁流体通道外侧之间形成相互贯通的封闭空间。
9、 根据权利要求 8所述的发热电子元件的热管散热器， 其特征在于： 所述 的管状薄壁流体通道是采用导热性能良好的金属材料制造的矩形或圆形或六角 形管体，该管状薄壁流体通道内供冷却流体通过的空间容积大于所述封闭空间容 积的 2倍。
10、根据权利要求 8所述的发热电子元件的热管散热器， 其特征在于： 所述 的管状薄壁流体通道内还设有一个或一个以上由金属材料制成的支撑杆或支撑 板；所述支撑杆或支撑板穿过所述散热鰭片并固接在所述管状薄壁流体通道的内 壁上； 所述散热鳍片与所述支撑杆或支撑板紧密连接。
11、根据权利要求 8所述的发热电子元件的热管散热器， 其特征在于： 所述 的管状薄壁流体通道 还设有一个或一个以上由金属材料制成的薄壁热管，该薄 壁热管穿过所述散热嗜片， 并与所述散热鳍片紧密连接，其两端固接在所迷管状 薄壁流体通道的内壁上， 并与所述封闭空间贯通。
12'、根据权利要求 1所述的发热电子元件的热管散热器， 其特征在于： 所述 的端面板的表面周边凸设有便于焊接或粘接在所述壳体内壁及所述管状薄壁流 体通道外侧表面的凸缘。
13、根据权利要求 1所述的发热电子元件的热管散热器， 其特征在于： 所述 的端面板的边缘与所 壳体的边缘和 /或所述管状薄壁流体通道的边缘通过弯折 咬口连接， 并使连接 ^通过焊接或粘接固定。
14、根据权利要求 1所述的发热电子元件的热管散热器， 其特征在于： 所述 的封闭空间内还粘接或焊接有一层或一层以上不影响所述液体工质运行、用于加 强所述壳体强度的加强板，该加强板的外形与所述端面板相同，并与所述端面板 平行。
15、根据权利要求 1所述的发热电子元件的热管散热器， 其特征在于： 所述 的散热鳍片为金属片制成的波浪形。
16、根据权利要求 1所述的发热电子元件的热管散热器， 其特征在于： 所述 的散热鳍片是金属片依照 "Z" 字形连续弯折所构成的散热鳍片组。
17、根据权利要求 1或 15或 16所述的发热电子元件的热管散热器， 其特征 在于： 所述的散热鳍片的表面开设有一个以上的供所述冷却流体穿过的过孔，或 者在其表面竖设有可造成所述冷却流体紊流的立刺。
18、根椐权利要求 1-7任一所述的发热电子元件的热管散热器，其特征在于： 所迷的壳体边缘上还匹配设有将所迷冷却流体导入所述管状薄壁流体通道内的 ？ I流罩， 该引流罩的外形与所述壳体或所述管状薄壁流体通道的形状相同。
19、根据权利要求 1所述的发热电子元件的热管散热器， 其特征在于： 所述 的壳体外侧表面上还固定贴设有用导热性能良好的材料制造的外侧管状流体通 道，该外侧管状流体通道的轴线与所述管状薄壁流体通道的轴线平行，其内壁上 固定设有散热鳍片。
20、根据权利要求 1或 19所述的发热电子元件的热管散热器，其特征在于： 所述的壳体上固设有一个或一个以上能够与外部发热电子元件的散热面紧密贴 合的导热板， 该导热板嵌入所述壳体表面，或者是开设于所述壳体表面用于嵌入 发热电子元件散热面的专用凹陷的底面。
21、 根据权利要求 20所述的发热电子元件的热管散热器， 其特征在于： 所 述的导热板是由具有良好导热性能的金属板或有机软板制成的矩形或圆形。
22、根据权利要求 1或 19所述的发热电子元件的热管散热器， 其特征在于： 所述的壳体上还开设有一个或一个以上的开孔，该开孔中嵌入与其尺寸相匹配的 器件基板，该器件基板的周边与所述壳体严密封接； 所迷器件基板位于所述封闭 空间内的表面上设有集成电子线路或电子元件的内芯；所述集成电子线路或电子 元件的内芯的引脚线设置在所述器件基板位于壳体外侧的表面上；所述吸液芯为 电绝缘并敷设在所述集成电子线路或电子元件的内芯上；所述液体工质为电绝缘 材料， 并与所述集成电子线路或电子元件的内芯材料化学相容、 电相容。
PCT/CN2004/000356 2004-01-08 2004-04-15 Heat pipe radiator of heat-generating electronic component WO2005071747A1 (en)

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EP1708261A4 (en) 2011-05-04
EP1708261A1 (en) 2006-10-04
US20050150636A1 (en) 2005-07-14
CN1314112C (zh) 2007-05-02
CN1641868A (zh) 2005-07-20
EP1708261B1 (en) 2014-12-17

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