WO2005047558A2 - Process for manufacturing devices which require a non evaporable getter material for their working - Google Patents
Process for manufacturing devices which require a non evaporable getter material for their working Download PDFInfo
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- WO2005047558A2 WO2005047558A2 PCT/IT2004/000615 IT2004000615W WO2005047558A2 WO 2005047558 A2 WO2005047558 A2 WO 2005047558A2 IT 2004000615 W IT2004000615 W IT 2004000615W WO 2005047558 A2 WO2005047558 A2 WO 2005047558A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- support
- deposit
- acid
- getter
- mems
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
- B81C1/00285—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5846—Reactive treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/10—Other heavy metals
- C23G1/106—Other heavy metals refractory metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
- C23G1/20—Other heavy metals
- C23G1/205—Other heavy metals refractory metals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J7/00—Details not provided for in the preceding groups and common to two or more basic types of discharge tubes or lamps
- H01J7/14—Means for obtaining or maintaining the desired pressure within the vessel
- H01J7/18—Means for absorbing or adsorbing gas, e.g. by gettering
- H01J7/183—Composition or manufacture of getters
Definitions
- the present invention relates to a process for manufacturing devices which require a non evaporable getter material for their working.
- the process is particularly suitable for being used in the processes for the manufacture of miniaturized devices.
- Non evaporable getter materials also known as NEG, are capable of reversibly sorbing hydrogen and irreversibly sorbing gases such as oxygen, water, carbon oxides and, in some cases, nitrogen.
- the main NEG materials are transition metals such as titanium, zirconium, vanadium, niobium, hafnium and tantalum, or alloys thereof (and in particular titanium and zirconium) with one or more elements selected among the transition metals, Rare Earths and aluminum.
- a first use of these materials is for keeping vacuum. The maintenance of vacuum is required in very different applications, as for example in particle accelerators, in X-rays generating tubes, in the flat displays of the field-emission type and in the evacuated jackets for thermal insulation, such as in thermal vessels
- NEG materials can be also employed to remove the above-mentioned gases when traces thereof are present in other gases, generally noble gases.
- gases generally noble gases.
- An example is the use in lamps, particularly fluorescent ones which are filled with noble gases at pressures of some tens of mbar, wherein the NEG material has the function of removing traces of oxygen, water, hydrogen and other gases to keep a suitable atmosphere for the operation of the lamp; another example of removal of traces of the above-mentioned gases by other gases is the purification of inert gases, particularly for applications in the microelectronic industry.
- Another emerging application is the use of NEG materials in miniaturized mechanical, electromechanical or optical devices.
- MEMS generally comprise an active device (the miniaturized mechanical, ectromechanical or optical part) and ancillary parts, enclosed in a sealed cavity; electrical feedtliroughs assure the electrical supply to the device and the transmission of the signals from this toward the outside.
- the last generation MEMS are manufactured through technologies derived from the semiconductors industry, which comprise generally depositions on a support of layers of a desired material and selective and localized chemical attacks to remove only predefined parts of a deposited layer or of the support, so as to obtain miniaturized structures and geometries which would not be obtainable through traditional mechanics.
- microaccelerometers an example of which is disclosed in the patent US 5,952,572, used for example in the motor-car field to perceive collisions and thus to activate the air bag of the vehicle; miniaturized mirrors, such as those disclosed in the patent US 5,155,778, used in the telecommunication systems in optical fiber; the arrays of miniaturized mirrors, as disclosed for example in the patent US 6,469,821, used in the formation of images; or micro-bolometers, that is, miniaturized detectors of infrared radiation, an example of which is disclosed in the patent US 6,252,229.
- MEMS Integrated Multimedia Substyrene
- the most common ones comprise the use of at least two planar supports made of glass or quartz, ceramic material (e.g. silicon carbide) or semiconductor (silicon is preferred), whereon the different active and passive components of the MEMS are constructed.
- the active parts are constructed, for example the movable parts of a micromechanical device, while a second support (which may be made up of glass or quartz, ceramic or semiconductor material) has essentially the function of closing the finished, device; the electrical feedthrouglis for transferring signals between the inside and the outside of the MEMS may indifferently be obtained on any of the two planar supports.
- Another type of bonding is the anodic bonding (used especially in the case in which one of the two supports is made up of glass or quartz and the other of silicon), wherein between the two parts, kept at a temperature in the range from 300 to 500 °C, is applied a potential difference of about 1000 V; in these conditions, there is a migration of positive ions from the support kept at the more positive potential (for example, sodium ions from the glass) toward the support kept at the more negative potential, and of negative ions (for example, oxygen from silicon) in the opposite direction; this migration of material between the two supports gives rise to the mutual welding thereof.
- positive potential for example, sodium ions from the glass
- negative ions for example, oxygen from silicon
- Another possible technique is the eutectic bonding, wherein between the two supports is interposed a layer of a metal or alloy capable of forming an eutectic composition with the material of at least one of the two supports, so that with a suitable thermal treatment a localized melting in the welding area is caused.
- the direct bonding which comprises the localized melting of the material of the supports, but this process generally requires too high temperatures, for example of about 1000 °C in the case of silicon, which may damage the component parts of the microdevice.
- all the types of bonding require a previous treatment of the surfaces to be fixed to each other, because dirty surfaces endanger the tightness of the welding.
- These treatments are both of mechanical type (gas blowing or mechanical washing with solid CO 2 ), aimed to remove particles present in the welding area, and of chemical type, to eliminate the species (for example oxides) which alter the composition of the surface; the chemical treatments generally involve washings of the support with acid or basic solutions, or combinations thereof in sequence.
- MEMS devices require a specific atmosphere for their working: for example, the inner space of microbolometers must rigorously be under vacuum, because traces of gases, if any, would give a convective contribution to the heat transfer in the system which would alter the measurement; the MEMS with moving parts may be in vacuum or in inert atmosphere, but the humidity content of the atmosphere must be controlled because water molecules present on the surface of the different parts which compose the microdevice may give rise to sticking phenomena or modify the friction between the stationary parts and the moving parts, thus modifying the mechanical characteristics of the system.
- the control of the inner atmosphere of a MEMS is, consequently, extremely important for the proper working thereof. There are different mechanisms which tend to deteriorate the quality of the inner atmosphere of a MEMS.
- getters it is known that these materials have a high chemical reactivity with small molecules, apart from noble gases and in some cases nitrogen, and in the prior art it has been thought that the getter, once deposited on a support, has to be protected until the end of the manufacturing process, that is until it has to be exposed to the inner atmosphere of the cavity, already sealed, of the MEMS.
- the treatment of a support whereon a getter material is already present with the acid or basic baths used for pre-treating the surfaces of the two supports before the welding operations is considered particularly problematic.
- the bonding one the temperature of the process causes the layer of noble metal to diffuse into the underlying material, that is thus exposed to the atmosphere in the cavity of the MEMS.
- Other patents disclose methods for avoiding the problem, or mention the necessity of the presence of the getter in the MEMS without disclosing how to integrate the formation of this component in the overall manufacturing process of the final device.
- the above mentioned patent US 6,252,229 proposes a manufacturing process which comprises a double step bonding, a "pressure bonding" step along a continue closed line around the cavity to obtain the gastightness, and a second one, for example of anodic bonding, more external with respect to the first one, which aims to accomplish a mechanically resistant welding of the two supports.
- this document refers to the previous patent US 5,433,639, which relates to a process for manufacturing an infrared radiation sensor of traditional type (not a MEMS), and wherein the different components are manufactured in parallel and finally assembled; the process of US 5,433,639 is not directly applicable to US 5,701,008, at least for what concerns the integration of the getter in the cavity, and therefore this last document does not give any information useful to solve the problem.
- patent US 6,590,850 mentions the general use of a getter in a MEMS and discloses the location thereof, but it does not disclose the manufacturing process of the device and consequently does not mention how to introduce the getter therein;
- patent US 5,952,572 is even more vague, mentioning only the use of a getter, a combination between titanium and an alloy Zr-V-Fe, without disclosing either the location of the getter in the cavity, and the less the step of introducing the getter in said cavity. It is therefore clear that according to the present state of the art, the integration of the formation of a deposit of getter material in the manufacturing process of a MEMS is still an open problem, and that the solutions proposed up to now are complicated and expensive.
- the object of the present invention is to provide a process free from the problems of the prior art for manufacturing devices which require for their operation a non evaporable getter material. Said object is achieved according to the present invention with a process wherein: - a deposit of non evaporable getter material is formed on a support; - the support with the deposit of non evaporable getter material is then treated with at least an acid or basic solution; and - the so treated support is then introduced in the inner space of a device whose operation requires the presence of a non evaporable getter material, or is used to form at least a portion of the surface which defines the imier space of said device, in such a way that said deposit is in contact with said space.
- the invention is based on the inventors' acknowledgement that the chemical treatments with acid or basic solutions (or combination in sequence thereof), contrary to what is commonly believed by those skilled in the art of getter materials, do not decrease the gas sorbing properties of the material, nor cause the loss of particles from the deposit or its detaching from the support, so that a NEG material may be subjected to chemical treatments used for the manufacturing of some devices wherein said material is required without having recourse to the measures of the prior art.
- the inventors have determined that the chemical treatments with said solutions not only do not cause the loss of particles from the NEG material and do not cause its detachment from the support, but in some cases allow also to improve the gas sorbing properties of the material.
- the process of the invention may be used for the activation, at least partial, of the NEG material; the activation obtained through chemical way according to the present process may be then optionally followed by a further treatment of thermal activation.
- the invention is particularly suitable to be used in the manufacturing processes of devices of the MEMS type wherein it is accomplished the bonding of at least two supports, on one of which the getter is present.
- the supports used in these processes are slices of silicon, glass, quartz or ceramic, called "wafer" in the field, which have generally a thickness of about 0,2-2 millimeters and diameters comprised between about 10 and 30 centimeters. On these wafer there are produced, with different techniques, the active parts of the MEMS device and the NEG deposits.
- the NEG material may be deposited on the same support on which is constructed (or from which is obtained) the active part of the device, that may be a moving part or a sensor of electromagnetic radiation.
- the NEG material is preferably deposited onto the other support, the one used to close the device (defined in the field "cap wafer"), because on this part there is more available space and thus it is possible to deposit a greater amount of getter, and because in this way there are no incompatibility problems between the deposition of the getter and the presence of the active structure.
- Figure 1 shows a part of a "cap wafer" onto which a plurality of NEG deposits are present: for the sake of ease, this cap wafer is represented with some different areas thereof at different working steps, but obviously in the real processes all the parts of its surface will be always in the same manufacturing step.
- Wafer 10 has a upper surface, 11, ideally divided into areas 12, 12', ... (defined in the figure by the broken lines), each of which will be used to form the closing element of a single MEMS; at the centre of each area 12, 12', ..., in an area 13, 13', ..., there is obtained, for example through anisotropic chemical attacks known in the semiconductors field, a hollow 14, defined by lateral walls 15, 15', ..., and by a bottom wall 16.
- the getter deposit 17 is produced; preferably, said device is formed at least on the bottom wall 16, which is the one that offers the greatest surface; furthermore, the most common technique of getter deposition in the MEMS manufacture is sputtering, and wall 16 is the most convenient for said deposition being perpendicular to the arrival direction of the material according to this technique.
- the finished cap wafer 10, wherein all the hollows 14 have internally a deposit 17 of getter material, is then placed over the support (not shown) on which the active components of the MEMS are constructed, in such a way that the hollows 14 define the cavity of the finished MEMS device, and that the walls 15, 15',...
- the welding between the cap wafer 10 and the support on which the active components of the MEMS are present is carried out in the areas 18, that is the peripheric areas of each area 12, 12',...; the welding may be carried out by any known method, for example by anodic or eutectic bonding.
- the getter material used may be any known NEG material, for example a metal such as zirconium, titanium, tantalum, niobium, hafnium or yttrium, or alloys of at least one of these metals (preferably zirconium or titanium) with one or more elements selected among the transition metals, Rare Earths and aluminum.
- washing baths of the wafers whose composition is standardized and optimized to obtain specific effects; these baths comprise both acid and basic solutions.
- Typical washing solutions are for example those named SCI and SC2, wherein the wafer is immersed in sequence; the solution named SCI is formed of one part (by volume) of ammonium hydroxide, one part of oxygenated water and five parts of distilled water, and is usually used at temperatures comprised between about 60 and 80 °C; the solution named SC2 is formed of one part of hydrochloric acid, one part of oxygenated water and six parts of distilled water, and also in this case it is used at temperatures of about 60-80 °C; after the washing with the solution SC2, and optionally also between the washing SCI and SC2, the support is generally rinsed with distilled water.
- Solution SCI accomplishes a gentle chemical attack of the surface of the wafer, removing organic contaminants and particles which adheres to said surface, while solution SC2 removes the metallic contaminants.
- Another standard solution used in the field is a solution at 65% by weight of nitric acid in water, which is used at temperatures comprised between room temperature and about 120 °C, and also in this case is followed by rinsing with distilled water.
- Other standard washings are with aqueous solutions of hydrofluoric or sulphuric acid at different concentrations; a broad description of the different washing solutions used in the field, and of their effects on substrates, is given in the book "Handbook of Semiconductor Manufacturing Technology", edited by Y. Nishi and R. Doering, published in 2000 by Marcel Dekker, Inc. publisher (in particular, see pags. 87-104). According to the process of the invention, during these steps of chemical attack - li ⁇
- the device 20 is formed by assembling a part 21 and a part 22, joined to each other through a welding 23; each of these two parts originates from a support of bigger dimension, and in particular part 22 originates from a support of type 10 after it has been cut along the broken lines of figure 1; said cutting is preferably carried out after the welding operation of the two supports.
- a cavity 24 which may be under vacuum or contain a controlled atmosphere; this cavity is defined by surface 25 of part 21, and by walls 15, 15', ... and 16 described with reference to figure 1.
- Onto wall 16 of part 22 there is the deposit of getter material 17; finally, in cavity 24 the active part, 26, of the MEMS device is housed.
- FIG. 3 shows another possible MEMS device, 30, produced with the process of the invention.
- both the active part 31 and the getter deposit 32 are formed on the same part of support 33, while part 34 acts, in this case, simply as closing element of cavity 35; this structure is, however, less preferable than that of figure 2, since, as already said, in this case the space available for the getter deposit 32 is smaller (with a consequent reduced gas sorbing capacity) and the production of both deposit 32 and part 31 on a part 33 of the same support is more complex.
- the formation of the getter deposit (17, 32) onto one of the two supports may be carried out according to different techniques, for example by evaporation; the preferred technique is in any case sputtering, which is the technique most widely used in the industrial manufacture of miniaturized devices on planar supports, and thus also of MEMS.
- sputtering is the technique most widely used in the industrial manufacture of miniaturized devices on planar supports, and thus also of MEMS.
- the sputtering technique allows to obtain deposits with a thickness from fractions of micrometers (micron, ⁇ m) up to some tens of micron, which have an excellent adhesion to the substrate without loss of particles.
- EXAMPLE 1 hi this example it is checked the compatibility of a support with a deposit of getter material with the combined treatment with SCI and SC2 solutions.
- a 2 ⁇ m thick deposit of an alloy made up of zirconium, cobalt and Rare Earths is produced by sputtering; the deposit is produced starting from a target of alloy St 787, disclosed in the patent US 5,961,750 in the name of the applicant.
- the first sample thus produced is not treated further, and constitutes the reference sample for this test.
- the second sample is immersed for 15 minutes in a bath of SCI solution kept at 80 °C, then taken out, rinsed with distilled water and dried with a flow of dry nitrogen.
- the third sample is first immersed in the SCI solution and then in the SC2 solution, for a period of 15 minutes for each bath, then rinsed with distilled water and then dried with dry nitrogen.
- the three samples so obtained are initially subjected to a visual analysis at the optic microscope to check the morphology of the deposit and the possible detachment from the support; this first examination confirms that after the baths SCI and SC2 there is no detachment of the deposit from the support, and that the samples treated with said baths do not lose particles.
- the three samples are assembled in vacuum benches and activated with a treatment under vacuum at 450 °C for 45 minutes; afterwards the samples are allowed to cool at 25 °C and their characteristics of hydrogen and carbon monoxide (CO) sorption are measured, according to the procedure defined in the standard ASTM F 798-82, with a testing pressure of 10 "4 Pa.
- EXAMPLE 2 In this example it is checked the compatibility of a deposit of getter material on a support with the combined treatment with aqueous solutions of nitric acid at different temperatures for different period of times. Four samples similar to those produced for example 1 are prepared. The first one of these in not subjected to any treatment and constitutes the reference sample; the second one is immersed for 30 minutes in an aqueous solution of HNO 3 at 65% by weight at room temperature; the third one is immersed in the same solution for 10 minutes at 60°C; and the fourth one is immersed in the same solution for 10 minutes at 120°C.
- the four samples after possible rinsing and drying with nitrogen, are analyzed from the point of view of the detachment from support and of the loss of particles, confirming that the treatments in nitric acid do not alter these two parameters with respect to the reference sample.
- the four samples are then subjected to hydrogen and carbon monoxide sorbing tests as described in example 1.
- the results of the tests are reported in figure 5, as graphs from 7 to 10 for hydrogen sorption by, respectively, the samples from the first one to the fourth one as described; and graphs from 11 to 14 refer to CO sorption by the four samples (graphs 7 and 11 thus represent the properties of the reference samples in hydrogen and CO sorption, respectively).
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Abstract
Description
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Priority Applications (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DK04799409T DK1685269T3 (en) | 2003-11-14 | 2004-11-09 | Process for manufacturing devices which, in order to function, require a non-evaporable getter material |
DE602004022078T DE602004022078D1 (en) | 2003-11-14 | 2004-11-09 | METHOD FOR MANUFACTURING DEVICES THAT NEED A NON-EVAPORATIVE GETTER MATERIAL FOR WORKING |
BRPI0413417-6A BRPI0413417B1 (en) | 2003-11-14 | 2004-11-09 | "PROCESS FOR MANUFACTURING A DEVICE WHICH REQUIRES AN INAPTABLE WASTE MATERIAL FOR THEIR OPERATION". |
PL04799409T PL1685269T3 (en) | 2003-11-14 | 2004-11-09 | Process for manufacturing devices which require a non evaporable getter material for their working |
JP2006539078A JP4865562B2 (en) | 2003-11-14 | 2004-11-09 | Method of manufacturing a device that requires a non-volatile getter material for operation |
MXPA06002390A MXPA06002390A (en) | 2003-11-14 | 2004-11-09 | Process for manufacturing devices which require a non evaporable getter material for their working. |
EP04799409A EP1685269B1 (en) | 2003-11-14 | 2004-11-09 | Process for manufacturing devices which require a non evaporable getter material for their working |
CA002533643A CA2533643C (en) | 2003-11-14 | 2004-11-09 | Process for manufacturing devices which require a non evaporable getter material for their working |
AU2004288886A AU2004288886B2 (en) | 2003-11-14 | 2004-11-09 | Process for manufacturing devices which require a non evaporable getter material for their working |
IL173224A IL173224A (en) | 2003-11-14 | 2006-01-18 | Process for manufacturing devices which require a non evaporable getter material for their working |
NO20060595A NO20060595L (en) | 2003-11-14 | 2006-02-06 | Manufacture of devices with non-evaporable getter material |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT002209A ITMI20032209A1 (en) | 2003-11-14 | 2003-11-14 | PROCESS FOR THE PRODUCTION OF DEVICES THAT REQUIRE A NON-EVAPORABLE GETTER MATERIAL FOR THEIR OPERATION. |
ITMI2003A002209 | 2003-11-14 |
Publications (2)
Publication Number | Publication Date |
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WO2005047558A2 true WO2005047558A2 (en) | 2005-05-26 |
WO2005047558A3 WO2005047558A3 (en) | 2005-10-13 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/IT2004/000615 WO2005047558A2 (en) | 2003-11-14 | 2004-11-09 | Process for manufacturing devices which require a non evaporable getter material for their working |
Country Status (18)
Country | Link |
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EP (1) | EP1685269B1 (en) |
JP (1) | JP4865562B2 (en) |
KR (1) | KR100742422B1 (en) |
CN (1) | CN100554496C (en) |
AU (1) | AU2004288886B2 (en) |
BR (1) | BRPI0413417B1 (en) |
CA (1) | CA2533643C (en) |
DE (1) | DE602004022078D1 (en) |
DK (1) | DK1685269T3 (en) |
ES (1) | ES2326812T3 (en) |
IL (1) | IL173224A (en) |
IT (1) | ITMI20032209A1 (en) |
MX (1) | MXPA06002390A (en) |
MY (1) | MY139594A (en) |
NO (1) | NO20060595L (en) |
PL (1) | PL1685269T3 (en) |
TW (1) | TWI261930B (en) |
WO (1) | WO2005047558A2 (en) |
Cited By (6)
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WO2007066370A1 (en) * | 2005-12-06 | 2007-06-14 | Saes Getters S.P.A. | Process for manufacturing micromechanical devices containing a getter material and devices so manufactured |
JP2007245339A (en) * | 2006-03-16 | 2007-09-27 | Commiss Energ Atom | Microelectronic composite, especially packaging structure in sealing cavity of mems |
EP1878693A1 (en) * | 2006-07-13 | 2008-01-16 | Commissariat à l'Energie Atomique | Encapsulated microcomponent equipped with at least one getter |
CN102040186A (en) * | 2010-11-09 | 2011-05-04 | 北京自动化控制设备研究所 | High vacuum ceramic LCC packaging method |
US9637377B2 (en) | 2008-11-18 | 2017-05-02 | Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. | Method for forming a micro-surface structure and for producing a micro-electromechanical component |
CN113061854A (en) * | 2021-03-19 | 2021-07-02 | 上海松尚国际贸易有限公司 | Method for preparing getter by utilizing AMAT PVD cavity and thin film getter thereof |
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FR2922202B1 (en) * | 2007-10-15 | 2009-11-20 | Commissariat Energie Atomique | STRUCTURE COMPRISING A GETTER LAYER AND AN ADJUSTMENT SUB-LAYER AND METHOD OF MANUFACTURE |
JP2015002414A (en) * | 2013-06-14 | 2015-01-05 | セイコーインスツル株式会社 | Electronic device |
CN105366624B (en) * | 2014-07-30 | 2017-06-13 | 中芯国际集成电路制造(上海)有限公司 | A kind of semiconductor devices and its manufacture method and electronic installation |
CN109680249A (en) * | 2019-01-25 | 2019-04-26 | 苏州大学 | Non-evaporable film getter and preparation method thereof |
CN113699425B (en) * | 2021-08-31 | 2022-07-15 | 中国科学技术大学 | Non-evaporable quaternary Ti-Zr-V-Cu vacuum getter film and preparation method thereof |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US20030138656A1 (en) * | 2002-01-07 | 2003-07-24 | Sparks Douglas Ray | Method of forming a reactive material and article formed thereby |
Family Cites Families (5)
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- 2004-11-09 WO PCT/IT2004/000615 patent/WO2005047558A2/en active Application Filing
- 2004-11-09 EP EP04799409A patent/EP1685269B1/en active Active
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AU2006322862C1 (en) * | 2005-12-06 | 2011-12-01 | Saes Getters S.P.A. | Process for manufacturing micromechanical devices containing a getter material and devices so manufactured |
US7833880B2 (en) | 2005-12-06 | 2010-11-16 | Saes Getters S.P.A. | Process for manufacturing micromechanical devices containing a getter material and devices so manufactured |
AU2006322862B2 (en) * | 2005-12-06 | 2011-04-28 | Saes Getters S.P.A. | Process for manufacturing micromechanical devices containing a getter material and devices so manufactured |
CN101291873B (en) * | 2005-12-06 | 2011-06-15 | 工程吸气公司 | Process for manufacturing micromechanical devices containing a getter material |
WO2007066370A1 (en) * | 2005-12-06 | 2007-06-14 | Saes Getters S.P.A. | Process for manufacturing micromechanical devices containing a getter material and devices so manufactured |
JP2007245339A (en) * | 2006-03-16 | 2007-09-27 | Commiss Energ Atom | Microelectronic composite, especially packaging structure in sealing cavity of mems |
EP1878693A1 (en) * | 2006-07-13 | 2008-01-16 | Commissariat à l'Energie Atomique | Encapsulated microcomponent equipped with at least one getter |
FR2903678A1 (en) * | 2006-07-13 | 2008-01-18 | Commissariat Energie Atomique | ENCAPSULATED MICROCOMPONENT EQUIPPED WITH AT LEAST ONE GETTER |
US7786561B2 (en) | 2006-07-13 | 2010-08-31 | Commissariat A L'energie Atomique | Encapsulated microcomponent equipped with at least one getter |
US9637377B2 (en) | 2008-11-18 | 2017-05-02 | Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. | Method for forming a micro-surface structure and for producing a micro-electromechanical component |
CN102040186A (en) * | 2010-11-09 | 2011-05-04 | 北京自动化控制设备研究所 | High vacuum ceramic LCC packaging method |
CN102040186B (en) * | 2010-11-09 | 2012-11-21 | 北京自动化控制设备研究所 | High vacuum ceramic LCC packaging method |
CN113061854A (en) * | 2021-03-19 | 2021-07-02 | 上海松尚国际贸易有限公司 | Method for preparing getter by utilizing AMAT PVD cavity and thin film getter thereof |
Also Published As
Publication number | Publication date |
---|---|
CA2533643A1 (en) | 2005-05-26 |
PL1685269T3 (en) | 2009-11-30 |
DE602004022078D1 (en) | 2009-08-27 |
NO20060595L (en) | 2006-06-27 |
WO2005047558A3 (en) | 2005-10-13 |
JP4865562B2 (en) | 2012-02-01 |
MXPA06002390A (en) | 2006-06-20 |
MY139594A (en) | 2009-10-30 |
CN1846012A (en) | 2006-10-11 |
BRPI0413417A (en) | 2006-10-10 |
JP2007523467A (en) | 2007-08-16 |
TW200527692A (en) | 2005-08-16 |
EP1685269B1 (en) | 2009-07-15 |
ITMI20032209A1 (en) | 2005-05-15 |
CA2533643C (en) | 2010-01-12 |
DK1685269T3 (en) | 2009-11-02 |
KR20060113891A (en) | 2006-11-03 |
IL173224A0 (en) | 2006-06-11 |
KR100742422B1 (en) | 2007-07-24 |
ES2326812T3 (en) | 2009-10-20 |
AU2004288886A1 (en) | 2005-05-26 |
CN100554496C (en) | 2009-10-28 |
IL173224A (en) | 2010-05-31 |
BRPI0413417B1 (en) | 2014-10-14 |
TWI261930B (en) | 2006-09-11 |
EP1685269A2 (en) | 2006-08-02 |
AU2004288886B2 (en) | 2008-06-12 |
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