WO2005039845A1 - Panneaux postformables en materiau derive du bois et procede de fabrication desdits panneaux - Google Patents

Panneaux postformables en materiau derive du bois et procede de fabrication desdits panneaux Download PDF

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Publication number
WO2005039845A1
WO2005039845A1 PCT/EP2004/008738 EP2004008738W WO2005039845A1 WO 2005039845 A1 WO2005039845 A1 WO 2005039845A1 EP 2004008738 W EP2004008738 W EP 2004008738W WO 2005039845 A1 WO2005039845 A1 WO 2005039845A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive
wood
chips
thermosetting
thermoplastic
Prior art date
Application number
PCT/EP2004/008738
Other languages
German (de)
English (en)
Inventor
Kerstin Schmidt
Andreas Weber
Dirk Grunwald
Steffen Tobisch
Björn LILIE
Original Assignee
Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V:
Institut für Holztechnologie Dresden gGmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V:, Institut für Holztechnologie Dresden gGmbH filed Critical Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V:
Publication of WO2005039845A1 publication Critical patent/WO2005039845A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N5/00—Manufacture of non-flat articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/002—Manufacture of substantially flat articles, e.g. boards, from particles or fibres characterised by the type of binder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/04—Manufacture of substantially flat articles, e.g. boards, from particles or fibres from fibres

Definitions

  • Patent application Postformable wood-based panel and process for its production
  • the invention relates to a process for the production of re-formable wood-based panels with at least one layer of slender, long, preferably aligned chips, which are wetted with an adhesive and bonded to one another under the action of pressure and thermal energy, and to a re-formable wood-based panel with at least one layer longer , slender, preferably aligned chips, which are wetted with an adhesive and were connected to one another under the influence of pressure and thermal energy in a press system.
  • Boards are produced from long, slim, preferably aligned chips, so-called strands, by cutting the wood in drum barkers after debarking the starting material. Knife ring chippers are used almost exclusively, whereby the dimensions of the strands have increased to lengths of 120 to 145 mm in recent years. The production of longer beaches is basically possible. After drying in drum dryers, the strands are fractionated in drum sieves.
  • the adhesive content (solid) must be less than 25% based on dry wood and
  • the wood-adhesive mixture must not be able to climb, so it must not flow under pressure when softened.
  • Adhesive in press and bending dies without further crosslinking or condensation without further crosslinking or condensation.
  • the disadvantage here is the lack of moisture resistance of the bond and the thermoplasticity of the connection when using such adhesive systems.
  • the object of the present invention is to provide post-formable wood-based panels with at least one layer of long, slender, preferably aligned chips which, after being formed, have improved moisture resistance, transverse tensile strength and good heat resistance.
  • thermoplastic and thermosetting curing adhesives as an adhesive means that both properties of a wood-based panel, which initially appear to be contradictory, are achieved, namely, on the one hand, the formability, on the other hand the high heat resistance as well as low thickness swelling and high transverse tensile strength of the formed Wood panel. This is achieved in that the chips are only connected to one another by activating the thermoplastic curing adhesives, so that the thermosetting curing adhesives have not yet been crosslinked, that is to say have not yet been activated.
  • thermosetting is above a setting temperature for thermoplastic adhesives, with the chips below the crosslinking temperature for thermosetting, but above the setting temperature for thermoplastic curing, so that a wood-based panel is joined together arises, which still has the potential for thermoset curing, but due to the thermoplastic curing of the adhesives it already has sufficient stability to be stored, transported and processed without any problems.
  • thermosetting adhesives due to the cooling of the press is avoided.
  • the wood-based panel can be coated before the reshaping and activation of the thermosetting adhesives, in particular with veneers, furniture foils or flexible laminates.
  • thermoplastic and thermosetting adhesives can either be applied together as a mixture to the chips or applied individually, if necessary in layers and one after the other. Due to the high metal stickiness, PMDI adhesives are preferably used in the interior of the wood-based material fleece.
  • the reshapable wood-based panel according to the invention provides that the chips are connected to one another via thermoplastic hardening adhesive portions of the adhesive and are wetted with activatable, thermosetting adhesive portions of the adhesive that have not yet hardened, in order to enable non-destructive reshaping of the wood-based panel.
  • the adhesive advantageously has portions of MUPF adhesive and acrylate.
  • the wood-based panel can be composed of a single-layer layer of long, slender, possibly aligned beaches.
  • the long, slim beaches can be arranged as cover layers that enclose a middle layer, the chips or the wood-based materials being unoriented in contrast to the cover layers.
  • the top layers enclose the middle layer, whereby the middle layer can be wetted with PMDI adhesive.
  • the inventive production of re-formable wood-based panels with long, slim chips, at least as a top layer, so-called OSB, using an adhesive combination of thermoplastic and thermosetting components takes place under conditions customary in industry, whereby conventional softwood and possibly hardwood beaches or their mixtures with a beach length of up to 145 mm can be mechanically glued with the adhesive mixture in drum mixers.
  • other property-improving additives such as. B. water repellant possible.
  • the material moisture should be between 6 and 12% after gluing and before pressing.
  • the wood-based panels are produced as semi-finished products in discontinuously working single or multi-day hot presses or continuously working hot presses.
  • the pressing time factor, the pressing temperature and the pressure regime depend on the adhesive combinations used in the adhesive.
  • the last segments of a continuous press system should not be heated or actively recooled in order to avoid thermoset curing of the corresponding adhesive components.
  • recooling and pressure reduction may be required.
  • the boards can be treated like conventional boards, in particular trimming, grinding, cutting or storage is possible.
  • thermoplastic-bonded wood-based panels After storage for 3 to 5 days in a ripening stack at room temperature and, if necessary, transport to a processor, the previously thermoplastic-bonded wood-based panels are re-crosslinked as semi-finished products at a temperature of 100 to 240 ° C on single-day or molded presses.
  • the duroplastic component of the adhesive hardens completely.
  • Both the processing of pure OSB and a coating with solid coating materials such as veneers, furniture foils or flexible laminates is possible.
  • the reshaping or the deformations can be carried out both in the two-dimensional and in the three-dimensional range.
  • the molded parts are similar in their possibilities for further processing and the strength properties of conventionally manufactured, flat OSB panels.
  • 100% pine beaches with a thickness of 0.8 mm and a length of 145 mm were used.
  • the raw plate thickness was 1 1, 5 mm with a single-layer plate structure and a target bulk density of 650 kg / m 3 .
  • 70% MUPF adhesive and 30% acrylate were used as the adhesive, the adhesive content being 10% solid resin based on atro strands.
  • the bulk density achieved was 620 kg / m 3
  • the transverse tensile strength (dry) was 0.26 N / mm 2
  • the bending strength was 17.1 N / mm 2 with a flexural modulus of 3000 N / mm 2 and one Thickness swelling after 24 h WL of 70.8%.
  • the post-forming was carried out in the form of a plate and gave a plate thickness of 11 mm, the heating plate temperature being 180 ° C. and the pressing being carried out with a pressing time factor of 20 sec / mm.
  • the bulk density of the postformed plate was 645 kg / m 3 with a transverse tensile strength (dry) of 0.60 N / mm 2 , a bending strength of 25.5 N / mm 2 , a flexural modulus of 3500 N / mm 2 and a thickness swelling of only 17.8% after 24 hours of water storage.
  • 100% beech beaches with a length of 90 mm to 120 mm and a thickness of 0.5 mm were used.
  • the raw board thickness was 11.5 mm with a single-layer board structure with a target bulk density of 680 kg / m 3 .
  • 70% MUPF adhesive and 30% ethylene-modified polyvinyl acetate were used as adhesives, with an adhesive content of 12% solid resin based on atro strands.
  • 1% solid paraffin based on atro strands was used for the hydrophobization.
  • the heating plate temperature was 95 ° C with a moisture content of 0% after gluing and a pressing time factor of 15 s / mm.
  • the post-deformation was three-dimensionally curved to form a chair seat.
  • the material thickness was 1 1 mm and the hot plate temperature during post-forming was 100 ° C.
  • the pressing time for post-forming was 6 minutes. Due to the deformation of the finished workpiece in the form of a three-dimensional chair seat, no standardized product properties could be determined, but the reshaped product was usable.
  • thermoplastic-based binding of the chips of the wood-based panel Due to the initially only thermoplastic-based binding of the chips of the wood-based panel, it is possible to enable two-dimensional or three-dimensional post-forming without mechanical destruction of the wood-adhesive connection already formed. Mechanical destruction would preclude further material use due to the loss of strength.
  • the adhesive mixture according to the invention and the wood-based panels surprisingly achieve this Even at comparatively low press temperatures, sheet properties that allow further processing and in particular forming.
  • Acrylates and polyvinyl acetates are particularly suitable for thermoplastic curing, while urea-formaldehyde (UF), melamine-urea-formaldehyde (MUF) and melamine-urea-phenol-formaldehyde (MUPF) adhesives are mainly used for thermosetting in question.
  • UF urea-formaldehyde
  • MEF melamine-urea-formaldehyde
  • MUPF melamine-urea-phenol-formaldehyde
  • the setting temperature of thermoplastic adhesives is generally below the crosslinking temperature of thermosetting systems.
  • the post-deformation temperature selected in exemplary embodiment 2 was below the setting temperature of the thermoplastic adhesive due to the technological conditions in the production of molded parts.
  • Cross-linking of the thermoset was achieved by a correspondingly longer pressing time.
  • a post-crosslinking of the molded part at 180 ° C to 210 ° C would have been desirable in terms of a faster reaction time.

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)

Abstract

L'invention concerne un procédé de fabrication de panneaux postformables en matériau dérivé du bois pourvus d'au moins une couche de copeaux minces, longs, de préférence alignés, mouillés d'une substance adhésive et liés les uns aux autres sous l'effet de la pression et de l'énergie thermique dans une presse. Cette invention concerne également un panneau postformable en matériau dérivé du bois. L'objectif de cette invention est de produire des panneaux postformables en matériau dérivé du bois pourvus d'au moins une couche de copeaux longs, minces, de préférence alignés, lesquels panneaux présentent, après mise en forme, une résistance à l'humidité et à la traction transversale améliorées ainsi qu'une bonne résistance au fluage à chaud. A cet effet, des substances adhésives durcissables thermoplastiques et duroplastiques sont utilisées comme substance adhésive et les copeaux sont liés les uns aux autres par seule activation des substances adhésives durcissables thermoplastiques ou ces copeaux sont mouillés de fractions activables et durcissables duroplastiques de la substance adhésive, lesquelles fractions ne sont pas encore durcies.
PCT/EP2004/008738 2003-09-25 2004-08-04 Panneaux postformables en materiau derive du bois et procede de fabrication desdits panneaux WO2005039845A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2003144598 DE10344598B3 (de) 2003-09-25 2003-09-25 Nachformbare Holzwerkstoffplatte und Verfahren zu deren Herstellung
DE10344598.6 2003-09-25

Publications (1)

Publication Number Publication Date
WO2005039845A1 true WO2005039845A1 (fr) 2005-05-06

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DE (1) DE10344598B3 (fr)
WO (1) WO2005039845A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007019978B3 (de) 2007-04-27 2008-10-23 Kronotec Ag Bauplatte, insbesondere Fußbodenpaneel, und Verfahren zu deren Herstellung
BE1017821A5 (nl) * 2007-10-19 2009-08-04 Flooring Ind Ltd Sarl Plaat, werkwijzen voor het vervaardigen van platen en paneel dat dergelijk plaatmateriaal bevat.
ITUD20110142A1 (it) * 2011-09-13 2013-03-14 Roberta Bas Pannello per uso arredamento intermedia tra mdf e truciolare
WO2013131528A1 (fr) * 2012-03-06 2013-09-12 Homatherm Ag Procédé de fabrication d'un panneau de matériau dérivé du bois
DE102018114687B4 (de) 2018-06-19 2020-02-13 C. H. Müller Gmbh Mehrlagiges, biegeschlaffes, flächiges Halbzeug mit segmentartiger Oberfläche und Verfahren zu dessen Herstellung sowie daraus hergestelltes mehrdimensional gekrümmtes Formteil und Verfahren zu dessen Herstellung

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1326959A (en) * 1970-07-15 1973-08-15 Formwood Ltd Method and apparatus for pressing a moulded body of ligno- cellulose particles and a binder
DD201120A1 (de) * 1981-11-11 1983-07-06 Karla Lang Verfahren zur herstellung oberflaechenvergueteter formteile aus plattenfoermigen holzpartikelwerkstoffen
JPS59120440A (ja) * 1982-12-28 1984-07-12 Tohoku Kaihatsu Kk 深絞り成形用木質繊維マツトの製造方法
DE3441104A1 (de) * 1984-11-08 1986-05-22 Günter Hans 1000 Berlin Kiss Verfahren zur herstellung von mittels thermoplastisch verformbarer deckfolien oberflaechenkaschierter formteile

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20109675U1 (de) * 2001-06-12 2002-10-24 Fritz Egger Ges M B H & Co Grossformatige OSB-Platte mit verbesserten Eigenschaften, insbesondere für den Baubereich

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1326959A (en) * 1970-07-15 1973-08-15 Formwood Ltd Method and apparatus for pressing a moulded body of ligno- cellulose particles and a binder
DD201120A1 (de) * 1981-11-11 1983-07-06 Karla Lang Verfahren zur herstellung oberflaechenvergueteter formteile aus plattenfoermigen holzpartikelwerkstoffen
JPS59120440A (ja) * 1982-12-28 1984-07-12 Tohoku Kaihatsu Kk 深絞り成形用木質繊維マツトの製造方法
DE3441104A1 (de) * 1984-11-08 1986-05-22 Günter Hans 1000 Berlin Kiss Verfahren zur herstellung von mittels thermoplastisch verformbarer deckfolien oberflaechenkaschierter formteile

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 008, no. 240 (M - 336) 6 November 1984 (1984-11-06) *

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