WO2005034251A2 - Procede de fabrication d'un corps de led photoconducteur en au moins deux etapes de fabrication - Google Patents
Procede de fabrication d'un corps de led photoconducteur en au moins deux etapes de fabrication Download PDFInfo
- Publication number
- WO2005034251A2 WO2005034251A2 PCT/DE2004/002230 DE2004002230W WO2005034251A2 WO 2005034251 A2 WO2005034251 A2 WO 2005034251A2 DE 2004002230 W DE2004002230 W DE 2004002230W WO 2005034251 A2 WO2005034251 A2 WO 2005034251A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- led
- partial
- chip
- recess
- light
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1615—The materials being injected at different moulding stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2011/00—Optical elements, e.g. lenses, prisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Definitions
- the larger end face diameter of the truncated cone (16) measures approximately 5 mm in the exemplary embodiment. It is called the base size.
- the taper of the truncated cone (16) is, for example, 20% of the basic size.
- the total height of the LED part body (10) corresponds to approx. 180% of the basic size.
- the height of the cylinder (11), which is a flange-like collar with respect to its radius over the conical survives bluntly by approx. 10% of the basic size, eats approx. 30% of the basic size.
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04789939A EP1704601A2 (fr) | 2003-10-09 | 2004-10-07 | Procede de fabrication d'un corps de led photoconducteur en au moins deux etapes de fabrication |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10347541.9 | 2003-10-09 | ||
DE2003147541 DE10347541B4 (de) | 2003-10-09 | 2003-10-09 | Verfahren zum Herstellen eines lichtleitenden LED-Körpers in mindestens zwei Fertigungsstufen |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005034251A2 true WO2005034251A2 (fr) | 2005-04-14 |
WO2005034251A3 WO2005034251A3 (fr) | 2005-11-03 |
Family
ID=33521597
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2004/002230 WO2005034251A2 (fr) | 2003-10-09 | 2004-10-07 | Procede de fabrication d'un corps de led photoconducteur en au moins deux etapes de fabrication |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1704601A2 (fr) |
DE (1) | DE10347541B4 (fr) |
TW (1) | TW200515626A (fr) |
WO (1) | WO2005034251A2 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2428724A1 (fr) | 2010-09-08 | 2012-03-14 | SMR Patents S.à.r.l. | Couplage de lumière optimal pour dispositifs rétroviseurs |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3863075A (en) * | 1972-06-29 | 1975-01-28 | Plessey Handel Investment Ag | Light emitting diode assembly |
GB1518040A (en) * | 1975-12-08 | 1978-07-19 | Savage J | Lens clip for led assembly |
US6048082A (en) * | 1997-06-20 | 2000-04-11 | Stanley Electric Co., Ltd. | Direct-mounting electric lamp unit |
WO2002069409A1 (fr) * | 2001-02-22 | 2002-09-06 | Weldon Technologies, Inc. | Diode electroluminescente grande puissance |
DE10163116A1 (de) * | 2001-12-24 | 2003-07-17 | Reitter & Schefenacker Gmbh | Verfahren zum Herstellen von lichtleitenden LED-Körpern in zwei räumlich und zeitlich getrennten Stufen |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2733937A1 (de) * | 1977-07-27 | 1979-02-08 | Siemens Ag | Vorrichtung zur uebertragung von signalen |
JPS6469061A (en) * | 1987-09-10 | 1989-03-15 | Nec Corp | Light emitting diode |
JP4271747B2 (ja) * | 1997-07-07 | 2009-06-03 | 株式会社朝日ラバー | 発光ダイオード用透光性被覆材及び蛍光カラー光源 |
-
2003
- 2003-10-09 DE DE2003147541 patent/DE10347541B4/de not_active Expired - Fee Related
-
2004
- 2004-10-07 EP EP04789939A patent/EP1704601A2/fr not_active Withdrawn
- 2004-10-07 WO PCT/DE2004/002230 patent/WO2005034251A2/fr active Application Filing
- 2004-10-08 TW TW093130669A patent/TW200515626A/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3863075A (en) * | 1972-06-29 | 1975-01-28 | Plessey Handel Investment Ag | Light emitting diode assembly |
GB1518040A (en) * | 1975-12-08 | 1978-07-19 | Savage J | Lens clip for led assembly |
US6048082A (en) * | 1997-06-20 | 2000-04-11 | Stanley Electric Co., Ltd. | Direct-mounting electric lamp unit |
WO2002069409A1 (fr) * | 2001-02-22 | 2002-09-06 | Weldon Technologies, Inc. | Diode electroluminescente grande puissance |
DE10163116A1 (de) * | 2001-12-24 | 2003-07-17 | Reitter & Schefenacker Gmbh | Verfahren zum Herstellen von lichtleitenden LED-Körpern in zwei räumlich und zeitlich getrennten Stufen |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2428724A1 (fr) | 2010-09-08 | 2012-03-14 | SMR Patents S.à.r.l. | Couplage de lumière optimal pour dispositifs rétroviseurs |
Also Published As
Publication number | Publication date |
---|---|
EP1704601A2 (fr) | 2006-09-27 |
WO2005034251A3 (fr) | 2005-11-03 |
DE10347541A1 (de) | 2005-06-02 |
TW200515626A (en) | 2005-05-01 |
DE10347541B4 (de) | 2012-02-16 |
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