WO2005027080A1

WO2005027080A1 - Label for in-mold molding

Info

Publication number: WO2005027080A1
Application number: PCT/JP2004/013994
Authority: WO
Inventors: Masaki Shiina; Takashi Funato; Takushi Yoshida
Original assignee: Yupo Corporation
Priority date: 2003-09-16
Filing date: 2004-09-16
Publication date: 2005-03-24
Also published as: WO2005027080A8; JP2005091594A

Abstract

A label for in-mold molding, characterized in that it has a releasable pseudo-adhesive resin layer (4) of ultraviolet curable and/or electron beam curable type between a first resin film (1) and a second resin film (2) having a heat-sealing layer (3). A container manufactured trough in-mold molding by using the above label for in-mold molding is free of a blister and has a good appearance, and the resin film pasted by pseudo-adhesion can be released from the container with ease by hand.

Description

Specification

In-mold label

Technical field

TECHNICAL FIELD The present invention relates to an in-mold molding label that is adhered to a thermoplastic resin container manufactured by differential pressure molding, hollow molding, injection molding, foam molding, or compression molding simultaneously with container molding. In particular, the present invention relates to an in-mold molding label comprising a film in which a label is pseudo-adhered and laminated in multiple layers, wherein the pseudo-adhered film can be peeled off from the container after being attached to the container by in-mold molding. Background art

Conventionally, after setting a label in a mold in advance, a thermoplastic resin is injected into the mold, and a container is formed by differential pressure molding, hollow molding, injection molding, foam molding, compression molding, etc., and the label is simultaneously formed. Thermoplastic resin mold labels for sticking are used. Generally, these in-mold molding labels can be attached to the front and back of a container only one by one, so that there is a disadvantage that a lot of information such as explanation of contents cannot be displayed.

In order to remedy this drawback, the in-mold label is folded into multiple sheets and heat-bonded to the container, and both the front and back sides of the label that has been bonded to the container and the label that has been folded against the bonding surface are used as display surfaces. It has been proposed (Japanese Patent Application Laid-Open No. 2002-258587). In addition, an in-mold label composed of a plurality of labels that are laminated by applying an adhesive to at least a part of the label has also been proposed (Japanese Patent Application Laid-Open No. 2000-240666).

However, if the in-mold label is folded into multiple pieces and a part of the label is thermally bonded to the container, the part of the label that has not been thermally bonded to the shrinkage of the container after the in-mold molding cannot follow the shrinkage of the container, and the folded label rises. There is a problem. Also, when multiple labels are pasted together using ordinary adhesives, heat sealants, adhesives, etc., the pre-stamp is applied to the upper paper label that has been stacked by shrinkage of the container after the initial molding. When the resin film is easily lifted by the impact given during the transportation of the container or when the resin film is easily lifted, there is also a drawback. If the superimposed labels are strongly adhered, it is difficult to peel the pasted labels from the container, and even if the labels can be peeled off, there were problems such as destruction of the material of the labels and the inability to read printed prints. Disclosure of the invention

The present inventors have conducted intensive studies in order to solve these problems, and as a result, an ultraviolet curable type and a Z or electron beam curable pseudo type that can be peeled between the first resin film 1 and the second resin film 2. It has been found that the use of the adhesive resin layer 4 solves the above problem. That is, the present invention provides an in-mold molding label and a container having the following structures.

1. An in-mold molding label having an ultraviolet curable and Z or electron beam curable pseudo-adhesive resin layer 4 that can be peeled between a first resin film 1 and a second resin film 2 having a heat seal layer 3.

2. The peel strength between the pseudo-adhesive resin layer and the first resin film 1 or between the pseudo-adhesive resin layer 4 and the second resin film 2 is 10 to 500 gf / 25 mm. The label for in-mold molding described in the above.

3. The pseudo-adhesive resin layer 4 includes the pseudo-adhesive resin layer 41 on the first resin film 1 side and the pseudo-adhesive resin layer 42 on the second resin film 2 side. 2. The label for in-mold molding according to 1 above, wherein the peel strength between the layer 42 and the layer 42 is 10 to 500 gf / 25 mm.

4. On the surface of the first resin film 1 on the side of the pseudo-adhesive resin layer 4 and / or on the surface of the second resin film 2 on the side of the pseudo-adhesive resin layer 4, to adjust the peel strength with the pseudo-adhesive resin layer 4. The label for in-mold molding according to any one of the above 1 to 3, wherein the surface treatment is performed. '

5. The Gurley stiffness of the label should be 10 to 100 0. The label for in-mold molding described in the above.

6. The label for in-mold molding according to any one of the above 1 to 5, wherein the resin film layer 2 is stretched at least in a uniaxial direction.

7. The label for in-mold molding according to 6 above, wherein the heat seal layer 3 is stretched in at least one axis direction.

8. The label for in-mold molding according to any one of the above 1 to 6, wherein the heat seal layer 3 is provided by a coating method or a lamination method.

9. The label for in-mold molding according to any one of the above items 1 to 8, wherein the first resin film 1 has a concealing layer 5 on its surface.

10. The in-mold molding label according to any one of 1 to 9 above, further comprising a printed layer on at least one surface of the first resin film 1 or at least one surface of the second resin film 2.

11. The immold-forming label according to 9 or 10 above, further comprising a printing layer on the surface of the concealing layer 5.

12. The in-mold molding label according to any one of 9 to 11 above, further comprising a concealing layer 5 'on at least one surface of the second resin film 2.

1 3. The label for in-mold molding described in 12 above, comprising a printing layer between the concealing layer 5 and the pseudo-adhesive resin layer 4.

14. The in-mold molding label according to any one of the above items 1 to 13, wherein the first resin film 1 is a transparent resin film.

15. The label for in-mold molding according to any one of 1 to 14 above, wherein the second resin film 2 is a transparent resin film.

16. The label for in-mold molding according to any one of 1 to 13 or 15 above, wherein the first resin film 1 is an opaque resin film.

17. The label for in-mold molding according to any one of 9 to 11 above, further comprising a print layer on the surface of the heat seal layer 3.

1 8. The above 1 to 14 wherein the second resin film 2 is an opaque resin film or 16. The label for in-mold molding according to any one of 16.

19. Any one of the above items 1 to 13 in which either the first resin film 1 or the second resin film 2 is a transparent resin film, and the pseudo adhesive resin layer 4 is an ultraviolet-curable adhesive resin layer. The label for in-mold molding described in 1.

20. The label for in-mold molding according to any one of the items 1 to 13, wherein the pseudo adhesive resin layer 4 is an electron beam-curable adhesive resin layer.

21. The label for in-mold molding according to any one of 1 to 20 above, which is punched in a pattern.

22. The label for in-mold molding according to 21 above, wherein a peeling opening for peeling off the first resin film is formed.

23. A container to which the label for in-mold molding described in any one of 1 to 22 above is adhered.

24. The container according to the above item 23, wherein the container is manufactured by differential pressure molding, hollow molding, injection molding, foam molding, or compression molding.

The container molded by using the label for mold molding of the present invention has good appearance without a blister, and the resin film bonded by pseudo-adhesion can be easily peeled off from the container by hand. Brief Description of Drawings

FIG. 1 is a cross-sectional view showing a configuration example of a label for in-mold molding of the present invention. FIG. 2 is a cross-sectional view showing a configuration example of the label for in-mold molding of the present invention. FIG. 3 is a cross-sectional view showing a configuration example of the label for in-mold molding of the present invention. FIG. 4 is a cross-sectional view showing a configuration example of the label for in-mold molding of the present invention. FIG. 5 is a cross-sectional view showing a configuration example of the label for in-mold molding of the present invention. FIG. 6 is a cross-sectional view showing a configuration example of the label for in-mold molding of the present invention. FIG. 7 is a cross-sectional view showing a configuration example of the label for molding imino redo of the present invention. FIG. 8 is a cross-sectional view showing a configuration example of the label for in-mold molding of the present invention. FIG. 9 is a cross-sectional view showing a configuration example of the label for in-mold molding of the present invention. FIG. 10 is a top view and a cross-sectional view showing a specific mode of a peeling opening of the label for in-mold molding of the present invention.

FIG. 11 is a top view and a cross-sectional view showing a specific mode of a peeling opening of the label for in-mold molding of the present invention.

FIG. 12 is a schematic diagram showing a production line of the first embodiment.

FIG. 13 is a schematic diagram showing a production line of the second embodiment.

In the figure, 1 is the first resin film, 1a is the transparent first resin film, lb is the opaque first resin film, 2 is the second resin film, 2a is the transparent second resin film, and 2b is opaque. No. 2 resin film, 3 is a heat seal layer, 3 a is a transparent heat seal layer, 4 is a pseudo adhesive resin layer, 4 a is an ultraviolet curing type pseudo adhesive resin layer, 4 b is an electron beam curing type pseudo adhesive resin Layer, 5 is concealable layer, 5 'is concealable layer, 6 is printed, 7 is solid white printing, 8 is peeling spot, 9 is ultraviolet ray 10 is electron beam, 11 is cut, 1 2 is non-simulated Adhesive resin layer area, 13 is pseudo adhesive, 14 is plate cylinder, 15 is impression cylinder, 16 is printing D part, 17 is pseudo adhesive resin layer coating part, 18 is printing B processing Part, 19 is the concealable layer coating part, 20 is the printing A processing part, 21 is the printing D processing part, 22 is the printing B processing part, 23 is the pseudo adhesive resin layer coating part, 24 Is printing A construction department, 25 is ultraviolet irradiation machine, 26 is an electron beam irradiator, 27 is a mold release, 41 is a pseudo adhesive resin layer on the first resin film 1 side, and 42 is a pseudo adhesive resin layer on the second resin film 2 side. Detailed description of the invention

Hereinafter, the in-mold molding label of the present invention will be described in detail. In this specification, a numerical range represented by using “to” means a range including numerical values described before and after “to” as a lower limit and an upper limit. <Label structure>

The label for in-mold molding of the present invention includes a first resin film 1, a second resin film 2 having a heat seal layer 3 formed on a side to be adhered to a container, a first resin film 1 and a second resin film. It is basically composed of an ultraviolet-curable and / or electron beam-curable pseudo-adhesive resin layer 4 that can be peeled between the two. In the immold molding label of the present invention, the peel strength is adjusted to an appropriate range so that the first resin film 1 can be separated from the container after the inmold molding.

In addition, the label for in-mold molding of the present invention can be used for the first resin film 1 and Z or

(2) The resin film 2 may be provided with a concealing layer 5, 5, and a printing layer having various information is provided on at least one side of the first resin film 1 and / or on at least one side of the second resin film 2. Preferably, a printing layer may be provided on the surface of the opaque layers 5, 5,. Furthermore, a non-pseudo-adhesive resin layer region (and a slit) having no pseudo-adhesive resin may be provided in the region of the pseudo-adhesive resin layer 4 punched and formed in an appropriate pattern to form a peeling opening.

1 to 9 exemplify a specific configuration of the label for in-mold molding of the present invention. Fig .: ~ ~ Fig. 4 shows a configuration in which an ultraviolet curing type pseudo adhesive is used for the pseudo adhesive resin layer, and at least one of the first resin film 1 and the second resin film 2 is made of a transparent resin film capable of transmitting ultraviolet light. The UV-curable pseudo-adhesive of the pseudo-adhesive resin layer is cured with UV light from the direction of the transparent resin film. FIGS. 5 to 9 show a configuration in which an electron beam curing type pseudo-adhesive is used for the pseudo-adhesion resin layer, and the first resin film 1 and Z or the second resin film 2 may be either an opaque resin film or a transparent resin film. The electron beam-curable pseudo-adhesive of the pseudo-adhesive resin layer is cured with an electron beam. First resin film 1 and second resin film 2>

The resin constituting the first resin film 1 and the resin constituting the second resin film 2 are thermoplastic resins, for example, polyethylene resins such as propylene-based resin, high-density polyethylene, medium-density polyethylene, polymethyl-1-pentene, and ethylene. One ring Polyolefin resins such as polyolefin copolymers, polyethylene terephthalate resins, polychlorinated vinyl resins, polyamide resins such as nylon-16, nylon-6,6, nylon-16,10, nylon-16,12, AB Films such as S resin and ionomer resin can be used. These resins may be used alone or as a mixture of two or more.

Among them, propylene-based resin is particularly preferred in view of chemical resistance, recyclability with polyolefin-based containers, and cost. Examples of such a propylene-based resin include a propylene homopolymer exhibiting isotactic or syndiotactic stereoregularity, and propylene, ethylene, 1-butene, 1-hexene, 11-heptene, 4-methyl-11-pentene. And α-olefins. These copolymers may be two-dimensional, three-dimensional or four-dimensional, and may be random copolymers or block copolymers.

Further, an inorganic fine powder or an organic filler or the like can be appropriately added to the above-mentioned thermoplastic resin.

The type of the inorganic fine powder or the organic filler is not particularly limited. Examples of the inorganic fine powder include heavy calcium carbonate, light calcium carbonate, calcined clay, talc, barium sulfate, diatomaceous earth, magnesium oxide, zinc oxide, titanium oxide, and silicon oxide. Among them, heavy calcium carbonate, calcined clay, and talc are preferable because they are inexpensive and have good moldability.

The organic fillers include polyethylene terephthalate, polybutylene terephthalate, polyamide, polycarbonate, polyethylene naphthalate, polystyrene, melamine resin, polyethylene sulphite, polyimide, polyetheretherketone, polyphenylene sulphite and cyclic olefin. Copolymers and copolymers of cyclic olefin and ethylene. Among them, it is preferable to use an organic boiler that has a higher melting point than the thermoplastic resin used and is incompatible with the thermoplastic resin. One of the above-mentioned inorganic fine powders or organic fillers may be used alone, or two or more kinds may be selected and used in combination. Used in combination of two or more In this case, an inorganic fine powder and an organic filler may be mixed and used.

Further, if necessary, a dispersant, an antioxidant, a compatibilizer, an ultraviolet stabilizer, an anti-blocking agent, and the like can be added to the thermoplastic resin.

The first resin film 1 and the second resin film 2 may be a single layer or a multilayer. In the case of multiple layers, the core layer and the front layer and the back layer are arranged on both sides, and each layer may be composed of the same thermoplastic resin, or may be composed of different types of thermoplastic resins. Is also good. When inorganic fine powders or organic fillers are blended with them, their types and blending amounts may be the same or different. The films constituting the first resin film 1 and the second resin film 2 are preferably stretched in at least one direction. When the first resin film 1 is composed of a plurality of layers, it is preferable that at least one layer is stretched. When a plurality of layers are stretched, they may be stretched individually before laminating each layer, or may be stretched as a whole after lamination. Further, the stretched layer may be stretched again after lamination.

Although various known methods can be used for stretching, it is preferable to perform stretching between rolls using a difference in peripheral speed between roll groups. According to this method, the draw ratio can be adjusted arbitrarily. In addition, since the resin is oriented in the flow direction of the film, a label having a high tensile strength and a small dimensional change due to the tension during printing can be obtained as compared with an unstretched film. The stretching temperature can be set from the glass transition point of the thermoplastic resin to be used in the case of non-crystalline resin to the glass transition point, and in the case of crystalline resin, it can be set to be from the glass transition point of the non-crystalline part to the melting point of the crystalline part. .

The thickness of the first resin film 1 and the second resin film 2 is appropriately determined according to the material, label application target, use purpose, use environment, storage environment, and the like. The thickness of the first resin film 1 is preferably 5 to 500 μπη, more preferably 10 to 300 μπι. Further, the thickness of the second resin film 2 is preferably 20 to 500 μπι, and more preferably 40 to 300 μπι. Peel strength at the interface between the first resin film 1 and the pseudo-adhesive resin layer 4 or the second resin film In order to adjust the peel strength at the interface between the film 2 and the pseudo-adhesive resin layer 4, the first resin film 1 or the second resin film 2, or the pseudo-adhesive resin layer of the first resin film 1 and the second resin film 2 Surface treatment can be applied to the four sides.

In the present invention, since the peel strength of the pseudo-bonded resin layer 4 varies depending on the type of the first resin film 1 and the second resin film 2, when the peel strength of the interface to be peeled is low, surface treatment is performed. There are cases where the peel strength is increased and cases where the surface treatment is performed so as to prevent the surface from peeling by increasing the peel strength of the interface that is not desired to be peeled.

Examples of the surface treatment method include corona discharge treatment, flame treatment, and application of an anchor coating agent. Corona discharge treatment is a method in which high frequency and high voltage are applied between electrodes placed in the air, and the corona generated generates polar groups on the resin film surface to modify the surface. Further, as an anchor coating agent for improving the adhesiveness, for example, an organic titanium-based, isocyanate-based, polyethyleneimine-based coating agent or the like can be used. These surface treatments may be performed on a label production line, or a resin film which has been subjected to a surface treatment in advance may be used.

The second resin film 2 has a heat seal layer 3 on the side to be adhered to the container, and the resin constituting the heat seal layer is a resin material constituting the container to which the label is adhered by heating during the in-mold molding. The type is not particularly limited as long as it has a function of sticking.

Examples of preferred resins, density 0.9 0 0 to 0.9 3 5 low density or medium density polyethylene g / cm ^3, a density of 0. 8 8 0~0. 9 4 0 g / cm 3 Linear low-density polyethylene, ethylene 'biel acetate copolymer, ethylene' acrylic acid copolymer, ethylene. Acrylic acid alkyl ester copolymer, ethylene / methacrylic acid alkyl ester copolymer (carbon number of alkyl group Is 1 to 8), and a polyethylene resin having a melting point of 80 to 130 ° C, such as a metal salt of ethylene and methacrylic acid copolymer (Zn, Al, Li, K, Na, etc.). be able to. Among these, At the above density, a high-pressure polyethylene having a crystallinity (X-ray method) of 10 to 60% and a number average molecular weight of 10, 000 to 40, 000, or a linear linear polyethylene is preferred. Above all the adhesion to the resin molded product, ethylene 4 0-9 8 wt% and the Orefin 6 0-2 wt ^_0/0 carbon number 3-3 0, meta port Sen catalyst (especially meth port Sen Al Mokisan Or a catalyst comprising a metallocene compound as disclosed in, for example, WO 92/01723, and a compound which reacts with the metallocene compound to form a stable anion. Thus, a linear linear polyethylene obtained by copolymerization is most suitable. One of these polyolefin-based resins may be used alone, or two or more may be used as a mixture.

Other known resin additives can be arbitrarily added to the heat seal layer 3 as long as the performance required for the heat seal layer is not impaired. Examples of such additives include dyes, nucleating agents, plasticizers, release agents, antioxidants, antiblocking agents, flame retardants, ultraviolet absorbers, antistatic agents and the like.

The heat seal layer 3 is formed by laminating the heat seal resin as a film on the second resin film 2 to form a heat seal layer. There is a method in which a resin liquid dissolved in a solvent such as the above is applied to the second resin film 2 and then dried to form a heat seal layer.

The thickness of the heat seal layer 3 is preferably from 1 to 100 μπι, more preferably from 2 to 20 μm. The heat seal layer needs to be melted by the heat of the molten polyethylene or propylene resin used as a parison during molding, and the resin molded product and the label must be fused together. It is preferable that μΐη or more. In addition, if it is not more than Ιμππι, the label is unlikely to curl, and it is relatively easy to set in an in-mold mold at the time of in-mold molding.

<Pseudo-adhesive resin layer 4>

As the resin for forming the pseudo-adhesive resin layer 4, the first resin film 1 or the second resin film When at least one of the films 2 is a transparent resin film capable of transmitting ultraviolet light, an ultraviolet-curable pseudo-adhesive can be used. In the composition of the UV-hardened pseudo-adhesive, a urethane resin, a polyester resin, an epoxy resin or the like is used as a prepolymer, and an acrylate or the like is used as a monomer. In addition, a photopolymerization initiator, a photopolymerization inhibitor and, if necessary, a silicone resin are used as additives. In the case of the above configuration, the ultraviolet-curable pseudo-adhesive of the pseudo-adhesive resin layer is cured with ultraviolet rays from the direction of the transparent resin film.

When an electron beam-curable pseudo-adhesive is used as the resin for forming the pseudo-adhesive resin layer 4, the first resin film 1 and / or the second resin film 2 may be an opaque resin film or a transparent resin film. . In the composition of the electron beam-curable pseudo-adhesive, a polyamide resin, a biel-based resin, a urethane resin, a polyester resin, an epoxy resin, or the like is used as a prepolymer, and an acrylate ester or the like is used as a monomer. In the case of curing with an electron beam, an additive such as a photopolymerization initiator is not particularly required, but a known photopolymerization initiator can be added to promote the curability.

In the case of the above configuration, the electron beam-curable pseudo-adhesive of the pseudo-adhesive resin layer 4 can be cured with an electron beam from the direction of the opaque resin film.

The thickness of the pseudo adhesive resin layer 4 is preferably 5 to 200 / zm, more preferably 10 to 100 μηι, and particularly preferably 15 to 80 μπι. . If the thickness of the pseudo-adhesive resin layer 4 is 5 m or more, sufficient adhesive strength can be exhibited.If the thickness is 200 μm or less, the label does not curl, and the in-mold mold is used during the in-mold molding. Set to is relatively easy.

The method of applying the pseudo-adhesive resin layer 4 can be letterpress printing, offset printing, screen printing, flexographic printing, gravure printing, etc., and is not particularly limited, but screen printing, flexographic printing, and gravure printing with a large amount of application are possible. Are preferred.

The label for in-mold molding of the present invention is provided between the pseudo-adhesive resin layer 4 and the first resin film 1 or between the pseudo-adhesive resin layer 4 and the second resin film 2 (the pseudo-adhesive resin layer 4). This includes the case where the first resin film 1 has a pseudo adhesive resin layer 41 and the resin film side has a pseudo adhesive resin layer 42. In this case, the pseudo adhesive resin layer 41 and the pseudo adhesive layer resin

The peel strength (based on JIS-Z-0 237) is preferably in a specific range, that is, 10 to 500 gf Z 25 mm, and 15 to 50 It is more preferably 300 gf Z 25 mm, particularly preferably 20 to 150 gf / 25 mm.

If the peel strength is 10 gf / 25 mm or more, blisters will be generated in the first resin film 1 due to the shrinkage of the container after the in-mold molding, and the impact will be caused by the impact when the in-mold molded container is transported. And other problems can be avoided sufficiently. When the peel strength is 500 gf / 25 mm or less, the first resin film 1 can be easily peeled off by hand. If the peel strength is too high, the material may be destroyed in the first resin film 1 or the second resin film 2 even if the peeling is performed, and a problem may occur such that printed information cannot be recognized. <Stiffness>

In the label for in-mold molding of the present invention, the Gurley stiffness of the label measured according to TAPPI T543PM-84 is preferably from 10 to 100, more preferably from 10 to 600, It is more preferably 12 to 600, and 15 to

500 is particularly preferred. When the first resin film 1 and / or the second resin film 2 forming a label are stretched, the MD direction (machine flow direction) and the TD direction (M

If any of the Gurley stiffnesses (in the direction perpendicular to the D direction) is within the above range, it can be suitably used as a label for in-mold molding. More preferred is an in-mold molding label in which both the Gurley stiffness in the MD direction and the Gurley stiffness in the TD direction are within the above ranges.

If the Gurley stiffness is 10 or more, the label has an appropriate stiffness, so it is difficult for the label to float when the label is suction-fixed to the die during the molding process, and the molded product is unlikely to have label sticking. If the Gurley stiffness is 100 or less, the label has a waist Even if the mold at the label position is curved at the time of the in-mold molding, the label can be set in the mold without repulsion, and the in-mold molding can be performed. In general, if the label is too stiff, problems such as large deformation of the in-mold molded container are likely to occur even if in-mold molding can be performed.

On the surface of the first resin film 1, a concealing layer 5 can be provided. If necessary, a concealing layer 5 may be provided on the back side of the first resin film 1. Further, a concealing layer 5 ′ can be provided on at least one surface of the second resin film 2. The concealing layer is to be subjected to letter solid printing, offset printing, screen printing, flexographic printing, Daravia printing, etc., to perform solid white printing or black solid printing with a thickness of 1 to 5 μμηι, preferably 5 to 4 μμηι. Can be formed. In order to enhance the design, the concealing layer is formed by direct metal deposition, metal transfer deposition, metal foil transfer, paint coating with metal powder, paint with pearl pigment, and exposure to interference fringes on photosensitive resin for development. (Formation of holo-drum) method. Providing such concealing layers 5 and 5 ′ has the advantage that the design as a label can be enhanced, the transparent resin film can be made opaque, and the following printed layers can be provided on both sides. .

On the label for in-mold molding of the present invention, a printed layer having various information such as a product name, a character, a bar code, a manufacturer, a sales company name, and a use method can be formed. As a printing method for forming a printing layer, various printings such as gravure printing, offset printing, letter press printing, flexographic printing, and screen printing can be performed. The printing is performed by combining the first resin film 1 and the second resin film 2 with a transparent resin film or an opaque resin film, for example, as shown in FIGS. 1 to 9. A printing layer can be provided on the layer to be formed. Further, by providing a printing layer on the concealing layer 5 and / or the concealing layer 5 'as needed, the decorativeness can be enhanced.

The first resin film 1 and the second resin film 2 are pasted together by pseudo-adhesion, and the label for in-mold molding, which has been printed on any layer, is punched out by punching as appropriate to form the pattern required for container attachment. Separated into formed labels. Further, a “peeling opening” for peeling the first resin film can be provided at one end of the label.

The details of the shape of the peeling opening are not particularly limited. For example, various modes as exemplified in FIGS. 10 and 11 can be employed. For example, as shown in FIG. 10 (a), a non-pseudo-adhesive resin layer region is formed at the end of the label, and the first resin film 1 and the second resin film 2 are brought into a non-adhesive state, whereby the first resin The film 1 can be easily peeled. Further, as shown in FIG. 10 (b), a non-pseudo-adhesive resin layer region is formed to isolate the pseudo-adhesive resin layer at the end of the label, and the first resin film 1 on the non-pseudo-adhesive resin layer region is formed. The cuts may be shaped. The cut is not limited to a straight line but may be a semicircular portion as shown in FIG. 10 (c).

Further, as shown in FIG. 11, a step is formed by forming a cut in the first resin film 1 at the boundary between the non-pseudo-adhesive resin layer area formed at the end of the label and the pseudo-adhesive resin layer and removing the same. As a result, the first resin film 1 can be easily peeled off. Further, as shown in FIG. 11 (b), the cut may be formed on the non-pseudo-adhesive resin layer region side from the boundary portion, and the end of the first resin film 1 may be removed. The cut is not limited to a straight line but may be a semicircular portion as shown in FIG. 11 (c).

These modes can be appropriately determined in consideration of the mode of use and environment of use of the label.

<In-mold molded container> The in-mold molding label of the present invention can be used for various resin containers. For example, it can be used for containers made of high-density polyethylene, polypropylene, polyester, polystyrene, polyvinyl chloride, polycarbonate, etc., and is particularly suitable for containers made of high-density polyethylene, polypropylene, polyester, and polystyrene. These resin containers are manufactured by differential pressure molding, hollow molding, injection molding, foam molding, or compression molding. Among them, it is suitable for differential pressure molding, hollow molding, and injection molding. Hereinafter, features of the present invention will be described more specifically with reference to examples and comparative examples. The materials, amounts used, ratios, treatment details, treatment procedures, and the like shown in the following examples can be appropriately changed without departing from the gist of the present invention. Therefore, the scope of the present invention should not be construed as being limited by the specific examples described below.

(Example 1)

As the first resin film 1, a transparent resin film (trade name “OPU_l”, thickness 201111, corona-discharge treated, manufactured by Tosello Co., Ltd.), and as the second resin film 2, a heat-sealing layer Opaque resin film (product name “UPO ^R IDS 80”, thickness 80 / πι, opacity 86%, manufactured by UPO Corporation), UV curing as pseudo-adhesive resin layer 4 A model pseudo adhesive (trade name “UV FIL 383 Clear”, manufactured by Teikoku Ink Mfg. Co., Ltd.) was used.

In a series of lines shown in Fig. 12, first, a printing layer D is applied to the surface of the opaque second resin film 2 with an ultraviolet curing ink (16 in the figure), and the ink is cured with an ultraviolet irradiator 25. Then, a UV-curable pseudo-adhesive layer is applied to a thickness of 30 μm (17 in the figure), and after bonding the transparent first resin film 1 and the opaque second resin film 2, Then, the pseudo-adhesive layer was cured by irradiating ultraviolet rays from the transparent first resin film 1 side. At this time, ultraviolet rays were irradiated using a metal nitride lamp at an output of 280 W / cm. The ultraviolet intensity at this time was 2100 mW / cm ² . UV irradiation width 77 mm In so line speed was 4 OmZm in, integral light quantity of ultraviolet light was 242 m JZ cm ^2. Next, a reverse image printing layer B is provided on the surface of the transparent first resin film 1 with an ultraviolet-curing ink (18 in the figure), and then the printing layer B is printed by flexo printing with a 20 μπι white solid printing ( (Concealing layer) to provide concealment (19 in the figure), and further apply a printing layer で on the surface of white solid printing (concealing layer) with UV-curable ink (20 in the figure) to obtain an opaque resin film A laminated film composed of Z printing layer DZ ultraviolet curable pseudo-adhesive resin layer Z transparent resin film / printing layer BZ hiding layer / printing layer A was obtained.

The peeling port was formed by forming a non-pseudo-adhesion area when applying the pseudo-adhesive, and cutting the first resin film 1 in the non-pseudo-adhesion area by punching (FIG. 10 (b)). ).

Next, the above film was punched into a label having a length of 9 cm and a width of 7 cm by punching to obtain a label for in-mold molding.

<In-mold molding>

The obtained label for in-mold molding is blown using a blow molding machine (Model V-50) manufactured by Placo Co., Ltd. and an automatic label supply device manufactured by Pentel Co., Ltd. After fixing the label on one side (capacity 800ml) using a vacuum so that the printing layer surface is in contact with the mold, high-density polyethylene (Nippon Polychem Co., Ltd., Novatec PE, HB330, melting point 1 33 ° C ”) is melt-extruded at 200 ° C, then the mold is clamped, then 4.6 kg / cm ² of compressed air is supplied into the parison to expand the parison and bring it into close contact with the mold. After the mold was cooled, the mold was opened to obtain a hollow container to which the label was attached.

(Example 2)

As the first resin film 1, an opaque resin film (trade name “UPO ^R FPG6 0 ", thickness 6 0 / zm, opacity 8 7%, Inc. Interview Po 'made Corporation), as a second tree fat film 2, an opaque resin film having a heat seal layer (trade name" Interview port ^R IDS 80 ”, thickness 80 μπι, opacity 86%, manufactured by Upo Corporation), as the pseudo-adhesive resin layer 4, an electron beam-curable pseudo-adhesive (trade name“ TU 2 40 FDSS ”, manufactured by Toyo Ink Mfg. Co., Ltd.).

In the series of lines shown in Fig. 13, first, a printing layer D is applied to the surface of the opaque second resin film 2 with an ultraviolet curing ink (21 in the figure), and the ink is cured with an ultraviolet irradiator 25. Then, a printing layer B was applied to the back surface of the opaque first resin film 1 with an ultraviolet curable ink (22 in the figure), and the ink was cured with an ultraviolet irradiator. Next, an electron beam-curable pseudo-adhesive was applied to the surface of the opaque second resin film 2 to a thickness of 30 μm (23 in the figure), and the opaque first resin film 1 and opaque second resin film were applied. After bonding with the resin film 2, the pseudo adhesive was cured with an electron beam irradiator 26. At this time, the accelerating voltage of the electron beam was 100 kV, and the line speed was 4 Om / min. Subsequently, a printing layer A is applied to the surface of the opaque first resin film 1 with an ultraviolet curable ink (24 in the figure), and the ink is hardened by an ultraviolet irradiator 25 to form an opaque resin film Z printing layer D A laminated film composed of / electron beam curing type pseudo-adhesive resin layer / printing layer BZ opaque resin film Z printing layer A was obtained.

Further, in the same manner as in Example 1, a label for in-mold molding and a hollow container to which the label was attached were obtained.

.

(Comparative Example 1)

An adhesive (trade name “Olipine BPS—111” (main component acrylic resin, solvent type) manufactured by Toyo Ink Mfg. Co., Ltd.) is used as the pseudo-adhesive resin layer 4 to a dry weight of 30 g / m ² . Except for coating and drying, use the same composition as in Example 1 (opaque resin film / printing layer D / adhesive transparent resin film printing layer B / hiding layer / printing layer A) Label A hollow container to which the label was attached was obtained. (Comparative Example 2)

Except that a heat-sealable adhesive (trade name: rAdcote 33DW 1790J, manufactured by Toyo Morton Co., Ltd.) was applied as the pseudo-adhesive resin layer 4 so as to have a dry weight of 30 g / m ² , dried, and used. The same labeling as in 1 (opaque resin film Z printing layer DZ heat sealant transparent resin film Z printing layer B / concealing layer / printing layer A) for in-mold molding and a hollow container to which the label is attached are obtained. Was.

(Test example)

The labels for the in-mold molding produced in the above Examples and Comparative Examples and the hollow containers to which the labels were adhered were measured and evaluated by the following methods.

(1) Measurement of the peel strength of the label for in-mold molding

Each in-mold label is made into a strip with a width of 25 mm and pulled at a speed of 300 mm / min using a tensile tester (trade name “Autograph AGS_5 KND”, manufactured by Shimadzu Corporation). Thereby, the peel strength between the first resin film 1 and the second resin film 2 was measured.

(2) Measuring the Gurley stiffness of the label for the in-mold molding

Gurley stiffness of each in-mold molding label was measured according to TAPPI T543PM-84. The measurement was performed in both the MD direction (the machine flow direction during stretching) and the TD direction (the direction perpendicular to the MD direction).

(3) Evaluation of blister suitability

10 hollow containers each with a label attached were molded, and immediately after in-mold molding and 24 hours after molding, the presence or absence of a prister between the container and the second resin film 2, and the first resin film 1 and the first resin film The appearance was evaluated based on the following criteria for the presence or absence of a prister between the two resin films 2.

〇: No pre-staring occurs even after 24 hours of in-mold molding.

△: After 24 hours of in-mold molding, more than half of the pristers are formed. X: Plister is generated in everything immediately after in-mold molding. (4) Evaluation of peelability

Prepare five hollow containers each with a label attached, and assuming that the first resin film 1 that has been pseudo-adhered is actually peeled off, the ease of peeling by human hands and the appearance of printing after peeling are as follows. Evaluation was based on criteria.

〇: All are easily peeled, and the printed state after peeling is also good.

X: The film is broken and difficult to peel, and the printed shape cannot be recognized after peeling. The results are summarized in the following table.

Label for in-mold molding In Item Composition Measurement result Bugle stiffness container First resin pseudo-adhesion Second resin Peel strength and film Resin film (gf / 25mm) Second resin film

MD direction TD direction

Between Example 1 OP U-1 UV-curable type ポ IDS80 50 40 75 〇 Example 2 ポ FPG60 Electron beam-curable type ID IDS80 50 50 1 00 O Comparative example 1 OP U-1 Adhesive ポ po IDS 80 8 40 75 〇 Comparative Example 2 OP U-1 Heat sealant Upo IDS80 550 40 75 〇

Claims

The scope of the claims

1. A peelable ultraviolet-curable and / or electron-beam-curable pseudo-adhesive resin layer 4 is provided between the first resin film 1 and the second resin film 2 having the heat seal layer 3. In-mold label.

2. Between the pseudo-adhesive resin layer 4 and the first resin film 1 or the pseudo-adhesive resin layer

The label for in-mold molding according to claim 1, wherein the peel strength between the fourth resin film 2 and the second resin film 2 is 10 to 500 gf / 25 mm.

3. The pseudo-adhesive resin layer 4 includes the pseudo-adhesive resin layer 41 on the first resin film 1 side and the pseudo-adhesive resin layer 42 on the second resin film 2 side, and the pseudo-adhesive resin layer 41 and the pseudo-adhesive resin layer 4 2. The label for in-mold molding according to claim 1, wherein the peel strength between the label and the label No. 2 is 10 to 500 gf / 25 mm.

4. The surface of the first resin film 1 on the side of the pseudo-adhesive resin layer 4 and the surface of the second resin film 2 on the side of the pseudo-adhesive resin layer 4 for adjusting the peel strength with the pseudo-adhesive resin layer 4. The label for in-mold molding according to any one of claims 1 to 3, wherein the label is subjected to a surface treatment.

5. The label for in-mold molding according to any one of claims 1 to 4, wherein the Gurley stiffness of the label is from 10 to 100.

6. The label for in-mold molding according to any one of claims 1 to 5, wherein the resin film layer 2 is stretched at least in a uniaxial direction.

7. The label for in-mold molding according to claim 6, wherein the heat seal layer 3 is stretched at least in a uniaxial direction.

8. The label for mold molding according to any one of claims 1 to 6, wherein the heat seal layer 3 is provided by a coating method or a lamination method.

9. The label for in-mold molding according to any one of claims 1 to 8, wherein the first resin film 1 includes a concealing layer 5 on a surface thereof.

10. The method according to any one of claims 1 to 9, wherein a printed layer is provided on at least one side of the first resin film 1 and / or at least one side of the second resin film 2. For imprint molding.

11. The in-mold molding label according to claim 9 or 10, comprising a printing layer on the surface of the concealing layer 5.

12. The label for in-mold molding according to any one of claims 9 to 11, wherein the label comprises a concealable layer 5 on at least one surface of the second resin film 2.

13. The in-mold molding label according to claim 12, wherein a printing layer is provided between the concealing layer 5 'and the pseudo-adhesive resin layer 4. .

14. The label for in-mold molding according to any one of claims 1 to 13, wherein the first resin film 1 is a transparent resin film.

15. The second resin film 2 is a transparent resin film.

Item 15. The label for in-mold molding according to any one of Items 1-4.

16. The in-mold molding label according to any one of claims 1 to 13 or 15, wherein the first resin film 1 is an opaque resin film.

17. The label for in-mold molding according to any one of claims 9 to 11, comprising a print layer on the surface of the heat seal layer 3.

18. The label for in-mold molding according to any one of claims 1 to 14 or 16, wherein the second resin film 2 is an opaque resin film.

19. The first resin film 1 or the second resin film 2 is a transparent resin film, and the pseudo-adhesive resin layer 4 is an ultraviolet-curable adhesive resin layer. The label for in-mold molding according to any one of the above.

20. The label for forming imino reddo according to any one of claims 1 to 13, wherein the pseudo adhesive resin layer 4 is an electron beam curable adhesive resin layer.

21. The label for in-mold molding according to any one of claims 1 to 20, wherein the label for in-mold molding is stamped into a pattern.

22. The label for in-mold molding according to claim 21, wherein a peeling opening for peeling the first resin film is formed. Rin mold molding label.

23. A container to which the label for in-mold molding according to any one of claims 1 to 22 is attached.

24. The container according to claim 23, wherein the container is manufactured by differential pressure molding, blow molding, injection molding, foam molding, or compression molding.