WO2005024871A1 - キーパッド及びその製造方法 - Google Patents
キーパッド及びその製造方法 Download PDFInfo
- Publication number
- WO2005024871A1 WO2005024871A1 PCT/JP2004/012251 JP2004012251W WO2005024871A1 WO 2005024871 A1 WO2005024871 A1 WO 2005024871A1 JP 2004012251 W JP2004012251 W JP 2004012251W WO 2005024871 A1 WO2005024871 A1 WO 2005024871A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin
- key
- keypad
- silicone
- presser
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/02—Details
- H01H13/04—Cases; Covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H25/00—Switches with compound movement of handle or other operating part
- H01H25/04—Operating part movable angularly in more than one plane, e.g. joystick
- H01H25/041—Operating part movable angularly in more than one plane, e.g. joystick having a generally flat operating member depressible at different locations to operate different controls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2791/00—Shaping characteristics in general
- B29C2791/001—Shaping in several steps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/003—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
- B29C69/02—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore of moulding techniques only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2021/00—Use of unspecified rubbers as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2283/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen or carbon only, in the main chain, as reinforcement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/46—Knobs or handles, push-buttons, grips
- B29L2031/466—Keypads, keytops
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H25/00—Switches with compound movement of handle or other operating part
- H01H25/04—Operating part movable angularly in more than one plane, e.g. joystick
- H01H2025/048—Operating part movable angularly in more than one plane, e.g. joystick having a separate central push, slide or tumbler button which is not integral with the operating part that surrounds it
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2209/00—Layers
- H01H2209/002—Materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2221/00—Actuators
- H01H2221/002—Actuators integral with membrane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2221/00—Actuators
- H01H2221/008—Actuators other then push button
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2221/00—Actuators
- H01H2221/05—Force concentrator; Actuating dimple
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2229/00—Manufacturing
- H01H2229/044—Injection moulding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2231/00—Applications
- H01H2231/022—Telephone handset
Definitions
- the present invention relates to a configuration, a material, and a manufacturing method of a keypad including a pusher, which constitutes a keypad for a mobile phone, a personal digital assistant (PDA) such as a mopile device.
- PDA personal digital assistant
- a key unit is a kind of component constituting a mopile device, and is an arrangement in which a large number of switch operation keys (push buttons) are collected and arranged on one sheet surface.
- FIG. 1 is a perspective view of an example of such a key unit 4 as viewed obliquely from above.
- the part that looks like a slightly larger circle at the upper right of the figure is a collective key called a multi-directional key etc.
- the key force to operate the (direction) switch is put together into one.
- the keys arranged in three rows to the left are called the numeric keypad etc., and are keys that operate one switch each.
- Each key has a soft elastomer one (for example, silicone rubber) keypad and one hard material (for example, polycarbonate resin, hereinafter "PC resin") attached to the surface of the keypad.
- PC resin polycarbonate resin
- a plurality of such keys are arranged in one plane to constitute one key unit 4. When a circuit board having switch elements is brought into close contact with the lower surface of the key unit at a position corresponding to the presser 3 of each key, a series of key switch groups are formed.
- the presser is integrally formed of the same material as the keypad.
- the resin is formed by a hard resin (for example, a PC resin) (hereinafter referred to as “resin chip 5”), and this resin chip is set in advance in a keypad mold and the insert molding method is performed. A method of implanting in place of the pad was considered.
- a hard resin for example, a PC resin
- Patent Document 1 Japanese Patent Application Laid-Open No. 2002-279860
- Figs. 2 and 3 show two examples of multi-directional keys in which a resin chip is embedded in a keypad, prepared by the method of Patent Document 1.
- Fig. 2 shows a four-way key with a confirmation key that operates a total of five dome switches in the center and four around it with one key top.
- Fig. 3 is also a four-way key with a confirmation key.
- both the key top and the key pad are thinly formed, and the shape of the resin chip is also disk-shaped. In this case, there is a problem in the bonding strength where the bonding area between the key pad and the resin chip is narrow.
- the resin chip is made of gold in order to securely bond the silicone rubber and the resin chip.
- the resin chip is made of gold in order to securely bond the silicone rubber and the resin chip.
- FIG. 1 is a perspective view showing the overall shape of a key unit including a multidirectional key.
- FIG. 2 is a cross-sectional view showing an example of a multidirectional key in which a resin chip is implanted by an insert molding method.
- FIG. 3 is a cross-sectional view showing another example of the multidirectional key in which the resin chip is implanted by the insert molding method.
- FIG. 4 is a cross-sectional view showing the structure of a mold provided with a recess for carrying out the insert molding method of Example 1.
- FIG. 5 is a cross-sectional view showing a multidirectional key created using the mold of FIG.
- FIG. 6 is a sectional view showing the structure of a mold provided with a recess for carrying out the insert molding method of Example 2.
- FIG. 7 is a cross-sectional view showing a multidirectional key created using the mold of FIG. Disclosure of the invention
- the object of the present invention is to provide a presser 3 capable of pressing a switch element with less key stroke loss and clear click feeling, and the process also requires more processing than the insert molding method using a conventional resin chip. It is an object of the present invention to find a configuration, a material and a manufacturing method of a new elastomer-made keypad 2 that can be simplified.
- an elastomeric one-key pad including a pressing element for pressing a switch element, which is formed of a thermosetting liquid resin, and a method of manufacturing the same.
- thermosetting liquid resin employed in the present invention may be a general thermosetting resin such as epoxy resin or phenol resin, or trifunctional (T unit) or tetrafunctional (Q unit) in the molecule.
- a silicone resin that is a polyorganosiloxane containing a siloxane unit is suitable.
- silicone resin it is possible to use methylphenyl-based straight silicone resin containing methyl group and phenyl group in the molecule, or various silicone-modified organic resin (eg silicone-modified epoxy resin).
- thermosetting liquid resin As the thermosetting liquid resin, silicone rubber is desirable.
- thermoplastic elastomers such as polyester, urethane, and polyamide are desirable.
- the main body of the keypad 2 is made of silicone rubber and the presser 3 is made of silicone resin
- a catalyst is added to the presser-forming recess in the keypad mold (in the case of one-pack system)
- the silicone resin in which solution A and solution B are mixed with the catalyst (in the case of two-component type), is dropped and heated to a predetermined temperature, the crosslinking curing reaction proceeds to start curing the silicone resin.
- a press made of silicone resin is formed in the keypad mold, and it becomes the insert in the insert molding method as it is. Then, when the silicone resin of the presser is in a semi-cured state, silicone rubber is supplied to the keypad mold and molding is performed by the compression molding method or the liquid injection molding method (LIM).
- LIM liquid injection molding method
- the thermosetting resin is dropped to the presser-forming recess in the keypad mold and By heating the resin at a predetermined temperature, the thermosetting resin starts to be cured, and a pushing member made of the thermosetting resin is formed in the keypad molding die, and it becomes an insert in the insert molding method as it is. Then, when the thermosetting resin of the presser is in a semi-cured state, the thermoplastic elastomer is injected to form a keypad in which the presser and the keypad body are integrated. In this case, for example, not only the presser but also the key top can be simultaneously integrally molded by a two-color molding method.
- Patent Document 1 requires a resin chip molding step which is completely different from the keypad molding step, whereas the method of the present invention requires a thermosetting liquid resin presser and a key. Since the pad body is formed using the same mold, it is much more efficient.
- the silicone resin pusher has a moderate elasticity that is softer than that of the PC resin, the click feeling is softer than that of the PC resin, and the clarity of the click feeling also changes. There is a feature that there is no.
- FIGS. 4 and 5 show Example 1 in which a silicone resin is used as a thermosetting liquid resin for forming a presser, and a silicone rubber is used as an elastomer for forming a keypad body.
- FIG. 4 shows gold for producing the four-way key with a confirmation key shown in FIG. 2 by the method of the present invention
- FIG. 10 is a cross-sectional view showing the configuration of molds 51 and 52. On the surface of the lower mold 52 facing the cavity 53, a recess 71 for forming a silicone resin plunger is provided.
- the silicone resin methylphenylsilicone resin belonging to straight silicone resin was used.
- the juice and the juice are mixed in a ratio of 1: 1, defoamed, dropped from the injector 8 to the saucer 71, left for about 30 seconds, and when the silicone resin starts to cure, the silicone rubber material is made of gold.
- the mold was placed on the surface of the mold 53, the molds 51 and 52 were closed, and primary vulcanization was carried out at 170 ° C. for about 3 minutes, and then secondary vulcanization was carried out at 200 ° C. for about 1 hour.
- a so-called liquid injection molding method may be used in which liquid silicone rubber is injected into a mold by a compression molding method using silicone rubber cloth.
- FIG. 5 is a cross-sectional view of a four-way key with a confirmation key created using the molds 51 and 52 of FIG.
- the configuration in which the key top 1 made of hard resin is placed on the silicone rubber keypad 2 having the pressers 3 formed integrally is the same as that of FIG. Instead of 4, a silicone resin pusher 41 is provided.
- the shape of the pusher 41 is an inverted truncated cone with its end rounded, and its top surface is joined to the back surface of the keypad 2.
- the resin chip in Fig. 2 is easy to chip and the silicone rubber layer is interposed between the top surface of the presser bar 41 and the hard resin key top 1 to improve the click feeling. It is
- FIG. 6 and FIG. 7 show Example 2 using silicone resin as the thermosetting liquid resin forming the presser and silicone rubber as the elastomer 1 forming the keypad body, as in the above-mentioned Example 1. It is a thing.
- FIG. 6 is a cross-sectional view showing the configuration of dies 61 and 62 for producing the four-way key with a confirmation key shown in FIG. 3 by the method of the present invention.
- a recess 72 for forming a silicone resin plunger, into which the syringe 8 force, a mixed solution 9 of silicone resin is dropped.
- the type of silicone resin, handling, method and the like are the same as in Example 1.
- FIG. 7 is a cross-sectional view of a four-way key with a confirmation key created using the molds 61 and 62 of FIG. Ru.
- the configuration in which the hard resin key top 11 is placed on the silicone rubber keypad 21 having the integrally formed pushers 3 is the same as that of FIG. Instead, a silicone resin pusher 42 is provided. In order to improve the click feeling and to increase the bonding area, the top surface of the silicone resin pusher 42 is bonded to the back surface of the key pad 21.
- the secondary vulcanized silicone resin-silicone rubber joint (without primer treatment) is greater than the conventional PC resin chip-silicone rubber joint (with primer treatment). , Show good bonding strength.
- the present invention relates to a mopile device such as a mobile phone and a personal digital assistant (PDA) that occupies an important position in the information industry and the communication device manufacturing industry, and more specifically, to the invention for a mopile device
- PDA personal digital assistant
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Manufacture Of Switches (AREA)
- Push-Button Switches (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04772207A EP1662527A4 (en) | 2003-09-03 | 2004-08-26 | KEYBOARD AND MANUFACTURING METHOD |
MXPA06002438A MXPA06002438A (es) | 2003-09-03 | 2004-08-26 | Teclado numerico y metodo de fabricacion del mismo. |
US10/570,462 US20060284344A1 (en) | 2003-09-03 | 2004-08-26 | Key-pad and method of producing the same |
BRPI0414050-8A BRPI0414050A (pt) | 2003-09-03 | 2004-08-26 | teclado e processo de fabricação do mesmo |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003-310960 | 2003-09-03 | ||
JP2003310960A JP2005079036A (ja) | 2003-09-03 | 2003-09-03 | キーパッド及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005024871A1 true WO2005024871A1 (ja) | 2005-03-17 |
Family
ID=34269686
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/012251 WO2005024871A1 (ja) | 2003-09-03 | 2004-08-26 | キーパッド及びその製造方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US20060284344A1 (ja) |
EP (1) | EP1662527A4 (ja) |
JP (1) | JP2005079036A (ja) |
KR (1) | KR20060076763A (ja) |
CN (1) | CN1836300A (ja) |
BR (1) | BRPI0414050A (ja) |
MX (1) | MXPA06002438A (ja) |
WO (1) | WO2005024871A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6925119B2 (en) | 2001-09-20 | 2005-08-02 | Stmicroelectronics S.R.L. | Process and system for the compression of digital video signals, a system and a computer program product therefor |
WO2007018053A1 (ja) * | 2005-08-05 | 2007-02-15 | Shin-Etsu Polymer Co., Ltd. | キーフレームおよび押釦スイッチ用カバー部材 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5025425B2 (ja) * | 2007-10-31 | 2012-09-12 | 三洋電機株式会社 | 携帯機器 |
CN102760588A (zh) * | 2011-04-25 | 2012-10-31 | 机智创新股份有限公司 | 开关及其形成方法 |
EP3018681A1 (de) | 2014-11-10 | 2016-05-11 | Abatek International AG | Flexible schaltmatte und deren verwendung |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06309988A (ja) * | 1993-04-20 | 1994-11-04 | Shinano Polymer Kk | 硬質キートップ押釦スイッチ用カバー部材 |
JPH0686238U (ja) * | 1993-05-26 | 1994-12-13 | しなのポリマー株式会社 | 押釦スイッチ |
JP2001351461A (ja) * | 2000-06-07 | 2001-12-21 | Mitsubishi Electric Corp | 押しボタン構造 |
JP2002279860A (ja) * | 2001-03-15 | 2002-09-27 | Sunarrow Ltd | 多方向キー及びその製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3144084C2 (de) * | 1981-11-06 | 1988-08-18 | Preh, Elektrofeinmechanische Werke Jakob Preh Nachf. Gmbh & Co, 8740 Bad Neustadt | Verfahren zur Herstellung einer für ein Drucktastenfeld geeigneten Kontaktmatte |
JPS58140229A (ja) * | 1982-02-15 | 1983-08-19 | Fuji Gomme Kk | キ−トツプ一体型接点ゴムの製造方法 |
DE3569697D1 (en) * | 1984-03-21 | 1989-06-01 | Franz Sterner | Method for producing injection-moulded parts, and injection mould for carrying out this method |
US4818829A (en) * | 1987-07-09 | 1989-04-04 | Duralith Corporation | Integrally molded composites of silicone rubber |
TW328924B (en) * | 1995-06-09 | 1998-04-01 | Daisei Plastic Kk | A method for assembling a control panel of an electronic apparatus |
US5714104A (en) * | 1995-06-12 | 1998-02-03 | Outboard Marine Corporation | Method of molding FRP parts |
-
2003
- 2003-09-03 JP JP2003310960A patent/JP2005079036A/ja active Pending
-
2004
- 2004-08-26 BR BRPI0414050-8A patent/BRPI0414050A/pt not_active Application Discontinuation
- 2004-08-26 CN CNA2004800236485A patent/CN1836300A/zh active Pending
- 2004-08-26 WO PCT/JP2004/012251 patent/WO2005024871A1/ja active Application Filing
- 2004-08-26 EP EP04772207A patent/EP1662527A4/en not_active Withdrawn
- 2004-08-26 KR KR1020067003224A patent/KR20060076763A/ko not_active Application Discontinuation
- 2004-08-26 US US10/570,462 patent/US20060284344A1/en not_active Abandoned
- 2004-08-26 MX MXPA06002438A patent/MXPA06002438A/es unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06309988A (ja) * | 1993-04-20 | 1994-11-04 | Shinano Polymer Kk | 硬質キートップ押釦スイッチ用カバー部材 |
JPH0686238U (ja) * | 1993-05-26 | 1994-12-13 | しなのポリマー株式会社 | 押釦スイッチ |
JP2001351461A (ja) * | 2000-06-07 | 2001-12-21 | Mitsubishi Electric Corp | 押しボタン構造 |
JP2002279860A (ja) * | 2001-03-15 | 2002-09-27 | Sunarrow Ltd | 多方向キー及びその製造方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1662527A4 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6925119B2 (en) | 2001-09-20 | 2005-08-02 | Stmicroelectronics S.R.L. | Process and system for the compression of digital video signals, a system and a computer program product therefor |
WO2007018053A1 (ja) * | 2005-08-05 | 2007-02-15 | Shin-Etsu Polymer Co., Ltd. | キーフレームおよび押釦スイッチ用カバー部材 |
US7999204B2 (en) | 2005-08-05 | 2011-08-16 | Shin-Etsu Polymer Co., Ltd. | Key frame and cover member for push button switch |
Also Published As
Publication number | Publication date |
---|---|
EP1662527A4 (en) | 2009-04-29 |
KR20060076763A (ko) | 2006-07-04 |
CN1836300A (zh) | 2006-09-20 |
BRPI0414050A (pt) | 2006-11-07 |
MXPA06002438A (es) | 2006-06-20 |
JP2005079036A (ja) | 2005-03-24 |
US20060284344A1 (en) | 2006-12-21 |
EP1662527A1 (en) | 2006-05-31 |
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