WO2005022566A1 - « procede et systeme de realisation de composants inductifs supraconducteurs en couches minces, et dispositifs incluant de tels composants - Google Patents
« procede et systeme de realisation de composants inductifs supraconducteurs en couches minces, et dispositifs incluant de tels composants Download PDFInfo
- Publication number
- WO2005022566A1 WO2005022566A1 PCT/FR2004/001873 FR2004001873W WO2005022566A1 WO 2005022566 A1 WO2005022566 A1 WO 2005022566A1 FR 2004001873 W FR2004001873 W FR 2004001873W WO 2005022566 A1 WO2005022566 A1 WO 2005022566A1
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- WO
- WIPO (PCT)
- Prior art keywords
- superconductive
- inductive component
- stack
- component
- produced
- Prior art date
Links
- 230000001939 inductive effect Effects 0.000 title claims abstract description 64
- 238000000034 method Methods 0.000 title claims abstract description 43
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 238000000151 deposition Methods 0.000 claims abstract description 27
- 238000005530 etching Methods 0.000 claims abstract description 18
- 230000008021 deposition Effects 0.000 claims description 12
- 239000007943 implant Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 5
- 230000010363 phase shift Effects 0.000 claims description 5
- 238000001914 filtration Methods 0.000 claims description 3
- 239000010408 film Substances 0.000 description 38
- 238000010586 diagram Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000012212 insulator Substances 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 230000007123 defense Effects 0.000 description 2
- 238000002059 diagnostic imaging Methods 0.000 description 2
- 238000000608 laser ablation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004870 electrical engineering Methods 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000009643 growth defect Effects 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007736 thin film deposition technique Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/364—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith using a particular conducting material, e.g. superconductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/047—Printed circuit coils structurally combined with superconductive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F6/00—Superconducting magnets; Superconducting coils
- H01F6/06—Coils, e.g. winding, insulating, terminating or casing arrangements therefor
Definitions
- the present invention relates to a method for producing superconductive inductive components in thin layers. It also relates to an embodiment system implementing this method, as well as devices including such components.
- This invention is in the field of superconductive electrical and electronic components for the telecommunications and electrical energy sectors.
- the production of superconductive inductive components in thin layers is generally carried out by depositing a superconductive film, generally by vacuum methods such as sputtering or pulsed laser ablation, then the definition by photo lithography of one or more turns. In this technique the dimension of the device increases with the value of its inductance.
- a practical example of embodiment consists of a coil comprising 5 turns whose external diameter is 15mm, with tracks of 0.4mm in width spaced 0.3mm having an inductance of 2.12 ⁇ H, which is described in the thesis dissertation. supported by Jean-Christophe Ginefri on December 16, 1999 at the University of Paris XI and entitled "Miniature superconductive surface antenna for RN imaging at 1.5 Tesla".
- the technique described above has two main drawbacks: - the area occupied by each inductive component is significant. For example, the component described in the previous paragraph occupies an area of more than 700mm 2 :
- This objective is achieved with a process for producing a superconductive inductive component in the form of one or more line segments with a surface area of the order of a few hundred square microns consisting of a stack of alternately superconductive and insulating films. . At least one of these line segments then integrates at least one part constituting one of the terminals of the component.
- This method makes it possible in particular to produce an inductive superconductive component having at least two terminals, this component comprising at least one line segment integrating at least one terminal of the component, this line segment constituting a conductive or superconductive layer within at least one stack of alternately superconductive and insulating films.
- each film constituting the stack is perfectly crystallized.
- the device is dimensioned so that in working conditions it is in the eissner state, that is to say the state in which it has no measurable direct current dissipation.
- the proposed device can be produced from any pair of materials making it possible to produce a stack of alternately superconductive and insulating films below a temperature called the critical temperature.
- a first manufacturing process comprises the following steps: 1) deposition of a superconductive film 2) deposition of the stack of alternately superconductive and insulating films 3) etching of all of the films deposited, for example in the form of a simultaneous etching of the stack and of the superconductive film, 4) selective etching of the stack, produced in such a way as to leave it only remaining locations where one wishes to install an inductive component.
- a second manufacturing process can also be implemented with the following steps: 1) depositing a superconductive film
- a third possible process includes the following steps: 1) deposition of a superconductive film
- a fourth possible process comprises the following steps: 1) deposition of the stack of alternately superconductive and insulating films 2) selective etching of the stack, carried out so as to leave it remaining only at the locations where it is desired implant an inductive component. 3) connection of the inductive components thus produced to the rest of the circuit by superconductive connections or not.
- a system is proposed for producing a superconductive inductive component in the form of one or more line segments constituted by a stack of alternately superconductive and insulating films, implementing the method according to the invention. 'invention.
- this embodiment system comprises:
- an antenna device comprising an electronic circuit including a superconductive inductive component produced by the method according to the invention.
- a delay line device is proposed comprising an inductive component in series and a capacitive component in parallel downstream of said inductive component, characterized in that the inductive component is a superconductive inductive component produced by the method according to the invention.
- Delay lines according to the invention can be implemented in a phase shift radar device comprising a plurality of antennas each comprising an electronic circuit including a delay line according to the invention, this delay line being arranged so that each of said antennas emits a signal whose phase is offset from that of neighboring antennas.
- an electronic frequency filtering device comprising an electronic circuit including a superconductive inductive component produced by the method according to the invention. It may for example be a high-pass filter comprising in parallel an inductive component and in series a capacitive component downstream of said inductive component, where this inductive component is a superconductive inductive component produced by the method according to the invention.
- FIG. 3A is a photograph of the pattern used for the tests showing the location of the inputs of current II and 12, the measurement pads VI and V2 of the potential difference at the terminals of the bridge as well as the location thereof;
- - Figure 3B shows the photolithography mask used to make the test pattern of Figure 3A;
- - Figure 4 is a diagram of the measuring device used to characterize a superconductive inductive component according to the invention;
- - Figure 5 illustrates a potential difference measured between pads VI and V2 (solid lines) when a sawtooth current at the frequency of 1000Hz (dotted lines) flows in the sample;
- - Figure 7 illustrates a delay line implementing a superconductive inductive component according to the invention;
- - Figure 8 is a block diagram of a phase shift antenna;
- - Figure 9 is a block diagram of a high pass filter;
- - Figure 10 is a block diagram of a low-pass filter.
- the principle implemented in the production method according to the invention resides in a stack E of alternately superconductive thin films Cl and insulating C2 deposited on a substrate S, with reference to FIG. 1, or else on a superconductive line LS.
- the first film deposited to make the stack E is insulating as indicated in FIG. 1.
- the integration of inductive components in a superconductive circuit can be carried out as indicated in the figures 2A and 2B using the thin film deposition techniques well known to those skilled in the art, for example laser ablation, radio frequency cathode sputtering, vacuum evaporation, chemical vapor deposition and generally any deposition technique allowing the production of thin layers. It should be noted that in this particular version of the method according to the invention corresponding to FIGS.
- the materials chosen are the compounds YBa 2 Cu 3 0 7 - ⁇ for the superconductive films and LaA10 3 for the insulating films.
- the thicknesses are lOnm (10 _8 m) for the superconductive films and 4nm (4.10 "9 m) for the insulating films. 14 pairs of films were deposited. After deposition, the films were etched so as to obtain the pattern represented in FIG.
- the measuring device used to characterize the samples of inductive superconductive components according to the invention includes a GBF generator creating a variable current in time
- the generator delivers a sawtooth current at the frequency of 1000Hz.
- the value of the current I (t) was directly reported. It is observed that the potential difference V (t) between VI and V2 has the form of slots, which indicates that V (t) is proportional to the derivative with respect to the time of I (t). This characteristic indicates that the sample behaves well as an inductive component.
- the signals V (t) measured at 700 Hz and 2 kHz have been reported in FIG. 6 for a value of the peak current equal to 10 ⁇ A in both cases.
- the ratio of the amplitude of the signals obtained is in the ratio of the applied frequencies, which again is typical of an inductive component. From the results presented in FIG. 6, it is deduced that the inductance of the component produced according to the invention is equal to 535 ⁇ H ⁇ 10 ⁇ H. The components tested did not all have such a high inductance, but values of the order of a few tens of ⁇ H were commonly obtained with components of identical shape to that presented here.
- the superconductive inductive components obtained by the method according to the invention can find applications in the fields of electronics or electrical engineering, antennas and passive components at high frequency, in particular for medical imaging, or radars. and defense electronics.
- inductive superconductive components are implemented in antenna systems.
- MRI surface magnetic resonance medical imaging
- tuned antennas are used.
- An important parameter involved in the efficiency of the antenna is the overvoltage coefficient which is proportional to its inductance.
- a superconductive antenna makes it possible to increase this coefficient because its ohmic resistance is very low. We can think of obtaining a further increase in the overvoltage coefficient by including in the antenna circuit a device of the type described here.
- inductive superconductive components are implemented in delay lines.
- Delay lines are in common use in all areas of electronics.
- the simplest form that a delay line can take is shown in Figure 7.
- the presence in the circuit of inductance L and capacitor C causes a phase difference between voltage V and current I.
- An example d he use is of phase shift radars which allow the exploration of the surrounding space with a system of fixed antennas.
- a block diagram for such a system is shown in Figure 8.
- the main line carrying the current I is coupled to the various antennas.
- Each of these has a delay line in its circuit. As a result, each antenna emits a signal whose phase is offset from that of neighboring antennas.
- inductive components allows integrated circuits to be produced filters comprising only capacitors and inductors, which are not dissipative compared to filters constructed with capacitors and resistors.
- the invention is not limited to the examples which have just been described and numerous modifications can be made to these examples without departing from the scope of the invention.
- the number of respectively insulating and superconductive films is not limited to the examples described.
- the dimensions of the superconductive inductive components as well as their surfaces can change according to the specific applications of these components.
- the respectively superconductive and insulating films can be produced from compounds other than those proposed in the example described, provided that these compounds satisfy the physical conditions required for the applications.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
- Details Of Aerials (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006521609A JP2007503107A (ja) | 2003-07-28 | 2004-07-16 | 薄い超伝導層を含んだ誘導素子を製造する方法及びシステム並びに同素子を含む装置 |
EP04767697A EP1649473A1 (fr) | 2003-07-28 | 2004-07-16 | Procede et systeme de realisation de composants inductifs supraconducteurs en couches minces, et dispositifs incluant de tels composants |
US10/566,070 US20080039332A1 (en) | 2003-07-28 | 2004-07-16 | Method and System for the Production of Superconducting Inductive Components Comprising Thin Layers, and Devices Containing Such Components |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR03/09212 | 2003-07-28 | ||
FR0309212A FR2858463B1 (fr) | 2003-07-28 | 2003-07-28 | Procede et systeme de realisation de composants inductifs supraconducteurs en couches minces, et dispositifs incluant de tels composants |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005022566A1 true WO2005022566A1 (fr) | 2005-03-10 |
Family
ID=34043577
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/FR2004/001873 WO2005022566A1 (fr) | 2003-07-28 | 2004-07-16 | « procede et systeme de realisation de composants inductifs supraconducteurs en couches minces, et dispositifs incluant de tels composants |
Country Status (5)
Country | Link |
---|---|
US (1) | US20080039332A1 (fr) |
EP (1) | EP1649473A1 (fr) |
JP (1) | JP2007503107A (fr) |
FR (1) | FR2858463B1 (fr) |
WO (1) | WO2005022566A1 (fr) |
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US9444213B2 (en) | 2009-03-09 | 2016-09-13 | Nucurrent, Inc. | Method for manufacture of multi-layer wire structure for high efficiency wireless communication |
US11476566B2 (en) | 2009-03-09 | 2022-10-18 | Nucurrent, Inc. | Multi-layer-multi-turn structure for high efficiency wireless communication |
US9439287B2 (en) | 2009-03-09 | 2016-09-06 | Nucurrent, Inc. | Multi-layer wire structure for high efficiency wireless communication |
US8855786B2 (en) | 2009-03-09 | 2014-10-07 | Nucurrent, Inc. | System and method for wireless power transfer in implantable medical devices |
US9208942B2 (en) * | 2009-03-09 | 2015-12-08 | Nucurrent, Inc. | Multi-layer-multi-turn structure for high efficiency wireless communication |
US9232893B2 (en) | 2009-03-09 | 2016-01-12 | Nucurrent, Inc. | Method of operation of a multi-layer-multi-turn structure for high efficiency wireless communication |
US9306358B2 (en) | 2009-03-09 | 2016-04-05 | Nucurrent, Inc. | Method for manufacture of multi-layer wire structure for high efficiency wireless communication |
US9300046B2 (en) | 2009-03-09 | 2016-03-29 | Nucurrent, Inc. | Method for manufacture of multi-layer-multi-turn high efficiency inductors |
AU2010300364A1 (en) * | 2009-10-02 | 2012-05-24 | Ambature L.L.C. | Extremely low resistance films and methods for modifying or creating same |
US9287844B2 (en) * | 2011-07-07 | 2016-03-15 | Kemet Electronics Corporation | Surface mountable multi-layer ceramic filter |
US10063100B2 (en) | 2015-08-07 | 2018-08-28 | Nucurrent, Inc. | Electrical system incorporating a single structure multimode antenna for wireless power transmission using magnetic field coupling |
US11205848B2 (en) | 2015-08-07 | 2021-12-21 | Nucurrent, Inc. | Method of providing a single structure multi mode antenna having a unitary body construction for wireless power transmission using magnetic field coupling |
US9941743B2 (en) | 2015-08-07 | 2018-04-10 | Nucurrent, Inc. | Single structure multi mode antenna having a unitary body construction for wireless power transmission using magnetic field coupling |
US9948129B2 (en) | 2015-08-07 | 2018-04-17 | Nucurrent, Inc. | Single structure multi mode antenna for wireless power transmission using magnetic field coupling having an internal switch circuit |
US9960629B2 (en) | 2015-08-07 | 2018-05-01 | Nucurrent, Inc. | Method of operating a single structure multi mode antenna for wireless power transmission using magnetic field coupling |
US10658847B2 (en) | 2015-08-07 | 2020-05-19 | Nucurrent, Inc. | Method of providing a single structure multi mode antenna for wireless power transmission using magnetic field coupling |
US9960628B2 (en) | 2015-08-07 | 2018-05-01 | Nucurrent, Inc. | Single structure multi mode antenna having a single layer structure with coils on opposing sides for wireless power transmission using magnetic field coupling |
US9941729B2 (en) | 2015-08-07 | 2018-04-10 | Nucurrent, Inc. | Single layer multi mode antenna for wireless power transmission using magnetic field coupling |
US10636563B2 (en) | 2015-08-07 | 2020-04-28 | Nucurrent, Inc. | Method of fabricating a single structure multi mode antenna for wireless power transmission using magnetic field coupling |
US9941590B2 (en) | 2015-08-07 | 2018-04-10 | Nucurrent, Inc. | Single structure multi mode antenna for wireless power transmission using magnetic field coupling having magnetic shielding |
WO2017031348A1 (fr) | 2015-08-19 | 2017-02-23 | Nucurrent, Inc. | Configurations d'antenne sans fil multimode |
US10069662B2 (en) | 2015-11-10 | 2018-09-04 | Infineon Technologies Ag | Mixed analog-digital pulse-width modulator |
US9800236B2 (en) | 2015-11-10 | 2017-10-24 | Infineon Technologies Ag | Integrated analog delay line of a pulse-width modulator |
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EP3552298A4 (fr) | 2016-12-09 | 2020-01-15 | NuCurrent, Inc. | Substrat configuré pour faciliter un transfert d'énergie par métal par l'intermédiaire d'un couplage magnétique en champ proche |
US10903688B2 (en) | 2017-02-13 | 2021-01-26 | Nucurrent, Inc. | Wireless electrical energy transmission system with repeater |
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US11831174B2 (en) | 2022-03-01 | 2023-11-28 | Nucurrent, Inc. | Cross talk and interference mitigation in dual wireless power transmitter |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0455527A1 (fr) * | 1990-04-03 | 1991-11-06 | Sumitomo Electric Industries, Ltd. | Circuit résonant À ligne microbande composé d'oxyde supraconducteur |
GB2272111A (en) * | 1992-11-02 | 1994-05-04 | Gen Electric | High-frequency superconductive inductor for a power conversion system |
WO1994013028A1 (fr) * | 1992-12-01 | 1994-06-09 | Superconducting Core Technologies, Inc. | Dispositifs syntonisables a micro-ondes comprenant des couches supraconductrices et ferroelectriques a haute temperature |
EP0735606A1 (fr) * | 1995-03-27 | 1996-10-02 | Murata Manufacturing Co., Ltd. | Electrode multicouche supraconducteur et procédé de sa fabrication |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03194979A (ja) * | 1989-12-22 | 1991-08-26 | Sumitomo Electric Ind Ltd | マイクロ波共振器 |
DE69116422D1 (de) * | 1990-05-18 | 1996-02-29 | Ibm | Supraleitendes Mehrschichtkeramiksubstrat |
JP2560001Y2 (ja) * | 1991-09-04 | 1998-01-21 | 三菱電機株式会社 | 送受信モジュール |
US5472935A (en) * | 1992-12-01 | 1995-12-05 | Yandrofski; Robert M. | Tuneable microwave devices incorporating high temperature superconducting and ferroelectric films |
CN1122327C (zh) * | 1993-08-27 | 2003-09-24 | 株式会社村田制作所 | 高频电磁场耦合的薄膜多层电极 |
US6239674B1 (en) * | 1993-12-27 | 2001-05-29 | Matsushita Electric Industrial Co., Ltd | Elliptical resonator with an input/output capacitive gap |
KR0175359B1 (ko) * | 1995-12-15 | 1999-02-01 | 양승택 | 초전도체-절연체-초전도체 조셉슨 터널 접합구조의 제조방법 |
US20030036483A1 (en) * | 2000-12-06 | 2003-02-20 | Arendt Paul N. | High temperature superconducting thick films |
FR2866979A1 (fr) * | 2004-02-27 | 2005-09-02 | Centre Nat Rech Scient | Composants supraconducteurs en couches minces a inductance accordable, procede de realisation et dispositifs incluant de tels composants |
FR2880991B1 (fr) * | 2005-01-17 | 2007-04-06 | Centre Nat Rech Scient | Utilisation de composants supraconducteurs en couches minces comme inductance variable, dispositifs incluant de tels composants, et procede de commande associe |
-
2003
- 2003-07-28 FR FR0309212A patent/FR2858463B1/fr not_active Expired - Fee Related
-
2004
- 2004-07-16 US US10/566,070 patent/US20080039332A1/en not_active Abandoned
- 2004-07-16 EP EP04767697A patent/EP1649473A1/fr not_active Withdrawn
- 2004-07-16 JP JP2006521609A patent/JP2007503107A/ja active Pending
- 2004-07-16 WO PCT/FR2004/001873 patent/WO2005022566A1/fr active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0455527A1 (fr) * | 1990-04-03 | 1991-11-06 | Sumitomo Electric Industries, Ltd. | Circuit résonant À ligne microbande composé d'oxyde supraconducteur |
GB2272111A (en) * | 1992-11-02 | 1994-05-04 | Gen Electric | High-frequency superconductive inductor for a power conversion system |
WO1994013028A1 (fr) * | 1992-12-01 | 1994-06-09 | Superconducting Core Technologies, Inc. | Dispositifs syntonisables a micro-ondes comprenant des couches supraconductrices et ferroelectriques a haute temperature |
EP0735606A1 (fr) * | 1995-03-27 | 1996-10-02 | Murata Manufacturing Co., Ltd. | Electrode multicouche supraconducteur et procédé de sa fabrication |
Non-Patent Citations (1)
Title |
---|
LEE A E ET AL: "LaAlO3-YBCO multilayers", IEEE TRANSACTIONS ON MAGNETICS, vol. 27, no. 2, March 1991 (1991-03-01), pages 1365 - 1368, XP002271949, ISSN: 0018-9464 * |
Also Published As
Publication number | Publication date |
---|---|
FR2858463B1 (fr) | 2007-08-24 |
US20080039332A1 (en) | 2008-02-14 |
EP1649473A1 (fr) | 2006-04-26 |
JP2007503107A (ja) | 2007-02-15 |
FR2858463A1 (fr) | 2005-02-04 |
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