WO2005008718A1 - Appareil de traitement en continu de la surface pour un polymere en forme de film, procede de traitement en continu de la surface - Google Patents

Appareil de traitement en continu de la surface pour un polymere en forme de film, procede de traitement en continu de la surface Download PDF

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Publication number
WO2005008718A1
WO2005008718A1 PCT/KR2003/002109 KR0302109W WO2005008718A1 WO 2005008718 A1 WO2005008718 A1 WO 2005008718A1 KR 0302109 W KR0302109 W KR 0302109W WO 2005008718 A1 WO2005008718 A1 WO 2005008718A1
Authority
WO
WIPO (PCT)
Prior art keywords
leading
chamber
film
shaped polymer
processing chamber
Prior art date
Application number
PCT/KR2003/002109
Other languages
English (en)
Inventor
Yong Rak Choi
Original Assignee
Epon Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epon Co., Ltd. filed Critical Epon Co., Ltd.
Priority to AU2003269527A priority Critical patent/AU2003269527A1/en
Publication of WO2005008718A1 publication Critical patent/WO2005008718A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
    • H01J37/32761—Continuous moving
    • H01J37/3277—Continuous moving of continuous material

Definitions

  • the present invention relates to a continuous surface treatment of film-shaped polymer.
  • the present invention relates to an apparatus for continuously performing a
  • a polymer material is widely used for various applications due to the lightness of
  • hydrophilic or hydrophobic property of the surface will significantly affect the wettability
  • One of the typical methods of the chemical treatment is a surface treatment method of fluorine-based polymer using Na NH 3 (see
  • the conditions of treatment process parameters such as atmospheric humidity, or the like.
  • the polymer surface treatment method using plasma under a low pressure includes a
  • Plasma is known as the fourth state of substance distinguishable from solid, liquid and
  • gas may be referred to as partially ionized gas. It usually comprises electrons, positive ions,
  • the plasma treatment has advantages of allowing to select a reactant gas and control the process parameters such as treatment pressure, etc. with compared to the corona treatment, but it also has
  • Korean Patent Publication KR 1987-7562 discloses a surface treatment method which
  • the method includes a process of applying an ion beam including at
  • Korean Patent Publication KR 1997-73239 discloses a surface modification method for
  • the method includes steps of:
  • pulse voltage is -1 kV to -20 kV
  • the voltage in the pulse-off is 0 V to -1 kV
  • the pulse width is 1
  • the pulse frequency is 10 Hz to 500 kHz.
  • liquid crystal display to cause a serious damage on the patterns or the chips thereof.
  • a jig for rotating an object should be employed to perform ion implantation in three-
  • Korean Patent Publication KR 2002-20010 discloses a surface modification method for
  • the method discloses surface treatment of tridimensional polymer material by plasma ion
  • the method has
  • the present invention is directed to a continuous surface treatment method
  • the present invention provides a
  • continuous surface treatment apparatus of film-shaped polymer including a high frequency power
  • supplying device for generating plasma and thus, injecting ions, and having a high frequency - power supplying unit, a matching box, and an antenna, a gas introducing unit for supplying
  • a gas supplying unit connected to the gas introducing unit
  • a processing chamber having a vacuum pump and the like, and further including a leading-in
  • cylindrical plate and the cylindrical-shaped grid being electrically connected to a high voltage
  • the processing chamber may be structured such that two discrete chambers are
  • a second processing chamber may be provided in parallel with the processing chamber, the structure of the
  • second processing chamber being identical or similar to the structure of the processing chamber.
  • the rotating means in the leading-in chamber and the rotating means in the rotating means in the rotating means in the rotating means in the leading-in chamber are arranged in the rotating means in the leading-in chamber and the rotating means in the rotating means in the
  • leading-out chamber may be arranged to operate under synchronous rotary speed in order to roll
  • the present invention provides a continuous
  • implantat on technology which may include the steps of (1) mounting the unprocessed roll stock
  • the method may further
  • process gas including argon, nitrogen, or these rriixture
  • FIG. 1 is a view to illustrate the structural configuration of one specific example of a
  • the continuous surface treatment apparatus of film-shaped polymer As shown in FIG. 1, the continuous surface treatment apparatus of film-shaped polymer
  • a gas introducing unit 71 for supplying process gas to be ionized for plasma; a gas introducing unit 71 for supplying process gas to be ionized for plasma; a gas introducing unit 71 for supplying process gas to be ionized for plasma; a
  • the continuous surface treatment apparatus furthermore, having a vacuum pump and the like.
  • leading-in chamber 11 includes a leading-in chamber 11, and an leading-out chamber 41, which are installed before and
  • cylindrical plate 25 remote a little therefrom inside the processing chamber 21 ;
  • the antenna 28 the gas introducing unit 71 for supplying process gas to be ionized for plasma; the
  • ionized is supplied into the vacuumized processing chamber 21, and a high frequency power is supplied.
  • to the present invention further includes the leading-in chamber 11, and the leading-out chamber
  • film-shaped polymer 52 and the leading-in chamber 11 and the leading-out chamber 41 are gas
  • unprocessed roll stock 51 has the film-shaped polymer 52 as an object wound therethrough.
  • a processed roll stock 61 is installed, and the processed roll stock 61
  • polymer 52 is unrolled from the unprocessed roll stock 51, and passes through the spout located
  • the grooves has a size enough to pass the film-shaped polymer 52 therethrough, and the film-
  • shaped polymer 52 is surface-treated by plasma ion implantation in the processing chamber 21 in
  • the film-shaped polymer 52 can be continuously surface-treated through the above
  • the processing chamber 21 includes a cylindrical plate 25 for holding the film-shaped
  • the grid 24 are injected into the film-shaped polymer 52 so that the surface of the film-shaped
  • polymer 52 is treated.
  • the cylindrical plate 25 and the cylindrical-shaped grid 24 are electrically connected to
  • the pre-processing device may be a fan for supplying hot air
  • a cutoff valve for cutting off the flow of the hot air, and an air
  • compressor for generating hot air, or the like are connected to the pre-processing device.
  • pre-treatment by the pre-processing device helps the ion to implant more de ⁇ ly into the surface
  • the film-shaped polymer 52 can be partially heate
  • the heating temperature varies depending on the types, physical properties, size, and the like of
  • the processing chamber 21 can be structured such that two discrete chambers are
  • a second processing chamber 31 can be provided, in which the structure of the second
  • processing chamber 31 is identical or similar to the structure of the processing chamber 21. That is,
  • the second processing chamber 31 may include a vacuum pump 32, a second high voltage
  • the second processing chamber 31 has a structure identical or similar to the structure of the
  • one surface of the film-shaped polymer 52 can be treated, or by the operation of the both the chamber 21 and the chamber 31, the both surfaces of the film-shaped polymer 52 can be treated, or by the operation of the both the chamber 21 and the chamber 31, the both surfaces of the film-shaped polymer 52 can be
  • the leading-in chamber 11 includes a unprocessed roll stock 51 having unprocessed
  • the leading-out chamber 41 includes
  • means may employ a typical geared motor, or the like. It can be understood that the geared motor
  • polymer 52 can pass through the processing chamber 21 (or the second processing chamber 31)
  • the leading-out chamber 41 are all vacuumized.
  • the plasma treatment is the same as or similar to a typical conventional plasma
  • the film-shaped polymer 52 can be surface-treated continuously. Jn addition, the continuous surface treatment method of the film-shaped polymer
  • modification includes the steps of: (1) mounting the unprocessed roll stock 51 having the film-
  • processing chamber 21 by using plasma (surface-treatment); (5) transferring the surface-treated
  • the (1) leading-in step is to install the unprocessed roll stock 51 having the film-shaped
  • the (2) first vacuumization step is to decompress and gas-exhaust the inside of the
  • leading-in chamber 11 having the unprocessed roll stock 51 installed therein, and the inside of the
  • the (3) first transfer step is to transfer the film-shaped polymer 52 from the unprocessed
  • the (5) second transfer step is to transfer the surface-treated film-shaped polymer
  • the leading-out chamber 41 is drawn out of the chamber 41, and thus, the film-shaped polymer 52
  • wound on the unprocessed roll stock 51 can be placed under continuous surface treatment.
  • a pre-treatment Before or after the (2) first vacuumization step, a pre-treatment can be ftrther performed
  • the pre-treatment is intended to pre-heat the polymer product inside the leading-in chamber 11 to remove moisture or the like therefrom.
  • leading-in chamber 11 leading-in chamber 11 and to facilitate the ion-implantation more deep into the surface of the
  • the surface of the polymer product to remove moisture, and the film-shaped polymer 52 can be
  • the heating temperature is varied depending on the kinds of the polymer
  • the (4) surface-treatment step is performed by supplying process gas including argon,
  • a high voltage is 26 KV to 30 KV.
  • process condition can be varied depending on the kinds, size, shape of the film-shaped polymer
  • LDPE low density polyethylene
  • LLDPE linear low density polyethylene
  • high LDPE high density polyethylene
  • HDPE density polyethylene
  • PP polypropylene
  • PS polystyrene
  • nylon 6 nylon 11, nylon 12, nylon 66, or the like
  • PC polycarbonate
  • polyethylene polyethylene
  • PET terephthalate
  • ABS acrylor ⁇ trile-butadiene-styrene copolymer
  • SAN styrene-acrylonitrile copolymer
  • PPS polyphenylene sulfide
  • PEI polyetherimide
  • PI polyimide
  • MPPO poly phenylene oxide
  • MPSU modified polysulfone
  • MPES modified polyefher
  • PEEK polyether ether ketone
  • polyethylene to be processed is installed inside the leading-in chamber 11 in the form of the
  • the film-shaped polymer 52 is
  • the plasma surface-treatment is performed with process conditions
  • the surface resistance as low as 10 to 10 ⁇ /cm 2 is obtained, thereby improving the antistatic characteristics and the conductibility of the surface of the polymer, or the like, and continuous surface treatment for the film-shaped polymer 52 is possible, thereby making the mass-production of the film-shaped polymer product easy.

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)

Abstract

La présente invention concerne un appareil de traitement en continu de la surface ainsi qu'un procédé de traitement en continu de la surface mis en oeuvre sur la surface d'un polymère en forme de film par implantation d'ions au plasma avec des impulsions de tension négative, afin d'améliorer les caractéristiques antistatiques et la conductibilité de la surface du polymère. L'appareil de traitement en continu de la surface du polymère en forme de film comprend un dispositif d'application de puissance haute fréquence qui génère un plasma et par conséquent, injecte des ions et une unité d'alimentation en puissance haute fréquence, un coffret d'adaptation et une antenne, une unité d'introduction de gaz qui apporte le gaz de traitement devant être ionisé pour le plasma, une unité d'alimentation en gaz qui est reliée à l'unité d'introduction de gaz et une chambre de traitement comprenant une pompe à vide et autre. L'appareil de traitement en continu de la surface comprend également une chambre d'arrivée et une chambre de sortie qui sont installées respectivement avant et après la chambre de traitement et qui sont prévues pour assurer l'extraction du gaz; des passages qui sont situés respectivement dans des parois entre le chambre d'arrivée et la chambre de traitement et entre la chambre de traitement et la chambre de sortie, et qui servent à laisser passer le polymère en forme de film; une plaque cylindrique prévue pour retenir le polymère en forme de film à l'intérieur de la chambre de traitement et une grille de forme cylindrique située à proximité de la plaque cylindrique; la plaque cylindrique et la grille de forme cylindrique étant électriquement reliées à une unité de génération d'impulsions haute tension.
PCT/KR2003/002109 2003-07-22 2003-10-13 Appareil de traitement en continu de la surface pour un polymere en forme de film, procede de traitement en continu de la surface WO2005008718A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003269527A AU2003269527A1 (en) 2003-07-22 2003-10-13 Continuous surface-treating apparatus for film shape of polymer and continuous surface-treating method thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2003-0050175A KR100442309B1 (ko) 2003-07-22 2003-07-22 필름상 중합체의 연속 표면처리장치 및 연속 표면처리방법
KR10-2003-0050175 2003-07-22

Publications (1)

Publication Number Publication Date
WO2005008718A1 true WO2005008718A1 (fr) 2005-01-27

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PCT/KR2003/002109 WO2005008718A1 (fr) 2003-07-22 2003-10-13 Appareil de traitement en continu de la surface pour un polymere en forme de film, procede de traitement en continu de la surface

Country Status (3)

Country Link
KR (1) KR100442309B1 (fr)
AU (1) AU2003269527A1 (fr)
WO (1) WO2005008718A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1866140A1 (fr) * 2005-03-31 2007-12-19 Deog Gu Lim Appareil servant à traiter la surface d'un produit en polymère moulé
JP2021172876A (ja) * 2020-04-30 2021-11-01 株式会社プラズマイオンアシスト 成膜装置及び成膜方法
US11841149B1 (en) 2015-07-08 2023-12-12 Berner International Corporation Enhanced techniques for air curtain control

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100593805B1 (ko) * 2004-02-18 2006-06-26 주식회사 에폰 필름상 중합체에 금속박막을 연속적으로 형성하기 위한장치 및 방법
KR100615632B1 (ko) * 2004-08-13 2006-08-25 김정자 필름상 중합체 처리장치 및 그 처리방법
KR101405174B1 (ko) * 2007-12-10 2014-06-10 주식회사 디엠에스 필름 전처리 시스템

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4322276A (en) * 1979-06-20 1982-03-30 Deposition Technology, Inc. Method for producing an inhomogeneous film for selective reflection/transmission of solar radiation
US5652029A (en) * 1994-03-25 1997-07-29 Semiconductor Energy Laboratory Co., Ltd. Plasma processing apparatus and plasma processing method
KR100217538B1 (ko) * 1996-04-10 1999-09-01 박호군 플라즈마 이온 주입에 의한 고분자 소재의 표면 개질 방법 및 그 장치
JP2001002806A (ja) * 1999-06-21 2001-01-09 Ueno Tekkusu Kk プラズマ表面処理方法及びその装置
KR20010091935A (ko) * 2000-03-14 2001-10-23 이준상 3차원적인 이온 주입에 의한 도전영역 형성방법
JP2001303249A (ja) * 2000-04-19 2001-10-31 Hirano Koon Kk 帯状シート材の表面処理装置
KR20020020010A (ko) * 2000-09-06 2002-03-14 박호군 입체 고분자 재료의 표면처리방법

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010019022A (ko) * 1999-08-24 2001-03-15 구자홍 플라즈마중합 연속처리장치

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4322276A (en) * 1979-06-20 1982-03-30 Deposition Technology, Inc. Method for producing an inhomogeneous film for selective reflection/transmission of solar radiation
US5652029A (en) * 1994-03-25 1997-07-29 Semiconductor Energy Laboratory Co., Ltd. Plasma processing apparatus and plasma processing method
KR100217538B1 (ko) * 1996-04-10 1999-09-01 박호군 플라즈마 이온 주입에 의한 고분자 소재의 표면 개질 방법 및 그 장치
JP2001002806A (ja) * 1999-06-21 2001-01-09 Ueno Tekkusu Kk プラズマ表面処理方法及びその装置
KR20010091935A (ko) * 2000-03-14 2001-10-23 이준상 3차원적인 이온 주입에 의한 도전영역 형성방법
JP2001303249A (ja) * 2000-04-19 2001-10-31 Hirano Koon Kk 帯状シート材の表面処理装置
KR20020020010A (ko) * 2000-09-06 2002-03-14 박호군 입체 고분자 재료의 표면처리방법

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1866140A1 (fr) * 2005-03-31 2007-12-19 Deog Gu Lim Appareil servant à traiter la surface d'un produit en polymère moulé
EP1866140A4 (fr) * 2005-03-31 2008-09-24 Deog Gu Lim Appareil servant à traiter la surface d'un produit en polymère moulé
US11841149B1 (en) 2015-07-08 2023-12-12 Berner International Corporation Enhanced techniques for air curtain control
JP2021172876A (ja) * 2020-04-30 2021-11-01 株式会社プラズマイオンアシスト 成膜装置及び成膜方法

Also Published As

Publication number Publication date
AU2003269527A1 (en) 2005-02-04
KR100442309B1 (ko) 2004-07-30
KR20030074512A (ko) 2003-09-19

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