WO2005004244A2 - Strahlungsemittierendes halbleiterbauelement - Google Patents
Strahlungsemittierendes halbleiterbauelement Download PDFInfo
- Publication number
- WO2005004244A2 WO2005004244A2 PCT/DE2004/001344 DE2004001344W WO2005004244A2 WO 2005004244 A2 WO2005004244 A2 WO 2005004244A2 DE 2004001344 W DE2004001344 W DE 2004001344W WO 2005004244 A2 WO2005004244 A2 WO 2005004244A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- doped
- dopant
- radiation
- semiconductor component
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 31
- 239000002019 doping agent Substances 0.000 claims abstract description 51
- 229910052714 tellurium Inorganic materials 0.000 claims description 18
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 18
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 13
- 229910052710 silicon Inorganic materials 0.000 claims description 12
- 239000010703 silicon Substances 0.000 claims description 12
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 6
- 229910052749 magnesium Inorganic materials 0.000 claims description 6
- 239000011777 magnesium Substances 0.000 claims description 6
- 239000011701 zinc Substances 0.000 claims description 6
- 229910052725 zinc Inorganic materials 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 239000010410 layer Substances 0.000 description 110
- 239000000758 substrate Substances 0.000 description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- 230000003287 optical effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000002800 charge carrier Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 2
- 238000010348 incorporation Methods 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/025—Physical imperfections, e.g. particular concentration or distribution of impurities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/305—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure
- H01S5/3086—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure doping of the active layer
Definitions
- the invention relates to a radiation-emitting semiconductor component with a layer structure which contains an n-doped confinement layer, a p-doped confinement layer, and an active, photon-emitting layer arranged between the n-doped confinement layer and the p-doped confinement layer.
- the confinement layers are material layers or material layer sequences which are able to restrict charge carriers to an active zone of the layer structure which generates photons.
- the term “confinement layer” includes both a single material layer and a sequence of material layers that comprise the function of a confinement layer.
- the term “photon-emitting layer” includes both a single material layer and a material layer sequence that in the It is able to emit photons during operation.
- the highest possible n-doping in the confinement layers is aimed at in order to minimize charge carrier losses due to leakage currents.
- a sharp drop in the doping at the edge of the waveguide of a laser diode is desirable in order to avoid increased absorption of the laser mode.
- the electrical, optical and / or electro-optical quality of the active layer is often insufficient.
- other dopants are used that improve the electrical or optical quality of the active ones
- the present invention is based on the object of specifying a radiation-emitting semiconductor component of the type mentioned at the outset, which has improved electrical and / or optical quality of the active layer and / or high efficiency.
- the n-doped confinement layer is doped with a first n-dopant, in particular to produce a high active doping and a sharp doping profile, and the active layer with a second n-dopant different from the first dopant.
- Dopant is doped in particular to improve the layer quality of the active layer.
- the invention is therefore based on the idea of using two different n-dopants which are installed at different points in the layer structure, so that the different properties of the two dopants can be used locally in a targeted manner.
- the first n-dopant is chosen so that it allows the highest possible active doping of the confinement layer and a sharp doping profile.
- the active layer is doped with a second n-dopant, which is suitable for improving the electrical and / or optical quality of the active layer.
- the suppression of order effects such as that from KL Chang et al. , J. Appl. Phys. 92, 6582 (2002) are known, or the suppression of non-radiating centers.
- the n-doped confinement layer is doped both with the first n-dopant and with a further dopant, in particular with the second n-dopant.
- the active doping can be increased up to the sum of the two active dopant concentrations.
- the advantage of the high achievable doping and the sharp doping profile is retained.
- the semiconductor component is a light-emitting diode.
- the active layer of the light-emitting diode can be formed by a homogeneous layer or by a quantum well or a multiple quantum well.
- the semiconductor component is an edge-emitting laser diode in which a first waveguide layer is arranged between the active layer and the n-doped confinement layer and a second waveguide layer is arranged between the active layer and the p-doped confinement layer.
- the first waveguide layer of the laser diode can be undoped or, like the active layer, can be doped with the second n-dopant. However, it can also be doped with both n-dopants or only with the first n-dopant.
- the second waveguide layer is preferably undoped.
- Silicon is preferably used as the first n-dopant, since silicon can be used to set both very high n-dopants and a sharply falling dopant profile.
- Tellurium is preferably used as the second n-dopant. It was surprisingly found that tellurium has the property of suppressing undesired ordering effects in the active layer or generally improving the optical-electrical quality of the active layer. On the other hand, tellurium diffuses very strongly during epitaxial growth, so that the use of tellurium as the only dopant leads to components with comparatively low efficiency both for the confinement layer and for the active layer.
- the p-doped confinement layers of the laser diodes or light-emitting diodes are preferably doped with magnesium or zinc.
- the invention can be used with particular advantage in the case of radiation-emitting semiconductor components, the layer structure of which is formed on the basis of AlInGaP.
- the invention can also be used advantageously in layer structures based on other material systems, such as AlGaAs, In-GaAlAs or InGaAsP, in which order effects can occur or in which the electrical and / or optical quality of the active layer by a dopant can be influenced.
- other material systems such as AlGaAs, In-GaAlAs or InGaAsP, in which order effects can occur or in which the electrical and / or optical quality of the active layer by a dopant can be influenced.
- the group of such layer structures based on AlInGaP primarily includes any III / V- suitable for a radiation-emitting semiconductor component.
- Ill / V compound semiconductor structure of the type mentioned at the outset, which has a layer sequence of different individual layers and which contains at least one single layer that an Ill / V compound semiconductor material from the material system Al x In y Gax- x . y P with O ⁇ x ⁇ l, O ⁇ y ⁇ l and x + y ⁇ 1.
- Such an Ill / V compound semiconductor structure can have, for example, a conventional pn junction, a double heterostructure, a single quantum well structure (SQW structure) or a multiple quantum well structure (MQW structure).
- SQL structure single quantum well structure
- MQW structure multiple quantum well structure
- the concentration of the different dopants in the component structures can be set using a specified temperature profile.
- Figure 1 is a schematic representation of a sectional view of a laser diode according to an embodiment of the invention.
- Figure 2 is a schematic sectional view of a light emitting diode according to another embodiment of the invention. At this point it should be expressly pointed out that the layer structures and layer thickness relationships in the figures are not shown to scale.
- the first exemplary embodiment of the invention shown in a schematic sectional view in FIG. 1 is an edge-emitting laser diode layer structure 10 based on AlInGaP.
- a layer sequence based on AlInGaP is grown on a silicon-doped GaAs substrate 12.
- This layer sequence based on AlInGaP comprises: an n-doped In 0 .s (Al x Ga ⁇ _ x ) 0 .sP confinement layer 14, which is preferably n-doped with silicon, on the GaAs substrate 12, one from the perspective of the GaAs -Substrate 12 of the n-doped confinement layer 14 first In 0 . 5 (Al x Ga ⁇ _ x ) 0 .5P waveguide layer 16, which is undoped, one from the perspective of the GaAs substrate 12 of the undoped In 0 . 5 (Al x Ga ⁇ - x ) 0 .
- index variables x, y and z O ⁇ x ⁇ l, O ⁇ y ⁇ l and O ⁇ z ⁇ l.
- the first n-type dopant for the n-doped In 0 .5 (Al ⁇ Ga! _ X) 0.5P- confinement layer 14 is in this first exemplary embodiment play silicon used. This means that in the n-doped In 0 . 5 (AI ⁇ Ga ! _ X ) o.sP confinement layer 14 achieves an advantageously high n-doping and also a doping profile with a sharp drop.
- the tellurium doping suppresses undesired ordering effects in the crystal structure of the active layer.
- the first In 0 . 5 (Al x Gax- x ) o.sP waveguide layer 16 also doped with tellurium.
- the doping of the waveguide layer advantageously further reduces the charge carrier losses or increases the efficiency of the component.
- the n-doped In is 0 . 5 (Al x Ga 1-x ) o.sP confinement layer 14, in contrast to the first exemplary embodiment, not only with one but with both n-dopants, that is to say doped with both the first and the second n-dopant used ideally to increase the total active dopant concentration up to the sum of the two dopant concentrations.
- the first in 0 . 5 (Al x Ga ⁇ _ x ) o.sP waveguide layer 16 can be undoped, also doped with tellurium or with silicon and tellurium.
- the fourth exemplary embodiment of the invention shown in a schematic sectional view in FIG. 2 is a light-emitting diode layer structure 30 based on AlInGaP, which has been grown on a silicon-doped GaAs substrate 32.
- This layer sequence 30 based on AlInGaP comprises: an n-doped In 0.5 (Al x Ga ⁇ _ x ) 0 .sP confinement layer 34, which is preferably n-doped with silicon, on the GaAs substrate 12, one from the GaAs perspective Substrate 12 of the n-doped In 0 . 5 (Al x Ga x - x ) o.sP confinement layer 34 downstream n-doped active In 0 . 5 (Al y Ga ⁇ _ y ) 0 .sP layer 36, which is preferably n-doped with tellurium, and one from the perspective of the GaAs substrate 12 of the n-doped active In 0 .
- the active layer can represent both a homogeneous layer and be formed by a quantum well or a multiple quantum well structure.
- silicon is used with a correspondingly advantageous effect in the light-emitting diode as the first n-dopant for the n-confinement layer 34 and as the second dopant for the active layer 36 tellurium.
- the invention is of course not limited to the exemplary embodiment by means of the exemplary embodiment. Rather, the invention encompasses every new feature and every combination of features, which in particular includes every combination of individual features of the different patent claims or the different exemplary embodiments, even if the relevant feature or the relevant combination itself is not explicitly specified in the patent claims or exemplary embodiments.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Lasers (AREA)
- Led Devices (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006515690A JP5150099B2 (ja) | 2003-06-27 | 2004-06-25 | 発光半導体素子 |
US10/561,318 US7629670B2 (en) | 2003-06-27 | 2004-06-25 | Radiation-emitting semi-conductor component |
DE502004007853T DE502004007853D1 (de) | 2003-06-27 | 2004-06-25 | Strahlungsemittierendes halbleiterbauelement |
EP04738791A EP1642347B1 (de) | 2003-06-27 | 2004-06-25 | Strahlungsemittierendes halbleiterbauelement |
KR1020057025057A KR101087803B1 (ko) | 2003-06-27 | 2004-06-25 | 광방출 반도체소자 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10329079.6A DE10329079B4 (de) | 2003-06-27 | 2003-06-27 | Strahlungsemittierendes Halbleiterbauelement |
DE10329079.6 | 2003-06-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005004244A2 true WO2005004244A2 (de) | 2005-01-13 |
WO2005004244A3 WO2005004244A3 (de) | 2005-04-21 |
Family
ID=33546690
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2004/001344 WO2005004244A2 (de) | 2003-06-27 | 2004-06-25 | Strahlungsemittierendes halbleiterbauelement |
Country Status (8)
Country | Link |
---|---|
US (1) | US7629670B2 (de) |
EP (2) | EP1642347B1 (de) |
JP (1) | JP5150099B2 (de) |
KR (1) | KR101087803B1 (de) |
CN (1) | CN100539211C (de) |
DE (3) | DE10329079B4 (de) |
TW (1) | TWI240435B (de) |
WO (1) | WO2005004244A2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007053376A (ja) * | 2005-08-15 | 2007-03-01 | Avago Technologies Ecbu Ip (Singapore) Pte Ltd | 半導体素子の作動電圧を低下させるための構造 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10329079B4 (de) | 2003-06-27 | 2014-10-23 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement |
FR3066616B1 (fr) * | 2017-05-18 | 2019-06-14 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Source de lumiere guidee, son procede de fabrication et son utilisation pour l'emission de photons uniques |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0762516A1 (de) * | 1995-08-28 | 1997-03-12 | Mitsubishi Cable Industries, Ltd. | Lichtemittierende Vorrichtung auf Basis einer Nitridverbindung der Gruppe III |
EP0772247A1 (de) * | 1994-07-21 | 1997-05-07 | Matsushita Electric Industrial Co., Ltd. | Lichtemittierende halbleiter vorrichtung und herstellungsverfahren |
DE19756856A1 (de) * | 1996-12-20 | 1998-07-02 | Sharp Kk | Halbleiterlichtemissionsvorrichtung mit hoher Lichtemissionswirksamkeit |
WO2000024097A1 (en) * | 1998-10-16 | 2000-04-27 | Agilent Technologies, Inc. | Improved far-field nitride based semiconductor device |
EP1079444A2 (de) * | 1994-09-20 | 2001-02-28 | Toyoda Gosei Co., Ltd. | Lichtemittierende Halbleitervorrichtung aus einer Nitridverbindung der Gruppe III |
US20020053665A1 (en) * | 2000-09-08 | 2002-05-09 | Yuhzoh Tsuda | Light emitting nitride semiconductor device, and light emitting apparatus and pickup device using the same |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5790990A (en) * | 1980-11-27 | 1982-06-05 | Sharp Corp | Semiconductor light emitting device |
JPS59213179A (ja) * | 1983-05-19 | 1984-12-03 | Toshiba Corp | 発光素子 |
JPH07254732A (ja) * | 1994-03-15 | 1995-10-03 | Toshiba Corp | 半導体発光装置 |
US5825052A (en) * | 1994-08-26 | 1998-10-20 | Rohm Co., Ltd. | Semiconductor light emmitting device |
KR100267839B1 (ko) * | 1995-11-06 | 2000-10-16 | 오가와 에이지 | 질화물 반도체 장치 |
DE19630689C1 (de) * | 1996-07-30 | 1998-01-15 | Telefunken Microelectron | Halbleiteranordnung und Verfahren zum Herstellen |
US6072196A (en) * | 1996-09-05 | 2000-06-06 | Ricoh Company, Ltd. | semiconductor light emitting devices |
TW406442B (en) * | 1998-07-09 | 2000-09-21 | Sumitomo Electric Industries | White colored LED and intermediate colored LED |
GB2351390A (en) | 1999-06-16 | 2000-12-27 | Sharp Kk | A semiconductor material comprising two dopants |
US6324432B1 (en) * | 1999-11-01 | 2001-11-27 | Compex Sa | Electrical neuromuscular stimulator for measuring muscle responses to electrical stimulation pulses |
JP3585817B2 (ja) * | 2000-09-04 | 2004-11-04 | ユーディナデバイス株式会社 | レーザダイオードおよびその製造方法 |
US20020104997A1 (en) * | 2001-02-05 | 2002-08-08 | Li-Hsin Kuo | Semiconductor light emitting diode on a misoriented substrate |
DE10329079B4 (de) | 2003-06-27 | 2014-10-23 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement |
US6907056B2 (en) * | 2003-08-08 | 2005-06-14 | Wisconsin Alumni Research Foundation | Semiconductor light sources with doping gradients in optical confinement layers for improved device efficiency |
-
2003
- 2003-06-27 DE DE10329079.6A patent/DE10329079B4/de not_active Expired - Fee Related
-
2004
- 2004-06-25 TW TW093118424A patent/TWI240435B/zh not_active IP Right Cessation
- 2004-06-25 CN CNB2004800182042A patent/CN100539211C/zh not_active Expired - Fee Related
- 2004-06-25 EP EP04738791A patent/EP1642347B1/de not_active Expired - Lifetime
- 2004-06-25 WO PCT/DE2004/001344 patent/WO2005004244A2/de active IP Right Grant
- 2004-06-25 US US10/561,318 patent/US7629670B2/en not_active Expired - Lifetime
- 2004-06-25 DE DE502004010654T patent/DE502004010654D1/de not_active Expired - Lifetime
- 2004-06-25 JP JP2006515690A patent/JP5150099B2/ja not_active Expired - Fee Related
- 2004-06-25 KR KR1020057025057A patent/KR101087803B1/ko active IP Right Grant
- 2004-06-25 EP EP08157597A patent/EP1959507B1/de not_active Expired - Lifetime
- 2004-06-25 DE DE502004007853T patent/DE502004007853D1/de not_active Expired - Lifetime
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0772247A1 (de) * | 1994-07-21 | 1997-05-07 | Matsushita Electric Industrial Co., Ltd. | Lichtemittierende halbleiter vorrichtung und herstellungsverfahren |
EP1079444A2 (de) * | 1994-09-20 | 2001-02-28 | Toyoda Gosei Co., Ltd. | Lichtemittierende Halbleitervorrichtung aus einer Nitridverbindung der Gruppe III |
EP0762516A1 (de) * | 1995-08-28 | 1997-03-12 | Mitsubishi Cable Industries, Ltd. | Lichtemittierende Vorrichtung auf Basis einer Nitridverbindung der Gruppe III |
DE19756856A1 (de) * | 1996-12-20 | 1998-07-02 | Sharp Kk | Halbleiterlichtemissionsvorrichtung mit hoher Lichtemissionswirksamkeit |
WO2000024097A1 (en) * | 1998-10-16 | 2000-04-27 | Agilent Technologies, Inc. | Improved far-field nitride based semiconductor device |
US20020053665A1 (en) * | 2000-09-08 | 2002-05-09 | Yuhzoh Tsuda | Light emitting nitride semiconductor device, and light emitting apparatus and pickup device using the same |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007053376A (ja) * | 2005-08-15 | 2007-03-01 | Avago Technologies Ecbu Ip (Singapore) Pte Ltd | 半導体素子の作動電圧を低下させるための構造 |
EP1755173A3 (de) * | 2005-08-15 | 2007-06-20 | Avago Technologies ECBU IP (Singapore) Pte. Ltd. | Strukturen zur Verminderung der Betriebsspannung in einer Halbleitervorrichtung |
US7473941B2 (en) | 2005-08-15 | 2009-01-06 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Structures for reducing operating voltage in a semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
DE10329079B4 (de) | 2014-10-23 |
KR20060031646A (ko) | 2006-04-12 |
JP5150099B2 (ja) | 2013-02-20 |
TWI240435B (en) | 2005-09-21 |
KR101087803B1 (ko) | 2011-11-29 |
EP1959507A1 (de) | 2008-08-20 |
WO2005004244A3 (de) | 2005-04-21 |
EP1642347A2 (de) | 2006-04-05 |
EP1959507B1 (de) | 2010-01-13 |
EP1642347B1 (de) | 2008-08-13 |
DE10329079A1 (de) | 2005-01-27 |
CN1813359A (zh) | 2006-08-02 |
DE502004007853D1 (de) | 2008-09-25 |
JP2007507083A (ja) | 2007-03-22 |
CN100539211C (zh) | 2009-09-09 |
US20060284192A1 (en) | 2006-12-21 |
DE502004010654D1 (de) | 2010-03-04 |
US7629670B2 (en) | 2009-12-08 |
TW200501463A (en) | 2005-01-01 |
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